JP2007061976A - Resin bond wire saw and resin bond wire saw manufacturing method - Google Patents

Resin bond wire saw and resin bond wire saw manufacturing method Download PDF

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JP2007061976A
JP2007061976A JP2005253284A JP2005253284A JP2007061976A JP 2007061976 A JP2007061976 A JP 2007061976A JP 2005253284 A JP2005253284 A JP 2005253284A JP 2005253284 A JP2005253284 A JP 2005253284A JP 2007061976 A JP2007061976 A JP 2007061976A
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abrasive
resin
abrasive grains
layer
filler
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JP4266969B2 (en
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Daisuke Ide
大介 井手
Naoki Toge
直樹 峠
Tomohiro Matsuki
智寛 松木
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin bond wire saw excellent in grinding performance that allows abrasive grains to sufficiently bite into a material to be ground. <P>SOLUTION: The wire saw 1 is composed such that a buffer layer 3 mainly composed of a resin is provided around a core wire 2 made of a piano wire or the like and an abrasive grain layer 6 composed by fixing abrasive grains 4 with an ultraviolet-curing resin is formed on the outer periphery of the buffer layer 3. The abrasive grains 4 may be coated with a metal coating. The buffer layer 3 and abrasive grain layer 6 respectively include filler particles 7. The filler particles 7 having an average particle size of ≤30% of that of the abrasive grains 4 are added in an amount of ≥5 vol% and ≤50 vol% of the volume of the resin occupying the abrasive grain layer 6. In this way, the filler particles 7 are arranged in a region in the direction that the abrasive grains 4 sink into the abrasive grain layer 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、マルチ切断加工に用いられるレジンボンドワイヤソーとその製造方法に関する。   The present invention relates to a resin bond wire saw used for multi-cutting and a method for manufacturing the same.

固定砥粒ワイヤソーを用いた、サファイア、炭化珪素、セラミックス等の硬質被削材のマルチ切断加工において、高能率で精度良く切断するためには，砥粒と被削材表面での滑りを発生させずに被削材にいかに砥粒を食い込ませるかが重要である。
しかし、レジンボンドワイヤソーでは、被削材が硬いと砥粒がボンド中に沈み込みやすいため，食い込みが充分でない。また、硬質被削材の切断加工では砥粒による芯線への負荷が大きく、マルチ切断加工では芯線への負荷が繰り返し作用するため，ワイヤの断線率が高くなる。 In the multi-cutting of hard work materials such as sapphire, silicon carbide and ceramics using a fixed abrasive wire saw, in order to cut with high efficiency and high accuracy, slip between the abrasive grains and the work surface is generated. It is important how the abrasive grains are made to penetrate into the work material.
However, in a resin bond wire saw, if the work material is hard, the abrasive grains are likely to sink into the bond, so that the bite is not sufficient. Moreover, the load on the core wire due to the abrasive grains is large in the cutting processing of the hard work material, and the load on the core wire repeatedly acts in the multi-cutting processing, so that the wire disconnection rate is increased.

レジンボンドワイヤーに関して、様々な改良がなされており、その一例が、特許文献１、特許文献２、特許文献３、特許文献４、特許文献５に記載されている。
特許文献１には、高強度の芯線の外周面上に、粒子径がレジンボンド層厚の２／３以上で上記芯線径の１／２以下の砥粒が、弾性率１００ｋｇ／ｍｍ2以上かつ軟化温度２００℃以上である樹脂中に粒子径がレジンボンド層厚の２／３未満のフィラーを含有するレジンボンド中に固着されていることを特徴とするワイヤソーが記載されている。 Various improvements have been made with respect to resin bond wires, and examples thereof are described in Patent Document 1, Patent Document 2, Patent Document 3, Patent Document 4, and Patent Document 5.
In Patent Document 1, abrasive grains having a particle diameter of 2/3 or more of the resin bond layer thickness and 1/2 or less of the core wire diameter on the outer peripheral surface of a high-strength core wire have an elastic modulus of 100 kg / mm 2 or more and A wire saw characterized by being fixed in a resin bond containing a filler having a particle size of less than 2/3 of the resin bond layer thickness in a resin having a softening temperature of 200 ° C. or higher is described.

特許文献２には、光硬化性樹脂を主成分とし、複数層からなる結合材が工具半径方向に形成されており、該結合材でワイヤ上に砥粒を固定したワイヤ工具であって、結合材には、ワイヤ上に形成された光硬化性接着剤層と、骨材として、平均粒径が０．１〜１５μｍの金属粒子および平均粒径が０．１〜１５μｍの無機粉末が５〜９０ｗｔ％添加されるか、平均粒径が０．１〜１５μｍの金属粒子又は平均粒径が０．１〜１５μｍの無機粉末が５〜９０ｗｔ％添加された、光硬化性樹脂からなり、前記光硬化性接着剤層上に形成された光硬化性樹脂層と、を含むことを特徴とするワイヤ工具が記載されている。   Patent Document 2 is a wire tool in which a binder composed of a plurality of layers is formed in the radial direction of a tool, with a photocurable resin as a main component, and abrasive grains are fixed on the wire with the binder. The material includes a photocurable adhesive layer formed on the wire, and 5 to 5 particles of metal particles having an average particle diameter of 0.1 to 15 μm and inorganic powder having an average particle diameter of 0.1 to 15 μm. 90% by weight or a photocurable resin to which 5 to 90% by weight of metal particles having an average particle diameter of 0.1 to 15 μm or inorganic powder having an average particle diameter of 0.1 to 15 μm is added. A wire tool is described that includes a photocurable resin layer formed on a curable adhesive layer.

特許文献３には、ワイヤ上に樹脂を主成分とする結合材で砥粒を固定したワイヤ工具において、結合材として光化学反応を起こして数秒単位若しくはそれ以下の短時間において重合硬化し得る光硬化性樹脂を用いること、および光硬化性樹脂中に、３０／４０μｍの砥粒と、平均粒径が０．１〜１５μｍの金属粒子および／または平均粒径が０．１〜１５μｍの無機粉末を５〜９０ｗｔ％添加したことを特徴とするワイヤ工具が記載されている。   Patent Document 3 discloses a photocuring that can be polymerized and cured in a short time of several seconds or less by causing a photochemical reaction as a binder in a wire tool in which abrasive grains are fixed on a wire with a binder mainly composed of a resin. An adhesive resin, and 30/40 μm abrasive grains, metal particles having an average particle diameter of 0.1 to 15 μm, and / or inorganic powder having an average particle diameter of 0.1 to 15 μm in the photocurable resin. A wire tool characterized by adding 5 to 90 wt% is described.

特許文献４には、ワイヤ芯の周囲に砥粒を含有してなる砥粒保持材が形成されたワイヤソーにおいて、前記砥粒保持材はガラス転移温度が５０〜２００℃かつ材料非切断時の弾性率が５００ＭＰａ以上であって、材料非切断時の前記砥粒の前記砥粒保持材からの平均突出量が前記砥粒の平均粒径の１〜３０％であることを特徴とするワイヤソーが記載されている。
特許文献５には、超砥粒が金属被覆され、金属芯線が樹脂によってプライマリーコートされているワイヤソーが記載されている。 In Patent Document 4, in a wire saw in which an abrasive grain holding material containing abrasive grains is formed around a wire core, the abrasive grain holding material has a glass transition temperature of 50 to 200 ° C. and elasticity when the material is not cut. A wire saw characterized in that the rate is 500 MPa or more, and the average protrusion amount of the abrasive grains from the abrasive grain holding material when the material is not cut is 1 to 30% of the average grain diameter of the abrasive grains. Has been.
Patent Document 5 describes a wire saw in which superabrasive grains are metal-coated and a metal core wire is primary-coated with a resin.

特許第３０７８０２０号公報Japanese Patent No. 3078020 特許第３３６２０１５号公報Japanese Patent No. 3362015 特許第３３９０６８６号公報Japanese Patent No. 3390686 特開２００４−３２２２９０号公報JP 2004-322290 A 特開２０００−２４６５４２号公報JP 2000-246542 A

しかし、特許文献１記載のワイヤソーでは、芯線の周囲に緩衝層を設けていないため、断線率が高い。また、特許文献２、特許文献３記載のワイヤ工具では、砥粒と芯線との間にプライマ処理層が形成されてはいるものの、切断時の負荷を緩衝する効果は考慮されていない。また、砥粒層は紫外線硬化樹脂であり、フィラーには金属粒子や無機粉末を使用しているが、紫外線透過率を考慮していないため，不完全硬化部が形成されやすい。
また、特許文献４に記載のワイヤソーでは、紫外線硬化樹脂の砥粒層にＡｌ2Ｏ3やＳｉＯ2などの微小粉末を添加しているが、紫外線透過率を考慮していないため、不完全硬化部が形成されやすい。またフィラーの添加量についても考慮されていない。また、特許文献５においても、プライマ処理層が形成することが記載されているが、切断時の負荷を緩衝する効果はあるものの、砥粒層に添加するフィラーの粒径と含有量を考慮しておらず、またプライマ層にフィラーを添加することは考慮していないため、砥粒を被削材に充分に食い込ませることができない。
従って、以上のいずれの技術を用いても、硬質被削材の研削において、砥粒を被削材に充分に食い込ませて、研削性能を上げることができない。 However, in the wire saw described in Patent Document 1, since the buffer layer is not provided around the core wire, the disconnection rate is high. Moreover, in the wire tool of patent document 2 and patent document 3, although the primer process layer is formed between the abrasive grain and the core wire, the effect which buffers the load at the time of a cutting | disconnection is not considered. The abrasive layer is an ultraviolet curable resin, and metal particles and inorganic powder are used for the filler. However, since the ultraviolet transmittance is not taken into consideration, an incompletely cured portion is easily formed.
Further, in the wire saw described in Patent Document 4, a fine powder such as Al 2 O 3 or SiO 2 is added to the abrasive layer of the UV curable resin, but since the UV transmittance is not taken into account, incomplete curing is performed. The part is easy to be formed. Further, the amount of filler added is not taken into consideration. Also, Patent Document 5 describes that a primer treatment layer is formed. However, although there is an effect of buffering a load at the time of cutting, the particle size and content of the filler added to the abrasive layer are considered. In addition, since it is not considered to add a filler to the primer layer, the abrasive grains cannot sufficiently penetrate into the work material.
Therefore, even if any of the above techniques is used, in grinding a hard work material, it is impossible to cause the abrasive grains to sufficiently penetrate the work material and improve the grinding performance.

本発明は、以上の問題点を解決するためになされたもので、砥粒を被削材に充分に食い込ませることを可能として、研削性能に優れたレジンボンドワイヤソーを提供することを目的とする。   The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a resin-bonded wire saw having excellent grinding performance by allowing abrasive grains to sufficiently penetrate into a work material. .

以上の課題を解決するために、本発明のレジンボンドワイヤソーは、砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーにおいて、平均粒径が砥粒の平均粒径の３０％以下のフィラーが砥粒層を占める樹脂の体積の５体積％以上５０体積％以下で添加され、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置されていることを特徴とする。   In order to solve the above problems, the resin bond wire saw of the present invention is a resin bond wire saw in which an abrasive layer in which abrasive grains are bonded with a resin is provided around a core wire. 30% or less of the filler is added at 5 volume% or more and 50 volume% or less of the volume of the resin occupying the abrasive layer, and the filler is disposed in a region of the abrasive layer in the direction in which the abrasive grains sink. And

平均粒径が砥粒の平均粒径の３０％以下のフィラーが添加されていることにより、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置されるようになるため、砥粒が結合材中に沈みにくくなり，砥粒の被削材への食い込みが大きくなる。
フィラーの平均粒径が砥粒の平均粒径の３０％を超えると、砥粒と隣接して配置することはできるものの、砥粒が沈み込む方向の領域に配置することができないため好ましくない。また、フィラーの添加量が砥粒層を占める樹脂の体積の５体積％未満であると、フィラーによる効果が少ないため砥粒の食い込みを十分に大きくすることができず好ましくなく、５０体積％を超えると、砥粒層の柔軟性が低下し、砥粒層の剥離や断線などが発生しやすくなって好ましくない。 By adding a filler having an average particle size of 30% or less of the average particle size of the abrasive grains, the filler comes to be disposed in a region of the abrasive layer in the direction in which the abrasive grains sink. It becomes difficult to sink into the binding material, and the bite of the abrasive grains into the work material increases.
When the average particle diameter of the filler exceeds 30% of the average particle diameter of the abrasive grains, it can be arranged adjacent to the abrasive grains, but it is not preferable because it cannot be arranged in the region where the abrasive grains sink. Further, if the added amount of the filler is less than 5 volume% of the volume of the resin occupying the abrasive layer, the effect of the filler is small and the biting of the abrasive grains cannot be sufficiently increased, which is not preferable. If it exceeds the upper limit, the flexibility of the abrasive layer is lowered, and peeling or disconnection of the abrasive layer is likely to occur.

本発明においては、前記芯線と前記砥粒層との間に樹脂からなる緩衝層が設けられ、前記緩衝層の厚みが２μｍ以上５μｍ以下であることを特徴とする。   In the present invention, a buffer layer made of a resin is provided between the core wire and the abrasive grain layer, and the thickness of the buffer layer is 2 μm or more and 5 μm or less.

樹脂からなる緩衝層が設けられていることにより、芯線への負荷を緩和することができ、断線を防止できる。
緩衝層の厚みが２μｍ未満であると、緩衝層が薄すぎて芯線への負荷を十分に緩和することができない。緩衝層の厚みが２μｍ以上で芯線への負荷が緩和するが、５μｍを超えると芯線への負荷はほぼ一定値となるため、２μｍ以上５μｍ以下とすることが好ましい。 By providing the buffer layer made of resin, the load on the core wire can be relaxed and disconnection can be prevented.
If the thickness of the buffer layer is less than 2 μm, the buffer layer is too thin to sufficiently reduce the load on the core wire. When the thickness of the buffer layer is 2 μm or more, the load on the core wire is alleviated. However, if the thickness exceeds 5 μm, the load on the core wire becomes a substantially constant value, and is preferably 2 μm or more and 5 μm or less.

本発明においては、前記緩衝層に平均粒径が緩衝層の厚み以下のフィラーが緩衝層の体積の５体積％以上５０体積％以下で添加されていることを特徴とする。
緩衝層に平均粒径が緩衝層の厚み以下のフィラーが緩衝層の体積の５体積％以上５０体積％以下で添加されていることにより、緩衝層へ砥粒が沈みにくくなり，砥粒の被削材への食い込みが大きくなる。特に、被削材を高速で切断する高負荷加工においては，砥粒が緩衝層にも沈み込んでしまいやすく、ワイヤソーの切れ味が低下すいため、緩衝層にフィラーを添加することによる効果が大きい。
フィラーの添加量が緩衝層の体積の５体積％未満であると、フィラーによる効果が少ないため砥粒の食い込みを十分に大きくすることができず好ましくなく、５０体積％を超えると、柔軟性が低下して緩衝層の剥離が発生し、芯線との密着性も低下するので好ましくない。 In the present invention, a filler having an average particle size of not more than the thickness of the buffer layer is added to the buffer layer at 5% by volume or more and 50% by volume or less of the volume of the buffer layer.
By adding a filler having an average particle size equal to or less than the thickness of the buffer layer to the buffer layer in an amount of 5% by volume to 50% by volume of the buffer layer volume, the abrasive particles are less likely to sink into the buffer layer, The bite into the cutting material increases. In particular, in high-load machining in which a work material is cut at high speed, the abrasive grains are likely to sink into the buffer layer, and the sharpness of the wire saw is reduced. Therefore, the effect of adding a filler to the buffer layer is great.
If the added amount of the filler is less than 5% by volume of the volume of the buffer layer, the effect of the filler is small, so that it is not preferable because the biting of the abrasive grains cannot be sufficiently increased. The buffer layer is peeled off and the adhesion with the core wire is also lowered, which is not preferable.

本発明においては、前記砥粒層を占める樹脂は紫外線硬化樹脂からなり、砥粒層に添加するフィラーの紫外線透過率が５０％以上であることを特徴とする。
紫外線硬化樹脂は熱硬化性樹脂に比べて硬化速度が格段に速いため，生産性に優れている。また、熱硬化性樹脂は硬化時の加熱により芯線強度が低下するため断線率が高くなるが、紫外線硬化樹脂を用いるとこのような問題を生じない。
フィラーの紫外線透過率が５０％未満のフィラーを添加すると、紫外線が樹脂全体に透過せず、樹脂の未硬化部が生成されて、樹脂強度が低下してしまう。 In the present invention, the resin occupying the abrasive layer is made of an ultraviolet curable resin, and the ultraviolet transmittance of the filler added to the abrasive layer is 50% or more.
UV curable resins are excellent in productivity because their curing speed is much faster than thermosetting resins. In addition, the thermosetting resin has a higher disconnection rate because the core wire strength is reduced by heating at the time of curing, but such a problem does not occur when an ultraviolet curable resin is used.
When a filler having an ultraviolet transmittance of less than 50% is added, the ultraviolet rays are not transmitted through the entire resin, an uncured portion of the resin is generated, and the resin strength is reduced.

本発明においては、前記砥粒には金属被覆が施され、砥粒の含有量が樹脂、フィラー、砥粒からなる砥粒層の５体積％以上２５体積％以下であることを特徴とする。
砥粒には金属被覆が施されていることにより、砥粒と樹脂との接着強度を高めることができる。砥粒の含有率が５体積％未満では砥粒摩耗が大きくなり、切れ味低下が著しい。一方、２５体積％を超えると、切粉排除性の低下で切れ味が低下し、また被削材へ食い込まずに滑りが発生して砥粒摩耗が大きくなり、切れ味が低下する。 In the present invention, the abrasive grains are coated with a metal, and the content of the abrasive grains is 5% by volume or more and 25% by volume or less of the abrasive layer made of resin, filler, and abrasive grains.
Since the abrasive grains are coated with metal, the adhesive strength between the abrasive grains and the resin can be increased. When the content of abrasive grains is less than 5% by volume, abrasive wear increases and sharpness is significantly reduced. On the other hand, when it exceeds 25% by volume, the sharpness is lowered due to a decrease in chip eliminability, and slippage occurs without biting into the work material to increase abrasive wear, resulting in a decrease in sharpness.

本発明のレジンボンドワイヤソーの製造方法は、砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーの製造方法において、平均粒径が砥粒の平均粒径の３０％以下であるフィラーを砥粒の外周に付着し、この砥粒を樹脂で結合することを特徴とする。
平均粒径が砥粒の平均粒径の３０％以下であるフィラーを砥粒の外周に付着し、この砥粒を樹脂で結合することにより、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置される構造となり、砥粒が結合材中に沈みにくくなり，砥粒の被削材への食い込みが大きいレジンボンドワイヤソーを製造することができる。 The resin bond wire saw manufacturing method of the present invention is a resin bond wire saw manufacturing method in which an abrasive grain layer in which abrasive grains are bonded with a resin is provided around a core wire. The average grain size is 30% of the average grain size of the abrasive grains. The following filler is attached to the outer periphery of the abrasive grains, and the abrasive grains are bonded with a resin.
By attaching a filler having an average particle diameter of 30% or less of the average particle diameter of the abrasive grains to the outer periphery of the abrasive grains and bonding the abrasive grains with a resin, the abrasive grains in the area where the abrasive grains sink is formed. It becomes a structure in which the filler is disposed, and it becomes difficult for the abrasive grains to sink into the binder, and a resin bond wire saw can be manufactured in which the abrasive grains are deeply bite into the work material.

本発明によると、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置されるようになるため、砥粒が結合材中に沈みにくくなり，砥粒の被削材への食い込みが大きくなる。そのため、硬い被削材の切断の際にも切れ味を良好に維持することが可能なレジンボンドワイヤソーを実現することができる。   According to the present invention, since the filler is disposed in the region of the abrasive layer in the direction in which the abrasive grains sink, the abrasive grains are less likely to sink in the binder, and the abrasive grains are greatly bited into the work material. Become. Therefore, it is possible to realize a resin bond wire saw capable of maintaining good sharpness even when cutting a hard work material.

以下に、本発明をその実施形態に基づいて説明する。
図１に、本発明の実施形態に係るレジンボンドワイヤソーの構成を示す。
ワイヤソー１は、ピアノ線等からなる芯線２の周囲に、樹脂を主成分とする緩衝層３が設けられ、この緩衝層３の外周に砥粒４を紫外線硬化樹脂からなる結合材５で固定した砥粒層６を形成してなるものである。砥粒４は金属被覆が施されていてもよい。緩衝層３を構成する樹脂は、紫外線硬化樹脂であることが好ましいが、熱硬化性樹脂であってもよい。 Below, this invention is demonstrated based on the embodiment.
In FIG. 1, the structure of the resin bond wire saw which concerns on embodiment of this invention is shown.
In the wire saw 1, a buffer layer 3 mainly composed of a resin is provided around a core wire 2 made of a piano wire or the like, and abrasive grains 4 are fixed to the outer periphery of the buffer layer 3 with a binder 5 made of an ultraviolet curable resin. An abrasive layer 6 is formed. The abrasive grains 4 may be coated with a metal. The resin constituting the buffer layer 3 is preferably an ultraviolet curable resin, but may be a thermosetting resin.

緩衝層３と砥粒層６にはフィラー７が含まれており、図２の砥粒周辺の詳細図に示すように、砥粒層６における砥粒４が沈み込む方向の領域Ａにフィラー７が配置されるようになっている。このようにフィラー７が配置されるようにすることは、平均粒径が砥粒４の平均粒径の３０％以下のフィラー７を、砥粒層６を占める樹脂の体積の５体積％以上５０体積％以下で添加することによって可能である。   The buffer layer 3 and the abrasive grain layer 6 include a filler 7, and as shown in a detailed view around the abrasive grain in FIG. 2, the filler 7 is in the region A of the abrasive grain layer 6 in the direction in which the abrasive grain 4 sinks. Is arranged. In this way, the filler 7 is disposed so that the filler 7 having an average particle diameter of 30% or less of the average particle diameter of the abrasive grains 4 is not less than 5% by volume of the volume of the resin occupying the abrasive grain layer 6. It is possible to add by volume% or less.

フィラー７の形状は、レーザー回折式粒度分布測定装置等を使用して測定した平均粒径が上記の範囲内であれば、真球状、鱗片状、ファイバー状などのいずれの形状であっても良い。特に真球状のものであって表面に孔を有する多孔質粒子や、鱗片状やファイバー状のものは、その形状の粒子が三次元的に凝集して二次粒子を形成し、表面積が大きくなるため、樹脂中でアンカー効果を生じて砥粒を沈み込みにくくする効果が高い。
また、フィラー７として、シリカ、マイカ、ガラスビーズ、セラミックス等を使用することができる。特にシリカは樹脂中に添加することで耐水性、耐熱性、耐薬品性を向上させることができ、さらに紫外線透過率も高いため好適である。 The shape of the filler 7 may be any shape such as a spherical shape, a scale shape, and a fiber shape as long as the average particle diameter measured using a laser diffraction particle size distribution measuring device or the like is within the above range. . In particular, porous particles having a spherical shape and having pores on the surface, scale-like or fiber-like particles, the particles of the shape aggregate three-dimensionally to form secondary particles, resulting in a large surface area. Therefore, the effect of making the anchor effect in the resin and making the abrasive grains difficult to sink is high.
Further, silica, mica, glass beads, ceramics, or the like can be used as the filler 7. In particular, silica is suitable because it can improve water resistance, heat resistance, and chemical resistance by adding it to the resin, and also has high ultraviolet transmittance.

また、一般的に紫外線の発光波長分布は２００ｎｍ〜４５０ｎｍであり、この波長全域において紫外線透過率が５０％以上であるフィラー７を用いるのが良い。ただし、この範囲内で部分的に紫外線透過率が５０％以上のフィラー７を使用する場合は、その波長に合った紫外線光源を使用すれば良い。   In general, the emission wavelength distribution of ultraviolet rays is 200 nm to 450 nm, and it is preferable to use a filler 7 having an ultraviolet transmittance of 50% or more in the entire wavelength range. However, when the filler 7 having an ultraviolet transmittance of 50% or more is partially used within this range, an ultraviolet light source suitable for the wavelength may be used.

上述したフィラー７を添加した液状接着剤を砥粒４に噴霧して、砥粒４の表面にフィラー７を付着させ、その後ワイヤソー１を製造する。または、フィラー７と砥粒４とをレジンボンド、メタルボンド、ビトリファイドボンドのいずれかのボンドで焼結し、または電着によって、砥粒４の表面にフィラーを付着させ、その後成形品を粉砕し、ふるいにより分級してワイヤソー１を製造する。
接着剤で砥粒４の表面に付着したフィラー７は、被削材に接触した際にすぐに落ちるため、切味を低下させることはない。また、レジンボンド、メタルボンド、ビトリファイドボンド、電着により砥粒４の表面に付着したフィラー７によって切味が低下する場合には、使用前にワイヤソーで一般砥石を切断することで、フィラー７を落とすことができる。 The liquid adhesive to which the filler 7 described above is added is sprayed on the abrasive grains 4 to adhere the filler 7 to the surface of the abrasive grains 4, and then the wire saw 1 is manufactured. Alternatively, the filler 7 and the abrasive grains 4 are sintered with any one of a resin bond, a metal bond, and a vitrified bond, or the filler is attached to the surface of the abrasive grains 4 by electrodeposition, and then the molded product is pulverized. The wire saw 1 is manufactured by classification using a sieve.
Since the filler 7 adhered to the surface of the abrasive grain 4 with the adhesive falls immediately upon contact with the work material, the sharpness is not lowered. When the sharpness is lowered by the filler 7 attached to the surface of the abrasive grain 4 by resin bond, metal bond, vitrified bond, or electrodeposition, the filler 7 is cut by cutting a general grindstone with a wire saw before use. Can be dropped.

緩衝層３には、平均粒径が緩衝層３の厚み以下のフィラー７が、緩衝層３の体積の５体積％以上５０体積％以下で添加されている。緩衝層３は２層構造としてもよく、この場合には、芯線２に密着する内側の層にはフィラー７を添加せず、砥粒層６に密着する外側の層にはフィラー７を添加する。この２層構造の場合にも、緩衝層３全体の厚みが２μｍ以上５μｍ以下であればよい。   Filler 7 having an average particle size equal to or smaller than the thickness of buffer layer 3 is added to buffer layer 3 at 5% by volume or more and 50% by volume or less of the volume of buffer layer 3. The buffer layer 3 may have a two-layer structure. In this case, the filler 7 is not added to the inner layer in close contact with the core wire 2, and the filler 7 is added to the outer layer in close contact with the abrasive grain layer 6. . Also in the case of this two-layer structure, the entire thickness of the buffer layer 3 may be 2 μm or more and 5 μm or less.

図３に、加工時に砥粒にかかる負荷の様子を示す。砥粒４には、切り込み方向（ワイヤソーの法線方向）への負荷Ｆｎと、ワイヤソーの走行方向（ワイヤソーの接線方向）への負荷Ｆｔがかかり、その結果、砥粒４にはワイヤソーの軸に対して斜め方向への合力が作用する。
このような力が芯線２に対して作用するため、芯線２に傷がついて断線しやすくなるが、図４に示すように、緩衝層３を設けることにより、芯線２への負荷を和らげて、芯線２の断線を防止することができる。この緩衝層３にもフィラー７を添加することにより、砥粒４の沈み込みを抑制することができる。 FIG. 3 shows a load applied to the abrasive grains during processing. The abrasive grain 4 is subjected to a load Fn in the cutting direction (wire saw normal direction) and a load Ft in the wire saw traveling direction (wire saw tangential direction). As a result, the abrasive grain 4 is applied to the axis of the wire saw. On the other hand, a resultant force in an oblique direction acts.
Since such a force acts on the core wire 2, the core wire 2 is easily damaged and broken, but as shown in FIG. 4, by providing the buffer layer 3, the load on the core wire 2 is reduced, Disconnection of the core wire 2 can be prevented. By adding the filler 7 also to this buffer layer 3, sinking of the abrasive grains 4 can be suppressed.

以下に、具体的な試験例を示す。
図５に示す装置を用いて切断試験を行い、ワイヤソーの撓み量の測定を行った。図５において、ワイヤソー１は多数のプーリーを介してワイヤガイド１０にセッティングされ、加工中は被削材１１との接触部１２に撓みが発生して切断が進行していく。この撓み量について、以下の試験条件で試験を行った。
・機械：マルチ切断装置
・被削材：サファイア
・ワイヤ線速：４００ｍ／ｍｉｎ
・研削液：水溶性
・ワイヤ芯線：φ１８０μｍ
・砥粒：平均粒径４５μｍ／含有量２０体積％
・ワイヤ製品径：φ２５０μｍ
・フィラー：シリカ２０体積％
なお、砥粒の粒径はレーザー回折式粒度分布測定装置にて測定した。 Specific test examples are shown below.
A cutting test was performed using the apparatus shown in FIG. 5, and the amount of bending of the wire saw was measured. In FIG. 5, the wire saw 1 is set on the wire guide 10 through a number of pulleys, and during the machining, the contact portion 12 with the work material 11 is bent and the cutting proceeds. This bending amount was tested under the following test conditions.
・ Machine: Multi-cutting device ・ Work material: Sapphire ・ Wire speed: 400 m / min
・ Grinding fluid: Water-soluble ・ Wire core: φ180μm
Abrasive grains: average particle size 45 μm / content 20 volume%
・ Wire product diameter: φ250μm
Filler: Silica 20% by volume
The particle size of the abrasive grains was measured with a laser diffraction type particle size distribution measuring device.

以上の切断試験によると、ワイヤソーの切れ味が悪いと撓み量が大きくなって、加工精度が悪くなり、ワイヤソーの切れ味が良いと撓み量が小さくなって、加工精度が良好となる。
砥粒層に含まれるフィラーの平均粒径を変化させて上記の試験を行った結果を図６に示す。フィラーの平均粒径が砥粒の平均粒径の３０％以下、すなわち１３．５μｍ以下のときは、砥粒が沈み込みにくいため、切れ味が良好であり、撓みが小ないのに対して、フィラーの平均粒径が砥粒の平均粒径の３０％を超えると、砥粒が沈み込みやすく、切れ味が低下して撓みが大きくなる。
このことから、フィラーの平均粒径が砥粒の平均粒径の３０％以下のときは、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置されているものと判断される。 According to the above cutting test, if the wire saw has poor sharpness, the amount of bending becomes large and the processing accuracy deteriorates. If the wire saw has good sharpness, the amount of bending decreases and the processing accuracy becomes good.
FIG. 6 shows the result of the above test performed by changing the average particle size of the filler contained in the abrasive layer. When the average particle size of the filler is 30% or less of the average particle size of the abrasive grains, that is, 13.5 μm or less, since the abrasive grains are difficult to sink, the sharpness is good and the deflection is small. When the average particle diameter exceeds 30% of the average particle diameter of the abrasive grains, the abrasive grains tend to sink, the sharpness decreases, and the deflection increases.
From this, when the average particle diameter of a filler is 30% or less of the average particle diameter of an abrasive grain, it is judged that the filler is arrange | positioned in the area | region of the direction in which the abrasive grain sinks in an abrasive grain layer.

次に、フィラーの添加量を変化させて撓み量を測定した結果を図７に示す。フィラーとして、粒径が５．０μｍのシリカを用いた。
フィラーの添加量が砥粒層を占める樹脂の体積の５体積％未満のときは、フィラーを添加したことによる効果が十分に得られず、撓み量が大きい。また、フィラーの添加量が砥粒層を占める樹脂の体積の５０体積％を超えると、砥粒層の柔軟性が低下して砥粒層の剥離が発生し、撓み量が大きくなる。これに対し、フィラーの添加量が砥粒層を占める樹脂の体積の５体積％以上５体積％以下のときに撓み量が小さい。 Next, the result of measuring the amount of deflection by changing the amount of filler added is shown in FIG. Silica having a particle size of 5.0 μm was used as the filler.
When the added amount of the filler is less than 5% by volume of the resin occupying the abrasive layer, the effect of adding the filler cannot be sufficiently obtained, and the amount of bending is large. Moreover, when the addition amount of a filler exceeds 50 volume% of the volume of resin which occupies an abrasive grain layer, the softness | flexibility of an abrasive grain layer will fall, peeling of an abrasive grain layer will generate | occur | produce, and the amount of bending will become large. On the other hand, the amount of bending is small when the amount of filler added is 5% by volume or more and 5% by volume or less of the volume of the resin occupying the abrasive layer.

次に、緩衝層の厚みを変化させたときに、断線に至るまでの往復回数を調査し、その結果を図８に示す。
このときの試験条件は以下の通りである。
・機械：単線切断装置
・ワーク：サファイア
・ワイヤ線速：２００ｍ／ｍｉｎ
・被削材への押し付け荷重：８Ｎ
・研削液：水溶性
・ワイヤ芯線：φ１８０μｍ
・砥粒：平均粒径４５μｍ／含有量２０体積％
・ワイヤ製品径：φ２５０μｍ
・フィラー：シリカ１０体積％ Next, when the thickness of the buffer layer is changed, the number of reciprocations until disconnection is investigated, and the result is shown in FIG.
The test conditions at this time are as follows.
・ Machine: Single wire cutting device ・ Workpiece: Sapphire ・ Wire speed: 200m / min
・ Pressing load on work material: 8N
・ Grinding fluid: Water-soluble ・ Wire core: φ180μm
Abrasive grains: average particle size 45 μm / content 20 volume%
・ Wire product diameter: φ250μm
-Filler: 10% by volume of silica

緩衝層の厚みが２μｍ未満のときは、芯線への負荷を緩和できずに断線しやすく、緩衝層の厚みが５μｍを超えると、断線に至るまでの往復回数はほぼ一定値となる。切り代を考慮すると緩衝層の厚みは５μｍ以下であることが好ましい。   When the thickness of the buffer layer is less than 2 μm, the load on the core wire cannot be eased and the wire is easily disconnected. When the thickness of the buffer layer exceeds 5 μm, the number of reciprocations until the wire breaks is a substantially constant value. In consideration of the cutting allowance, the thickness of the buffer layer is preferably 5 μm or less.

次に、緩衝層に添加されるフィラーの量を変化させたときの撓み量の測定結果を図９に示す。緩衝層の厚みは３．０μｍである。
緩衝層に添加されるフィラーの量が緩衝層の体積の５体積％未満であると、フィラーを添加したことによる効果が十分に得られず、撓み量が大きい。また、フィラーが緩衝層の体積の５０体積％を超えると、緩衝層の柔軟性が低下して緩衝層の剥離が発生し、撓み量が大きくなる。これに対し、フィラーが緩衝層の体積の５体積％以上５０体積％以下のときに撓み量が小さい。 Next, FIG. 9 shows the measurement results of the amount of deflection when the amount of filler added to the buffer layer is changed. The thickness of the buffer layer is 3.0 μm.
When the amount of the filler added to the buffer layer is less than 5% by volume of the volume of the buffer layer, the effect of adding the filler cannot be sufficiently obtained, and the amount of deflection is large. Moreover, when a filler exceeds 50 volume% of the volume of a buffer layer, the softness | flexibility of a buffer layer will fall, peeling of a buffer layer will generate | occur | produce and a deflection amount will become large. On the other hand, when the filler is 5 volume% or more and 50 volume% or less of the volume of the buffer layer, the bending amount is small.

次に、砥粒層に添加するフィラーの紫外線透過率を変化させて撓み量を測定した結果を図１０に示す。緩衝層の厚みは３．０μｍである。
フィラーの紫外線透過率が５０％未満のときは、樹脂の未硬化部が形成されて，砥粒層の剥離が発生し、撓み量が大きい。これに対し、フィラーの紫外線透過率が５０％以上のときは、撓み量が小さい。 Next, the result of having measured the amount of deflection | deviation by changing the ultraviolet-ray transmittance of the filler added to an abrasive grain layer is shown in FIG. The thickness of the buffer layer is 3.0 μm.
When the ultraviolet transmittance of the filler is less than 50%, an uncured portion of the resin is formed, peeling of the abrasive layer occurs, and the amount of deflection is large. In contrast, when the ultraviolet transmittance of the filler is 50% or more, the amount of bending is small.

次に、砥粒の含有量を変化させて撓み量を測定した結果を図１１に示す。
砥粒含有量が５体積％未満のときは、砥粒摩耗が大きく、切れ味の低下が大きいため、撓み量が大きい。また、砥粒含有量が２５体積％を超えると、砥粒数が多くなり、食い込みにくく切れ味が低下する。また、切粉排除性の低下のため、切れ味が低下する。そのため、撓み量が大きい。これに対し、砥粒含有量が５体積％以上２５体積％以下のときは、切れ味が良く撓み量が小さい。 Next, the result of measuring the amount of deflection by changing the content of abrasive grains is shown in FIG.
When the abrasive content is less than 5% by volume, the abrasive wear is large and the sharpness is greatly reduced, so that the amount of deflection is large. On the other hand, when the abrasive content exceeds 25% by volume, the number of abrasive grains increases, and it is difficult to bite in and the sharpness is lowered. In addition, the sharpness is reduced due to a reduction in chip evacuation. Therefore, the amount of bending is large. On the other hand, when the abrasive content is 5% by volume or more and 25% by volume or less, the sharpness is good and the deflection amount is small.

本発明は、硬い被削材の切断の際にも切れ味を良好に維持することが可能なレジンボンドワイヤソーとして利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be used as a resin bond wire saw that can maintain good sharpness even when cutting a hard work material.

本発明の実施形態に係るレジンボンドワイヤソーの構成を示す図である。It is a figure which shows the structure of the resin bond wire saw which concerns on embodiment of this invention. 砥粒周辺の詳細を示す図である。It is a figure which shows the detail of an abrasive grain periphery. 加工時に砥粒にかかる負荷の様子を示す図である。It is a figure which shows the mode of the load concerning an abrasive grain at the time of a process. 緩衝層にフィラーを配置したことを示す図である。It is a figure which shows having arrange | positioned the filler to the buffer layer. 切断試験装置を示す図である。It is a figure which shows a cutting | disconnection test apparatus. 砥粒層に含まれるフィラーの平均粒径を変化させて試験を行った結果を示す図である。It is a figure which shows the result of having tested by changing the average particle diameter of the filler contained in an abrasive grain layer. 砥粒層に含まれるフィラーの添加量を変化させて撓み量を測定した結果を示す図である。It is a figure which shows the result of having changed the addition amount of the filler contained in an abrasive grain layer, and measuring the amount of bending. 緩衝層の厚みを変化させたときに、断線に至るまでの往復回数を調査した結果を示す図である。It is a figure which shows the result of having investigated the frequency | count of a reciprocation until it reaches a disconnection, when changing the thickness of a buffer layer. 緩衝層に添加されるフィラーの量を変化させたときの撓み量の測定結果を示す図である。It is a figure which shows the measurement result of the deflection amount when changing the quantity of the filler added to a buffer layer. 砥粒層に添加するフィラーの紫外線透過率を変化させて撓み量を測定した結果を示す図である。It is a figure which shows the result of having changed the ultraviolet-ray transmittance of the filler added to an abrasive grain layer, and measuring the amount of bending. 砥粒の含有量を変化させて撓み量を測定した結果を示す図である。It is a figure which shows the result of having changed content of an abrasive grain and measuring the amount of bending.

符号の説明Explanation of symbols

１ ワイヤソー
２ 芯線
３ 緩衝層
４ 砥粒
５ 結合材
６ 砥粒層
７ フィラー
１０ ワイヤガイド
１１ 被削材
１２ 接触部 DESCRIPTION OF SYMBOLS 1 Wire saw 2 Core wire 3 Buffer layer 4 Abrasive grain 5 Binder 6 Abrasive grain layer 7 Filler 10 Wire guide 11 Work material 12 Contact part

Claims (6)

砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーにおいて、平均粒径が砥粒の平均粒径の３０％以下のフィラーが砥粒層を占める樹脂の体積の５体積％以上５０体積％以下で添加され、砥粒層における砥粒が沈み込む方向の領域にフィラーが配置されていることを特徴とするレジンボンドワイヤソー。   In a resin bond wire saw in which an abrasive grain layer in which abrasive grains are bonded with a resin is provided around the core wire, a filler whose average grain size is 30% or less of the average grain diameter of the abrasive grains is 5% of the volume of the resin occupying the abrasive grain layer. A resin bond wire saw, wherein the filler is added in a region of the abrasive grain layer in a direction in which the abrasive grains sink, added in an amount of 50% by volume or more and 50% by volume or less. 前記芯線と前記砥粒層との間に樹脂からなる緩衝層が設けられ、前記緩衝層の厚みが２μｍ以上５μｍ以下であることを特徴とする請求項１記載のレジンボンドワイヤソー。   The resin bond wire saw according to claim 1, wherein a buffer layer made of a resin is provided between the core wire and the abrasive grain layer, and the thickness of the buffer layer is 2 µm or more and 5 µm or less. 前記緩衝層に平均粒径が緩衝層の厚み以下のフィラーが緩衝層の体積の５体積％以上５０体積％以下で添加されていることを特徴とする請求項２記載のレジンボンドワイヤソー。   The resin bond wire saw according to claim 2, wherein a filler having an average particle size of not more than the thickness of the buffer layer is added to the buffer layer in an amount of 5 to 50% by volume of the buffer layer. 前記砥粒層を占める樹脂は紫外線硬化樹脂からなり、砥粒層に添加するフィラーの紫外線透過率が５０％以上であることを特徴とする請求項１から３のいずれかに記載のレジンボンドワイヤソー。   The resin bond wire saw according to any one of claims 1 to 3, wherein the resin occupying the abrasive layer is made of an ultraviolet curable resin, and an ultraviolet transmittance of a filler added to the abrasive layer is 50% or more. . 前記砥粒には金属被覆が施され、砥粒の含有量が樹脂、フィラー、砥粒からなる砥粒層の５体積％以上２５体積％以下であることを特徴とする請求項１から４のいずれかに記載のレジンボンドワイヤソー。   5. The abrasive grain according to claim 1, wherein a metal coating is applied to the abrasive grains, and the abrasive grain content is 5% by volume or more and 25% by volume or less of an abrasive layer made of resin, filler, and abrasive grains. The resin bond wire saw in any one. 砥粒を樹脂で結合した砥粒層が芯線の周囲に設けられたレジンボンドワイヤソーの製造方法において、平均粒径が砥粒の平均粒径の３０％以下であるフィラーを砥粒の外周に付着し、この砥粒を樹脂で結合することを特徴とするレジンボンドワイヤソーの製造方法。   In a resin bond wire saw manufacturing method in which an abrasive layer in which abrasive grains are bonded with a resin is provided around a core wire, a filler having an average grain size of 30% or less of the average grain size of the abrasive grains is attached to the outer periphery of the abrasive grain. A method of manufacturing a resin bond wire saw, wherein the abrasive grains are bonded with a resin.
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US8425640B2 (en) 2009-08-14 2013-04-23 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
US9028948B2 (en) 2009-08-14 2015-05-12 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof
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JP2008246646A (en) * 2007-03-30 2008-10-16 Noritake Super Abrasive:Kk Resin bond wire saw
JP4633082B2 (en) * 2007-03-30 2011-02-16 株式会社ノリタケスーパーアブレーシブ Resin bond wire saw
US9862041B2 (en) 2009-08-14 2018-01-09 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
US8425640B2 (en) 2009-08-14 2013-04-23 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
US9028948B2 (en) 2009-08-14 2015-05-12 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof
US9067268B2 (en) 2009-08-14 2015-06-30 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
CN102712080A (en) * 2010-06-15 2012-10-03 新日本制铁株式会社 Saw wire
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US9186816B2 (en) 2010-12-30 2015-11-17 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
JP2012240150A (en) * 2011-05-18 2012-12-10 Noritake Co Ltd Wire tool and method of manufacturing the same
US9375826B2 (en) 2011-09-16 2016-06-28 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9211634B2 (en) 2011-09-29 2015-12-15 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof
US9533397B2 (en) 2012-06-29 2017-01-03 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9278429B2 (en) 2012-06-29 2016-03-08 Saint-Gobain Abrasives, Inc. Abrasive article for abrading and sawing through workpieces and method of forming
US9687962B2 (en) 2012-06-29 2017-06-27 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9254552B2 (en) 2012-06-29 2016-02-09 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9902044B2 (en) 2012-06-29 2018-02-27 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US10596681B2 (en) 2012-06-29 2020-03-24 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9409243B2 (en) 2013-04-19 2016-08-09 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
US9878382B2 (en) 2015-06-29 2018-01-30 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
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