WO2003100136A3 - Alkaline zinc-nickel bath with increased current efficiency - Google Patents
Alkaline zinc-nickel bath with increased current efficiency Download PDFInfo
- Publication number
- WO2003100136A3 WO2003100136A3 PCT/EP2003/005394 EP0305394W WO03100136A3 WO 2003100136 A3 WO2003100136 A3 WO 2003100136A3 EP 0305394 W EP0305394 W EP 0305394W WO 03100136 A3 WO03100136 A3 WO 03100136A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- current efficiency
- increased current
- deposition
- alkaline zinc
- nickel bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003238380A AU2003238380A1 (en) | 2002-05-28 | 2003-05-23 | Alkaline zinc-nickel bath with increased current efficiency |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002123622 DE10223622B4 (en) | 2002-05-28 | 2002-05-28 | Alkaline zinc-nickel bath and corresponding electroplating process with increased current efficiency |
DE10223622.4 | 2002-05-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003100136A2 WO2003100136A2 (en) | 2003-12-04 |
WO2003100136A3 true WO2003100136A3 (en) | 2004-03-25 |
Family
ID=29557338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/005394 WO2003100136A2 (en) | 2002-05-28 | 2003-05-23 | Alkaline zinc-nickel bath with increased current efficiency |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003238380A1 (en) |
DE (1) | DE10223622B4 (en) |
WO (1) | WO2003100136A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007002321B4 (en) * | 2007-01-16 | 2018-07-05 | Volkswagen Ag | Coil spring with corrosion protection |
CN105239115A (en) * | 2015-10-22 | 2016-01-13 | 广州超邦化工有限公司 | Alkaline zinc-nickel alloy electroplating solution with high stability |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699696A (en) * | 1986-04-15 | 1987-10-13 | Omi International Corporation | Zinc-nickel alloy electrolyte and process |
DE3712511A1 (en) * | 1986-04-14 | 1987-10-15 | Dipsol Chem | ELECTRIC PLATING BATH |
EP0346161A1 (en) * | 1988-06-10 | 1989-12-13 | Mcgean-Rohco, Inc. | Acid zinc-nickel plating baths |
EP0649918A1 (en) * | 1993-10-21 | 1995-04-26 | Mcgean-Rohco, Inc. | Alkaline zinc-nickel alloy plating baths |
WO2000006807A2 (en) * | 1998-07-30 | 2000-02-10 | Walter Hillebrand Gmbh & Co. Galvanotechnik | Alkali zinc nickel bath |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681211A (en) * | 1970-11-23 | 1972-08-01 | Enequist Chem Co Inc The | Electroplating a black nickel-zinc alloy deposit |
DE19848467C5 (en) * | 1998-10-21 | 2006-04-27 | Walter Hillebrand Gmbh & Co. Kg Galvanotechnik | Alkaline zinc-nickel bath |
DE19956383A1 (en) * | 1999-11-24 | 2001-05-31 | Henkel Kgaa | Process for phosphatizing surfaces made of steel, galvanized steel and/or aluminum (alloy) comprises phosphatizing using a phosphatizing solution and post-rinsing with a solution containing copper ions and silanes |
-
2002
- 2002-05-28 DE DE2002123622 patent/DE10223622B4/en not_active Expired - Fee Related
-
2003
- 2003-05-23 AU AU2003238380A patent/AU2003238380A1/en not_active Abandoned
- 2003-05-23 WO PCT/EP2003/005394 patent/WO2003100136A2/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3712511A1 (en) * | 1986-04-14 | 1987-10-15 | Dipsol Chem | ELECTRIC PLATING BATH |
US4699696A (en) * | 1986-04-15 | 1987-10-13 | Omi International Corporation | Zinc-nickel alloy electrolyte and process |
EP0346161A1 (en) * | 1988-06-10 | 1989-12-13 | Mcgean-Rohco, Inc. | Acid zinc-nickel plating baths |
EP0649918A1 (en) * | 1993-10-21 | 1995-04-26 | Mcgean-Rohco, Inc. | Alkaline zinc-nickel alloy plating baths |
WO2000006807A2 (en) * | 1998-07-30 | 2000-02-10 | Walter Hillebrand Gmbh & Co. Galvanotechnik | Alkali zinc nickel bath |
Also Published As
Publication number | Publication date |
---|---|
AU2003238380A8 (en) | 2003-12-12 |
DE10223622B4 (en) | 2005-12-08 |
AU2003238380A1 (en) | 2003-12-12 |
DE10223622A1 (en) | 2003-12-18 |
WO2003100136A2 (en) | 2003-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004101854A3 (en) | Aqueous alkaline zincate solutions and methods | |
WO2004005528A3 (en) | Pyrophosphoric acid bath for use in copper-tin alloy plating | |
TW200502437A (en) | Solution for etching copper surfaces and method of depositing metal on copper surfaces | |
CA2346587A1 (en) | Method of manufacturing an aluminum product | |
TWI255873B (en) | Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby | |
AU2002256115A1 (en) | Zinc/air cell | |
KR960014421A (en) | Surface roughening treatment method of copper foil | |
WO2005010233A3 (en) | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys | |
TWI268292B (en) | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions | |
EP1111097A3 (en) | Bright tin-copper alloy electroplating solution | |
EP1452628A4 (en) | Copper electroplating method, pure copper anode for copper electroplating and semiconductor wafer plated thereby with little particle adhesion | |
US3881999A (en) | Method of making abrasion resistant coating for aluminum base alloy | |
CN101613862A (en) | Method for processing plastic surface | |
WO2004094682A3 (en) | Improved coating for silver plated circuits | |
KR100693902B1 (en) | A double nickel plating method of a permanent magnet with Nd-Fe-B | |
WO2002063069A3 (en) | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features | |
CN109075019A (en) | Semiconductor devices and manufacturing method | |
CA1227451A (en) | Electrolessly plating workpiece with nickel and after activation, with chromium | |
WO2003100136A3 (en) | Alkaline zinc-nickel bath with increased current efficiency | |
WO2005064043A3 (en) | Improved metal strip electroplating | |
EP1199384A3 (en) | Plating Bath | |
EP1091023A3 (en) | Alloy composition and plating method | |
MY118571A (en) | Method for the manufacture of a leadless substrate especially a solder layer | |
CA2122406A1 (en) | Method for direct plating of iron on aluminum | |
WO2002029875A3 (en) | Plating system with remote secondary anode for semiconductor manufacturing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |