WO2003031995A1 - Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence - Google Patents

Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence Download PDF

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Publication number
WO2003031995A1
WO2003031995A1 PCT/US2001/031500 US0131500W WO03031995A1 WO 2003031995 A1 WO2003031995 A1 WO 2003031995A1 US 0131500 W US0131500 W US 0131500W WO 03031995 A1 WO03031995 A1 WO 03031995A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
circuit board
pins
pin
recited
Prior art date
Application number
PCT/US2001/031500
Other languages
English (en)
Inventor
Charles J. Johnston
Original Assignee
Delaware Capital Formation, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delaware Capital Formation, Inc. filed Critical Delaware Capital Formation, Inc.
Priority to JP2003534925A priority Critical patent/JP2005504991A/ja
Priority to CNA018237835A priority patent/CN1559008A/zh
Priority to EP01977631A priority patent/EP1438591A1/fr
Priority to PCT/US2001/031500 priority patent/WO2003031995A1/fr
Publication of WO2003031995A1 publication Critical patent/WO2003031995A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Definitions

  • This invention relates to the automatic testing of high frequency or high speed printed digital circuit boards and of components mounted on such boards, and more particularly to a matched impedance translator fixture used to translate test signals from a test analyzer to such circuit boards or components.
  • the circuit board is then mounted in the fixture superimposed on the array of test probes.
  • the spring- loaded probes are brought into spring-pressure contact with the test points on the circuit board under test.
  • Electrical test signals are then transferred from the board to the test probes and then to the exterior of the fixture for communication with a high speed electronic test analyzer which detects continuity or lack of continuity between various test points in the circuits on the board.
  • a typical class of test fixtures is the so called "grid type" class of test fixtures in which the random pattern of test points on the board are contacted by translator pins which transfer test signals to interface pins arranged in a grid pattern in a receiver.
  • a typical grid fixture includes a grid type of compliant test interface or probe field which typically includes equidistantly spaced openings forming a predetermined pattern. This type of compliant test interface because of its predetermined pattern of openings forming a grid is commonly referred to as a grid or grid base.
  • a translator fixture contains test electronics with a huge number of switches connecting test probes fitted in the grid base openings to corresponding test circuits in the electronic test analyzer.
  • a grid tester as many as 40,000 switches are used.
  • a translator fixture supports translator pins that communicate between a grid pattern of test probes in a grid base and an off-grid pattern of test points on the board under test.
  • so-called "tilt pins” are used as the translator pins.
  • the tilt pins are straight solid pins mounted in corresponding pre-drilled holes in translator plates which are part of the translator fixture. The tilt pins can tilt in various orientations to translate separate test signals from the off-grid random pattern of test points on the UUT to the grid pattern of test probes in the grid base.
  • test fixtures include test fixtures that are not of the "grid type.” These fixtures incorporate a compliant test interface having openings in pattern different from the standard grid patterns. For example, the openings may not be equidistantly or uniformly spaced forming "off-grid patterns.” Tilt pins are used with these fixtures to translate the test signals from the off-grid pattern on the compliant test interface to the off-grid pattern on the UUT.
  • the off-grid pattern on the UUT is different from the off-grid pattern on the compliant test interface.
  • the spacing between test points on the UUT may be shorter than the spacing between corresponding probes on the compliant test interface.
  • a recent approach uses a translator pin retention system for a translator fixture for a printed circuit board tester having a pattern of test probes facing away from a base plate upon which the translator fixture is mounted.
  • the fixture comprises a plurality of essentially parallel and spaced apart translator plates having patterns of preformed holes for containing and supporting translator pins extending through the plates of the translator fixture for use in translating test signals between test points on a printed circuit board supported by the fixture and the probes on the base of the tester.
  • a thin, flexible pin retention sheet comprising an elastomeric material is positioned above a surface of one of the translator plates so that the translator pins carried by the translator fixture extend through the pin retention sheet. The elastomeric pin retention sheet naturally applies a compression force around the translator pins.
  • testing of high frequency or high speed digital UUTs requires that the impedance of the test source (i.e., the test source providing the electrical signals) is matched to the impedance of the load (i.e., the UUT) in order to avoid attenuation of the high frequency signals.
  • the impedance of the interconnect between the UUT and test analyzer must also be matched to the impedance of the source and to the impedance of the load.
  • the problem with present translator fixtures incorporating pins is that the characteristic impedance of the pins may vary from pin to pin. Such impedance variation is caused by the variance in the spacings between a set of two pins (i.e., a signal pin and a ground pin) used to test a set of test points.
  • each set of pins forms a capacitor with the air being the capacitor's dielectric. Since the spacing of one set of pins may vary from the spacing another set of pins, so does the capacitance between each set and hence the impedance of the pins of each set. As such, current translator fixtures incorporating pins are not suited for testing high frequency or high speed UUTs.
  • high frequency or high speed digital UUTs such as digital circuit boards, digital circuit boards with mounted components, or individual components are typically tested using test sockets.
  • short spring probes are fitted in cavities formed through the thickness of the socket.
  • a contact side of the UUT is brought into pressure contact with the tips of the spring probes protruding through a side of the socket.
  • a contact plate connected to the test analyzer is brought into contact with the tips of the spring probes protruding through an opposite side of the socket.
  • the test analyzer transmits high frequency test signals to the contact plate from where the signals are transmitted through the spring probes to the UUT.
  • the present invention is based on a recognition of a need for a matched impedance interconnect which can be used for testing high frequency UUTs having a contact point center spacing that is less than 0.07 inch. Moreover, the invention is based on a recognition of a need for such a translator fixture which does not incorporate mechanical means such as spring probes for exerting a compliant force on the pins in the translator fixture.
  • the present invention is directed to a translator fixture or interconnect for testing high frequency or high speed digital circuit boards or unit under test ("UUT).
  • UUT high frequency or high speed digital circuit boards or unit under test
  • the invention comprises a translator fixture having a top and a base spaced apart grounded support plates, each plate having pin openings formed through its thickness. In one embodiment, there are four support plates positioned between the top and base plates, although the number may vary.
  • the UUT interfaces with an upper surface of the top plate.
  • the top plate has pin openings corresponding to a set of test points on the UUT.
  • the base plate interfaces with a compliant test interface (or probe field) having an array of spring loaded test probes arranged in a grid or an off-grid pattern.
  • the base plate openings correspond to this spring probe pattern.
  • the probe pattern is typically different from the pattern formed by the set of test points on the UUT.
  • a second circuit board is coupled to the test analyzer and to the compliant test interface.
  • Coaxial pins are used to provide a signal path from the test analyzer to test points on the UUT which may have centers which are spaced apart at distances of less than 0.07 inch and even less than 0.025 inch.
  • Coaxial pins consist of a signal pin which is surrounded by a shield. The signal pin is separated from the shield by a dielectric material. The shield serves as a ground. The spacing between the signal pin and the shield for each pin used is the same. As a result, each coaxial pin has the same impedance.
  • the tips of the coaxial pins are ground to a point such that the signal pins extend beyond their corresponding shields.
  • One end of the coaxial pin penetrates the opening on the top plate, while the other end penetrates the opening on the base plate and is in contact with a predetermined spring loaded test probe in the compliant test interface.
  • the spring loaded test probe applies a compliant force against the coaxial pin to ensure a positive contact with the test point on the UUT.
  • Signals from the test analyzer are transferred via the second circuit board through the spring loaded test probes and through the coaxial pins to the test points on the UUT.
  • Ground pins may also used to connect ground points on the UUT with grounded spring loaded test probes in the compliant test interface.
  • the impedance of the coaxial pins, ground pins, coaxial test probes, UUT, the test analyzer and interfacing circuit board are matched.
  • the impedance of the probes in the compliant test interface is a function of the spacing between adjacent signal and ground probes.
  • the matching of impedances allows the interconnect to be used in testing high frequency or high speed digital circuit boards.
  • the translator fixture does not incorporate any spring loaded probes and thus does not interface with a compliant test interface. Rather, the UUT is interfaced with the top plate. A second circuit board, which is coupled to the test analyzer, is interfaced with the bottom plate. Coaxial pins provide the signal path between the second and first circuit boards. During testing, the two circuit boards are moved toward each other, either by applying a vacuum or by mechanical means, causing the coaxial pins to buckle, preferably under Euler buckling. The buckling of the pins causes them to exert a compliant force against the two circuit boards, thereby ensuring a positive contact between the pin and the test points on the UUT and the appropriate points on the second circuit board. The points on the second board may form a grid or an off-grid pattern.
  • the top plate is separated from the base plate using two-piece posts.
  • Each two-piece post comprises a first member slidably engaged to a second member.
  • One member is coupled to the top plate and the other member to the base plate.
  • the first member does not span the entire distance between the two plates.
  • a gap exists between the first member and one of the plates.
  • the pins buckle.
  • the gap formed between the first member and one of the plates is eliminated.
  • the initial width of the gap controls the amount of travel between the two circuit boards toward each other, and thus, the amount of buckling of the pins.
  • the spacing between the signal pin and the shield of each coaxial pin remains unchanged even when the coaxial pin is buckled. Consequently, the impedance of the coaxial pins remains constant even when buckled.
  • the pins may be tilted sufficiently to provide an interconnect to contact points on the UUT whose centers are spaced apart by a distance of less than 0.07 inch and even less than 0.025 inch.
  • the interconnects of the present invention can be used to test high frequency UUTs.
  • FIG. 1 is a schematic block diagram illustrating components of a tester and a translator fixture with pin retention means according to principles of this invention.
  • FIG.2 is a fragmentary cross-sectional view of a translator fixture incorporating coaxial rigid pins.
  • FIG. 3 is a cross-sectional view of a coaxial pin.
  • FIG. 4A is a fragmentary cross-sectional view of a translator fixture incorporating coaxial rigid pins without spring loaded probes.
  • FIG. 4B is a fragmentary cross-sectional view of the translator fixture of FIG. 4A with the coaxial pins buckled.
  • FIG. 5 A is a front elevation view of the translator fixture of FIG. 4A.
  • FIG. 5B is a front elevation view of the translator fixture shown in FIG. 4B.
  • a circuit board tester includes a compliant test interface plate or probe field (referred to herein as the "compliant test interface") 10 having an array of spring-loaded test probes 12 arranged on a two-dimensional pattern.
  • This pattern may be a grid pattern consisting of an array of uniformly spaced apart rows and columns of test probes or may be an off-grid pattern, i.e., a pattern that does not consist solely of uniformly spaced apart test probes.
  • the test probes 12 comprise spring-loaded plungers which project above the surface of the compliant test interface, typically uniformly across the array of probes.
  • a translator fixture or interconnect 14 supports a high frequency or high speed printed circuit board 16, or a circuit board with mounted components, or an individual component or grouping of individual components under test (also referred to herein as a "unit under test” or "UUT").
  • a translator fixture serves as an interface between an array of test points 18 on the board under test and the test probes 12 in the compliant test interface.
  • An external electronic test analyzer 20 is electrically connected to the test points in the board under test through test probes in the translator fixture. These test probes (of which there can be several types) are illustrated generally at 22.
  • the test analyzer 20 contains electronic interrogation circuits to electronically interrogate separate test points 18 of the UUT to determine the high frequency characteristics of the electrical connection between any two given test points.
  • the high frequency characteristics detected between test points on the UUT are electronically compared with stored reference results obtained from a previous interrogation of test points of a faultless master printed circuit board.
  • the tested board is good if test results match the stored reference results, but if any problem exists in the circuits on the board, the problem is detected by the test results and the bad boards then can be separated from the good boards.
  • Electronic interrogation circuits may comprise a plurality of printed circuit cards having electronic components and printed circuits for carrying out the electronic testing.
  • Each test probe used in the test procedure may be coupled to the test electronics through a corresponding switch 24 leading to the test analyzer.
  • a grid-type tester i.e., a tester comprising a compliant test interface having a grid pattern of openings to accommodate the test probes
  • switches there can be as many as 40,000 switches available for testing the various test points in a board under test. These switches are preferably incorporated in one or multiple circuit boards.
  • the translator fixture 14 includes a series of vertically spaced-apart and parallel translator support plates which may include a top plate 26, an upper plate 28 spaced a short distance below the top plate, a middle plate 30 at approximately an intermediate level of the translator fixture, and a 33016P/E87
  • the fixture also includes an array of standard translator pins such as tilt pins represented schematically at 22 extending through the translator plates 26, 28, 30 and 32.
  • FIG. 1 illustrates only a few of the standard tilt pins for simplicity.
  • the tilt pins extending through the base plate 32 of the translator fixture are in alignment with the pattern of test probes 12 in the compliant test interface 10.
  • the top portions of the tilt pins, which extend through the top plate 26, are in an off-grid pattern aligned to match the random pattern of test points 18 on the UUT.
  • the tilt pins can be tilted slightly and various three dimensional orientations that can be used in order to translate between the probe pattern at the compliant test interface and the off-grid pattern at the top. Because they are tilted, tilt pins are able to contact test points on the UUT whose centers are spaced at less than 0.07 inch. By tilting the pins, instead of keeping them parallel relative to each other, the points of the pins may be brought much closer together.
  • the standard tilt pins pass through holes in the base, lower, middle, upper, and top plates.
  • the holes in each of the translator plates are drilled in patterns controlled by standard computer- operated software xording-to-welH nown procedures for-aligning the tilt pins in the various orientations to translate between the probe pattern at compliant test interface and the off-grid pattern at the UUT.
  • the tilt pins also extend through a flexible pin retention sheet 34 comprising a common sheet of a thin, flexible elastomeric material located over the base plate (and below the lower plate in a preferred embodiment) of the translator fixture.
  • the pin retention sheet is described in the aforementioned U.S. Patent No. 5,493,230.
  • the present invention is directed to the testing of high frequency or high speed digital UUTs using translator fixtures with tilt pins. Applicant has discovered that use of tilt pins allow for the testing of UUTs whose contacts have close centers, i.e., the spacing between the centers of two contacts is less than 0.07 inch and even less than 0.025 inch.
  • High frequency testing encompasses testing at frequency levels exceeding 100 MHz with a testing bandwidth exceeding 1 GHz. It is not uncommon to test at frequencies in the 1-2 GHz range and even in the 4 GHz range.
  • the impedance of the source i.e., the test circuit
  • the load i.e., the UUT
  • the impedance of the tilt pins and the impedance of the spring loaded probes match the impedance of the load.
  • the impedance of conventional tilt pins mounted in a translator fixture may vary from pin to pin. This is due to the 33016P/E87
  • the present invention overcomes this problem via use of a translator fixture having rigid coaxial pins as shown in FIG. 2.
  • Coaxial pins 23 consist of a center signal pin 40 surrounded by a ground shield 42 (FIG. 3).
  • a dielectric 44 separates the signal pin from the shield.
  • the radial distance 46 between the signal pin and shield, and therefore the radial thickness of the dielectric, is constant from one end of the pin to the other.
  • a coaxial pin is tailored to have a specific impedance.
  • the coaxial pins contained in the translator fixture have substantially the same impedance.
  • the impedance of both the load and the UUT is 50 ohms.
  • the impedance of the coaxial pins is also 50 ohms.
  • the tips of the coaxial pins are ground to a point such that each signal pin 40 extends beyond the shield. Moreover, by having pointed ends, the end points of the coaxial pins can be brought closer together by tilting, allowing them to make contact with points on a UUT that are spaced less than 0.025 inch apart.
  • one end of the coaxial pin shield terminates at the upper surface 50 of the top plate, while the other end terminates at the lower surface 52 of the base plate.
  • the top and base plates are ground plates and are typically both connected to an electrical ground using a low loss ground connection 48.
  • the signal pins protrude beyond the top plate to contact the UUT and beyond the base plate to contact the signal carrying spring loaded probes, respectively.
  • the spring loaded probes exert a compliant force on the pins to ensure a positive contact with the test points on the UUT.
  • Ground pins 54 may be used to contact ground test points on the UUT and the grounded spring loaded probes (also referred to as the "ground probes") in the compliant test interface.
  • the impedance of the ground pins is also matched to the impedance of the source, load and coaxial pins.
  • the impedance of the signal and ground probes is a function of the spacing of the probes in the compliant test interface. Since the impedance of the coaxial pins is not affected by the spacing between pins, the spacing of the probes in the compliant test interface can be easily tailored to yield to desired probe impedance and to accommodate reasonably sized spring loaded probes.
  • an interface circuit board 58 interfaces the spring loaded probes to the test equipment.
  • the signal pins 23 communicate with signal points on the interface circuit board 58.
  • the impedance of the circuit board 58 is also matched to the impedance 33016P/E87
  • a circuit is completed from the test equipment through the interface circuit board, through a signal probe, through a test point on the UUT, through a ground test point on the UUT, and through a ground pin to ground.
  • the ground test points on the UUT may be grounded directly to the top plate, thus alleviating the need for ground pins.
  • a translator fixture comprises a top plate 126 and a base plate 132 without use of intermediate plates (FIG. 4A).
  • the top plate interfaces with the UUT 16 while the base plate interfaces with a test analyzer interface circuit board 158.
  • the top and base plates are grounded.
  • Each of the plates has openings 60 penetrating their entire thickness.
  • the top and base plates are shown in FIG. 4 A as having one opening 60.
  • the top plate openings are aligned with the test points on the UUT.
  • the base plate openings are aligned with signal points on the interface circuit board. They may also be aligned with ground points on the interface circuit board.
  • the ground points on the interface circuit board and the ground test points on the UUT may directly contact the ground base and top plates, respectively.
  • Coaxial tilt pins 123 have one end fitted into an opening in the base plate and one end fitted into the opening in the top plate so as to provide the requisite signal path between the test analyzer and UUT. Because the tips or ends of the coaxial tilt pins are ground to preferably a conical shape allowing the center signal pins to extend beyond the shields, only the points of the signal pins make contact with the test points on the UUT and the signal points on the interface circuit board. The shields contact the circumferential walls of openings 60 in the top and base plates. Ground pins in the form of tilt pins may also be used in situations where the ground points on the UUT are not ground to the top plate.
  • the top plate 126 is coupled to the base plate 132 using posts 70 (FIG. 5 A).
  • each post comprises a first member 72 slidably engaged with a second member 74.
  • One member is coupled to the top plate and the other to the base plate.
  • the first member does not span the entire distance between the two plates.
  • a gap 76 exists between the first member and one of the plates.
  • the UUT and interface circuit board are then moved toward each other, causing the coaxial pins to buckle. This can be achieved by pushing on either or both the UUT and interface circuit board, using a mechanical device 80. Alternatively, this may be achieved by introducing a vacuum between the UUT and interface circuit board causing the two to move toward each other.
  • the vacuum may be introduced by a vacuum means 82.
  • a vacuum means 82 Use of a mechanical device or vacuum means to move the plates toward each other is known in the art.
  • the tilt pins buckle under Euler bucking (FIG. 4B).
  • Euler buckling occurs when the load applied to a slim slender column, i.e., the pin, is at P cr which is equal to 47T 2 EI/1 2 , where E 33016P/E87
  • the two members of each post also slide relative to each other thereby closing the gap 76. Once the gap is closed (FIG. 5B), the UUT and interface circuit board can not move any further toward each other.
  • the gap width can be tailored for limiting the buckling of the pins to a desired level.
  • the coaxial pins exert a compliant force against the test points on the UUT and the appropriate points on the interface circuit board.
  • spring loaded probes are not required-for exerting a compliant force on the pins for ensuring a positive contact between the pins and the test points on the UUT.
  • An advantage of this embodiment is that it avoids the use of spring loaded probes in the test circuit. Consequently, the time and cost for having to appropriately space such probes on a compliant test interface for matching their impedance to that of the UUT are also reduced.
  • the impedance of the interface circuit board also needs to be matched to the impedance of the UUT.
  • the impedance of the ground pins should also be matched to the impedance of the UUT.
  • the top plate may interface with a first circuit board (not shown) other than the UUT.
  • the UUT is coupled or otherwise interfaces with the first circuit board.
  • the base plate may interface with a second circuit board (not shown). In such case, the second circuit board and the interface circuit board 158 will be coupled to, or otherwise interface with, each other.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

L'invention concerne un montage de translation destiné à être utilisé dans les tests de cartes de circuits imprimés numériques à haute fréquence ou à haute vitesse. Le montage selon l'invention comprend une plaque supérieure (29) de support de broches et une plaque de base (32), ainsi que des broches de test (23) coaxiales, à impédance constante, intégrées dans le montage pour former un trajet de signal d'un analyseur de test à une carte de circuits imprimés (16) testée. La carte testée est couplée à la surface supérieure de la plaque supérieure. L'impédance des broches coaxiales est adaptée à l'impédance de la carte testée et à l'impédance de l'analyseur de test. La force exercée sur les broches coaxiales assure le contact des broches avec les points de test situés sur la carte de circuits imprimés testée. Cette force peut être exercée par des sondes à ressort (12) montées sur une interface de test (10) flexible disposée en dessous de la plaque de base. Cette force peut également être exercée par flambement d'Euler des broches, par un mouvement relatif entre la carte de circuits imprimés testée et une deuxième carte de circuits imprimés couplée à la plaque de base ou à l'analyseur de test.
PCT/US2001/031500 2001-10-10 2001-10-10 Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence WO2003031995A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003534925A JP2005504991A (ja) 2001-10-10 2001-10-10 高周波回路板を検査するための同軸チルトピン治具
CNA018237835A CN1559008A (zh) 2001-10-10 2001-10-10 测试高频电路板的同轴倾斜引脚卡具
EP01977631A EP1438591A1 (fr) 2001-10-10 2001-10-10 Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence
PCT/US2001/031500 WO2003031995A1 (fr) 2001-10-10 2001-10-10 Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/031500 WO2003031995A1 (fr) 2001-10-10 2001-10-10 Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence

Publications (1)

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WO2003031995A1 true WO2003031995A1 (fr) 2003-04-17

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PCT/US2001/031500 WO2003031995A1 (fr) 2001-10-10 2001-10-10 Montage de broches a inclinaison coaxiale permettant de tester des cartes de circuits imprimes haute frequence

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Country Link
EP (1) EP1438591A1 (fr)
JP (1) JP2005504991A (fr)
CN (1) CN1559008A (fr)
WO (1) WO2003031995A1 (fr)

Cited By (1)

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CN109088676A (zh) * 2018-07-02 2018-12-25 四川斐讯信息技术有限公司 一种射频测试头及射频测试仪

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Publication number Priority date Publication date Assignee Title
US8166446B2 (en) * 2007-09-13 2012-04-24 Jabil Circuit, Inc. Flexible test fixture
JP2015021726A (ja) * 2013-07-16 2015-02-02 日置電機株式会社 プローブユニットおよび基板検査装置
KR102044753B1 (ko) * 2018-05-25 2019-11-15 리노공업주식회사 검사장치
CN112858873B (zh) * 2020-12-31 2024-05-17 杭州广立微电子股份有限公司 一种基于二端测试的引脚资源分配方法及***
CN115932550B (zh) * 2022-12-29 2023-08-29 佛山市蓝箭电子股份有限公司 一种半导体测试装置

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JP2005504991A (ja) 2005-02-17
EP1438591A1 (fr) 2004-07-21

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