WO2003004725A3 - Regeneration method for a plating solution - Google Patents

Regeneration method for a plating solution Download PDF

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Publication number
WO2003004725A3
WO2003004725A3 PCT/EP2002/006654 EP0206654W WO03004725A3 WO 2003004725 A3 WO2003004725 A3 WO 2003004725A3 EP 0206654 W EP0206654 W EP 0206654W WO 03004725 A3 WO03004725 A3 WO 03004725A3
Authority
WO
WIPO (PCT)
Prior art keywords
tin
ions
solution
regeneration
plating solution
Prior art date
Application number
PCT/EP2002/006654
Other languages
French (fr)
Other versions
WO2003004725A2 (en
Inventor
Thomas Beck
Hans-Juergen Schreier
Sven Lamprecht
Rolf Schoeder
Kai-Jens Matejat
Original Assignee
Atotech Deutschland Gmbh
Thomas Beck
Hans-Juergen Schreier
Sven Lamprecht
Rolf Schoeder
Kai-Jens Matejat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to AU2002321069A priority Critical patent/AU2002321069A1/en
Application filed by Atotech Deutschland Gmbh, Thomas Beck, Hans-Juergen Schreier, Sven Lamprecht, Rolf Schoeder, Kai-Jens Matejat filed Critical Atotech Deutschland Gmbh
Priority to JP2003510478A priority patent/JP4157838B2/en
Priority to BRPI0210829-1A priority patent/BR0210829B1/en
Priority to KR1020037017284A priority patent/KR100827259B1/en
Priority to DE60203050T priority patent/DE60203050T2/en
Priority to MXPA03011772A priority patent/MXPA03011772A/en
Priority to AT02754692T priority patent/ATE289633T1/en
Priority to EP02754692A priority patent/EP1427869B1/en
Priority to US10/494,217 priority patent/US20040245108A1/en
Priority to CA002450258A priority patent/CA2450258A1/en
Publication of WO2003004725A2 publication Critical patent/WO2003004725A2/en
Publication of WO2003004725A3 publication Critical patent/WO2003004725A3/en
Priority to HK04105703A priority patent/HK1062926A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.
PCT/EP2002/006654 2001-07-03 2002-06-17 Regeneration method for a plating solution WO2003004725A2 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
MXPA03011772A MXPA03011772A (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution.
JP2003510478A JP4157838B2 (en) 2001-07-03 2002-06-17 Regeneration method of plating solution
BRPI0210829-1A BR0210829B1 (en) 2001-07-03 2002-06-17 Regeneration process of a coating bath containing ions in a state of high oxidation during the deposition of a metal layer.
KR1020037017284A KR100827259B1 (en) 2001-07-03 2002-06-17 Methods of depositing a metal layer and regenerating a solution
DE60203050T DE60203050T2 (en) 2001-07-03 2002-06-17 REGENERATION PROCESS FOR A PLATING SOLUTION
AU2002321069A AU2002321069A1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
AT02754692T ATE289633T1 (en) 2001-07-03 2002-06-17 REGENERATION PROCESS FOR A PLATING SOLUTION
CA002450258A CA2450258A1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
US10/494,217 US20040245108A1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
EP02754692A EP1427869B1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
HK04105703A HK1062926A1 (en) 2001-07-03 2004-08-03 Regeneration method for a plating solution.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10132478.2 2001-07-03
DE10132478A DE10132478C1 (en) 2001-07-03 2001-07-03 Process for depositing a metal layer and process for regenerating a solution containing metal ions in a high oxidation state

Publications (2)

Publication Number Publication Date
WO2003004725A2 WO2003004725A2 (en) 2003-01-16
WO2003004725A3 true WO2003004725A3 (en) 2004-04-15

Family

ID=7690626

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/006654 WO2003004725A2 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution

Country Status (16)

Country Link
US (1) US20040245108A1 (en)
EP (1) EP1427869B1 (en)
JP (1) JP4157838B2 (en)
KR (1) KR100827259B1 (en)
CN (1) CN1232677C (en)
AT (1) ATE289633T1 (en)
AU (1) AU2002321069A1 (en)
BR (1) BR0210829B1 (en)
CA (1) CA2450258A1 (en)
DE (2) DE10132478C1 (en)
ES (1) ES2236552T3 (en)
HK (1) HK1062926A1 (en)
MX (1) MXPA03011772A (en)
MY (1) MY130423A (en)
TW (1) TWI279456B (en)
WO (1) WO2003004725A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI259680B (en) 2003-07-16 2006-08-01 Interdigital Tech Corp Method and system for transferring information between network management entities of a wireless communication system
EP1630252A1 (en) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Process for coating antimony containing substrate with tin or tin alloys
JP4998704B2 (en) 2007-01-22 2012-08-15 上村工業株式会社 Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance
EP2298960A1 (en) 2009-08-24 2011-03-23 ATOTECH Deutschland GmbH Method for electroless plating of tin and tin alloys
DE102009060676B4 (en) 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Process and device for wet-chemical treatment of items to be treated
CN102586851B (en) * 2011-01-06 2015-03-04 宝山钢铁股份有限公司 Electrolytic method for relieving and reducing tin sludge generated in tin plating solution
EP2671968B1 (en) * 2012-06-05 2014-11-26 ATOTECH Deutschland GmbH Method and regeneration apparatus for regenerating a plating composition
CN104846406B (en) * 2015-05-12 2017-03-08 江苏理工学院 supercritical composite electroforming system recycling device and working method thereof
CN106011810B (en) * 2016-06-02 2019-01-11 东莞市智源电子科技有限公司 Stannic removal technique in the chemical tinning solution of Copper base material
CN109844182A (en) * 2016-10-24 2019-06-04 安美特德国有限公司 The method of tin layers and the purposes of the structure using the method comprising nickel phosphorous alloy underlayer and the tin layers are deposited on metal base
CN110387540A (en) * 2019-08-30 2019-10-29 江苏上达电子有限公司 Stannous replenishment system and method in a kind of tin dissolving slot
CN111676470A (en) * 2020-05-29 2020-09-18 广东天承科技有限公司 Simple and soluble high-valence tin reduction method
CN114232030B (en) * 2021-12-23 2023-04-18 广东鑫菱环境科技有限公司 PCB methanesulfonic acid tin stripping waste liquid recycling method
WO2024116456A1 (en) * 2022-11-28 2024-06-06 株式会社村田製作所 Method and device for regenerating plating composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2401719A1 (en) * 1974-01-15 1975-07-24 Vaw Ver Aluminium Werke Ag Tin recovery from colouring solns. for aluminium - by dissolving sludge in alkali and electrolysing
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
EP0545216A2 (en) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JPH06256999A (en) * 1993-03-05 1994-09-13 Kawasaki Steel Corp Method for recovering and regenerating tin plating liquid

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1527576A (en) * 1923-02-19 1925-02-24 Wheeling Steel & Iron Company Process of coating conducting materials with tin
US3784455A (en) * 1971-12-28 1974-01-08 Western Electric Co Methods of electrolytic regenerative etching and metal recovery
JPS5226315A (en) * 1975-08-25 1977-02-26 Fuji Photo Film Co Ltd Process for the recovery of silver from fixer
DE2742718C2 (en) * 1977-09-22 1984-04-19 ESTEL HOOGOVENS B.V., 1970 Ijmuiden Method and device for regenerating a tin-plating electrolyte
US4432844A (en) * 1982-01-28 1984-02-21 Fujisash Company Process for regeneration of electrolyte containing tin salts by reducing the same
DE3634710A1 (en) * 1986-10-11 1988-04-21 Ver Glaswerke Gmbh DEVICE FOR VACUUM COATING A GLASS DISC BY REACTIVE CATHODAL SPRAYING
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
US5705048A (en) * 1996-03-27 1998-01-06 Oxley Research, Inc. Apparatus and a process for regenerating a CUCl2 etchant
DE19719020A1 (en) * 1997-05-07 1998-11-12 Km Europa Metal Ag Method and device for regenerating tinning solutions
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
JP3455709B2 (en) * 1999-04-06 2003-10-14 株式会社大和化成研究所 Plating method and plating solution precursor used for it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2401719A1 (en) * 1974-01-15 1975-07-24 Vaw Ver Aluminium Werke Ag Tin recovery from colouring solns. for aluminium - by dissolving sludge in alkali and electrolysing
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
EP0545216A2 (en) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JPH06256999A (en) * 1993-03-05 1994-09-13 Kawasaki Steel Corp Method for recovering and regenerating tin plating liquid

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0186, no. 62 (C - 1287) 14 December 1994 (1994-12-14) *

Also Published As

Publication number Publication date
WO2003004725A2 (en) 2003-01-16
DE60203050T2 (en) 2006-02-23
JP4157838B2 (en) 2008-10-01
TWI279456B (en) 2007-04-21
DE60203050D1 (en) 2005-03-31
JP2004534151A (en) 2004-11-11
HK1062926A1 (en) 2004-12-03
MY130423A (en) 2007-06-29
BR0210829A (en) 2005-05-03
EP1427869A2 (en) 2004-06-16
ES2236552T3 (en) 2005-07-16
CN1524132A (en) 2004-08-25
ATE289633T1 (en) 2005-03-15
KR20040030725A (en) 2004-04-09
KR100827259B1 (en) 2008-05-07
US20040245108A1 (en) 2004-12-09
CA2450258A1 (en) 2003-01-16
EP1427869B1 (en) 2005-02-23
MXPA03011772A (en) 2004-04-02
AU2002321069A1 (en) 2003-01-21
BR0210829B1 (en) 2011-07-26
CN1232677C (en) 2005-12-21
DE10132478C1 (en) 2003-04-30

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