WO2002080197A1 - Composition for filling through-holes in printed wiring boards - Google Patents
Composition for filling through-holes in printed wiring boards Download PDFInfo
- Publication number
- WO2002080197A1 WO2002080197A1 PCT/US2002/009118 US0209118W WO02080197A1 WO 2002080197 A1 WO2002080197 A1 WO 2002080197A1 US 0209118 W US0209118 W US 0209118W WO 02080197 A1 WO02080197 A1 WO 02080197A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- holes
- curing
- conductor composition
- viscosity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Definitions
- the present invention relates to a conductor composition used to fill through-holes in printed wiring boards (PWB).
- PWB printed wiring boards
- the filled through-holes achieve interlayer connections between the circuit layers of the PWBs.
- Prior-art conductor thick film compositions for filling through-holes such as those described in Japanese Patent No. 2603053 and JP-A 11-209662 have made use of a composition comprising a bifunctional liquid epoxy resin having a viscosity at ordinary room temperature of not more than 15 Pa s or a solid epoxy resin, in combination with a reactive diluting agent and a solid latent curing agent.
- the viscosity of the composition must be lowered to some degree when attempting to fill through-holes with a conductor composition so as to keep voids from forming therein. Because this necessitates a reduction in the amount of electrically conductive powder in the binder or the use of a large amount of aliphatic epoxy compound, the unfortunate result has been to raise the resistance of the cured composition or lower its glass transition temperature.
- JP-A 5-20918 describes the use of a composition comprising an epoxy resin which is free of hydroxyl groups on the molecule in combination with an acid anhydride.
- obtaining a hydroxyl group- free epoxy resin requires repeated molecular distillation.
- the resulting epoxy resin has a high purity, it tends to crystallize, which has a very significant and adverse effect on the efficiency of operations.
- the invention is directed to a conductor composition
- a conductor composition comprising an electrically conductive powder and a binder, wherein the ratio of conductive powder to binder is from 95:5 to 70:30, and wherein the binder comprises:
- the invention provides a conductor composition
- a conductor composition comprising an electrically conductive powder and an epoxy resin binder, wherein the epoxy resin binder base is composed of an epoxy compound having an average number of functional groups greater than 2 and a monofunctional reactive diluting agent as the essential constituents.
- the inventive composition includes a curing agent that is selected from a cationic polymerization initiator capable of triggering a curing reaction even when present in a small amount or a curing agent that is liquid at an ordinary room temperature, and a small amount of a curing catalyst.
- the through-hole conductor thick film composition comprises an electrically conductive powder and a binder, wherein the ratio of conductive powder to binder is from 95:5 to 70:30.
- the electrically conductive powders in a given composition could comprise a single type of powder, mixtures thereof, alloys thereof, compounds of several elements or combinations or mixtures of the aforementioned.
- powders include: gold, silver, copper, nickel, aluminum, platinum, palladium, molybdenum, tungsten, tantalum, tin, indium, lanthanum, gadolinium, boron, ruthenium, cobalt, titanium, yttrium, europium, gallium, sulfur, zinc, silicon, magnesium, barium, cerium, strontium, lead, antimony, conductive carbon, and combinations thereof and others common in the art of thick film compositions.
- Examples of the epoxy resin having an average number of functional groups greater than 2 which may be used in the invention include compounds prepared by combining epichlorohydrin with the condensation product of an alkylphenol (e.g., phenol novolak, cresol novolak) with formaldehyde or dicyclopentadiene, and compounds prepared by combining such a condensation product with a bisphenol-type epoxy resin, a polyfunctional epoxy compound such as trihydroxytriphenylmethane triglycidyl ether, or a glycidylamine-type epoxy compound.
- the epoxy resin is preferably semi-solid at an ordinary room temperature.
- the monofunctional reactive diluting agent used in the invention may be the glycidyl ether of a higher alcohol or a compound prepared from an alkylphenol (e.g., nonylphenol) and epichlorohydrin.
- a reactive diluting agent having a vapor pressure of not more than 0.5 mmHg is preferred.
- a reactive diluting agent with a vapor pressure greater than 0.5 mmHg tends to volatilize easily, which may cause the viscosity of the composition to increase during printing or storage.
- the ratio of the semisolid epoxy compound having an average number of functional groups greater than 2 to the monofunctional reactive diluting agent is preferably from 90:10 to 50:50.
- An epoxy resin ratio greater than 90% may result in a loss of the diluting agent effects, thereby lowering the viscosity of the composition.
- a reactive diluting agent ratio in excess of 50% may make it impossible to achieve a three-dimensional matrix during curing.
- Illustrative examples of cationic polymerization initiators that may be used in the invention include tertiary amines, imidazoles, Lewis acid salts (BF3-amine complexes), and Br ⁇ nsted acid salts (aromatic sulfonium salts, aromatic diazonium salts).
- Lewis acid salts are preferred because they dissolve in epoxy resins and exhibit latency.
- the relative proportions in which the epoxy resin base (which includes the reactive diluting agent) and the cationic polymerization initiator are used in the invention may be selected from a range of 99:1 to 90:10. At less than 1% of initiator, the curing reaction tends to be difficult to trigger. On the other hand, more than 10% of initiator may cause the curing reaction to occur instantaneously, which may lead to undesirable results such as void formation when the conductor composition is filled into through-holes and cured.
- liquid acid anhydride curing agents that may be used in the invention include dicarboxylic anhydrides and derivatives thereof, such as hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride and methyl tetrahydrophthalic anhydride; and derivatives of polycarboxylic anhydrides, such as trimellitic anhydride triglyceride.
- a curing catalyst such as a tertiary amine, imidazole or amine compound may also be used. The use of an amine compound is preferable from the standpoint of storage stability.
- the amount of acid anhydride curing agent used in the invention may be selected from a range of 0.7 to 1.3 equivalent per epoxy functional group in the epoxy resin base. An amount of acid anhydride curing agent outside of this range may result in poor curing.
- the amount of curing catalyst may be selected from a range of 1 to 5 parts per 100 parts of the mixture of the epoxy resin base and the curing agent. At less than 1 part of curing catalyst, the epoxy resin base and the curing agent may fail to react, whereas more than 5 parts may increase the composition viscosity and result in a poor storage stability.
- the conductor composition of the present invention is typically manufactured by a mechanical mixing means (e.g., on a roll mill) to form a paste-like composition having suitable consistency and rheology for screen printing, and has preferably a viscosity ratio which is defined as a viscosity measurement at 0.5 rpm divided by a viscosity measurement at 10 rpm and 25°C using # 14 spindle and utility cup with a Brookfield Viscometer being not larger than 7.5.
- the resulting paste exhibits good hole filling properties without void formation in the body of the via fill.
- the filled vias with the resulting paste is shaped so as to be easily polished followed by a metal plating being applied on top of the filled vias so that electrical parts are mounted directly on such plated top of the filled vias.
- EPOSIL 759 produced by Air Products and Chemicals, Inc.
- 0.75 part of boron trifluoride-ethylamine complex 0.75 part of boron trifluoride-ethylamine complex, 42.5 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 42.5 parts of flake-like silver powder having an average particle size of 2.5 ⁇ m.
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volume resistivity was 1.4 10-4 ⁇ cm.
- the glass transition point of the cured product obtained by curing under the same conditions was 119°C.
- the percent weight loss on curing was 0.25%.
- This conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing.
- the composition had no voids and exhibited good hole filling properties.
- unplated through-holes some voids were found, but the overall hole filling properties were good.
- EXAMPLE 2 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 83 Pa s: 6.25 parts of phenol epoxy novolak (DEN431 , produced by The Dow Chemical Co.; viscosity at 25°C, 60 Pa s), 1.55 parts of monofunctional alkyl glycidyl ether (EPOSIL 759, produced by Air Products and Chemicals, Inc.),
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volume resistivity was 4.5x10" 4 ⁇ cm.
- the glass transition point of the cured product obtained by curing under the same conditions was 105°C.
- the percent weight loss on curing was 0.46%.
- the conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing.
- the composition had no voids and exhibited good hole filling properties.
- unplated through-holes the composition likewise had no voids and exhibited good hole filling properties.
- EXAMPLE 3 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 100 Pa s: 6.65 parts of phenol epoxy novolak (DEN431 , produced by The Dow Chemical Co.; viscosity at 25°C, 60 Pa s), 2.85 parts of monofunctional alkyl glycidyl ether (EPOSIL 759, produced by Air Products and Chemicals, Inc.), 0.5 part of boron trifluoride-ethylamine complex, 45 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 45 parts of flake-like silver powder having an average particle size of 2.5 ⁇ m.
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volume resistivity was 0.7x10 -4 ⁇ cm.
- the glass transition point of the cured product obtained by curing under the same conditions was 116°C.
- the percent weight loss on curing was 0.22%.
- the conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing. In plated through- holes, the composition had no voids and exhibited good hole filling properties. In unplated through-holes, some scattered voids were found, but the overall hole filling properties were good. EXAMPLE 4
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volume resistivity was 0.9x10-4 ⁇ cm.
- the glass transition point of the cured product obtained by curing under the same conditions was 109°C.
- the percent weight loss on curing was 0.33%.
- the conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing.
- the composition had no voids and exhibited good hole filling properties.
- unplated through-holes some scattered voids were found, but the overall hole filling properties were good.
- EXAMPLE 5 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 38 Pa s: 6.65 parts of phenol epoxy novolak (DEN431 , produced by The Dow Chemical Co.; viscosity at 25°C, 60 Pa s), 2.85 parts of monofunctional alkyl glycidyl ether (EPOSIL 759, produced by Air Products and Chemicals, Inc.), 0.5 part of boron trifluoride-ethylamine complex, 72 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 18 parts of flake-like silver powder having an average particle size of 2.5 ⁇ m.
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volumetric resistivity was
- the conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing.
- the composition had no voids and exhibited good hole filling properties.
- unplated through-holes some scattered voids were found, but the overall hole filling properties were good.
- COMPARATIVE EXAMPLE 1 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 128 Pa s: 3 parts of a bisphenol A-type liquid epoxy resin (Epikote 828, produced by Japan Epoxy Resin; viscosity at 25°C, 12 Pa s), 9 parts of the diglycidyl ester of dimer acid (YD-171 , produced to Toto Kasei; viscosity at 25°C, 0.6 Pa s), 3 parts of an amine curing agent (MY-24, produced by Ajinomoto Fine- Techno Co., Inc.), 42.5 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 42.5 parts of flake-like silver powder having an average particle size of 2.5 ⁇ m.
- a bisphenol A-type liquid epoxy resin Epikote 828, produced by Japan Epoxy Resin;
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour. An attempt was subsequently made to measure the resistivity, but the resistivity was not measurable.
- the glass transition point of the cured product obtained by curing under the same conditions was lower than room temperature. The percent weight loss on curing was 0.31%.
- COMPARATIVE EXAMPLE 2 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 61 Pa s: 10 parts of a bisphenol A-type liquid epoxy resin (Epikote 827, produced by Japan Epoxy Resin; viscosity at 25°C, 10 Pa s), 7.25 parts of a difunctional aliphatic diglycidyl ether (ED-508, produced by Asahi Denka Kogyo K.K.), 0.70 part of dicyandiamide, 1.05 part of an imidazole curing catalyst (2P4MHZ, produced by Shikoku Chemicals Corporation), 40.5 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 40.5 parts of flake-like silver powder having an average
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volumetric resistivity was
- This conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing. When filled into plated through-holes, many small voids were noted. Many voids were also observed in unplated through-holes.
- COMPARATIVE EXAMPLE 3 The following ingredients were mixed, blended and dispersed in a three-roll mill to give a conductor composition having a viscosity, as measured at 25°C with a Brookfield viscometer, of 248 Pa s: 7.8 parts of a bisphenol F-type epoxy resin (Epikote 807, produced by Japan Epoxy Resin; viscosity at 25°C, 3 Pa s), 6.95 parts of methyl tetrahydrophthalic anhydride (HN-2200, produced by Hitachi Chemical Co., Ltd.), 0.25 part of an imidazole curing catalyst (2P4MHZ, produced by Shikoku Chemicals Corporation), 40.5 parts of spherical silver powder having an average particle size of 7 ⁇ m, and 40.5 parts of flake-like silver powder having an average particle size of 2.5 ⁇ m.
- a bisphenol F-type epoxy resin Epikote 807, produced by Japan Epoxy Resin; viscosity at 25°C, 3 Pa s
- the conductor composition was printed onto circuits to a film thickness of 40 ⁇ m with a printer, then cured at 160°C for 1 hour, after which the resistivity was measured.
- the volumetric resistivity was 11 x10-4 ⁇ cm.
- the glass transition point of the cured product obtained by curing under the same conditions was 130°C.
- the percent weight loss on curing was 0.38%.
- This conductor composition was filled into 0.3 mm diameter through-holes in a 1 mm thick FR-4 board by printing. Large voids were noted in both plated and unplated through-holes.
- Example 1 versus Comparative Example 1 : Although the silver composition and the solids content was the same in both Example 1 according to the invention and Comparative Example 1 , the conductor composition in Example 1 had a low viscosity, a low resistance, and a high glass transition point. In spite of the use of a reactive diluting agent in Example 1, the conductor composition in this example had a smaller percent weight loss on curing than the composition in Comparative Example 1.
- Example 2 versus Comparative Example 3:
- Example 2 The silver composition and the solids content were the same in both Example 2 according to the invention and Comparative Example 3.
- this composition had a higher viscosity and resistivity than the composition prepared in Example 2.
- the presence of a reactive diluting agent in the composition of Example 2 gave this composition a lower glass transition point than the composition in Comparative Example 3.
- the resulting compositions were filled into through-holes, the high viscosity of the composition prepared in Comparative Example 3 resulted in the formation of voids.
- the composition obtained in Example 2 of the invention cleanly and completely filled the through-holes.
- Example 4 versus Comparative Example 2: In Comparative Example 2, it was necessary to set the content of silver solids to 81 % in order to achieve a viscosity comparable to that in Example 2 according to the invention (the silver solids content in Example 4 was 85%).
- the resistivity of the composition prepared in Comparative Example 2 was much higher than the composition in Example 4. Moreover, because a large amount of reactive diluting agent was used in Comparative Example 2 (42%, based on the epoxy resin and the diluting agent combined, as opposed to 30% in Example 4), the glass transition point was low. In spite of the presence of a large amount of diluting agent and the use of a lower viscosity epoxy resin than in Example 4, the conductor composition obtained in Comparative Example 2 had a high viscosity.
- Example 5 demonstrates that even at a silver solids content of 90%, a low composition viscosity can be achieved by altering the ratio of spherical silver power to flake-type silver powder. However, because raising the amount of spherical silver powder increases the resistivity, this approach cannot be used in systems already having both a high viscosity and resistivity.
- N/A Not applicable. Through-hole filling was not carried out.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02728560A EP1374255A1 (en) | 2001-03-28 | 2002-03-25 | Composition for filling through-holes in printed wiring boards |
KR10-2003-7012549A KR20040030551A (en) | 2001-03-28 | 2002-03-25 | Composition for Filling Through-Holes in Printed Wiring Boards |
US10/468,425 US20040094751A1 (en) | 2002-03-25 | 2002-03-25 | Composition for filling through-holes in printed wiring boards |
JP2002578520A JP2005510827A (en) | 2001-03-28 | 2002-03-25 | Composition for filling through hole of printed wiring board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27920601P | 2001-03-28 | 2001-03-28 | |
US60/279,206 | 2001-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002080197A1 true WO2002080197A1 (en) | 2002-10-10 |
Family
ID=23068071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/009118 WO2002080197A1 (en) | 2001-03-28 | 2002-03-25 | Composition for filling through-holes in printed wiring boards |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1374255A1 (en) |
JP (1) | JP2005510827A (en) |
KR (1) | KR20040030551A (en) |
CN (1) | CN1500278A (en) |
WO (1) | WO2002080197A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9676947B2 (en) | 2013-12-25 | 2017-06-13 | Noritake Co., Limited | Thermosetting conductive paste |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005040126A1 (en) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | coating composition |
KR20120071921A (en) * | 2010-12-23 | 2012-07-03 | 한국전자통신연구원 | Composition for filling through silicon vias (tsvs), tsv filling method and substrate including tsv filling formed of the composition |
JP6157440B2 (en) * | 2014-11-19 | 2017-07-05 | 株式会社ノリタケカンパニーリミテド | Heat-curing conductive paste |
JP6231977B2 (en) * | 2014-12-22 | 2017-11-15 | 株式会社ノリタケカンパニーリミテド | Heat-curing conductive paste |
TWI700305B (en) * | 2015-03-30 | 2020-08-01 | 日商則武股份有限公司 | Heat-curing conductive paste for laser etching |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410457A (en) * | 1981-05-11 | 1983-10-18 | Sumitomo Chemical Co., Ltd. | Conductive paste |
JPH06211965A (en) * | 1993-01-19 | 1994-08-02 | Nippon Kayaku Co Ltd | New fine particle containing cure accelerator, epoxy resin composition, and cured product |
JPH11209662A (en) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | Conductive paste |
JP2001002892A (en) * | 1999-06-17 | 2001-01-09 | Sumitomo Metal Mining Co Ltd | Conductive resin composition |
-
2002
- 2002-03-25 EP EP02728560A patent/EP1374255A1/en not_active Withdrawn
- 2002-03-25 WO PCT/US2002/009118 patent/WO2002080197A1/en not_active Application Discontinuation
- 2002-03-25 CN CNA028072375A patent/CN1500278A/en active Pending
- 2002-03-25 JP JP2002578520A patent/JP2005510827A/en not_active Ceased
- 2002-03-25 KR KR10-2003-7012549A patent/KR20040030551A/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410457A (en) * | 1981-05-11 | 1983-10-18 | Sumitomo Chemical Co., Ltd. | Conductive paste |
JPH06211965A (en) * | 1993-01-19 | 1994-08-02 | Nippon Kayaku Co Ltd | New fine particle containing cure accelerator, epoxy resin composition, and cured product |
JPH11209662A (en) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | Conductive paste |
JP2001002892A (en) * | 1999-06-17 | 2001-01-09 | Sumitomo Metal Mining Co Ltd | Conductive resin composition |
Non-Patent Citations (3)
Title |
---|
DATABASE WPI Section Ch Week 199435, Derwent World Patents Index; Class A21, AN 1994-283396, XP002204262 * |
DATABASE WPI Section Ch Week 199941, Derwent World Patents Index; Class A21, AN 1999-488969, XP002204261 * |
DATABASE WPI Section Ch Week 200128, Derwent World Patents Index; Class A21, AN 2001-268317, XP002204260 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9676947B2 (en) | 2013-12-25 | 2017-06-13 | Noritake Co., Limited | Thermosetting conductive paste |
Also Published As
Publication number | Publication date |
---|---|
CN1500278A (en) | 2004-05-26 |
EP1374255A1 (en) | 2004-01-02 |
KR20040030551A (en) | 2004-04-09 |
JP2005510827A (en) | 2005-04-21 |
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