WO2002073153A3 - Modul für eine analyseeinrichtung, applikator als austauschteil der analyseeinrichtung und zugehörige analyseeinrichtung - Google Patents

Modul für eine analyseeinrichtung, applikator als austauschteil der analyseeinrichtung und zugehörige analyseeinrichtung Download PDF

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Publication number
WO2002073153A3
WO2002073153A3 PCT/DE2002/000836 DE0200836W WO02073153A3 WO 2002073153 A3 WO2002073153 A3 WO 2002073153A3 DE 0200836 W DE0200836 W DE 0200836W WO 02073153 A3 WO02073153 A3 WO 02073153A3
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WO
WIPO (PCT)
Prior art keywords
analysis device
chip
applicator
module
sensor
Prior art date
Application number
PCT/DE2002/000836
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English (en)
French (fr)
Other versions
WO2002073153A2 (de
Inventor
Walter Gumbrecht
Manfred Stanzel
Manfred Wossler
Joerg Zapf
Original Assignee
Siemens Ag
Walter Gumbrecht
Manfred Stanzel
Manfred Wossler
Joerg Zapf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Siemens Ag, Walter Gumbrecht, Manfred Stanzel, Manfred Wossler, Joerg Zapf filed Critical Siemens Ag
Priority to CA002440126A priority Critical patent/CA2440126A1/en
Priority to US10/471,167 priority patent/US20050031490A1/en
Priority to JP2002572367A priority patent/JP2004532396A/ja
Priority to EP02722000A priority patent/EP1366361A2/de
Publication of WO2002073153A2 publication Critical patent/WO2002073153A2/de
Publication of WO2002073153A3 publication Critical patent/WO2002073153A3/de

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/02—Adapting objects or devices to another
    • B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
    • B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Investigating Or Analysing Biological Materials (AREA)

Abstract

Bei einem Analysegerät, insbesondere zur dezentralen biochemischen Analytik, mit einem Sensor-Chip in einem ersten Gehäuse, ist der Sensor-Chip Teil eines Moduls, bestehend aus Chipträger, Chip und elektrischen Kontakten zwischen Chip und Chipträger. Eine Verkapselung (5) des Chips (1) ist derart gestaltet, dass die elektrischen Kontakte (3, 3', ..., 3VIII) isoliert sind, die sensitive Fläche (2) des Sensor-Chips (1) aber für ein Fluid zugänglich bleibt. Modul (15) und ein erstes Gehäuse bilden einen austauschbaren Applikator (10, 20, 60), der zur Analyse und zum Auslesen der Messdaten in ein zweites Gehäuse (80) mit Auswerteeinheit einschiebbar ist. Der Applikator ist vorteilhafterweise nach Art einer Chipkarte (10), in die mikrofluidische Komponenten und/oder Funktionen integriert sind, ausgebildet.
PCT/DE2002/000836 2001-03-09 2002-03-08 Modul für eine analyseeinrichtung, applikator als austauschteil der analyseeinrichtung und zugehörige analyseeinrichtung WO2002073153A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CA002440126A CA2440126A1 (en) 2001-03-09 2002-03-08 Module for an analysis device, applicator as an exchangeable part of theanalysis device and associated analysis device
US10/471,167 US20050031490A1 (en) 2001-03-09 2002-03-08 Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith
JP2002572367A JP2004532396A (ja) 2001-03-09 2002-03-08 分析装置のためのモジュール、分析装置の交換部分としてのアプリケータおよび分析装置
EP02722000A EP1366361A2 (de) 2001-03-09 2002-03-08 Modul fur eine analyseeinrichtung, applikator als austauschteil der analyseeinrichtung und zugehörige analyseeinrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10111458A DE10111458B4 (de) 2001-03-09 2001-03-09 Analyseeinrichtung
DE10111458.3 2001-03-09

Publications (2)

Publication Number Publication Date
WO2002073153A2 WO2002073153A2 (de) 2002-09-19
WO2002073153A3 true WO2002073153A3 (de) 2003-04-03

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PCT/DE2002/000836 WO2002073153A2 (de) 2001-03-09 2002-03-08 Modul für eine analyseeinrichtung, applikator als austauschteil der analyseeinrichtung und zugehörige analyseeinrichtung

Country Status (6)

Country Link
US (1) US20050031490A1 (de)
EP (1) EP1366361A2 (de)
JP (1) JP2004532396A (de)
CA (1) CA2440126A1 (de)
DE (1) DE10111458B4 (de)
WO (1) WO2002073153A2 (de)

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US20050031490A1 (en) 2005-02-10
WO2002073153A2 (de) 2002-09-19
DE10111458B4 (de) 2008-09-11
JP2004532396A (ja) 2004-10-21
EP1366361A2 (de) 2003-12-03
DE10111458A1 (de) 2002-09-19

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