WO2002064304A1 - Dispositif de surveillance du stade de soudage - Google Patents
Dispositif de surveillance du stade de soudage Download PDFInfo
- Publication number
- WO2002064304A1 WO2002064304A1 PCT/JP2002/000922 JP0200922W WO02064304A1 WO 2002064304 A1 WO2002064304 A1 WO 2002064304A1 JP 0200922 W JP0200922 W JP 0200922W WO 02064304 A1 WO02064304 A1 WO 02064304A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- welding
- image
- monitoring device
- image sensor
- welded
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/741—Circuitry for compensating brightness variation in the scene by increasing the dynamic range of the image compared to the dynamic range of the electronic image sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/76—Circuitry for compensating brightness variation in the scene by influencing the image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/14—Picture signal circuitry for video frequency region
- H04N5/20—Circuitry for controlling amplitude response
Definitions
- the present invention relates to a welding condition monitoring device that supervises a welding condition by using an image taken by an image sensor of a work portion during welding in the welding device.
- a welding state is monitored by an image captured by an image sensor of a work part being welded.
- H indicates the halation portion
- f1 and f2 indicate the surface defects of the bead portion BB.
- the camera determines whether or not the distance between the welding heddle and the member to be welded during welding is always maintained at a predetermined value.
- a camera with a narrow dynamic range can clearly identify both the low-intensity irradiated part during teaching before welding and the high-intensity irradiated part during welding. In order to be able to see it, it is necessary to shoot while switching the filter or attaching / detaching the filter. There is a problem that the operation becomes troublesome.
- a welding apparatus configured to perform welding on a member to be welded in a non-contact manner, and based on an image taken by a CMOS camera, a welding edge during welding is provided.
- the bright spot part being welded was photographed from an oblique direction using a CMOS camera attached to the weld A-jid part. Therefore, a means for adjusting the height of the welding head to the member to be welded is provided so that the bright spot is always at a fixed position on the image taken by the CMOS camera.
- FIG. 1 is a schematic configuration diagram showing one configuration example of a welding condition monitoring device according to the present invention.
- FIG. 2 is an electric circuit diagram showing a configuration example of a photosensor circuit for one pixel in the image sensor.
- the 2nd west is an electric circuit diagram showing another configuration 1 of the optical sensor circuit.
- V pd ′ indicates a voltage signal inverted and amplified by the amplifying transistor Q2.
- the fifth garden simulates the operation state due to the flow of the charge g of the transistor Q1 during the 3 ⁇ 4J period.
- FIG. 6 schematically shows an operation state due to the flow of the electric charge of the transistor Q1 at the time of detecting the optical signal. .
- the residual charge of the junction capacitance C of the photodiode PD is discharged and initialized, and then the charge is injected into the junction capacitance C.
- Figure 7 is, in the optical sensor circuit, shows the characteristic of the rise of the difference response to the intensity of the incident 3 ⁇ 4 L S, Ji voltage signal VP d.
- FIG. 10 shows an image sensor in which a plurality of pixels are arranged in a matrix in such a manner that such an optical sensor circuit is used as a pixel unit, and each image signal is read out and executed in time series.
- the figure shows an example of a configuration in which each pixel is initialized so that each pixel can be initialized at an appropriate timing according to the reading scan of each image signal.
- the basic configuration of this image sensor is, for example, that 4 ⁇ 4 pixels consisting of Dl 1 to D 44 are arranged in a matrix, and a pixel row for each line is arranged in pixels. Selection is performed by the selection signals LS 1 to LS 4 sequentially output from the column selection circuit 11, and each pixel in the selected pixel column is selected by the selection signals DS 1 to DS sequentially output from the pixel selection circuit 12. 4, each of the corresponding switches SW1 to SW4 in the switch group 13 is sequentially turned on, so that each image signal Vo is read out in time series. .
- 14 is a power supply for the gate voltage VG of the transistor Q1 in each pixel
- 16 is a power supply for the drain voltage VD.
- the pixel column selection signal LS 1 becomes high level H, it first pixel row consisting of D 1 1 t D 12, D 13, D 14 to Taimise is selected. Then, during a certain period T1 in which LS1 is at the high level H, the pixel selection signals DS1 to DS4 sequentially become the high level H, and the pixels D11, D12, D13, D14 Picture signal V. Are sequentially read.
- the first and second images are image processing that emphasizes image signals at a high-intensity welding part and a low-intensity bead part from data of an image of a working part being welded by an image sensor.
- 2 shows a specific configuration example for executing the above.
- FIG. 13 (a) when the sensor current is above the predetermined value I s, the logarithmic output characteristic is shown, but when the sensor current becomes smaller than the predetermined value I s, the non-logarithmic output characteristic is shown.
- the output of the image signal Vo of the inuage sensor 21 indicating the above is converted into a digital image signal DS 1 having 8 bins and 256 gradations by the AD converter 22.
- the 256 gradations can be used effectively, and the logarithmic output characteristics can be shown over the entire area.
- Digital image signal DS2 Digital image signal
- the 14th image shows the state of the surface image in the working part being connected based on the linearly converted digital surface signal DS2.
- BS is a welded portion
- BB is a bead portion. According to the ft state, the bead portion B B can hardly be distinguished, and it is difficult to grasp the center position and the shape of the weld pool of the welded portion B S.
- Fig. 15 shows the characteristic a of the digital image signal DS2 on the line L1 crossing the welded part BS in the image shown in Fig. 14 and the digital image signal on the line L2 crossing the bead portion BB.
- the characteristic b of DS 2 is shown.
- the present invention in particular, in the Rigid Aip Table 23, it is possible to obtain a sufficiently wide dynamic range over the entire area, and to obtain a light and dark information amount using the full 256 gradations.
- a conversion process is performed in which the image signal of the part is omitted by drawing.
- the 16th zone shows the luminance distribution Ka at the bead immediately after welding and the luminance distribution Kb at the tangent part during welding.
- the image signal in the area of the luminance distribution Ka is required to see the bead part, and the luminance is required to see the welding part.
- the image signal in the area of the distribution Kb is essential. That is, as shown by the conversion characteristic A in FIG. 16, the digital image signal DS2 output from the lugi-adip table 23 is converted to linear. In this case, the image information of the area other than the luminance distribution K a and the luminance distribution K b becomes unnecessary.
- the portion corresponding to the region of the luminance distribution K a becomes the conversion characteristic B in the diagram
- the portion corresponding to the region of the luminance distribution K b becomes the conversion characteristic C in the diagram. Convert each one.
- the conversion characteristics B and C of the output of the image sensor 21 are treated as being on the same image.
- J3 ⁇ 4 it is also possible to handle the conversion characteristic B or the conversion characteristic C alone as an image. . That is, by using only the conversion characteristic B, it is possible to obtain an image of only the bead portion immediately after welding. Further, by using only the conversion characteristic C, it is possible to obtain an image of only the welded part during welding.
- the 18th line shows another conversion of the output characteristics of the image sensor 21 by the lug-zip table 23.
- the output of the image sensor 21 in the intermediate area between the area of the luminance distribution Ka and the area of the luminance distribution Kb is converted into a conversion characteristic D fixed at a fixed threshold TH.
- D fixed at a fixed threshold TH.
- FIG. 13 (b) in the case of 8 visitors, the digital image signal converted to linear so as to exhibit logarithmic output characteristics over the entire 256 gray scales is obtained. Assignment of 256 visitors is performed according to the relationship shown in FIG.
- FIG. 20 shows the state of the bacteria image in the working part during welding based on the digital image signal DS2 converted with the conversion characteristic D.
- B S is a welded portion
- B is a weld pool
- B B is a bead portion. According to the image state, the center position of the welded portion B S and the shape of the molten pool B A can be clearly grasped, and the bead portion B B can be also reliably determined.
- Fig. 21 shows the characteristics a 'of the digital image signal DS2 on the line L1 crossing the welded part BS in the image shown in country 20 and the digital image on the line L2 crossing the bead portion BB. N indicating the characteristic b ′ of the signal DS 2
- the welding progress monitoring device is widely applied not only to the laser welding described above but also to welding devices such as arc welding, gas welding, thermite welding, electron beam welding, and electroslag welding. .
- the optical sensor circuit used in the image sensor 7 is not limited to the one shown in FIG. 2, but may be one shown in FIGS. 22, 24, and 26.
- the tip sensor circuit shown in FIG. 22 uses the photosensor circuit shown in FIG. 2 to change the terminal voltage V pd of the photodiode PD to a rain signal in order to provide a shutter function (samble and hold function).
- Capacitor C1 for storing as a capacitor and photodiode Diode MOS for transferring the charge of the parasitic capacitance C of capacitor PD to capacitor C18 Type transistor Q4 is provided.
- a control signal for driving each unit is given to control the opening and closing of the shutter, and an image signal output according to the opening time of the shutter is performed. Is obtained.
- the transistor Q1 is turned on by setting the drive voltage V1 to a high level at timings 1 to ⁇ 2, and charges are injected into the parasitic capacitance C of the photodiode PD. Then, at timings t2 to t3, the charge injected into the parasitic capacitance C is released in proportion to the sensor current flowing when light enters the photodiode PD.
- the transistor Q4 is also turned on, and the terminal voltage Vc.
- the parasitic capacitance C and the terminal voltage Vc1 of the capacitor C1 become the same. I have.
- the photosensor circuit shown in FIG. 24 has the shutter function shown in FIG. 22.
- the drain voltage VD of the transistor Q1 is reduced to reduce the photodiode PD.
- a voltage switching circuit 51 is provided for causing the residual charge of the parasitic capacitance C to be generated and for the current period to be performed. As described above, the light quantity at the incident destination Ls is small. In this case, the occurrence of an afterimage is suppressed.
- FIG. 25 shows a timing chart of control signals of various parts in the sensor circuit.
- FIG. 26 shows another configuration of a 33 ⁇ 4 sensor circuit having a shutter function.
- a transistor Q5 for charging and discharging the charge of the capacitor C1 is provided, and The charge can be released by the transistor Q5 so that the charge of the parasitic capacitance C is transferred to the capacitor C1 with good reproducibility.
- the optical sensor circuit thus configured operates similarly to the one shown in FIG. 22, but in this case, in particular, as shown in FIG. Then, when the transistor Q5 is turned on, the charge of the capacitor C1 is released, and the pixel signal is initialized.
- Drawing 30 shows an example of an image of an image obtained by photographing a working portion during laser welding by the CMOS camera 2.
- the image processing device 4 relies on the data of the image taken by the CMOS camera 2 to obtain the center position G, the area S, and the length of the laser beam irradiation slobite in the molten pool BA.
- L and width W 1, width W 2 at bead portion BB, number of surface defects f 1 s f 2, and their defect areas S 1 and S 2 can be clearly measured.
- the data of the determination result is provided to the ECU 6, and the welding conditions are appropriately changed in accordance with the determination result. Specifically, under control of the ECU 6, if it is necessary to adjust the position of the welded joint 1 in order to correct the deviation S of the welding position with respect to the member 3 to be welded.
- the deviation of the welding position is determined by the deviation between the center O between the joined plates and the center position G in the molten pool BA.
- a deviation between a predetermined distance d of the welded member 1 from the edge and a center position G in the molten pool BA is determined.
- the height of the welding head 1 is adjusted or the member 3 to be welded is moved up and down so as to change the size of the irradiation deposit on the member 3 to be welded at the laser tip so that the width W 2 of the bead portion BB becomes predetermined. Adjustment and intensity adjustment of the laser tip are performed appropriately. In addition, in order to suppress the occurrence of surface defects, the moving speed of the workpiece 3 is appropriately adjusted.
- variable control of the welding conditions according to the result of the judgment of the welding condition is executed in real time during the welding operation.
- the CMOS camera 2 can be integrally attached to the outside of the welding head 1 via a support member 9 having a position adjusting mechanism.
- the molten pool BA and the bead during laser welding are observed while monitoring the monitor screen during teaching and adjusting the position of the support member 9 as needed.
- the BB can be mounted at a position where it can be used to collectively and optimally shoot.
- FIG. 33 shows another configuration when the CMOS camera 2 is attached to the welding head 1.
- the CMOS camera 2 is connected to the welding 1 side so that the working part being welded can be photographed through the inside of the welding 1 through the optical system (reflecting mirrors 10 and 11). It is designed to be mounted on the table 12 provided in According to this, the irradiation spot of the laser light always exists in the center of the image captured by the CM0S camera 2, and it is not necessary to adjust the shadow position. Therefore, the CMOS camera 2 can be easily attached to the welding jade 1 in a compact manner without providing a support member with a position adjusting mechanism. ⁇
- the present invention is not limited to the case of laser welding, but may be applied to other welding devices such as arc welding, electron beam welding, and the like, in which non-welded members that have been joined or overlapped are contactlessly welded from one side thereof.
- other welding devices such as arc welding, electron beam welding, and the like, in which non-welded members that have been joined or overlapped are contactlessly welded from one side thereof.
- implementation is possible as well.
- the deviation of the welding position is determined based on the data of the image photographed by the C ⁇ S camera 2 in the image processing device 4, and the displacement is determined.
- the ECU 6 Based on the displacement of the welding position, the ECU 6 gives a drive command to the driving device 8 of the robot to move the welding jade 1 as appropriate to take measures to correct the displacement of the welding position mane. .
- the distance of the gap g of the workpiece 3 to be welded was measured based on the image data based on the data of the image taken by the CMOS camera 2. Under the control of the ECU 6, the measured value was The welding work is stopped if the allowable range according to the combination of the members 3 to be welded is exceeded.
- ECU6 was that time of the match?
- the measured value of the distance of the gap g in the member to be welded 3 is recorded, and the value of “measurement when the welding operation is forcibly stopped” can be displayed on the display 5 later by an instruction of the operator.
- a deviation ⁇ between a predetermined distance d from the edge of the overlapped welded part ⁇ 3 and the center position G of the molten pool BA is obtained.
- the welding head 1 is moved so that the deviation ⁇ becomes zero.
- the robot drive unit 8 moves the welding head 1 as appropriate and replaces the joined members 3 or the overlapped parts 3 with each other. Needless to say, it may be appropriately moved.
- the ECU 6 controls the drive of the mechanism for transporting the workpiece 3 on the secondary surface.
- the work part being welded to the receiving member 3 is photographed from an oblique direction by the CMOS camera 2 which is attached to the welding head 1 part. I have. Then, under the control of the ECU 6, the center G of the irradiation spot in the molten pool BA, which is the bright spot of the portion of the workpiece 3 to which the laser beam Lz is irradiated, is as shown in FIG. 36.
- the height of the welding edge 1 for the workpiece 3 is adjusted so that the CMOS camera 2 always comes to a fixed position (the center if tilted) on the image taken by the CMOS camera 2.
- the bright spot P by the laser beam with reduced intensity for irradiating the welding start point of the welded member 3 was photographed by the CMOS camera 2. Positioning relative to the weld-head 1 and the member 3 to be welded is performed so as to be at a fixed position on the image.
- the distance between the head 1 and the member 3 to be welded is set to a predetermined value that is equivalent to the criterion, the bright spot P on the member 3 to be welded comes to the fixed position of the photographed image. As described above, the CMOS camera 2 is positioned.
- the carriage (not shown) of the member 3 to be welded is raised or lowered to move the welding head 1 relative to the member 3 to be welded. It is also possible to easily adjust an appropriate height.
- a conversion table of the output characteristics of the image sensor can be used.
- a wide dynamic range that covers from the high brightness area at the welded part to the low brightness area at the bead part due to the provision of means to emphasize and output the output of the image sensor in the brightness area It is possible to clearly grasp the welded part and the bead part in the dazzling part of the weld with sufficient contrast from the image taken with the camera, and to accurately judge the quality of welding from the captured image.
- a low-brightness bead starts from a high-brightness weld pool part in the work part being welded.
- the single camera is used to collectively image the molten pool and the bead part, and then take that image.
- An image processing means is installed to capture the data of the shaded image and judge the welding wiping condition. It is possible to obtain a captured image that can be clearly seen without causing excessive welding, and it is possible to reliably determine the connection condition from the captured image, and to change the welding conditions based on the determination result. You will be able to do it properly.
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002444272A CA2444272C (en) | 2001-02-14 | 2002-02-05 | Welding condition monitoring device |
JP2002564084A JP4501101B2 (ja) | 2001-02-14 | 2002-02-05 | 溶接状況監視装置 |
EP02711313A EP1366847B1 (en) | 2001-02-14 | 2002-02-05 | Welding state monitoring device |
US10/641,587 US7380697B2 (en) | 2001-02-14 | 2003-08-12 | Welding condition monitoring device |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-81675 | 2001-02-14 | ||
JP2001081675 | 2001-02-14 | ||
JP2001153196 | 2001-04-13 | ||
JP2001153197 | 2001-04-13 | ||
JP2001-153196 | 2001-04-13 | ||
JP2001-153195 | 2001-04-13 | ||
JP2001-153197 | 2001-04-13 | ||
JP2001153195 | 2001-04-13 | ||
JP2001-180838 | 2001-05-11 | ||
JP2001180838 | 2001-05-11 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/641,587 Continuation US7380697B2 (en) | 2001-02-14 | 2003-08-12 | Welding condition monitoring device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002064304A1 true WO2002064304A1 (fr) | 2002-08-22 |
Family
ID=27531844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/000922 WO2002064304A1 (fr) | 2001-02-14 | 2002-02-05 | Dispositif de surveillance du stade de soudage |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1366847B1 (ja) |
JP (1) | JP4501101B2 (ja) |
CA (1) | CA2444272C (ja) |
TW (1) | TW565684B (ja) |
WO (1) | WO2002064304A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005131761A (ja) * | 2003-10-31 | 2005-05-26 | Fanuc Ltd | 産業用ロボット |
JP2007028103A (ja) * | 2005-07-14 | 2007-02-01 | Honda Motor Co Ltd | 光センサ回路およびイメージセンサ |
JP2007097711A (ja) * | 2005-09-30 | 2007-04-19 | Fujinon Corp | 電子内視鏡装置 |
JP2008246536A (ja) * | 2007-03-30 | 2008-10-16 | Ihi Corp | 溶接状況解析装置及び方法 |
JP4835593B2 (ja) * | 2005-03-15 | 2011-12-14 | オムロン株式会社 | 画像処理装置および画像処理方法、プログラム、並びに、記録媒体 |
JP2012045610A (ja) * | 2010-08-30 | 2012-03-08 | Suzuki Motor Corp | ビードの終端部の形状を判定する装置及びその方法 |
WO2013146643A1 (ja) * | 2012-03-28 | 2013-10-03 | 三菱重工業株式会社 | 溶接用撮像装置 |
JP2014524840A (ja) * | 2011-07-08 | 2014-09-25 | エイナヴ,オメル | 溶接中の手動シーム追跡システム及び方法並びに溶接支援システム |
WO2016181695A1 (ja) * | 2015-05-11 | 2016-11-17 | 株式会社日立製作所 | 溶接装置および溶接品質検査方法 |
JP2017140647A (ja) * | 2016-02-12 | 2017-08-17 | トヨタ自動車株式会社 | レーザ肉盛装置及びレーザ肉盛方法 |
Families Citing this family (3)
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JP5182555B2 (ja) * | 2005-03-15 | 2013-04-17 | オムロン株式会社 | 画像処理装置および画像処理方法、画像処理システム、プログラム、並びに、記録媒体 |
CN102292187B (zh) | 2008-11-21 | 2015-12-09 | 普雷茨特两合公司 | 用于监控要在工件上实施的激光加工过程的方法和装置以及具有这种装置的激光加工头 |
CN115988866B (zh) * | 2023-03-21 | 2023-06-20 | 深圳市利和兴股份有限公司 | 一种基于机器视觉的nfc lami加工控制方法及*** |
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2002
- 2002-01-17 TW TW091100635A patent/TW565684B/zh not_active IP Right Cessation
- 2002-02-05 EP EP02711313A patent/EP1366847B1/en not_active Expired - Lifetime
- 2002-02-05 WO PCT/JP2002/000922 patent/WO2002064304A1/ja active Application Filing
- 2002-02-05 CA CA002444272A patent/CA2444272C/en not_active Expired - Fee Related
- 2002-02-05 JP JP2002564084A patent/JP4501101B2/ja not_active Expired - Fee Related
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JP2005131761A (ja) * | 2003-10-31 | 2005-05-26 | Fanuc Ltd | 産業用ロボット |
JP4835593B2 (ja) * | 2005-03-15 | 2011-12-14 | オムロン株式会社 | 画像処理装置および画像処理方法、プログラム、並びに、記録媒体 |
JP2007028103A (ja) * | 2005-07-14 | 2007-02-01 | Honda Motor Co Ltd | 光センサ回路およびイメージセンサ |
JP4528221B2 (ja) * | 2005-07-14 | 2010-08-18 | 本田技研工業株式会社 | 光センサ回路およびイメージセンサ |
JP2007097711A (ja) * | 2005-09-30 | 2007-04-19 | Fujinon Corp | 電子内視鏡装置 |
JP4694336B2 (ja) * | 2005-09-30 | 2011-06-08 | 富士フイルム株式会社 | 電子内視鏡装置 |
JP2008246536A (ja) * | 2007-03-30 | 2008-10-16 | Ihi Corp | 溶接状況解析装置及び方法 |
JP2012045610A (ja) * | 2010-08-30 | 2012-03-08 | Suzuki Motor Corp | ビードの終端部の形状を判定する装置及びその方法 |
JP2014524840A (ja) * | 2011-07-08 | 2014-09-25 | エイナヴ,オメル | 溶接中の手動シーム追跡システム及び方法並びに溶接支援システム |
WO2013146643A1 (ja) * | 2012-03-28 | 2013-10-03 | 三菱重工業株式会社 | 溶接用撮像装置 |
JP2013207439A (ja) * | 2012-03-28 | 2013-10-07 | Mitsubishi Heavy Ind Ltd | 溶接用撮像装置 |
US9538095B2 (en) | 2012-03-28 | 2017-01-03 | Mitsubishi Heavy Industries, Ltd. | Imaging device for welding |
WO2016181695A1 (ja) * | 2015-05-11 | 2016-11-17 | 株式会社日立製作所 | 溶接装置および溶接品質検査方法 |
JPWO2016181695A1 (ja) * | 2015-05-11 | 2018-01-25 | 株式会社日立製作所 | 溶接装置および溶接品質検査方法 |
US10821550B2 (en) | 2015-05-11 | 2020-11-03 | Hitachi, Ltd. | Welding apparatus and welding quality inspection method |
JP2017140647A (ja) * | 2016-02-12 | 2017-08-17 | トヨタ自動車株式会社 | レーザ肉盛装置及びレーザ肉盛方法 |
Also Published As
Publication number | Publication date |
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CA2444272C (en) | 2009-06-16 |
JP4501101B2 (ja) | 2010-07-14 |
JPWO2002064304A1 (ja) | 2004-06-10 |
CA2444272A1 (en) | 2002-08-22 |
EP1366847A1 (en) | 2003-12-03 |
EP1366847A4 (en) | 2006-11-22 |
TW565684B (en) | 2003-12-11 |
EP1366847B1 (en) | 2013-01-16 |
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