WO2002015281A3 - Glass-to-metal hermetically sealed led array - Google Patents

Glass-to-metal hermetically sealed led array Download PDF

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Publication number
WO2002015281A3
WO2002015281A3 PCT/US2001/025750 US0125750W WO0215281A3 WO 2002015281 A3 WO2002015281 A3 WO 2002015281A3 US 0125750 W US0125750 W US 0125750W WO 0215281 A3 WO0215281 A3 WO 0215281A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
glass
plastic
light output
aluminum
Prior art date
Application number
PCT/US2001/025750
Other languages
French (fr)
Other versions
WO2002015281A2 (en
Inventor
Michael C Hutchison
Original Assignee
Power Signal Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Signal Technologies Inc filed Critical Power Signal Technologies Inc
Priority to AU2001283424A priority Critical patent/AU2001283424A1/en
Publication of WO2002015281A2 publication Critical patent/WO2002015281A2/en
Publication of WO2002015281A3 publication Critical patent/WO2002015281A3/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

A solid state light apparatus ideally suited for use in traffic control signals having a glass-to-metal hermetically sealed LEDs. Current state of the art solid state signals utilize LED's with plastic/epoxy seals. A glass-to-metal hermetic seal is over 1000 times better at sealing LED's than a plastic/epoxy seal. Plastic/epoxy seals allow Oxygen and other contaminants to come in contact with the LED semiconductor material. The LED semiconductor's are composed of chemicals such as Aluminum (for example AlInGaP is one of the material used for red and yellow LED's), which over time and exposed to Oxygen, chemically changes the LED material from aluminum to Aluminum Oxide. Increased temperature accelerates the chemical changes, therefore keeping LED's cool and sealed greatly reduces permanent light output degradation. The chemical change of the LED semiconductor material is one of the primary causes of permanent light output degradation in LED's. The combination of a glass-to-metal hermetic seal in conjunction with a superior thermal design has an exponential effect on the MTBF of the LED array's light output.
PCT/US2001/025750 2000-08-17 2001-08-17 Glass-to-metal hermetically sealed led array WO2002015281A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001283424A AU2001283424A1 (en) 2000-08-17 2001-08-17 Glass-to-metal hermetically led array in a sealed solid state light

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64041600A 2000-08-17 2000-08-17
US09/640,416 2000-08-17

Publications (2)

Publication Number Publication Date
WO2002015281A2 WO2002015281A2 (en) 2002-02-21
WO2002015281A3 true WO2002015281A3 (en) 2002-05-23

Family

ID=24568140

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025750 WO2002015281A2 (en) 2000-08-17 2001-08-17 Glass-to-metal hermetically sealed led array

Country Status (2)

Country Link
AU (1) AU2001283424A1 (en)
WO (1) WO2002015281A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
EP1634332A1 (en) * 2003-06-03 2006-03-15 Asetronics AG Insulated metal substrate with at least one light diode, light diode matrix and production method
EP1735844B1 (en) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications
WO2005109529A1 (en) * 2004-05-07 2005-11-17 Koninklijke Philips Electronics N.V. Light-emitting-diode chip package and a collimator
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
DE102010009429A1 (en) * 2010-02-24 2011-08-25 Siemens Aktiengesellschaft, 80333 Symbol Gazette
US8876322B2 (en) 2012-06-20 2014-11-04 Journée Lighting, Inc. Linear LED module and socket for same
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US9976710B2 (en) 2013-10-30 2018-05-22 Lilibrand Llc Flexible strip lighting apparatus and methods
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
US10132476B2 (en) 2016-03-08 2018-11-20 Lilibrand Llc Lighting system with lens assembly
US11296057B2 (en) 2017-01-27 2022-04-05 EcoSense Lighting, Inc. Lighting systems with high color rendering index and uniform planar illumination
US20180328552A1 (en) 2017-03-09 2018-11-15 Lilibrand Llc Fixtures and lighting accessories for lighting devices
CN114981592A (en) 2018-05-01 2022-08-30 生态照明公司 Lighting system and device with central silicone module
CN114364913A (en) 2018-12-17 2022-04-15 生态照明公司 Stripe lighting system conforming to AC driving power

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1360073A (en) * 1970-11-30 1974-07-17 Western Electric Co Semiconductor devices
US4225380A (en) * 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5674985A (en) * 1979-11-24 1981-06-20 Sharp Corp Forming method for protective film for luminous element
JPS60143982A (en) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd Led head
EP0404565A1 (en) * 1989-06-21 1990-12-27 Mitsubishi Kasei Corporation Compound semiconductor device and method of surface treatment of such a device
JPH0519705A (en) * 1991-07-12 1993-01-29 Takiron Co Ltd Light emission display body and manufacture thereof
EP0741419A2 (en) * 1995-05-02 1996-11-06 Motorola, Inc. Passivation of organic devices
JPH11163410A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led lighting device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1360073A (en) * 1970-11-30 1974-07-17 Western Electric Co Semiconductor devices
US4225380A (en) * 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5674985A (en) * 1979-11-24 1981-06-20 Sharp Corp Forming method for protective film for luminous element
JPS60143982A (en) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd Led head
EP0404565A1 (en) * 1989-06-21 1990-12-27 Mitsubishi Kasei Corporation Compound semiconductor device and method of surface treatment of such a device
JPH0519705A (en) * 1991-07-12 1993-01-29 Takiron Co Ltd Light emission display body and manufacture thereof
EP0741419A2 (en) * 1995-05-02 1996-11-06 Motorola, Inc. Passivation of organic devices
JPH11163410A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led lighting device

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 005, no. 141 (E - 073) 5 September 1981 (1981-09-05) *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 307 (M - 435) 4 December 1985 (1985-12-04) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 293 (P - 1550) 4 June 1993 (1993-06-04) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

Also Published As

Publication number Publication date
WO2002015281A2 (en) 2002-02-21
AU2001283424A1 (en) 2002-02-25

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