WO2002011186A3 - Inserts for making change kit or socket universal to ic packages of varying configuration and sizes - Google Patents

Inserts for making change kit or socket universal to ic packages of varying configuration and sizes Download PDF

Info

Publication number
WO2002011186A3
WO2002011186A3 PCT/US2001/020678 US0120678W WO0211186A3 WO 2002011186 A3 WO2002011186 A3 WO 2002011186A3 US 0120678 W US0120678 W US 0120678W WO 0211186 A3 WO0211186 A3 WO 0211186A3
Authority
WO
WIPO (PCT)
Prior art keywords
packages
inserts
sizes
making change
change kit
Prior art date
Application number
PCT/US2001/020678
Other languages
French (fr)
Other versions
WO2002011186A2 (en
Inventor
Dean Tran
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to AU2001271599A priority Critical patent/AU2001271599A1/en
Publication of WO2002011186A2 publication Critical patent/WO2002011186A2/en
Publication of WO2002011186A3 publication Critical patent/WO2002011186A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/US2001/020678 2000-07-27 2001-06-27 Change kit-insert or socket-insert for ic packages WO2002011186A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001271599A AU2001271599A1 (en) 2000-07-27 2001-06-27 Inserts for making change kit or socket universal to ic packages of varying configuration and sizes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62439600A 2000-07-27 2000-07-27
US09/624,396 2000-07-27

Publications (2)

Publication Number Publication Date
WO2002011186A2 WO2002011186A2 (en) 2002-02-07
WO2002011186A3 true WO2002011186A3 (en) 2002-04-25

Family

ID=24501840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/020678 WO2002011186A2 (en) 2000-07-27 2001-06-27 Change kit-insert or socket-insert for ic packages

Country Status (2)

Country Link
AU (1) AU2001271599A1 (en)
WO (1) WO2002011186A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY166008A (en) 2010-03-12 2018-05-21 Illinois Tool Works A strippable hybrid tray system for electronic devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117468A (en) * 1984-11-14 1986-06-04 Nec Corp Socket device for testing small-sized individual semiconductor
US5568868A (en) * 1995-08-18 1996-10-29 Precision Connector Designs, Inc. Gull-wing IC carrier system
US5763297A (en) * 1993-07-05 1998-06-09 Fujitsu Limited Integrated circuit carrier having lead-socket array with various inner dimensions
DE19816404A1 (en) * 1997-04-11 1998-12-17 Johns Tech International Corp Deformable blank fastener for integrated circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117468A (en) * 1984-11-14 1986-06-04 Nec Corp Socket device for testing small-sized individual semiconductor
US5763297A (en) * 1993-07-05 1998-06-09 Fujitsu Limited Integrated circuit carrier having lead-socket array with various inner dimensions
US5568868A (en) * 1995-08-18 1996-10-29 Precision Connector Designs, Inc. Gull-wing IC carrier system
DE19816404A1 (en) * 1997-04-11 1998-12-17 Johns Tech International Corp Deformable blank fastener for integrated circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 300 (P - 506) 14 October 1986 (1986-10-14) *

Also Published As

Publication number Publication date
AU2001271599A1 (en) 2002-02-13
WO2002011186A2 (en) 2002-02-07

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