AU2001271599A1 - Inserts for making change kit or socket universal to ic packages of varying configuration and sizes - Google Patents

Inserts for making change kit or socket universal to ic packages of varying configuration and sizes

Info

Publication number
AU2001271599A1
AU2001271599A1 AU2001271599A AU7159901A AU2001271599A1 AU 2001271599 A1 AU2001271599 A1 AU 2001271599A1 AU 2001271599 A AU2001271599 A AU 2001271599A AU 7159901 A AU7159901 A AU 7159901A AU 2001271599 A1 AU2001271599 A1 AU 2001271599A1
Authority
AU
Australia
Prior art keywords
packages
inserts
sizes
making change
change kit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271599A
Inventor
Dean Tran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001271599A1 publication Critical patent/AU2001271599A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2001271599A 2000-07-27 2001-06-27 Inserts for making change kit or socket universal to ic packages of varying configuration and sizes Abandoned AU2001271599A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62439600A 2000-07-27 2000-07-27
US09624396 2000-07-27
PCT/US2001/020678 WO2002011186A2 (en) 2000-07-27 2001-06-27 Change kit-insert or socket-insert for ic packages

Publications (1)

Publication Number Publication Date
AU2001271599A1 true AU2001271599A1 (en) 2002-02-13

Family

ID=24501840

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271599A Abandoned AU2001271599A1 (en) 2000-07-27 2001-06-27 Inserts for making change kit or socket universal to ic packages of varying configuration and sizes

Country Status (2)

Country Link
AU (1) AU2001271599A1 (en)
WO (1) WO2002011186A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY166008A (en) * 2010-03-12 2018-05-21 Illinois Tool Works A strippable hybrid tray system for electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117468A (en) * 1984-11-14 1986-06-04 Nec Corp Socket device for testing small-sized individual semiconductor
JP3185480B2 (en) * 1993-07-05 2001-07-09 富士通株式会社 IC carrier
US5568868A (en) * 1995-08-18 1996-10-29 Precision Connector Designs, Inc. Gull-wing IC carrier system
US6182829B1 (en) * 1997-04-11 2001-02-06 Johnstech International Corporation I.C. carrier insert

Also Published As

Publication number Publication date
WO2002011186A3 (en) 2002-04-25
WO2002011186A2 (en) 2002-02-07

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