WO2001099186A3 - Shielding of analog circuits on semiconductor substrates - Google Patents
Shielding of analog circuits on semiconductor substrates Download PDFInfo
- Publication number
- WO2001099186A3 WO2001099186A3 PCT/US2001/019658 US0119658W WO0199186A3 WO 2001099186 A3 WO2001099186 A3 WO 2001099186A3 US 0119658 W US0119658 W US 0119658W WO 0199186 A3 WO0199186 A3 WO 0199186A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- shielding
- semiconductor substrates
- analog circuits
- region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Abstract
A semiconductor device, in accordance with the present invention, includes a doped semiconductor substrate (102) wherein the doping of the substrate has a first conductivity and a device region (110) formed near a surface of the substrate. The device region includes at least one device well. A buried well (104) is formed in the substrate below the device region. The buried well is doped with dopants having a second conductivity. A trench region (124) surrounds the device region and extends below the surface of the substrate to at least the buried well such that the device region is isolated from other portions of the substrate by the buried well and the trench region.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59711600A | 2000-06-20 | 2000-06-20 | |
US09/597,116 | 2000-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001099186A2 WO2001099186A2 (en) | 2001-12-27 |
WO2001099186A3 true WO2001099186A3 (en) | 2002-10-10 |
Family
ID=24390149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/019658 WO2001099186A2 (en) | 2000-06-20 | 2001-06-20 | Shielding of analog circuits on semiconductor substrates |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2001099186A2 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60105265A (en) * | 1983-11-11 | 1985-06-10 | Toshiba Corp | Manufacture of complementary type semiconductor device |
EP0178649A2 (en) * | 1984-10-17 | 1986-04-23 | Hitachi, Ltd. | Complementary semiconductor device |
US4926233A (en) * | 1988-06-29 | 1990-05-15 | Texas Instruments Incorporated | Merged trench bipolar-CMOS transistor fabrication process |
JPH07273184A (en) * | 1994-04-01 | 1995-10-20 | Mitsubishi Electric Corp | Semiconductor device and its fabrication |
EP0817268A1 (en) * | 1996-06-27 | 1998-01-07 | Nec Corporation | Semiconductor integrated circuit device with digital circuit and analog circuit on common substrate and fabrication process therefor |
JPH11233616A (en) * | 1998-02-17 | 1999-08-27 | Toshiba Corp | Semiconductor device and its manufacturing method |
US6051868A (en) * | 1996-11-15 | 2000-04-18 | Nec Corporation | Semiconductor device |
-
2001
- 2001-06-20 WO PCT/US2001/019658 patent/WO2001099186A2/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60105265A (en) * | 1983-11-11 | 1985-06-10 | Toshiba Corp | Manufacture of complementary type semiconductor device |
EP0178649A2 (en) * | 1984-10-17 | 1986-04-23 | Hitachi, Ltd. | Complementary semiconductor device |
US4926233A (en) * | 1988-06-29 | 1990-05-15 | Texas Instruments Incorporated | Merged trench bipolar-CMOS transistor fabrication process |
JPH07273184A (en) * | 1994-04-01 | 1995-10-20 | Mitsubishi Electric Corp | Semiconductor device and its fabrication |
EP0817268A1 (en) * | 1996-06-27 | 1998-01-07 | Nec Corporation | Semiconductor integrated circuit device with digital circuit and analog circuit on common substrate and fabrication process therefor |
US6051868A (en) * | 1996-11-15 | 2000-04-18 | Nec Corporation | Semiconductor device |
JPH11233616A (en) * | 1998-02-17 | 1999-08-27 | Toshiba Corp | Semiconductor device and its manufacturing method |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 009, no. 255 (E - 349) 12 October 1985 (1985-10-12) * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 02 29 February 1996 (1996-02-29) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001099186A2 (en) | 2001-12-27 |
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