WO2001080315A3 - Shaped springs and methods of fabricating and using shaped springs - Google Patents

Shaped springs and methods of fabricating and using shaped springs Download PDF

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Publication number
WO2001080315A3
WO2001080315A3 PCT/US2001/009994 US0109994W WO0180315A3 WO 2001080315 A3 WO2001080315 A3 WO 2001080315A3 US 0109994 W US0109994 W US 0109994W WO 0180315 A3 WO0180315 A3 WO 0180315A3
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WO
WIPO (PCT)
Prior art keywords
shaped springs
fabricating
methods
volume
interconnection
Prior art date
Application number
PCT/US2001/009994
Other languages
French (fr)
Other versions
WO2001080315A2 (en
Inventor
Gaetan L Mathieu
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Gaetan L Mathieu
Benjamin N Eldridge
Stuart W Wenzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/547,560 external-priority patent/US6640432B1/en
Priority claimed from US09/547,561 external-priority patent/US7458816B1/en
Application filed by Formfactor Inc, Gaetan L Mathieu, Benjamin N Eldridge, Stuart W Wenzel filed Critical Formfactor Inc
Priority to EP01922806A priority Critical patent/EP1275150A2/en
Priority to AU2001249567A priority patent/AU2001249567A1/en
Priority to JP2001577609A priority patent/JP2003531495A/en
Publication of WO2001080315A2 publication Critical patent/WO2001080315A2/en
Publication of WO2001080315A3 publication Critical patent/WO2001080315A3/en

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
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    • G01R1/06733—Geometry aspects
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)

Abstract

An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).
PCT/US2001/009994 2000-04-12 2001-03-28 Shaped springs and methods of fabricating and using shaped springs WO2001080315A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01922806A EP1275150A2 (en) 2000-04-12 2001-03-28 Shaped springs and methods of fabricating and using shaped springs
AU2001249567A AU2001249567A1 (en) 2000-04-12 2001-03-28 Shaped springs and methods of fabricating and using shaped springs
JP2001577609A JP2003531495A (en) 2000-04-12 2001-03-28 Molded spring and method of making and using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/547,560 2000-04-12
US09/547,560 US6640432B1 (en) 2000-04-12 2000-04-12 Method of fabricating shaped springs
US09/547,561 2000-04-12
US09/547,561 US7458816B1 (en) 2000-04-12 2000-04-12 Shaped spring

Publications (2)

Publication Number Publication Date
WO2001080315A2 WO2001080315A2 (en) 2001-10-25
WO2001080315A3 true WO2001080315A3 (en) 2002-03-28

Family

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Application Number Title Priority Date Filing Date
PCT/US2001/009994 WO2001080315A2 (en) 2000-04-12 2001-03-28 Shaped springs and methods of fabricating and using shaped springs

Country Status (7)

Country Link
EP (1) EP1275150A2 (en)
JP (1) JP2003531495A (en)
KR (2) KR100801353B1 (en)
CN (1) CN100339985C (en)
AU (1) AU2001249567A1 (en)
TW (1) TW546803B (en)
WO (1) WO2001080315A2 (en)

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TWI336156B (en) * 2006-07-21 2011-01-11 Fujikura Ltd Ic socket and manufacturing method for the same
ATE503037T1 (en) * 2008-10-17 2011-04-15 Atotech Deutschland Gmbh STRESS-REDUCED NI-P/PD STACKS FOR WAFER SURFACE
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
TWI449280B (en) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd Testing electrical connector
KR101738421B1 (en) 2015-11-10 2017-05-23 광주과학기술원 Self-deformable Flexible film and Method for Fabricating the same
KR102042052B1 (en) * 2017-03-23 2019-11-08 광주과학기술원 Self-deformable Flexible film and Method for Fabricating the same
KR102114210B1 (en) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 Probe beam and probe module
CN114108041A (en) * 2021-12-20 2022-03-01 太仓市惠得利弹簧有限公司 Spring surface oxidation resistance treatment process

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