WO2001067835A1 - Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste - Google Patents

Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste Download PDF

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Publication number
WO2001067835A1
WO2001067835A1 PCT/KR2001/000367 KR0100367W WO0167835A1 WO 2001067835 A1 WO2001067835 A1 WO 2001067835A1 KR 0100367 W KR0100367 W KR 0100367W WO 0167835 A1 WO0167835 A1 WO 0167835A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
dispensing
circuit board
pcb
inspection
Prior art date
Application number
PCT/KR2001/000367
Other languages
French (fr)
Inventor
Byung Jun Oh
Original Assignee
Ari Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ari Co., Ltd. filed Critical Ari Co., Ltd.
Publication of WO2001067835A1 publication Critical patent/WO2001067835A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Definitions

  • the present invention relates to a method and an apparatus for surface mounting electronic components on a printed circuit board, and more particularly to an apparatus for inspecting and dispensing a solder paste on the printed circuit board, i.e., a method and an apparatus for inspecting a dispensing state of the solder paste firstly printed on the printed circuit board and refills the printed circuit board with supplementary solder paste according to inspection result.
  • a printed circuit board which is essentially embedded in electronic appliances such as computers and home appliances, is printed with a solder in a melted state (hereinafter called 'solder paste') in a predetermined pattern in order to surface mount small electronic parts such as semiconductor chips and resistant chips thereon.
  • the solder paste is printed on the PCB usually by a solder paste dispenser called a screen printer.
  • the screen printer applies the solder paste on the component mounted place of the PCB by squeezing out solder paste applied on a metal mask that has a predetermined pattern of opening therein.
  • FIG. 1 schematically shows an arrangement of main units in a general electronic components mounting line. Referring to FIG. 1, the general electronic component mounting process is as follows.
  • the screen printer 12 applies solder paste on the PCB that is successively supplied by a PCB loading device 11 Then, with a solder paste inspector 14, the dispensing state of the solder paste is inspected, and it is determined whether the solder paste is dispensed approp ⁇ ately or not
  • the solder paste inspector 14 uses a vision system, or the like For example the solder paste inspector 14 determines whether the dispensing state of the solder paste is approp ⁇ ate or not based on a difference calculated between an actual area of the solder paste p ⁇ nted on the PCB as inspected and a preset image data about an average area of the solder paste normally p ⁇ nted on a reference PCB
  • the undesignated reference numeral 13 refers to a glue dispensing machine for dispensing solidifying adhesive such as a glue on the mounting place of the PCB for the relatively heavier electronic components such as a quad flat package (QFP) and a connector
  • the reference numerals 15a and 15b are buffer conveyors disposed for balanced tact time between the respective processes, I e , for load balance, and reference numeral 17 is different shape chip mounter for mounting components of different shapes, 18 is a reflow machine for solidifying mounting of the mounted components, and 19 is a PCB unloading device for discharging the PCB completed with the electronic component mounting
  • the PCB has also been designed to be thinner
  • the amount of the printed solder paste varies depending on the thickness of the metal mask of the screen printer 12.
  • the thickness of the solder paste is determined within the range of 80 ⁇ m-150 ⁇ m.
  • the PCB when mounting the electronic components on both sides of the PCB in the conventional electronic component mounting line, the PCB is reversed after the electronic components are mounted on one side thereof Then, with its other side facing upward on the mounting line, the PCB is mounted with the electronic components thereon and the solder paste is solidified, sequentially.
  • the electronic components soldered on one side of the PCB is input to the reflow machine 18 and the solidified solder paste thereof is re-subjected to the temperature close to the melting point (approximately 20°C). Accordingly, the solder paste is melted, and defectiveness occurs like early cooling of the solder paste, deviation or separation of the relatively larger and heavier electronic components such as the quad flat package and connector from the initial position of the PCB.
  • the present invention has been made to overcome the problems of the conventional method for mounting the electronic components, and it is an object of the present invention to provide a method for mounting electronic components on a p ⁇ nted circuit board that improves the quality of the mounted component by increasing quality precision and inspection reliability about the state that the solder paste is dispensed on the p ⁇ nted circuit, while minimizing the possibility of having defectiveness.
  • Another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste on a taught location according to the result of the first inspection.
  • Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste on a taught location according to the result of the first inspection without having to repeatedly inspecting the dispensing state of the solder paste.
  • Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for inspecting the dispensing state of a solder paste p ⁇ nted on a p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste according to the result of the inspection, while simultaneously applying a bond on a taught location of the p ⁇ nted circuit board for solidifying mounted components.
  • the above object is accomplished by a method for attaching and thereby mounting an electronic component on a solder paste p ⁇ nted on a p ⁇ nted circuit board according to a dispensing state of the solder paste inspected by a vision system, the method in accordance with the present invention including the steps of inputting an image information about a normal dispensing state of the solder paste normally p ⁇ nted on a reference p ⁇ nted circuit board, and calculating and sto ⁇ ng reference data, dispensing the solder paste on a p ⁇ nted circuit board as inspected, inputting image information about the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board as inspected, and calculating inspection data, compa ⁇ ng the reference data with resultant data of the inspection and outputting a difference obtained from the compa ⁇ son, and supplementary dispensing the solder paste on the p ⁇ nted circuit board as inspected according to the resultant data of the inspection.
  • an apparatus for inspecting and dispensing a solder paste on a p ⁇ nted circuit board in accordance with the present invention including supporting means for positioning thereby supporting the p ⁇ nted circuit board on which the solder paste is firstly p ⁇ nted by a screen p ⁇ nter, image recognizing means for inputting image information about a dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board, and outputting resultant data, a controller for compa ⁇ ng data about image information output by the image recognizing means with a preset reference data, and outputting a control signal according to the compa ⁇ son result, positioning means controlled by the control signal of the controller to be moved to certain coordinates on an orthogonal coordinate, and a solder paste dispenser disposed on and thus connectively d ⁇ ven with the positioning means, to supplementary dispense the solder paste on a certain location on the p ⁇ nted circuit board according to the control signal of the controller.
  • the positioning means includes an adhesive dispenser disposed on and thus connectively d ⁇ ven with the positioning means, for dispensing an adhesive for a solidification of a mounted component on a certain location on the p ⁇ nted circuit board in accordance with the control signal of the controller
  • the solder paste dispenser is preferably d ⁇ ven by a dnvmg unit formed on the positioning means and thus raised and lowered with respect to the p ⁇ nted circuit board
  • the dnvmg unit includes a dnving motor, a ball screw coaxially disposed with an output shaft of the dnving motor, a moving member disposed to be moved along a shaft of the all screw, and an actuator disposed on the moving member for supporting the solder paste dispenser.
  • the adhesive dispenser is preferably d ⁇ ven by a raising unit formed on the positioning means to be raised and lowered with respect to the pnnted circuit board
  • the raising unit includes a dnving motor, a dnving pulley disposed on the output shaft of the dnving motor, a dnven pulley connected to the d ⁇ ving pulley through a belt, a ball screw coaxially disposed on the dnven pulley, a movable member disposed to be moved along the shaft of the ball screw, and an actuator disposed on the movable member to support the adhesive dispenser.
  • FIG. 1 is a view schematically showing one example of a conventional line for mounting electronic components on a pnnted circuit board
  • FIG. 2 is a perspective view schematically showing an appearance of an apparatus for inspecting and dispensing a solder paste in accordance with the present invention
  • FIG. 3 is a schematic perspective view showing the main portion of FIG. 2 m greater detail
  • FIG. 4 is a flowchart for explaining a process of inspecting and dispensing the solder paste in accordance with the present invention
  • FIG. 5 is a view schematically showing an anangement of units for mounting electronic components with the apparatus for inspecting and dispensing solder paste employed therein in accordance with the present invention.
  • the apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention includes an image recognizing means 30 for inspecting the dispensing state of the solder paste firstly pnnted on a pnnted circuit board 1 (PCB) by a screen p ⁇ nter (not shown), a solder paste dispenser 50 for supplementary refilling the PCB 1 with the solder paste on a location taught in accordance with the result of the inspection of the image recognizing means 30, and an adhesive dispenser 70 for dispensing a solidifying adhesive such as a glue on the taught location of the PCB 1.
  • an image recognizing means 30 for inspecting the dispensing state of the solder paste firstly pnnted on a pnnted circuit board 1 (PCB) by a screen p ⁇ nter (not shown)
  • a solder paste dispenser 50 for supplementary refilling the PCB 1 with the solder paste on a location taught in accordance with the result of the inspection of the image recognizing means 30, and an adhesive dispenser 70 for dispens
  • the image recognizing means 30, the solder paste dispenser 50, and the adhesive dispenser 70 are integrated into one unit so that the same are controlled with respect to the PCB 1 sequentially
  • the apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention will be descnbed in greater detail with reference to FIGS. 2 and 3
  • the image recognizing means 130, the solder paste dispenser 150, and the adhesive dispenser 170 are supported on a positioning means 120 such as an X-Y orthogonal robot to be moved to certain coordinates on a base frame 100
  • a conveyor 101 for conveying and thus supplying PCBs 1 firstly pnnted with the solder paste by a screen pnnter (not shown) in a certain direction, and a supporting means 110 mounted on the conveyor 101 to support the PCB 1 to a state that the PCB 1 is positioned on the lower portion of an image input side of the image recognizing means 130
  • the supporting means 110 includes a cell type positioning conveyor 111 that takes a certain part of the conveyor 101 and is moved in a direction perpendicular to the conveyance direction of the PCB 1, and an actuator 112 for raising and aligning the PCB 1 from the positioning conveyor 111 to the inspection position at a certain height
  • the image recognizing means 130 is aimed to input image information about the dispensing state of the solder paste p ⁇ nted on the PCB 1 and outputs signal data
  • a general vision system that include a vision camera 131, a control portion 133 for processing signals, a monitor 135 for displaying the image data, and a signal generator such as a mouse 136 and a keyboard 137 for teaching and inputting signal information about a certain location of the image information as displayed on the monitor 135
  • the image data about the dispensing state of the solder paste on the PCB recognized by the vision camera 131 is input to a controlling means such as a computer system, or the like, to be used as an information signal about the result of the inspection and also used as a control signal
  • the control portion 133 is input with reference data about image information on the dispensing state of the solder paste normally pnnted on a reference PCB, and together with the control signal, the control portion 133 outputs signal information about companson between the image data about the dispensing state of the solder paste pnnted on the PCB as inspected and the reference data to the monitor 125 and to a mam controller 180 which are provided to the base frame 100
  • the main controller 180 controls the positioning means 120 by the control signal output from the control portion 133 of the image recognizing means 130 so that the positioning means 120 is moved to certain coordinates on the base frame 100.
  • the signal generator 137 are used as the signal generator through which an operator inputs a command to teach the location that the operator determines needs solder paste refill based on the image information displayed on the monitor 135. For example, when the operator clicks the mouse 136 on a certain position of the image information as displayed on the monitor 135 he/she wants to teach, an identifying number such as a distinctive number is input to the clicked area, and the control signal is output from the ma controller 180 according to the identifying signal Accordingly, the positioning means 120 is moved to the certain coordinates on the base frame 100, to refill the taught area of the PCB with the supplemental solder paste.
  • the dnving unit 160 includes a ball screw 163 coaxially disposed on an output shaft of a dnving motor 161, a moving member 165 movably disposed on the shaft of the ball screw 163, and an actuator 167 disposed on the moving member 165 in a manner of supporting the solder paste dispenser 160
  • the adhesive dispenser 170 is raised and lowered with respect to the PCB 1 by a raising unit 180 disposed on the positioning means 120
  • the raising unit 180 includes a dnving pulley 182 disposed on the output shaft of the dnving motor 181, a d ⁇ ven pulley 183 connected to the dnving pulley 182 through a belt B, a movable member 185 disposed to be moved along the shaft of the ball screw 184 that is coaxially disposed with the d ⁇ ven pulley 183, and an actuator 186 disposed on the movable member 185 for supporting the adhesive dispenser 170.
  • the operation of the apparatus for inspecting and dispensing the solder paste constructed as above in accordance with the present invention will be described in greater detail with reference to FIGS. 2 through 4.
  • the PCB 1 which is firstly p ⁇ nted with the solder paste by the screen pnnter (not shown), is moved in a certain direction by the conveyor 101 (step SI 10)
  • the PCB 1 is positioned by the cell type positioning conveyor 111, and raised and thus firstly aligned at a certain height by the actuator 112 (step S120).
  • the cell type positioning conveyor 111 conveys the PCB 1 m a direction perpendicular to an initial conveyance direction, to secondly position and align the PCB 1 below the image input side of a CCD camera 131 of the image recognizing means 130.
  • the vision camera 131 of the image recognizing means 131 is moved to the inspection coordinates, and to recognize the image information about the dispensing state of the solder paste on the PCB 1 as inspected (step S130)
  • control portion 133 of the vision camera 131 compares the inspection data of the recognized image information with the reference data corresponding to the image information obtained from the inspection of the dispensing state of the solder paste normally dispensed on the reference PCB, and outputs signal information about the compa ⁇ son result to the monitor 135 (step S140).
  • step SI 50 it is determined whether the solder paste is dispensed on the PCB 1 appropnately or not. For example, based on a difference calculated by compa ⁇ ng the area of the solder paste dispensed on the PCB as inspected with a preset image information about the area of the solder paste normally disposed on a reference PCB, it is determined whether the solder paste is dispensed approp ⁇ ately or not. If the solder paste is mapprop ⁇ ately dispensed, the control portion 131 of the vision camera 131 outputs a control signal, which conesponds to the information output to the monitor 135, to the main controller 180 of the base frame 100 (step S160).
  • the main controller 180 controls the positioning means 120 to move the positioning means to certain coordinates on the base frame 100 and supplementary dispense the solder paste on the certain coordinates of the PCB 1 (step S170).
  • the operator may refill the desired area with the supplemental solder paste by determining the area that needs supplement solder paste and inputting a teaching command to refill the area w ith the solder paste based on the image information displayed on the monitor 135. More specifically, when the operator clicks the mouse 136 on the certain area he/she wants to teach among the image information displayed on the monitor 135, information signal such as identifying number is input to the clicked area Accordingly, the main controller 180 controls the positioning means 120 so that the positioning means 120 is moved to certain coordinates on the base frame 100, and the solder paste dispenser 150 is moved to the certain coordinates on the PCB 1 to refill the area with the supplemental solder paste (step S170)
  • the solder paste dispenser 150 supplies the solder paste in a state that the solder paste dispenser 150 is lowered with respect to the PCB 1 by the dnving unit 160 That is, when the d ⁇ ving motor 161 is dnven by the control signal of the main controller 180, the ball screw 163 disposed on the output shaft is rotated, and accordingly, the moving member 165 is moved along the shaft of the ball screw 163, lowenng the actuator 167 supported on the moving member 165 and thus lowenng the solder paste dispenser 150 by a predetermined distance
  • the adhesive dispenser 170 is moved to certain coordinates on the PCB 1 by the d ⁇ ving of the positioning means 120 according to the control signal taught and output to the mam controller 180, to thereby dispense the solidifying adhesive such as a glue to the area in a predetermined pattern
  • the apparatus for inspecting and dispensing the solder paste in accordance with the present invention is disposed between the screen pnnter 12 and the chip mounter 16 to inspect the dispensing state of the solder paste that is firstly pnnted on the PCB by the screen p ⁇ nter 12, and if a certain area of certain coordinates is determined to have inapprop ⁇ ately dispensed solder paste, to refills the certain area with the solder paste m a dot or linear pattern.
  • the apparatus for inspecting and dispensing the solder paste in accordance with the present invention can increase a mounting solidity for relatively heavy components such as a quad flat package and connector by dispensing separate solidifying adhesive such as a glue on a pre-taught area of the PCB completed with the solder paste dispensing
  • the apparatus for inspecting and dispensing a solder paste in accordance with the present invention adds a function of inspecting a dispensing state of the solder paste firstly pnnted on a PCB by a screen p ⁇ nter with a function of refilling an area taught by the inspection result with supplemental solder paste. Accordingly, quality precision and inspection reliability about the dispensing state of the solder paste p ⁇ nted on the PCB are increased, while the defectiveness is minimized and the productivity is maximized.
  • the apparatus for inspecting and dispensing a solder paste in accordance with the present invention integrates two functions of inspecting the dispensing state of the solder paste and supplementary dispensing the solder paste according to the inspection result in one unit disposed between the screen p ⁇ nter and the chip mounter, thereby shortening the line of the electronic component mounting line.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An integral unit has an image recognizing portion for inspecting printing state of a solder paste that is first printed on a Printed Circuit Board (PCB) by a screen printer, a supplemental solder paste dispenser for supplementary dispensing the solder paste on a location of the PCB indicated by a teaching according to the inspecting result of the image recognizing portion, and an adhesive dispenser for dispensing an adhesive for hardening mounted components on the PCB on a location indicated by a separate teaching. The respective operations of the image recognizing portion, the supplemental solder paste dispenser, and the adhesive dispenser are sequentially controlled with respect to the PCB. Accordingly, on the location where the solder paste is improperly printed, the solder paste can be supplementary dispensed. Since quality precision and inspection reliability of the printing state of the solder paste printed on the PCB are improved, quality improvement is achieved, while defective proportion is decreased. As a result, the productivity is maximized.

Description

APPARATUS FOR INSPECTING SOLDER PASTE PRINTED ON A
PCB AND SUPPLEMENTARY DISPENSING SOLDER PASTE
TECHNICAL FIELD The present invention relates to a method and an apparatus for surface mounting electronic components on a printed circuit board, and more particularly to an apparatus for inspecting and dispensing a solder paste on the printed circuit board, i.e., a method and an apparatus for inspecting a dispensing state of the solder paste firstly printed on the printed circuit board and refills the printed circuit board with supplementary solder paste according to inspection result.
BACKGROUND ART
Generally, a printed circuit board (PCB), which is essentially embedded in electronic appliances such as computers and home appliances, is printed with a solder in a melted state (hereinafter called 'solder paste') in a predetermined pattern in order to surface mount small electronic parts such as semiconductor chips and resistant chips thereon. The solder paste is printed on the PCB usually by a solder paste dispenser called a screen printer. The screen printer applies the solder paste on the component mounted place of the PCB by squeezing out solder paste applied on a metal mask that has a predetermined pattern of opening therein. FIG. 1 schematically shows an arrangement of main units in a general electronic components mounting line. Referring to FIG. 1, the general electronic component mounting process is as follows. First, the screen printer 12 applies solder paste on the PCB that is successively supplied by a PCB loading device 11 Then, with a solder paste inspector 14, the dispensing state of the solder paste is inspected, and it is determined whether the solder paste is dispensed appropπately or not
The solder paste inspector 14 uses a vision system, or the like For example the solder paste inspector 14 determines whether the dispensing state of the solder paste is appropπate or not based on a difference calculated between an actual area of the solder paste pπnted on the PCB as inspected and a preset image data about an average area of the solder paste normally pπnted on a reference PCB
According to the result of the inspection, the PCB with in appropπately dispensed solder paste is omitted, while a chip mounter 16 mounts electronic components on the PCBs on which the solder paste is dispensed appropπately Here, the undesignated reference numeral 13 refers to a glue dispensing machine for dispensing solidifying adhesive such as a glue on the mounting place of the PCB for the relatively heavier electronic components such as a quad flat package (QFP) and a connector Also, the reference numerals 15a and 15b are buffer conveyors disposed for balanced tact time between the respective processes, I e , for load balance, and reference numeral 17 is different shape chip mounter for mounting components of different shapes, 18 is a reflow machine for solidifying mounting of the mounted components, and 19 is a PCB unloading device for discharging the PCB completed with the electronic component mounting Meanwhile, according to the recent trend that prefers the compact-sized electπc/electromc appliances, the PCB has also been designed to be thinner and smaller Accordingly, in the general electronic component mounting line, when mounting the electronic components on the PCB, serious problems frequently occur such as short, under- soldering, and early cooling of the solder paste depending on the amount of the printed solder paste.
Particularly in the general process of surface mounting the electronic components, depending on the thickness of the metal mask of the screen printer 12, the amount of the printed solder paste varies. For example, depending on the model type of the PCB, the thickness of the solder paste is determined within the range of 80μm-150μm.
As the electronic components become more compact-sized, the metal mask becomes thinner and thinner, and accordingly, defective mounting of the electronic components frequently occurs due to lack of degree of freedom in dealing with the electronic components of different shapes. For example, dispensing solder paste only once is insufficient for mounting the quad flat package and connector, which requires relatively large amount of solder paste.
Further, in the conventional process of mounting the electronic components, since the dispensing state of the solder paste on the PCB must be inspected by separate process by the solder paste inspector 14, the mounting line is inevitably lengthened.
Further, only those of the PCBs that the solder paste inspector 14 determines as having solder paste appropriately dispensed, are transferred to the next process, while those that are determined as having the solder paste inappropriately dispensed are stopped and taken out. Accordingly, the operating efficiency of the respective equipments is deteriorated, and since some of the mounted components are exclusively inspected for balanced tack time between the lines, the inspection reliability is also deteriorated. Also, in the conventional process of mounting the electronic components, since supplementary supply of the solder paste, i.e., since refilling is not allowed, the productivity is basically deteπorated due to low recovery rate.
Meanwhile, when mounting the electronic components on both sides of the PCB in the conventional electronic component mounting line, the PCB is reversed after the electronic components are mounted on one side thereof Then, with its other side facing upward on the mounting line, the PCB is mounted with the electronic components thereon and the solder paste is solidified, sequentially. Duπng this process, the electronic components soldered on one side of the PCB is input to the reflow machine 18 and the solidified solder paste thereof is re-subjected to the temperature close to the melting point (approximately 20°C). Accordingly, the solder paste is melted, and defectiveness occurs like early cooling of the solder paste, deviation or separation of the relatively larger and heavier electronic components such as the quad flat package and connector from the initial position of the PCB.
DISCLOSURE OF INVENTION
Accordingly, the present invention has been made to overcome the problems of the conventional method for mounting the electronic components, and it is an object of the present invention to provide a method for mounting electronic components on a pπnted circuit board that improves the quality of the mounted component by increasing quality precision and inspection reliability about the state that the solder paste is dispensed on the pπnted circuit, while minimizing the possibility of having defectiveness.
Another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste pπnted on the pπnted circuit board by a screen pπnter, and supplementary refilling the pπnted circuit board with the solder paste on a taught location according to the result of the first inspection. Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste pπnted on the pπnted circuit board by a screen pπnter, and supplementary refilling the pπnted circuit board with the solder paste on a taught location according to the result of the first inspection without having to repeatedly inspecting the dispensing state of the solder paste.
Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for inspecting the dispensing state of a solder paste pπnted on a pπnted circuit board by a screen pπnter, and supplementary refilling the pπnted circuit board with the solder paste according to the result of the inspection, while simultaneously applying a bond on a taught location of the pπnted circuit board for solidifying mounted components.
The above object is accomplished by a method for attaching and thereby mounting an electronic component on a solder paste pπnted on a pπnted circuit board according to a dispensing state of the solder paste inspected by a vision system, the method in accordance with the present invention including the steps of inputting an image information about a normal dispensing state of the solder paste normally pπnted on a reference pπnted circuit board, and calculating and stoπng reference data, dispensing the solder paste on a pπnted circuit board as inspected, inputting image information about the dispensing state of the solder paste pπnted on the pπnted circuit board as inspected, and calculating inspection data, compaπng the reference data with resultant data of the inspection and outputting a difference obtained from the compaπson, and supplementary dispensing the solder paste on the pπnted circuit board as inspected according to the resultant data of the inspection.
Another object is accomplished by an apparatus for inspecting and dispensing a solder paste on a pπnted circuit board in accordance with the present invention, including supporting means for positioning thereby supporting the pπnted circuit board on which the solder paste is firstly pπnted by a screen pπnter, image recognizing means for inputting image information about a dispensing state of the solder paste pπnted on the pπnted circuit board, and outputting resultant data, a controller for compaπng data about image information output by the image recognizing means with a preset reference data, and outputting a control signal according to the compaπson result, positioning means controlled by the control signal of the controller to be moved to certain coordinates on an orthogonal coordinate, and a solder paste dispenser disposed on and thus connectively dπven with the positioning means, to supplementary dispense the solder paste on a certain location on the pπnted circuit board according to the control signal of the controller.
According to the present invention, the positioning means includes an adhesive dispenser disposed on and thus connectively dπven with the positioning means, for dispensing an adhesive for a solidification of a mounted component on a certain location on the pπnted circuit board in accordance with the control signal of the controller Further, the solder paste dispenser is preferably dπven by a dnvmg unit formed on the positioning means and thus raised and lowered with respect to the pπnted circuit board The dnvmg unit includes a dnving motor, a ball screw coaxially disposed with an output shaft of the dnving motor, a moving member disposed to be moved along a shaft of the all screw, and an actuator disposed on the moving member for supporting the solder paste dispenser.
Further, the adhesive dispenser is preferably dπven by a raising unit formed on the positioning means to be raised and lowered with respect to the pnnted circuit board The raising unit includes a dnving motor, a dnving pulley disposed on the output shaft of the dnving motor, a dnven pulley connected to the dπving pulley through a belt, a ball screw coaxially disposed on the dnven pulley, a movable member disposed to be moved along the shaft of the ball screw, and an actuator disposed on the movable member to support the adhesive dispenser.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a view schematically showing one example of a conventional line for mounting electronic components on a pnnted circuit board,
FIG. 2 is a perspective view schematically showing an appearance of an apparatus for inspecting and dispensing a solder paste in accordance with the present invention,
FIG. 3 is a schematic perspective view showing the main portion of FIG. 2 m greater detail;
FIG. 4 is a flowchart for explaining a process of inspecting and dispensing the solder paste in accordance with the present invention,
FIG. 5 is a view schematically showing an anangement of units for mounting electronic components with the apparatus for inspecting and dispensing solder paste employed therein in accordance with the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
An apparatus for inspecting and dispensing a solder paste in accordance with the prefened embodiment of the present invention will be descnbed below with reference to accompanying drawings As shown in FIG. 2, the apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention includes an image recognizing means 30 for inspecting the dispensing state of the solder paste firstly pnnted on a pnnted circuit board 1 (PCB) by a screen pπnter (not shown), a solder paste dispenser 50 for supplementary refilling the PCB 1 with the solder paste on a location taught in accordance with the result of the inspection of the image recognizing means 30, and an adhesive dispenser 70 for dispensing a solidifying adhesive such as a glue on the taught location of the PCB 1. The image recognizing means 30, the solder paste dispenser 50, and the adhesive dispenser 70 are integrated into one unit so that the same are controlled with respect to the PCB 1 sequentially The apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention will be descnbed in greater detail with reference to FIGS. 2 and 3
In the apparatus for inspecting and dispensing the solder paste m accordance with the present invention, the image recognizing means 130, the solder paste dispenser 150, and the adhesive dispenser 170 are supported on a positioning means 120 such as an X-Y orthogonal robot to be moved to certain coordinates on a base frame 100
Formed on the base frame 100 are a conveyor 101 for conveying and thus supplying PCBs 1 firstly pnnted with the solder paste by a screen pnnter (not shown) in a certain direction, and a supporting means 110 mounted on the conveyor 101 to support the PCB 1 to a state that the PCB 1 is positioned on the lower portion of an image input side of the image recognizing means 130
The supporting means 110 includes a cell type positioning conveyor 111 that takes a certain part of the conveyor 101 and is moved in a direction perpendicular to the conveyance direction of the PCB 1, and an actuator 112 for raising and aligning the PCB 1 from the positioning conveyor 111 to the inspection position at a certain height
The image recognizing means 130 is aimed to input image information about the dispensing state of the solder paste pπnted on the PCB 1 and outputs signal data As the image recognizing means 130, a general vision system that include a vision camera 131, a control portion 133 for processing signals, a monitor 135 for displaying the image data, and a signal generator such as a mouse 136 and a keyboard 137 for teaching and inputting signal information about a certain location of the image information as displayed on the monitor 135
Here, the image data about the dispensing state of the solder paste on the PCB recognized by the vision camera 131 is input to a controlling means such as a computer system, or the like, to be used as an information signal about the result of the inspection and also used as a control signal
The control portion 133 is input with reference data about image information on the dispensing state of the solder paste normally pnnted on a reference PCB, and together with the control signal, the control portion 133 outputs signal information about companson between the image data about the dispensing state of the solder paste pnnted on the PCB as inspected and the reference data to the monitor 125 and to a mam controller 180 which are provided to the base frame 100
According to one aspect of the present invention, the main controller 180 controls the positioning means 120 by the control signal output from the control portion 133 of the image recognizing means 130 so that the positioning means 120 is moved to certain coordinates on the base frame 100. According to another aspect of the present invention, the mouse 136 and the keyboard
137 are used as the signal generator through which an operator inputs a command to teach the location that the operator determines needs solder paste refill based on the image information displayed on the monitor 135. For example, when the operator clicks the mouse 136 on a certain position of the image information as displayed on the monitor 135 he/she wants to teach, an identifying number such as a distinctive number is input to the clicked area, and the control signal is output from the ma controller 180 according to the identifying signal Accordingly, the positioning means 120 is moved to the certain coordinates on the base frame 100, to refill the taught area of the PCB with the supplemental solder paste.
According to the present invention, and as shown in FIG. 3, the dnving unit 160 includes a ball screw 163 coaxially disposed on an output shaft of a dnving motor 161, a moving member 165 movably disposed on the shaft of the ball screw 163, and an actuator 167 disposed on the moving member 165 in a manner of supporting the solder paste dispenser 160
The adhesive dispenser 170 is raised and lowered with respect to the PCB 1 by a raising unit 180 disposed on the positioning means 120
According to the present invention, and as shown in FIG. 3, the raising unit 180 includes a dnving pulley 182 disposed on the output shaft of the dnving motor 181, a dπven pulley 183 connected to the dnving pulley 182 through a belt B, a movable member 185 disposed to be moved along the shaft of the ball screw 184 that is coaxially disposed with the dπven pulley 183, and an actuator 186 disposed on the movable member 185 for supporting the adhesive dispenser 170. The operation of the apparatus for inspecting and dispensing the solder paste constructed as above in accordance with the present invention will be described in greater detail with reference to FIGS. 2 through 4.
According to the apparatus for inspecting and dispensing the solder paste in accordance with the present invention, the PCB 1, which is firstly pπnted with the solder paste by the screen pnnter (not shown), is moved in a certain direction by the conveyor 101 (step SI 10)
The PCB 1 is positioned by the cell type positioning conveyor 111, and raised and thus firstly aligned at a certain height by the actuator 112 (step S120).
Next, the cell type positioning conveyor 111 conveys the PCB 1 m a direction perpendicular to an initial conveyance direction, to secondly position and align the PCB 1 below the image input side of a CCD camera 131 of the image recognizing means 130.
Next, the vision camera 131 of the image recognizing means 131 is moved to the inspection coordinates, and to recognize the image information about the dispensing state of the solder paste on the PCB 1 as inspected (step S130)
Accordingly, control portion 133 of the vision camera 131 compares the inspection data of the recognized image information with the reference data corresponding to the image information obtained from the inspection of the dispensing state of the solder paste normally dispensed on the reference PCB, and outputs signal information about the compaπson result to the monitor 135 (step S140).
Based on the information output to the monitoi 135, it is determined whether the solder paste is dispensed on the PCB 1 appropnately or not (step SI 50) For example, based on a difference calculated by compaπng the area of the solder paste dispensed on the PCB as inspected with a preset image information about the area of the solder paste normally disposed on a reference PCB, it is determined whether the solder paste is dispensed appropπately or not. If the solder paste is mappropπately dispensed, the control portion 131 of the vision camera 131 outputs a control signal, which conesponds to the information output to the monitor 135, to the main controller 180 of the base frame 100 (step S160).
The main controller 180 controls the positioning means 120 to move the positioning means to certain coordinates on the base frame 100 and supplementary dispense the solder paste on the certain coordinates of the PCB 1 (step S170).
Meanwhile, according to another aspect of the present invention, in S160, the operator may refill the desired area with the supplemental solder paste by determining the area that needs supplement solder paste and inputting a teaching command to refill the area w ith the solder paste based on the image information displayed on the monitor 135. More specifically, when the operator clicks the mouse 136 on the certain area he/she wants to teach among the image information displayed on the monitor 135, information signal such as identifying number is input to the clicked area Accordingly, the main controller 180 controls the positioning means 120 so that the positioning means 120 is moved to certain coordinates on the base frame 100, and the solder paste dispenser 150 is moved to the certain coordinates on the PCB 1 to refill the area with the supplemental solder paste (step S170)
The solder paste dispenser 150 supplies the solder paste in a state that the solder paste dispenser 150 is lowered with respect to the PCB 1 by the dnving unit 160 That is, when the dπving motor 161 is dnven by the control signal of the main controller 180, the ball screw 163 disposed on the output shaft is rotated, and accordingly, the moving member 165 is moved along the shaft of the ball screw 163, lowenng the actuator 167 supported on the moving member 165 and thus lowenng the solder paste dispenser 150 by a predetermined distance
The previous steps before S170 are repeated so that S170 can be repeated at least twice
Meanwhile, according to the present invention, inespective of the inspection result of the image recognizing means 130, the adhesive dispenser 170 is moved to certain coordinates on the PCB 1 by the dπving of the positioning means 120 according to the control signal taught and output to the mam controller 180, to thereby dispense the solidifying adhesive such as a glue to the area in a predetermined pattern
As descnbed above, and as shown in FIG 5, the apparatus for inspecting and dispensing the solder paste in accordance with the present invention is disposed between the screen pnnter 12 and the chip mounter 16 to inspect the dispensing state of the solder paste that is firstly pnnted on the PCB by the screen pπnter 12, and if a certain area of certain coordinates is determined to have inappropπately dispensed solder paste, to refills the certain area with the solder paste m a dot or linear pattern. Also, the apparatus for inspecting and dispensing the solder paste in accordance with the present invention can increase a mounting solidity for relatively heavy components such as a quad flat package and connector by dispensing separate solidifying adhesive such as a glue on a pre-taught area of the PCB completed with the solder paste dispensing
INDUSTRIAL AVAILABILITY
As descnbed above, the apparatus for inspecting and dispensing a solder paste in accordance with the present invention adds a function of inspecting a dispensing state of the solder paste firstly pnnted on a PCB by a screen pπnter with a function of refilling an area taught by the inspection result with supplemental solder paste. Accordingly, quality precision and inspection reliability about the dispensing state of the solder paste pπnted on the PCB are increased, while the defectiveness is minimized and the productivity is maximized.
Further, the apparatus for inspecting and dispensing a solder paste in accordance with the present invention integrates two functions of inspecting the dispensing state of the solder paste and supplementary dispensing the solder paste according to the inspection result in one unit disposed between the screen pπnter and the chip mounter, thereby shortening the line of the electronic component mounting line. Although the preferced embodiments of the present invention have been described, it will be understood by those skilled in the art that the present invention should not be limited to the described preferred embodiments, but various changes and modifications can be made within the spirit and scope of the present invention as defined by the appended claims.

Claims

1 A method for attaching and thereby mounting an electronic component on a solder paste pnnted on a pπnted circuit board according to a dispensing state of the solder paste inspected by a vision system, the method compπsing the steps of inputting an image information about a normal dispensing state of the solder paste normally pnnted on a reference pnnted circuit board, and calculating and stonng reference data, dispensing the solder paste on a pnnted circuit board as inspected, inputting image information about the dispensing state of the solder paste pnnted on the pnnted circuit board as inspected, and calculating inspection data, compaπng the reference data with resultant data of the inspection, and outputting a difference obtained from the companson, and supplementary dispensing the solder paste on the pnnted circuit board as inspected according to the resultant data of the inspection
2 The method of claim 1, wherein the step of outputting the resultant data of the inspection displays the resultant data of the inspection in the form of image information
3 The method of claim 2, further compns g the steps of teaching and inputting signal information for outputting a predetermined control signal to a certain location of the image information of the displayed resultant data of the inspection, and supplementary dispensing the solder paste on the printed circuit board as inspected in accordance with the control signal.
4. The method of claim 1, further comprising the steps of: comparing the reference data and the inspection data with the vision system, and calculating a difference between the reference data and the inspection data in the form of resultant data of the inspection; and supplementary dispensing the solder paste on the printed circuit board as inspected based on the resultant data of the inspection, the comparing step and the supplementary dispensing step repeated at least twice.
5. An apparatus for inspecting and dispensing a solder paste on a printed circuit board, comprising: supporting means for positioning thereby supporting the printed circuit board on which the solder paste is firstly printed by a screen printer; image recognizing means for inputting image information about a dispensing state of the solder paste printed on the printed circuit board, and outputting resultant data; a controller for comparing data about image information output by the image recognizing means with a preset reference data, and outputting a control signal according to the comparison result; positioning means controlled by the control signal of the controller to be moved to certain coordinates on an orthogonal coordinate; and a solder paste dispenser disposed on and thus connectively dnven with the positioning means, to supplementary dispense the solder paste on a certain location on the pnnted circuit board according to the control signal of the controller
6 The apparatus of claim 5, wherein the positioning means compπses an adhesive dispenser disposed on and thus connectively dπven with the positioning means, for dispensing an adhesive for a solidification of a mounted component on a certain location on the pnnted circuit board m accordance with the control signal of the controller
7. The apparatus of claim 5, wherein the image recognizing means compπses a monitor for outputting data in the form of image information about a difference obtained by companng the image information about the dispensing state of the solder paste pnnted on the pnnted circuit board with a preset reference information; and a signal generator for teaching and inputting signal information to a certain location of the image information as displayed on the monitor, in order for the controller to output a predetermined control signal.
PCT/KR2001/000367 2000-03-10 2001-03-09 Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste WO2001067835A1 (en)

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US9327490B2 (en) 2007-02-20 2016-05-03 Asm Assembly Systems Switzerland Gmbh Screen printing machine and method having vision camera coupled to material-dispensing effector
DE102007019073A1 (en) * 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Method and device for applying media to flat substrates
EP2140744A1 (en) * 2007-04-23 2010-01-06 Ekra Automatisierungssysteme GmbH Method and device for applying media to flat substrates
KR100929911B1 (en) * 2007-11-28 2009-12-04 주식회사 프로텍 Dispensing Preliminary Inspection System
US8746139B2 (en) 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
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US8733244B2 (en) 2010-12-08 2014-05-27 Illinois Tool Works, Inc. Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser
US8739699B2 (en) 2010-12-08 2014-06-03 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
WO2012078894A3 (en) * 2010-12-08 2012-10-26 Illinois Tool Works Inc. Method for depositing viscous material on a substrate with a combination stencil printer and dispenser
US8776684B2 (en) 2010-12-08 2014-07-15 Illinois Tool Works Inc. Method of depositing viscous material on a substrate
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US8474377B2 (en) 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
CN102601066A (en) * 2012-03-16 2012-07-25 德州泓淋电子有限公司 Testing and gluing integrated machine
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CN104010442A (en) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 PCB wire welding and dispensing machine capable of carrying out batch conveying operation
CN104010440A (en) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 PCB wire soldering and adhesive dispensing machine capable of conducting bulk operation
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