WO2001059828A3 - Bauelement mit konstant verspannter verklebung und verfahren zur verklebung - Google Patents
Bauelement mit konstant verspannter verklebung und verfahren zur verklebung Download PDFInfo
- Publication number
- WO2001059828A3 WO2001059828A3 PCT/DE2001/000403 DE0100403W WO0159828A3 WO 2001059828 A3 WO2001059828 A3 WO 2001059828A3 DE 0100403 W DE0100403 W DE 0100403W WO 0159828 A3 WO0159828 A3 WO 0159828A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bonding
- building component
- distorsion
- constant
- free
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 125000006850 spacer group Chemical group 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10006447A DE10006447A1 (de) | 2000-02-14 | 2000-02-14 | Bauelement mit konstant verspannter Verklebung und Verfahren zur Verklebung |
DE10006447.7 | 2000-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001059828A2 WO2001059828A2 (de) | 2001-08-16 |
WO2001059828A3 true WO2001059828A3 (de) | 2002-02-28 |
Family
ID=7630817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/000403 WO2001059828A2 (de) | 2000-02-14 | 2001-02-02 | Bauelement mit konstant verspannter verklebung und verfahren zur verklebung |
Country Status (3)
Country | Link |
---|---|
US (1) | US20030141782A1 (de) |
DE (1) | DE10006447A1 (de) |
WO (1) | WO2001059828A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7495862B2 (en) * | 2005-02-08 | 2009-02-24 | Seagate Technology Llc | Formed parts for adhesive height setting |
TWI589420B (zh) * | 2012-09-26 | 2017-07-01 | Mitsuboshi Diamond Ind Co Ltd | Metal multilayer ceramic substrate breaking method and trench processing tools |
DE102015101711B4 (de) * | 2014-02-11 | 2020-10-01 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Verfahren zum Bilden einer Klebeverbindung sowie Verfahren zum Reparieren von Automobilkomponenten |
US10018211B2 (en) * | 2014-02-11 | 2018-07-10 | GM Global Technology Operations LLC | Bond standoffs for sliding positioning of components in an assembly |
JP6669104B2 (ja) | 2017-03-03 | 2020-03-18 | 株式会社デンソー | 半導体装置 |
JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
DE102022209197A1 (de) | 2022-09-05 | 2024-03-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Vorrichtung und Verfahren zum Bedrucken eines Substrats mit einem Dicht- und/oder Klebstoff |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105449A (ja) * | 1988-10-13 | 1990-04-18 | Nec Corp | 半導体装置用リードフレーム |
JPH02144954A (ja) * | 1988-11-28 | 1990-06-04 | Matsushita Electron Corp | 半導体装置 |
JPH03206626A (ja) * | 1990-01-08 | 1991-09-10 | Nec Corp | 樹脂封止型半導体装置 |
JPH0438859A (ja) * | 1990-06-04 | 1992-02-10 | Hitachi Ltd | 電子部品組立構造及びその組立方法 |
JPH05109786A (ja) * | 1991-10-18 | 1993-04-30 | Fujitsu Ltd | 半導体チツプの実装構造 |
JPH05343658A (ja) * | 1992-06-09 | 1993-12-24 | Sony Corp | 固体撮像装置のパッケージ構造 |
JPH10284515A (ja) * | 1997-04-10 | 1998-10-23 | Murata Mfg Co Ltd | ダイボンディング方法およびそれを用いた電子部品の実装構造 |
-
2000
- 2000-02-14 DE DE10006447A patent/DE10006447A1/de not_active Ceased
-
2001
- 2001-02-02 US US10/203,582 patent/US20030141782A1/en not_active Abandoned
- 2001-02-02 WO PCT/DE2001/000403 patent/WO2001059828A2/de active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105449A (ja) * | 1988-10-13 | 1990-04-18 | Nec Corp | 半導体装置用リードフレーム |
JPH02144954A (ja) * | 1988-11-28 | 1990-06-04 | Matsushita Electron Corp | 半導体装置 |
JPH03206626A (ja) * | 1990-01-08 | 1991-09-10 | Nec Corp | 樹脂封止型半導体装置 |
JPH0438859A (ja) * | 1990-06-04 | 1992-02-10 | Hitachi Ltd | 電子部品組立構造及びその組立方法 |
JPH05109786A (ja) * | 1991-10-18 | 1993-04-30 | Fujitsu Ltd | 半導体チツプの実装構造 |
JPH05343658A (ja) * | 1992-06-09 | 1993-12-24 | Sony Corp | 固体撮像装置のパッケージ構造 |
JPH10284515A (ja) * | 1997-04-10 | 1998-10-23 | Murata Mfg Co Ltd | ダイボンディング方法およびそれを用いた電子部品の実装構造 |
Non-Patent Citations (8)
Title |
---|
"CHIP-HEATSINK ATTACH USING CONTOURED ADHESIVE WITH GLASS STAND-OFFS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 34, no. 3, 1 August 1991 (1991-08-01), pages 161 - 162, XP000210487, ISSN: 0018-8689 * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 316 (E - 0949) 6 July 1990 (1990-07-06) * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 391 (E - 0968) 23 August 1990 (1990-08-23) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 476 (E - 1140) 4 December 1991 (1991-12-04) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 224 (E - 1206) 25 May 1992 (1992-05-25) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 463 (E - 1420) 24 August 1993 (1993-08-24) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 171 (E - 1529) 23 March 1994 (1994-03-23) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 01 29 January 1999 (1999-01-29) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001059828A2 (de) | 2001-08-16 |
DE10006447A1 (de) | 2001-08-16 |
US20030141782A1 (en) | 2003-07-31 |
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