WO2001041968A3 - Process for forming film covered sheet metal material and sheet metal material so covered - Google Patents

Process for forming film covered sheet metal material and sheet metal material so covered Download PDF

Info

Publication number
WO2001041968A3
WO2001041968A3 PCT/US2000/042043 US0042043W WO0141968A3 WO 2001041968 A3 WO2001041968 A3 WO 2001041968A3 US 0042043 W US0042043 W US 0042043W WO 0141968 A3 WO0141968 A3 WO 0141968A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
sheet metal
substrate
metal material
covered
Prior art date
Application number
PCT/US2000/042043
Other languages
French (fr)
Other versions
WO2001041968A2 (en
Inventor
Sidney Elzahr
Dennis Michael Mahoney
Original Assignee
Main Tape Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Main Tape Company Inc filed Critical Main Tape Company Inc
Priority to AU47066/01A priority Critical patent/AU4706601A/en
Publication of WO2001041968A2 publication Critical patent/WO2001041968A2/en
Publication of WO2001041968A3 publication Critical patent/WO2001041968A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)

Abstract

A plastic film (44) is bonded with an adhesive (48) to a sheet metal substrate (46). The sheet metal substrate is processed in a laser operation to form grooves, openings or cuts in the sheet metal. The laser operation has a pressurized gas stream that is directed to the laser beam cut to clean and cool the cut. The gas enters the film-substrate interface at the opening formed by the beam. The film has slits (50) or other perforations throughout so that as the pressurized gas impinges upon the film and its opening formed by the laser beam and enters the film-substrate interface, the adjacent slits bleed the pressurized gas from the film-substrate interface to prevent significant lifting of the film from the substrate into a bubble which otherwise interferes with and can stop the laser operation. The perforations may be in the form of weakened recesses (47) in the film which open in reponse to lifting of the film by gas pressure at the interface with the underlying metal sheet. The dimensions of the perforations are such that the sheet metal is protected during prior handling and the laser processing while maintaining the integrity of the film so it can be easily removed as a unit and not shared during such removal.
PCT/US2000/042043 1999-11-18 2000-11-10 Process for forming film covered sheet metal material and sheet metal material so covered WO2001041968A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU47066/01A AU4706601A (en) 1999-11-18 2000-11-10 Process for forming film covered sheet metal material and sheet metal material so covered

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44300299A 1999-11-18 1999-11-18
US09/443,002 1999-11-18

Publications (2)

Publication Number Publication Date
WO2001041968A2 WO2001041968A2 (en) 2001-06-14
WO2001041968A3 true WO2001041968A3 (en) 2002-02-14

Family

ID=23759043

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/042043 WO2001041968A2 (en) 1999-11-18 2000-11-10 Process for forming film covered sheet metal material and sheet metal material so covered

Country Status (2)

Country Link
AU (1) AU4706601A (en)
WO (1) WO2001041968A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20001466A (en) * 2000-06-20 2001-12-21 Outokumpu Oy Method for protecting sheet or sheet material, sheet and sheet or sheet product with sheet
WO2004096483A1 (en) 2003-04-25 2004-11-11 Nitto Denko Corporation Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
ATE553638T1 (en) 2003-12-25 2012-04-15 Nitto Denko Corp METHOD FOR PRODUCING WORKPIECES BY LASER
JP4873863B2 (en) 2005-01-14 2012-02-08 日東電工株式会社 Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing
JP4854061B2 (en) 2005-01-14 2012-01-11 日東電工株式会社 Manufacturing method of laser processed product and protective sheet for laser processing
CN101208172A (en) 2005-06-27 2008-06-25 日东电工株式会社 Surface protective sheet for use in laser processing
DE102015215316A1 (en) * 2015-08-11 2016-06-30 Schuler Automation Gmbh & Co. Kg Method for producing a metal sheet by means of laser cutting and use of a plastic film
CN108274126A (en) * 2018-01-23 2018-07-13 王若云 A kind of laser carving device

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3655501A (en) * 1968-03-26 1972-04-11 Guenther Horst Tesch Flexible materials
US3749878A (en) * 1967-03-16 1973-07-31 Nat Res Dev Gas assisted laser cutting apparatus
JPS59147382A (en) * 1983-02-10 1984-08-23 占部　聡長 Tack paper
US4469727A (en) * 1981-09-02 1984-09-04 The Standard Products Company Automotive trim strip with expanded pressure sensitive tape
US4615781A (en) * 1985-10-23 1986-10-07 Gte Products Corporation Mask assembly having mask stress relieving feature
US4724297A (en) * 1985-05-09 1988-02-09 Aga Aktiebolag Methods in the laser cutting of metallic workpieces
US4847181A (en) * 1986-08-08 1989-07-11 Mazda Motor Corporation Laser marking method
JPH01298113A (en) * 1988-05-26 1989-12-01 Hajime Watanabe Coating agent for working by laser light
US4891077A (en) * 1988-10-27 1990-01-02 Dana Corporation Method of making an electromagnetic coupling disc
US4999235A (en) * 1987-07-24 1991-03-12 Ethicon, Inc. Conformable, stretchable surgical wound closure tape
EP0646962A1 (en) * 1993-04-14 1995-04-05 Hitachi Construction Machinery Co., Ltd. Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device
US5547725A (en) * 1994-02-25 1996-08-20 Tesa Tape Inc. Production of a novel sculptured strip of plastic foam
US5565120A (en) * 1991-06-12 1996-10-15 La Rocca; Aldo V. Method of supplying laser cutting gas and cutting apparatus implementing such a method
US5810756A (en) * 1995-05-23 1998-09-22 Lectec Corporation Method of producing a perforated medical adhesive tape

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3749878A (en) * 1967-03-16 1973-07-31 Nat Res Dev Gas assisted laser cutting apparatus
US3655501A (en) * 1968-03-26 1972-04-11 Guenther Horst Tesch Flexible materials
US4469727A (en) * 1981-09-02 1984-09-04 The Standard Products Company Automotive trim strip with expanded pressure sensitive tape
JPS59147382A (en) * 1983-02-10 1984-08-23 占部　聡長 Tack paper
US4724297A (en) * 1985-05-09 1988-02-09 Aga Aktiebolag Methods in the laser cutting of metallic workpieces
US4615781A (en) * 1985-10-23 1986-10-07 Gte Products Corporation Mask assembly having mask stress relieving feature
US4847181A (en) * 1986-08-08 1989-07-11 Mazda Motor Corporation Laser marking method
US4999235A (en) * 1987-07-24 1991-03-12 Ethicon, Inc. Conformable, stretchable surgical wound closure tape
JPH01298113A (en) * 1988-05-26 1989-12-01 Hajime Watanabe Coating agent for working by laser light
US4891077A (en) * 1988-10-27 1990-01-02 Dana Corporation Method of making an electromagnetic coupling disc
US5565120A (en) * 1991-06-12 1996-10-15 La Rocca; Aldo V. Method of supplying laser cutting gas and cutting apparatus implementing such a method
EP0646962A1 (en) * 1993-04-14 1995-04-05 Hitachi Construction Machinery Co., Ltd. Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device
US5547725A (en) * 1994-02-25 1996-08-20 Tesa Tape Inc. Production of a novel sculptured strip of plastic foam
US5810756A (en) * 1995-05-23 1998-09-22 Lectec Corporation Method of producing a perforated medical adhesive tape

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 080 (C - 0689) 15 February 1990 (1990-02-15) *

Also Published As

Publication number Publication date
AU4706601A (en) 2001-06-18
WO2001041968A2 (en) 2001-06-14

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