WO2001020659A1 - Method for transferring integrated circuit microchips and implementing device - Google Patents

Method for transferring integrated circuit microchips and implementing device Download PDF

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Publication number
WO2001020659A1
WO2001020659A1 PCT/FR2000/002379 FR0002379W WO0120659A1 WO 2001020659 A1 WO2001020659 A1 WO 2001020659A1 FR 0002379 W FR0002379 W FR 0002379W WO 0120659 A1 WO0120659 A1 WO 0120659A1
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WIPO (PCT)
Prior art keywords
adhesive
chips
degraded
wafer
integrated circuit
Prior art date
Application number
PCT/FR2000/002379
Other languages
French (fr)
Inventor
Bernard Calvas
Olivier Brunet
Philippe Patrice
Didier Elbaz
Original Assignee
Gemplus
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Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU70170/00A priority Critical patent/AU7017000A/en
Publication of WO2001020659A1 publication Critical patent/WO2001020659A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to integrated circuit microchips, hereinafter called wafers, as well as individual integrated circuits, hereinafter called chips, which they comprise. It relates more particularly to the technique used for their transfer, in particular in modules for cards with integrated microcircuit or in cavities provided for this purpose in such cards.
  • flip-chip technologies, used for the direct connection, without wires, of protruding contact chips, are becoming more and more important in various applications, among which the transfer of the chip in portable devices of smart card type with cavity or electronic label type.
  • These transfer techniques with tilting consist in placing an element having its own orientation on a support, by imposing an orientation of said element relative to that of said support.
  • the orientation sought is that of orienting the active face of the integrated circuit downwards on the support, so that the inputs / outputs of the chip and of the support to be interconnected can be in direct or almost-direct contact.
  • the interconnections of the flip-chip type have electronic performance superior to that of wired connections and make it possible to lower costs, in particular thanks to a gain in the dimensions of the assemblies and a reduction in the number of operations necessary for the manufacture of portable devices comprising such an integrated microcircuit.
  • some of the remaining operations use additional means for picking up, turning over and positioning the chips accurately, making the operations more complex and significantly lowering the rate of transfer to the chips, compared to a conventional transfer of the chips. with their active side up (visible active side).
  • the invention therefore aims to provide an improved process for inverting integrated microcircuit chips, making it possible to overcome the drawbacks exposed above and to facilitate their transfer to a module or a card body.
  • the first object of the invention is a method for inverting integrated circuit chips, in which a plate of such chips is placed in a given orientation on a first adhesive film, the individual chips are optionally separated from the assembly and reverses the chips still held by the first adhesive on a second adhesive which, after removal of said first adhesive, retains said chips in the desired orientation, said second adhesive having a adhesion factor higher than that of the first a ⁇ hési.
  • an adhesiveness factor of said adhesive secon ⁇ in a ratio of at least 10: 1, preferably from 10: 1 to 50: 1, with that of the first adhesive can be sought, although this does not does not constitute a limitation.
  • Adhesiveness is measured in practice by peel strength or peel strength, using standard test procedures.
  • a wafer of integrated circuit chips in a given orientation on a first adhesive film which can then be degraded, for example under the effect of UV rays, the individual chips are optionally separated from the assembly, in particular by sawing according to known techniques, said first adhesive is degraded to an appropriate degree, and the chips still held by the degraded adhesive are overturned on a second adhesive which, after removal of the first degraded adhesive, retains only said chips, in the desired orientation, and if desired, said chips are placed according to a conventional method on or in their final supports.
  • appropriate degree means a degree of degradation which gives said first adhesive a lower tack factor than that of said second adhesive.
  • the first adhesive bearing the chips can be turned over before having subjected it to the abovementioned degradation process, so that it is suitably positioned on a second adhesive plastic material, while said degradation of the first adhesive is then undertaken. , preferably so as to concern only the said first adhesive, and the first adhesive thus degraded is subsequently removed, which means that the second adhesive retains the said only chips, in the desired orientation and allows to place them, if desired, according to a conventional method on their final supports.
  • the second adhesive plastic material can be deposited on the upper face of the chips still carried by the said first adhesive plastic material with their active face facing upwards and, in any order, proceed from below to said deactivation of the first adhesive, turn the assembly over so that said chips have their active face facing downwards, and remove the first adhesive which covers the faces of the chips opposite to the active face.
  • FIG. 1 schematically shows, in schematic cross-sectional view, a plate of adhesive plastic material held in a frame and carrying a microchip, the elements of which have been separated by sawing, in accordance with the present invention
  • Fig. 2 represents, in a schematic cross-section view, the plate according to FIG. 1 after turning and depositing on a second adhesive, adhesive side facing the aforementioned elements;
  • Fig. 3 represents, in a schematic cross-section view, the plate according to FIG. 2 after removal of the first degraded adhesive.
  • microchips 1 are placed on a plastic material having an appropriate adhesive face 2, capable of being degraded, for example under the action of UV radiation, with the active faces 3 of the circuits of the microchips. oriented opposite the adhesive, that is to say in practice upwards.
  • the first adhesive 2 carrying the integrated circuit wafers is advantageously fixed at the periphery by its own adhesive force on a frame 4, preferably a circular metallic frame.
  • microchips are sawn in order to isolate each individual microcircuit or chip 5 and said first adhesive is then degraded, so as to reduce the adhesion force between the chips 5 and the adhesive 2, without however completely canceling the effect d adhesion.
  • a sufficient adhesive action should be retained so that the assembly can be turned over without the chips 5 separating from said first adhesive 2 under the effect of gravity, before their fixing by their opposite face on a second adhesive. 6.
  • the set of integrated circuit chips 5 is then placed, while they still adhere to the first adhesive, active face down on a second adhesive 6.
  • the adhesive 2 having a degraded adhesion strength is removed by peeling and there is then a strip carrying microcircuits face down, which can be implemented by traditional known means used for placing and transferring integrated circuits on supports suitable for the applications for which the above microcircuits are intended.
  • the invention also relates to a device for turning over microchips of integrated circuits, comprising a support film with adhesive 2 for the temporary fixing of said microchips 1, a system for turning over said film (not shown), means for partially degrading the first adhesive 2 and means for positioning a second adhesive 6 on the free face or active face 3, before or after turning over, of said circuits integrated 5 still held on their opposite face by said first adhesive 2.
  • the means for at least partial degradation of the first adhesive preferably consist of an apparatus generating UV radiation, the activation of which for a period and under defined conditions, after calibration tests which are within the scope of the skilled in the art, allows to obtain the desired deactivation and therefore the corollary reduction in adhesion to the chips carried by this adhesive, which has the effect of facilitating the ejection of said chips.
  • the second adhesive 6 used according to the invention is chosen so as to prevent any damage to the active faces of the chips during the ejection of the latter, in particular by a preventive action against the impact of needles conventionally used for ejecting said chips in the so-called "flip chip” transfer technique.
  • this damage prevention action can be provided by an additional film placed between the ejection needles and the adhesive supporting the chips.
  • said ejectors can be made of slightly hard material, such as Teflon or any other polytetrafluoroethylene, or even another material plastic, which may constitute the material of the needle eject ⁇ ce itself or a coating thereof.
  • the method according to the invention further comprises a viewing step operating under the support of the integrated circuit chips and allowing the identification through the support of the second adhesive 6 of the defective elements, previously marked visibly, for example by means of an identification ink, after completion of a defect test.
  • a viewing step operating under the support of the integrated circuit chips and allowing the identification through the support of the second adhesive 6 of the defective elements, previously marked visibly, for example by means of an identification ink, after completion of a defect test.
  • the support of the second adhesive and the latter it is advantageous for the support of the second adhesive and the latter to be translucent.
  • such viewing means can be used during a test transfer of a few chips judiciously chosen on the wafer of individualized integrated circuits, in order to carry out a learning by wafer or sawed wafer.
  • We can then continue to carry over the other components of the wafer without special recognition, or alternatively use a simplified vision system, taking into account for example only the periphery of the integrated circuits concerned.
  • the method and the means described above can equally well be used for the positioning of any object of small size and / or light weight, which must be oriented with respect to a support or in general with respect to a defined surface, after having been presented in another orientation or before being made available to users for whom another orientation is necessary.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention concerns a method for turning integrated circuit chips, which consists in arranging a wafer (1) of chips (5) in a given orientation on a first adhesive film (2); optionally separating the individual chips from the assembly and turning around the chips (5) still fixed to the first adhesive onto a second adhesive (6) which, after the first adhesive has been removed, maintains said chips in the desired orientation, said second adhesive having a higher adhesive coefficient than the first adhesive, optionally after the latter has been degraded. The invention is useful for transferring integrated circuit flip-chips into or onto a module of a card body.

Description

PROCEDE POUR LE REPORT DE MICROPLAQUETTES DE CIRCUIT INTÉGRÉ ET DISPOSITIF UTILISÉMETHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED
La présente invention concerne les microplaquettes de circuits intégrés, ci -après dénommées wafers, ainsi que les circuits intégrés individuels, ci -après dénommés puces, qu'elles comportent. Elle concerne plus particulièrement la technique mise en oeuvre pour leur report, notamment dans des modules pour cartes à microcircuit intégré ou dans des cavités prévues à cet effet dans de telles cartes.The present invention relates to integrated circuit microchips, hereinafter called wafers, as well as individual integrated circuits, hereinafter called chips, which they comprise. It relates more particularly to the technique used for their transfer, in particular in modules for cards with integrated microcircuit or in cavities provided for this purpose in such cards.
Les technologies dites "flip-chip", utilisées pour la connexion directe, sans fils, de puces à contacts protubérants, prennent de plus en plus d'importance dans diverses applications, parmi lesquelles il faut citer le report de puce dans des dispositifs portables de type carte à puce à cavité ou de type étiquette électronique.The so-called "flip-chip" technologies, used for the direct connection, without wires, of protruding contact chips, are becoming more and more important in various applications, among which the transfer of the chip in portable devices of smart card type with cavity or electronic label type.
Ces techniques de report avec basculement consistent à venir placer un élément ayant une orientation propre sur un support, en imposant une orientation du dit élément par rapport à celle du dit support. Par exemple, pour des puces de circuits intégrés, l'orientation recherchée est celle consistant à orienter la face active du circuit intégré vers le bas sur le support, de telle sorte que les entrées/sorties de la puce et du support a interconnecter puissent être en contact direct ou quasi -direct .These transfer techniques with tilting consist in placing an element having its own orientation on a support, by imposing an orientation of said element relative to that of said support. For example, for integrated circuit chips, the orientation sought is that of orienting the active face of the integrated circuit downwards on the support, so that the inputs / outputs of the chip and of the support to be interconnected can be in direct or almost-direct contact.
Dans le cas des microcircuits intégrés, les interconnexions de type flip-chip présentent des performances électroniques supérieures à celles des connexions filaires et permettent d'abaisser les coûts, notamment grâce à un gain sur les dimensions des assemblages et à une réduction du nombre des opérations nécessaires pour la fabrication des dispositifs portables comportant un tel microcircuit intégré. Cependant, certaines des opérations qui subsistent mettent en oeuvre des moyens supplémentaires de prise, de retournement et de positionnement précis des puces, rendant les opérations plus complexes et abaissant de façon importante la cadence de report αes puces, par rapport à un report classique des puces avec leur face active vers le haut (face active apparente) .In the case of integrated microcircuits, the interconnections of the flip-chip type have electronic performance superior to that of wired connections and make it possible to lower costs, in particular thanks to a gain in the dimensions of the assemblies and a reduction in the number of operations necessary for the manufacture of portable devices comprising such an integrated microcircuit. However, some of the remaining operations use additional means for picking up, turning over and positioning the chips accurately, making the operations more complex and significantly lowering the rate of transfer to the chips, compared to a conventional transfer of the chips. with their active side up (visible active side).
La technique "flip chip", en conséquence, n'est rentable que dans le cas de puces nécessitant un positionnement très précis pour leur connexion, c'est-à- dire des puces ayant un grand nombre d'entrées/sorties, par exemple 100, alors que dans le domaine des cartes à puces, les puces comportent généralement un nombre d'entrées et sorties faible, de l'ordre de 5. En revanche, dans les autres cas, il y a un besoin pour une technique facilitant les opérations ci-dessus rappelées et ayant un effet positif sur le coût et/ou les cadences du dit procédé de report. D'une manière plus générale, le besoin se fait sentir pour un procédé dans lequel des éléments petits et/ou légers doivent être retournés et présentés en regard d'une zone de report ou de dépôt .The "flip chip" technique, therefore, is only profitable in the case of chips requiring very precise positioning for their connection, that is to say chips having a large number of inputs / outputs, for example 100, whereas in the field of chip cards, chips generally have a low number of inputs and outputs, of the order of 5. On the other hand, in other cases, there is a need for a technique facilitating the operations mentioned above and having a positive effect on the cost and / or the rates of said deferral process. More generally, the need arises for a process in which small and / or light elements must be turned over and presented opposite a carry-over or deposit area.
L'invention a donc pour objectif de procurer un procédé amélioré de retournement de puces de microcircuit intégré, permettant de pallier les inconvénients exposés ci-dessus et de faciliter leur report sur un module ou un corps de carte.The invention therefore aims to provide an improved process for inverting integrated microcircuit chips, making it possible to overcome the drawbacks exposed above and to facilitate their transfer to a module or a card body.
L'invention a pour premier objet un procédé pour le retournement de puces de circuits intégrés, dans lequel on dispose une plaquette de telles puces dans une orientation donnée sur un premier film adhésif, on sépare en option les puces individuelles de l'ensemble et on renverse les puces encore tenues par le premier adhésif sur un second adhésif qui, après enlèvement du dit premier adhésif, retient lesdites puces dans l'orientation voulue, ledit second adhésif ayant un facteur d'adhésivité supérieur à celui du premier aαhési .The first object of the invention is a method for inverting integrated circuit chips, in which a plate of such chips is placed in a given orientation on a first adhesive film, the individual chips are optionally separated from the assembly and reverses the chips still held by the first adhesive on a second adhesive which, after removal of said first adhesive, retains said chips in the desired orientation, said second adhesive having a adhesion factor higher than that of the first aαhési.
A titre d'exemple, un facteur d'adhésivité du dit seconα adhésif dans un rapport d'au moins 10:1, de préférence de 10:1 à 50:1, avec celui du premier adhésif peut être rechercne, bien que cela ne constitue pas une limitation.For example, an adhesiveness factor of said adhesive seconα in a ratio of at least 10: 1, preferably from 10: 1 to 50: 1, with that of the first adhesive can be sought, although this does not does not constitute a limitation.
L'adhésivité est mesurée en pratique par la résistance au pelage ou la résistance à l'arrachement, au moyen de procédures de test normalisées.Adhesiveness is measured in practice by peel strength or peel strength, using standard test procedures.
Selon une forme de réalisation du dit procédé, on dispose une plaquette de puces de circuits intégrés dans une orientation donnée sur un premier film adhésif pouvant être ensuite dégradé, par exemple sous l'effet de rayons U.V. , on sépare en option les puces individuelles de l'ensemble, notamment par sciage selon des techniques connues, on dégrade ledit premier adhésif jusqu'à un degré approprié, et on renverse les puces encore tenues par l'adhésif dégradé sur un second adhésif qui, après enlèvement du premier adhésif dégradé, retient seul lesdites puces, dans l'orientation voulue, et si on le souhaite on place lesdites puces selon une méthode classique sur ou dans leurs supports définitifs . On entend par "degré approprié" un degré de dégradation conférant au dit premier adhésif un facteur d'adhésivité inférieur à celui du dit second adhésif.According to one embodiment of said method, there is a wafer of integrated circuit chips in a given orientation on a first adhesive film which can then be degraded, for example under the effect of UV rays, the individual chips are optionally separated from the assembly, in particular by sawing according to known techniques, said first adhesive is degraded to an appropriate degree, and the chips still held by the degraded adhesive are overturned on a second adhesive which, after removal of the first degraded adhesive, retains only said chips, in the desired orientation, and if desired, said chips are placed according to a conventional method on or in their final supports. The term "appropriate degree" means a degree of degradation which gives said first adhesive a lower tack factor than that of said second adhesive.
En variante, on peut retourner le premier adhésif portant les puces avant de l'avoir soumis au processus de dégradation susdit, de telle sorte qu'il soit convenablement positionné sur une seconde matière plastique adhesive, tandis que ladite dégradation du premier adhésif est entreprise ensuite, de préférence de façon à ne concerner que le dit premier adhésif, et le premier adhésif ainsi dégradé est enlevé subséquemment, ce qui fait que le second adhésif retient seul lesdites puces, dans l'orientation voulue et permet αe les placer, si on le souhaite, selon une méthode classique sur leurs supports définitifs.Alternatively, the first adhesive bearing the chips can be turned over before having subjected it to the abovementioned degradation process, so that it is suitably positioned on a second adhesive plastic material, while said degradation of the first adhesive is then undertaken. , preferably so as to concern only the said first adhesive, and the first adhesive thus degraded is subsequently removed, which means that the second adhesive retains the said only chips, in the desired orientation and allows to place them, if desired, according to a conventional method on their final supports.
Selon une autre variante de réalisation du dit procédé, on peut déposer la seconde matière plastique adhesive en recouvrement sur la face supérieure des puces encore portées par la dite première matière plastique adhesive avec leur face active tournée vers le haut et, dans un ordre indifférent, procéder par en dessous à ladite désactivation du premier adhésif, retourner 1 ' ensemble de façon à ce que lesdites puces aient leur face active tournée vers le bas, et ôter le premier adhésif qui recouvre les faces des puces opposées à la face active. L'invention sera décrite ci-après, pour simplifier, en référence à des wafers et puces tels qu'indiqués plus haut, mais elle pourrait tout aussi bien être appliquée, avec seulement si nécessaire des adaptations appropriées à la portée de l'homme du métier, à tous autres types d'éléments petits et/ou légers, ainsi que le comprendra l'homme du métier à la lecture de la description qui suit, complétée par les dessins annexés.According to another alternative embodiment of the said method, the second adhesive plastic material can be deposited on the upper face of the chips still carried by the said first adhesive plastic material with their active face facing upwards and, in any order, proceed from below to said deactivation of the first adhesive, turn the assembly over so that said chips have their active face facing downwards, and remove the first adhesive which covers the faces of the chips opposite to the active face. The invention will be described below, for simplicity, with reference to wafers and chips as indicated above, but it could just as easily be applied, with only if necessary appropriate adaptations to the scope of the man of the profession, to all other types of small and / or light elements, as will be understood by those skilled in the art on reading the description which follows, supplemented by the appended drawings.
L'invention est décrite ci-après plus concrètement en référence aux dessins annexés, dans lesquels: Fig. 1 représente schématiquement , en vue en coupe transversale schématique, une plaque de matière plastique adhesive tenue dans un cadre et portant une microplaquette dont les éléments ont été séparés par sciage, conformément à la présente invention; Fig. 2 représente, en vue en coupe transversale schématique, la plaque selon la Fig. 1 après retournement et dépôt sur un second adhésif, face adhesive tournée vers les éléments susdits; etThe invention is described below more specifically with reference to the accompanying drawings, in which: FIG. 1 schematically shows, in schematic cross-sectional view, a plate of adhesive plastic material held in a frame and carrying a microchip, the elements of which have been separated by sawing, in accordance with the present invention; Fig. 2 represents, in a schematic cross-section view, the plate according to FIG. 1 after turning and depositing on a second adhesive, adhesive side facing the aforementioned elements; and
Fig. 3 représente, en vue en coupe transversale schématique, la plaque selon la Fig. 2 après enlèvement du premier adhésif dégradé. Dans le procédé selon la présente invention, des microplaquettes 1 sont placées sur une matière plastique ayant une face adhesive appropriée 2, apte à être dégradée, par exemple sous l'action d'un rayonnement U.V., avec les faces actives 3 des circuits des microplaquettes orientées à l'opposé de l'adhésif, c'est-à-dire en pratique vers le haut.Fig. 3 represents, in a schematic cross-section view, the plate according to FIG. 2 after removal of the first degraded adhesive. In the method according to the present invention, microchips 1 are placed on a plastic material having an appropriate adhesive face 2, capable of being degraded, for example under the action of UV radiation, with the active faces 3 of the circuits of the microchips. oriented opposite the adhesive, that is to say in practice upwards.
Dans la pratique, le premier adhésif 2 portant les plaquettes de circuits intégrés est avantageusement fixé en périphérie par sa propre force d'adhérence sur un cadre 4, de préférence un cadre métallique circulaire.In practice, the first adhesive 2 carrying the integrated circuit wafers is advantageously fixed at the periphery by its own adhesive force on a frame 4, preferably a circular metallic frame.
Les microplaquettes sont sciées afin d'isoler chaque microcircuit individuel ou puce 5 et on dégrade ensuite ledit premier adhésif, de façon à réduire la force d'adhérence entre les puces 5 et l'adhésif 2, sans pour autant annuler complètement l'effet d'adhérence. En pratique, il convient de conserver une action adhesive suffisante pour que l'ensemble puisse être retourné sans que les puces 5 se séparent du dit premier adhésif 2 sous l'effet de la gravité, avant leur fixation par leur face opposée sur un second adhésif 6.The microchips are sawn in order to isolate each individual microcircuit or chip 5 and said first adhesive is then degraded, so as to reduce the adhesion force between the chips 5 and the adhesive 2, without however completely canceling the effect d adhesion. In practice, a sufficient adhesive action should be retained so that the assembly can be turned over without the chips 5 separating from said first adhesive 2 under the effect of gravity, before their fixing by their opposite face on a second adhesive. 6.
On place ensuite l'ensemble des puces de circuits intégrés 5, tandis qu'elles adhérent encore au premier adhésif, face active vers le bas sur un second adhésif 6. On enlève par pelage l'adhésif 2 ayant une force d'adhérence dégradée et on dispose alors d'une bande portant des microcircuits face active vers le bas, qui peuvent être mis en oeuvre par des moyens connus traditionnels servant au placement et au report de circuits intégrés sur des supports convenant pour les applications auxquelles les microcircuits susdits sont destinés .The set of integrated circuit chips 5 is then placed, while they still adhere to the first adhesive, active face down on a second adhesive 6. The adhesive 2 having a degraded adhesion strength is removed by peeling and there is then a strip carrying microcircuits face down, which can be implemented by traditional known means used for placing and transferring integrated circuits on supports suitable for the applications for which the above microcircuits are intended.
L'invention a également pour objet un dispositif pour le retournement de microplaquettes de circuits intégrés, comprenant un film support avec adhésif 2 pour la fixation temporaire des dites microplaquettes 1, un système de retournement du dit film (non représenté) , des moyens pour la dégradation partielle du premier adhésif 2 et des moyens pour le positionnement d'un second adhésif 6 sur la face libre ou face active 3, avant ou après retournement, des dits circuits intégrés 5 encore tenus sur leur face opposée par ledit premier adhésif 2.The invention also relates to a device for turning over microchips of integrated circuits, comprising a support film with adhesive 2 for the temporary fixing of said microchips 1, a system for turning over said film (not shown), means for partially degrading the first adhesive 2 and means for positioning a second adhesive 6 on the free face or active face 3, before or after turning over, of said circuits integrated 5 still held on their opposite face by said first adhesive 2.
Les moyens pour la dégradation au moins partielle du premier adhésif sont de préférence constitués par un appareillage générateur de rayonnement U.V., dont l'activation pendant une durée et dans des conditions définies, après des tests d'étalonnage qui sont à la portée de l'homme du métier, permet d'obtenir la désactivation souhaitée et donc la réduction corollaire de l'adhésion aux puces portées par cet adhésif, ce qui a pour effet de faciliter l'éjection des dites puces.The means for at least partial degradation of the first adhesive preferably consist of an apparatus generating UV radiation, the activation of which for a period and under defined conditions, after calibration tests which are within the scope of the skilled in the art, allows to obtain the desired deactivation and therefore the corollary reduction in adhesion to the chips carried by this adhesive, which has the effect of facilitating the ejection of said chips.
Selon une forme de réalisation préférée, le second adhésif 6 mis en oeuvre selon l'invention est choisi de manière à prévenir tout endommagement des faces actives des puces lors de l'éjection de celles-ci, en particulier par une action de prévention contre l'impact des aiguilles utilisées classiquement pour l'éjection des dites puces dans la technique de report dite "flip chip". En variante, cette action de prévention contre les dommages peut être assurée par un film supplémentaire placé entre les aiguilles d'éjection et l'adhésif supportant les puces.According to a preferred embodiment, the second adhesive 6 used according to the invention is chosen so as to prevent any damage to the active faces of the chips during the ejection of the latter, in particular by a preventive action against the impact of needles conventionally used for ejecting said chips in the so-called "flip chip" transfer technique. Alternatively, this damage prevention action can be provided by an additional film placed between the ejection needles and the adhesive supporting the chips.
Il est également possible de conférer aux éjecteurs utilisés une extrémité faiblement arrondie ou même plate et/ou de répartir les éjecteurs de manière à assurer une répartition large de l'effort nécessaire à l'éjection des puces.It is also possible to give the ejectors used a slightly rounded or even flat end and / or to distribute the ejectors so as to ensure a wide distribution of the force necessary for the ejection of the chips.
En variante ou complémentairement , lesdits éjecteurs peuvent être réalisés en matière peu dure, telle que du Téflon ou tout autre polytétrafluoroéthylène, ou encore une autre matière plastique, qui peut constituer le matériau de l'aiguille éjectπce elle-même ou un revêtement de celle-ci.As a variant or in addition, said ejectors can be made of slightly hard material, such as Teflon or any other polytetrafluoroethylene, or even another material plastic, which may constitute the material of the needle ejectπce itself or a coating thereof.
Dans une forme de mise en oeuvre préférée du procédé selon l'invention, celui-ci comprend en outre une étape de visionnage opérant sous le support des puces de circuit intégré et permettant le repérage au travers du support du second adhésif 6 des éléments défectueux, préalablement marqués de façon visible, par exemple au moyen d'une encre d'identification, après accomplissement d'un test de défectuosité. Pour cela, il est avantageux que le support du second adhésif et ce dernier soient translucides.In a preferred embodiment of the method according to the invention, it further comprises a viewing step operating under the support of the integrated circuit chips and allowing the identification through the support of the second adhesive 6 of the defective elements, previously marked visibly, for example by means of an identification ink, after completion of a defect test. For this, it is advantageous for the support of the second adhesive and the latter to be translucent.
Pour améliorer encore la productivité du procédé et la qualité des résultats obtenus, en particulier si la cadence et la précision du placement des puces lors de leur report le nécessitent, on peut utiliser de tels moyens de visionnage lors d'un report test de quelques puces judicieusement choisies sur la plaquette de circuits intégrés individualisés, afin de réaliser un apprentissage par plaquette ou wafer scié. On peut ensuite poursuivre le report des autres composants du wafer sans reconnaissance particulière, ou en variante utiliser un système de vision simplifié, prenant en compte par exemple uniquement la périphérie des circuits intégrés concernés.To further improve the productivity of the process and the quality of the results obtained, in particular if the rate and the precision of the placement of the chips during their transfer require it, such viewing means can be used during a test transfer of a few chips judiciously chosen on the wafer of individualized integrated circuits, in order to carry out a learning by wafer or sawed wafer. We can then continue to carry over the other components of the wafer without special recognition, or alternatively use a simplified vision system, taking into account for example only the periphery of the integrated circuits concerned.
Plus généralement, le procédé et les moyens décrits ci -dessus peuvent tout aussi bien être employés pour le positionnement de tout objet de petite taille et/ou de faible poids, qui doit être orienté par rapport à un support ou de manière générale par rapport à une surface définie, après avoir été présenté sous une autre orientation ou avant d'être mis à disposition des utilisateurs pour lesquels une autre orientation est nécessaire . More generally, the method and the means described above can equally well be used for the positioning of any object of small size and / or light weight, which must be oriented with respect to a support or in general with respect to a defined surface, after having been presented in another orientation or before being made available to users for whom another orientation is necessary.

Claims

REVEND I C AT I ONSRESELL I C AT I ONS
1. Procédé pour le retournement de puces de circuits intégrés, caractérisé en ce qu'on dispose une plaquette (1) de puces (5) dans une orientation donnée sur un premier film adhésif (2) , on sépare en option les puces individuelles de l'ensemble et on renverse les puces (5) encore tenues par le premier adhésif sur un second adhésif (6) qui, après enlèvement du dit premier adhésif, retient lesdites puces dans l'orientation voulue, ledit second adhésif ayant un facteur d'adhésivité supérieur à celui du premier adhésif .1. A method for inverting integrated circuit chips, characterized in that there is a wafer (1) of chips (5) in a given orientation on a first adhesive film (2), the individual chips are optionally separated from the assembly and the chips (5) still held by the first adhesive are reversed onto a second adhesive (6) which, after removal of said first adhesive, retains said chips in the desired orientation, said second adhesive having a factor of higher adhesiveness than the first adhesive.
2. Procédé selon la revendication 1, caractérisé en ce qu'on dispose une plaquette (1) de puces (5) dans une orientation donnée sur un premier film adhésif (2) pouvant être ensuite dégradé, on sépare en option les éléments individuels de l'ensemble, on dégrade ledit premier adhésif (2) jusqu'à un degré approprié, et on renverse les puces (5) encore tenues par l'adhésif (2) dégradé sur un second adhésif (6) qui, après enlèvement du dit premier adhésif dégradé, retient seul lesdites puces (5), dans l'orientation voulue, et si on le souhaite on place lesdites puces selon une méthode classique sur ou dans leurs supports définitifs.2. Method according to claim 1, characterized in that there is a wafer (1) of chips (5) in a given orientation on a first adhesive film (2) which can then be degraded, the individual elements are optionally separated from the assembly, said first adhesive (2) is degraded to an appropriate degree, and the chips (5) still held by the degraded adhesive (2) are reversed on a second adhesive (6) which, after removal of said first degraded adhesive, retains only said chips (5), in the desired orientation, and if desired, said chips are placed according to a conventional method on or in their final supports.
3. Procédé selon la revendication 2, caractérisé en ce qu'on dégrade ledit premier adhésif sous l'effet de rayons U.V. 4. Procédé selon la revendication 2, caractérisé en ce qu'on retourne ledit premier adhésif portant les puces (5) avant de l'avoir soumis au processus de dégradation susdit, de telle sorte qu'il soit convenablement positionné sur une seconde matière plastique adhesive, tandis que ladite dégradation du premier adhésif est entreprise ensuite, de préférence de façon à ne concerner que le dit premier adhésif, et le premier adhésif ainsi dégradé est enlevé subséquemment.3. Method according to claim 2, characterized in that said first adhesive is degraded under the effect of UV rays 4. Method according to claim 2, characterized in that said first adhesive carrying the chips (5) is turned over to have subjected it to the abovementioned degradation process, so that it is suitably positioned on a second adhesive plastic material, while said degradation of the first adhesive is then undertaken, preferably so as to concern only the said first adhesive, and the first adhesive thus degraded is removed subsequently.
5. Procédé selon la revendication 2, caractérisé en ce qu'on dépose la seconde matière plastique adhesive5. Method according to claim 2, characterized in that the second adhesive plastic material is deposited
(5) en recouvrement sur la face supérieure des puces encore portées par la dite première matière plastique adhesive avec leur face active tournée vers le haut et, dans un ordre indifférent, on procède par en dessous à ladite desactivation du premier adhésif (2), on retourne l'ensemble de façon à ce que lesdites puces (5) aient leur face active (3) tournée vers le bas, et on ôte le premier adhésif (2) qui recouvre les faces des puces opposées à la face active (3) .(5) overlapping on the upper face of the chips still carried by said first adhesive plastic material with their active face facing upwards and, in an indifferent order, said deactivation of the first adhesive (2) is carried out from below, the assembly is turned over so that said chips (5) have their active face (3) facing down, and the first adhesive (2) is removed which covers the faces of the chips opposite to the active face (3) .
6. Procédé selon l'une quelconque des revendications 1 à 5, caractérisé en ce que ledit second adhésif présente un facteur d'adhésivité dans un rapport d'au moins 10:1 avec celui du premier adhésif. "" . Procédé selon la revendication 6, caractérisé en ce que ledit second adhésif présente un facteur d'adhésivité dans un rapport de 10:1 à 50:1 avec celui du premier adhésif.6. Method according to any one of claims 1 to 5, characterized in that said second adhesive has an adhesion factor in a ratio of at least 10: 1 with that of the first adhesive. " ". Method according to claim 6, characterized in that said second adhesive has an adhesion factor in a ratio of 10: 1 to 50: 1 with that of the first adhesive.
8. Dispositif pour le retournement de microplaquettes de circuits intégrés, caractérisé en ce qu'il comprend un film support avec adhésif (2) pour la fixation temporaire des dites microplaquettes (1), un système de retournement du dit film, des moyens pour la dégradation partielle du premier adhésif (2) et des moyens pour le positionnement d'un second adhésif (6) sur la face libre ou face active (3) , avant ou après retournement, des dits circuits intégrés (5) encore tenus sur leur face opposée par ledit premier adhésif (2) . 9. Dispositif selon la revendication 8, caractérisé en ce que les moyens pour la dégradation au moins partielle du premier adhésif sont constitués par un appareillage générateur de rayonnement U.V.8. Device for turning over microchips of integrated circuits, characterized in that it comprises a support film with adhesive (2) for the temporary fixing of said microchips (1), a system for turning over said film, means for partial degradation of the first adhesive (2) and of the means for positioning a second adhesive (6) on the free face or active face (3), before or after reversal, of said integrated circuits (5) still held on their face opposed by said first adhesive (2). 9. Device according to claim 8, characterized in that the means for degradation at least partial of the first adhesive consist of an apparatus generating UV radiation
10. Dispositif selon la revendication 8, caractérisé en ce que le second adhésif (6) assure une prévention contre 1 ' impact des aiguilles utilisées pour l'éjection des dits circuits intégrés ou puces dans la technique de report dite "flip chip".10. Device according to claim 8, characterized in that the second adhesive (6) provides prevention against the impact of the needles used for the ejection of said integrated circuits or chips in the so-called "flip chip" transfer technique.
11. Dispositif selon la revendication 10, caractérisé en ce qu'un film supplémentaire placé entre les aiguilles d'éjection et l'adhésif supportant les puces assure ladite action de prévention contre les dommages .11. Device according to claim 10, characterized in that an additional film placed between the ejection needles and the adhesive supporting the chips ensures said action of prevention against damage.
12. Utilisation du procédé selon l'une quelconque des revendications 1 à 7 pour le report avec basculement de puces de circuit intégré dans ou sur un module ou un corps de carte, caractérisé en ce qu'elle comprend la mise en oeuvre d' éjecteurs ayant une extrémité faiblement arrondie ou plate.12. Use of the method according to any one of claims 1 to 7 for the transfer with tilting of integrated circuit chips in or on a module or a card body, characterized in that it comprises the use of ejectors having a slightly rounded or flat end.
13. Utilisation selon la revendication 12, caractérisée en ce qu'elle comporte une étape de visionnage opérant sous le support des puces de circuit intégré pour permettre le repérage au travers du support du second adhésif 6 des éléments défectueux, préalablement marqués de façon visible après accomplissement d'un test de défectuosité.13. Use according to claim 12, characterized in that it comprises a viewing step operating under the support of integrated circuit chips to allow the identification through the support of the second adhesive 6 of the defective elements, previously marked visibly after completion of a defect test.
14. Utilisation selon la revendication 13, caractérisée en ce qu'elle comporte l'utilisation de tels moyens de visionnage lors d'un report test de quelques puces judicieusement choisies sur la plaquette de circuits intégrés individualisés, afin de réaliser un apprentissage par plaquette ou wafer scié et la poursuite du report des autres composants du wafer sans reconnaissance particulière ou avec un système de vision simplifié. 14. Use according to claim 13, characterized in that it includes the use of such viewing means during a test report of a few chips judiciously chosen on the wafer of individualized integrated circuits, in order to carry out learning by wafer or sawed wafer and continuing to carry over the other components of the wafer without special recognition or with a simplified vision system.
PCT/FR2000/002379 1999-09-10 2000-08-25 Method for transferring integrated circuit microchips and implementing device WO2001020659A1 (en)

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FR9911556A FR2798513B1 (en) 1999-09-10 1999-09-10 METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED
FR99/11556 1999-09-10

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