WO2000060645A3 - Dual cmp pad conditioner - Google Patents
Dual cmp pad conditioner Download PDFInfo
- Publication number
- WO2000060645A3 WO2000060645A3 PCT/US2000/008340 US0008340W WO0060645A3 WO 2000060645 A3 WO2000060645 A3 WO 2000060645A3 US 0008340 W US0008340 W US 0008340W WO 0060645 A3 WO0060645 A3 WO 0060645A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pad
- pad conditioner
- dispense
- cmp pad
- conditioning
- Prior art date
Links
- 230000009977 dual effect Effects 0.000 title 1
- 238000005498 polishing Methods 0.000 abstract 4
- 238000004140 cleaning Methods 0.000 abstract 2
- 230000003750 conditioning effect Effects 0.000 abstract 2
- 239000002002 slurry Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00919823A EP1190455A2 (en) | 1999-04-01 | 2000-03-29 | Dual cmp pad conditioner |
KR1020007013508A KR20010071353A (en) | 1999-04-01 | 2000-03-29 | Dual cmp pad conditioner |
JP2000610047A JP2002540972A (en) | 1999-04-01 | 2000-03-29 | Double CMP pad adjustment device |
AU40444/00A AU4044400A (en) | 1999-04-01 | 2000-03-29 | Dual cmp pad conditioner |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28371699A | 1999-04-01 | 1999-04-01 | |
US09/283,716 | 1999-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000060645A2 WO2000060645A2 (en) | 2000-10-12 |
WO2000060645A3 true WO2000060645A3 (en) | 2002-01-17 |
Family
ID=23087250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/008340 WO2000060645A2 (en) | 1999-04-01 | 2000-03-29 | Dual cmp pad conditioner |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1190455A2 (en) |
JP (1) | JP2002540972A (en) |
KR (1) | KR20010071353A (en) |
CN (1) | CN1362907A (en) |
AU (1) | AU4044400A (en) |
WO (1) | WO2000060645A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW495416B (en) * | 2000-10-24 | 2002-07-21 | Ebara Corp | Polishing apparatus |
KR20040004453A (en) * | 2000-11-29 | 2004-01-13 | 인피네온 테크놀로지스 아게 | Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers |
DE10308064B4 (en) * | 2003-02-26 | 2006-03-09 | Infineon Technologies Ag | Polishing agent supply in CMP processes |
US7125324B2 (en) * | 2004-03-09 | 2006-10-24 | 3M Innovative Properties Company | Insulated pad conditioner and method of using same |
CN102124545B (en) * | 2008-08-14 | 2013-11-06 | 应用材料公司 | Chemical mechanical polisher having movable slurry dispensers and method |
US20100041316A1 (en) * | 2008-08-14 | 2010-02-18 | Yulin Wang | Method for an improved chemical mechanical polishing system |
US20100291840A1 (en) * | 2009-05-12 | 2010-11-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for conditioning chemical mechanical polishing apparatus using multiple conditioning disks |
CN102554782A (en) * | 2010-12-20 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Polishing pad cleaning device and polishing pad finisher |
US8920214B2 (en) * | 2011-07-12 | 2014-12-30 | Chien-Min Sung | Dual dressing system for CMP pads and associated methods |
US9149906B2 (en) * | 2011-09-07 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for CMP pad conditioning |
CN103182681A (en) * | 2011-12-28 | 2013-07-03 | 青岛嘉星晶电科技股份有限公司 | Rectifying device for millstone of double-sided grinder, and rectifying method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421768A (en) * | 1993-06-30 | 1995-06-06 | Mitsubishi Materials Corporation | Abrasive cloth dresser |
US5683289A (en) * | 1996-06-26 | 1997-11-04 | Texas Instruments Incorporated | CMP polishing pad conditioning apparatus |
WO1998045090A1 (en) * | 1997-04-04 | 1998-10-15 | Obsidian, Inc. | Polishing media magazine for improved polishing |
-
2000
- 2000-03-29 KR KR1020007013508A patent/KR20010071353A/en not_active Application Discontinuation
- 2000-03-29 EP EP00919823A patent/EP1190455A2/en not_active Withdrawn
- 2000-03-29 WO PCT/US2000/008340 patent/WO2000060645A2/en not_active Application Discontinuation
- 2000-03-29 AU AU40444/00A patent/AU4044400A/en not_active Abandoned
- 2000-03-29 JP JP2000610047A patent/JP2002540972A/en active Pending
- 2000-03-29 CN CN00800898A patent/CN1362907A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421768A (en) * | 1993-06-30 | 1995-06-06 | Mitsubishi Materials Corporation | Abrasive cloth dresser |
US5683289A (en) * | 1996-06-26 | 1997-11-04 | Texas Instruments Incorporated | CMP polishing pad conditioning apparatus |
WO1998045090A1 (en) * | 1997-04-04 | 1998-10-15 | Obsidian, Inc. | Polishing media magazine for improved polishing |
Also Published As
Publication number | Publication date |
---|---|
JP2002540972A (en) | 2002-12-03 |
AU4044400A (en) | 2000-10-23 |
EP1190455A2 (en) | 2002-03-27 |
CN1362907A (en) | 2002-08-07 |
KR20010071353A (en) | 2001-07-28 |
WO2000060645A2 (en) | 2000-10-12 |
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