WO1999027540A1 - Dispositif de positionnement d'une plaquette - Google Patents
Dispositif de positionnement d'une plaquette Download PDFInfo
- Publication number
- WO1999027540A1 WO1999027540A1 PCT/JP1998/005274 JP9805274W WO9927540A1 WO 1999027540 A1 WO1999027540 A1 WO 1999027540A1 JP 9805274 W JP9805274 W JP 9805274W WO 9927540 A1 WO9927540 A1 WO 9927540A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stage
- actuator
- relative displacement
- magnetic
- sample
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70816—Bearings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/839—Mathematical algorithms, e.g. computer software, specifically adapted for modeling configurations or properties of nanostructure
Definitions
- the present invention relates to a stage positioning device, and more particularly to a stage positioning device capable of performing fine positioning suitable for mounting a sample such as a semiconductor manufacturing device inspection device.
- the sample In semiconductor manufacturing equipment, inspection equipment, etc., the sample is usually placed on an XY stage for processing and observation.
- the conventional XY stage on which a sample is placed is controlled by an actuator placed on the mounting table, for example, a servomotor via a ball screw, etc., and feedback control in the X or Y direction. It had been.
- a mechanism with mechanical friction was not always sufficient for high-speed and high-accuracy alignment.
- the reaction force at the time of table acceleration / deceleration excites the entire system at the natural frequency of the system, which has a problem that positioning is adversely affected. there were.
- a scan type stepper it is necessary to move the XY stage at high speed, with high precision, and smoothly.
- the vibration to be damped by these anti-vibration devices is limited to the vibration of the anti-vibration table. That is, for example, even if the semiconductor manufacturing apparatus is mounted on the table, the vibration of the beam itself for processing the sample cannot be suppressed in the semiconductor manufacturing apparatus. Therefore, when positioning in the submicron order is required, there is a problem in that the beam irradiation position, which is a processing point, is displaced by the vibration of the beam itself. Disclosure of the invention
- the present invention has been made in view of the above-mentioned circumstances, and has as its object to provide a stage positioning device capable of stably performing a fine positioning operation. It is another object of the present invention to provide a magnetic levitation stage that has a compact structure, has low leakage magnetic flux, and can be used in a vacuum environment.
- the stage positioning device of the present invention mounts a sample to be irradiated with a beam.
- a stage that floats and supports the stage in a non-contact manner and controls movement thereof; a first sensor that measures a relative displacement between the stage and the actuator; and an actual irradiation position of the beam on the sample.
- a second sensor for measuring a relative displacement with respect to a target irradiation position, and a controller for controlling the movement of the stage so as to reduce the relative displacement detected by the second sensor.
- the relative displacement between the actual irradiation position on the sample and the target irradiation position of the beam irradiated for processing or measuring the sample is measured, and the relative displacement is reduced.
- the beam can be accurately positioned at the target irradiation position.
- fine positioning operation can be performed with high accuracy in a semiconductor manufacturing apparatus or the like. This can have a favorable effect on, for example, the production yield of semiconductor products and the like.
- the magnetic levitation stage of the present invention may further include a levitation body including a table on which the sample is placed, a side plate hanging down from an outer periphery of the table, and a space surrounded by the table and the side plate.
- a fixed body provided with an actuator that floats and supports the floating body and controls the position of the floating body.
- the fixed body includes a permanent magnet that supports the weight of the floating body at substantially the center of the space, It is preferable that electromagnets for horizontal control of the levitation body are arranged at four corners on the outer periphery of the inside, and electromagnets for vertical control of the levitation body are arranged at an intermediate portion between the electromagnets.
- the actuator is arranged in the space surrounded by the table portion and the side plate hanging down from the outer periphery thereof, so that the magnetic levitation stage having an extremely compact structure is provided.
- the table surrounding the actuator and the side plate hanging down from the four circumferences of the table are covered with a shield material, and the lower end has a labyrinth structure. The magnetic flux can be greatly reduced.
- FIG. 1A is an elevation view of a stage positioning device according to one embodiment of the present invention
- FIG. 1B is a plan view of a stage positioning device according to one embodiment of the present invention
- FIG. 1C is the present invention.
- FIG. 2 is a partially enlarged view of a stage positioning device of one embodiment.
- FIG. 2 is a block diagram of a control system of the positioning device.
- FIG. 3 is a block diagram of a control system of the positioning device.
- FIG. 4 is a block diagram of a control system of the positioning device.
- FIG. 5 is a vertical sectional view of an actuator of the stage positioning device according to one embodiment of the present invention.
- FIG. 6 is an explanatory view showing a modification of FIG.
- FIG. 7 is a control block diagram of the cooling device of FIG.
- FIG. 8 is an explanatory diagram of a stage positioning device mounted on a high-performance vibration isolator.
- FIG. 9 is a layout view of a magnetic levitation stage according to another embodiment of the present invention as viewed from above.
- FIG. 10 is a side perspective view of the magnetic levitation stage.
- FIG. 11 is a cross-sectional side view of the magnetic levitation stage taken along line X-X.
- FIGS. 12A to 12C are explanatory diagrams of the passive type magnetic bearing using the permanent magnet in the above embodiment.
- FIG. 13 is an explanatory diagram of a control system of the magnetic levitation stage.
- FIG. 14 is an explanatory diagram of a magnetic shield having a labyrinth structure.
- FIG. 15 is an explanatory view of a magnetic shield having a labyrinth structure.
- Fig. 16A is a plan view of the electromagnet
- Fig. 16B is a longitudinal front view of the electromagnet
- Fig. 16C is a transverse side view of the electromagnet.
- FIG. 1A to 1C show a stage positioning device according to an embodiment of the present invention.
- a stage 11 on which a sample is placed is supported at its four corners by factor units 12a, 12b, 12c, and 12d.
- Actuators 12a, 12b, 12c, and 12d have control forces fx, fy, fz, f ⁇ , f] 3, f ⁇ in six degrees of freedom (X, Y, Z, ⁇ , ⁇ , ⁇ directions) in the translational and rotational directions. Occurs.
- a semiconductor wafer (sample) W to be processed or measured by the electron beam or the light beam ⁇ is placed on stage 11.
- a displacement sensor (first sensor) 13 that detects the position of the stage and outputs a signal of a relative displacement with respect to the actuator (fixed portion) is provided. Further, a controller 15 is provided for controlling the force generated by the actuator based on a relative displacement signal of the displacement sensor 13 and a relative displacement signal of an actual beam irradiation position and a target irradiation position, which will be described later.
- Each of the actuators 12a, 12b, 12c, and 12d is composed of an electromagnet or a combination of an electromagnet and a permanent magnet, and a magnetic material or a permanent magnet is mounted on the stage whose magnetic pole faces face each other. Therefore, by adjusting the exciting current of the electromagnet, a magnetic attraction force can be exerted on the stage, and the stage is supported while floating and moving / positioning is controlled. Electromagnet is used for levitation support control and horizontal direction control It is possible to generate a control force with six degrees of freedom in the X, ⁇ , ⁇ , ⁇ , jS, and ⁇ directions. In any of the actuators 12a, 12b, 12c, and 12d, by controlling the current or voltage supplied to the actuator, a control force having an extremely high-speed response is generated, and fine positioning control is possible.
- a sample W such as a semiconductor wafer for electron beam exposure is mounted on the stage 11.
- the sample W is coated with, for example, a resist for electron beam exposure, and a fine pattern is processed and formed by irradiation with the electron beam B. That is, the beam B is irradiated from the beam source 35 and is irradiated to a predetermined target position on the semiconductor wafer W to perform pattern processing.
- the stage 11 is moved and controlled by the actuators 12a, 12b, 12c, and 12d for positioning to the target irradiation position. In the manufacture of a semiconductor device having a line width of the order of submicrons, this alignment naturally requires a positioning accuracy of the order of submicrons or less.
- a sensor (second sensor) 36 for measuring a relative displacement between the actual irradiation position of the beam irradiated on the semiconductor wafer and the target irradiation position is provided.
- the following method is used for measuring the relative displacement as an example. That is, as shown in the enlarged view of FIG. 1C, a target pattern T indicating a target irradiation position is provided on a semiconductor wafer W, and the pattern T is made of a material that reflects a beam such as an electron beam.
- this pattern T is irradiated with the beam B
- the center Be of the beam B is aligned with the center Tc of the target pattern T.
- the amount of reflected beam is maximized, and by detecting the amount of reflected beam with the sensor 36, it is determined that the target irradiation position of the beam coincides with the actual irradiation position. 7
- the center Be of the beam B and the center Tc of the target pattern T are displaced, the amount of the reflected beam changes, and the change in the amount of the reflected beam causes the target irradiation position of the beam to be determined.
- the relative displacement from the actual irradiation position can be measured
- the relative displacement signal between the actual irradiation position of the beam B and the target irradiation position and the relative displacement signal with respect to the fixed side of the stage are input to the controller 15, and the actual irradiation position of the beam, the target irradiation position,
- the movement of the stage 11 is controlled by the actuator 12 so as to reduce the relative displacement of the sample c. That is, the actuators 12 are arranged so that the target pattern T of the sample W is directly positioned at the actual irradiation position of the beam B. C to drive 1 1
- the control system shown in FIG. 2 inputs the relative displacement signal Xr of the beam irradiation position of the second sensor, that is, the relative displacement between the actual irradiation position of the beam B and the target irradiation position as a reference signal,
- the actuator is operated via the controller 15 so that the relative displacement signal X of the stage position of the first sensor follows the signal. That is, the relative displacement signal Xr of the beam irradiation position is input to the comparator 16, the difference between the relative displacement signal Xr and the stage position displacement signal X is calculated, and the compensation signal (operation signal) is adjusted by the controller 15 so that the difference becomes zero. Formed, actiyue
- Plant 17 shows the relationship between the input signal to the actuator and the position X of the stage based on the operation result of the actuator.
- the position signal X of the stage driven by the actuator returns to the comparator 16. c That is, the controller 15, the relative displacement between the stage and Akuchiyueta the first control amount, the beam relative displacement between the actual irradiation position and the target irradiation position on the sample a second of Control variables, and these control variables are
- the stage operates in the opposite phase. Therefore, when the relative displacement signal Xr of the beam irradiation position is not input, the stage is always positioned at the reference position indicated by the relative displacement signal X with respect to the fixed portion.
- the actuator When the relative displacement signal Xr of the beam irradiation position is input, the actuator is actuated according to the signal, whereby the stage moves the relative displacement between the actual irradiation position of the beam B and the target irradiation position to zero and zero. It is positioned as follows. That is, the stage 11 operates so that the target irradiation position coincides with the actual irradiation position of the beam B.
- the control system shown in FIG. 3 relates to feed-feed control in which a relative displacement signal Xr of the beam irradiation position is input through a transfer function Q, and an actuator is operated so that the stage follows the position correction signal. That is, the control system shown in FIG. 3 uses the relative displacement signal Xr of the beam irradiation position of the second sensor, that is, the relative displacement between the actual irradiation position of the beam B and the target irradiation position as a reference signal, as a comparator. Input to the controller 16 and operate the actuator via the controller 15 so that the relative displacement signal X of the stage position of the first sensor follows the signal is similar to the control system shown in FIG.
- the relative displacement signal Xr of the beam irradiation position is input to the comparator 16, the difference from the stage position displacement signal X is calculated, and the compensation signal (operation signal) is made by the controller 15 so that this difference becomes zero. Is formed and supplied to the actuators 12a, 12b, 12c, and 12d. In this control system, a relative displacement signal Xr between the actual irradiation position of the beam B and the target irradiation position is obtained by a controller 15 via a transfer function Q. Output signal I Ri is added to the vessel 16a.
- This transfer function Q is given by the following relational expression as an example.
- controllable frequency band of controller H can be greatly extended, and control stability can be improved:
- Fig. 4 shows a method of converting a movement position correction signal based on a relative displacement signal between the actual irradiation position of the beam B at an arbitrary point and the target irradiation position into a movement position correction signal at each actuator position.
- the figure is shown.
- the movement position command value on the stage plane is given by arbitrary X and Y coordinates.
- actuators 12a, 12b, 12c, and 12d for moving the stage to the movement position command value are provided at the four corners of the stage as shown in the figure. Therefore, the position correction signal in each of the actuators 12a, 12b, 12c, and 12d must be converted from the moving position command value. For this reason, the movement position command value of an arbitrary point is converted into a position correction signal in each actuator using the coordinate conversion matrix.
- the controller H is configured to firstly perform a coordinate conversion of the relative displacement between the actual irradiation position of the beam on the sample and the target irradiation position into a relative displacement of the center of gravity of the stage, An operation unit for generating an operation amount with respect to the displacement, and an operation unit for distributing the generated operation amount to the operation amount at each operation point of the electromagnet are provided.
- the stage 11 may include a sensor for detecting vibration. Enter the acceleration due Ri detected sample W to the sensor to the controller one la H, the controller H by which c is controlled so by reducing this vibration, if the stage itself is vibrating, Stage The vibration of itself can be attenuated, and the actual irradiation position of the beam B and the target irradiation position The stage positioning operation can be made more reliable.
- the controller H includes a calculation unit that performs coordinate conversion of the acceleration into an acceleration at the position of the center of gravity of the stage 11, a calculation unit that generates an operation amount based on the converted coordinate acceleration, A computing unit for distributing the generated operation amount to the operation amount at each operation point of the electromagnet.
- FIG. 5 shows an example of the configuration of the electromagnetic actuator portion of the positioning device according to one embodiment of the present invention.
- the stage 11 on which the sample is placed is supported at its four corners by an electromagnetic actuator 12 having electromagnets 21 and 22.
- the magnetic stone 21 performs a horizontal positioning operation by applying a magnetic attraction to a magnetic body fixed to the opposing stage with an exciting current supplied from the controller to the coil.
- the electromagnet 22 levitates and supports the stage 11 in a non-contact manner by applying a magnetic attraction to the magnetic body 11 V fixed to the stage 11.
- vibration from the installation floor is cut off.
- a permanent magnet may be used in combination with the levitation support. As a result, the burden on the exciting current of the electromagnet can be reduced.
- a magnetic coating is provided on the lower surface of the stage 11 so that the leakage flux generated by the actuator itself does not leak to the upper part of the stage. 1a.
- a cover lib of a magnetic material having a labyrinth structure is provided so as to surround the actuators 12.
- a magnetic material coating or plate 19a is provided on the fixed surface 19 on the stage on which the actuator 12 is fixed so that the magnetic flux leaking from the labyrinth structure space does not go upward.
- the coil portion is surrounded by a can 20 so that the outer stage can be used in a vacuum without degassing.
- the entire actuator may be sealed with a can.
- FIG. 6 shows an example of an actuator cooling system using electromagnets.
- the actuators 12 in the figure are electromagnetic actuators of the awner type.
- the fixed side is arranged at the center and the floating body is arranged outside.
- a Peltier element (cylindrical) 25 is mounted inside the member (cylindrical) to which this coil is fixed, and cooling water flows inside the element.
- a passage 27 is provided.
- the outer side of the belch element 25 is the heat absorbing side, and the inner side is the heat generating side.
- a more stable cooling system is realized by detecting the temperature of the fixing member of the electromagnet by the temperature sensor 26 and controlling the current flowing through the Peltier element 25.
- FIG. 7 shows this temperature control system.
- the temperature detected by the temperature sensor 26 is compared with a temperature command value, and PID control is performed by the temperature controller 28 so that the difference is made zero.
- the output of the temperature controller 28 is current-amplified by the current amplifier 29 and supplied to the Belchu element 25, whereby the amount of heat transferred from the heat-absorbing side to the heat-generating side is controlled. Thereby, the temperature rise of each part of the actuator can be kept constant within a predetermined value range H.
- FIG. 8 shows an example of a device in which the stage positioning device of one embodiment of the present invention is mounted on a vibration isolator.
- Beam source 10 such as electron beam generator
- Beam source 10 is highly efficient It is placed on the vibration isolation table 31 of the active vibration isolation device 32 having a high vibration isolation performance.
- the stage 11 on which the sample W processed by the beam of the beam source 10 is mounted and the actuators 12a, 12b, 12c, 12d supporting this stage are also mounted on the table 31. With this configuration, the transmission of vibration from the outside to the stage 11, the actuators 12a, 12b, 12c, and 12d, the beam source, and 10 is almost eliminated, and more precise positioning control is enabled. I have.
- vibrations generated in the positioning device itself such as vibrations caused by the movement of the stage 11 are suppressed.
- a magnetic levitation vibration isolator in which a table is levitated and suspended in a non-contact manner by an electromagnetic actuator or a vibration isolator using both an air spring and an electromagnetic actuator is preferable.
- the above-described stage positioning operation between the actual irradiation position of the beam B and the target irradiation position is mainly used to correct a positioning error when a fine pattern is formed by beam irradiation.
- the controller H is controlled based on the signal of the first sensor that measures the relative displacement between the stage and the fixed side of the actuator. Feedback control is performed by PID operation to determine the position.
- the output of the signal Xr indicating the relative displacement between the actual irradiation position of the beam B and the target irradiation position is stopped, and for example, the input of the comparator 16 is set to zero.
- the second sensor for detecting the relative displacement between the actual irradiation position of the beam B and the target irradiation position may use the beam B itself actually used for processing, but the parallelism with the beam B is maintained.
- sauce and 'be used Yo Le, this case, the beam B is irradiated with the working portion of the sample, this parallel beam B' another beam B is that irradiates the target pattern T on the sample Then, the relative displacement is obtained.
- beam B itself is used for both processing and detection of relative displacement.
- the floating body F is provided with a plate 52 as a table on which a sample is placed at the center thereof, and a side plate 53 hanging down from four rounds of the plate, and has a box shape with an opening at the bottom.
- a fixed unit, Actuator A is placed inside the box-shaped table. That is, the actuator A has a permanent magnet 47 that constitutes one of the passive magnetic bearings that floats and holds the floating body F in a space surrounded by the flat plate 52 and the side plate 53 of the table.
- Electromagnets 41 and 42 that move the levitation body F in the vertical direction, and a displacement that detects the relative displacement between the pole faces of these electromagnets and the target fixed to the levitation body It has sensors 54 and so on.
- the target 45 receiving the magnetic force is fixed.
- Vertical (z) receiving a magnetic force of the electromagnet 4 3 for positioning the direction Target 4 6 are horizontally fixed on the inner surface side of the side plate 5 3 c.
- Actuator A is a magnetic device that supports the weight of the table at its approximate center in a space surrounded by a flat plate 52 of the table part constituting the levitating body F and side plates 53 hanging down from its four circumferences.
- Bearings 47 and 48 are arranged, and electromagnets 41 and 42 for moving the floating body F in the x and y directions are arranged at the four corners of the outer periphery of the space.
- An electromagnet 43 for moving the levitating body F in the vertical (z) direction is arranged in the middle of the electromagnets in the x and y directions. As a result, all parts including the coil of the electromagnet are arranged in the space surrounded by the flat plate 52 and the side plate 53 of the floating body F.
- the horizontal position control electromagnets 41 and 42 By arranging the horizontal position control electromagnets 41 and 42 at the four corners of the table, X-direction movement control, y-direction movement control, and rotation control around the z-axis can be easily performed.
- the vertical position control electromagnet 43 between the horizontal position control electromagnets 4 1 and 4 2, the z-axis movement control, the X-axis rotation, and the y-axis rotation control are performed. be able to.
- These controls use a high-precision position measurement sensor such as a capacitance sensor, compare the sensor output with a target value, and perform feed knock control on the excitation current of the electromagnet. Positioning control around six axes on the order of nanometers can be performed.
- the vertical control electromagnet 43 is composed of a pair of electromagnets, each of which has a magnetic pole surface in the vertical direction, and is arranged so that both magnetic pole surfaces face each other.
- the magnetic body 46 fixed to the floating body F is disposed between the magnetic pole faces so as to be interposed in the horizontal direction.
- the electromagnets for vertical direction control are arranged so that each has a magnetic pole surface in the vertical direction and both magnetic pole surfaces are located in opposite directions to each other, and both magnetic pole surfaces are respectively provided on the outer periphery of the floating body of the floating body. You may make it arrange
- Actuator A has magnetic bearings 47 and 48 for supporting the weight of the table at approximately the center of the space surrounded by the flat plate and the side plate of the table.
- the flat plate 52 is provided with a second side wall 53 a depending on a substantially central portion thereof.
- one surface of the side wall 5 3 a and one surface of the fixed side 5 1 A pair of permanent magnet rows 47, 48 is provided between them to form a passive magnetic bearing.
- permanent magnet rows 48 are provided at four locations on the side plate 5 3 a having a rectangular cross section, and four permanent magnet rows 4 7 are similarly provided on the surface of the fixed side 51 opposite thereto. Has been arranged.
- Fig. 48 as shown in Fig. 12A, permanent magnets magnetized to N and S poles are stacked in multiple stages so that their magnetization directions are reversed.
- the magnet arrays 47 and 48 are provided facing each other, one is fixed to the fixed-side actuator A, and the other is a side plate on the inner peripheral side of the floating body F.
- Figure 13 shows the control system for the magnetic levitation stage.
- the displacement sensors 54 that detect the displacement of the stage, three displacement sensors that detect the displacement of the horizontal stage and three sensors that detect the displacement of the vertical stage. Have been.
- the controller section in the figure may be an analog circuit or a digital circuit.
- a shield member 55 of high magnetic permeability such as a perm is attached to the outer surface, so that the leakage magnetic flux from the electromagnet and the permanent magnet is It cannot be leaked outside.
- the structure shown in Fig. 14 must be adopted to prevent the formation of a gap in this part and the generation of magnetic flux leakage. Is preferred. That is, the outer side of the fixed side is provided with side plates 51b and 51c made of a magnetic material that is doubled upright, and the lower end of the side plate 53 hanging down from the four circumferences of the table (plate 52) is formed. Arrange so as to be interposed between the fixed double side plates 51b and 51c.
- the labyrinth structure of the shield may be a three-layer structure as shown in FIG.
- the position control electromagnets 41 and 2 in the horizontal direction and the position control electromagnet 43 in the vertical direction have the same shape and dimensions, respectively. For this reason, the same standard product can be adopted, and a magnetic levitation stage can be economically constructed. Further, as shown in FIGS. 16A to 16C, each electromagnet coil C is loaded inside the magnetic pole, and its entrance is molded and sealed with a resin E such as epoxy. For this reason, the coil section Since the components are not exposed to the outside, the problem of degassing does not occur even if this device is placed in a high vacuum atmosphere, and the problem of impairing cleanliness does not occur.
- a resin E such as epoxy
- the present invention is extremely useful when used in a device for performing fine and high-speed positioning, such as a semiconductor manufacturing device.
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98954803A EP1071097A4 (en) | 1997-11-25 | 1998-11-24 | DEVICE FOR POSITIONING A PLATE |
US09/355,034 US6437864B1 (en) | 1997-11-25 | 1998-11-24 | Stage positioning device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9/339329 | 1997-11-25 | ||
JP33932997A JP3560053B2 (ja) | 1997-11-25 | 1997-11-25 | 磁気浮上ステージ |
JP9369519A JPH11194824A (ja) | 1997-12-26 | 1997-12-26 | ステージの位置決め装置 |
JP9/369519 | 1997-12-26 |
Publications (1)
Publication Number | Publication Date |
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WO1999027540A1 true WO1999027540A1 (fr) | 1999-06-03 |
Family
ID=26576389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1998/005274 WO1999027540A1 (fr) | 1997-11-25 | 1998-11-24 | Dispositif de positionnement d'une plaquette |
Country Status (4)
Country | Link |
---|---|
US (1) | US6437864B1 (ja) |
EP (1) | EP1071097A4 (ja) |
TW (1) | TW404089B (ja) |
WO (1) | WO1999027540A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3755862B2 (ja) * | 1999-05-26 | 2006-03-15 | キヤノン株式会社 | 同期位置制御装置および方法 |
NL1019237C2 (nl) * | 2001-10-25 | 2003-04-28 | Krapels Multi Alignment B V | Stelvoet voorzien van een voetstuk en een drager die ten opzichte van het voetstuk door middel van een hefmechanisme met ten minste een schroefdraad in hoogterichting instelbaar is. |
US6838967B2 (en) * | 2002-06-03 | 2005-01-04 | Michael Martin | Support surface that utilizes magnetic repulsive forces |
JP3826086B2 (ja) | 2002-08-29 | 2006-09-27 | キヤノン株式会社 | ステージ装置及びその駆動方法、露光装置並びにデバイス製造方法 |
EP1418017A3 (en) * | 2002-08-29 | 2008-12-24 | Canon Kabushiki Kaisha | Positioning apparatus, charged particle beam exposure apparatus, and semiconductor device manufacturing method |
JP4422957B2 (ja) * | 2002-10-31 | 2010-03-03 | キヤノン株式会社 | 位置決め装置 |
US7221463B2 (en) * | 2003-03-14 | 2007-05-22 | Canon Kabushiki Kaisha | Positioning apparatus, exposure apparatus, and method for producing device |
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- 1998-11-24 EP EP98954803A patent/EP1071097A4/en not_active Withdrawn
- 1998-11-24 TW TW087119429A patent/TW404089B/zh not_active IP Right Cessation
- 1998-11-24 US US09/355,034 patent/US6437864B1/en not_active Expired - Fee Related
- 1998-11-24 WO PCT/JP1998/005274 patent/WO1999027540A1/ja not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
---|---|
TW404089B (en) | 2000-09-01 |
US6437864B1 (en) | 2002-08-20 |
EP1071097A4 (en) | 2007-07-25 |
EP1071097A1 (en) | 2001-01-24 |
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