WO1999010186A1 - Image forming material, image forming method, lithographic printing plate manufacturing method and apparatus, lithographic printing plate making method, and printed wiring board manufacturing method - Google Patents

Image forming material, image forming method, lithographic printing plate manufacturing method and apparatus, lithographic printing plate making method, and printed wiring board manufacturing method Download PDF

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Publication number
WO1999010186A1
WO1999010186A1 PCT/JP1997/003819 JP9703819W WO9910186A1 WO 1999010186 A1 WO1999010186 A1 WO 1999010186A1 JP 9703819 W JP9703819 W JP 9703819W WO 9910186 A1 WO9910186 A1 WO 9910186A1
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WO
WIPO (PCT)
Prior art keywords
layer
heat
fine particle
printing plate
lithographic printing
Prior art date
Application number
PCT/JP1997/003819
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kenji Hyodo
Wakana Aizawa
Yuji Takagami
Kenji Tsuda
Original Assignee
Mitsubishi Paper Mills Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22626397A external-priority patent/JPH1165100A/ja
Priority claimed from JP22626297A external-priority patent/JPH1165099A/ja
Application filed by Mitsubishi Paper Mills Limited filed Critical Mitsubishi Paper Mills Limited
Priority to DE19781578T priority Critical patent/DE19781578C2/de
Publication of WO1999010186A1 publication Critical patent/WO1999010186A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/10—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme
    • B41C1/1008—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials
    • B41C1/1025—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials using materials comprising a polymeric matrix containing a polymeric particulate material, e.g. hydrophobic heat coalescing particles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/02—Positive working, i.e. the exposed (imaged) areas are removed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/04—Negative working, i.e. the non-exposed (non-imaged) areas are removed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/06—Developable by an alkaline solution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/22—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation characterised by organic non-macromolecular additives, e.g. dyes, UV-absorbers, plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/24—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation characterised by a macromolecular compound or binder obtained by reactions involving carbon-to-carbon unsaturated bonds, e.g. acrylics, vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Definitions

  • Image forming material Description Image forming material, image forming method, lithographic printing plate manufacturing method and manufacturing apparatus, lithographic printing plate making method, and printed wiring board manufacturing method
  • the present invention relates to an image forming material and an image forming method capable of easily and inexpensively obtaining an image having high resolution. Further, the present invention relates to a method and an apparatus for manufacturing a lithographic printing plate, a method for manufacturing a lithographic printing plate, and a method for manufacturing a printed wiring board using the image forming material and the image forming method.
  • lithographic printing plates are manufactured by providing a lipophilic ink-receiving layer on a substrate such as an aluminum plate, zinc plate, or paper whose surface has been hydrophilized.
  • a lithographic printing plate using a photosensitive material such as polymer is most common.
  • a circuit is formed of a conductive material such as copper on an insulating substrate.
  • a method for manufacturing such a printed wiring board is to provide a corrosion-resistant etching resist layer on a conductive layer of a laminate in which a conductive layer is laminated on an insulating substrate in advance, and to etch away the exposed conductive layer by etching. Active method, and an additive method in which a corrosion-resistant plating resist layer is provided on an insulating substrate, and then a conductive layer is formed on the exposed insulating substrate by metal plating or the like. .
  • a method using a photopolymer is generally used as a method for forming an etching resist layer or an applied resist layer.
  • an etching resist layer, or a plating resist layer (hereinafter referred to as an image layer) using a azo compound or a photopolymer
  • a substrate such as a metal plate, paper, a laminated plate, or an insulating substrate is formed on a substrate.
  • a photosensitive material such as a diazo compound or photopolymer.
  • the photosensitive material is irradiated with light to cause a chemical change, thereby changing the solubility in a developing solution.
  • Photosensitive materials are divided into two types depending on the type of chemical change. being classified.
  • the exposure method is one of the important factors that determine the resolution.
  • the mainstream has been to produce a film for exposure and then to perform a contact exposure method using ultraviolet light or white light.
  • laser direct writing methods that transmit digital signals from computer information to an exposure device (computer 'edge' plate) and directly expose the photosensitive material using a laser are used. It is like that.
  • This laser direct writing method has advantages such as low cost, high speed, and high productivity with many kinds and small lots.
  • the optical sensitivity of the photosensitive material In order to perform this laser direct writing method, the optical sensitivity of the photosensitive material must be increased.
  • Jiazo compound or follower Toporima to accompany the photochemical reaction, optical science sensitivity is low, a few to several hundred m J / cm 2. Therefore, the laser output device must have a high output, and there have been problems such as an increase in the size of the device and an increase in cost.
  • Photochemical reactions of diazo compounds and photopolymers also proceed under room light or sunlight. Also, reactivity changes even at high temperatures. In addition, the presence of oxygen is an inhibitor of the reaction. Therefore, the photosensitive material has a drawback that the preservation before the exposure step, the application step to the substrate, and the like must be performed in the dark or under a safety light or under a low oxygen concentration.
  • an aqueous dispersion paint containing a coloring agent and a particulate resin having a hydrophilic surface and a hydrophobic inside is applied to a supporting substrate, The coating is formed by drying while maintaining the particle morphology of the particle layer, and then the fine particle layer corresponding to the image is heated to lose the particle morphology, and is fixed together with the colorant on the supporting substrate, and the image is formed. Is not formed An image forming method of separating with an alkaline aqueous solution is disclosed.
  • Japanese Patent Application Laid-Open No. 9-117129 / 49 discloses an image forming layer on a hydrophilic surface of a lithographic base, the image forming layer comprising hydrophobic thermoplastic polymer particles dispersed in a hydrophilic binder.
  • a method for making a lithographic printing plate is disclosed in which imagewise exposure is performed, followed by development using fresh water or an aqueous liquid, and further heating the imaged image forming layer.
  • the hydrophobic thermoplastic polymer particles in the hydrophilic binder are melted by exposure and become insoluble in fresh water or aqueous liquid.
  • it in order to exhibit insolubility, it must contain many hydrophobic thermoplastic polymer fine particles. If the amount of the hydrophobic thermoplastic polymer particles is too large, there is a problem that the amount of the hydrophilic binder is too small to completely remove the unnecessary image forming layer in the non-image area.
  • the problem that the image area is not completely covered by the hydrophobic part, in which case pinholes and the like are generated. There was also. In particular, such a problem is likely to occur in a solid portion (large-area image portion).
  • the resolution of an image is determined by the melting of the fine particles.
  • the hydrophilic binder is contained in the fine particle layer, the resolution is reduced unlike the case where the image layer is formed only with the fine particle layer. There was a disadvantage.
  • a coating liquid for forming an image forming layer is an aqueous dispersion using water as a medium. is there.
  • the medium In order for the medium to evaporate after application, work must be performed at low temperatures so that the particulate layer does not melt. The disadvantage was that it took a long time to remove water at low temperatures.
  • An object of the present invention is to provide an image capable of easily and inexpensively obtaining an image having high resolution and reliability in a lithographic printing plate and printed wiring board manufacturing technology, and capable of responding to a laser direct drawing method.
  • An object of the present invention is to provide a forming material and an image forming method. Further, it is intended to provide a method and an apparatus for manufacturing a lithographic printing plate, a method for making a lithographic printing plate, and a method for manufacturing a printed wiring board using the image forming material and the image forming method.
  • An image-forming material comprising a heat-fusible fine particle layer provided on a substrate.
  • thermofusible fine particle layer contains a light absorber
  • the substrate is a printing plate support, the alkali-soluble resin layer is formed by electrodeposition, the heat-meltable fine particle layer is formed by electrodeposition, and the heat-meltable fine particle layer is formed by laser.
  • the substrate is a support for the manufacture of printed wiring boards, the resin layer is formed by electrodeposition, and the layer of heat-meltable fine particles is fused and fixed by laser. (4) or (8) ).
  • the base material is a support for manufacturing a printed wiring board, the alkali-soluble resin layer is formed by an electrodeposition method, the heat-meltable fine particle layer is formed by an electrodeposition method, and the heat-meltable fine particles are formed.
  • a method for producing a lithographic printing plate comprising: applying a coating liquid containing fine particles; evaporating the dispersion medium at an ambient temperature equal to or lower than the softening point of the heat-meltable fine particles to form the heat-meltable fine particle layer in a layered form.
  • the coating liquid is heat-fusible fine particles having a charge dispersed in a dispersion medium having a high electrical resistivity, and the heat-fusible fine particles are applied on a photosensitive lithographic printing plate before image exposure by an electrodeposition method.
  • a coating liquid containing a dispersion medium and heat-meltable fine particles is applied, and the dispersion medium is evaporated at an ambient temperature equal to or lower than the softening point of the heat-meltable fine particles to form the heat-meltable fine particles in a layer.
  • a lithographic printing plate manufacturing apparatus comprising: means for supplying a fine particle-containing coating liquid; means for applying a voltage from the electrode to the lithographic printing plate; and means for squeezing excess coating liquid downstream of the electrode.
  • the means for squeezing the excess coating liquid is a squeezing roll pair, and means for blowing gas toward a gap formed between the squeezing roll pair and an end of the photosensitive lithographic printing plate.
  • heat-fusible fine particles are provided in a layer on the photosensitive layer of the photosensitive lithographic printing plate, and the heat-fusible fine particle layer in a portion to be an image is heated and melted and fixed on the photosensitive lithographic printing plate;
  • a plate making method of a lithographic printing plate for eluting and removing a non-image portion is provided.
  • the photosensitive lithographic printing plate is of a negative type, and the plate surface is irradiated with ultraviolet light after removing the non-image portion, and the non-image portion of the photosensitive lithographic printing plate is eluted and removed, followed by a burning treatment.
  • the photosensitive lithographic printing plate is of a positive type, and the plate surface is irradiated with ultraviolet light before the hot-melt fine particle layer is provided, and after the non-image portion of the photosensitive lithographic printing plate is eluted and removed.
  • a method for manufacturing a printed wiring board comprising the steps of: providing a resist layer; etching away the attached conductive layer and the conductive layer that are not covered with the etching resist layer; and removing the remaining etching resist layer as the case may be.
  • a method for manufacturing a printed wiring board wherein an etching resist layer is formed by removing a fine particle layer and a soluble dry film.
  • thermofusible fine particle layer is fused and fixed by a laser.
  • FIG. 1 is a conceptual diagram illustrating an example of the image forming material of the present invention.
  • FIG. 2 is a conceptual diagram illustrating an example of the image forming method of the present invention.
  • 3A, 3B and 3C are conceptual diagrams showing an example of the image forming material of the present invention.
  • 4A, 48 and 4 are conceptual diagrams illustrating an example of the image forming method of the present invention.
  • FIG. 5 is a conceptual diagram illustrating an example of the image forming method of the present invention.
  • FIG. 6 is a conceptual diagram illustrating an example of the image forming method of the present invention.
  • FIG. 7 is a conceptual diagram illustrating an example of the image forming method of the present invention.
  • 8A, 8B, 8 and 80 are conceptual diagrams showing a method of forming an etching resist layer according to the method of manufacturing a printed wiring board of the present invention.
  • 9A, 9B, 9C, and 9D are conceptual diagrams illustrating a method of forming an etching resist layer according to the method of manufacturing a printed wiring board of the present invention.
  • FIG. 10 is a schematic side sectional view showing an example of the lithographic printing plate manufacturing apparatus of the present invention.
  • 11A, 11B, 11C, 11D, 11E, and 11F are schematic diagrams of a method of manufacturing a printed wiring board having through holes by a subtractive method. In these figures, each symbol indicates the following.
  • the image-forming material (1) of the present invention comprises a heat-fusible fine particle layer provided on a substrate.
  • the portion of the image forming material (1) according to the present invention which is to be an image is heated and melted and fixed on the surface of the substrate.
  • the image forming method (3) of the present invention when the corresponding portion is heated in accordance with a desired image on the heat-meltable fine particle layer, the fine particles of the heat-meltable fine particle layer are melted and bonded to each other to form a film structure. Is formed, and the adhesiveness to the substrate is significantly improved. For this reason, the presence or absence of this heat fixing causes a difference in the adhesive strength to the substrate surface.
  • a printing plate support is used as a base material and the image forming material of the present invention on which an image is formed by the image forming method of the present invention is mounted on a lithographic printing machine and printing is started, the material is heated and fixed.
  • the melt-fixed part receives the ink and becomes an image area, and in the part that is not heated, the heat-fusible fine particle layer has a weak adhesion to the substrate surface, so it is immediately separated and removed, and the hydrophilic surface of the substrate Is exposed and becomes a non-image area of ink non-reception (water reception), and lithographic printing becomes possible.
  • a liquid developer and its device are heated and fixed according to a desired image, for example, by thermal printing head-laser exposure. It is possible to easily produce an image layer without using any kind.
  • the image forming material (2) of the present invention has an alkali-soluble resin layer and a heat-meltable fine particle layer in this order on a substrate.
  • the heat-fusible fine particle layer corresponding to the image portion of the image forming material having such a structure is melt-fixed and bonded to each other and to the alkali-soluble resin layer. Allow the structure to form.
  • an image is formed on the substrate by removing the heat-fusible fine particle layer corresponding to the non-image portion and the layer that has not been melt-fixed and the soluble layer using an alkaline solution.
  • the image forming method (4) of the present invention when the relevant portion is heated in accordance with a desired image on the heat-meltable fine particle layer, the fine particles of the heat-meltable fine particle layer are fused and bonded to each other to form a film structure. Is formed, and the image portion develops resistance to the alkaline solution. In the non-image area where the heat-fusible fine particle layer is not fused and fixed, the heat-fusible fine particle layer In this state, the alkaline liquid easily permeates, dissolves the lower alkali-soluble resin layer, and can be removed together with the heat-meltable fine particles.
  • the image forming materials (1) and (2) of the present invention are very stable against oxygen, sunlight and room light. Therefore, it can be stored in a bright room or under oxygen. Further, the image forming methods (3) and (4) can be performed in a bright room.
  • the heat-meltable fine particle layer corresponding to the image area can be melt-fixed by laser exposure to obtain an image with extremely high resolution. be able to. Therefore, a laser direct drawing method corresponding to a computer 'head' plate can be performed, and high productivity can be obtained.
  • the image-forming material (1) and the heat-meltable fine particle layer according to the image-forming method (3) of the present invention, and the image-forming material (2) and the image of the present invention By including a light absorber in at least one of the alkali-soluble resin layer and the heat-meltable fine particle layer in the formation method (4), energy can be efficiently used for fusing and fixing heat and light. It becomes possible to absorb. Therefore, for example, when fusing and fixing with a laser, a low output laser can be used, and the equipment cost / operating cost can be reduced.
  • the image forming materials (1) and (2) and the image forming methods (3) and (4) of the present invention can be used in the field of printing and in the field of manufacturing printed wiring boards.
  • a lithographic printing plate is produced by forming a layer of heat-meltable fine particles on a photosensitive lithographic printing plate.
  • the heat corresponding to the image portion of the heat-meltable fine particle layer provided on the surface of the photosensitive lithographic printing plate before image exposure is provided.
  • the fusible fine particle layer is melt-fixed and bound to each other and the alkali-soluble resin layer to form a film structure.
  • an image is formed on the substrate by eluting and removing the non-fused hot-melt fine particle layer corresponding to the non-image portion and the photosensitive layer of the photosensitive lithographic printing plate therebelow.
  • a commercially available photosensitive lithographic printing plate (PS plate) is provided with a heat-fusible fine particle layer containing a light absorbing agent.
  • the heat-fusible fine particle layer can be melt-fixed by a laser, and an image with extremely high resolution can be obtained. Therefore, PT /
  • the dispersion medium is evaporated at an ambient temperature equal to or lower than the softening point of the heat-meltable fine particles, so that the heat-meltable fine particles are not fused and fixed. It can be fixed in layers on the lithographic printing plate surface. For this reason, it is possible to prevent the non-image portion from fusing and fixing to become a capri.
  • the coating liquid according to the method (22) for producing a lithographic printing plate according to the present invention comprises a hot melt having a charge dispersed in a dispersion medium having a high electrical resistivity.
  • the heat-fusible fine particles in the coating liquid by selectively applying the heat-fusible fine particles in the coating solution to the photosensitive lithographic printing plate before image exposure by electrodeposition. Therefore, the heat-meltable fine particle layer can be formed more efficiently.
  • the heat-fusible fine particle layer can be efficiently and uniformly fixed to the surface of the planographic printing plate in a layered manner.
  • Means for squeezing excess coating liquid include, for example, a roll pair, an air knife that blows air over the entire width of a lithographic printing plate, and a corona discharge.
  • the squeezed liquid by a roll pair consisting of is preferred because it can be squeezed efficiently and stably for a long period of time. More preferably, it is a roll pair having nitrile butadiene rubber (NBR) on the surface in a rubber hardness range of 20 to 70 degrees.
  • NBR nitrile butadiene rubber
  • the means for squeezing excess coating liquid is a squeezing roll pair, and a gap formed between the squeezing roll pair and an end of the photosensitive lithographic printing plate.
  • the apparatus for manufacturing a lithographic printing plate of the present invention (26) has a means for adsorbing and transporting the back surface of the photosensitive lithographic printing plate downstream of the pair of squeezing rolls, so that the formed fusible fine particle layer is brought into contact with It is possible to carry to the next step without performing. Therefore, it is possible to prevent destruction of the heat-meltable fine particle layer due to transportation.
  • a dispersion medium evaporation promoting means is provided downstream of the squeezing roll pair, so that the dispersion medium is continuously formed with the heat-meltable fine particle layer. Can be evaporated, so that the time required for producing a lithographic printing plate can be reduced.
  • the method of making a lithographic printing plate (29) of the present invention is characterized in that the photosensitive lithographic printing plate is a negative type.
  • the image area is polymerized and hardened by irradiating the plate surface with ultraviolet light after removing the non-image area, and the printing durability is further improved. be able to.
  • the light absorbing agent contained in the heat-meltable fine particle layer has an absorption maximum near the near-infrared region (600 nm to 1200 nm), and has a maximum absorption at a wavelength less than 600 nm.
  • the image portion can more efficiently absorb ultraviolet light, especially when the photosensitive lithographic printing plate is a negative type.
  • the photosensitive lithographic printing plate is of a positive type.
  • irradiating the plate surface with ultraviolet light before providing the heat-meltable fine particle layer improves the solubility, so that the heat-meltable fine particle layer is heated.
  • the non-image area can be easily eluted after fixing.
  • the method of making a lithographic printing plate according to any of (29) to (31) according to the present invention comprises the steps of: Burning is performed after elution and removal of the image part.
  • the binding process crosslinks the binder resin in the image area of the photosensitive lithographic printing plate, forms a stronger film, and further improves printing performance such as printing durability.
  • both the heat-meltable fine particle layer and the alkali-soluble resin layer used for forming the etching resist layer are exposed to oxygen, sunlight, and room light. It is very stable. Therefore, it can be stored in a bright room or in the presence of oxygen. Also, the image forming step can be performed in a bright room.
  • the alkali-soluble dry film and the heat-meltable fine particle layer in the printed wiring board manufacturing method (38) of the present invention also have the same properties.
  • the heat-fusible fine particle layer Alternatively, the alkali-soluble resin layer contains a light absorber.
  • the heat-meltable fine particle layer or the alkali-soluble dry film contains a light absorber. Therefore, it becomes possible to efficiently absorb energy such as heat and light for fusing and fixing the heat-meltable fine particle layer in a portion corresponding to the wiring portion. Therefore, it is possible to reduce the cost, work cost, and the like of the device that provides this energy.
  • the portion of the heat-meltable fine particle layer corresponding to the roto-roof portion is fused and fixed by a laser to provide an etching resist having a very high resolution. Layers can be obtained. In addition, high productivity can be obtained by using a laser direct writing method compatible with computer boards.
  • the electrodeposition method is used as a method for applying a photopolymer in the manufacture of some printed wiring boards, such as painting automobiles.
  • the electrodeposition method has good followability to the substrate to be coated, and can uniformly form the thickness of the soluble resin layer regardless of the shape of the substrate to be coated. Also, there are very few defects such as pinholes.
  • the image forming method of the present invention (12), (13), (17), (21), the method of manufacturing a lithographic printing plate of the present invention (23), and the method of manufacturing a printed wiring board (44)
  • the heat-meltable fine particle layer is formed by the electrodeposition method, but a uniform thin film with few defects can be obtained in the same manner as described above.
  • FIG. 1 is a schematic view showing an example of the image forming material (1) of the present invention.
  • the image forming material (1) of the present invention has a structure in which a heat fusible fine particle layer 1 is provided on a substrate 10.
  • T thermoelectric
  • FIG. 2 is a schematic view showing an example of the image forming material (2) of the present invention.
  • the image forming material (2) of the present invention has a structure in which a resin layer 2 and a thermofusible fine particle layer 1 are sequentially formed on a substrate 10.
  • FIG. 3 is a schematic view showing an example of the image forming method (3) of the present invention.
  • the image forming method (3) of the present invention first, the heat fusible fine particle layer 1 is provided on the substrate 10 (FIG. 3A). Next, the portion of the heat-meltable fine particle layer 1 corresponding to the image area is melt-fixed to form a melt-fixing layer 3 (FIG. 3B).
  • FIG. 4 is a schematic diagram illustrating an example of the image forming method (4) of the present invention.
  • the image forming method of the present invention first, a portion corresponding to an image portion of an image forming material (FIG. 4A) having an alkali-soluble resin layer 2 and a heat-fusible fine particle layer 1 on a substrate 10 in this order.
  • the heat-fusible fine particle layer 1 is fused and fixed to form a fusion-fixed layer 3 (FIG. 4B).
  • the non-image portion of the heat-meltable fine particle layer 1 and the resin layer 2 are removed with an alkaline solution (FIG. 4C).
  • the heat-fusible fine particle layer 1 in the non-image area which is not fused and fixed, is in a very sparse state, so that the alkali liquid can easily penetrate and can be removed together with the underlying alkali-soluble resin layer 2 It is.
  • An image is formed with the fusion fixing layer 3 and the alkali-soluble resin layer 2 remaining on the substrate 10 (FIG. 4).
  • the base material 10 having a surface on which a fusion-fixing layer 3 corresponding to an image area and a heat-fusible fine particle layer 1 corresponding to a non-image area obtained by the image forming method (3) of the present invention,
  • the layer 1 is in a sparse state and has poor adhesion to the substrate 10 as compared with the fusion-fixing layer 3. Therefore, when printing is performed using a printing plate support as the substrate 10 and printing is performed as a printing plate, the thermally fusible fine particle layer 1 having poor adhesion is removed at the initial stage of printing, and the substrate 10 The surface will be exposed (Figure 3C). In this manner, a form in which the fusion fixing layer 3 which is the lipophilic ink receiving layer is formed on the base material having the hydrophilic surface, and printing is possible.
  • FIG. 5 to 7 are schematic views showing an example of the method (29) of making a lithographic printing plate according to the present invention.
  • the heat-meltable fine particle layer 1 is provided on the photosensitive layer 11 of the photosensitive lithographic printing plate (PS plate) 13 (FIG. 5).
  • the heat-fusible fine particle layer 1 at the portion corresponding to the image area is melted and fixed by heating to form a melt-fixed layer 3 (FIG. 6).
  • the photosensitive layer 11 of the photosensitive lithographic printing plate is removed together with the heat-fusible fine particle layer 1 in the non-image area using a treatment solution capable of eluting and removing (FIG. 7).
  • FIG. 11 is a schematic diagram showing a general method of manufacturing a printed rookie board having through holes by a subtractive method.
  • a through-hole 23 is formed in a laminated board 20 (FIG. 11A) provided with a conductive layer 22 on at least one surface of an insulating substrate 21 (see FIG.
  • the conductive layer 24 is formed on the surface of the laminated layer 20 including the inside of the through hole 23 (FIG. 11C).
  • an etching resist layer 25 corresponding to the wiring portion is provided (FIG. 11D), and the plating conductive layer 24 and the conductive layer 22 not covered with the etching resist layer 25 are etched and removed (see FIG. 11D).
  • FIG. 8 is a conceptual diagram showing a method of forming an etching resist layer in the method (37) of manufacturing a printed wiring board of the present invention.
  • the hot-melt fine particle layer 1 and the non-wiring soluble resin layer 2 in the non-wiring portion are removed with an alkaline liquid (FIG. 8D).
  • the heat-fusible fine particle layer 1 that has not been fused and fixed is in a very sparse state, so that the liquid can easily penetrate, and can be removed together with the lower layer of the soluble resin layer 2. It is possible.
  • the remaining melt-fixing layer 3, alkali-soluble resin layer 2, and filling ink 5 are used as an etching resist layer 25a.
  • FIG. 9 is a conceptual diagram showing a method of forming an etching resist layer in the method (38) of manufacturing a printed wiring board of the present invention.
  • the alkali-soluble dry film 4 is attached to the laminate (Fig. 11C) (Fig. 9 A)
  • the heat-meltable fine particle layer 1 is formed on the soluble dry film 4 (FIG. 9B), and the heat-meltable fine particle layer 1 corresponding to the wiring portion is melt-fixed. (Fig. 9C).
  • the heat-fusible fine particle layer 1 and the non-wiring soluble dry film 4 at the non-wiring portion are removed with an alkaline solution (FIG. 9D).
  • the remaining resist layer 3 and the alkali-soluble dry film 4 are used as an etching resist layer 25b.
  • the heat-fusible fine particle layer according to the image forming material, the image forming method, the lithographic printing plate manufacturing method and manufacturing apparatus, the lithographic printing plate plate making method, and the printed wiring board manufacturing method of the present invention is a fine particle layer at normal temperature. It has the property of forming a dense film structure by fusing and fixing.
  • the material forming such heat-fusible fine particles include (meth) acrylic resin, vinyl acetate resin, polyethylene resin, polypropylene resin, polybutadiene resin, vinyl chloride resin, vinyl acetal resin, vinylidene chloride resin, styrene resin, and polyester.
  • Examples include resin, polyamide resin, phenol resin, xylene resin, alkyd resin, gelatin, cellulose, wax, and the like.
  • the image forming material, the image forming method, the lithographic printing plate manufacturing method and manufacturing apparatus of the present invention, the lithographic printing plate plate making method, and the method for forming a heat-fusible fine particle layer according to the method for manufacturing a printed wiring board include at least:
  • the hot-melt fine particles are dispersed in an appropriate dispersion medium, and are dipped, spin-coated, bar-coated, white-coated, roll-coated, spray-coated, force-coated, air-knife-coated, It can be formed by using a coating method such as a blade coating method and an electrodeposition method.
  • the electrodeposition method has good adherence to base materials, alkali-soluble resin layers, photosensitive lithographic printing plates, alkali-soluble dry films, etc., good adhesion, and very few defects such as pinholes. Further, since a thin film to which the heat-fusible fine particles are uniformly attached can be obtained, it can be used most advantageously. Further, even when the concentration of the heat-meltable fine particle dispersion is low, the heat-meltable fine particle layer can be efficiently formed.
  • the image forming material, the image forming method, the lithographic printing plate manufacturing method and manufacturing apparatus, the lithographic printing plate plate making method, and the method for forming a heat-fusible fine particle layer according to the method of manufacturing a printed wiring board according to the present invention include: As a liquid that does not dissolve Water, linear, branched or cyclic hydrocarbons, their halogen-substituted products, silicone oils, and the like.
  • a material having a high electric resistivity is preferable, and a material having a low dielectric constant is preferable.
  • the dispersion medium that can be used in the electrodeposition method include aliphatic hydrocarbons.
  • a low-fraction aliphatic hydrocarbon In order to quickly remove the dispersion medium after the formation of the heat-fusible fine particle layer, it is more preferable to use a low-fraction aliphatic hydrocarbon.
  • Examples of commercially available products include Shellsol 71 (manufactured by Shell Petroleum), Biopar G, Biopar H and Biopar L (manufactured by Exxon Chemical), and IP Solvent IP_1620 (manufactured by Idemitsu Petroleum).
  • hydrocarbon-based petroleum solvents having a low vapor pressure and hydrocarbons having a high molecular weight can be used.
  • the heat-meltable fine particle layer according to the image forming material, the image forming method, the lithographic printing plate manufacturing method and manufacturing apparatus, the lithographic printing plate making method, and the printed wiring board manufacturing method of the present invention is formed by an electrodeposition method.
  • a charge control agent is contained in the heat-fusible fine particle layer dispersion in order to keep the heat-fusible fine particle layer charged.
  • the charge control agent include metal salts of fatty acids such as naphthenic acid, octenoic acid, and oleic acid, metal salts of sulfosuccinate esters, metal salts of oil-soluble sulfonic acids, metal salts of phosphoric acid esters, and aromatic carboxylic acids.
  • the heat-meltable fine particle layer according to the image forming material, the image forming method, the lithographic printing plate manufacturing method and manufacturing apparatus, the lithographic printing plate making method, and the printed wiring board manufacturing method of the present invention is formed by an electrodeposition method.
  • a commercially available toner (wet developer) for an electrophotographic lithographic printing plate can be used.
  • the above-mentioned heat-meltable fine particle layer, dispersion medium, charge control agent, dispersant, dispersion stabilizer and the like are prepared in advance and can be used easily.
  • the method for forming a heat-meltable fine particle layer according to the image forming material, the image forming method, the lithographic printing plate manufacturing method and the manufacturing apparatus, the lithographic printing plate making method, and the printed wiring board manufacturing method of the present invention To disperse the conductive fine particles in the dispersion medium, use a mechanical or ultrasonic disperser or stirrer such as an agitator, ball mill, homogenizer, etc. Can be used. At this time, a dispersion stabilizer and a dispersant such as a surfactant and a resin soluble in a dispersion medium can be used.
  • the dispersing medium-soluble resin When a dispersing medium-soluble resin is used as the dispersing (stabilizing) agent, the dispersing medium-soluble resin is contained in the heat-meltable fine particle layer.
  • the content of the dispersing medium-soluble resin is increased, the resin acts as a binder and may reduce image resolution. Therefore, the content of the dispersing medium-soluble resin is preferably 0.1 to 30% by weight based on the weight of the heat-meltable fine particles.
  • the image forming method (4) of the present invention having a step of removing a non-image portion with an alkaline solution, the plate making method of a lithographic printing plate of the present invention (29), the method of manufacturing a printed wiring board (37) and (37)
  • the resin soluble in a dispersion medium is preferably alkali-resistant, more preferably hydrophobic, in order not to lower the alkali resistance of the heat-meltable fine particle layer.
  • the heat-meltable fine particle layer according to the image forming material, the image forming method, the lithographic printing plate manufacturing method and the manufacturing apparatus, the lithographic printing plate making method, and the printed wiring board manufacturing method of the present invention is obtained by applying the above-described coating method.
  • the dispersion medium is dried in an atmosphere temperature range equal to or lower than the softening point of the heat-meltable fine particle layer, and the dispersion medium is removed by evaporation.
  • the softening point of the heat-meltable fine particles is the temperature at which a film is formed by heating, and the numerical value is that when the heat-meltable fine particle dispersion is sealed and gradually heated, the heat-meltable fine particles melt to form a film.
  • the temperature can be obtained by a simple experiment.
  • the alkali-soluble resin that can be used in the alkali-soluble resin layer according to the image forming material (2), the image forming method (4), and the method for manufacturing a printed wiring board (37) of the present invention.
  • a monomer having an anionic group such as a carboxylic acid group, a sulfoxyamide group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, a phosphonic acid group, etc.
  • a monomers may be copolymerized to control alkali solubility, film strength, heat melting temperature, and the like. Further, two or more kinds of alkali-soluble resins may be mixed.
  • the alkali-soluble resin layer according to the image-forming material (2), the image-forming method (4) and the method for manufacturing a printed wiring board (37) of the present invention comprises at least an alkali-soluble resin in an appropriate medium. Disperse or dissolve, dipping, spin coating, bar coating, roll coating, spray coating, curtain coating, air knife coating It can be formed by using a coating method such as a coating method, a blade coating method, and an electrodeposition method. In particular, the electrodeposition method can be advantageously used because it has good followability and adhesion to a substrate to be coated, has very few defects such as pinholes, and can provide a good thin film. .
  • the main component of the Alkali soluble soluble film according to the method (38) for producing a printed wiring board of the present invention is an alkali-soluble resin.
  • the alkali-soluble resin includes at least one monomer component having a monomer having an anionic group such as a carboxylic acid group, a carboxyamide group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, and a phosphonic acid group.
  • various monomers may be copolymerized to control alkali solubility, film strength, adhesion, softening temperature, glass transition point, and the like.
  • two or more kinds of soluble resins may be mixed and used.
  • the alkali-soluble dry film according to the method (38) for producing a printed wiring board of the present invention is generally formed by dissolving the above-mentioned alkali-soluble resin in a medium and coating it on a substrate.
  • a substrate films of polytetrafluoroethylene, polyethylene terephthalate, alamide, Kapton, polymethylpentene, polyethylene, polypropylene, polyvinyl chloride, etc. can be used.
  • the method of fusing and fixing the image portion of the heat-fusible fine particle layer includes heat fixing, light fixing, pressure fixing, and solvent. There are methods such as fixing. In order to perform a direct drawing method using a computer chip plate to increase productivity, it is desirable to use a laser for fusing and fixing.
  • Lasers include gas lasers such as carbon dioxide laser, nitrogen laser, Ar laser, HeZNe laser, HeZCd laser, Kr laser, solid lasers such as liquid (dye) laser, ruby laser, NdZY AG laser, GaAsZGaAlAs, I nG a a s a semiconductor laser such as a laser, K r F laser, XEC l laser, XeF laser, the use of excimer laser or the like of the Ar 2 laser or the like leaving at.
  • gas lasers such as carbon dioxide laser, nitrogen laser, Ar laser, HeZNe laser, HeZCd laser, Kr laser
  • solid lasers such as liquid (dye) laser, ruby laser, NdZY AG laser, GaAsZGaAlAs, I nG a a s a semiconductor laser such as a laser, K r F laser, XEC l laser, XeF laser, the use of excimer laser or the like of the Ar 2 laser or the
  • the heat fusible fine particle layer is used in order to improve the melting and fixing ability of the heat fusible fine particle layer.
  • the heat fusible fine particle layer is used.
  • thermofusible fine particle layer with small heat or light energy.
  • the light absorber for example, carbon black, cyanine, metal-free or metal phthalocyanine, metal dithiolene, anthraquinone and the like can be used.
  • a light absorber having the maximum absorption at the wavelength of the laser For example, when fixing a heat-meltable fine particle layer using a semiconductor laser of 830 nm, a cyanine dye having a heptamethine skeleton can be suitably used.
  • Ripbon black is a light absorber that can be used most preferably because it has a wide light absorption wavelength range and high heat absorption efficiency.
  • the image forming method (4) and the method for manufacturing a printed wiring board (37) of the present invention similarly to the above, it is selected from an alkali-soluble resin layer or a heat-meltable fine particle layer.
  • at least one layer contains a light absorber.
  • at least one layer selected from the group consisting of a soluble dry film and a heat-meltable fine particle layer contains a light absorber.
  • a negative PS plate is used in the method (29) to (31) of making a lithographic printing plate of the present invention.
  • the plate surface is irradiated with ultraviolet light after elution and removal of the non-image portion. Therefore, a light absorber having low absorption in a wavelength region of 600 nm or less is desirable.
  • the alkali-soluble resin layer or the alkali-soluble dry film in the non-image portion or the non-circuit portion, and The hot-melt fine particle layer formed on the substrate is removed using an alkaline solution.
  • the heat-fusible fine particle layer that is not melt-fixed is in a very sparse state, and the alkali solution can easily penetrate and is removed together with the underlying alkali-soluble resin layer or Al-soluble dry film. It is possible.
  • the alkaline liquid water can be advantageously used as a solvent.
  • alkali metal gayate alkali metal hydroxide, phosphoric acid and alkali metal carbonate and ammonium salt
  • ethanolamine ethylenediamine, propanediamine, triethylenetetramine, morpholine and the like
  • a water-soluble alcohol / surfactant may be contained.
  • a commercially available PS plate developer can be used as the photosensitive layer eluting solution in the plate making method (29) of the present invention. If there is a dedicated or recommended developer for the PS plate to be used, it can be suitably used. Further, for example, a negative / positive common developer as described in JP-A-6-282709 can be used. Furthermore, it can be treated with an alkaline solution containing water as a main solvent. Examples of such an alkaline liquid include the alkaline liquids relating to the above-described image forming method (4) and methods (37) and (38) for producing a printed wiring board of the present invention.
  • the substrate relating to the image forming materials (1) and (2) and the image forming methods (3) and (4) of the present invention for example, in the case of producing a printing plate, polyethylene terephthalate, polyethylene naphthalate, A metal plate such as a plastic plate such as polyphenylene sulfide, paper, an aluminum plate, a zinc plate, and a copper Z aluminum plate can be used.
  • epoxy resin-impregnated glass substrate epoxy resin-impregnated paper substrate, phenol resin-impregnated glass substrate, phenol resin-impregnated paper substrate, polyimide film
  • an insulating substrate such as a polyester film, a laminated plate or a metal plate provided with a conductive layer of copper, aluminum, silver, iron, gold, or the like on at least one surface of the insulating substrate.
  • a commercially available PS plate is not limited to a negative type or a positive type, and It can be used without being affected by the type and thickness of the support.
  • a commercially available PS plate is not limited to a negative type or a positive type, and It can be used without being affected by the type and thickness of the support.
  • an elution type printing plate that forms an image by an electrophotographic method can be used.
  • the photosensitive lithographic printing plate according to the lithographic printing plate making method (29) of the present invention is a negative type, as described in the lithographic printing plate making methods (32) and (35) of the present invention
  • ultraviolet light such as a mercury lamp
  • the photosensitive layer is polymerized and hardened, and the image area can be made stronger.
  • a solvent or the like that dissolves only the melt-fixing layer in the image area. After separating the fixing layer, ultraviolet light irradiation can be performed.
  • the lithographic printing plate making method of the present invention (33) and (36) are as follows. Before providing the heat-meltable fine particle layer, the surface of the photosensitive lithographic printing plate is irradiated with ultraviolet light such as a mercury lamp in advance to improve the solubility of the photosensitive layer, and a plate-making process using the heat-meltable fine particles is performed. . By irradiating with ultraviolet light, the solubility of the photosensitive layer of the photosensitive lithographic printing plate in the elution treatment liquid increases, and the photosensitive layer in the non-image area can be removed very easily.
  • ultraviolet light such as a mercury lamp
  • a non-image portion of the photosensitive lithographic printing plate is eluted and removed, and then a burning process is performed to further strengthen the image portion.
  • a burning process a method generally applied to a PS plate, such as heating at 200 to 250 ° C. for several minutes, can be used. Such a burning process is described in, for example, “PS Version Overview” (by Yonezawa Teruhiko, published by The Printing Society of Japan, pp. 107-108).
  • a dry (air-drying) type hole filling ink for example, a dry (air-drying) type hole filling ink, an ultraviolet light curing type hole filling ink, or a thermosetting type hole filling ink can be used.
  • a method of filling the filling hole inside the through hole a roll coating method, a squeegee method, a multi-pin injection method, or the like can be used.
  • the filling ink that has adhered to the outside of the through-hole may be left as it is, or may be removed by wiping or puffing.
  • Examples of the laminated board provided with a conductive layer on at least one surface of an insulating substrate according to the method for manufacturing a printed wiring board of the present invention include, for example, “Printed Circuit Technology Handbook-Second Edition 1”
  • the insulating substrate examples include a paper substrate or a glass substrate impregnated with an epoxy resin or a phenol resin, a polyester film, a polyimide film, and the like.
  • the material of the conductive layer examples include copper, silver, and aluminum.
  • a method for forming a plated conductive layer according to the method for manufacturing a printed wiring board of the present invention for example, when the plated conductive layer is copper, “Surface mounting technology” (June 1993, June, Electroless plating step, electroless plating-one electrolytic plating step, direct electrolytic plating step, etc. described in Nikkan Kogyo Shimbun, etc.) can be used.
  • the etching resist layer after removing the unnecessary conductive layer and the plated conductive layer may be left as it is, but is unnecessary when loading and connecting circuit components and the like. If it becomes, remove it.
  • an alkali solution can be advantageously used. In the case where the solubility of the etching resist layer in the alkaline solution is low, a force for appropriately adding an organic solvent or only the organic solvent may be used.
  • FIG. 10 is a schematic side sectional view showing an example of the lithographic printing plate manufacturing apparatus (24) of the present invention.
  • the printing plate 4 14 with its surface facing upward is introduced into a gap formed by the electrode 41 and the guide plate 42 by a pair of feed rolls 4 3 and 4 4 whose surface is formed of rubber.
  • the liquid supply section attached to the recovery tank 410, the pump 41, and the electrode 41 which constitutes the hot-melt fine particle-containing coating liquid supply means, sends the liquid to the gap. Is discharged.
  • a voltage is supplied from a voltage supply unit 413, which is a charge application unit connected to the electrode 41, the conductive grounding piece 47, and the plate guide 49.
  • the polarity of the supplied voltage is the same as the polarity of the charged electrode of the hot-melt particles in the coating liquid, and the hot-melt particles are electrodeposited on the surface of the printing plate 4 14.
  • the printing plate 4 14 is a gas blowing means in which excess coating liquid is squeezed by a pair of squeezing rolls 4 5 and 4 6 which are squeezing means, and at the same time, is connected to a high-pressure air source (not shown). High-pressure air is blown from the air knife 48 to the gap formed by the printing plate 4 14 and the squeezing roll pairs 45, 46.
  • the printing plate 4 14 is suctioned on its back surface by suction conveyance means composed of a conveyance belt 4 24 suspended on four rotating shafts 4 23 and a suction box 4 22. Conveyed.
  • the suction box 4 22 has a plurality of suction ports on its upper surface for sucking the printing plate 4 14, and the air inside the suction box 4 22 is exhausted by an exhaust fan (not shown) installed inside. It is being discharged.
  • two drying fans 420 are arranged as a means for promoting the evaporation of the dispersion medium, so that the dispersion medium in the coating liquid that has not been squeezed on the printing plate 4 14 is sealed. I have.
  • an air temperature control unit (not shown) is introduced into the drying fan 420.
  • an exhaust duct 421 is provided at the upper part as an evaporation promoting means, so that the evaporated dispersion medium can be discharged as required.
  • the transport speed of the printing plate 4 14 can be arbitrarily set according to the evaporation speed of the dispersion medium used.
  • the printing plate 4 14 processed as described above reaches a buffer unit composed of a transport belt 4 31 suspended on two rotating shafts 4 30.
  • the printing plate 4 14 may be taken out, or may be transported to a stocker capable of stocking a plurality of printing plates.
  • a JIS 1550 aluminum sheet was immersed in an aqueous solution of 10% NaOH at 60 ° C, and the surface was etched so that the amount of aluminum dissolved was 6 gZm 2 . After washing with water, it was immersed in a 30% aqueous nitric acid solution for 1 minute to neutralize, and washed thoroughly with water. Thereafter, electrolytic surface roughening was performed in a 2.0% aqueous nitric acid solution for 25 seconds, and the surface was washed by immersion in a 20% aqueous sulfuric acid solution at 50 ° C., and then washed with water. Furthermore, the substrate (printing plate support, A3 size) is prepared by anodizing in a 20% sulfuric acid aqueous solution, washing with water, and drying.
  • the heat-meltable fine particle layer corresponding to the image area was fused and fixed by a semiconductor laser exposure device (780 nm) to obtain a printing plate.
  • a printing plate Using this printing plate, printing was performed with an offset printing machine (Ryobi 3200 MCD).
  • an offset printing machine Rost 3200 MCD.
  • a layer of heat-meltable fine particles that had not been fused was fixed. was completely removed, and the hydrophilically treated surface of the substrate was exposed.
  • the remaining melt-fixing layer as the ink receiving layer, it was possible to obtain good printed matter free of stains and the like up to 60,000 sheets.
  • a substrate having the same specifications as in Example 1 (hydrophilic aluminum sheet, 110 ⁇ 398 mm) was coated with a coating solution having the composition shown in Table 2 by a curtain coating method, and the coating was performed at 30 °. After drying for 5 minutes at C, a heat-meltable fine particle layer (2.5 m thick) was formed.
  • Table 2 Compositions Polyuryl methacrylate (molecular weight 2,000,000) 5 Polyvinyl acetate emulsion (average particle size 0.2 ⁇ m) 25 Carbon black 5 Saturated hydrocarbons (IP-1620; Idemitsu Petrochemical) 2 1 5 Formation of fusing layer
  • the printing plate was obtained by fusing and fixing the heat-meltable fine particle layer corresponding to the image area with a semiconductor laser exposure device (780 nm). Using this printing plate, we performed printing with an offset printing machine (Ryobi 320 MCD). At the initial stage of printing (about 10 sheets), the heat-fusible fine particles that had not been fused and fixed were used. The layer was completely removed, exposing the hydrophilized surface of the substrate. By using the remaining melt-fixing layer as the ink receiving layer, it was possible to obtain good printed matter free of stains and the like up to 60,000 sheets.
  • the heat-meltable fine particle layer corresponding to the image area was fused and fixed by a semiconductor laser exposure device (780 nm) to obtain a printing plate.
  • a semiconductor laser exposure device 780 nm
  • we performed printing with an offset printing machine (Ryobi 320 MCD).
  • the heat-fusible fine particles that had not been fused and fixed were used.
  • the layer was completely removed, exposing the hydrophilized surface of the substrate.
  • the remaining melt-fixing layer as the ink receiving layer, no stains or the like were generated up to 70,000 sheets, and good printed matter was obtained.
  • a semiconductor laser exposure device (780 nm) melts and fixes the heat-meltable fine particle layer corresponding to the image area, and then sprays 5.0% sodium carbonate solution (liquid temperature 35 ° C) (2.0 kg / cm 2 ) to remove the hot-melt fine particle layer and the alkali-soluble resin layer in the non-image area to obtain a printing plate.
  • Observation with a microscope of the image layer composed of the alkali-soluble resin layer and the heat-meltable fine particle layer revealed that the image had a high resolution without any missing image portions and no stain on non-image portions.
  • an offset printing machine Hamaduster 600 CD
  • Coating Co., Ltd. 200 x 300 x 1.6 mm, copper thickness 18 ⁇ m) using a coating solution having the composition shown in Table 6 by dipping and then 90 ° After drying at C for 5 minutes, an alkali-soluble resin layer (5.2 m in thickness) was obtained.
  • a coating solution having the composition shown in Table 7 coating was performed by a curtain coating method to form a heat-meltable fine particle layer (thickness: 1.2 m).
  • the copper-clad laminate on which the image layer was formed was prepared using a commercially available ferric chloride solution.
  • Table 8 shows a single-sided copper-clad laminate (Matsushita Electric Works, Ltd., 200 mm x 300 mm, copper thickness 18 mm, copper thickness 18 ⁇ m) with copper foil laminated to one side of a paper-based epoxy resin plate.
  • a coating solution having the following composition apply by electrodeposition (applied current: 100 mA), and then dry at 90 ° C for 10 minutes to obtain an alkali-soluble resin layer (thickness 3.2 ⁇ m). ).
  • coating solution having the composition shown in Table 3 coating was carried out by the electrodeposition method (applied voltage: 180 V), and then air-dried at 40 ° C for 2 minutes. 0 um).
  • Observation with a microscope of the image layer composed of the alkali-soluble resin layer and the heat-meltable fine particle layer revealed a high-resolution image with no missing image portions and no stain on non-image portions.
  • the copper-clad laminate on which the image layer was formed was treated with a commercially available ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ), and the portion not covered with the image layer was treated.
  • Drift film photoresist (Nippon Gohsei Chemical Co., Ltd.) as a photopolymer was thermocompression-bonded on the copper-clad laminate having the same specifications as in Examples 5 and 6. This photopoly Exposure was performed with the same semiconductor laser exposure apparatus as in Examples 1 and 2, but no photopolymerization reaction could be caused and no image could be obtained. Further, when a dry film photoresist was thermocompression-bonded on a copper-clad laminate and stored for 30 months in a bright room, the polymerization reaction proceeded and the photosensitive properties were deactivated.
  • a curtain coating method was applied to a commercially available unexposed negative PS plate (Fuji Photo Film, FNS), followed by air drying at 40 ° C for 2 minutes. A thermally fusible fine particle layer (thickness: 3.0 fim) was obtained.
  • a semiconductor laser exposure device (830 nm) melts and fixes the hot-melt fine particle layer corresponding to the image area, and then uses a commercially available negative-type PS plate developer (Fuji Photo Film, DN 3C).
  • the heat-meltable fine particle layer and the PS plate photosensitive layer in the non-image area were removed.
  • the plate surface was once subjected to gumming treatment and subjected to burning treatment in an oven heated to 200 ° C to obtain a lithographic printing plate. Observation of the plate surface with a microscope revealed that the image had high resolution without any missing image portions and poor elution in non-image portions. Offset printing was performed using this lithographic printing plate. As a result, good scumming property and printing durability were obtained, and good printed matter was obtained.
  • a semiconductor laser exposure device (830 nm) melts and fixes the heat-meltable fine particle layer corresponding to the image area, and then uses a commercially available negative-type PS plate developer (Fuji Photo Film, DN 3C).
  • the heat-meltable fine particle layer and the PS plate photosensitive layer in the non-image area were removed.
  • the plate surface was irradiated with ultraviolet light from a mercury lamp, the plate surface was once subjected to gumming treatment, and subjected to burning treatment in an oven heated to 200 ° C. to obtain a lithographic printing plate. Observation of the plate surface with a microscope revealed that the image had high resolution without any missing image areas and poor elution in non-image areas. Offset printing was performed using this lithographic printing plate. As a result, it was possible to obtain a printed matter that had good scumming properties and printing durability, and was good even with the 50,000th print.
  • Table 11 Composition Polyradiryl methacrylate (molecular weight 2,000,000) 5 Polyvinyl acetate emulsion (average particle size 0.2 ⁇ m) 2 5 Power black 5 Saturated hydrocarbon (IP-160; Idemitsu Petrochemical Co., Ltd.
  • a semiconductor laser exposure device (830 nm) fuses and fixes the heat-meltable fine particle layer corresponding to the image area, and then a commercially available positive PS plate developer (Fuji Photo Film, Using DP 4), the heat-fusible fine particle layer and the PS plate photosensitive layer in the non-image area were removed, and a gumming treatment was performed. Thereafter, a lithographic printing plate was obtained by performing a burning treatment in an oven heated to 200 ° C. Observation of the plate surface with a microscope revealed that the image had high resolution without any missing image portions and poor elution in non-image portions. Offset printing was performed using this lithographic printing plate. As a result, it was possible to obtain a printed matter having good scumming property and printing durability, and having a printability of 50,000 sheets.
  • a printing plate 4 1 4 with its surface facing upwards by means of a feed roller pair 43, 44 formed of nitrile butadiene rubber (NBR) having a hardness of 45 degrees (in this example, a positive PS plate) Is introduced into a gap formed by an electrode 41 made of SUS304 (JIS stainless steel) and a guide plate 42 made of polycarbonate.
  • NBR nitrile butadiene rubber
  • the liquid is fed from the collection tank 4 10 to the gap by the pump 4 12 from the recovery tank 4 10 to the liquid discharge portion 4 11 1 attached to the electrode 41, and is applied.
  • the voltage supply unit 4 1 3 connected to the electrode 1 and the phosphor bronze ground strip 47 and the SUS 304 pass-through guide 49 Are supplied with a voltage.
  • the polarity of the supplied voltage was set to + (plus) because the heat-fusible fine particles in the coating liquid had a positive charge, and a voltage of 180 V was applied.
  • the printing plate 4 14 is squeezed out of the excess coating liquid by the squeezing roll pairs 45, 46, and at the same time, the air nip 48, which is a gas blowing means connected to a high-pressure air source (not shown), is provided. Then, high-pressure air (pressure 2 kgZcm 2 ) is blown toward the gap formed by the printing plate 4 14 and the squeezing roll pairs 45, 46.
  • the printing plate 4 14 is conveyed while its back surface is adsorbed by the adsorbing / conveying means composed of the conveying belt 4 24 suspended on the four rotating shafts 4 2 3 and the suction box 4 22.
  • the suction box 4 2 2 two exhaust fans (not shown) with a maximum air flow of 500 1 / min are provided.
  • two drying fans (maximum static pressure 6 mm A q), which are means for accelerating the dispersion medium evaporation, are arranged. It is designed to air dry.
  • the blowing temperature of the drying fan was measured and found to be 20 ° C.
  • the printing plate 4 14 is conveyed to a buffer section comprising a conveying belt 4 31 suspended on two rotating shafts 4 30.
  • the printing plate 4 14 was taken out.
  • the PS plate treated as described above is melt-fixed with a semiconductor laser exposure apparatus (830 nm) to a hot-melt fine particle layer corresponding to the image area, and then a commercially available positive PS plate developer (Fuji Using a photographic film, DP4), the heat-meltable fine particle layer and the PS plate photosensitive layer in the non-image area were removed.
  • the lithographic printing plate was obtained by performing a gumming treatment on the plate surface and a burning treatment in an oven heated to 200 ° C. Observation of the plate surface with a microscope revealed that the image had high resolution without any missing image portions and poor elution in non-image portions. Offset printing was performed using this lithographic printing plate. As a result, it was possible to obtain a printed material that had good scumming resistance and printing durability from the start of printing, and was good for the 50,000th print.
  • a heat-meltable fine particle layer was formed in the same manner as in Example 7, except that a commercially available electrophotographic lithographic printing plate (ODP ND-300, manufactured by Mitsubishi Paper Mills) was used as the printing plate.
  • ODP ND-300 commercially available electrophotographic lithographic printing plate
  • the processed printing plate is melt-fixed with a semiconductor laser exposure device (830 nm) to a heat-fusible fine particle layer corresponding to the image area, and then an electrophotographic lithographic printing plate eluent (Mitsubishi Paper, Using ODP-DF), the fusible fine particle layer and the photosensitive layer in the non-image area were removed to obtain a lithographic printing plate.
  • Observation of the plate surface with a microscope revealed that the image had high resolution without any missing image portions and poor elution in non-image portions.
  • Offset printing was performed using this lithographic printing plate. As a result, it was possible to obtain a printed matter which had good soiling properties and printing durability from the start of
  • a copper plating process (Okuno Pharmaceutical Co., Ltd., 0PC process M) is applied to the surface of the laminated board including the inside of the through holes.
  • a copper plating layer having a thickness of 8 m was provided.
  • a hole-filling ink (SER-450W, manufactured by San-ei Chemical Co., Ltd.) was applied to the inside of the through-hole by a roll coating method, followed by heat curing. Filling ink on the copper plating layer other than inside the through holes was removed by buffing and washing.
  • the coating solution having the composition shown in Table 4 is applied by the curtain coating method, and the coating is dried at 90 ° C for 10 minutes. A layer (film thickness 4.5) was obtained. Furthermore, using a coating solution having the composition shown in Table 5, the composition was applied by curtain coating, and then air-dried at 40 ° C for 2 minutes to obtain a heat-meltable fine particle layer (film thickness: 1.5 / m). .
  • a semiconductor laser exposure apparatus (780 nm) melts and fixes the heat-meltable fine particle layer corresponding to the wiring section to form a fusion-fixed layer, and then sprays 5.0% sodium carbonate solution (liquid temperature of 35 ° C) ( 2.0 kg / cm 2 ) to remove the heat-fusible fine particle layer and the alkali-soluble resin layer in the non-wiring area, and form an etching resist layer consisting of the alkali-soluble resin layer, the fusion fixing layer, and the ink for filling the hole. Obtained. Observe this etching resist layer with a microscope. From the observation, it was a high-resolution wiring image with no missing wiring parts and no stain on non-image parts.
  • the etching resist layer After the etching resist layer is formed, it is treated with a ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ), and the copper plating layer and the copper that are not covered with the etching resist layer The layer was removed. Then, the substrate was treated with a 3.0% sodium hydroxide solution at 40 ° C. to remove the remaining etching resist layer, thereby obtaining a printed wiring board. Observation of the obtained printed wiring board with a microscope showed no defects such as disconnection. No defects such as pinholes were found inside the through holes. Storage test
  • the etching resist layer is formed in the same manner as above. As a result, a wiring image free from defects was obtained.
  • the coating solution having the composition shown in Table 12 was applied to a polyester film having a thickness of 15 m by the roll coating method, and then dried at 60 ° C for 20 minutes to obtain an alkali-soluble dry film (thickness 15). fim). After the formation of the through holes, an alkali-soluble dry film was thermocompression-bonded to the surface of the copper plating layer of the laminate, the polyester film was removed, and the plating conductive layer was covered with the dry film.
  • Table 1 Composition methacrylic acid Z-methacrylic acid n-butyl / acrinoleic acid n—
  • butyl copolymer (weight ratio: 3 / 3Z'4, weight average molecular weight
  • Lauryl copolymer (weight ratio 1/1 / 1'3, weight average molecular weight 15
  • a semiconductor laser exposure apparatus (780 nm) melts and fixes the heat-meltable fine particle layer corresponding to the wiring section to form a fusion-fixed layer, and then sprays 5.0% sodium carbonate solution (liquid temperature of 35 ° C) ( 2.0 kg / cm 2 ) to remove the heat-meltable fine particle layer and the soluble dry film in the non-wiring area to obtain an etching resist layer consisting of the soluble dry film and the fusion fixing layer.
  • the etching resist layer After the etching resist layer is formed, it is treated with a ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ). The copper layer was removed. Next, the printed wiring board is obtained by removing the remaining etching resist layer by treating it with a 3.0% hydroxylamine solution at 40 ° C. Was. Observation of the obtained printed wiring board with a microscope showed no defects such as disconnection. No defects such as pinholes were found inside the through holes. Storage test
  • the etching resist layer After forming the etching resist layer, it is treated with a ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ), and the copper plating layer and the copper that are not covered with the etching resist layer The layer was removed. Next, treatment with a 3.0% sodium hydroxide solution at 40 ° C. was performed to remove the remaining etching resist layer, thereby obtaining a printed wiring board. Observation of the obtained printed wiring board with a microscope showed no defects such as disconnection. No defects such as pinholes were found inside the through holes. Storage test
  • the etching resist layer is formed in the same manner as described above. As a result, no defect was found and a wiring image could be obtained.
  • the etching resist layer After the etching resist layer is formed, it is treated with a ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ), and the copper plating layer and the copper that are not covered with the etching resist layer The layer was removed. Then, the substrate was treated with a 3.0% sodium hydroxide solution at 40 ° C. to remove the remaining etching resist layer, thereby obtaining a printed wiring board. Observation of the obtained printed wiring board with a microscope showed no defects such as disconnection. No defects such as pinholes were found inside the through holes. Storage test
  • the laminated plate on which the soluble dry film coating and the heat-fusible fine particle layer were formed was stored for 4 months in a light room at 30 ° C, and then an etching resist layer was formed in the same manner as above. However, a defect-free wiring image could be obtained.
  • a double-sided copper-clad laminate with copper foil laminated on both sides of a glass-based epoxy resin plate (Mitsubishi Gas Chemical Co., Ltd., 200 x 300 x 0.8 mm, copper thickness 18 zm)
  • a copper plating treatment (Okuno Pharmaceutical Co., Ltd., 0PC process M) is applied, and the thickness of the laminated board surface including the inside of the through holes is increased.
  • An 8 m copper plating layer was provided.
  • the filling ink used in Example 12 was filled in the inside of the through-hole by a roll coating method, and was thermally cured. Filling ink on the copper-plated layer other than inside the through hole was removed by buffing and washing.
  • a semiconductor laser exposure apparatus (780 nm) melts and fixes the heat-meltable fine particle layer corresponding to the wiring section to form a fusion-fixed layer, and then sprays 5.0% sodium carbonate solution (liquid temperature of 35 ° C) ( 2.0 kg / cm 2 ) to remove the heat-fusible fine particle layer and the alkali-soluble resin layer in the non-wiring area, and form an etching resist layer consisting of the alkali-soluble resin layer, the fusion fixing layer, and the ink for filling the hole. Obtained. Observation of this etching resist layer with a microscope revealed that it was a high-resolution wiring image with no missing wiring parts and no stain on non-image parts.o
  • the etching resist layer After the etching resist layer is formed, it is treated with a ferric chloride solution (45 ° C, spray pressure: 3.0 kg / cm 2 ), and the copper plating layer and the copper that are not covered with the etching resist layer The layer was removed. Next, the substrate was treated with a 3.0% sodium hydroxide solution at 40 ° C. to remove the remaining etching resist layer, thereby obtaining a printed wiring board. Observation of the obtained printed wiring board with a microscope showed no defects such as disconnection. No defects such as pinholes were found inside the through holes. Storage test
  • the etching resist layer is formed in the same manner as described above. After forming, a wiring image without any defects could be obtained ⁇
  • This photopolymer was exposed to light using the same semiconductor laser exposure apparatus as in Examples 12 to 16 above, but no photopolymerization reaction could be caused. After the dry finolem photoresist was thermocompressed and stored in a light room at 30 ° C for 3 months, the polymer was inactivated.
  • the image forming material of the present invention has better storage stability than the conventional image forming material using a photopolymer. Further, in the image forming method, the lithographic printing plate making method, and the printed wiring board manufacturing method of the present invention, it is possible to easily form an image by a direct drawing method using a low-output laser, and to use a computer. It is also compatible with a flat plate, and has an excellent effect that an image having high resolution can be obtained easily and at low cost.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Materials For Photolithography (AREA)
PCT/JP1997/003819 1997-08-22 1997-10-22 Image forming material, image forming method, lithographic printing plate manufacturing method and apparatus, lithographic printing plate making method, and printed wiring board manufacturing method WO1999010186A1 (en)

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DE19781578T DE19781578C2 (de) 1997-08-22 1997-10-22 Bildgebendes Material, Verfahren zur Bildgebung, Verfahren zur Herstellung einer lithographischen Druckplatte und Anlage, die dafür verwendet wird, Verfahren zur Herstellung einer Platte für eine lithographische Druckplatte und Verfahren zur Herstellung einer gedruckten Leitungsplatte

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JP22626397A JPH1165100A (ja) 1997-08-22 1997-08-22 平版印刷版の製造方法及び製造装置
JP22626297A JPH1165099A (ja) 1997-08-22 1997-08-22 平版印刷版の製版方法
JP9/226262 1997-08-22
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Cited By (13)

* Cited by examiner, † Cited by third party
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EP1160083A2 (de) 2000-06-02 2001-12-05 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1193055A2 (de) * 2000-09-28 2002-04-03 Fuji Photo Film Co., Ltd. Lithographische Druckplattenvorläufer, Druckverfahren und Druckmaschine
EP1228865A2 (de) 2001-02-06 2002-08-07 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1238801A2 (de) 2001-03-07 2002-09-11 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1287985A2 (de) * 2001-08-24 2003-03-05 Fuji Photo Film Co., Ltd. Lithographischer Druckplattenvorläufer
EP1302313A2 (de) 2001-10-16 2003-04-16 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1344644A2 (de) 2002-03-13 2003-09-17 Fuji Photo Film Co., Ltd. Lithographischer Druckplattenvorläufer
EP1356929A2 (de) 2002-04-24 2003-10-29 Fuji Photo Film Co., Ltd. Verfahren zur Herstellung von lithographischen Druckplatten
EP1393899A2 (de) 2002-08-29 2004-03-03 Fuji Photo Film Co., Ltd. Auf der Druckpresse entwickelbarer lithographischer Druckplattenvorläufer
US6815137B2 (en) 2000-12-28 2004-11-09 Fuji Photo Film Co., Ltd. Process for producing polymer fine particles and lithographic printing plate precursor using the same
EP1707352A1 (de) 2005-03-31 2006-10-04 Fuji Photo Film Co., Ltd. Verfahren zur Herstellung einer Flachdruckplatte
US7132212B2 (en) 2001-06-13 2006-11-07 Fuji Photo Film Co., Ltd. Presensitized plate
EP1972439A2 (de) 2007-03-20 2008-09-24 FUJIFILM Corporation Auf Druck entwickelbarer Lithografiedruckplattenvorläufer

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JPS6216833B2 (de) * 1978-12-20 1987-04-14 Tomoegawa Paper Mfg Ltd
JPH06237064A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH0851270A (ja) * 1994-08-06 1996-02-20 Ibiden Co Ltd プリント配線板の製造方法

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JPH0614198B2 (ja) * 1986-03-18 1994-02-23 三菱製紙株式会社 電子写真製版用印刷版
EP0770495B1 (de) * 1995-10-24 2002-06-19 Agfa-Gevaert Verfahren zur Herstellung einer lithographischen Druckplatte mit auf der Druckpresse stattfindenden Entwicklung
EP0773113B1 (de) * 1995-11-09 2000-05-24 Agfa-Gevaert N.V. Wärmeempfindliches Aufzeichnungselement und Verfahren zur Herstellung einer lithographischen Druckform damit
DE69608522T2 (de) * 1995-11-09 2001-01-25 Agfa-Gevaert N.V., Mortsel Wärmeempfindliches Aufzeichnungselement und Verfahren zur Herstellung einer lithographischen Druckform damit

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JPS6216833B2 (de) * 1978-12-20 1987-04-14 Tomoegawa Paper Mfg Ltd
JPH06237064A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH0851270A (ja) * 1994-08-06 1996-02-20 Ibiden Co Ltd プリント配線板の製造方法

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1160083A2 (de) 2000-06-02 2001-12-05 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
US6942955B2 (en) 2000-06-02 2005-09-13 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
US6905803B2 (en) 2000-06-02 2005-06-14 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
EP1410907A2 (de) 2000-06-02 2004-04-21 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1193055A2 (de) * 2000-09-28 2002-04-03 Fuji Photo Film Co., Ltd. Lithographische Druckplattenvorläufer, Druckverfahren und Druckmaschine
EP1193055A3 (de) * 2000-09-28 2004-04-07 Fuji Photo Film Co., Ltd. Lithographische Druckplattenvorläufer, Druckverfahren und Druckmaschine
US6815137B2 (en) 2000-12-28 2004-11-09 Fuji Photo Film Co., Ltd. Process for producing polymer fine particles and lithographic printing plate precursor using the same
EP1228865A3 (de) * 2001-02-06 2003-12-03 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
US6641977B2 (en) 2001-02-06 2003-11-04 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
EP1228865A2 (de) 2001-02-06 2002-08-07 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1238801A2 (de) 2001-03-07 2002-09-11 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
US7132212B2 (en) 2001-06-13 2006-11-07 Fuji Photo Film Co., Ltd. Presensitized plate
EP1287985A3 (de) * 2001-08-24 2003-11-26 Fuji Photo Film Co., Ltd. Lithographischer Druckplattenvorläufer
EP1287985A2 (de) * 2001-08-24 2003-03-05 Fuji Photo Film Co., Ltd. Lithographischer Druckplattenvorläufer
EP1302313A2 (de) 2001-10-16 2003-04-16 Fuji Photo Film Co., Ltd. Flachdruckplattenvorläufer
EP1344644A2 (de) 2002-03-13 2003-09-17 Fuji Photo Film Co., Ltd. Lithographischer Druckplattenvorläufer
US7078145B2 (en) 2002-03-13 2006-07-18 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
EP1356929A2 (de) 2002-04-24 2003-10-29 Fuji Photo Film Co., Ltd. Verfahren zur Herstellung von lithographischen Druckplatten
US7198876B2 (en) 2002-04-24 2007-04-03 Fuji Photo Film Co., Ltd. Method of preparation of lithographic printing plates
EP1393899A2 (de) 2002-08-29 2004-03-03 Fuji Photo Film Co., Ltd. Auf der Druckpresse entwickelbarer lithographischer Druckplattenvorläufer
US6969575B2 (en) 2002-08-29 2005-11-29 Fuji Photo Film Co., Ltd. On-press developable lithographic printing plate precursor
EP1707352A1 (de) 2005-03-31 2006-10-04 Fuji Photo Film Co., Ltd. Verfahren zur Herstellung einer Flachdruckplatte
EP1972439A2 (de) 2007-03-20 2008-09-24 FUJIFILM Corporation Auf Druck entwickelbarer Lithografiedruckplattenvorläufer

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