WO1999007003A1 - Supraconducteur a haute temperature et procede de fabrication et d'utilisation de celui-ci - Google Patents

Supraconducteur a haute temperature et procede de fabrication et d'utilisation de celui-ci Download PDF

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Publication number
WO1999007003A1
WO1999007003A1 PCT/US1998/016069 US9816069W WO9907003A1 WO 1999007003 A1 WO1999007003 A1 WO 1999007003A1 US 9816069 W US9816069 W US 9816069W WO 9907003 A1 WO9907003 A1 WO 9907003A1
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WO
WIPO (PCT)
Prior art keywords
bundle
tapes
high temperature
strip
tape
Prior art date
Application number
PCT/US1998/016069
Other languages
English (en)
Inventor
Michael J. Tomsic
Martin S. Lubell
Jinwun W. Lue
Jonathan A. Demko
Original Assignee
Eurus Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurus Technologies, Inc. filed Critical Eurus Technologies, Inc.
Priority to AU87646/98A priority Critical patent/AU8764698A/en
Publication of WO1999007003A1 publication Critical patent/WO1999007003A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/20—Permanent superconducting devices
    • H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0801—Manufacture or treatment of filaments or composite wires

Definitions

  • the present invention relates generally to superconductors, and more particularly, to improved high temperature superconductors and methods of manufacture which maximize the critical current carrying capacity I c thereof.
  • Superconductors exhibit diamagnetism and have a zero voltage drop along their length, irrespective of the passage of current therethrough.
  • Applications for superconductors include magnetic hydrodynamic ("MHD") generation of electricity, transmission and storage of electric power, magnetic levitation of trains and electromagnetic ship propulsion, and various uses in instrumentation, including NMR, pi-meson sources for medical treatment, and supersensitive sensors for magnetic fields, microwaves, radioactive beams and the like.
  • Superconductors are also being employed as high speed switching elements such as Josephson junction devices.
  • Such a superconductor(s) is referred to as a high temperature superconductor (hereinafter "HTS").
  • HTS high temperature superconductor
  • Composite oxides having a pseudo-perovskite type crystalline structure such as [La, Ba] 2 CuO 4 or [La, Sr] 2 CuO 4 have an orthorhombic structure and the like, which is similar to the crystalline structure of perovskite type oxides. These have exhibited a T c of 30 °K to 50°K. Furthermore, a T c in excess of 70°K has been associated with superconducting materials formed of oxides such as Ba, Y and Cu.
  • the bodies are produced by a sintering-rolling process in which heat and pressure are applied to the material.
  • An example of a prior art superconductor wire comprising a normal conductor and a HTS is disclosed in U.S. Patent No.4,906,609 ("the '609 Patent").
  • the '609 Patent teaches a method of manufacture comprising the steps of continuously forming a strip of material into a U-shaped strip; filling the strip with raw material powders; closing up the strip, forming a tube; butt welding the resulting seam; and sintering the resulting tube containing the raw material powders to produce the final product.
  • the raw material powders include a mixture of oxides, nitrides, fluorides, carbonates, nitrates, oxalates or sulfates of a first element selected from group Ila in the periodic table, a second element selected from group Ilia in the periodic table, and a third element selected from groups lb, lib, Illb, IVa and Villa in the periodic table, or powders of composite oxides obtained by sintering and pulverizing these materials.
  • the '609 Patent also discloses continuously forming a strip of metal into a flume-like shape and then filling the resulting concave member with the oxide superconducting material.
  • HTS high cost associated with the use of silver material.
  • Silver also has a lower tensile and yield strength than can be achieved with other alloys as described in accordance with the present invention hereinbelow.
  • the present invention provides the following embodiments of improved HTS.
  • a stack of HTS tapes are bundled together, encapsulated with a silver or non-silver sheath by a continuous tube filling and forming process, and sintered to form the final product.
  • a large current carrying conductor is achieved with the stacking of multiple HTS tapes.
  • This bundling and encapsulating technique can be applied to commercially finished HTS tapes.
  • the present invention provides an encapsulated high temperature superconductor bundle, comprising: a plurality of high temperature superconducting tapes; and an outer sheath encapsulating the plurality of high temperature superconducting tapes to form a bundled superconductor.
  • the high temperature superconducting tapes are stacked flat, and a resistive barrier can be interposed between contiguous high temperature superconducting tapes.
  • the high temperature superconducting tapes are stacked side-by- side, and bundled within a single sheath.
  • the bundling process described above is implemented using the CTFF process, which restacks round wires or flat tapes inside another tube. After restacking, the encapsulated tape is subjected to a conventional rolling operation to convert the tape to a desired thickness.
  • the process involves either restacking round wire in a round tube, or flat tapes in a rectangular tube.
  • flat tapes is the preferred method and is referred to as the uniform transverse and longitudinal filament (“UTLF") process.
  • UTLF uniform transverse and longitudinal filament
  • Such tapes typically comprise 6 to 18 transverse superconducting filaments that yield a final thickness of 10 - 15um.
  • the UTLF process facilitates superconductivity by maximizing current density for a given precursor powder at a given filament thickness, since research indicates that most of the superconducting current is carried at the interface between the silver and the powder.
  • a resistive barrier is introduced between HTS tapes to prevent coupling loss therebetween.
  • the present invention provides a method of fabricating high temperature superconducting tapes, comprising the steps of: dispensing a strip of conductive material and passing the strip through forming rolls; filling the strip with precursor powder; and passing the strip through closing rolls to roll the strip into a tube without welding and drawing the strip to increase the density of the powder within the tube.
  • the method further comprises the steps of: encapsulating a plurality of tapes formed as above in an outer sheath to form a multi-filament bundle; and sintering and densifying the multi-filament bundle.
  • the sintering and densifying step comprises pressing the bundle between sintering steps.
  • the multifilament tape After the multifilament tape is constructed, it is densified between sintering operations and then subjected to a final sintering operation.
  • Prior art tape manufacturing methods have utilized sintering-rolling-sintering-rolling- sintering and then sintering-pressing-sintering-pressing-sintering procedures to avoid pressure-induced tape damage.
  • the present invention provides improved current density by pressing between sintering operations.
  • the process may involve sintering-rolling-sintering-pressing-sintering.
  • the critical sintering or heat-treating step is not a continuous process, but rather a batch operation.
  • Non-Silver Sheath Material To reduce sheath costs, the amount of silver may be reduced.
  • Exemplary tapes exhibiting critical transport currents I c of 20 - 22 A at 77 °K and engineering current densities J e of 2000 - 2200 A/cm 2 have been fabricated from 34% superconductor, 36% silver, and 30% non-silver material as compared to a more typical 33% superconductor/67% silver. This is a reduction in silver of
  • the alloy may comprise Cu-Al-Mn- Ni, stainless steel/nickel based compounds, like inconels, Cu-Ni, or Cu-Al. Diffusion Bonding of a Reinforcing Strip
  • An HTS tape is reinforced with an alloyed strip by diffusion bonding and sintering in a single step.
  • the backing strip is placed on the outside of the winding such that most of the tape is placed in compression when made to follow a tortious path. Normally, tensile strain causes a reduction in critical current capacity I c . By reinforcing the tape with the backing strip, bending strain induced critical current degradation is minimized by taking up tensile loads on the OD of the bend.
  • FIG. la is a cross sectional view of a 3-tape encapsulated bundle superconductor
  • FIG. lb is a cross sectional view of a 3 -tape encapsulated bundle superconductor with a resistive barrier interposed between adjacent HTS tapes
  • FIG. 1 c is a cross sectional view of a 6-tape encapsulated bundle superconductor comprised of two 3-tape stacks disposed side-by-side;
  • FIG. 2 is a flow chart of a representative process for manufacturing superconducting Bi:2223 tapes
  • FIG. 3 is a schematic of the CTFF process
  • FIG. 4 is a schematic of a prior art powder-in-tube process
  • FIGS. 5a-5d are illustrative views of photographs of transverse and longitudinal cross sections of tapes fabricated in accordance with the UTLF process
  • FIG. 6 is a schematic of an exemplary continuous pressing machine in accordance with the present invention.
  • FIGS.7a and 7b are illustrative views of photographs which depict the transverse cross section of both silver and reduced silver tapes that were processed with identical powder and processing steps;
  • FIG. 8 graphically depicts I-V curves of a 3-tape bundle of CTFF tapes both in straight length and coiled onto successively smaller diameter holders;
  • FIG. 9 graphically depicts I-V curves of a 3-tape bundle of third party tapes both in straight length and coiled onto successively smaller diameter holders with the conductor wound with the double-sheath disposed on the ID side of the winding;
  • FIG. 10 graphically depicts I-V curves of a 3-tape bundle of third party tapes both in straight length and coiled onto successively smaller diameter holders with the conductor wound with the double-sheath disposed on the OD side of the winding;
  • FIG. 11 graphically depicts critical currents as a function of bending strain for the conductor tested and shown in FIGS. 9 and 10. The strains were calculated with the thickness of the superconductor in tension only;
  • FIG. 12 graphically depicts reduced critical currents as a function of bending strain for a single control tape and the bundle conductor tested and shown in FIGS. 9 and 10;
  • FIG. 13a is a cross sectional view of an HTS tape having a diffusion bonded backing strip
  • FIG. 13b is a cross sectional view of an HTS tape having a diffusion bonded alloy plated backing strip
  • FIG. 13c is a cross sectional view of a multi-tape HTS having a diffusion bonded backing strip.
  • the present invention provides an improved HTS and method for making and using same.
  • the present invention provides a process of encapsulating a stack of Bi-2223/Ag tapes with a silver or non-silver sheath to form a strengthened bundle superconductor. This process was applied to HTS tapes made by a Continuous Tube Forming and Filling (hereinafter "CTFF") technique described below, and off the shelf tapes obtained from other manufacturers. Conductor bundles of 2 to 6 tapes have been fabricated in accordance with the inventive method. The finished bundle conductor maintained or even surpassed the sum of the original critical currents I c of the individual tapes.
  • CTFF Continuous Tube Forming and Filling
  • FIG. la depicts a cross section of an illustrative 3- tape encapsulated HTS bundle 10 comprising an outer sheath 12 and stacked flat- filament HTS tapes 14.
  • FIG. 1 c illustrates a 6-tape encapsulated HTS bundle 10 comprising two stacks of 3 HTS tapes 14 disposed side-by-side. The specifics of the encapsulating technique are described below.
  • CTFF Continuous Tube Filling and Forming Process
  • FIG. 2 shows the main processing steps in the manufacture of the BSCCO tape.
  • the first innovation for BSCCO tape was the development of the CTFF process shown in FIG. 3. With this process, a silver strip 18 is used in lieu of a tube. The strip 18 is dispensed from a strip pay-out reel 19 and passes through a plurality of "U" shaped forming rolls 22. The strip 18 is formed and filled continuously with the precursor powder 20 as it is dispensed from powder feed 24. Shorter strips can be welded prior to powder filling to produce strips of any desired length, which permits fabrication of unlimited length wires having the powder contained therein.
  • the filled tube initially starts out at a very small diameter, typically on the order 4.0 mm, thereby reducing the number of drawing passes needed to obtain the desired characteristics.
  • a similar process has been used for a long time in the welding industry to make tubular welding wire.
  • CTFF process After filling the tube by the CTFF process, conventional continuous drawing and rolling steps are employed to increase the density of the powder inside the tube.
  • the strip 18 is passed through a plurality of "U" shaped closing rolls 26, a draw die 28 and thereafter received on a wire take-up reel 30.
  • wires and tapes may be fabricated with cross sections that are indistinguishable from those made by a conventional powder-in-tube process, as depicted schematically in FIG. 4 without the need to butt weld a seam as in the prior art.
  • the present invention provides for the manufacture of multi-filament tapes using the CTFF process. Restacking round wires or flat tapes inside another tube has been found to be even more productive than filling the tube with powder. In this regard, the restacking step is less dependent on speed than the powder filling step. Here again, length is not an issue as the process is continuous and uniform. After restacking, the encapsulated tape is subjected to a conventional rolling operation to convert the tape to desired thickness.
  • the UTLF process produces a superconductor in which most of the superconducting current is carried at the interface between the silver and the powder.
  • the powder-silver interface area is maximized.
  • the current density for a given precursor powder can be maximized for a given filament thickness.
  • maintaining a uniform filament thickness with restacked round wires is very difficult since the filament is always thick in the middle and tapers off to zero at the corners.
  • only a portion of that filament is at the optimal thickness.
  • more of the powder can be located at the ideal filament thickness and the superconductor to sheath ratio can be maximized.
  • the present invention provides increased current densities by pressing between sinters on a high-speed, continuous pressing machine 32, an example of which is depicted schematically in FIG. 6.
  • This machine comprises a pay-off spool 34, press 36 and take-up spool 38.
  • the tape assembly is dispensed and pressed in steps between components of press 36 as the tape assembly passes from pay-off spool 34 to take-up spool 38 between sintering steps.
  • This arrangement permits tape pressing in long continuous lengths at speeds comparable to the rolling operation.
  • one process that is not continuous is the critical sintering or heat-treating step.
  • This is still a batch process, which means that the only limitation on length is the size that be wound up and sintered at one time in the furnace.
  • Current ovens can accommodate tape lengths in the 200 meter range, however larger ovens will allow processing of 1000-2000 meter long tapes.
  • FIGS 7a and 7b show the transverse cross section of two tapes that were processed with identical powder and processing steps. Both tapes had similar transport currents (I c ) of ⁇ 20-22A at 77 °K in self field, and similar engineering current densities (J e ) of ⁇ 2000-200 A/cm 2 .
  • the tape 10a on the left consists of 33% superconductor and 67% silver.
  • the tape 10b on the right contains 34% superconductor, 36% silver, and 30% non-silver sheath material. This represents a 44% reduction in the amount of silver.
  • the non-silver sheath has a tensile strength of 480 Mpa and a yield strength of 270
  • the alloy may comprise Cu-Al-Mn-Ni, stainless steel/nickel based compounds, like inconels, Cu-Ni, or Cu-Al. It is believed that further improvements may see production of tapes with as little as 15% silver content.
  • the present bundling and encapsulating technique can be applied to commercially finished HTS tapes.
  • a sample was made with third party tapes by encapsulating a 3-HTS-tape bundle with a non-silver sheath.
  • the conductor's bending tolerance was tested by coiling it onto successively smaller diameter holders. Since the conductor sheath 12 has a first thickness on one side of the bundle and a second double thickness on the other side (see FIG. 1 a), the sample was cut in half.
  • One half of the conductor 10 was tested with the double sheath thickness on the ID of the winding, and the other half with the sheath disposed on the OD of the winding.
  • FIG. 9 shows the I-V curves of the half tested with the double sheath side on the ID of the winding. A gradual diminution in the current carrying capacity I c of the conductor was observed.
  • FIG. 10 shows the I-V curves of the other half tested with the double sheath side on the OD of the winding. A similar but less severe reduction in current carrying capacity I c was observed in that case.
  • the basic tape has a nominal I c of 15-16 amps.
  • the encapsulated bundle conductor has a greater I c than the original I c of the individual tapes.
  • the degradation of I c due to bending with the double sheath thickness on the ID of the winding was greater than with the double sheath thickness disposed on the OD of the winding.
  • the I c dropped to 31.1 A in the former case, but to only 41.5 A in the latter case.
  • the exemplary 3-HTS-tape bundle thickness is about 0.66 mm, the sheath thickness about 0.178 mm and the total conductor thickness about 1.194 mm.
  • the neutral plane in this example was located
  • the measured thickness of the HTS tapes under tension was 0.419 mm.
  • the measured thickness of the HTS tape under tension was O.141 mm, i.e. less superconductor was under tension in the latter case.
  • FIG. 12 shows the reduced I c , I c /I co as a function of the bending strain for this reprocessed tape and the bundle conductor described above.
  • the bundle conductor data is located along the curve drawn through the single tape data.
  • the I c degradation is due to bending strain, and in particular, the portion of the superconductor that is subjected to bending tension, irrespective of whether it is in a single tape or bundled assembly. More than 90% of the straight length I c can be retained if the bending strain is limited to 0.2%
  • the conductor If the conductor is bent to a specified diameter, it is subjected to a higher bending strain and consequent higher I c degradation because of its larger thickness. However, due to its greater strength and stiffness, it may not suffer additional degradation from strain attributable to handling and winding.
  • Possible variations of the superconductor bundles are: 1 . Different sheathing materials, Ag or non-Ag containing alloys can be used as desired for different strengths and different thermal contraction considerations.
  • a resistive barrier can be placed between the HTS tapes to reduce AC losses as shown in FIG. lb.
  • FIGS. 13a- 13c are cross sectional schematics ofHTS tapes having a diffusion bonded backing strip 40.
  • the backing strip 40 may have alloy plating
  • an alloyed backing strip 40 is diffusion bonded 41 to one side of an HTS tape 14.
  • an alloy plating 42 is applied to the backing strip 40.
  • the alloy plated backing stip 40 is diffusion bonded 41 to one of a pair of HTS tapes 14.
  • the backing strip 40 is located on the side of the assembly corresponding to the OD of the winding, so that most of the superconductor can be placed in compression, as discussed above with respect to the encapsulated bundle embodiment. This acts to minimize bending strain induced critical current degradation.
  • the unique procedure of pressing the HTS tape and sintering the same during the diffusion process makes the present invention suitable to make strengthened conductors out of finished
  • a strengthened conductor is achieved through diffusion bonding to a backing material.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

L'invention concerne une pile de rubans (14) supraconducteurs à haute température (HTS) qui sont groupés, encapsulés à l'aide d'une gaine (12) renfermant de l'argent ou ne renfermant pas d'argent au moyen d'un procédé de remplissage et de formage de tubes en continu sans soudure, et soumis à un frittage en vue de former le produit final. Un grand conducteur porteur de courant est obtenu par l'empilement de multiples rubans HTS. Le procédé de groupage est mis en oeuvre au moyen d'un procédé de remplissage et de formage de tubes en continu, qui permet de réempiler des fils ronds ou des rubans plats à l'intérieur d'un autre tube. Après réempilement, le ruban encapsulé est soumis à une opération classique de laminage permettant de lui donner une épaisseur voulue. Pour des applications de courant alternatif, une barrière résistante est introduite entre des rubans HTS de façon à empêcher un affaiblissement de couplage entre ceux-ci. Afin de réduire les coûts occasionnés par les gaines, on peut utiliser un alliage ne renfermant pas d'argent, tel que Cu-Al-Mn-Ni, des composés à base d'acier inoxydable/nickel tels que des Inconels, Cu-Ni, ou Cu-Al. Dans un mode de réalisation, un ruban HTS est renforcé avec une bande d'alliage au moyen d'un procédé de soudage par diffusion et de frittage en une seule étape. La bande support est placée sur l'extérieur de l'enroulement, de sorte que la plus grande partie du ruban est mise en compression lorsqu'on lui fait suivre un tracé sinueux.
PCT/US1998/016069 1997-08-01 1998-07-30 Supraconducteur a haute temperature et procede de fabrication et d'utilisation de celui-ci WO1999007003A1 (fr)

Priority Applications (1)

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AU87646/98A AU8764698A (en) 1997-08-01 1998-07-30 A high temperature superconductor and method of making and using same

Applications Claiming Priority (2)

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US5508197P 1997-08-01 1997-08-01
US60/055,081 1997-08-01

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2056369A2 (fr) 2007-10-31 2009-05-06 Korea Electro Technology Research Institute Bande supraconductrice comprenant une couche de revêtement métallique et son procédé de fabrication
WO2016130141A1 (fr) * 2015-02-12 2016-08-18 Massachusetts Institute Of Technology Câbles pour courant fort supraconducteurs à haute température
US10079092B2 (en) 2015-02-12 2018-09-18 Massachusetts Institute Of Technology High-temperature superconducting high-current devices compensated for anisotropic effects

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3595982A (en) * 1967-12-20 1971-07-27 Siemens Ag Supercounducting alternating current cable
US4952554A (en) * 1987-04-01 1990-08-28 At&T Bell Laboratories Apparatus and systems comprising a clad superconductive oxide body, and method for producing such body
US5114908A (en) * 1989-08-09 1992-05-19 Sumitomo Electric Industries, Ltd. Superconductive conductor
US5508254A (en) * 1990-07-16 1996-04-16 Sumitomo Electric Industries, Ltd. Method of preparing oxide superconducting wire
US5625332A (en) * 1993-05-17 1997-04-29 Hitachi, Ltd. Oxide superconducting wire and superconducting apparatus thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3595982A (en) * 1967-12-20 1971-07-27 Siemens Ag Supercounducting alternating current cable
US4952554A (en) * 1987-04-01 1990-08-28 At&T Bell Laboratories Apparatus and systems comprising a clad superconductive oxide body, and method for producing such body
US5114908A (en) * 1989-08-09 1992-05-19 Sumitomo Electric Industries, Ltd. Superconductive conductor
US5508254A (en) * 1990-07-16 1996-04-16 Sumitomo Electric Industries, Ltd. Method of preparing oxide superconducting wire
US5625332A (en) * 1993-05-17 1997-04-29 Hitachi, Ltd. Oxide superconducting wire and superconducting apparatus thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2056369A2 (fr) 2007-10-31 2009-05-06 Korea Electro Technology Research Institute Bande supraconductrice comprenant une couche de revêtement métallique et son procédé de fabrication
EP2056369A3 (fr) * 2007-10-31 2010-09-01 Korea Electrotechnology Research Institute Bande supraconductrice comprenant une couche de revêtement métallique et son procédé de fabrication
WO2016130141A1 (fr) * 2015-02-12 2016-08-18 Massachusetts Institute Of Technology Câbles pour courant fort supraconducteurs à haute température
US10062485B2 (en) 2015-02-12 2018-08-28 Massachusetts Institute Of Technology High-temperature superconducting high-current cables
US10079092B2 (en) 2015-02-12 2018-09-18 Massachusetts Institute Of Technology High-temperature superconducting high-current devices compensated for anisotropic effects

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