WO1999002295A3 - Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire - Google Patents

Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire Download PDF

Info

Publication number
WO1999002295A3
WO1999002295A3 PCT/US1998/014040 US9814040W WO9902295A3 WO 1999002295 A3 WO1999002295 A3 WO 1999002295A3 US 9814040 W US9814040 W US 9814040W WO 9902295 A3 WO9902295 A3 WO 9902295A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
wire
longitudinal axis
diamond
ingot
Prior art date
Application number
PCT/US1998/014040
Other languages
French (fr)
Other versions
WO1999002295A2 (en
Inventor
John B Hodsden
Original Assignee
Laser Technology West Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/888,952 external-priority patent/US5878737A/en
Priority claimed from US09/108,864 external-priority patent/US6024080A/en
Application filed by Laser Technology West Limited filed Critical Laser Technology West Limited
Priority to JP2000501861A priority Critical patent/JP2001510742A/en
Priority to KR1020007000097A priority patent/KR20010021539A/en
Priority to EP98933215A priority patent/EP1009569A2/en
Publication of WO1999002295A2 publication Critical patent/WO1999002295A2/en
Publication of WO1999002295A3 publication Critical patent/WO1999002295A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D31/00—Shearing machines or shearing devices covered by none or more than one of the groups B23D15/00 - B23D29/00; Combinations of shearing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

An apparatus and method for slicing a workpiece (14), in particular, a polysilicon or single crystal silicon ingot (14), utilizing a diamond impregnated wire saw (12) in which either the workpiece (or ingot) is rotated, either continuously or reciprocally, about its longitudinal axis or the diamond wire saw (12) is rotated, either reciprocally or continuously, about the longitudinal axis of the workpiece as the diamond wire (12) is driven orthogonally to the longitudinal axis of the workpiece (14). When the relative rotation is continuous, the wire (12) is advanced from a position tangentially adjoining the outer diameter ('OD') of the ingot to a position tangential to its center or inner diameter ('ID'). When the rotation is reciprocating, the wire (12) is advanced from a position tangentially adjoining the outer diameter to a position through the workpiece. In both cases, the diamond wire (12) cuts through the workpiece (14) at a substantially tangential point to the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal 'kerf' loss and less extensive follow-on lapping operations.
PCT/US1998/014040 1997-07-07 1998-07-06 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire WO1999002295A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000501861A JP2001510742A (en) 1997-07-07 1998-07-06 Apparatus and method for slicing a workpiece using diamond-impregnated wire
KR1020007000097A KR20010021539A (en) 1997-07-07 1998-07-06 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
EP98933215A EP1009569A2 (en) 1997-07-07 1998-07-06 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US08/888,952 US5878737A (en) 1997-07-07 1997-07-07 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US08/888,952 1997-07-07
US99307797A 1997-12-18 1997-12-18
US08/993,077 1997-12-18
US09/108,864 US6024080A (en) 1997-07-07 1998-07-01 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US09/108,864 1998-07-01

Publications (2)

Publication Number Publication Date
WO1999002295A2 WO1999002295A2 (en) 1999-01-21
WO1999002295A3 true WO1999002295A3 (en) 1999-10-07

Family

ID=27380559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/014040 WO1999002295A2 (en) 1997-07-07 1998-07-06 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire

Country Status (4)

Country Link
EP (1) EP1009569A2 (en)
JP (1) JP2001510742A (en)
KR (1) KR20010021539A (en)
WO (1) WO1999002295A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697024A5 (en) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Wire sawing device.
RU2193486C1 (en) * 2001-11-27 2002-11-27 Левон Мурадович Мурадян Machine for hard material cutting
US8623137B1 (en) * 2008-05-07 2014-01-07 Silicon Genesis Corporation Method and device for slicing a shaped silicon ingot using layer transfer
WO2010009881A1 (en) * 2008-07-23 2010-01-28 Meyer Burger Ag Multi-wire cutting device with a revolving workpiece mount
DE102009040665B4 (en) * 2009-09-09 2012-08-30 HK Präzisionstechnik GmbH Method and separation system with apparatus for separating processing of crystalline materials
CN101913210B (en) * 2010-08-19 2012-08-08 英利能源（中国）有限公司 Polycrystalline silicon ingot ripping method
CN101927533B (en) * 2010-08-19 2012-07-04 英利能源（中国）有限公司 Method for cubing single crystal bar
JP5185419B2 (en) * 2011-08-22 2013-04-17 コマツＮｔｃ株式会社 Wire saw
JP6598438B2 (en) * 2014-08-20 2019-10-30 富士電機株式会社 Manufacturing method of semiconductor device
CN107030909A (en) * 2017-05-15 2017-08-11 南通综艺新材料有限公司 A kind of use diamond wire blocks the cutting technique of polycrystal silicon ingot
CN110103346A (en) * 2019-06-04 2019-08-09 泰州市晨虹数控设备制造有限公司 A kind of large size silicon-carbide chip diamond wire saw lathe
CN110202709A (en) * 2019-07-09 2019-09-06 深圳市雯逸水晶有限公司 A kind of adjustable cutting washing degumming device of single crystal product article
EP4029670A1 (en) * 2021-01-15 2022-07-20 Lapmaster Wolters GmbH Device and method for cutting a solid substrate
CN113306031A (en) * 2021-05-24 2021-08-27 福州天瑞线锯科技有限公司 Silicon rod bidirectional cutting mechanism

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5628301A (en) * 1995-07-14 1997-05-13 Tokyo Seimitsu Co., Ltd. Wire traverse apparatus of wire saw
US5699782A (en) * 1995-05-31 1997-12-23 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
US5715806A (en) * 1994-12-15 1998-02-10 Sharp Kabushiki Kaisha Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
US5715806A (en) * 1994-12-15 1998-02-10 Sharp Kabushiki Kaisha Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5699782A (en) * 1995-05-31 1997-12-23 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5628301A (en) * 1995-07-14 1997-05-13 Tokyo Seimitsu Co., Ltd. Wire traverse apparatus of wire saw

Also Published As

Publication number Publication date
JP2001510742A (en) 2001-08-07
EP1009569A2 (en) 2000-06-21
WO1999002295A2 (en) 1999-01-21
KR20010021539A (en) 2001-03-15

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