CN110103346A - A kind of large size silicon-carbide chip diamond wire saw lathe - Google Patents
A kind of large size silicon-carbide chip diamond wire saw lathe Download PDFInfo
- Publication number
- CN110103346A CN110103346A CN201910481399.2A CN201910481399A CN110103346A CN 110103346 A CN110103346 A CN 110103346A CN 201910481399 A CN201910481399 A CN 201910481399A CN 110103346 A CN110103346 A CN 110103346A
- Authority
- CN
- China
- Prior art keywords
- wire
- silk
- driving mechanism
- pedestal
- chevron shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 41
- 239000010432 diamond Substances 0.000 title claims abstract description 41
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 30
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000001514 detection method Methods 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 34
- 239000004576 sand Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 206010038743 Restlessness Diseases 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A kind of large size silicon-carbide chip diamond wire saw lathe, it includes pedestal (1) and the door shape column (12) for being equipped with Yarn guide component, it is characterized in that being respectively equipped with a wire transporting component (2) on the pedestal (1) of (12) two side of door shape column, sliding block, which is mounted on guide rail and is driven by servo motor, realizes that stepping puts silk or receives silk；The chevron shaped column of Y-direction (3) is installed at the center of pedestal (1), the chevron shaped column of Y-direction (3) is driven by Y-direction driving mechanism (4) makees front and back feeding movement；Z-direction slide plate is installed on the chevron shaped column of Y-direction (3), Z-direction slide plate is driven by the Z-direction driving mechanism (5) for being mounted on the chevron shaped column of Y-direction (3) top and is moved up and down, it is equipped in C axis driving mechanism (6) workpiece grip mechanism (7), C axis driving mechanism (6) drives the workpiece to be machined on workpiece grip mechanism (7) to turn round or swing.The configuration of the present invention is simple, easily manufactured, processing quality is reliable and stable, high-efficient.
Description
Technical field
The present invention relates to a kind of wire cutting machine tools, especially a kind of to change a wire cutting machine tool for period length, specifically
A kind of large size silicon-carbide chip diamond wire saw lathe.
Background technique
Silicon carbide is a kind of multi-crystalline compounds.At a high temperature of 560 degree Celsius, silicon carbide wafer does not have cooling device
In the case of remain to work operation, have irreplaceable advantage in the extreme environments application such as space flight, military project, nuclear energy.
Silicon carbide wafer is third generation semiconductor material, has forbidden bandwidth is big, critical breakdown strength is high, thermal conductivity is high etc.
Advantage is the ideal material for making high pressure, large power semiconductor device.The single-crystal silicon carbide of high quality major diameter is particularly important,
But chip processing then plays a decisive role to the surface quality of chip, wherein body block monocrystalline is cut into, angularity is small, thickness is equal
Chip even, that knife seam loss is small is extremely important, otherwise will come to subsequent grinding and polishing work belt greatly difficult.Not due to SiC
Family name's hardness is 9.2, is only second to diamond (its Mohs' hardness is 10), difficulty of processing is very big.When the diameter of crystal reaches 2 inches
When, conventional inner circle cutting machine cannot effectively work, and the silicon carbide wafer of certain thin size can not cutting processing.It is necessary
Using diamond wire saw technology.The bobbins of high speed rotation and reciprocating rotating drives diamond wire to move reciprocatingly, diamond
Line is tensioned by two tensioning line wheels (spring or pneumatic), while adding two directive wheels to ensure the precision and face type cut.
It is constantly fed by automatically controlling workbench to diamond wire console direction, or controls diamond wire console to work
Platform direction is constantly fed, to make to generate grinding between diamond wire and material to be cut part and form cutting.In cutting process, due to
Diamond wire diameter is small, and has elasticity, and diamond cutting secant is by material to be cut part and positioned at two directive wheels of its left and right
Between form a subtended angle, diamond wire is in micro-arc shape.Therefore be applied to power on material to be cut part in conjunction with diamond wire with
Relative motion between material to be cut part carries out cutting constantly.
There is following deficiency in the prior art, 1. prior arts use reciprocal sand line feeding or workpiece between two capstan of processing district
Feeding mode easily makes processing district sand line drift about or shake, so that the silicon carbide surface of cutting processing is uneven, deep mixed item
Line, this carrys out greatly difficulty to grinding and polishing work belt, and serious later process, which is unable to complete, causes scrapping for material.2. on wire storage tube
Boart boart line reserves are limited, and typically less than 300 meters, the diamond wire of insufficient length participates in cutting processing, and the cutting edge of sand line is not
It is enough to cut entire chip, re-replaces diamond wire, influence processing efficiency, is greater than due to replacing not add with the sand line footpath of processing
Processed old sand linear diameter is participated in, secondary cut is brought after replacing diamond wire, brings more serious deep mixed striped, shadow
Processing matter reason and efficiency are rung.3. wire transporting main motor is generally common three-phase induction motor with frequency converter timing, speed adjustable range is small,
Motor output torque is small when low frequency, and boart boart line tension fluctuates when deceleration commutates, and processing technology is flexible insufficient, close to cut
Chip chipping is easily caused when processing.
Summary of the invention
The purpose of the present invention is, because of cutting line curtailment, easily occur processing quality shakiness for existing wire cutting machine tool
The problem of, design the large size silicon-carbide chip diamond wire saw lathe that a kind of cutting is stable, wire length is long.
The technical scheme is that
A kind of large size silicon-carbide chip diamond wire saw lathe, it includes pedestal 1, and it is vertical that the center of pedestal 1 is equipped with a shape
Column 12 is equipped with Yarn guide component on door shape column 12, it is characterized in that being respectively equipped with one on the pedestal 1 of 12 2 side of door shape column
A wire transporting component 2, diamond silk thread are drawn from the wire transporting component of side and are received after wire assembly by the wire transporting component of the other side
Silk, wire transporting component 2 are mounted on sliding block, and sliding block, which is mounted on guide rail and is driven by servo motor, realizes that stepping puts silk or receives silk；
The chevron shaped column 3 of Y-direction is installed at the center of pedestal 1, the chevron shaped column 3 of Y-direction is driven by Y-direction driving mechanism 4 makees front and back feeding
It is mobile；Z-direction slide plate is installed on the chevron shaped column 3 of Y-direction, Z-direction slide plate is driven by the Z-direction for being mounted on chevron shaped 3 top of column of Y-direction
The driving of motivation structure 5 moves up and down, and C axis driving mechanism 6 is equipped on Z-direction slide plate, is equipped with workpiece clamp in C axis driving mechanism 6
Mechanism 7 is held, C axis driving mechanism 6 drives the workpiece to be machined on workpiece grip mechanism 7 to turn round or swing.
The wire transporting component 2 is made of wire transporting spindle motor and silk cylinder, they are installed in synchronizing moving on sliding block, sliding
Block is mounted on guide rail and is driven by lead screw, and lead screw is driven by servo motor.
Diamond silk thread list on the silk cylinder is led or multi-lay winding, and length is 1000-10000 meters.
The Yarn guide component includes the transition guide wheel 8 being mounted on a shape column, tensioning wheel 9,10 and of tension detection wheel
Capstan 11.
Beneficial effects of the present invention:
On double wire transporting device silk cylinders of the invention can layer wind the metal and stone lines of several kms a to myriametre, using asymptotic expression wire mould
Formula centainly rolls up the sand line of number i.e. length (such as numbers of volume 1000) according to technique initialization between two cylinders with the number of setting (such as 50
It is secondary) it moves back and forth, when the reciprocal time for reaching setting, the carborundum line of cutting is participated in set volume number (such as volume 2) and is wrapped in B
Cutting processing is no longer participate on cylinder, A cylinders place volume number (such as volume 2) of the diamond wire for having neither part nor lot in cutting to set, under participation
One cutting processing, the diamond wire of final consume totally are wrapped on B wire transporting silk cylinder.Fracture of wire such as occurs for process, will wind B
On wire transporting device sand line remove, will have neither part nor lot in again processing cutting A cylinders on sand line again wire arrangement, re-work cutting.
The loss of fracture of wire and sand line is insignificant, reduces loss, and asymptotic expression wire improves flatness, this brings product to later process
The influence of pole.Wire transporting spindle motor uses high-power servo motor, and slowing down ensures that tension is steady when commutating, close to cutting processing knot
Beam can adjust wire travelling speed, reach optimal cutting technique state.
C axis driving workpiece rotation improves processing efficiency, cuts and repair that knife is organic gathers together, and improves surface matter
Workpiece finally can be used according to setting and swing mode cutting processing, because with the diameter at the carry out work piece cut of cutting for amount
The intensity that becomes smaller becomes smaller, and finally the cutting stage easily forms fracture, influences later process, serious to scrap workpiece.
Diamond wire saw tension can set adjustment in real time and feed back to control system, guarantee processing district sand line tension and sand line
Stability.This is the necessary condition that cut quality guarantees.
The configuration of the present invention is simple, easily manufactured, processing quality is reliable and stable, high-efficient.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is the rearview of Fig. 1.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
As shown in Figs. 1-2.
A kind of large size silicon-carbide chip diamond wire saw lathe, it includes pedestal 1, and the center of pedestal 1 is equipped with door
Shape column 12, is equipped with Yarn guide component on door shape column 12, Yarn guide component include the transition guide wheel 8 being arranged symmetrically, tensioning wheel 9,
The structure of tension detection wheel 10 and capstan 11, each component in Yarn guide component is the same as those in the prior art, can directly will be existing
Relevant component is on lathe of the invention in equipment, as shown in Figure 1.Respectively pacify on the pedestal 1 of 12 2 side of door shape column
Equipped with a wire transporting component 2, the wire transporting component 2 is generally made of wire transporting spindle motor and silk cylinder, on the silk cylinder
Diamond silk thread list is led or multi-lay winding, and length is 1000-10000 meters.Wire transporting spindle motor and silk cylinder are installed on sliding block
Synchronizing moving, sliding block are mounted on guide rail and are driven by lead screw, and lead screw is driven by servo motor.Along straight while putting silk cylinder rotation
Line is mobile, so that silk thread is kept ideal unwrapping wire state, puts silk and wire transporting more suitable for the silk cylinder of multi-lay winding, prevent fracture of wire and unrest
The generation of silk phenomenon, and the timely correction when such situation occurs.Diamond silk thread is drawn from the wire transporting component of side by leading
Silk is received by the wire transporting component of the other side after line component, wire transporting component 2 is mounted on sliding block, and sliding block is mounted on guide rail and by servo
Motor driven realizes that stepping puts silk or receives silk；The chevron shaped column 3 of Y-direction is installed at the center of pedestal 1, such as Fig. 2, Y-direction is chevron shaped
Column 3 is driven by Y-direction driving mechanism 4 makees front and back feeding movement；Y-direction driving mechanism 4 is generally by motor, belt wheel, lead screw, nut group
At, the identical Y-direction driving structure of existing driving structure can be used, it can also self design.In the chevron shaped column of Y-direction
Z-direction slide plate is installed, Z-direction slide plate is typically also by electricity by the Z-direction driving mechanism 5(for being mounted on chevron shaped 3 top of column of Y-direction on 3
Machine, feed screw nut form driving structure, can be realized by using the prior art) driving move up and down, be equipped on Z-direction slide plate
The suitable main shaft of C axis driving mechanism 6(, is made of spindle motor and the main tapping with chuck or clamping device), C axis driving mechanism 6
On be equipped on workpiece grip mechanism 7(i.e. main shaft clamping device 7 is installed), C axis driving mechanism 6 drive workpiece grip mechanism 7
On workpiece to be machined turn round or swing.
As shown in Figs. 1-2, the bis- wire transportings of AB are placed in pedestal two sides, can multi-lay winding diamond wire length on silk cylinder.Y-direction herringbone
Type traveller is located at pedestal center, and Y-direction driving mechanism drives feeding before and after column, is equipped with Z-direction slide plate, Z-direction driving machine before column
Structure drives Z-direction slide plate bottom and top feed, and workpiece grip mechanism is equipped on Z-direction slide plate, and C axis driving mechanism drives workpiece grip mechanism rotation
Turn or swings.Two vertical columns are symmetrically put on two wing base of traveller, and main processing guide wheel assembly, tension inspection are put on vertical columns
Guide wheel assembly, transition guide wheel assembly are surveyed, tension guide wheel device and feedback device are put in vertical columns upper end.
When processing, it will first be located on pedestal side A wire transporting device silk cylinder and wind multi-layer diamond line, can be set according to line footpath
Arrange silk gap, after by diamond wire through transition guide wheel, tensioning wheel, tension detection wheel, capstan, tension detection wheel, tensioning wheel, mistake
Guide wheel is crossed to another lateral filament cylinder, workpiece is placed in C shaft-like work fixed plate, and when processing opens wire transporting, Y-direction and Z-direction position are set,
C axis drives workpiece rotation according to setting with certain revolving speed, and Z axis is displaced according to the speed band of setting part of starting building, diamond wire with
Linear velocity movement and the workpiece of setting generate relative motion, to generate cutting processing.
On double wire transporting device silk cylinders of the invention can layer wind the metal and stone lines of several kms a to myriametre, using asymptotic expression wire
Mode, centainly rolled up according to technique initialization the sand line of number i.e. length (such as numbers of volume 1000) between two cylinders with the number of setting (such as
50 times) it moves back and forth, when the reciprocal time for reaching setting, the carborundum line of cutting is participated in set volume number (such as volume 2) and is wrapped in B
Cutting processing is no longer participate on silk cylinder, A cylinders are placed volume number (such as volume 2) of the diamond wire for having neither part nor lot in cutting to set, participated in
Next cutting processing, the diamond wire of final consume totally are wrapped on B wire transporting silk cylinder.Fracture of wire such as occurs for process, will twine
On B wire transporting device sand line remove, will have neither part nor lot in again processing cutting A cylinders on sand line again wire arrangement, re-work and cut
It cuts.The loss of fracture of wire and sand line is insignificant, reduces loss, and asymptotic expression wire improves flatness, this is to later process band
Carry out active influence.For wire transporting spindle motor using high-power servo motor, slowing down ensures that tension is steady when commutating, and adds close to cutting
Work terminates, and can adjust wire travelling speed, reaches optimal cutting technique state.
C axis driving workpiece rotation improves processing efficiency, cuts and repair that knife is organic gathers together, and improves surface matter
Workpiece finally can be used according to setting and swing mode cutting processing, because with the diameter at the carry out work piece cut of cutting for amount
The intensity that becomes smaller becomes smaller, and finally the cutting stage easily forms fracture, influences later process, serious to scrap workpiece.
Diamond wire saw tension can set adjustment in real time and feed back to control system, guarantee processing district sand line tension and sand line
Stability.This is the necessary condition that cut quality guarantees.
Part that the present invention does not relate to is the same as those in the prior art or can be realized by using the prior art.
Claims (4)
1. a kind of large size silicon-carbide chip diamond wire saw lathe, it includes pedestal (1), and the center of pedestal (1) is equipped with
Door shape column (12) is equipped with Yarn guide component on door shape column (12), it is characterized in that the pedestal of (12) two side of door shape column
(1) a wire transporting component (2) is respectively installed, diamond silk thread is drawn after wire assembly from the wire transporting component of side by another on
The wire transporting component of side receives silk, and wire transporting component (2) is mounted on sliding block, and sliding block is mounted on guide rail and is driven by servo motor real
Existing stepping puts silk or receives silk；The chevron shaped column of Y-direction (3) is installed at the center of pedestal (1), the chevron shaped column of Y-direction (3) is by Y-direction
Front and back feeding movement is made in driving mechanism (4) driving；Z-direction slide plate is installed on the chevron shaped column of Y-direction (3), Z-direction slide plate is by installing
Z-direction driving mechanism (5) driving on the chevron shaped column of Y-direction (3) top moves up and down, and C axis driving machine is equipped on Z-direction slide plate
Structure (6) is equipped with workpiece grip mechanism (7) in C axis driving mechanism (6), and C axis driving mechanism (6) drives workpiece grip mechanism (7)
On workpiece to be machined turn round or swing.
2. large size silicon-carbide chip diamond wire saw lathe according to claim 1, it is characterized in that the wire transporting
Component (2) is made of wire transporting spindle motor and silk cylinder, they are installed in synchronizing moving on sliding block, and sliding block is mounted on guide rail simultaneously
It is driven by lead screw, lead screw is driven by servo motor.
3. large size silicon-carbide chip diamond wire saw lathe according to claim 2, it is characterized in that the silk cylinder
On diamond silk thread list lead or multi-lay winding, length is 1000-10000 meters.
4. large size silicon-carbide chip diamond wire saw lathe according to claim 1, it is characterized in that the seal wire
Component includes the transition guide wheel (8) being mounted on a shape column, tensioning wheel (9), tension detection wheel (10) and capstan (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910481399.2A CN110103346A (en) | 2019-06-04 | 2019-06-04 | A kind of large size silicon-carbide chip diamond wire saw lathe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910481399.2A CN110103346A (en) | 2019-06-04 | 2019-06-04 | A kind of large size silicon-carbide chip diamond wire saw lathe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110103346A true CN110103346A (en) | 2019-08-09 |
Family
ID=67493779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910481399.2A Withdrawn CN110103346A (en) | 2019-06-04 | 2019-06-04 | A kind of large size silicon-carbide chip diamond wire saw lathe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110103346A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111231142A (en) * | 2020-03-05 | 2020-06-05 | 苏州市汇峰机械设备有限公司 | Loop wire cutting machine |
| CN110421222B (en) * | 2019-08-12 | 2020-07-14 | 烟台德丰精密钣金有限公司 | Full-automatic cutting unit |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999002295A2 (en) * | 1997-07-07 | 1999-01-21 | Laser Technology West, Limited | Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
| CN102528953A (en) * | 2011-12-29 | 2012-07-04 | 江西金葵能源科技有限公司 | Diamond wire single-rod multi-wire cutting machine |
| CN102555091A (en) * | 2012-02-29 | 2012-07-11 | 无锡斯达新能源科技有限公司 | Multi-station sapphire single-wire swinging cutting machine |
| CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
| CN103538159A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material cutting device |
| CN104890036A (en) * | 2015-06-29 | 2015-09-09 | 泰州市晨虹数控设备制造有限公司 | Horizontal diamond wire cutting machine tool |
| CN206066728U (en) * | 2016-08-31 | 2017-04-05 | 傅林军 | A kind of diamond wire monocrystalline evolution and polycrystalline cutting machine |
| CN206277533U (en) * | 2016-12-06 | 2017-06-27 | 浙江晶盛机电股份有限公司 | A kind of workbench rocking equipment for sapphire wafer multi-line cutting machine |
| CN207629338U (en) * | 2017-12-12 | 2018-07-20 | 安徽省振泉数控科技有限公司 | High-precision Wire-conveying mechanism of quick walk for wire cutting machine tool |
| CN210256793U (en) * | 2019-06-04 | 2020-04-07 | 泰州市晨虹数控设备制造有限公司 | Large-size silicon carbide wafer diamond wire cutting machine tool |
-
2019
- 2019-06-04 CN CN201910481399.2A patent/CN110103346A/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
| WO1999002295A2 (en) * | 1997-07-07 | 1999-01-21 | Laser Technology West, Limited | Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| CN102528953A (en) * | 2011-12-29 | 2012-07-04 | 江西金葵能源科技有限公司 | Diamond wire single-rod multi-wire cutting machine |
| CN102555091A (en) * | 2012-02-29 | 2012-07-11 | 无锡斯达新能源科技有限公司 | Multi-station sapphire single-wire swinging cutting machine |
| CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
| CN103538159A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material cutting device |
| CN104890036A (en) * | 2015-06-29 | 2015-09-09 | 泰州市晨虹数控设备制造有限公司 | Horizontal diamond wire cutting machine tool |
| CN206066728U (en) * | 2016-08-31 | 2017-04-05 | 傅林军 | A kind of diamond wire monocrystalline evolution and polycrystalline cutting machine |
| CN206277533U (en) * | 2016-12-06 | 2017-06-27 | 浙江晶盛机电股份有限公司 | A kind of workbench rocking equipment for sapphire wafer multi-line cutting machine |
| CN207629338U (en) * | 2017-12-12 | 2018-07-20 | 安徽省振泉数控科技有限公司 | High-precision Wire-conveying mechanism of quick walk for wire cutting machine tool |
| CN210256793U (en) * | 2019-06-04 | 2020-04-07 | 泰州市晨虹数控设备制造有限公司 | Large-size silicon carbide wafer diamond wire cutting machine tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421222B (en) * | 2019-08-12 | 2020-07-14 | 烟台德丰精密钣金有限公司 | Full-automatic cutting unit |
| CN111231142A (en) * | 2020-03-05 | 2020-06-05 | 苏州市汇峰机械设备有限公司 | Loop wire cutting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10137553B2 (en) | Abrasive belt grinding center applicable to grinding and polishing of whole profile of blisk | |
| KR101625709B1 (en) | Method of cutting workpiece with wire saw and wire saw | |
| CN109227976B (en) | Self-adaptation diamond wire saw cutting equipment | |
| CN103203808B (en) | Efficient multi-line cutting device and method | |
| CN103407009A (en) | Multi-diamond-wire cutting machine | |
| CN102513643A (en) | Automatic material distribution equipment for entire-soldering diamond saw blade | |
| CN214187894U (en) | Silicon rod loading device and silicon rod processing equipment | |
| CN110103346A (en) | A kind of large size silicon-carbide chip diamond wire saw lathe | |
| CN214394865U (en) | Flaw-piece discharging mechanism and silicon rod processing equipment | |
| JP2010105061A (en) | Wire saw apparatus | |
| CN214562085U (en) | Chamfering device and silicon rod processing equipment | |
| CN201471610U (en) | Multi-line cutting type diamond linear cutting machine | |
| CN112109222A (en) | A cut device for silicon rod | |
| WO2022041864A1 (en) | Cutting apparatus and silicon rod processing device | |
| Knoblauch et al. | Endless diamond wire saw for monocrystalline silicon cutting | |
| WO2023226735A1 (en) | Curved form cutting wire saw machine and cutting method | |
| CN103659604A (en) | Grinding disc flatness correcting device | |
| JP2011167810A (en) | Wire saw | |
| CN203266962U (en) | Fret saw cutting semiconductor work piece | |
| CN210256793U (en) | Large-size silicon carbide wafer diamond wire cutting machine tool | |
| JP2011167810A5 (en) | ||
| CN204622357U (en) | Numerical control sapphire multistation single line excavation machine | |
| CN217021033U (en) | Multi-shaft multi-station cutting machine | |
| CN217831657U (en) | High-speed multi-ring continuous cutting device based on numerical control technology | |
| CN109513999A (en) | Full-automatic pipe cutting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190809 |
|
| WW01 | Invention patent application withdrawn after publication |