WO1998048081A2 - Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens - Google Patents
Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens Download PDFInfo
- Publication number
- WO1998048081A2 WO1998048081A2 PCT/EP1998/002196 EP9802196W WO9848081A2 WO 1998048081 A2 WO1998048081 A2 WO 1998048081A2 EP 9802196 W EP9802196 W EP 9802196W WO 9848081 A2 WO9848081 A2 WO 9848081A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- continuous product
- chambers
- continuous
- cell
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
Definitions
- the invention relates to a process for the electrolytic coating of metallic or non-metallic continuous products with metals or alloys in a continuous process from aprotic water- and oxygen-free electrolytes.
- Another object of the invention is a device for performing this method.
- Non-aqueous systems are referred to as electrolytes in the sense of the invention, which allow a controlled, pure deposition of the metal or the metal alloy, in particular of aluminum and aluminum alloys, via the electrolysis process without an intermediate or carrier layer.
- Figure 4 shows the contacting cell.
- the wire is introduced into the device according to the invention via particularly expediently designed vacuum or liquid lock systems, the latter being designed similarly to the contacting cells between the coating cells. This is possible for both single and multi-wire systems.
- the sealing medium can also be used to clean the wire surface.
- the processes between the lock systems always run completely under an inert atmosphere.
- the wire guides are specifically designed so that the wire is moved through the coating cell at a uniform distance from the anodes serving as coating material, without making electrical contact with adjacent wires or the anode.
- the invention ensures that mechanical or physico-chemical stripping processes do not influence the uniformity or homogeneity of the applied surface layer 0. With the method according to the invention, it is possible to easily replace the aluminum electrodes in the coating cells and to restart operation immediately.
- the contacting cell 5 is preferably designed such that a metal roller or a sliding contact is arranged in it, via which the continuous product is connected cathodically.
- one or more ceramic tensioning rollers can be arranged in the contacting cell for setting the pretension.
- the metal roll has a notch over which the continuous product is passed.
- an overflow is also preferably arranged so that urgent electrolytes can be discharged from the electrolytic cell into a collection system.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Processing (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/403,430 US6340422B1 (en) | 1997-04-19 | 1998-04-15 | Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
CA002287179A CA2287179C (en) | 1997-04-19 | 1998-04-15 | Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
EP98922715A EP0975826B1 (de) | 1997-04-19 | 1998-04-15 | Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens |
AU75257/98A AU7525798A (en) | 1997-04-19 | 1998-04-15 | Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
JP54495798A JP4411397B2 (ja) | 1997-04-19 | 1998-04-15 | 金属または非金属からなる連続製品のめっき方法、およびこの方法に用いる装置 |
DE59804675T DE59804675D1 (de) | 1997-04-19 | 1998-04-15 | Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens |
AT98922715T ATE220130T1 (de) | 1997-04-19 | 1998-04-15 | Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19716493.5 | 1997-04-19 | ||
DE19716493A DE19716493C2 (de) | 1997-04-19 | 1997-04-19 | Verfahren zum elektrolytischen Beschichten von metallischen oder nichtmetallischen Endlosprodukten und Vorrichtung zur Durchführung des Verfahrens |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998048081A2 true WO1998048081A2 (de) | 1998-10-29 |
WO1998048081A3 WO1998048081A3 (de) | 1999-02-11 |
Family
ID=7827072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1998/002196 WO1998048081A2 (de) | 1997-04-19 | 1998-04-15 | Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens |
Country Status (9)
Country | Link |
---|---|
US (1) | US6340422B1 (de) |
EP (1) | EP0975826B1 (de) |
JP (1) | JP4411397B2 (de) |
AT (1) | ATE220130T1 (de) |
AU (1) | AU7525798A (de) |
CA (1) | CA2287179C (de) |
DE (2) | DE19716493C2 (de) |
WO (1) | WO1998048081A2 (de) |
ZA (1) | ZA983275B (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002289559A (ja) * | 2001-02-01 | 2002-10-04 | Texas Instr Inc <Ti> | 集積回路の製造方法 |
US7204918B2 (en) * | 2003-03-10 | 2007-04-17 | Modular Components National, Inc. | High efficiency plating apparatus and method |
US9149990B2 (en) * | 2007-03-30 | 2015-10-06 | Airbus Operations Gmbh | Apparatus for the forming of a lay-up of fibre composite material |
US9157160B2 (en) | 2013-08-22 | 2015-10-13 | Ashworth Bros., Inc. | System and method for electropolishing or electroplating conveyor belts |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4419204A (en) * | 1981-09-23 | 1983-12-06 | Siemens Aktiengesellschaft | Installation for the electro-deposition of metals, particularly aluminum |
US4444636A (en) * | 1980-06-25 | 1984-04-24 | Siemens Aktiengesellschaft | System for the galvanic deposition of metals such as aluminum |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE761101A (fr) * | 1970-03-25 | 1971-05-27 | Nisshin Steel Co Ltd | Dispositif pour la metallisation galvano-plastique des metaux |
DE2153831C3 (de) * | 1971-10-28 | 1980-10-02 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verformungshilfsstoff |
US4401522A (en) * | 1980-09-29 | 1983-08-30 | Micro-Plate, Inc. | Plating method and apparatus |
DE3202265A1 (de) * | 1982-01-25 | 1983-07-28 | Siemens AG, 1000 Berlin und 8000 München | Elektrolyt zur galvanischen abscheidung von aluminium |
US5082747A (en) * | 1985-11-12 | 1992-01-21 | Hedgcoth Virgle L | Magnetic recording disk and sputtering process and apparatus for producing same |
JPS63227797A (ja) * | 1987-03-16 | 1988-09-22 | Nisshin Steel Co Ltd | 電気Alめつきにおける金属板活性化処理法および処理液 |
DE3919069A1 (de) * | 1989-06-10 | 1990-12-13 | Studiengesellschaft Kohle Mbh | Aluminiumorganische elektrolyte und verfahren zur elektrolytischen abscheidung von aluminium |
EP0504704A1 (de) * | 1991-03-20 | 1992-09-23 | Siemens Aktiengesellschaft | Vorbehandlung von metallischen Werkstoffen für die galvanische Beschichtung mit Metall |
US5779961A (en) * | 1996-07-26 | 1998-07-14 | General Electric Company | Method of making a fiber reinforced thermoplastic extrusion |
-
1997
- 1997-04-19 DE DE19716493A patent/DE19716493C2/de not_active Expired - Lifetime
-
1998
- 1998-04-15 EP EP98922715A patent/EP0975826B1/de not_active Expired - Lifetime
- 1998-04-15 JP JP54495798A patent/JP4411397B2/ja not_active Expired - Fee Related
- 1998-04-15 AU AU75257/98A patent/AU7525798A/en not_active Abandoned
- 1998-04-15 CA CA002287179A patent/CA2287179C/en not_active Expired - Fee Related
- 1998-04-15 DE DE59804675T patent/DE59804675D1/de not_active Expired - Lifetime
- 1998-04-15 US US09/403,430 patent/US6340422B1/en not_active Expired - Fee Related
- 1998-04-15 WO PCT/EP1998/002196 patent/WO1998048081A2/de active IP Right Grant
- 1998-04-15 AT AT98922715T patent/ATE220130T1/de not_active IP Right Cessation
- 1998-04-20 ZA ZA983275A patent/ZA983275B/xx unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4444636A (en) * | 1980-06-25 | 1984-04-24 | Siemens Aktiengesellschaft | System for the galvanic deposition of metals such as aluminum |
US4419204A (en) * | 1981-09-23 | 1983-12-06 | Siemens Aktiengesellschaft | Installation for the electro-deposition of metals, particularly aluminum |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Section Ch, Week 8844 Derwent Publications Ltd., London, GB; Class M11, AN 88-310904 XP002079975 & JP 63 227797 A (NISSHIN STEEL CO LTD) , 22. September 1988 * |
Also Published As
Publication number | Publication date |
---|---|
DE19716493C2 (de) | 2001-11-29 |
AU7525798A (en) | 1998-11-13 |
DE19716493A1 (de) | 1998-10-22 |
EP0975826A2 (de) | 2000-02-02 |
EP0975826B1 (de) | 2002-07-03 |
ATE220130T1 (de) | 2002-07-15 |
ZA983275B (en) | 1998-11-04 |
CA2287179A1 (en) | 1998-10-29 |
DE59804675D1 (de) | 2002-08-08 |
US6340422B1 (en) | 2002-01-22 |
JP4411397B2 (ja) | 2010-02-10 |
WO1998048081A3 (de) | 1999-02-11 |
CA2287179C (en) | 2003-11-18 |
JP2001521581A (ja) | 2001-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60011125T2 (de) | Verfahren und vorrichtung zur reinigung und/oder beschichtung von metalloberflächen mittels elektroplasma-technologie | |
DE1299608B (de) | Verfahren und Vorrichtung zur elektrolytischen Entfernung von Spuren von Metallen aus nichtmetallischen waessrigen Salzloesungen | |
DE102012206800B3 (de) | Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück | |
DE3432821C2 (de) | ||
DE19719020A1 (de) | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen | |
DE2355865A1 (de) | Verfahren und einrichtung zur reinigung einer oberflaeche eines metallgegenstands | |
DE10025551C2 (de) | Kathode für die elektrochemische Regenerierung von Permanganat-Ätzlösungen, Verfahren zu deren Herstellung sowie elektrochemische Regeneriervorrichtung | |
AT399167B (de) | Verfahren und vorrichtung zum elektrolytischen beizen von kontinuierlich durchlaufendem elektrisch leitendem gut | |
EP1230441B1 (de) | Verfahren und vorrichtung zum elektrolytischen behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen strukturen auf oberflächen von elektrisch isolierendem folienmaterial sowie anwendungen des verfahrens | |
DE2850542C2 (de) | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen | |
WO1995020692A1 (de) | Verfahren und vorrichtung zum elektrolytischen metallisieren oder ätzen von behandlungsgut | |
DE19951324C2 (de) | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens | |
EP0393192A1 (de) | Einrichtung zur elektrochemischen behandlung von erzeugnissen | |
EP0975826B1 (de) | Verfahren zum elektrolytischen beschichten von metallischen oder nichtmetallischen endlosprodukten und vorrichtung zur durchführung des verfahrens | |
DE2228229A1 (de) | Verfahren und Vorrichtung für die elektrolytische Ablagerung von Metallen | |
CH694619A5 (de) | Verfahren und Vorrichtung zur elektrochemischen Behandlung. | |
DE3418039C2 (de) | Vorrichtung für die elektrolytische Behandlung metallischer Bänder | |
DE4123196C2 (de) | ||
DE3418040A1 (de) | Vorrichtung fuer die elektrolytische behandlung eines metallbandes | |
WO2000026440A2 (de) | Kreislaufverfahren zum beizen von kupfer und kupferlegierungen | |
EP0429748B1 (de) | Elektrode für das Austragen von Metallen aus Metallionen enthaltender Lösung | |
DE102009013467B4 (de) | Verfahren und Vorrichtung zum elektrochemischen Behandeln von Gut in Behandlungsvorrichtungen | |
DE2522926A1 (de) | Verfahren zur herstellung metallplattierten langgestreckten aluminiummaterials | |
DE19932523C1 (de) | Verfahren und Vorrichtung zur elektrochemischen Behandlung | |
DE19521596C1 (de) | Verfahren und Vorrichtung zur elektolytischen Abscheidung von Zink und Kupfer aus saurer Lösung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1998922715 Country of ref document: EP |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
ENP | Entry into the national phase |
Ref document number: 2287179 Country of ref document: CA Ref country code: CA Ref document number: 2287179 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: PA/a/1999/009575 Country of ref document: MX |
|
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 1998 544957 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09403430 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1998922715 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1998922715 Country of ref document: EP |