WO1998029906A1 - Module a circuit integre comportant un organe de conformation - Google Patents
Module a circuit integre comportant un organe de conformation Download PDFInfo
- Publication number
- WO1998029906A1 WO1998029906A1 PCT/FR1997/002400 FR9702400W WO9829906A1 WO 1998029906 A1 WO1998029906 A1 WO 1998029906A1 FR 9702400 W FR9702400 W FR 9702400W WO 9829906 A1 WO9829906 A1 WO 9829906A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- module
- shaping member
- base
- support film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- Integrated circuit module comprising a shaping member
- the invention relates to an integrated circuit module comprising a shaping member, such an integrated circuit module which can in particular be inserted into an integrated circuit card.
- Integrated circuit modules are known comprising an integrated circuit disposed on one side of an insulating support film.
- the integrated circuit is connected to conductive pads arranged on an opposite face of the support film by connecting members extending in holes in the support film.
- the integrated circuit and the connecting members are embedded in a resin so that they are protected from external aggressions, mechanical in particular.
- the resin is deposited in the form of a drop of liquid resin which hardens after its deposition to form a tablet.
- the module thus produced is inserted into a card body comprising a recess intended to receive the resin wafer.
- the shaping member comprises a base fixed to the support film and an annular wall surrounding the integrated circuit and the connecting members and defining an opening directly above them.
- the drop of resin is deposited in the opening so as to fill the shaping member.
- the drop is thus shaped by the shaping member so that its lateral dimensions are defined by the shaping member.
- the solid shaping member is moreover easily positioned with respect to the conductive pads.
- the surface of the tablet has irregularities resulting from the escape of the air bubbles included in the liquid resin and surface tension forces around the periphery of the opening.
- an integrated circuit module comprising an integrated circuit disposed on one side of an insulating support film and connected to conductive pads arranged on an opposite face of the support film by connecting members extending in holes of the support film, and a shaping member comprising a base fixed to the support film and a wall surrounding the integrated circuit and the connecting members and defining an opening directly above them, the shaping member being filled with a resin and comprising a wall element adjacent to the opening inclined towards the inside of the shaping member.
- the inclination of the wall element and the reduction in the dimensions of the resulting opening minimize the dimensions of the surface having irregularities by correspondingly increasing the part having a precise geometry. A satisfactory bonding of the module is therefore obtained in the card body without it being necessary to correct the surface of the patch. Furthermore, the inclination of the wall element facilitates the positioning of the module in the card by making the conforming member a member for centering the module in the card, even if at the time of placing place the shaping member is not exactly centered with respect to the recess.
- the wall element extends from the base to the opening and preferably has a frustoconical shape.
- the shaping member comprises at least one orifice in a wall part adjacent to the base.
- the orifice has an oblong shape.
- This shape allows the evacuation of a larger quantity of air while retaining the resin.
- FIG. 1 is a partial perspective view of an integrated circuit module according to the invention
- FIG. 2 is a sectional view along line II -II of Figure 1.
- the integrated circuit module comprises, in a manner known per se, an insulating support film 1 carrying on one face an integrated circuit
- the integrated circuit 2 is connected to the conductive pads by connecting members 4.
- the connecting members 4 each extend in a hole 5 passing through the support film 1. They can be constituted in particular by gold threads.
- a shaping member, generally designated at 6, is fixed to the support film 1.
- the shaping member 6 comprises a base 7 fixed to the face of the support film carrying the integrated circuit, and a conical wall 8 produced in one piece with the base 7 and surrounding the integrated circuit 2 and the connecting members 4.
- the truncated cone thus arranged forms a wall element inclined towards the inside of the shaping member and extends opposite the printed circuit 2 and the connecting members 4.
- the wall 8 further defines an opening 9 which s 'extends substantially in line with the integrated circuit 2 and the connecting members 4.
- the shaping member 6 can be produced in particular by thermoforming or injection of a plastic plate, this plate being cut simultaneously or after it is put in shape .
- the shaping member 6 has orifices 11 of oblong shape which extend astride the wall 8 and the base 7.
- the transverse dimension of these orifices 11 is sufficient to allow air to escape contained in the volume delimited by the shaping member during the introduction of a drop of resin through the opening 9.
- the transverse dimension of the orifices 11 is also insufficient to allow the resin to escape from the conformation 6.
- a homogeneous resin pellet 10 is thus obtained ensuring good mechanical resistance of the module while the shaping member simultaneously provides mechanical reinforcement of the resin block and precise and repetitive delimitation of the interface of the module with a body. Map.
- the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention.
- the wall 8 has been shown in a frustoconical shape, it could have a shape in the form of a pyramid trunk making it possible to angularly position the shaping member and therefore the module relative to the card around an axis perpendicular to the map area.
- the wall 8 could also include a wall element adjacent to the cylindrical base and a wall element adjacent to the frustoconical opening in order to increase the volume of resin while benefiting from the precise geometric definition of the wall portion adjacent to the opening.
- the shaping member has been illustrated with an opening 9 of small dimensions, which supposes that the shaping member is put in place after the integrated circuit and the connecting wires, the shaping member can be produced according to the invention with an opening large enough to allow the implantation of the integrated circuit and the production of the connections after the setting up of the shaping member.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97952993A EP0948811A1 (fr) | 1996-12-30 | 1997-12-23 | Module a circuit integre comportant un organe de conformation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR96/16205 | 1996-12-30 | ||
FR9616205A FR2758005B1 (fr) | 1996-12-30 | 1996-12-30 | Module a circuit integre comportant un organe de conformation |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998029906A1 true WO1998029906A1 (fr) | 1998-07-09 |
Family
ID=9499292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1997/002400 WO1998029906A1 (fr) | 1996-12-30 | 1997-12-23 | Module a circuit integre comportant un organe de conformation |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0948811A1 (fr) |
FR (1) | FR2758005B1 (fr) |
WO (1) | WO1998029906A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CL2008002157A1 (es) | 2008-07-23 | 2009-02-20 | Gillot Sandra | Producto alimenticio microencapsulado rico en omega-3 que contiene aceite de chia, fosfato dipotasico, palmitato de ascorbilo, alfa-tocoferol, almidon modificado, maltodextrina, goma arabica; proceso de elaboracion que comprende dispersion de los ingredientes, homogenizacion, microencapsulacion; usos. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6367756A (ja) * | 1986-09-09 | 1988-03-26 | Nec Corp | 混成集積回路装置 |
US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
FR2686996A1 (fr) * | 1992-01-31 | 1993-08-06 | Solaic Sa | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
EP0660383A1 (fr) * | 1993-12-16 | 1995-06-28 | AT&T Corp. | Boîtier de dispositifs électroniques |
WO1996032696A1 (fr) * | 1995-04-13 | 1996-10-17 | Dai Nippon Printing Co., Ltd. | Carte et module de circuit integre |
-
1996
- 1996-12-30 FR FR9616205A patent/FR2758005B1/fr not_active Expired - Fee Related
-
1997
- 1997-12-23 EP EP97952993A patent/EP0948811A1/fr not_active Withdrawn
- 1997-12-23 WO PCT/FR1997/002400 patent/WO1998029906A1/fr not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6367756A (ja) * | 1986-09-09 | 1988-03-26 | Nec Corp | 混成集積回路装置 |
US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
FR2686996A1 (fr) * | 1992-01-31 | 1993-08-06 | Solaic Sa | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
EP0660383A1 (fr) * | 1993-12-16 | 1995-06-28 | AT&T Corp. | Boîtier de dispositifs électroniques |
WO1996032696A1 (fr) * | 1995-04-13 | 1996-10-17 | Dai Nippon Printing Co., Ltd. | Carte et module de circuit integre |
EP0766197A1 (fr) * | 1995-04-13 | 1997-04-02 | Dai Nippon Printing Co., Ltd. | Carte et module de circuit integre |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 291 (E - 644) 9 August 1988 (1988-08-09) * |
Also Published As
Publication number | Publication date |
---|---|
EP0948811A1 (fr) | 1999-10-13 |
FR2758005B1 (fr) | 1999-05-07 |
FR2758005A1 (fr) | 1998-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2036007B1 (fr) | Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires | |
EP0519564B1 (fr) | Procédé de fabrication d'une carte à micro-circuit et carte à micro-circuit | |
EP0321899B1 (fr) | Procédé et dispositif de refroidissement d'un boîtier de circuit intégré | |
FR2890469A1 (fr) | Module de puce et carte a puce | |
US20050146057A1 (en) | Micro lead frame package having transparent encapsulant | |
FR2865575A1 (fr) | Procede pour emballer des pastilles semi-conductrices et structure de pastille semi-conductrice ainsi obtenue | |
WO1998006063A1 (fr) | Carte a circuit integre a connexion mixte | |
FR2591683A1 (fr) | Cheville de fixation | |
FR2819634A1 (fr) | Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication | |
EP3625822A1 (fr) | Procede de fabrication d'un dispositif d'affichage emissif a led | |
EP0623897B1 (fr) | Objet portatif à circuit intégré et procédé de fabrication | |
EP1226609A1 (fr) | Boitier semi-conducteur optique et procede de fabrication d'un tel boitier | |
EP0948811A1 (fr) | Module a circuit integre comportant un organe de conformation | |
WO1999066445A1 (fr) | Procede de fabrication d'une carte a circuit integre et carte obtenue | |
EP1226610B1 (fr) | Boitier semi-conducteur optique et procede de fabrication d'un tel boitier | |
FR2753819A1 (fr) | Carte a circuit integre a connexion mixte | |
FR2748856A1 (fr) | Dispositif diode a semiconducteur a montage en surface | |
EP1317003B1 (fr) | Boîtier semi-conducteur à capteur, muni d'un insert de fixation | |
FR2803413A1 (fr) | Element de carte a circuit integre monte en flip-chip | |
EP3009812B2 (fr) | Dispositif détecteur à constitution modulaire et équipement industriel le comportant | |
WO2024018145A1 (fr) | Assemblage par collage d'un imageur térahertz sur une lentille assurant une interface optimale | |
EP0498713B1 (fr) | Procédé de montage sur un substrat souple de composants électroniques miniatures à pattes de connexion à souder | |
FR2890387A1 (fr) | Composant micromecanique | |
KR100192226B1 (ko) | 반도체 패키지 제조방법 | |
FR2856516A1 (fr) | Procede de fabrication d'un composant semi-conducteur et composant semi-conducteur |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1997952993 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1997952993 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1997952993 Country of ref document: EP |