WO1998020718A1 - Heat sink-lead frame structure - Google Patents
Heat sink-lead frame structure Download PDFInfo
- Publication number
- WO1998020718A1 WO1998020718A1 PCT/US1997/019309 US9719309W WO9820718A1 WO 1998020718 A1 WO1998020718 A1 WO 1998020718A1 US 9719309 W US9719309 W US 9719309W WO 9820718 A1 WO9820718 A1 WO 9820718A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- lead frame
- lead
- leads
- die
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- This invention relates to a unitary design of heat sink and lead frame structure for semiconductor applications .
- a typical dual inline surface mount package 10 is shown in Fig. 1.
- a device 10 includes a heat sink 12 which may, for example, be of copper, and a semiconductor die 14 mounted thereon.
- Leads 16 are connected to the die 14 by means of conducting wires 18, and the die 14, conducting wires 18, and inner ends of the leads 16 are encapsulated in packaging material 20 as is well known.
- the extended ends of the leads 16 are soldered to appropriate parts of a printed circuit board 22. It will be seen that a direct heat conduction path is provided from the die 14 inside the package 20 through the heat sink 12 to the board 22.
- the structure can deal with a relatively large amount of power, and can also appropriately dissipate a relatively large amount of heat.
- a surface mount package includes a unitary combination heat sink and lead frame, the heat sink having mounted thereon a semiconductor die and being mounted to a printed circuit board.
- the heat sink and certain leads of the lead frame provide heat conduction paths from the die to the printed circuit board, for highly effective dissipation of heat.
- Figs. 1, 2 and 3 are cross sectional views showing prior art devices
- Fig. 4 is a plan view of the present inventive unitary heat sink-lead frame structure
- Fig. 5 is a cross-sectional view of the inventive device
- Fig. 6 is a cross-sectional view of the basic element used in achieving the invention of Fig. 4.
- the heat sink-lead frame structure 30 is shown as having 16 leads 32, including four leads 32A which extend from the heat sink 34, and 12 leads 32B which in accordance with common practice have their inner ends spaced frame and not connected to the heat sink 34 (of course, all leads of the lead frame in this form are connected by tie bars 36 as is well known, which will later be cut away, resulting in the leads 32A not being connected to the heat sink 34 in any manner) .
- the heat sink 34 is mounted directly to a printed circuit board 38, and has mounted thereon a semiconductor die.
- the die 40 is connected by conducting wires 42 to the leads 32, and the extended ends of the leads 32 are soldered to the printed circuit board 38.
- the die 40 has ground pads 54 connected by conducting wires 42 to the leads 32A which in turn extend from the heat sink 34, so that the leads 32A act as ground leads, meanwhile with other conducting wires connecting the die 40 and leads 32B so that those leads 32B are signal leads.
- the die 40 and inner ends of the leads 32, along with the conductive wires 42, are housed in appropriate packaging material 44 (also noted in dotted line in Fig. 4) , and the tie bars 36 are cut away, all as is well known, in forming the final device 46, which includes heat sink 34 and leads 32A extending therefrom as a unitary, single piece structure.
- the heat sink 34 acts as a heat path for the die 40, as do the individual leads 32A extending from the heat sink 34.
- This structure overcomes problems of the prior devices by including additional heat conduction paths which provide good thermal conductivity, meanwhile with the structure being low cost and avoiding the problems of poor thermal conduction adhesive tape, or the interfacial resistance in the riveting approach described above.
- the lead frame-heat sink structure 30 can with advantage be formed by the dual gauge copper structure 48 of Fig. 6, wherein the relatively thick portion 48A which will define the heat sink 34 has a thickness X between the arrows which is 50 mils, while the portions 48B which will define the leads 32 have a thickness indicated by Y between the arrows which is 15 mils.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU50876/98A AU5087698A (en) | 1996-11-06 | 1997-11-03 | Heat sink-lead frame structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74606496A | 1996-11-06 | 1996-11-06 | |
US08/746,064 | 1996-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998020718A1 true WO1998020718A1 (en) | 1998-05-14 |
Family
ID=24999337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/019309 WO1998020718A1 (en) | 1996-11-06 | 1997-11-03 | Heat sink-lead frame structure |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU5087698A (en) |
WO (1) | WO1998020718A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999007023A1 (en) * | 1997-07-29 | 1999-02-11 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic component |
WO2005057672A2 (en) * | 2003-12-09 | 2005-06-23 | Gelcore, Llc | Surface mount light emitting chip package |
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
JP2007184643A (en) * | 2007-03-28 | 2007-07-19 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
JP2010287914A (en) * | 2010-09-14 | 2010-12-24 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
US8097937B2 (en) | 2001-04-10 | 2012-01-17 | Osram Ag | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
JP2014042079A (en) * | 2013-12-02 | 2014-03-06 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
US9947612B2 (en) | 2015-12-03 | 2018-04-17 | Stmicroelectronics, Inc. | Semiconductor device with frame having arms and related methods |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5289344A (en) * | 1992-10-08 | 1994-02-22 | Allegro Microsystems Inc. | Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means |
-
1997
- 1997-11-03 AU AU50876/98A patent/AU5087698A/en not_active Abandoned
- 1997-11-03 WO PCT/US1997/019309 patent/WO1998020718A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5289344A (en) * | 1992-10-08 | 1994-02-22 | Allegro Microsystems Inc. | Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7288831B2 (en) | 1993-09-30 | 2007-10-30 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7102212B2 (en) | 1993-09-30 | 2006-09-05 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7183632B2 (en) | 1997-07-29 | 2007-02-27 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
EP1566846A2 (en) * | 1997-07-29 | 2005-08-24 | Osram Opto Semiconductors GmbH | Optoelectronic device |
WO1999007023A1 (en) * | 1997-07-29 | 1999-02-11 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic component |
US6759733B2 (en) | 1997-07-29 | 2004-07-06 | Osram Opto Semiconductors Gmbh | Optoelectric surface-mountable structural element |
US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
JP2009152639A (en) * | 1997-07-29 | 2009-07-09 | Osram Opto Semiconductors Gmbh | Surface-mountable photoelectric element |
EP1566846A3 (en) * | 1997-07-29 | 2009-08-19 | OSRAM Opto Semiconductors GmbH | Optoelectronic device |
US6469321B2 (en) | 1997-07-29 | 2002-10-22 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mountable light-emitting diode structural element |
US7508002B2 (en) | 1997-07-29 | 2009-03-24 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
EP1378013B1 (en) * | 2001-04-10 | 2015-09-30 | OSRAM Opto Semiconductors GmbH | Housing for a radiation-emitting component, radiation emitting component and method for producing the same |
US8097937B2 (en) | 2001-04-10 | 2012-01-17 | Osram Ag | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
WO2005057672A3 (en) * | 2003-12-09 | 2006-04-06 | Gelcore Llc | Surface mount light emitting chip package |
JP2007514320A (en) * | 2003-12-09 | 2007-05-31 | ゲルコアー リミテッド ライアビリティ カンパニー | Surface mount light emitting chip package |
KR101311635B1 (en) | 2003-12-09 | 2013-09-26 | 젤코어 엘엘씨 | Surface mount light emitting chip package |
WO2005057672A2 (en) * | 2003-12-09 | 2005-06-23 | Gelcore, Llc | Surface mount light emitting chip package |
JP2007184643A (en) * | 2007-03-28 | 2007-07-19 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
JP2010287914A (en) * | 2010-09-14 | 2010-12-24 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
JP2014042079A (en) * | 2013-12-02 | 2014-03-06 | Toshiba Electronic Engineering Corp | Optical semiconductor package |
US9947612B2 (en) | 2015-12-03 | 2018-04-17 | Stmicroelectronics, Inc. | Semiconductor device with frame having arms and related methods |
US11004776B2 (en) | 2015-12-03 | 2021-05-11 | Stmicroelectronics, Inc. | Semiconductor device with frame having arms and related methods |
US11715677B2 (en) | 2015-12-03 | 2023-08-01 | Stmicroelectronics, Inc. | Semiconductor device with frame having arms |
Also Published As
Publication number | Publication date |
---|---|
AU5087698A (en) | 1998-05-29 |
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