WO1998000840A1 - Thin film magnetic head tip and manufacturing method therefor - Google Patents

Thin film magnetic head tip and manufacturing method therefor Download PDF

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Publication number
WO1998000840A1
WO1998000840A1 PCT/KR1997/000113 KR9700113W WO9800840A1 WO 1998000840 A1 WO1998000840 A1 WO 1998000840A1 KR 9700113 W KR9700113 W KR 9700113W WO 9800840 A1 WO9800840 A1 WO 9800840A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic head
thin film
wafer
base
film magnetic
Prior art date
Application number
PCT/KR1997/000113
Other languages
French (fr)
Inventor
Jae Soo Lee
Sang Joon Kim
Byung Soo Chung
Original Assignee
Samsung Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019960025198A external-priority patent/KR0183894B1/en
Priority claimed from KR1019960025200A external-priority patent/KR0183895B1/en
Priority claimed from KR1019960030874A external-priority patent/KR100207740B1/en
Application filed by Samsung Electronics Co., Ltd. filed Critical Samsung Electronics Co., Ltd.
Publication of WO1998000840A1 publication Critical patent/WO1998000840A1/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
    • G11B15/60—Guiding record carrier
    • G11B15/61—Guiding record carrier on drum, e.g. drum containing rotating heads
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10—Structure or manufacture of housings or shields for heads
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/1272—Assembling or shaping of elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/17—Construction or disposition of windings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/52—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with simultaneous movement of head and record carrier, e.g. rotation of head
    • G11B5/53—Disposition or mounting of heads on rotating support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3176—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps
    • G11B5/3179—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes
    • G11B5/3183—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes intersecting the gap plane, e.g. "horizontal head structure"

Definitions

  • the present invention relates to a thin film magnetic head tip of a videocassette recorder (VCR), used for recording/reproducing information onto/from a tape and a manufacturing method therefor.
  • VCR videocassette recorder
  • a VCR includes a head drum 2 as shown in FIG. 1 for diagonally scanning a magnetic tape 1 with respect to the traveling direction thereof in order to read information recorded on the traveling magnetic tape 1 or record new information onto the magnetic tape 1.
  • the head drum 2 includes a fixed drum 3 for guiding the magnetic tape 1.
  • a rotary drum 4 rotatably installed on a shaft of the fixed drum 3 and a magnetic head 5 installed in the rotary drum 4.
  • the magnetic head 5 includes a head base 6 and a magnetic head tip 7.
  • the magnetic head tip 7 is manufactured by various processes. That is, cores 9 and 9' are manufactured separately and the spacing between the cores 9 and 9' is determined after lapping, bonding and assembly processes.
  • the above magnetic head tip 7 and the manufacturing method therefor are not desirable due to various errors and deviations caused during the various processes. Also, since the cores 9 and 9' should be formed of ferrite. it is difficult to minimize the size of the core 9 and 9'.
  • the method for manufacturing the magnetic head includes various processing steps as before: the step of attaching a substrate member processed to have a predetermined azimuth angle to the uppermost layer of a stacked structure, the step of forming a window for winding, the step of machining one side of the magnetic head in a predetermined curvature in order to improve the contact to a tape, and the step of performing the winding.
  • a thin film magnetic head tip comprising: a wafer being a non-magnetic insulator; a conductive contact point within a plurality of holes formed through the wafer; a base being a non-magnetic insulator, stacked on the wafer: a magnetic core being partially within the base, having an azimuth groove; and a coil within the base wound around the core, having two ends each connected to the conductive contact points.
  • a method for manufacturing a thin film magnetic head tip comprising the steps of: (a) forming a plurality of holes passing through a wafer; (b) filling the holes with a conductive material; (c) stacking a base being a non-magnetic insulator, a magnetic core having an azimuth groove, and a coil within the base around the magnetic core on the wafer in a predetermined shape by a wafer process; and (d) cutting the stacked wafer into thin film magnetic head tips.
  • the manual manufacturing steps for the magnetic head are reduced and the mass production of the magnetic head is achieved effectively.
  • FIG. 1 is a perspective view of a head drum for a videocassette recorder
  • FIG. 2 is a perspective view of the magnetic head tip of FIG. 1 ;
  • FIG. 3 is a partially cutaway perspective view of a wafer used for a thin film magnetic head tip according to the present invention;
  • FIG. 4 is a sectional view illustrating the step of stacking to form a thin film magnetic head tip of the present invention by a wafer process
  • FIG. 5 is a perspective view of a wafer plate in which the thin film magnetic head tip of the present invention is formed by stacking
  • FIG. 6 is a perspective view of the thin film magnetic head tip obtained by cutting the wafer plate of FIG. 5;
  • FIG. 7 is a perspective view showing a step in which the thin film magnetic head tip of the present invention is attached to a head base.
  • a thin film magnetic head tip according to the present invention is manufactured by a well-known wafer process. As shown in FIG. 4, the wafer process is for sequentially stacking predetermined material onto a wafer 100 of
  • FIG. 3 using sputtering, deposition and photolithography processes.
  • holes formed through the wafer 100 used for the wafer process are filled with metal such as copper (Cu).
  • metal such as copper (Cu).
  • One side of the metal is used as a contact point 210 when connecting a thin film magnetic head tip 200 to a head base 300.
  • the other side of the metal is connected to a conductive coil
  • a magnetic core 110, a base 120 being a non-magnetic insulator and a conductive coil 130 are stacked on the wafer 100 in a predetermined shape by deposition and photolithography methods.
  • the conductive coil 130 is formed within the base 120 around the magnetic core 110. and two ends of the conductive coil 130 are connected to two of the contact points 210 formed on the wafer 100. respectively. That is. the conductive coil 130 is stacked together with the base 120 and the magnetic core 110 while winding the magnetic core 1 10.
  • the magnetic core 110 is formed of iron (Fe) compounds or amorphous alloy containing cobalt (Co) having high magnetic permeability, high saturation magnetic flux densitv and less coercive force, and the base 120 being the non- magnetic insulator is a material having a thermal expansion coefficient which is similar to that of the material used for the magnetic core 110, and a strong antiabrasion property Also, the conductive coil 130 is formed of metal such as Cu having high conductivity Referring to FIG 4, m the final step, an azimuth groove 140 and a curved surface 150 are formed atop the magnetic core 110 The azimuth groove 140 and the curved surface 150 are intentionally formed by deposition and photolithography processes The magnetic cores 110 are separated from each other by the azimuth groove 140, and the curved surface 150 contacts the magnetic tape 1 of FIG 1 When the curved surface 150 is formed by the deposition and photolithography methods, a staircase texture 151 is formed on the curved surface 150 as shown in the enlarged view of FIG 4 However, since the height of a staircase texture
  • the azimuth groove 140 is formed in the curved surface 150 formed on the thin film magnetic head tip 200 even though the number of thin film magnetic head tips obtained from one wafer plate is dependent on the size of the water plate, several hundreds of thin film magnetic head tips 200 are obtained from one wafer plate in general
  • the thin film magnetic head tip 200 obtained by cutting the wafer plate manufactured by the wafer process is attached to the head base 300
  • the manufacturing process is simplified since additional processes for forming the curved surface contacting the magnetic tape are not required

Abstract

A thin film magnetic head tip, and a method for manufacturing the thin film magnetic head tip by a wafer process, are provided. A base (120) material is stacked on a wafer (100) and a core (110) is stacked partially within the base material to form an azimuth groove (140). Conductive points (210) are within a plurality of holes passed through the wafer (100). A coil (130) is stacked being connected to the conductive points (210), and the surface of the core (110) with the azimuth angle and the base (120) are rounded.

Description

THIN FILM MAGNETIC HEAD TIP AND MANUFACTURING METHOD THEREFOR
Technical Field
The present invention relates to a thin film magnetic head tip of a videocassette recorder (VCR), used for recording/reproducing information onto/from a tape and a manufacturing method therefor.
Background Art
Generally, a VCR includes a head drum 2 as shown in FIG. 1 for diagonally scanning a magnetic tape 1 with respect to the traveling direction thereof in order to read information recorded on the traveling magnetic tape 1 or record new information onto the magnetic tape 1. The head drum 2 includes a fixed drum 3 for guiding the magnetic tape 1. a rotary drum 4 rotatably installed on a shaft of the fixed drum 3 and a magnetic head 5 installed in the rotary drum 4. Also, as shown in FIG. 1, the magnetic head 5 includes a head base 6 and a magnetic head tip 7.
Referring to FIG. 2. the magnetic head tip 7 is manufactured by various processes. That is, cores 9 and 9' are manufactured separately and the spacing between the cores 9 and 9' is determined after lapping, bonding and assembly processes.
However, the above magnetic head tip 7 and the manufacturing method therefor are not desirable due to various errors and deviations caused during the various processes. Also, since the cores 9 and 9' should be formed of ferrite. it is difficult to minimize the size of the core 9 and 9'.
To solve this problem, in Korean Patent Application No. 95-2081. filed
Feb. 6. 1995. entitled "magnetic head and manufacturing method therefor" , there is described a magnetic layer which is selectively formed, so that a magnetic path is shortened, reducing inductance. Also, a separate manufacturing process for two cores is not required, improving yield.
However, the method for manufacturing the magnetic head includes various processing steps as before: the step of attaching a substrate member processed to have a predetermined azimuth angle to the uppermost layer of a stacked structure, the step of forming a window for winding, the step of machining one side of the magnetic head in a predetermined curvature in order to improve the contact to a tape, and the step of performing the winding.
Disclosure of the Invention
It is an object of the present invention to provide a thin film magnetic head tip and a manufacturing method therefor, which reduces the manufacturing steps of a magnetic head and makes possible the mass production of the magnetic head.
According to an aspect of the present invention, there is provided a thin film magnetic head tip comprising: a wafer being a non-magnetic insulator; a conductive contact point within a plurality of holes formed through the wafer; a base being a non-magnetic insulator, stacked on the wafer: a magnetic core being partially within the base, having an azimuth groove; and a coil within the base wound around the core, having two ends each connected to the conductive contact points.
According to another aspect of the present invention, there is provided a method for manufacturing a thin film magnetic head tip comprising the steps of: (a) forming a plurality of holes passing through a wafer; (b) filling the holes with a conductive material; (c) stacking a base being a non-magnetic insulator, a magnetic core having an azimuth groove, and a coil within the base around the magnetic core on the wafer in a predetermined shape by a wafer process; and (d) cutting the stacked wafer into thin film magnetic head tips.
In the thin film magnetic head tip and the manufacturing method therefor according to the present invention, the manual manufacturing steps for the magnetic head are reduced and the mass production of the magnetic head is achieved effectively.
Brief Description of the Drawings FIG. 1 is a perspective view of a head drum for a videocassette recorder
(VCR);
FIG. 2 is a perspective view of the magnetic head tip of FIG. 1 ; FIG. 3 is a partially cutaway perspective view of a wafer used for a thin film magnetic head tip according to the present invention;
FIG. 4 is a sectional view illustrating the step of stacking to form a thin film magnetic head tip of the present invention by a wafer process; FIG. 5 is a perspective view of a wafer plate in which the thin film magnetic head tip of the present invention is formed by stacking;
FIG. 6 is a perspective view of the thin film magnetic head tip obtained by cutting the wafer plate of FIG. 5; and
FIG. 7 is a perspective view showing a step in which the thin film magnetic head tip of the present invention is attached to a head base.
Best mode for carrying out the Invention
A thin film magnetic head tip according to the present invention is manufactured by a well-known wafer process. As shown in FIG. 4, the wafer process is for sequentially stacking predetermined material onto a wafer 100 of
FIG. 3 using sputtering, deposition and photolithography processes.
As shown in FIGS. 3 and 7, holes formed through the wafer 100 used for the wafer process are filled with metal such as copper (Cu). One side of the metal is used as a contact point 210 when connecting a thin film magnetic head tip 200 to a head base 300. The other side of the metal is connected to a conductive coil
130 (see FIG. 4) which will be described later.
Referring to FIG. 4, a magnetic core 110, a base 120 being a non-magnetic insulator and a conductive coil 130 are stacked on the wafer 100 in a predetermined shape by deposition and photolithography methods. The conductive coil 130 is formed within the base 120 around the magnetic core 110. and two ends of the conductive coil 130 are connected to two of the contact points 210 formed on the wafer 100. respectively. That is. the conductive coil 130 is stacked together with the base 120 and the magnetic core 110 while winding the magnetic core 1 10. The magnetic core 110 is formed of iron (Fe) compounds or amorphous alloy containing cobalt (Co) having high magnetic permeability, high saturation magnetic flux densitv and less coercive force, and the base 120 being the non- magnetic insulator is a material having a thermal expansion coefficient which is similar to that of the material used for the magnetic core 110, and a strong antiabrasion property Also, the conductive coil 130 is formed of metal such as Cu having high conductivity Referring to FIG 4, m the final step, an azimuth groove 140 and a curved surface 150 are formed atop the magnetic core 110 The azimuth groove 140 and the curved surface 150 are intentionally formed by deposition and photolithography processes The magnetic cores 110 are separated from each other by the azimuth groove 140, and the curved surface 150 contacts the magnetic tape 1 of FIG 1 When the curved surface 150 is formed by the deposition and photolithography methods, a staircase texture 151 is formed on the curved surface 150 as shown in the enlarged view of FIG 4 However, since the height of a staircase texture 151 is below several micrometers, the curved surface 150 is capable of smoothly contacting the magnetic tape 1 of FIG 1 As described above, a wafer plate 400 of FIG 5. manufactured by the wafer process is cut into a plurality of thin film magnetic head tips 200 of FIG 6 of a proper size by a cutter (not shown) The azimuth groove 140 is formed in the curved surface 150 formed on the thin film magnetic head tip 200 Even though the number of thin film magnetic head tips obtained from one wafer plate is dependent on the size of the water plate, several hundreds of thin film magnetic head tips 200 are obtained from one wafer plate in general
As described above, the thin film magnetic head tip 200 obtained by cutting the wafer plate manufactured by the wafer process is attached to the head base 300
Figure imgf000006_0001
Industrial Applicability
According to the thin film magnetic head tip and the manufacturing method therefoi . the number of manual pi cesses for manufacturing the magnetic head is reduced and the magnetic head can be effective!) produced by mass production In particular, the manufacturing process is simplified since additional processes for forming the curved surface contacting the magnetic tape are not required

Claims

CLAIMS:
1. A thin film magnetic head tip comprising: a wafer (100) being a non-magnetic insulator; a conductive contact point (210) within a plurality of holes formed through the wafer (100); a base (120) being a non-magnetic insulator, stacked on the wafer; a magnetic core (110) being partially within the base (120), having an azimuth groove (140); and a coil (130) within the base (120) wound around the core, having two ends each connected to the conductive contact points (210).
2. A thin film magnetic head tip as claimed in claim 1 , comprising a curved surface (150) formed being curved together with the surface of the magnetic core (110) with the azimuth groove (140) and the base (120).
3. A thin film magnetic head tip as claimed in claim 1 or 2. wherein the conductive contact point (120) is formed of metal.
4. A method for manufacturing a thin film magnetic head tip comprising the steps of:
(a) forming a plurality of holes passing through a wafer ( 100);
(b) filling the holes with a conductive material; (c) stacking a base (120) being a non-magnetic insulator, a magnetic core
(1 10) having an azimuth groove (140). and a coil (130) within the base (120) around the magnetic core (110) on the wafer (100) in a predetermined shape by a wafer process; and
(d) cutting the stacked wafer into thin film magnetic head tips.
5. A method for manufacturing a thin film magnetic head tip as claimed in claim 4. wherein the magnetic core (1 10) and the base (120) are stacked in a staircase shape to form a curved surface (150) curved together with the surface of the magnetic core (110) with the azimuth groove (140) and the base (120) during the step (c).
6. A method for manufacturing a thin film magnetic head tip as claimed in claim 4 or 5. wherein in the step (c). a predetermined material is sequentially deposited on the wafer (100) in a predetermined shape by deposition and photolithography methods.
PCT/KR1997/000113 1996-06-28 1997-06-13 Thin film magnetic head tip and manufacturing method therefor WO1998000840A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1019960025198A KR0183894B1 (en) 1996-06-28 1996-06-28 Double azimuth magnetic thin film head tip
KR1019960025200A KR0183895B1 (en) 1996-06-28 1996-06-28 Thin film magnetic head tip and its manufacture
KR1996/25198 1996-06-28
KR1996/25200 1996-06-28
KR1019960030874A KR100207740B1 (en) 1996-07-27 1996-07-27 Thin film magnetic head tip and its production method
KR1996/30874 1996-07-27

Publications (1)

Publication Number Publication Date
WO1998000840A1 true WO1998000840A1 (en) 1998-01-08

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Country Status (2)

Country Link
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WO (1) WO1998000840A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632243B1 (en) 1997-09-16 2003-10-14 Emphasys Medical Inc. Body fluid flow control device
US6694979B2 (en) 2000-03-04 2004-02-24 Emphasys Medical, Inc. Methods and devices for use in performing pulmonary procedures
US7896887B2 (en) 2001-10-25 2011-03-01 Spiration, Inc. Apparatus and method for deployment of a bronchial obstruction device
US8251067B2 (en) 2001-03-02 2012-08-28 Pulmonx Corporation Bronchial flow control devices with membrane seal
US8388682B2 (en) 2004-11-19 2013-03-05 Pulmonx Corporation Bronchial flow control devices and methods of use
US8474460B2 (en) 2000-03-04 2013-07-02 Pulmonx Corporation Implanted bronchial isolation devices and methods
US8876791B2 (en) 2005-02-25 2014-11-04 Pulmonx Corporation Collateral pathway treatment using agent entrained by aspiration flow current
US8926647B2 (en) 2002-03-20 2015-01-06 Spiration, Inc. Removable anchored lung volume reduction devices and methods
US8956319B2 (en) 2002-05-17 2015-02-17 Spiration, Inc. One-way valve devices for anchored implantation in a lung
US8974527B2 (en) 2003-08-08 2015-03-10 Spiration, Inc. Bronchoscopic repair of air leaks in a lung
US8974484B2 (en) 2001-09-11 2015-03-10 Spiration, Inc. Removable lung reduction devices, systems, and methods
US9198669B2 (en) 2006-03-31 2015-12-01 Spiration, Inc. Articulable anchor
US9211181B2 (en) 2004-11-19 2015-12-15 Pulmonx Corporation Implant loading device and system
US9326873B2 (en) 2007-10-12 2016-05-03 Spiration, Inc. Valve loader method, system, and apparatus

Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0407244A1 (en) * 1989-07-04 1991-01-09 Thomson-Csf Process for producing planar magnetic heads by making cells in a non-magnetic board, and magnetic heads obtained by such a process
EP0515786A1 (en) * 1991-05-28 1992-12-02 Read-Rite Corporation Thin film tape head assembly
EP0583921A1 (en) * 1992-08-19 1994-02-23 International Business Machines Corporation Unitary magnetic transducer and suspension structure for longitudinal operation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0407244A1 (en) * 1989-07-04 1991-01-09 Thomson-Csf Process for producing planar magnetic heads by making cells in a non-magnetic board, and magnetic heads obtained by such a process
EP0515786A1 (en) * 1991-05-28 1992-12-02 Read-Rite Corporation Thin film tape head assembly
EP0583921A1 (en) * 1992-08-19 1994-02-23 International Business Machines Corporation Unitary magnetic transducer and suspension structure for longitudinal operation

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632243B1 (en) 1997-09-16 2003-10-14 Emphasys Medical Inc. Body fluid flow control device
US6694979B2 (en) 2000-03-04 2004-02-24 Emphasys Medical, Inc. Methods and devices for use in performing pulmonary procedures
US8474460B2 (en) 2000-03-04 2013-07-02 Pulmonx Corporation Implanted bronchial isolation devices and methods
US8251067B2 (en) 2001-03-02 2012-08-28 Pulmonx Corporation Bronchial flow control devices with membrane seal
US8974484B2 (en) 2001-09-11 2015-03-10 Spiration, Inc. Removable lung reduction devices, systems, and methods
US8986336B2 (en) 2001-10-25 2015-03-24 Spiration, Inc. Apparatus and method for deployment of a bronchial obstruction device
US7896887B2 (en) 2001-10-25 2011-03-01 Spiration, Inc. Apparatus and method for deployment of a bronchial obstruction device
US8926647B2 (en) 2002-03-20 2015-01-06 Spiration, Inc. Removable anchored lung volume reduction devices and methods
US8956319B2 (en) 2002-05-17 2015-02-17 Spiration, Inc. One-way valve devices for anchored implantation in a lung
US9622752B2 (en) 2003-08-08 2017-04-18 Spiration, Inc. Bronchoscopic repair of air leaks in a lung
US8974527B2 (en) 2003-08-08 2015-03-10 Spiration, Inc. Bronchoscopic repair of air leaks in a lung
US8388682B2 (en) 2004-11-19 2013-03-05 Pulmonx Corporation Bronchial flow control devices and methods of use
US9211181B2 (en) 2004-11-19 2015-12-15 Pulmonx Corporation Implant loading device and system
US9872755B2 (en) 2004-11-19 2018-01-23 Pulmonx Corporation Implant loading device and system
US11083556B2 (en) 2004-11-19 2021-08-10 Pulmonx Corporation Implant loading device and system
US8876791B2 (en) 2005-02-25 2014-11-04 Pulmonx Corporation Collateral pathway treatment using agent entrained by aspiration flow current
US9198669B2 (en) 2006-03-31 2015-12-01 Spiration, Inc. Articulable anchor
US9326873B2 (en) 2007-10-12 2016-05-03 Spiration, Inc. Valve loader method, system, and apparatus
US10350048B2 (en) 2011-09-23 2019-07-16 Pulmonx Corporation Implant loading device and system

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