WO1994029077A1 - Dispositifs et procedes de polissage magnetorheologique - Google Patents

Dispositifs et procedes de polissage magnetorheologique Download PDF

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Publication number
WO1994029077A1
WO1994029077A1 PCT/US1994/006209 US9406209W WO9429077A1 WO 1994029077 A1 WO1994029077 A1 WO 1994029077A1 US 9406209 W US9406209 W US 9406209W WO 9429077 A1 WO9429077 A1 WO 9429077A1
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WO
WIPO (PCT)
Prior art keywords
polishing
determining
vessel
fluid
workpiece
Prior art date
Application number
PCT/US1994/006209
Other languages
English (en)
Inventor
William I Kordonsky
Igor V. Prokhorov
Sergei R. Gorodkin
Gennaadii R. Gorodkin
Leonid K. Gleb
Bronislav E. Kashevsky
Original Assignee
Byelocorp Scientific, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/071,813 external-priority patent/US5449313A/en
Application filed by Byelocorp Scientific, Inc. filed Critical Byelocorp Scientific, Inc.
Priority to EP94919329A priority Critical patent/EP0703847B1/fr
Priority to CA002163671A priority patent/CA2163671C/fr
Priority to KR1019950705488A priority patent/KR100335219B1/ko
Priority to JP7501936A priority patent/JPH08510695A/ja
Priority to AT94919329T priority patent/ATE215869T1/de
Priority to DE69430370T priority patent/DE69430370T2/de
Publication of WO1994029077A1 publication Critical patent/WO1994029077A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
    • B24B39/02—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor designed for working internal surfaces of revolution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent

Definitions

  • This invention relates to methods of polishing surfaces using magnetorheological fluids.
  • This invention is directed to improved devices and methods for polishing objects in a magnetorheological polishing fluid (MP-fluid) . More particularly, this invention is directed to a highly accurate method of polishing objects, in a magnetorheological fluid, which may be automatically controlled, and to improved polishing devices.
  • the method of this invention comprises the steps of creating a polishing zone within a magnetorheological fluid; bringing an object to be polished into contact with the polishing zone of the fluid; determining the rate of removal of material from the surface of the object to be polished; calculating the operating parameters, such as magnetic field intensity, dwell time, and spindle velocity, for optimal polishing efficiency; and moving at least one of said object and said fluid with respect to the other according to the operating parameters .
  • the polishing device comprises an object to be polished, a magnetorheological fluid, which may or may not be contained within a vessel, a means for inducing a magnetic field, and a means for moving at least one of these components with respect to one or more of the other componen s .
  • the object to be polished is brought into contact with the magnetorheological fluid and the magnetorheological fluid, the means for inducing a magnetic field, and/or the object to be polished are put into motion, thereby allowing all facets of the object to be exposed to the magnetorheological fluid.
  • the magnetorheological fluid is acted upon by a magnetic field in the region where the fluid contacts the object to be polished.
  • the magnetic field causes the MP-fluid to acquire the characteristics of a plasticized solid whose yield point depends on the magnetic field intensity and the viscosity.
  • the yield point of the fluid is high enough that it forms an effective polishing surface, yet still permits movement of abrasive particles.
  • the effective viscosity and elasticity of the magnetorheological fluid when acted upon by the magnetic field provides resistance to the abrasive particles such that the particles have sufficient force to abrade the workpiece.
  • Figure 1 is a cross-sectional side view of a polishing device of the invention.
  • Figure 2 is a cross-sectional side view of another embodiment of the invention.
  • Figure 3 is a cross-sectional side view of another embodiment of the invention.
  • Figure 4 is a graph showing the amount of material removed, as a function of distance from the center of the workpiece, for an exemplary workpiece.
  • Figure 5 is a schematic diagram illustrating the parameters used in the method of the invention to control polishing for a flat workpiece.
  • Figure 6 is a schematic diagram illustrating the parameters used in the method of the invention to control polishing for a curved workpiece.
  • Figure 7 is a graph showing the relationship between the rate of material removal during polishing and the magnetic field intensity.
  • Figure 8 is a graph showing the relationship between the rate of material removal during polishing and the clearance between a workpiece and the bottom of a vessel in which the workpiece is polished.
  • Figure 9 is a cross-sectional side view of another embodiment of the invention.
  • Figure 10 is a cross-sectional side view of another embodiment of the invention.
  • Figure 11 is a cross-sectional side view of another embodiment of the invention.
  • Figure 12 is a cross-sectional side view of another embodiment of the invention.
  • Figure 13 is a cross-sectional side view of another embodiment of the invention.
  • Figure 14 is a cross-sectional side view of another embodiment of the invention.
  • Figure 15 is a cross-sectional side view of another embodiment of the invention.
  • Figure 16 is a cross-sectional side view of another embodiment of the invention.
  • Figure 17 is a cross-sectional side view of another embodiment of the invention.
  • Figure 18 is a cross-sectional side view of another embodiment of the invention.
  • Figure 19 is a cross-sectional side view of another embodiment of the invention.
  • Figure 20 is a cross-sectional side view of another embodiment of the invention.
  • Figure 21 is a cross-sectional side view of another embodiment of the invention.
  • Figure 22 is a cross-sectional side view of another embodiment of the invention.
  • Figure 23 is a cross-sectional side view of another embodiment of the invention.
  • Figure 24 is a cross-sectional side view of another embodiment of the invention.
  • Figure 25 is a cross-sectional side view of another embodiment of the invention.
  • Figure 26 is a cross-sectional side view of another embodiment of the invention.
  • Figure 27 is a cross-sectional side view of another embodiment of the invention.
  • Figure 28 is a cross-sectional side view of another embodiment of the invention.
  • Figure 29 is a cross-sectional side view of another embodiment of the invention.
  • Figure 30 is a cross-sectional side view of another embodiment of the invention.
  • FIG. 1 is a schematic of a polishing device which may be operated according to the method of the present invention.
  • a cylindrical vessel 1 contains magnetorheological polishing fluid (MP-fluid) 2.
  • the MP-fluid 2 contains an abrasive.
  • Vessel 1 is preferably constructed of a non ⁇ magnetic material which is inert to the MP-fluid 2.
  • vessel 1 is semi-cylindrically shaped in cross- section and has a flat bottom. However, the particular shape of vessel 1 may be modified to suit the workpiece to be polished, as will be described in greater detail.
  • a workpiece 4 to be polished is connected to a rotatable workpiece spindle 5.
  • Workpiece spindle 5 is preferably made from a non ⁇ magnetic material.
  • Workpiece spindle 5 is mounted on a spindle slide 8, and can be moved in the vertical direction.
  • Spindle s ⁇ ide 8 may be driven by a conventional servomotor which operates according to electrical signals from a programmable control system 12.
  • Rotation of vessel 1 is controlled by vessel spindle 3, which is preferably positioned in a central location below vessel 1.
  • Vessel spindle 3 can be driven by conventional motor or other power source.
  • An electromagnet 6 is positioned adjacent to vessel 1 so as to be capable of influencing the MP-fluid 2 in a region containing the workpiece 4. Electromagnet 6 should be capable of inducing a magnetic field sufficient to carry out the polishing operation, and preferably will induce a magnetic field of at least about 100 kA/m. Electromagnet 6 is activated by winding 7 from power supply unit 11 which is connected to control system 12. Winding 7 can be any conventional magnetic winding. Electromagnet 6 is set up on an electromagnet slide 9 and can be moved in a horizontal direction, preferably along the radius of vessel 1. Electromagnet slide 9 may be driven by a conventional servomotor which operates according to electrical signals from the programmable control system 12.
  • Winding 7 is activated by power supply unit 11 during polishing to induce a magnetic field and influence the MP-fluid 2.
  • MP-fluid 2 is acted on by a nonuniform magnetic field in a region adjacent to the workpiece 4.
  • equal- intensity lines of the field are normal, or perpendicular, to the gradient of said field, and the force of the magnetic field is a gradient directed toward the vessel bottom normal to the surface of workpiece 4.
  • Application of the magnetic field from electromagnet 6 causes the MP-fluid 2 to change its viscosity and plasticity in a limited polishing zone 10 adjacent to the surface being polished.
  • the size of the polishing zone 10 is defined by the gap between the pole-pieces of the electromagnet 6 and the shape of the tips of the electromagnet 6.
  • Abrasive particles in the MP-fluid are preferably acted upon by the MP-fluid substantially only in polishing zone 10, and the pressure of MP-fluid against the surface of workpiece 4 is largest in the polishing zone 10.
  • composition of the MP-fluid 2 used in the method and devices discussed herein is preferably as described in co-pending-application Serial Nos. 966,919, filed October 27, 1992, 966,929, filed October 27, 1992, 930,116, filed August 14, 1992, and 868,466, filed April 14, 1992, which are incorporated herein by reference.
  • an MP-fluid composed according to co-pending application Ser. Nos. 966,919 or 930,116 comprising a plurality of magnetic particles, a stabilizer, and a carrying fluid selected from the group consisting of water and glycerin, is used.
  • the magnetic particles are coated with a protective layer of a polymer material which inhibits their oxidation.
  • the protective layer is preferably resistent to mechanical stresses, and as thin as practicable.
  • the coating material is teflon.
  • the particles may be coated by the usual process of microcapsulation.
  • the polishing machine shown in Figure 1 can operate as follows. Workpiece 4 is coupled to workpiece spindle 5, and positioned by spindle slide 8 at a clearance, h, with respect to the bottom of vessel 1 so that preferably a portion of the workpiece 4 to be polished is immersed in the MP-fluid 2.
  • Said clearance h may be any suitable clearance which will permit polishing of the workpiece.
  • the clearance h will affect the material removal rate V for the workpiece 4, as illustrated in Figure 8, and will also affect the size of a contact spot R, at which the polishing zone 10 contacts the workpiece 4.
  • the clearance h is preferably chosen so that the surface area of the contact spot R j , is less than one third of the surface area of the workpiece 4.
  • the clearance h may be changed during the polishing process.
  • both workpiece 4 and vessel 1 are rotated, preferably counter to each other.
  • Vessel spindle 3 is put into rotating motion, thereby rotating vessel 1.
  • Vessel spindle 3 rotates about a central axis and preferably rotates vessel 1 at a speed sufficient to effect polishing but insufficient to generate a centrifugal force sufficient to substantially eject or spray MP-fluid 2 out of vessel 1.
  • the vessel is rotated at a constant velocity.
  • the motion of vessel 1 provides continuous delivery of a fresh portion of MP-fluid 2 to the region where workpiece 4 is located, and provides continuous motion of the MP-fluid 2 in contact with the surface of the workpiece being polished in the polishing zone 10.
  • additional carrying fluid preferably water or glycerin, is added during polishing to replenish carrying fluid that has vaporized, and thus maintain the properties of the fluid.
  • Workpiece spindle 5 is also rotated, about a central axis, to provide rotating movement to workpiece 4.
  • workpiece spindle 5 operates at speeds of up to 2000 rpm, with about 500 rpm particularly preferred.
  • the motion of workpiece spindle 5 continuously brings a fresh part of the surface of the workpiece 4 into contact with the polishing zone 10, so that material removal along the circumference of the surface being polished will be substantially uniform.
  • polishing is accomplished in one or more cycles, with an incremental amount of material removed from the workpiece in each cycle. Polishing of the whole surface of the workpiece 4 is achieved by radial displacement of the electromagnet 6 using electromagnet slide 9, which causes the polishing zone 10 to move relative to the workpiece surface.
  • the radial motion of the electromagnet 6 may be continuous, or in discrete steps. If the movement of the electromagnet 6 is continuous, the optimal velocity U 2 of electromagnet 6 for each point of the trajectory of motion is calculated.
  • the velocity of the electromagnet, U z can be calculated according to the following formulae:
  • R is a function of the clearance h, as described above.
  • the material removal rate, V can be empirically determined given the clearance h and the velocity at which the vessel 1 is rotated.
  • the material removal rate V may be determined by measuring the amount of material removed from a given spot in a given time.
  • the thickness of the workpiece material layer to be removed during one polishing cycle, k 3 is a function of the accuracy required for the finished workpiece; k 3 may be selected to minimize local error accumulation. For example, when optical glass is polished, the value of k 3 is determined by the required fit to shape in waves.
  • the amount of time for which the contact spot R-- should be polished during one cycle, t is calculated according to the formula: t ⁇ k 3 /V
  • the number of cycles required and the time required for polishing may be determined.
  • N the thickness of the layer of material to be removed during polishing
  • K the thickness of the layer of material to be removed during polishing
  • Figure 5 shows the relationship of the radius of the workpiece R w , the contact spot R-, the clearance h, and the velocity of the magnet U z for a flat workpiece such as is shown in Figure 1.
  • the total time T required for polishing may be calculated using the formula:
  • T NR W /U 2
  • N the number of cycles required
  • R ⁇ is the radius of the workpiece
  • U z is the velocity of the electromagnet 6.
  • the dwell time at each step must be determined.
  • the overall material removal is maintained constant at each step. To remove a constant amount of material during stepwise polishing, it is necessary to take into account material removal due to overlapping of the contact spots R- at successive steps.
  • the coefficient of overlapping, I is determined by the formula:
  • r the displacement of the workpiece in a single step, in mm, and R-. is the radius of the contact spot.
  • the displacement in a single step, r may be determined empirically using results from preliminary trials, such as those detailed in the example given below.
  • n s R w /r
  • R-y the radius of the workpiece
  • r the displacement of the workpiece in a single step.
  • the total number of cycles, N, required to polish the workpiece may be calculated using the formula used with 11 continuous polishing, that is:
  • N K/k 3
  • K is the thickness of the layer of material to be removed during polishing
  • k 3 is the thickness of the workpiece material layer to be removed during one polishing cycle.
  • t d is the dwell time for each step
  • n s is the number of steps in one cycle
  • N is the total number of cycles.
  • a computer program for control unit 12 may be prepared on the basis of these calculations, for either continuous or stepwise polishing. The whole process of polishing a workpiece 4 may then be conducted under automatic control.
  • the control unit 12 preferably includes an input device 26, a processing unit 27, and a signal generator 28.
  • the accuracy of figure generation, or correspondence of the finished workpiece to the desired shape and tolerances may be improved by conducting tests to determine the spatial distribution of the removal rate of the material as a function of R-,, V[R Z ] , in the contact spot R z .
  • the spatial distribution of the removal rate may be determined by the method of successive approximation, as detailed in the example given below and in Figure 4.
  • the spatial distribution of the removal rate may then be used to more accurately determine the parameters of the polishing program, such as the dwell time, t d , using the formulas previously discussed.
  • the vessel 201 is a circular trough, and the radius of curvature of the internal wall, adjacent to polishing zone 210, is larger than the largest radius of curvature of workpiece 204.
  • the internal wall of the vessel 201 may be covered with a layer of a nap, or porous, material 215 to provide reliable mechanical adhesion between the MP-fluid 202 and the wall of the vessel 201.
  • Workpiece spindle 205 is connected with spindle slide 208, which is connected with a rotatable table 216.
  • the rotatable table 216 is connected to a table slide
  • Spindle slide 208, rotatable table 216, and table slide 217 may be driven by conventional servomotors which operate according to electrical signals from programmable control system 212.
  • Rotatable table 216 permits workpiece spindle 205 to be continuously rocked about its horizontal axis 214, or permits its positioning at an angle ce with the initial vertical axis 218 of spindle 205.
  • Axis 214 preferably is located at the center of curvature of the polished surface at the initial vertical position of the workpiece spindle.
  • Spindle slide 208 permits vertical displacement ⁇ of the center of polished surface curvature relative to axis 214.
  • Table slide 217 moves the rotatable table 216 with spindle slide 208 and workpiece spindle 205 to obtain, and maintain, the desired clearance h between the polished s ⁇ rface of workpiece 204 and the bottom of vessel 201.
  • an electromagnet 206 is stationary, and is positioned below the vessel 201 such that its magnetic gap is symmetric about the workpiece spindle axis 218 when this axis is perpendicular to the plane of polishing zone 210.
  • the device illustrated in Figure 2 is the same as the device shown in Figure 1 in all other respects.
  • the polishing machine operates as follows.
  • polishing of work piece 204 may then be conducted automatically by moving its surface relative to polishing zone 210 using rotatable table 216, which rocks workpiece spindle 205 and changes the angle o. according to calculated regimes of treatment.
  • L represents the thickness of the workpiece 204, as indicated on Figure 6, and it may be calculated using the formula:
  • the height of the contact spot, h 0 may be determined using the formula: where R sf is the radius of the total sphere and R-. is the width of the contact spot.
  • Rocking of workpiece spindle 205 may be continuous or stepwise. If the workpiece spindle 205 is continuously rocked, the angular velocity ⁇ z of this motion is determined by the formula: ⁇ z ⁇ /?V/k 3 where ⁇ is the angle dimension of the contact spot, V is the material removal rate, and k 3 is the thickness of the workpiece material layer to be removed during one cycle of polishing.
  • N the thickness of the layer of material to be removed during polishing
  • K k ! + k 2
  • k is the initial surface roughness in ⁇ m
  • k 2 is the thickness of the subsurface damage layer in ⁇ m.
  • N K/k 3 where k 3 is the thickness of the workpiece material layer to be removed during one cycle of polishing.
  • the total time T required to polish the workpiece may then be calculated using the formula
  • T t c N where t c is the duration of one cycle, and N is the number of cycles required. If the workpiece spindle 205 is rocked in discrete steps, the dwell time for each step must be calculated. In calculating the dwell time for each step, it is necessary to take the coefficient of overlapping I into account. The coefficient of overlapping I is determined by the formula
  • the angle displacement for one step, ⁇ . s may be calculated by the formula: where (. resonate,. is the maximal angle a to which the spindle 205 may be rocked, and n s is the number of steps in one cycle. The number of steps per cycle, n s , may be calculated using the formula where o. m ⁇ X is the maximal angle ⁇ to which the spindle 205 may be rocked, and ⁇ is the angle dimension of the contact spot.
  • the thickness of the layer of material to be removed during polishing, K is calculated according to the formula:
  • K k, + k 2
  • k is the initial surface roughness in ⁇ m
  • k is the thickness of the subsurface damage layer in ⁇ m.
  • N K/k 3 where k 3 is the thickness of the workpiece material layer to be removed during one cycle of polishing.
  • the total time T required to polish the workpiece may then be calculated using the formula:
  • T t d n s N
  • t d the dwell time for each step
  • n s the number of steps per cycle
  • N the number of cycles required.
  • the polishing may be conducted under conditions which yield uniform material removal from each point of the surface, if it is desired that the surface figure should not be altered, or specific material removal goals for each point on the surface may be achieved by varying the dwell time.
  • a non-spherical workpiece 204 When a non-spherical workpiece 204 is to be polished, the procedure is generally the same as described for a spherical workpiece.
  • a non-spherical workpiece 204 may be polished to the desired shape by varying the dwell time depending upon the radius of curvature of the section of the workpiece being polished.
  • workpiece spindle 205 may also be moved vertically during polishing.
  • the magnetic field strength may also be varied for each stage of treatment during polishing, if desired.
  • the material removal rate V is a function of the magnetic field intensity G, as shown in Figure 7. It is therefore possible to change the quantities of the operating parameters, such as dwell time or clearance.
  • the magnetic field strength may be used as another means for controlling the polishing process.
  • FIG 3 there is shown an alternate embodiment of the invention.
  • the internal wall of the vessel 301 has an additional circular trough which passes through the gap of the electromagnet 306.
  • This configuration of the internal wall of the vessel 301 results in a smaller, more focused, polishing zone 310, and an increase in adhesion between the MP-fluid 302 and the vessel 301 is achieved.
  • the smaller, more focused, polishing zone will result in a smaller contact spot R ⁇
  • the embodiment depicted in Figure 3 is the same as that depicted in Figure 2.
  • Example 1 The polishing of a glass lens was accomplished, using a device as shown in Figure 2.
  • the workpiece 204 had the following initial parameters: a) Glass type BK7 b) Shape Spherical c) Diameter, mm . 20 d) Radius of curvature, mm 40 e) Center thickness, mm 15 f) Initial fit to shape, waves 0.5 g) Initial surface roughness, nm, r s . . . . 100
  • a vessel 201 in which the radius of curvature of the internal wall adjacent to the electromagnet pole pieces 206 was 200 mm, was used. The radius from central axis 219 was 145 mm and the width of the vessel trough was 60 mm.
  • the vessel 201 was filled with 300 ml of the MP-fluid 202, having the following composition:
  • a test workpiece 204 identical to the workpiece to be polished was polished at arbitrarily chosen standard parameters.
  • the test workpiece was attached to the workpiece spindle 205 and positioned by spindle slide 208 so that the distance between the workpiece surface to be polished and the pivot point of the rotatable table 216 (axis 214) was equal to 40 mm (the radius of curvature of the workpiece 204 surface) .
  • the clearance h between the surface of workpiece 204 to be polished and the bottom of the vessel 201 was set at 2 mm using the table slide 217.
  • Both the workpiece spindle 205 and the vessel 201 were then rotated.
  • the workpiece spindle rotation speed was 500 rpm, and the vessel rotation speed was 150 rpm.
  • the electromagnet 206 having a magnet gap equal to 20 mm, was turned on to a level where the magnetic field intensity near the workpiece surface was about 350 kA/m. All parameters were kept constant, and the workpiece was polished for about 10 minutes, which was sufficient to create a well-defined spot.
  • the inputs obtained in this example for calculating the polishing program are as follows: 1. Parameters of the workpiece: a) radius of the total sphere, R sf , mm . 39.6 b) radius of workpiece, R w , mm . . . . 24.3
  • the polishing required to finish the workpiece is determined.
  • a computer program is used to calculate the necessary parameters and control the polishing operation. Determination of the polishing requirements includes determination of the number of steps for changing angle ⁇ ., the value of angle a for each step, and the dwell time for each step in order to maintain constant the material removal over the surface of the workpiece by overlapping polishing zones, as described above.
  • polishing regime The parameters of the workpiece, parameters of the polishing zone, and spatial distribution of removed material in the polishing zone given above for this example are used to control the system during the polishing method.
  • the results were entered into a computer program for this purpose.
  • the results of the calculations were as follows: Polishing regime
  • control radius represents the relative position of the polishing zone with respect to the central vertical axis of the workpiece.
  • the control radius is determined by the angle ⁇ .; during polishing it is the angle ⁇ , rather than the control radius, that is controlled.
  • the dwell times for each angle are then converted to minutes by multiplying the time coefficients in table 1 by a constant factor.
  • the constant factor used to convert the time coefficients to dwell times will depend upon the characteristics of the workpiece. For the example given here, this constant was empirically determined to be 5 minutes.
  • an MP-fluid 902 is placed at the poles of an electromagnet 906.
  • Electromagnet 906 is positioned so that the magnetic field that it creates acts only upon a particular surface section of the object to be polished 904, thereby creating a polishing zone.
  • object 904 is put into rotation.
  • Either electromagnet 906, or object 904, or both electromagnet 906 and object 904, are then moved such that step-by-step the entire surface of the object is polished.
  • Electromagnet 906, object to be polished 904, or both may be displaced relative to each other in the vertical and/or horizontal planes.
  • the magnetic field strength is also regulated, as required, to polish the object 904. Rotation of the object 904, movement of the electromagnet 906 and/or the object 904, and regulation of the magnetic field strength according to a predetermined program of polishing permits controlled removal of material from the surface of the object to be polished 904.
  • Figure 10 illustrates a device for polishing curved surfaces.
  • an MP-fluid 1002 is placed at the poles of electromagnet 1006.
  • the electromagnet 1006 is configured such that it generates a magnetic field affecting only some surface section of an object to be polished 1004.
  • Object to be polished 1004 which has a spherical or aspherical surface, is put into rotation.
  • Electromagnet 1006 is displaced to an angle along the trajectory which corresponds to the radius of curvature of the object 1004, as indicated by the arrows in Figure 10, such that the electromagnet is moved parallel to the surface of the object, according to a predetermined program of polishing, thus controlling material removal along the part surface.
  • an MR-fluid 1102 is also placed at the poles of electromagnet 1106.
  • the electromagnet is configured such that it generates a magnetic field acting only upon some surface section of the object to be polished 1104.
  • an object to be polished 1104 having a spherical or aspherical surface is put into rotation.
  • the object to be polished 1104 is then rocked, such that an angle a, indicated on Fig. 11, varies from 0 to a value which depends upon the size and shape of the workpiece.
  • MR-fluid 1202 is placed into a vessel 1201.
  • An electromagnet 1206 is positioned beneath vessel 1201 and configured such that the electromagnet 1206 initiates a magnetic field which acts only upon a section, or polishing zone 1210, of the MP-fluid 1202 in the vessel 1201.
  • the MP-fluid in the polishing zone 1210 acquires plastic properties for effective material removal in the presence of a magnetic field.
  • Object to be polished 1204 is put into rotation, and electromagnet 1206 is displaced along the surface to be polished.
  • the workpiece may then be polished according to a predetermined program which controls material removal along the surface of the object to be polished.
  • an MP-fluid 1302 is placed into a vessel 1301.
  • Electromagnet 1306 is configured such that it induces a magnetic field acting only upon a section, or polishing zone 1310, of the MP-fluid 1302.
  • the MP- fluid 1302 thus acts only upon the section of the object to be polished 1304 positioned in the polishing zone 1310.
  • Object to be polished 1304 and vessel 1301, with their axes coinciding, are put into rotation at the same or different speeds in the same or opposite directions.
  • Displacing electromagnet 1306 radially along the vessel surface according to an assigned program displaces the polishing zone 1310, and controls material removal along the surface of the object to be polished.
  • an MP-fluid 1402 is placed into a vessel 1401.
  • a casing 1419 which contains a system of permanent magnets 1406 is set under the vessel 1401.
  • An electromagnetic field created by each magnet 1406 affects only a section, or polishing zone 1410, of the object to be polished.
  • object to be polished 1404 and vessel 1401 are simultaneously put into rotation.
  • the rotation axes of object to be polished 1404 and vessel 1401 are eccentric relative to each other.
  • the casing 1419, or the object to be polished 1404, or both, are simultaneously displaced according to a predetermined program of polishing, thus controlling material removal along the object to be polished surface.
  • an MP-fluid 1502 is placed into a vessel 1501.
  • Electromagnet 1506 is positioned under the vessel such that its magnetic field affects only a section, or polishing zone 1510, of the MP-fluid 1502 in the vessel 1501.
  • Object to be polished 1504 which has a spherical or curved shape, and vessel 1501 are put in rotation in the same or opposite directions. While polishing, object 1504 is rocked such that an angle a, indicated on Fig. 15, varies from 0 to a value which depends upon the size and shape of the object 1504.
  • the rotation of the object 1504 and the vessel 1501, and the angle are controlled according to a predetermined program of polishing. As a result, material removal along the surface of the object to be polished is controlled.
  • an MP-fluid 1602 is placed into a longitudinal vessel 1601.
  • An electromagnet 1606 is positioned below the vessel 1601 such that it induces a magnetic field in a section, or polishing zone 1610, of the MP-fluid 1602. In operation, the electromagnet 1606 is displaced along the bottom of the vessel 1601 while the object 1604 and the vessel 1601 are rotating. The object is also rocked to an angle a during the polishing program.
  • Rotation of the object 1604 and vessel 1601, movement of the electromagnet 1606, and rocking the object 1604 according to a predetermined program of polishing permits controlled removal of material from the surface of the object to be polished 904.
  • MP-fluid 1702 is placed into a circular vessel with an annular cavity 1701.
  • Electromagnet 1706 is positioned under the vessel 1701.
  • Electromagnet 1706 is chosen such that its magnetic field affects a section, or polishing zone 1710, of the MP- fluid 1702.
  • Object to be polished 1704 and vessel 1701 are put into rotation in the same or opposite directions at equal or different speeds.
  • Displacing electromagnet 1706 radially along the bottom of the annular cavity of the vessel 1701, according to a program of polishing controls material removal along the surface of the object to be polished 1704.
  • an MP-fluid 1802 is placed into a circular vessel with an annular cavity 1801.
  • the vessel bottom is coated with a nap material 1815, which hinders slippage of the MP-fluid 1802 relative to the vessel bottom 1801, and enhances the rate of material removal from the surface of the object.
  • Electromagnet 1806 is mounted under the vessel cavity 1801.
  • the pole pieces of the electromagnet 1806 are chosen such that its field will affect only a section, or polishing zone 1810, of the MP-fluid, and therefore it will only affect a portion of the surface of the object to be polished 1804.
  • the object to be polished 1804, the longitudinal vessel 1801, or both, are put into rotation at the same or different speeds, in the same or opposite directions.
  • Electromagnet 1806 is also displaced relative to the surface of the object to be polished 1804 according to a program of polishing.
  • MP-fluid 1902 is placed into an annular cavity in a circular vessel 1901.
  • the radius of curvature of the vessel cavity is chosen to correspond to the desired radius of curvature of the object 1904 after polishing, such that the inner wall of the cavity 1901 will equi-distant to the surface of the polished object 1904.
  • Object to be polished 1904 which is mounted on a spindle 1905, and vessel 1901 are put into rotation at equal or different speeds in the same or opposite directions.
  • Electromagnet 1906 is displaced along the bottom of the vessel cavity 1901 according to a predetermined program, thus controlling material removal along the surface of the object to be polished.
  • the MP-fluid 2002 is also placed into a circular vessel with an annular cavity 2001.
  • An electromagnet 2006 is mounted under the vessel 2001.
  • the pole pieces of the electromagnet 2006 are chosen such that its field will affect only a section, or polishing zone 2010, of the MP-fluid 2002, and therefore will affect only a surface section of the object to be polished 2004.
  • Object to be polished 2004 and the vessel 2001 are put into rotation at the same or ' .fferent speeds in the same or opposite directions.
  • the object to be polished 2004 is also rocked, or swung, relative to the vessel.
  • the object is rocked from a vertical position to an angle oc during polishing according to a predetermined program, thereby controlling material removal along the surface to be polished.
  • an MP-fluid 2102 is placed in a circular vessel 2101 with an annular cavity having a valley 2120.
  • the pole pieces of electromagnet 2106 are chosen such that its magnetic field will affect only a portion, or polishing zone 2110, of the MP-fluid 2101.
  • the portion of the MP-fluid 2102 affected by the magnetic field is located within, or above, the valley 2120.
  • An object to be polished 2104 is put into rotation.
  • the object to be polished 2104 is also rocked, or swung, relative to its axis normal to the vessel rotation plane to an angle oc, according to an assigned program, thus controlling material removal along the surface of the object to be polished.
  • an MP-fluid 2202 is placed into a cylindrical vessel 2201.
  • Objects to be polished 2204a, 2204b, etc. are fixed on spindles 2205a, 2205b, etc., which are, mounted on a disc 2221 capable of rotating in the horizontal plane.
  • An electromagnet 2206 is installed under the vessel such that it creates a magnetic field along the entire surface of vessel 2201.
  • Disc 2221, vessel 2201, and objects to be polished 2204a, 2204b, etc. are put into rotation in the same or opposite directions with equal or different speeds.
  • the rate of removal of material from the surface of the object to be polished is controlled.
  • an MP-fluid 2302 is placed into a vessel 2301.
  • An electromagnet 2306 is installed below the vessel bottom.
  • the pole pieces of the electromagnet are chosen such that it will create a magnetic field which acts only upon a portion, or polishing zone 2310, of the MP-fluid 2302 in the vessel 2301.
  • Objects to be polished 2304a, 2304b, etc. are mounted on spindles 2305a, 2305b, etc., which are capable of rotating relative to a disc 2321 on which they are installed.
  • Disc 2321 is also capable of rotating relative to vessel 2301.
  • Electromagnet 2306 is also radially displaced along the surface of the vessel. This rotation, and displacing electromagnet 2306 along the vessel surface, are regulated to control material removal from the surface of the object to be polished.
  • an MP-fluid 2402 is placed into a vessel 2401.
  • Electromagnets 2406a, 2406b, etc. are mounted near the vessel bottom.
  • the pole pieces of electromagnets 2406a, 2406b, etc. are chosen such that each will create a field acting only upon a section, or polishing zone 2410a, 2410b, etc., of the vessel fluid 2402.
  • Objects to be polished 2404a, 2404b, etc. are mounted on spindles 2405a, 2405b, etc. which are capable of rotating relative to a disc 2421 on which they are installed.
  • Disc 2421, objects to be polished 2404a, 2404b, etc. and vessel 2401 are put into rotation with equal or different speeds, in the same or opposite directions.
  • Electromagnets 2406a, 2406b, etc. are also radially displaced along the bottom surface of the vessel 2401. This rotation, and displacing electromagnets 2406a, 2406b, etc. along the vessel surface, are regulated to control material removal from the surface of the object to be polished.
  • an MP-fluid 2502 is placed into a circular vessel 2501 with an annular cavity.
  • Objects to be polished 2504a, 2504b, etc. are mounted on spindles
  • Electromagnets 2506a, 2506b, etc. are mounted under the vessel 2501 such that the electromagnet-induced magnetic field will affect the entire volume of the MP-fluid, and thus the entire surface of the objects to be polished.
  • Vessel 2501 and objects to be polished 2504a, 2504b, etc. are rotated in the same or opposite directions, with equal or different speeds.
  • the electromagnet-induced magnetic field intensity is also controlled. This results in controlled material removal from the surface of the object to be polished.
  • an MP-fluid 2602 is placed into a circular vessel 2601 with an annular cavity.
  • Objects to be polished 2604a, 2604b, 2604c, 2604d, etc. are mounted on spindles 2605a, 2605b, 2605c, 2605d, etc., which are installed on a disc 2621 which is capable of rotating in the horizontal plane.
  • Electromagnets 2606a, 2606b, etc. are installed under the vessel surface.
  • the pole pieces of the electromagnets are chosen such that the electromagnets will create a magnetic field over the entire vessel width.
  • an MP-fluid 2702 is placed into a circular vessel 2701 having an annular cavity.
  • An electromagnet 2706 induces a magnetic filed along the entire surface of vessel 3501.
  • Objects to be polished 2704a, 2704b, 2704c, 2704d, etc. are mounted on spindles 2705a, 2705b, 2705c, 2705d, etc.
  • Spindles 2705a, 2705b, 2705c, 2705d, etc. are mounted on discs 2721a, 2721b, etc., which are capable of rotating in a horizontal plane.
  • Discs 2721a, 2721b, etc. are mounted on spindles 2724a, 2724b, etc.
  • This figure illustrates one possible design for simultaneously polishing numerous objects.
  • an MP-fluid 2802 is placed into vessel 2801.
  • Two units 2822a and 2822b equipped with permanently mounted magnets 2823 are installed inside the vessel 2801.
  • a flat object to be polished 2804 is mounted between units 2822a and 2822b.
  • Units 2822a and 2822b are rotated about their horizontal axes . These units are rotated at the same speed such that a magnetic field, and polishing zones 2810, will be created when different-sign poles are on the contrary with each other.
  • Object to be polished 2804 is moved in such a way that polishing zones are created for both object surfaces.
  • the material removal rate is controlled by the rotation speed of units 2822a, 2822b and the speed at which the object 2804 is vertically displaced.
  • an MP-fluid 2902 is placed into vessel 2901.
  • Units 2922 equipped with magnets 2923 are mounted inside vessel 2901 and are capable of rotating along the axis normal to the displacement direction of the object to be polished 2904.
  • the magnets are mounted in the unit so that the permanent magnets mounted side by side would have different-sign poles relative to each other, so as to create a polishing zone 2910 between the magnets.
  • FIG. 30 illustrates an apparatus for polishing spherical objects.
  • the objects 3004a, 3004b, etc. are placed in a channel 3025 formed between a top vessel 3001b and a bottom vessel 3001a.
  • the channel 3025 is filled with an MP-fluid 3002, which is affected by a magnetic field induced by an electromagnet 3006.
  • top vessel 3001a and bottom vessel 3001b are rotated counter to one another.
  • the rotation of the MP- fluid 3002 with the vessels 3001a and 3001b causes the spherical objects to be polished.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

L'invention se rapporte à un procédé pour polir un objet. Dans un mode de réalisation, illustré à la figure 1, ledit procédé consiste à créer une zone de polissage (10) dans un fluide magnétorhéologique (2); à déterminer les caractéristiques du contact entre l'objet et la zone de polissage nécessaires pour polir l'objet (4); à réguler la consistance du fluide (2) dans la zone de polissage (10); à amener l'objet (4) en contact avec la zone de polissage (10) du fluide (2); et à déplacer l'un par rapport à l'autre l'objet (4) et/ou le fluide (2). L'invention décrit également un dispositif de polissage (1). Dans un mode de réalisation, ce dispositif comprend un fluide magnétorhéologique (2), un moyen (6) pour induire un champ magnétique, et un moyen pour déplacer l'un par rapport à l'autre l'objet (4) à polir ou le moyen (6) pour induire un champ magnétique.
PCT/US1994/006209 1993-06-04 1994-06-03 Dispositifs et procedes de polissage magnetorheologique WO1994029077A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP94919329A EP0703847B1 (fr) 1993-06-04 1994-06-03 Dispositifs et procedes de polissage magnetorheologique
CA002163671A CA2163671C (fr) 1993-06-04 1994-06-03 Methodes et dispositifs de polissage magnetorheologiques
KR1019950705488A KR100335219B1 (ko) 1993-06-04 1994-06-03 자기유동학적유체및이를이용한시편표면완성방법,장치및광택방법
JP7501936A JPH08510695A (ja) 1993-06-04 1994-06-03 磁気流動学の研磨装置及び方法
AT94919329T ATE215869T1 (de) 1993-06-04 1994-06-03 Magnetorheologische poliervorrichtungen und verfahren
DE69430370T DE69430370T2 (de) 1993-06-04 1994-06-03 Magnetorheologische poliervorrichtungen und verfahren

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/071,813 1993-06-04
US08/071,813 US5449313A (en) 1992-04-14 1993-06-04 Magnetorheological polishing devices and methods
BY863 1993-12-09
BY00863-01 1993-12-09

Publications (1)

Publication Number Publication Date
WO1994029077A1 true WO1994029077A1 (fr) 1994-12-22

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PCT/US1994/006209 WO1994029077A1 (fr) 1993-06-04 1994-06-03 Dispositifs et procedes de polissage magnetorheologique

Country Status (7)

Country Link
EP (1) EP0703847B1 (fr)
JP (2) JPH08510695A (fr)
KR (1) KR100335219B1 (fr)
AT (1) ATE215869T1 (fr)
CA (3) CA2497731C (fr)
DE (1) DE69430370T2 (fr)
WO (1) WO1994029077A1 (fr)

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EP0687525A1 (fr) * 1994-06-13 1995-12-20 Read-Rite Corporation Système à roder pour le contournage automatisé
US7364493B1 (en) 2006-07-06 2008-04-29 Itt Manufacturing Enterprises, Inc. Lap grinding and polishing machine
EA024869B1 (ru) * 2013-12-27 2016-10-31 Государственное Научное Учреждение "Институт Тепло- И Массообмена Имени А.В. Лыкова Национальной Академии Наук Беларуси" Способ магнитореологического формообразования и полирования поверхности сложной формы
KR101994029B1 (ko) * 2018-01-02 2019-09-30 인하대학교 산학협력단 평면 연마 장치
CN110421412A (zh) * 2019-09-05 2019-11-08 河北工业大学 一种小型磁流变平面抛光装置
CN113941904A (zh) * 2021-10-29 2022-01-18 哈尔滨工业大学 一种基于小型回转体零件旋转超声振动的小球头磁流变抛光工艺方法
CN114055258A (zh) * 2021-11-19 2022-02-18 浙江师范大学 一种磁性抛光装置及磁性抛光控制方法
CN117428580A (zh) * 2023-12-15 2024-01-23 成都市凯林机械贸易有限责任公司 一种阀门加工用抛光装置

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KR100788796B1 (ko) 2006-11-20 2007-12-27 연세대학교 산학협력단 집속이온빔과 ｍｒｆ를 이용한 나노 구조물의 제조방법
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0687525A1 (fr) * 1994-06-13 1995-12-20 Read-Rite Corporation Système à roder pour le contournage automatisé
US7364493B1 (en) 2006-07-06 2008-04-29 Itt Manufacturing Enterprises, Inc. Lap grinding and polishing machine
EA024869B1 (ru) * 2013-12-27 2016-10-31 Государственное Научное Учреждение "Институт Тепло- И Массообмена Имени А.В. Лыкова Национальной Академии Наук Беларуси" Способ магнитореологического формообразования и полирования поверхности сложной формы
KR101994029B1 (ko) * 2018-01-02 2019-09-30 인하대학교 산학협력단 평면 연마 장치
CN110421412A (zh) * 2019-09-05 2019-11-08 河北工业大学 一种小型磁流变平面抛光装置
CN113941904A (zh) * 2021-10-29 2022-01-18 哈尔滨工业大学 一种基于小型回转体零件旋转超声振动的小球头磁流变抛光工艺方法
CN113941904B (zh) * 2021-10-29 2022-07-29 哈尔滨工业大学 一种基于小型回转体零件旋转超声振动的小球头磁流变抛光工艺方法
CN114055258A (zh) * 2021-11-19 2022-02-18 浙江师范大学 一种磁性抛光装置及磁性抛光控制方法
CN114055258B (zh) * 2021-11-19 2023-04-18 浙江师范大学 一种磁性抛光装置及磁性抛光控制方法
CN117428580A (zh) * 2023-12-15 2024-01-23 成都市凯林机械贸易有限责任公司 一种阀门加工用抛光装置
CN117428580B (zh) * 2023-12-15 2024-03-19 成都市凯林机械贸易有限责任公司 一种阀门加工用抛光装置

Also Published As

Publication number Publication date
JP2005040944A (ja) 2005-02-17
DE69430370T2 (de) 2002-12-12
ATE215869T1 (de) 2002-04-15
CA2497732C (fr) 2011-03-01
JPH08510695A (ja) 1996-11-12
CA2497731C (fr) 2006-02-07
KR100335219B1 (ko) 2002-11-07
CA2163671C (fr) 2005-10-25
DE69430370D1 (de) 2002-05-16
EP0703847A1 (fr) 1996-04-03
CA2497731A1 (fr) 1994-12-22
EP0703847B1 (fr) 2002-04-10
CA2163671A1 (fr) 1994-12-22
KR960702786A (ko) 1996-05-23
JP4741212B2 (ja) 2011-08-03
EP0703847A4 (fr) 1997-07-09
CA2497732A1 (fr) 1994-12-22

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