WO1994014306A1 - Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eine elektronischen moduls - Google Patents
Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eine elektronischen moduls Download PDFInfo
- Publication number
- WO1994014306A1 WO1994014306A1 PCT/DE1993/001173 DE9301173W WO9414306A1 WO 1994014306 A1 WO1994014306 A1 WO 1994014306A1 DE 9301173 W DE9301173 W DE 9301173W WO 9414306 A1 WO9414306 A1 WO 9414306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic module
- plastic carrier
- plastic
- rail
- carrier according
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/946—Memory card cartridge
Definitions
- the invention relates to an electronic module, in particular a memory module, each having a strip on two opposite sides, and a plastic carrier for receiving and holding the electronic module in grooves of the module carrier corresponding to the strips on a printed circuit board.
- System components such as, for example, are integrated by means of electronic modules which are accommodated in a module carrier on a printed circuit board.
- B. central assemblies or communication processors of automation devices can be implemented with a variable memory expansion. Depending on the requirements of the automation task, they can be equipped with a memory of different sizes. The requirements of industrial suitability must be met by the electronic module and the plastic carrier for holding the module on the circuit board.
- the invention has for its object to provide an electronic module, in particular a memory module, and a plastic carrier for receiving the electronic module on a printed circuit board, which ensure good electromagnetic compatibility with simple means and potential shifts between the electronic module and its surroundings avoid.
- the invention has the advantage that interference currents are diverted from the cover of the electronic module via a leaf spring and a flag on the leaf spring to the reference potential, and thus no electrostatic charging can occur. If the module carrier is designed accordingly, the interference currents can also be dissipated over the entire area of the electronic module.
- an electrically low-resistance connection is achieved by several contact points in the peripheral area of the covers.
- the special arrangement of the snap-in connections between the covers and the plastic frame makes it easy to assemble the individual parts by pressing them together.
- the number and placement of contact points and snap-in connections can be selected according to the requirements of electromagnetic compatibility and mechanical stability. In the case of non-detachable locking connections, high torsional rigidity and great bending stability of the electronic module are guaranteed. If a cover is chosen which, in addition to the electrical conductivity, also has good thermal conductivity, good heat dissipation is given by the immediate proximity of the components to be cooled on the printed circuit board to the covers.
- the design of the parts according to the invention has the advantage that assembly is possible without glue and without additional connecting elements. Joining aids are easy to implement. To increase the mechanical stability and to avoid short circuits, spacers can be inserted between the covers and the circuit board. For better handling of the electronic module, a pull handle can be inserted into locking points on the front of the plastic frame, which can also be easily removed if necessary. A compartment for a replaceable buffer battery of the electronic module can also be provided on the front.
- the plastic carrier with two leaf springs lying opposite one another ensures reliable contacting of the upper and the lower cover of the electronic module.
- the flag can be provided with a tab, which is pressed by the contact pressure of fastening elements of the plastic carrier against lines carrying reference potential on the printed circuit board.
- the arrangement of the leaf spring at the front in the area of the start of the rail means that when the electronic module is plugged in, the connection to the reference potential is established before plug connectors come into contact. This avoids the destruction of sensitive components during assembly.
- a relatively short, forward-facing flag is sufficient.
- a reference potential connection can be established between two adjacent printed circuit boards via the leaf spring of the plastic carrier.
- Leaf springs can easily be inserted into the plastic carrier and are captively arranged there when the upper part, which connects the two leaf springs, is mounted in a slot-shaped recess in the plastic carrier in the yoke of the rail and when the leaf springs have projections at their opposite ends, which protrude into corresponding recesses in the legs.
- the leaf springs including the connecting part and flags can be produced as a one-piece component by stamping and bending from flat material. To guarantee a permanent good contact, it is advantageous to tin the component galvanically.
- a part that hides the underlying components on the circuit board can be easily removed for troubleshooting or repair, even if the connector is already soldered to the circuit board.
- a central unit of an automation device equipped with it can be expanded by exchanging the modules and can be easily adapted to the task at hand.
- FIG. 1 shows an exploded view of an electronic module according to the invention
- FIG. 2 shows a sectional view of a contact point
- FIG. 3 shows a sectional view of a snap-in connection
- FIG. 4 shows an exploded view of a plastic carrier according to the invention
- FIG. 5 leaf springs with a flag to the front
- FIG. 6 leaf springs with a flag upwards.
- An electronic module consists of Figure 1 of a plastic frame 1 'which accommodates a printed circuit board. 2
- the plastic frame 1 has a recess 3, into which a pin 4 of the connector 5 protrudes on the printed circuit board 2, so that the forces required to insert and remove the electronic module are transferred to the plastic frame 1 and solder connections 6 of the connector 5 are relieved become.
- Covers 7 and 8 are provided to shield the electronic module against electromagnetic radiation. Spacers 9 can be used between the printed circuit board 2 and the covers 7 and 8 to avoid short circuits.
- Continuous recesses 10 are made in the plastic frame 1 between the top and bottom sides. When assembled, the electronic module protrude into these recesses 10 tabs 11 and 18 into it, which establish an electrical connection between the covers 7 and 8.
- Hooks 12 engage in further recesses 13 and cause a snap connection there.
- the plastic frame 1 is provided with locking points 14, to which a pull handle 15 can be attached.
- the two covers 7 and 8 extend to the strips 16 and 17 of the plastic frame 1, so that a connection to the reference potential can be established via a carrier for receiving and holding the electronic module. They are identical and therefore easily interchangeable.
- FIG. 2 shows the area of a contact point.
- Tabs 11 of the cover 7 and a tab 18 of the cover 8 protrude into a recess 10 in the plastic frame 1.
- Figure 3 shows a snap connection in the connector area of the electronic module.
- a hook 12 which comes to rest in a recess 13 of the plastic frame 1, engages behind a projection 19 there and hooks undetachably. It can be produced in a simple manner as a notch in an extension of the sheet metal of the cover 7 bent at a right angle. With the aid of such a snap connection, a high torsional rigidity of the electronic module is achieved.
- a plastic carrier consists of a rail start part 20, a rail end part 21 and contact elements 22 and 23.
- the rail start part 20 with its two arms 24 and 25 is pushed over the two rails 26 and 27 of the rail end part 21. pushed so that the two parts 20 and 21 form a latching connection which can be released again by spreading the arms 24 and 25.
- the contact elements 22 and 23 are inserted into grooves in the rail start part 20, of which only the groove 28 is visible in the perspective view.
- the two contact elements 22 and 23, each having leaf springs 29 and 30 or 31 and 32, come with their parts 33 and 34 connecting the leaf springs to lie in slot-shaped recesses 35 and 36 in the yokes 37 and 38 of the U-shaped rails .
- the leaf springs 29, 30, 31 and 32 are largely safe against damage when inserting or removing a module due to their design with a curvature in the central area.
- Connectors for contacting an electronic module and the electronic module according to the invention itself and the printed circuit board on which the plastic carrier according to the invention is fastened are not shown in FIG. 4 for reasons of clarity.
- the connector is arranged in the region 39 of the rail end part 21.
- the plastic carrier is provided with bores 40, 41 and two further bores which are not visible in FIG. 4 due to their arrangement in recesses 42 and 43 of a base plate 44.
- the base plate 44 is covered in the assembled state in the area of the latter two bores by two tabs 45 and 46.
- the tabs 45 and 46 make a reliable contact with conductor tracks of the printed circuit board which carry reference potential.
- They are connected to the leaf springs by flags 47 and 48, respectively.
- the leaf springs each have a projection 49 which engages in a corresponding recess 50 of a leg of a U-shaped rail. As a result, the leaf springs are secured against shifting in the grooves.
- Two locking springs, of which only one (51) is visible, are used for the vibration-proof mounting of the electronic module in the plastic frame. Because the top of the plastic carrier is open, no restrictive conditions are placed on the height of the electronic module.
- a leaf spring according to FIG. 5 is provided with a lug 52 which is led to the front and which establishes an electrical connection to the reference potential of an electrically conductive front plate.
- a flag 53 led upwards according to FIG. 6 enables the electrical connection between two adjacent printed circuit boards via the contact element of the plastic carrier.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Packaging Frangible Articles (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE59303280T DE59303280C5 (de) | 1992-12-17 | 1993-12-08 | Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eines elektronischen moduls |
JP6513658A JP2720413B2 (ja) | 1992-12-17 | 1993-12-08 | 電子モジュール及びこの電子モジュールを収容して保持するためのプラスチック支持体 |
US08/454,164 US5867366A (en) | 1992-12-17 | 1993-12-08 | Electronic module and plastic substrate to accept and hold the electronic module |
EP94901739A EP0674828B1 (de) | 1992-12-17 | 1993-12-08 | Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eines elektronischen moduls |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9217302U DE9217302U1 (de) | 1992-12-17 | 1992-12-17 | Kunststoffträger zur Aufnahme und Halterung eines elektronischen Moduls |
DEG9217302.0U | 1992-12-17 | ||
DE9217265U DE9217265U1 (de) | 1992-12-17 | 1992-12-17 | Elektronisches Modul |
DEG9217265.2U | 1992-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994014306A1 true WO1994014306A1 (de) | 1994-06-23 |
Family
ID=25960263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1993/001173 WO1994014306A1 (de) | 1992-12-17 | 1993-12-08 | Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eine elektronischen moduls |
Country Status (7)
Country | Link |
---|---|
US (1) | US5867366A (de) |
EP (1) | EP0674828B1 (de) |
JP (1) | JP2720413B2 (de) |
AT (1) | ATE140582T1 (de) |
DE (1) | DE59303280C5 (de) |
ES (1) | ES2091123T3 (de) |
WO (1) | WO1994014306A1 (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995024020A1 (de) * | 1994-03-01 | 1995-09-08 | Itt Cannon Gmbh | Steckkarte für elektronische datenverarbeitungsgeräte und verfahren zu dessen herstellung und montage |
EP0739064A1 (de) * | 1995-04-21 | 1996-10-23 | Framatome Connectors International | Herstellungsverfahren für modulare Verbindereinheit und für die so erhaltene elektrische Verbindung |
US5613860A (en) * | 1994-12-14 | 1997-03-25 | Molex Incorporated | Universal grounding clip for card-receiving connector |
EP0881869A2 (de) * | 1997-05-30 | 1998-12-02 | Nortel Networks Corporation | Verbesserung einer elektrischen Anlage |
US6083037A (en) * | 1996-10-25 | 2000-07-04 | Schroff Gmbh | Contact element for electrical contact of printed circuit boards to a front module rail of a module support structure |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09164791A (ja) * | 1995-12-19 | 1997-06-24 | Mitsubishi Electric Corp | Icカード及びその製造方法 |
JPH10287068A (ja) * | 1997-04-16 | 1998-10-27 | Mitsubishi Electric Corp | Icカード及びその製造方法 |
US6215674B1 (en) * | 1999-07-08 | 2001-04-10 | Hewlett-Packard Company | Slotted rail mount for circuit boards |
KR100490175B1 (ko) * | 2002-07-04 | 2005-05-17 | 주성엔지니어링(주) | 반도체 제조장치의 컨트롤러 모듈 |
DE10326388A1 (de) * | 2003-01-03 | 2004-07-15 | Rohde & Schwarz Gmbh & Co. Kg | Messgerätmodule und Messgerät |
US6997722B2 (en) * | 2003-03-25 | 2006-02-14 | Elma Electronic Inc. | ESD system for grounding electronics within an enclosure |
CN101296571B (zh) * | 2007-04-25 | 2010-12-08 | 群联电子股份有限公司 | 存储装置制造载具、制造方法及存储装置 |
TWI584276B (zh) * | 2013-09-18 | 2017-05-21 | 樺漢科技股份有限公司 | 接地件及設有該接地件的硬碟機固定裝置 |
CN106817887B (zh) * | 2015-11-30 | 2020-08-18 | 深圳富泰宏精密工业有限公司 | 屏蔽罩、屏蔽罩组件以及应用该屏蔽罩组件的电子装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765575C (de) * | 1971-12-23 | Siemens AG, 1000 Berlin und 8000 Mun chen | Schaltungsplatten Baueinheit | |
EP0429160A2 (de) * | 1989-11-20 | 1991-05-29 | Snk Corporation | Speicherkassette für Fernsehspielgerät |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5330360A (en) * | 1992-08-21 | 1994-07-19 | The Whitaker Corporation | Memory card and connector therefor |
US5483422A (en) * | 1994-09-23 | 1996-01-09 | Hewlett-Packard Company | Keying card guide for PC card |
US5600539A (en) * | 1994-10-11 | 1997-02-04 | At&T Global Information Solutions Company | Secure interface card extractor/ejector mechanism |
US5548483A (en) * | 1995-01-24 | 1996-08-20 | Elco Corporation | Frameless IC card and housing therefor |
-
1993
- 1993-12-08 WO PCT/DE1993/001173 patent/WO1994014306A1/de active IP Right Grant
- 1993-12-08 DE DE59303280T patent/DE59303280C5/de not_active Expired - Fee Related
- 1993-12-08 US US08/454,164 patent/US5867366A/en not_active Expired - Fee Related
- 1993-12-08 EP EP94901739A patent/EP0674828B1/de not_active Expired - Lifetime
- 1993-12-08 AT AT94901739T patent/ATE140582T1/de not_active IP Right Cessation
- 1993-12-08 ES ES94901739T patent/ES2091123T3/es not_active Expired - Lifetime
- 1993-12-08 JP JP6513658A patent/JP2720413B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765575C (de) * | 1971-12-23 | Siemens AG, 1000 Berlin und 8000 Mun chen | Schaltungsplatten Baueinheit | |
EP0429160A2 (de) * | 1989-11-20 | 1991-05-29 | Snk Corporation | Speicherkassette für Fernsehspielgerät |
Non-Patent Citations (5)
Title |
---|
DATAMATION April. 15. 1992 p 55-57 "Tiny PC Cards Pack A Punch" Scott D. Palmer Figuren Seite 55 * |
IBM Technical Disclosure Bulletin, Band 23, No. 5, Oktober 1980, M. I Davis, "SOLID-STATE CARTRIDEGE SYSTEM" * |
Patent Abstracts of Japan, Band 13, Nr 135, P-851, Zusammenfasung von JP, 63-302490 (MITSUBISHI ELECTRIC CORP), * |
Patent Abstracts of Japan, Band 8, Nr 55, P-260, Zusammenfasung von JP, 58-203686 (CANON K.K.), * |
Patent Abstracts of Japan, Band 8, Nr 55, P-260, Zusammenfasung von JP, 58-203687 (CANON K.K.), * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995024020A1 (de) * | 1994-03-01 | 1995-09-08 | Itt Cannon Gmbh | Steckkarte für elektronische datenverarbeitungsgeräte und verfahren zu dessen herstellung und montage |
US5768110A (en) * | 1994-03-01 | 1998-06-16 | Itt Cannon Gmbh | Plug-in card for electronic data processing equipment and a process for its manufacture and assembly |
US5613860A (en) * | 1994-12-14 | 1997-03-25 | Molex Incorporated | Universal grounding clip for card-receiving connector |
EP0739064A1 (de) * | 1995-04-21 | 1996-10-23 | Framatome Connectors International | Herstellungsverfahren für modulare Verbindereinheit und für die so erhaltene elektrische Verbindung |
FR2733363A1 (fr) * | 1995-04-21 | 1996-10-25 | Framatome Connectors France | Procede de realisation d'un element modulaire de connexion electrique et element modulaire de connexion electrique ainsi obtenu |
US5857265A (en) * | 1995-04-21 | 1999-01-12 | Framatome Connectors International | Process for producing of a modular electrical connection element and modular electrical connection element thus obtained |
US6083037A (en) * | 1996-10-25 | 2000-07-04 | Schroff Gmbh | Contact element for electrical contact of printed circuit boards to a front module rail of a module support structure |
EP0881869A2 (de) * | 1997-05-30 | 1998-12-02 | Nortel Networks Corporation | Verbesserung einer elektrischen Anlage |
EP0881869A3 (de) * | 1997-05-30 | 1998-12-23 | Nortel Networks Corporation | Verbesserung einer elektrischen Anlage |
Also Published As
Publication number | Publication date |
---|---|
JPH07509810A (ja) | 1995-10-26 |
EP0674828A1 (de) | 1995-10-04 |
JP2720413B2 (ja) | 1998-03-04 |
DE59303280D1 (de) | 1996-08-22 |
ES2091123T3 (es) | 1996-10-16 |
EP0674828B1 (de) | 1996-07-17 |
US5867366A (en) | 1999-02-02 |
ATE140582T1 (de) | 1996-08-15 |
DE59303280C5 (de) | 2006-06-29 |
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