WO1985005242A1 - Carte de circuit electriquement conductrice et son procede de production - Google Patents

Carte de circuit electriquement conductrice et son procede de production Download PDF

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Publication number
WO1985005242A1
WO1985005242A1 PCT/JP1985/000235 JP8500235W WO8505242A1 WO 1985005242 A1 WO1985005242 A1 WO 1985005242A1 JP 8500235 W JP8500235 W JP 8500235W WO 8505242 A1 WO8505242 A1 WO 8505242A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin film
circuit board
metal foil
conductive circuit
layer
Prior art date
Application number
PCT/JP1985/000235
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Nishino
Yoshihiro Watanabe
Masaki Ikeda
Masahiro Hiraka
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59086415A external-priority patent/JPS60229390A/ja
Priority claimed from JP59141901A external-priority patent/JPS6120395A/ja
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to KR1019850700351A priority Critical patent/KR900006976B1/ko
Publication of WO1985005242A1 publication Critical patent/WO1985005242A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring

Definitions

  • the present invention relates to a conductive circuit board used for various electronic devices, particularly to a conductive circuit board having a high-precision conductive circuit and withstanding a relatively large current, and a method for manufacturing the same.
  • a typical circuit board that is commercially available is a board that uses X-nor resin and 10-glass epoxy resin-containing epoxy resin. These substrates are disadvantageous in that they have poor heat dissipation.
  • An integrated circuit that incorporates a resistor or power transistor designed to carry a large current generates a large amount of heat. Resistor, transistor
  • Metallic substrates include those coated with epoxy resin and those with a hood layer.
  • the E 0 base plate has high mechanical strength and excellent heat resistance and heat dissipation. Also, because of the electromagnetic shielding effect, it is considered to be effective as a circuit board for high power.
  • a method of forming a circuit using a hood substrate is to form a paste by mixing powders of Au, Ag, Pt, and Cu with a binder, and screen-print the paste. This is a method of forming a circuit by heat treatment. This • Circuits that use high-speed pastes have high electrical resistance and large circuit resistance errors, so circuits that carry large or small currents may cause problems such as circuit heating and malfunction.
  • the hood substrate is used as a high-density, high-precision circuit base.
  • a conductive circuit board according to the present invention includes a substrate having a glassy coating layer on a surface thereof, and a conductive circuit pattern welded to the surface of the glassy layer.
  • a metal plate having a hole covering layer is preferable, but a substrate in which a glassy layer is formed on a ceramic substrate such as aluminum or beryllia may be used. it can.
  • the method of manufacturing the conductive circuit board of the present invention is roughly classified into two methods.
  • One of them is to place a metal foil forming a circuit pattern on the surface of the glass layer of the substrate having the glass layer on the surface, and to soften the glass which forms the glass layer. And fusing the metal foil to the glass layer by heating to a desired temperature.
  • the above heating atmosphere is non-oxidizing when using a metal foil that is easily oxidized such as copper.
  • An active gas atmosphere can be used, but it is convenient to use an atmosphere of one type of gas or a mixture of two or more types selected from the group consisting of nitrogen, argon and hydrogen.
  • Another method of manufacturing a conductive circuit board is to use a glass surface.
  • a conductive circuit pattern supported by a resin film having low heat shrinkage and high flammability is provided on the surface of the glass layer of a substrate having five layers, and the resin film is heated by heating. And a method of softening a glass constituting the glass layer and welding the conductive circuit pattern to the glass layer.
  • one side of a metal foil is coated with the resin film, and then the metal foil is touched to a predetermined circuit pattern. And a method in which one surface of a metal foil is coated with the resin film, and then a metal foil integrated with the resin film is punched into a predetermined circuit pattern.
  • the circuit pattern is not particularly deformed on the substrate, especially in the case of a circuit pattern including a fine portion. O It is advantageous to fix to
  • FIG. 1 is a longitudinal sectional view showing an example of the conductive circuit board of the present invention
  • FIG. 2 is a view showing the manufacturing process thereof
  • FIGS. 3 and 4 are plan views showing examples of the circuit pattern. .
  • FIG. 1 shows a configuration example of a conductive circuit board of the present invention.
  • 1 is a metal substrate 5 and 2 is a vitreous layer covering its surface •.
  • Reference numeral 3 denotes a metal foil welded to the surface of the mouth layer 2 and has a predetermined pattern.
  • FIG. 2 shows a process for obtaining the above-mentioned conductive circuit board.
  • 3a is a metal foil, and 4 is a resin film coated on one side thereof. This tree
  • the oil film 4 has a small deformation due to heat, in particular, a small heat shrinkage, and is highly flammable.
  • a solution obtained by dissolving the resin in an appropriate solvent is applied to the surface of the metal foil 3a, or is adhered to a uniform thickness by screen printing.
  • the metal foil. 3 having a conductive circuit having a predetermined pattern by to edge quenching the metal foil 3 a.
  • the metal foil 3 integrated with the resin film 4 is placed on the hole layer 2, and a heat treatment is performed at a temperature at which the glass constituting the hole layer 2 softens.
  • the metal foil 3 is brought into contact with the mouth layer 2 prior to the heat treatment.
  • the resin film 4 may be brought into contact with the mouth layer 2.
  • the hood layer was formed on both sides of metal plate 1,
  • the method shown in FIG. 2 is particularly advantageous for forming a complicated buttery circuit as shown in FIG.
  • Substrate examples of the metal plate include aluminum plate, aluminum steel plate, low carbon steel plate, steel plate for steel, stainless steel plate, nickel chrome steel plate, nickel chrome steel plate Aluminum steel sheets are used.
  • the glass layer covering the substrate is required to have excellent electrical insulation. Therefore, the glass frit constituting the glassy layer is preferably a low-altitude glass having excellent electric ecstasy.
  • Table 1 shows glass compositions suitable for application to metal plates and glass compositions used in the following examples.
  • Table 2 shows examples of slip compositions for forming the glassy layer. Unlike the slip composition for forming a general glassy layer, an organic solvent is used as a solvent and ethyl cellulose is used as a stabilizer. This is commonly used This is because the addition of clay or sodium nitrite degrades the electrical insulation of the vitreous layer.
  • the organic solvent used for the slip may be, besides benzyl alcohol, isophorone, cyclohexanol, canolebitone, ethyl alcohol, or the like. Further, as a stabilizer, soluble in organic solvents, it is the this using a small amount of thickener for oxidative combustion in 1 5 ⁇ 3 5 o ° c . In order to further enhance the electrical insulation ⁇ vitreous layer, it can be used as the S ⁇ 0 2, A 2 0 3 , MgO, Zr0 2 and mil additive compounds containing these.
  • a vitreous layer (open layer) on a metal substrate
  • the firing temperature is suitably 8O O to 850 ° C, but if the time is short, the temperature can be raised, and if firing for a long time, the temperature can be lowered.
  • the thickness of the mouth opening layer is preferably from 100 to 300 uw from the viewpoint of surface state and electrical insulation.
  • the method of manufacturing the HO mouth substrate by the spray method was described.
  • the glass composition shown in Table 1 was converted into a micro force busel, and the powder was subjected to the electrostatic glazing method and the electrophoretic glazing method.
  • the ceramic used in the present invention is most preferably an aluminum substrate.
  • One side of the aluminum substrate is coated with a glass layer.
  • the glass material used here is different from the glass composition shown in Table 1 above. However, a glass composition that matches the expansion coefficient of lumina must be selected. Table 3 shows suitable glass compositions.
  • the above-mentioned glass frit is synthesized into paste-like ink using an oil agent (Ski Geooil), screen-printed, dried, and fired.
  • the film thickness at this time is preferably set to 50 to 100 oo im.
  • (C) Resin Film The role of the resin film used in the present invention is to fix the metal foil forming the circuit pattern, and after the circuit pattern of the metal foil covered with the resin film is set on the substrate Is removed by firing. Therefore, the resin film used here is highly flammable and has a glassy layer and • Must not adversely affect metal foil.
  • Acrylic resin and vinyl chloride resin are examples. Polyacrylic acid esters and polyacrylic acid esters are used as acrylic resins. A copolymer of butyl chloride and acrylate is also used.
  • These resins have low heat shrinkage and are highly flammable compared to those commonly used as materials for printed circuit boards, such as polyester-polyimide or epoxy resins. Can be formed on a substrate with high accuracy.
  • the above resin is dissolved in a suitable solvent to adjust the viscosity, and coated on a metal foil by spraying or printing, or laminated with a metal foil using a film of these resins.
  • Strips made of simple metals such as copper, aluminum, iron, nickel, chromium, zinc, and the like, or alloys thereof are preferred. If copper is used as an example of a single metal, the rolled copper ribbon is preferred as the electrolytic copper ribbon because of its high cost. In the present invention, even if a rolled ribbon is used, the adhesive strength is much higher than each of the conventional printed circuit boards. Therefore, it is not necessary to use an electrolytic copper ribbon for the purpose of improving the bonding strength. Examples of alloys include SUS 3 O 4, 3 16, 430,
  • the thickness of the rolled ribbon is preferably in the range of 2 O to 2 OO iw, particularly preferably in the range of 20 to ⁇ 2.0 ixm.
  • the rolling thickness exceeds 2 OOiw, the glass layer is easily cracked5 due to the tension and elasticity of the ribbon, and the ribbon is separated. In the following ribbons Workability is worsened.
  • the temperature must be higher than the softening point of the glass frit constituting the vitreous layer.
  • the atmosphere during heating is preferably a non-oxidizing atmosphere.
  • copper foil is heated in air, one or more the degree at 00-200, the surface is oxidized, irregular occurs in the resistor, also Ru poor hung with of the electronic component.
  • an atmosphere having oxygen necessary for removing the resin film by combustion it is needless to say that it is necessary to use an atmosphere having oxygen necessary for removing the resin film by combustion.
  • Stainless steel SUS430 and an aluminum substrate are used as the substrate on which the glass layer is formed. Both the size 1 1 OX 1 1 O mm, a thickness of 0.8 discussions 0
  • the second table of the scan Li Tsu urchin by the thickness of the flop is about 1 5 O ⁇ , and SPRAY on both sides, after drying 8 2 O ° C 1
  • a ⁇ substrate was obtained.
  • the glass shown in Table 3 was pasted into a paste shape using a squid geo-oil, applied by screen printing so that the film thickness became approximately SOiW, and dried. Thereafter, it was baked at SOO ° C for 1 O minute.
  • the copper foil pattern coated with acrylic resin is in close contact with the glassy layer), there is no unburned resin, the oxide film is large on the surface of the copper foil, and the glass There was no abnormality in the stratum.
  • the polyester film and the polyimide film of the comparative examples a part of the copper foil did not adhere to the glass layer, and the copper foil and the glass layer surface did not adhere. Unburned material remains] 5, cracks were found in the glassy layer.
  • Example 1 to form a glass electrolyte layer stainless steel SUS 4 3 ⁇
  • an electric furnace by placing the same accession Li Le resins coated copper foil pattern as that used in this Example 1 Then, while flowing the same nitrogen-hydrogen mixed gas as in Example 1 , each was heated at 80 ° C., 7 ° C., 20 ° C., 4 ° C., and 760 ° C. for 1 hour each. Bake for O minutes.
  • the vitreous layer and the copper foil are bonded and ⁇ Cured at 720 ° C, T4O ° C, and 760 ° C, the copper foil was welded to the glassy layer, and especially baked at 760 ° C had good adhesion. It was stronger than others.
  • the resin-coated pattern was placed on the substrate having the glass layer, and the slips shown in Table 2 were applied thereon as a protective layer. Firing was performed at a temperature of 80 ° C. in an electric furnace through which nitrogen gas was passed.
  • the solution of the acrylic resin used in Example 1 was screen-printed on 5 O ⁇ -thick rolled copper foil, dried with, and then etched. Formed.
  • Example 1 E - is placed in the mouth substrate, in an electric furnace that was circulated a mixed gas of nitrogen and hydrogen in the same manner as in Example 1, at SOO It was baked at a temperature for 5 minutes to obtain an electronic camera hood circuit board.
  • This circuit board has extremely stable circuit resistance.] 9 In addition, no circuit errors occurred for large currents or small currents.
  • the present invention it is possible to obtain a high-precision, high-density circuit board that is excellent in heat dissipation and strength, withstands a very small current, and can withstand a large current.
  • the use of a metal substrate has a shield effect against electric and magnetic fields. Therefore, it is useful for various electronic devices including electronic cameras.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

Carte de circuit électriquement conductrice dans laquelle une feuille métallique formant un modèle de circuit est fondue sur une couche vitreuse qui couvre la carte de manière à y adhérer. Est également décrit un procédé de production d'une carte de circuit électriquement conductrice, dans laquelle une feuille métallique formant un modèle de circuit et un film de résine combustible sur lequel repose la feuille métallique sont placés sur la couche vitreuse, le film de résine étant ensuite éliminé par combustion, la feuille métallique adhérant par fusion sur la couche vitreuse. Comparée aux produits conventionnels qui utilisent une carte de résine, la carte de circuit ci-décrite présente d'excellentes caractéristiques de dissipation thermique et de résistance, ainsi qu'une augmentation de la précision et de la densité.
PCT/JP1985/000235 1984-04-27 1985-04-25 Carte de circuit electriquement conductrice et son procede de production WO1985005242A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019850700351A KR900006976B1 (ko) 1984-04-27 1985-04-25 도전회로기판 및 그 제조법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP59/86415 1984-04-27
JP59086415A JPS60229390A (ja) 1984-04-27 1984-04-27 ホ−ロ回路基板の製造法
JP59/141901 1984-07-09
JP59141901A JPS6120395A (ja) 1984-07-09 1984-07-09 ホ−ロ回路基板の製造法

Publications (1)

Publication Number Publication Date
WO1985005242A1 true WO1985005242A1 (fr) 1985-11-21

Family

ID=26427544

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1985/000235 WO1985005242A1 (fr) 1984-04-27 1985-04-25 Carte de circuit electriquement conductrice et son procede de production

Country Status (2)

Country Link
KR (1) KR900006976B1 (fr)
WO (1) WO1985005242A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561798B2 (fr) * 1974-07-18 1981-01-16
JPS57109392A (en) * 1980-12-26 1982-07-07 Suwa Seikosha Kk Circuit mounting substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561798B2 (fr) * 1974-07-18 1981-01-16
JPS57109392A (en) * 1980-12-26 1982-07-07 Suwa Seikosha Kk Circuit mounting substrate

Also Published As

Publication number Publication date
KR900006976B1 (ko) 1990-09-25
KR860700085A (ko) 1986-01-31

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