US9865646B2 - Flexible LED display - Google Patents

Flexible LED display Download PDF

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US9865646B2
US9865646B2 US15/210,786 US201615210786A US9865646B2 US 9865646 B2 US9865646 B2 US 9865646B2 US 201615210786 A US201615210786 A US 201615210786A US 9865646 B2 US9865646 B2 US 9865646B2
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flexible
led
wire
column
conductive
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US20170092691A1 (en
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Hui-Lan Tso
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Cheng-Chang Transflex Display Corp
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Cheng-Chang Transflex Display Corp
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Priority claimed from TW104215650U external-priority patent/TWM516776U/zh
Priority claimed from TW104132015A external-priority patent/TWI585943B/zh
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Assigned to Cheng-Chang TransFlex Display Corp. reassignment Cheng-Chang TransFlex Display Corp. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSO, HUI-LAN
Assigned to Cheng-Chang TransFlex Display Corp. reassignment Cheng-Chang TransFlex Display Corp. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S COUNTRY PREVIOUSLY RECORDED ON REEL 039162 FRAME 0521. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT COUNTRY OF ASSIGNEE SHOULD BE TAIWAN I/O SYRIAN ARAB REPUBLIC. Assignors: TSO, HUI-LAN
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5221—Crossover interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53276—Conductive materials containing carbon, e.g. fullerenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • the present invention relates to a matrix display, and in particular relates to a flexible LED display.
  • a flexible display made of plastic and having light weight and anti-shock properties have been developed.
  • the portability can be maximized by folding or rolling up the flexible display.
  • this flexible display can be used in many fields such as electronic billboards, window banners, exhibition bulletin boards, and so on.
  • a conventional flexible display comprises a display device formed on a flexible substrate, wherein various display device can be chosen, such as OLED, LCD or EPD.
  • the displays mentioned above usually comprise thin film transistors, so lots of thin film processes are necessary to form thin film transistors on a flexible substrate to generate a flexible display device.
  • the flexible substrate having a thickness of about tens nm is too thin to proceed various thin film processes.
  • a new method of manufacturing a flexible display was provided, wherein a flexible substrate was formed on a glass substrate in advance, then a display device was formed on the flexible substrate adhered on the glass substrate, then the flexible substrate and the glass substrate was separated.
  • the thermal expansion coefficients (CTE) of flexible substrate made of plastic materials and the glass substrate are different.
  • the flexible substrate and the glass substrate can be easily separated or bending during high temperature process when the bonding force therebetween is weak and results in serious defects.
  • the conventional single-layered or double-layered flexible LED display is restricted in the wiring design, so the single color (two conductive pad) LEDs are chosen instead of full color LEDs for full color display. Accordingly, the applications of LED displays are still not popular.
  • This present invention provides a flexible LED display by utilizing flexible wirings and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on the transparent flexible substrate. Furthermore, this present invention provide a flexible LED display which characterizes in separating the wirings crossing over with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.
  • An aspect of this present invention provides a flexible LED display, comprising: a transparent flexible substrate having a top surface and a bottom surface opposite to each other; 3M columns of first flexible wirings and N rows of second flexible wirings formed on the top surface of the flexible substrate, whereby the first flexible wirings and the second flexible wirings cross over with each other to define M*N pixels, and each pixel is addressed by the (i), (i+1) and (i+2) columns of the first flexible wirings and the (j) row of the second flexible wiring, wherein M, N, i, j are natural numbers, and 1 ⁇ i ⁇ 3M ⁇ 2, 1 ⁇ j ⁇ N; an insulating layer sandwiched between the intersections of each first flexible wiring and each second flexible wiring or overlaid each second flexible wiring; a plurality of LED packages mounted within each of the pixels; a first fan-shaped circuit connected to the first flexible wirings; a second fan-shaped circuit connected to the second flexible wirings; and a driving circuit respectively interconnecting the first fan-shaped circuit and the second fan-shaped circuit.
  • the transparent flexible substrate is selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof.
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • first flexible wires and the second flexible wires are selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • PEDOT poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid
  • each of the LED packages is designed to emit red, green, blue emission spectrum and mixture thereof.
  • each of the LED packages comprises a plurality of LED units designed to respectively emit red, green or blue emission spectrum.
  • each of the LED packages comprises three LED units designed to respectively emit red, green or blue emission spectrum.
  • each of the LED packages is mounted within each of the pixels by means of a conductive glue cured at a temperature lower than 250 degree C. and/or an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the insulating layer is consisted of a single-layered or multiple-layered insulating material.
  • each of the LED packages comprises a first conductive pin, a second conductive pin, a third conductive pin and a fourth conductive pin
  • the (j) row of the second flexible wire has a first extension part connected to a first conductive pad
  • the (i) column of the first flexible wire has a second extension part connected to a second conductive pad
  • the (i+1) column of the first flexible wire has a fourth extension part connected to a fourth conductive pad
  • the (i+2) column of the first flexible wire has a third extension part connected to a third conductive pad
  • the first conductive pin is electrically connected to the (j) row of the second flexible wire by interconnecting the first conductive pad
  • the second conductive pin is electrically connected to the (i) column of the first flexible wire by interconnecting the second conductive pad
  • the fourth conductive pin is electrically connected to the (i+1) column of the first flexible wire by interconnecting the fourth conductive pad
  • the third conductive pin is electrically connected
  • the driving circuit further comprising a driver IC.
  • Another aspect of the LED display as mentioned above further comprising a dielectric layer sandwiched between the intersection of third extension part of the (i+2) column of the first flexible wire and the (i+1) column of the first flexible wire.
  • the dielectric layer is consisted of a single-layered or multiple-layered insulating material.
  • Another aspect of this invention provides another LED display, comprising: a transparent flexible substrate having a top surface and a bottom surface opposite to each other; 3P columns of first flexible wirings and Q rows of second flexible wirings formed on the top surface of the flexible substrate, whereby the first flexible wirings and the second flexible wirings cross over with each other to define P*Q pixels, and each pixel comprising: a first sub-pixel, addressed by the (r) column of the first flexible wirings and the (s) row of the second flexible wiring; a second sub-pixel, addressed by the (r+1) column of the first flexible wirings and the (s) row of the second flexible wiring; a third sub-pixel, addressed by the (r+2) column of the first flexible wirings and the (s) row of the second flexible wiring; wherein P, Q, r, s are natural numbers, and 1 ⁇ r ⁇ 3P ⁇ 2, 1 ⁇ s ⁇ Q; an insulating layer sandwiched between the intersections of each first flexible wiring and each second flexible wiring or overlaid each second flexible wiring; a plurality
  • the transparent flexible substrate is selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof.
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • first flexible wires and the second flexible wires are selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • PEDOT poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid
  • the first LED packages are red LED packages or red LED flip-chips.
  • the second LED packages are green LED packages or green LED flip-chips.
  • LED packages are blue LED packages or blue LED flip-chips.
  • each of the first, second, third LED packages is respectively mounted within each of the first-subpixels, each of the second sub-pixels and each of the third sub-pixels by means of a conductive glue cured at a temperature lower than 250 degree C. and/or an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the insulating layer is consisted of a single-layered or multiple-layered insulating material.
  • each of the first LED packages comprises a fifth conductive pin and a sixth conductive pin
  • the (s) row of the second flexible wire has a fifth extension part connected to a fifth conductive pad
  • the (r) column of the first flexible wire has a sixth extension part connected to a sixth conductive pad
  • the fifth conductive pin is electrically connected to the (s) row of the second flexible wire by interconnecting the fifth conductive pad
  • the sixth conductive pin is electrically connected to the (r) column of the first flexible wire by interconnecting the sixth conductive pad
  • each of the second LED packages comprises a seventh conductive pin and a eighth conductive pin
  • the (s) row of the second flexible wire has a seventh extension part connected to a seventh conductive pad
  • the (r+1) column of the first flexible wire has an eighth extension part connected to an eighth conductive pad
  • the seventh conductive pin is electrically connected to the (s) row of the second flexible wire by interconnecting the seventh conductive pad
  • the driving circuit further comprising a driver IC.
  • Another aspect of this invention provides another LED display, comprising: a transparent flexible substrate having a top surface and a bottom surface opposite to each other; 2A columns of first flexible wirings and 2B rows of second flexible wirings formed on the top surface of the flexible substrate, whereby the first flexible wirings and the second flexible wirings cross over with each other to define A*B pixels, and each pixel comprising: a first sub-pixel, addressed by the (d) column of the first flexible wirings and the (e) row of the second flexible wiring; a second sub-pixel, addressed by the (d+1) column of the first flexible wirings and the (e) row of the second flexible wiring; a third sub-pixel, addressed by the (d) column of the first flexible wirings and the (e+1) row of the second flexible wiring; a fourth sub-pixel, addressed by the (d+1) column of the first flexible wirings and the (e+1) row of the second flexible wiring; wherein A, B, d, e are natural numbers, and 1 ⁇ d ⁇ 2A ⁇ 1, 1 ⁇ e ⁇ 2B
  • the transparent flexible substrate is selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof.
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • first flexible wires and the second flexible wires are selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • PEDOT poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid
  • the first LED packages are red LED packages or red LED flip-chips.
  • the second LED packages are green LED packages or green LED flip-chips.
  • LED packages are blue LED packages or blue LED flip-chips.
  • LED packages are yellow LED packages or yellow LED flip-chips.
  • LED packages are white LED packages or white LED flip-chips.
  • each of the first, second, third LED and fourth packages is respectively mounted within each of the first-subpixels, each of the second sub-pixels, each of the third sub-pixels and each of the fourth sub-pixels by means of a conductive glue cured at a temperature lower than 250 degree C. and/or an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the insulating layer is consisted of a single-layered or multiple-layered insulating material.
  • each of the first LED packages comprises a fifth conductive pin and a sixth conductive pin
  • the (e) row of the second flexible wire has a fifth extension part connected to a fifth conductive pad
  • the (d) column of the first flexible wire has a sixth extension part connected to a sixth conductive pad
  • the fifth conductive pin is electrically connected to the (e) row of the second flexible wire by interconnecting the fifth conductive pad
  • the sixth conductive pin is electrically connected to the (d) column of the first flexible wire by interconnecting the sixth conductive pad
  • each of the second LED packages comprises a seventh conductive pin and a eighth conductive pin
  • the (e) row of the second flexible wire has a seventh extension part connected to a seventh conductive pad
  • the (d+1) column of the first flexible wire has an eighth extension part connected to an eighth conductive pad
  • the seventh conductive pin is electrically connected to the (e) row of the second flexible wire by interconnecting the seventh conductive pad
  • the driving circuit further comprising a driver IC.
  • FIG. 1A illustrates the top-view of the flexible LED display according to the embodiment 1.
  • FIGS. 1B ⁇ 1 C illustrate the enlarged views of one of the pixels 150 as shown in FIG. 1A .
  • FIG. 1A ′ illustrates the top-view of the flexible LED display according to the embodiment 2.
  • FIGS. 1B ′ ⁇ 1 C′ illustrate the enlarged views of one of the pixels 150 ′ as shown in FIG. 1A ′.
  • FIG. 2A illustrates the top-view of the flexible LED display according to the embodiment 3.
  • FIGS. 2B ⁇ 2 C illustrate the enlarged views of one of the pixels 250 as shown in FIG. 2A .
  • FIG. 3A illustrates the top-view of the flexible LED display according to the embodiment 4.
  • FIGS. 3B ⁇ 3 C illustrate the enlarged views of one of the pixels 350 as shown in FIG. 3A .
  • the LED display 100 comprises a transparent flexible substrate 110 having a top surface 110 A and a bottom surface opposite to each other, which can be selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • the transparent flexible substrate 110 of this embodiment is consisted of PET.
  • first flexible wires 120 A There are M columns of first flexible wires 120 A, M columns of the first flexible wires 120 B, and M columns of the first flexible wires 120 C alternatively formed in parallel on the top surface 110 A of the transparent flexible substrate 110 , and N rows of second flexible wires 130 formed on the top surface 110 A of the transparent flexible substrate 110 and cross over with the first flexible wires 120 A, 120 B and 120 C to define M*N pixels 150 , wherein M and N are both natural numbers.
  • first flexible wires 120 A, 120 B and 120 C are electrically connected to the flexible print circuit board (FPC) 180 via the first fan-shaped circuit 140 A to interconnect the driving circuit (not shown) on the driver IC units and control circuit units 190
  • second flexible wires 130 are electrically connected to the flexible print circuit board (FPC) 180 via the second fan-shaped circuit 140 B to interconnect the driving circuit (not shown) having driver ICs and control units on the control board 190 .
  • the first flexible wires 120 A, 120 B and 120 C, and the second flexible wires 130 can be selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • the first flexible wires 120 A, 120 B and 120 C, and the second flexible wires 130 of this embodiment are consisted of carbon nanotube.
  • FIGS. 1B and 1C illustrate the enlarged views of one of the pixels 150 as shown in FIG. 1A .
  • the pixel 150 is addressed by the (i), (i+1) and (i+2) columns of the first flexible wires 120 A, 120 B and 120 C, and the (j) row of the second flexible wiring 130 , wherein the (i) column of the first flexible wire 120 A is depicted on the left side of each LED package 160 , the (i+2) column of the first flexible wire 120 C is depicted on the right side of each LED package 160 , and the (i+1) column of the first flexible wire 120 B is depicted under each LED package 160 .
  • a LED package 160 emitting red, green, blue light or mixture thereof is mounted within the pixel 150 , wherein i and j are both natural numbers, and 1 ⁇ i ⁇ 3M ⁇ 2, 1 ⁇ j ⁇ N.
  • an insulating layer 125 is sandwiched between the intersections of the first flexible wires 120 A, 120 B, 120 C and the second flexible wire 130 .
  • the insulating layer 125 can be a single-layered or a double-layered insulating material (not shown) to avoid disconnection owing to the height gap of the first flexible wires 120 A, 120 B, 120 C across each of the second flexible wires 130 .
  • the insulating layer 125 can also overall overlay each of the second flexible wires 130 in other embodiments of this invention (not shown).
  • Each of the LED packages 160 comprises a plurality of LED units (not shown) designed to respectively emit red, green, or blue emission spectrum.
  • the LED units of this embodiment are LED chips respectively emitting red, green or blue emission.
  • the non-emitting bottom side (not shown) of each LED package 160 comprises a first conductive pin 160 A, a second conductive pin 160 B, a third conductive pin 160 C and a fourth conductive pin 160 D.
  • LED units emits suitable visible emission spectrum other than red, green and blue emission spectrums can also be selected as the LED units of the LED package 160 .
  • the arrangement of these LED units inside the LED package 160 can be adjusted as needed.
  • the (j) row of the second flexible wire 130 has a first extension part 131 connected to a first conductive pad 145 A
  • the (i) column of the first flexible wire 120 A has a second extension part 120 A 1 connected to a second conductive pad 145 B
  • the (i+1) column of the first flexible wire 120 B has a fourth extension part 120 B 1 connected to a fourth conductive pad 145 D
  • the (i+2) column of the first flexible wire 120 C has a third extension part 120 C 1 connected to a third conductive pad 145 C
  • the first conductive pin 160 A of the LED package 160 is electrically connected to the (j) row of the second flexible wire 130 by interconnecting the first conductive pad 145 A by means of the conductive glue 155 cured at a temperature lower than 250 degree C.
  • the second conductive pin 160 B of the LED package 160 is electrically connected to the (i) column of the first flexible wire 120 A by interconnecting the second conductive pad 145 B by means
  • a flexible LED display with a high density array can be easily manufactured by forming flexible wires on a transparent flexible substrate and mounting each of full color LED packages within each of pixels defined by the flexible wires.
  • the LED display 100 ′ comprises a transparent flexible substrate 110 having a top surface 110 A and a bottom surface 110 B opposite to each other, which can be selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • the transparent flexible substrate 110 of this embodiment is consisted of PET.
  • first flexible wires 120 A There are M columns of first flexible wires 120 A, M columns of the first flexible wires 120 B, and M columns of the first flexible wires 120 C alternatively formed in parallel on the top surface 110 A of the transparent flexible substrate 110 , and N rows of second flexible wires 130 formed on the top surface 110 A of the transparent flexible substrate 110 and cross over with the first flexible wires 120 A, 120 B and 120 C to define M*N pixels 150 , wherein M and N are both natural numbers.
  • first flexible wires 120 A, 120 B and 120 C are electrically connected to the flexible print circuit board (FPC) 180 via the first fan-shaped circuit 140 A to interconnect the driving circuit (not shown) on the driver IC units and control circuit units 190
  • second flexible wires 130 are electrically connected to the flexible print circuit board (FPC) 180 via the second fan-shaped circuit 140 B to interconnect the driving circuit (not shown) having driver ICs and control units on the control board 190 .
  • the first flexible wires 120 A, 120 B and 120 C, and the second flexible wires 130 can be selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • the first flexible wires 120 A, 120 B and 120 C, and the second flexible wires 130 of this embodiment are consisted of carbon nanotube.
  • FIGS. 1B ′ and 1 C′ illustrate the enlarged views of one of the pixels 150 as shown in FIG. 1A ′.
  • the pixel 150 is addressed by the (i), (i+1) and (i+2) columns of the first flexible wires 120 A, 120 B and 120 C, and the (j) row of the second flexible wiring 130 , wherein the (i) column of the first flexible wire 120 A is depicted on the left side of each LED package 160 , the (i+1) and (i+2) columns of the first flexible wire 120 B and 120 C are depicted on the right side of each LED package 160 .
  • a LED package 160 emitting red, green, blue light or mixture thereof is mounted within each pixel 150 , wherein i and j are both natural numbers, and 1 ⁇ i ⁇ 3M ⁇ 2, 1 ⁇ j ⁇ N. Besides, an insulating layer 125 is formed to overall overlay each of the second flexible wires 130 .
  • the first flexible wire 120 B of embodiment 2 is depicted on the right side of the LED package 160 instead of depicting under the LED package 160 as that of embodiment 1.
  • the insulating layer 125 ′ of this embodiment is a double-layered structure including a first insulating layer 125 A and a second insulating layer 125 B formed on the first insulating layer 125 A, and the vertical projection area of the second insulating layer 125 B is smaller than that of the first insulating layer 125 A.
  • the insulating layer 125 ′ can also be a single-layered structure (not shown) or sandwiched between the intersections of the first flexible wires 120 A, 120 B, 120 C and the second flexible wires 130 in other embodiments of this invention.
  • Each of the LED packages 160 comprises various LED units (not shown) designed to respectively emit red, green, or blue emission spectrum.
  • the LED units of this embodiment are LED chips respectively emitting red, green or blue emission.
  • the non-emitting bottom side (not shown) of each LED package 160 comprises a first conductive pin 160 A, a second conductive pin 160 B, a third conductive pin 160 C and a fourth conductive pin 160 D.
  • LED units emits suitable visible emission spectrum other than red, green and blue emission spectrums can also be selected as the LED units of the LED package 160 .
  • the arrangement of these LED units inside the LED package 160 can be adjusted as needed.
  • the (j) row of the second flexible wire 130 has a first extension part 131 connected to a first conductive pad 145 A
  • the (i) column of the first flexible wire 120 A has a second extension part 120 A 1 connected to a second conductive pad 145 B
  • the (i+1) column of the first flexible wire 120 B has a fourth extension part 120 B 1 connected to a fourth conductive pad 145 D
  • the (i+2) column of the first flexible wire 120 C has a third extension part 120 C 1 connected to a third conductive pad 145 C
  • the first conductive pin 160 A of the LED package 160 is electrically connected to the (j) row of the second flexible wire 130 by interconnecting the first conductive pad 145 A by means of the conductive glue 155 cured at a temperature lower than 250 degree C.
  • the second conductive pin 160 B of the LED package 160 is electrically connected to the (i) column of the first flexible wire 120 A by interconnecting the second conductive pad 145
  • the conductive glue 155 can also be used together with the anisotropic conductive film (ACF) or replaced with the anisotropic conductive film (ACF) in other embodiments of this invention.
  • a dielectric layer 126 is sandwiched between the intersection of the third extension part 120 C 1 of the first flexible wire 120 C and the first flexible wire 120 B, wherein the dielectric layer 126 of this embodiment is a double-layered structure including a first dielectric layer 126 A and a second dielectric layer 126 B, and the vertical projection area of the second dielectric layer 126 B is smaller than that of the first dielectric layer 126 A.
  • the dielectric layer 126 of other embodiments of this invention can also be a single-layered structure.
  • the conductive glue 255 can also be used together with an anisotropic conductive film (ACF) (not shown) or replaced with the anisotropic conductive film (ACF) (not shown) in other embodiments of this invention.
  • a flexible LED display with a high density array of this embodiment 2 can be easily manufactured by forming flexible wires on a transparent flexible substrate and mounting each of full color LED packages in each of pixels defined by the flexible wires.
  • the LED display 200 comprises a transparent flexible substrate 210 having a top surface 210 A and a bottom surface 210 B opposite to each other, which can be selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • the transparent flexible substrate 210 of this embodiment is consisted of PET.
  • first flexible wires 220 A There are P columns of first flexible wires 220 A, P columns of the first flexible wires 220 B, and P columns of the first flexible wires 220 C alternatively formed in parallel on the top surface 210 A of the transparent flexible substrate 210 , and Q rows of second flexible wires 230 formed on the top surface 210 A of the transparent flexible substrate 210 and cross over with the first flexible wires 220 A, 220 B and 220 C to define P*Q pixels 250 , wherein P and Q are both natural numbers.
  • first flexible wires 220 A, 220 B and 220 C are electrically connected to the flexible print circuit board (FPC) 280 via the first fan-shaped circuit 240 A to interconnect the driving circuit (not shown) on the driver IC units and control circuit units 290
  • second flexible wires 230 are electrically connected to the flexible print circuit board (FPC) 280 via the second fan-shaped circuit 240 B to interconnect the driving circuit (not shown) having driver ICs and control units on the control board 290 .
  • the first flexible wires 220 A, 220 B and 220 C, and the second flexible wires 230 can be selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • the first flexible wires 220 A, 220 B and 220 C, and the second flexible wires 230 of this embodiment are consisted of carbon nanotube.
  • each pixel 250 includes a first sub-pixel 250 A addressed by the (r) column of the first flexible wires 220 A and the (s) row of the second flexible wiring 230 ; a second sub-pixel 250 B addressed by the (r+1) column of the first flexible wires 220 B and the (s) row of the second flexible wiring 230 ; and a third sub-pixel 250 C addressed by the (r+2) column of the first flexible wires 220 C and the (s) row of the second flexible wiring 230 , whereby r, s are both natural numbers, and 1 ⁇ r ⁇ 3P ⁇ 2, 1 ⁇ s ⁇ Q.
  • each of the second flexible wires 230 is overlaid by an insulating layer 225 to insulate the first flexible wires 220 A, 220 B and 220 C.
  • the insulating layer 225 is a double-layered structure including a first insulating layer 225 A and a second insulating layer 225 B formed on the first insulating layer 225 B, and the vertical projection area of the second insulating layer 225 B is smaller than that of the first insulating layer 225 A.
  • the insulating layer 225 of other embodiments of this invention can also be a single-layered structure (not shown) or sandwiched between the intersections (not shown) of the first flexible wires 220 A, 220 B, 220 C and the second flexible wires 230 .
  • a plurality of first LEDs 260 A are provided and mounted within each first sub-pixel 250 A, whereby each of the first LEDs 260 A has a fifth conductive pin 260 A 1 and a sixth conductive pin 260 A 2 on its non-emitting side (not shown).
  • a plurality of second LEDs 260 B are provided and mounted within each second sub-pixel 250 B, whereby each of the second LEDs 260 B has a seventh conductive pin 260 B 1 and a eighth conductive pin 260 B 2 on its non-emitting side (not shown).
  • a plurality of third LEDs 260 C are provided and mounted within each third sub-pixel 250 C, whereby each of the third LEDs 260 C has a ninth conductive pin 260 C 1 and a tenth conductive pin 260 C 2 on its non-emitting side (not shown).
  • the first LEDs 260 A of this embodiment are red LED packages; the second LEDs 260 B of this embodiment are green LED packages; and the third LEDs 260 C of this embodiment are blue LED packages.
  • the first LEDs 260 A, the second LEDs 260 B and the third LEDs 260 C of other embodiments of this invention can be selected from LED packages emitting visible spectrum other than red, green and blue emission spectrum, and the arrangement of these LED packages can be adjusted as needed.
  • the first LEDs 260 A, the second LEDs 260 B and the third LEDs 260 C can also be replaced with red LED flip chips, green LED flip chips and blue LED flip chips, and the arrangement of these LED flip chips can also be adjusted as needed.
  • the (s) row of the second flexible wire 230 has a fifth extension part 230 A 1 connected to a fifth conductive pad 245 R 1
  • the (r) column of the first flexible wire 220 A has a sixth extension part 220 A 1 connected to a sixth conductive pad 245 R 2
  • the fifth conductive pin 260 A 1 of the first LED 260 A is electrically connected to the (s) row of the second flexible wire 230 A by interconnecting the fifth conductive pad 245 R 1 by means of a conductive glue 255 cured at a temperature lower than 250 degree C.
  • the sixth conductive pin 260 A 2 is electrically connected to the (r) column of the first flexible wire 220 A by interconnecting the sixth conductive pad 245 R 2 by means of a conductive glue 255 cured at a temperature lower than 250 degree C.
  • the (s) row of the second flexible wire 230 has a seventh extension part 230 A 2 connected to a seventh conductive pad 245
  • a flexible LED display with a high density array of this embodiment 3 can be easily manufactured by forming flexible wires on a transparent flexible substrate and mounting each of red, green and blue LED packages or flip chips in each of pixels defined by the flexible wires.
  • the LED display 300 comprises a transparent flexible substrate 310 having a top surface 310 A and a bottom surface 310 B opposite to each other, which can be selected from one of the group consisting of Polyethylene terephthalate (PET), Poly(methyl methacrylate (PMMA), Polyimide (PI), Polycarbonate (PC) and glass or combination thereof
  • PET Polyethylene terephthalate
  • PMMA Poly(methyl methacrylate
  • PI Polyimide
  • PC Polycarbonate
  • the transparent flexible substrate 310 of this embodiment is consisted of PET.
  • first flexible wires 320 A and 320 B are electrically connected to the flexible print circuit board (FPC) 380 via the first fan-shaped circuit 340 A to interconnect the driving circuit (not shown) on the driver IC units and control circuit units 390
  • second flexible wires 330 A and 330 B are electrically connected to the flexible print circuit board (FPC) 380 via the second fan-shaped circuit 340 B to interconnect the driving circuit (not shown) having driver ICs and control units on the control board 390 .
  • the first flexible wires 320 A and 320 B, and the second flexible wires 330 A and 330 B can be selected from one of the group consisting of gold wire, silver wire, silver slurry, copper wire, carbon nanotube, poly-(3,4-ethylenedioxy thiophene)-polystyrene sulfonic acid (PEDOT) and nano silver or combination thereof.
  • the first flexible wires 320 A and 320 B, and the second flexible wires 330 A and 330 B of this embodiment are consisted of carbon nanotube.
  • each pixel 350 includes a first sub-pixel 350 A addressed by the (d) column of the first flexible wires 320 A and the (e) row of the second flexible wiring 330 A; a second sub-pixel 350 B addressed by the (d+1) column of the first flexible wires 320 B and the (e) row of the second flexible wiring 330 A; and a third sub-pixel 350 C addressed by the (d) column of the first flexible wires 320 A and the (e+1) row of the second flexible wiring 330 B; and a fourth sub-pixel 350 D addressed by the (d+1) column of the first flexible wires 320 B and the (e+1) row of the second flexible wiring 330 B, whereby d and e are both natural numbers, and 1 ⁇ d ⁇ 2A ⁇ 1, 1 ⁇ e ⁇ 2B ⁇ 1.
  • Each of the second flexible wires 330 A and 330 B is overlaid by an insulating layer 325 to insulate the first flexible wires 320 A and 320 B.
  • the insulating layer 325 is a double-layered structure including a first insulating layer 325 A and a second insulating layer 325 B formed on the first insulating layer 325 B, and the vertical projection area of the second insulating layer 325 B is smaller than that of the first insulating layer 325 A.
  • the insulating layer 325 of other embodiments of this invention can also be a single-layered structure (not shown) or sandwiched between the intersections (not shown) of the first flexible wires 320 A and 320 B and the second flexible wires 330 A and 330 B.
  • a plurality of first LEDs 360 A are provided and mounted within each first sub-pixel 350 A, whereby each of the first LEDs 360 A having a fifth conductive pin 360 A 1 and a sixth conductive pin 360 A 2 on its non-emitting side (not shown).
  • a plurality of second LEDs 360 B are provided and mounted within each second sub-pixel 350 B, whereby each of the second LEDs 360 B having a seventh conductive pin 360 B 1 and a eighth conductive pin 360 B 2 on its non-emitting side (not shown).
  • a plurality of third LEDs 360 C are provided and mounted within each third sub-pixel 350 C, whereby each of the third LEDs 360 C having a ninth conductive pin 360 C 1 and a tenth conductive pin 360 C 2 on its non-emitting side (not shown).
  • a plurality of fourth LEDs 360 D are provided and mounted within each fourth sub-pixel 350 D, whereby each of the fourth LEDs 360 D having a eleventh conductive pin 360 D 1 and a twelfth conductive pin 360 D 2 on its non-emitting side (not shown).
  • the first LEDs 360 A of this embodiment are red LED packages; the second LEDs 360 B of this embodiment are green LED packages; the third LEDs 360 C of this embodiment are blue LED packages; and the fourth LEDs 360 D of this embodiment are yellow or white LED packages.
  • the first LEDs 360 A, the second LEDs 360 B, the third LEDs 360 C and the fourth LEDs 360 D of other embodiments of this invention can be selected from LED packages emitting visible spectrum other than red, green, blue, yellow and white emission spectrum, and the arrangement of these LED packages can be adjusted as needed.
  • first LEDs 360 A, the second LEDs 360 B, the third LEDs 360 C and the fourth LEDs 360 D can also be replaced with red LED flip chips, green LED flip chips, blue LED flip chips and yellow or white LED flip chips, and the arrangement of these LED flip chips can also be adjusted as needed.
  • the (e) row of the second flexible wire 330 A has a fifth extension part 330 A 1 connected to a fifth conductive pad 345 R 1
  • the (d) column of the first flexible wire 320 A has a sixth extension part 320 A 1 connected to a sixth conductive pad 345 R 2
  • the fifth conductive pin 360 A 1 of the first LED 360 A is electrically connected to the (e) row of the second flexible wire 330 A by interconnecting the fifth conductive pad 345 R 1 by means of a conductive glue 355 cured at a temperature lower than 250 degree C.
  • the sixth conductive pin 360 A 2 is electrically connected to the (d) column of the first flexible wire 320 A by interconnecting the sixth conductive pad 345 R 2 by means of a conductive glue 355 cured at a temperature lower than 250 degree C.
  • the (e) row of the second flexible wire 230 has a seventh extension part 330 A 2 connected to a seventh conductive pad 345 G 1
  • a flexible LED display with a high density array of this embodiment 4 can be easily manufactured by forming flexible wires on a transparent flexible substrate and mounting each of red, green, blue and yellow or white LED packages or flip chips in each of pixels defined by the flexible wires.
  • this present invention provides a flexible LED display by utilizing flexible wirings and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on the transparent flexible substrate.

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CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN109103176A (zh) * 2018-08-10 2018-12-28 深圳市晶泓科技有限公司 一种led发光组件、led发光面板以及led显示屏
KR102591777B1 (ko) * 2018-09-21 2023-10-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN111261659A (zh) * 2020-03-11 2020-06-09 深圳市思坦科技有限公司 一种发动机顶盖led显示屏及制备方法
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