US5130783A - Flexible film semiconductor package - Google Patents
Flexible film semiconductor package Download PDFInfo
- Publication number
- US5130783A US5130783A US07/664,170 US66417091A US5130783A US 5130783 A US5130783 A US 5130783A US 66417091 A US66417091 A US 66417091A US 5130783 A US5130783 A US 5130783A
- Authority
- US
- United States
- Prior art keywords
- thin film
- leads
- semiconductor device
- film package
- package according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 239000010409 thin film Substances 0.000 claims abstract description 47
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 12
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920013632 Ryton Polymers 0.000 description 1
- 239000004736 Ryton® Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Definitions
- This invention relates to semiconductor devices, and more particularly to a package using a thin flexible film for the packaging material.
- Prior art packages include conventional packaging such as National Semiconductor's TapePakTM, Tape Automated Bonding (TAB), Dual In-line Pin (DIP) packages, and Small Outline Packages (SOPs).
- TAB packaging uses a liquid plastic to encapsulate the semiconductor chip.
- Conventional prior art packages use wire bonds to connect the chip to a leadframe.
- TapePakTM has connections along four sides of the package.
- the invention is a semiconductor package in which a semiconductor device is sandwiched between two thin layers of a plastic film.
- the film hermetically seals the device from the environment, gives mechanical strength to the device, provides a low profile and is low a weight device.
- the package is low cost when compared with standard packaging techniques.
- the semiconductor device may be a semiconductor die or integrated circuit having "bump" contacts in either a “chip-up” or “chip-down” configuration. Offset leads may be use in conjunction with a support ring to minimize stress on the bumplead interface.
- FIG. 1 is a side view, in section, of a package of the present invention
- FIG. 2 is a top view of the package of FIG. 1;
- FIG. 3 is a side view of a package with the semiconductor die contact side up.
- FIG. 4 is a side view of a package with an off set lead and support ring.
- FIG. 1 illustrates a thin film package semiconductor device.
- the semiconductor die 10 has a plurality of bump contacts 15 thereon. Attached to each bump contact is a lead 11.
- the backside 10a of the semiconductor die is covered with a thin film of material which may be, for example, Ryton, a trademarked thin film flexible material manufacture by Phillips 66. This film may be obtained in sheets of 0.005" thickness.
- the generic material is Polyphenylene Sulfide Resin.
- the under side of the semiconductor die and the leads 11 are also covered by the plastic film. An ultrasonic bond is made between the film and leads in the regions indicated by arrows A and B. Leads may optionally be folded around the bottom film as illustrated in FIG. 1.
- the leads in one embodiment, were made from a palladium plated leadframe.
- FIG. 2 is a top view of the device of FIG. 1 illustrating the typical layout of leads on an integrated circuit device.
- Leads 11 are arrayed around the device 10 and extend out the sides of the device.
- the plastic film covers the device and leads, except for the ends of the leads 11a which provide external electrical contact to the integrated circuit.
- the number of leads and arrangement of the leads is not a critical factor, but may be arrayed around the semiconductor device depending upon the device configuration.
- the package is light weight, and, in one embodiment, is about 0.03" thick.
- This thin film package device is functional mechanically as well as electrically, and in most instances provide a cleaner and better sealed device than the standard epoxy molded device. No mechanical degradation has been observed during storage or solder dunk at 250° C. during lead solder coating.
- the process flow for the package includes the steps of tab bonding the wafer to a lead frame or leads, placing the device and leads between two sheets of film and ultrasonically sealing the film around the leads.
- the film seals to itself between the leads 11c and to the leads 11b to form a hermetic seal. Sealing of the film may be done prior to separating a plurality of devices on a continuous strip of lead frame. After sealing, the device may be symbolized and then separated into individual devices prior to testing.
- FIG. 3 illustrates an second embodiment of the thin film package.
- the semiconductor device or integrated circuit 20 has a plurality of contacts 21 thereon.
- the leads 22 are bonded to the contacts and then angled downward to the plane of the semiconductor device. Thereafter, the top film 23 and bottom film 24 is sealed around the device, and to the leads 22.
- FIG. 4 is another embodiment of the thin film package.
- the semiconductor device 30 is mounted with the contact side up. Leads are connected to the contacts and then bent downwardly to lie in the plane of the semiconductor device.
- a support ring 33 of an insulating material is mounted on the part of the lead 32b that is in the plane of the semiconductor device, and extends above the part of the lead 32a bonded to contact 31.
- Plastic film 34 is applied over the contacts 32 and support ring 33, and a second sheet of film 35 is placed under the semiconductor device 30.
- Support ring 33 relieves and minimizes stress or pressure on the junction of contact 31 and lead end 32a.
- the use of the support ring can also be used on devices which are wire bonded.
- the ring may extend completely around the device or be located just in the area of the leads/contacts.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/664,170 US5130783A (en) | 1991-03-04 | 1991-03-04 | Flexible film semiconductor package |
KR1019920003479A KR100263723B1 (ko) | 1991-03-04 | 1992-03-03 | 가요성 박막 반도체 패키지 |
DE69212185T DE69212185T2 (de) | 1991-03-04 | 1992-03-04 | Halbleiteraufbau mit flexibler Trägerfolie |
EP92301854A EP0502710B1 (de) | 1991-03-04 | 1992-03-04 | Halbleiteraufbau mit flexibler Trägerfolie |
JP4046553A JPH0567692A (ja) | 1991-03-04 | 1992-03-04 | 薄膜パツケージ |
TW081104161A TW212250B (de) | 1991-03-04 | 1992-05-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/664,170 US5130783A (en) | 1991-03-04 | 1991-03-04 | Flexible film semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
US5130783A true US5130783A (en) | 1992-07-14 |
Family
ID=24664867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/664,170 Expired - Lifetime US5130783A (en) | 1991-03-04 | 1991-03-04 | Flexible film semiconductor package |
Country Status (6)
Country | Link |
---|---|
US (1) | US5130783A (de) |
EP (1) | EP0502710B1 (de) |
JP (1) | JPH0567692A (de) |
KR (1) | KR100263723B1 (de) |
DE (1) | DE69212185T2 (de) |
TW (1) | TW212250B (de) |
Cited By (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0528684A2 (de) * | 1991-08-20 | 1993-02-24 | Kabushiki Kaisha Toshiba | Halbleiteranordnung vom Dünntyp |
US5294827A (en) * | 1992-12-14 | 1994-03-15 | Motorola, Inc. | Semiconductor device having thin package body and method for making the same |
DE19653782A1 (de) * | 1996-12-21 | 1998-07-02 | Mci Computer Gmbh | Halbleiter-Bauelement |
US5786988A (en) * | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5877555A (en) * | 1996-12-20 | 1999-03-02 | Ericsson, Inc. | Direct contact die attach |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US6272744B1 (en) | 1992-07-24 | 2001-08-14 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US6274823B1 (en) | 1993-11-16 | 2001-08-14 | Formfactor, Inc. | Interconnection substrates with resilient contact structures on both sides |
US6329607B1 (en) | 1995-09-18 | 2001-12-11 | Tessera, Inc. | Microelectronic lead structures with dielectric layers |
US6359236B1 (en) | 1992-07-24 | 2002-03-19 | Tessera, Inc. | Mounting component with leads having polymeric strips |
US6478229B1 (en) | 2000-03-14 | 2002-11-12 | Harvey Epstein | Packaging tape with radio frequency identification technology |
US20040238909A1 (en) * | 2003-05-30 | 2004-12-02 | Boon Suan Jeung | Packaged microelectronic devices and methods of packaging microelectronic devices |
US20050110889A1 (en) * | 2003-11-26 | 2005-05-26 | Tuttle Mark E. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050184219A1 (en) * | 2004-02-23 | 2005-08-25 | Kirby Kyle K. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050253213A1 (en) * | 2004-05-13 | 2005-11-17 | Tongbi Jiang | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US20050254133A1 (en) * | 2004-05-13 | 2005-11-17 | Salman Akram | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US20050255628A1 (en) * | 2003-09-18 | 2005-11-17 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US20050275750A1 (en) * | 2004-06-09 | 2005-12-15 | Salman Akram | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |
US20050275048A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Microelectronic imagers and methods of packaging microelectronic imagers |
US20050275051A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers |
US20050275049A1 (en) * | 2004-06-10 | 2005-12-15 | Kirby Kyle K | Packaged microelectronic imagers and methods of packging microelectronic imagers |
US20050287783A1 (en) * | 2004-06-29 | 2005-12-29 | Kirby Kyle K | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20050285154A1 (en) * | 2004-06-29 | 2005-12-29 | Salman Akram | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20060014313A1 (en) * | 2004-07-16 | 2006-01-19 | Hall Frank L | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060024856A1 (en) * | 2004-07-28 | 2006-02-02 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060023107A1 (en) * | 2004-08-02 | 2006-02-02 | Bolken Todd O | Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers |
US20060040421A1 (en) * | 2004-08-19 | 2006-02-23 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US20060038183A1 (en) * | 2004-08-19 | 2006-02-23 | Oliver Steven D | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US20060044433A1 (en) * | 2004-08-31 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers having front side contacts and methods of packaging such microelectronic imagers |
US20060046332A1 (en) * | 2004-08-26 | 2006-03-02 | Derderian James M | Microelectronic Imaging units and methods of manufacturing microelectronic imaging units |
US20060043512A1 (en) * | 2004-08-24 | 2006-03-02 | Oliver Steven D | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US20060043599A1 (en) * | 2004-09-02 | 2006-03-02 | Salman Akram | Through-wafer interconnects for photoimager and memory wafers |
US20060043509A1 (en) * | 2004-08-24 | 2006-03-02 | Watkins Charles M | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US20060043262A1 (en) * | 2004-08-30 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US20060148250A1 (en) * | 2004-12-30 | 2006-07-06 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US20060177999A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces |
US20060175532A1 (en) * | 2005-02-08 | 2006-08-10 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060177959A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US20060186492A1 (en) * | 2005-02-18 | 2006-08-24 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US20060216850A1 (en) * | 2004-08-10 | 2006-09-28 | Street Bret K | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060243889A1 (en) * | 2004-07-19 | 2006-11-02 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20060289968A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US20060290001A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Interconnect vias and associated methods of formation |
US20070045515A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US20070045858A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US20070148807A1 (en) * | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7425499B2 (en) | 2004-08-24 | 2008-09-16 | Micron Technology, Inc. | Methods for forming interconnects in vias and microelectronic workpieces including such interconnects |
US7448910B2 (en) | 2004-09-03 | 2008-11-11 | Samsung Electronics Co., Ltd | Displaying apparatus |
US7622377B2 (en) | 2005-09-01 | 2009-11-24 | Micron Technology, Inc. | Microfeature workpiece substrates having through-substrate vias, and associated methods of formation |
US20100194465A1 (en) * | 2009-02-02 | 2010-08-05 | Ali Salih | Temperature compensated current source and method therefor |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3378338B2 (ja) * | 1994-03-01 | 2003-02-17 | 新光電気工業株式会社 | 半導体集積回路装置 |
Citations (3)
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US4710798A (en) * | 1985-09-10 | 1987-12-01 | Northern Telecom Limited | Integrated circuit chip package |
US4870476A (en) * | 1986-02-13 | 1989-09-26 | Vtc Incorporated | Integrated circuit packaging process and structure |
US5019673A (en) * | 1990-08-22 | 1991-05-28 | Motorola, Inc. | Flip-chip package for integrated circuits |
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US4007479A (en) * | 1976-03-29 | 1977-02-08 | Honeywell Information Systems, Inc. | Fixture for an integrated circuit chip |
KR900702568A (ko) * | 1988-09-30 | 1990-12-07 | 원본미기재 | 하이브리드 마이크로칩 접착제품 |
DE3838085A1 (de) * | 1988-11-10 | 1990-05-17 | Rheinmetall Gmbh | Beschleunigungsfeste verpackung fuer integrierte schaltungen und verfahren zu ihrer herstellung |
JPH02240956A (ja) * | 1989-02-03 | 1990-09-25 | Motorola Inc | プラスチックカプセル収納集積回路デバイスおよびその製造方法 |
-
1991
- 1991-03-04 US US07/664,170 patent/US5130783A/en not_active Expired - Lifetime
-
1992
- 1992-03-03 KR KR1019920003479A patent/KR100263723B1/ko not_active IP Right Cessation
- 1992-03-04 EP EP92301854A patent/EP0502710B1/de not_active Expired - Lifetime
- 1992-03-04 DE DE69212185T patent/DE69212185T2/de not_active Expired - Fee Related
- 1992-03-04 JP JP4046553A patent/JPH0567692A/ja active Pending
- 1992-05-28 TW TW081104161A patent/TW212250B/zh active
Patent Citations (3)
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US4710798A (en) * | 1985-09-10 | 1987-12-01 | Northern Telecom Limited | Integrated circuit chip package |
US4870476A (en) * | 1986-02-13 | 1989-09-26 | Vtc Incorporated | Integrated circuit packaging process and structure |
US5019673A (en) * | 1990-08-22 | 1991-05-28 | Motorola, Inc. | Flip-chip package for integrated circuits |
Cited By (151)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0528684A3 (en) * | 1991-08-20 | 1993-05-05 | Kabushiki Kaisha Toshiba | Thin type semiconductor device |
US5448106A (en) * | 1991-08-20 | 1995-09-05 | Kabushiki Kaisha Toshiba | Thin semiconductor integrated circuit device assembly |
US5672908A (en) * | 1991-08-20 | 1997-09-30 | Kabushiki Kaisha Toshiba | Thin semiconductor integrated circuit device assembly |
US5767572A (en) * | 1991-08-20 | 1998-06-16 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device assembly |
EP0528684A2 (de) * | 1991-08-20 | 1993-02-24 | Kabushiki Kaisha Toshiba | Halbleiteranordnung vom Dünntyp |
US6272744B1 (en) | 1992-07-24 | 2001-08-14 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US6359236B1 (en) | 1992-07-24 | 2002-03-19 | Tessera, Inc. | Mounting component with leads having polymeric strips |
US5294827A (en) * | 1992-12-14 | 1994-03-15 | Motorola, Inc. | Semiconductor device having thin package body and method for making the same |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US6274823B1 (en) | 1993-11-16 | 2001-08-14 | Formfactor, Inc. | Interconnection substrates with resilient contact structures on both sides |
US6329607B1 (en) | 1995-09-18 | 2001-12-11 | Tessera, Inc. | Microelectronic lead structures with dielectric layers |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5786988A (en) * | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
US5877555A (en) * | 1996-12-20 | 1999-03-02 | Ericsson, Inc. | Direct contact die attach |
DE19653782A1 (de) * | 1996-12-21 | 1998-07-02 | Mci Computer Gmbh | Halbleiter-Bauelement |
US6478229B1 (en) | 2000-03-14 | 2002-11-12 | Harvey Epstein | Packaging tape with radio frequency identification technology |
US20040238909A1 (en) * | 2003-05-30 | 2004-12-02 | Boon Suan Jeung | Packaged microelectronic devices and methods of packaging microelectronic devices |
US6882021B2 (en) * | 2003-05-30 | 2005-04-19 | Micron Technology, Inc. | Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead |
SG143932A1 (en) * | 2003-05-30 | 2008-07-29 | Micron Technology Inc | Packaged microelectronic devices and methods of packaging microelectronic devices |
US20050255628A1 (en) * | 2003-09-18 | 2005-11-17 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US7321455B2 (en) | 2003-09-18 | 2008-01-22 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US20050110889A1 (en) * | 2003-11-26 | 2005-05-26 | Tuttle Mark E. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
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Also Published As
Publication number | Publication date |
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EP0502710B1 (de) | 1996-07-17 |
DE69212185D1 (de) | 1996-08-22 |
TW212250B (de) | 1993-09-01 |
DE69212185T2 (de) | 1996-11-21 |
KR100263723B1 (ko) | 2000-09-01 |
KR920018878A (ko) | 1992-10-22 |
EP0502710A1 (de) | 1992-09-09 |
JPH0567692A (ja) | 1993-03-19 |
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