US4973645A

US4973645A - Novel soluble polyimidesiloxanes and methods for their preparation and use

Info

Publication number: US4973645A
Application number: US07/239,372
Authority: US
Inventors: Chung J. Lee
Original assignee: Occidental Chemical Corp
Current assignee: Sumitomo Bakelite Co Ltd
Priority date: 1987-03-31
Filing date: 1988-09-01
Publication date: 1990-11-27
Anticipated expiration: 2007-11-27
Also published as: EP0284803A2; EP0284803A3; CA1299801C; IL85598A; BR8801001A; EP0284803B1; JP2980321B2; US4956437A; IL85598A0; JPS63260924A; DE3856218T2; DE3856218D1

Abstract

Fully imidized polyimidisiloxanes which are based on oxydiphthalic anhydride are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from oxydiphthalic anhydride, a difunctional siloxane monomer and an organic diamine that provides an assymetrical structure in the polyimidesiloxane polymer chain. The polyimide-siloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

Description

BACKGROUND OF THE INVENTION AND INFORMATION DISCLOSURE STATEMENT

A class of polymers known as polyimides has become known for its combination of good heat stability and high upper use temperatures, as measured by glass transition temperature. A particularly useful type of such polyimides is known as polyimidesiloxanes.

Because of their combination of properties, polyimidesiloxanes have been used in electronic applications, particularly in micro-electronic components in the computer industry.

Because the previously known polyimidesiloxanes are insoluble or difficultly soluble in solvents, when used in the micro-electronics industry, there is a great need for polyimidesiloxanes having improved solubility characteristics, as well as a better balance of heat resistance and upper use temperature.

The chemistry for making polyimides has been well-known since about 1960. A structurally simple polyimide can be prepared by reacting a diamine with a dianhydride. ##STR1##

The first step, or the polycondensation reaction, generates polyamide acids which are hydrolytically unstable even at room temperature. The second step, or the imidization reaction, produces the stable polyimides desired for various applications.

Polyimidesiloxanes can be prepared by reactions employing siloxane diamines or siloxane dianhydrides with organic comonomers. Polyimidesiloxanes can also be prepared from siloxane diamines and siloxane dianhydrides without an organic comonomer.

Only a few polyimidesiloxanes are soluble, even in high boiling and relatively toxic solvents, such as 1-methyl-2-pyrrolidinone (NMP), despite the fact that most of their polyamide acids are soluble. The usage of polyamide acids in coating applications has many drawbacks. First, a subsequent imidization reaction on substrates produces water. Therefore, it can only be used in very thin film coatings and where void-free property is not critical to performance. Second, the removal of high boiling, polar solvents, such as NMP, requires temperatures as high as 350° C. for about 30 minutes even for films of a micron thickness. This drying process is not only energy intensive, but also unacceptable to some heat sensitive electronic devices or substrates. In addition, the polyamide acids solution has to be stored at refrigeration temperature (<4° C.) and it still has a very short shelf life (about 3 months). Finally, only the fully imidized polyimidesiloxanes are thermally stable for melt processing such as extrusion and injection molding. A soluble polyimidesiloxane can be fully imidized at temperatures of about 160° to 170° C. in a solvent, whereas imidization for insoluble polyimidesiloxanes in the solid state may require temperatures 50° C. above their glass transition temperatures which can be as high as 200° to 250° C. Shaping not fully imidized polyimidesiloxanes by the melt processing method produces voids in the products and often is not desirable.

Therefore, one object of the present invention is to prepare fully imidized polyimidesiloxanes.

Polyimides derived from reactions of 4,4'-oxydiphthalic anhydride (4,4'-ODPA) and organic diamines have been studied by Frank W. Harris and Lyn H. Lanier (in F. W. Harris & R. Seymour Edt., "Structure--Property Relationship in Polymers", Academic Press, 1977, pp. 182-198) and also by T. L. St. Clair et al, (Ibide. pp. 199-213). These polyimides, as well as other BTDA containing polyimides based on benzophenone tetracarboxylic dianhydride (BTDA), are very insoluble. For instance, out of 12 polyimides prepared in T. L. St. Clair's report, there are only two polyimides that are soluble in NMP and none are soluble in diglyme or methyl ethyl ketone (MEK). Diglyme is diethylene glycol dimethy ether, also known as 2-methoxyethyl ether. Polyimides prepared from oxydiphthalic anhydride and complex diamines are disclosed in U.S. Pat. Nos. 3,705,869 and 3,705,870. U.S. Pat. No. 4,048,142 discloses the use of 3,3'-oxydiphthalic anhydride in making polyimides.

The first polyimidesiloxane was prepared by reacting pyromellitic dianhydride (PMDA) with 1,3-bis-(aminopropyl)-1,1,3,3-tetramethyl disiloxane in 1966 (see V. H. Kuckertz, Macromol. Chem. 98, 1966, pp. 101-108). This polyimidesiloxane is a crystalline material and cannot be cast into flexible films from solvent. Polyimidesiloxanes derived from reactions of benzophenone tetracarboxylic dianhydride (BTDA) and α,w-diamino organo-polysiloxanes were disclosed by General Electric in 1967 in U.S. Pat. No. 3,325,450. Polyimidesiloxanes containing an α,w-diamino organo-polysiloxane and a diether dianhydride (DEDA) have also been disclosed in U.S. Pat. No. 3,847,867.

All these BTDA and DEDA containing polyimidesiloxanes are amorphous materials. They have a glass transition temperature of no more than 100° C. and, therefore, have very limited upper use temperatures, despite the excellent thermal stability of these polymers up to about 200° C.

Polyimidesiloxanes containing both organic and siloxane monomers have been reported for PMDA containing copolymers (see Japan Kokai Tokkyo Koho Nos. 83/7473 and 83/13631); for BTDA containing copolymers (U.S. Pat. Nos. 3,553,282 and 4,404,350) and for diether dianhydride containing copolymers (U.S. Pat. No. 3,847,867). These PMDA containing polyimidesiloxanes are not soluble in any solvent. The BTDA containing polyimidesiloxanes are only soluble in high boiling or toxic solvents such as N-methyl pyrrolidone (NMP), phenol or cresol, and the like. The diether dianhydride containing polyimidesiloxane, in addition, are also soluble in chlorinated solvents such as dichlorobenzene and dichloromethane. Since these phenol and chlorinated compounds are both corrosive and highly toxic, the polyimidesiloxanes have limited application in coating applications, especially in heat sensitive electronic devices. This is also due to the fact that a NMP soluble polyimidesiloxane normally has to be heated to 350° C. for at least half an hour to remove all the residual solvent in a film having a micron-thickness film.

Some diether dianhydride containing polyimidesiloxanes are soluble in diglyme (T_b =162° C.) and may be sparingly soluble in tetrahydrofuran (T_b =60° C.); but none of these polyimidesiloxanes are soluble in solvents such as methyl ethyl ketone (T_b =80° C.) which is one of the most used solvents in the coating industries. However, all these polyimidesiloxanes have relative low glass transition temperatures (below about 125° C. to 150° C.) and limited thermal stability (350° C./0.5 hour with retention of film flexibility and integrity). Thermally stable polyimidesiloxanes which are soluble in non-toxic and low boiling solvents such as diglyme or methyl ethyl ketone, are not readily available.

U.S. Pat. No. 4,395,527 to Berger discloses a large number of various components as useful in manufacturing polyimidesiloxanes. While the use of oxydiphthalic anhydride is disclosed in the patent there is no recognition that this compound would provide particularly useful properties. Moreover, the tolylene diamine used in the present invention is not even disclosed in the cited patent.

U.S. Pat. No. 4,586,997 teaches the utility of making polyimidesiloxanes based on diether dianhydrides, diamines and α,w-diaminosiloxanes. Cross-linked polymers are also disclosed. There is no recognition that the use of oxydiphthalic anhydride, which is a monoether dianhydride, as the sole essential organic dianhydride in the polymer produces a polymer with exceptional properties.

Another object of the invention is to provide fully imidized polyimidesiloxanes which are soluble not only in high boiling solvents, such as NMP, but also in low boiling, low toxic, less polar solvents such as diglyme, tetrahydrofuran (THF) or methyl ethyl ketone (MEK). A further object of the invention is to provide polyimidesiloxanes that have a good balance of heat resistance and high upper use temperatures, as measured by glass transition temperatures.

Another object of this invention is to produce curable and cross-linked polyimidesiloxanes.

SUMMARY OF THE INVENTION

Fully imidized polyimidesiloxanes which are based on oxydiphthalic anhydride are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from oxydiphthalic anhydride, a difunctional siloxane monomer and an organic diamine that provides an assymetrical structure in the polyimidesiloxane polymer chain.

The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable.

The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

DETAILED DESCRIPTION OF THE INVENTION The Organic Anhydrides

The present invention is based on the discovery that the use of oxydiphthalic anhydrides (ODPA), particularly 4,4'-oxydiphthalic anhydride (4,4'-ODPA), provides polyiminesiloxanes which have a unique combination of properties. Other oxydiphthalic anhydrides that can be used in the practice of the invention are 3,3'-oxydiphthalic anhydride and 3,4'-oxydiphthalic anhydride.

Other organic dianhydrides can be employed in small proportions, up to about 5 to about 20 weight percent of the oxydiphthalic anhydride.

The other organic dianhydrides include compounds having the following general formula: ##STR2## wherein m and Y have the same values as before. Specific examples are diether dianhydrides which have the formulas: ##STR3## Other examples of such other dianhydrides are disclosed in U.S. Pat. Nos. 4,395,527 and 4,586,997, the disclosures of which are incorporated herein by reference, However, even though the incorporation of these dianhydrides may alter only slightly the solubility of the resulting polyimidesiloxanes in NMP or diglyme, these modified polyimidesiloxanes may become insoluble in solvents, such as MEK or THF. This limits their applications where a very low boiling, non-toxic solvent such as MEK is required. In addition, the incorporation of the diether dianhydrides (DEDA) also reduces the glass transition temperature and thermal stability of ODPA-containing polyimidesiloxanes and limit their upper use temperatures. Thus only up to about 5 weight percent of PMDA, and only up to about 20 weight percent of BTDA or the diether dianhydrides (DEDA) can be employed in the composition of the invention.

The Organic Diamines

It has been found that diamines that provide assymetrical structure in the polyimidesiloxane chains are especially useful in combination with the oxydiphthalic anhydrides in making polyimidesiloxanes with the desirable and superior properties of this invention.

Suitable diamines that provide assymetrical structure in the polyimidesiloxane chain have the following formula: ##STR4## where x, y and z are independently selected from hydrogen, halogen, alkyl or halogenated alkyl of 1 to 12 carbon atoms or aryl or halogenated aryl of 6 to 12 carbon atoms.

Examples are:

2,4-tolyldiamine

2,5-tolyldiamine

2,6-tolyldiamine

m-xylyldiamine

2,4-diamine-5-chloro toluene

2,4-diamine-6-chloro toluene

trifluoromethyl-2,4-diaminobenzene

2,4,6-trimethyl 1,3-diaminobenzene

Other useful diamine compounds that are assymetrical in the polymer chain include compounds with the formula: ##STR5##

Examples are:

m,m-methylene dianiline

m,m-sulfone dianiline

o,m-sulfone dianiline.

Another suitable diamine that is assymetrical in the polyimide-siloxane is diaminoanthraquinone.

An especially preferred diamine is a mixture of 80 weight percent 2,4-tolyldiamine and 20 weight percent 2,6-tolyldiamine.

Small amounts up to about 25 weight percent of diamines that are not assymetrical in the polymer chain can be employed in the polyimidesiloxane compositions. Such other diamines are disclosed in U.S. Pat. Nos. 4,395,527 and 4,586,997, the disclosures of which are incorporated herein by reference.

Such auxiliary diamines have the formula ##STR6## wherein x is preferably ##STR7## for retaining solubility in diglyme, THF or MEK. In addition, the x can also be ##STR8## --O--, --S-- and --CH₂ -- for achieving only solubility in NMP. Additional organic diamines can be employed in much smaller quantities without affecting the favorable combinations of thermal stability glass transition temperature and solubility can be found.

The Siloxane Monomers

Siloxane diamino compounds that can be used for the present invention have the following formula: ##STR9## wherein R₁, R₂, R₃, and R₄ are independently selected from a substituted or unsubstituted aliphatic mono-radical of 1 to 12 carbon atoms or substituted or unsubstituted aromatic mono-radical of 6 to 10 carbon atoms. Suitable radicals include --CH₃, --CF₃, --(CH₂)_n CF₃, --C₆ H₅, --CF₂ --CHF--CF₃ and ##STR10##

R' is a di-radical of the foregoing type. Suitable di-radicals include and --(CH₂)_n, --(CH₂)_n CF₂ -- and --C₆ H₄ --, wherein n=1 to 10.

The employment of an α,w-diaminosiloxane is important for achieving the desired solubility in diglyme, THF or MEK in the present invention when the essential dianhydride employed in the invention is ODPA. The siloxane diamine also provides the flexibility or resilience of the polyimidedisiloxanes at low temperatures, especially when the m is an integer of more than about 5, or preferably more than about 7. When the m is more than about 50, the incorporation of diaminosiloxane into the polyimidesiloxane becomes difficult even though it is not impossible; and a dual solvent system (one polar and one non-polar solvent) for copolymerization may have to be employed. In general, the employment of the α,w-diaminosiloxane and α,w-dianhydride siloxane are interchangeable in the present invention. However, for making polyimidesiloxanes of high glass transition temperature, the mole percent of the ODPA in the total dianhydride should be maximized; and therefore, it is more desirable to employ the combination of an ODPA with an organic diamine and an α,w-diaminosiloxane.

Siloxane dianhydrides which can be incorporated instead of or in addition to the siloxane diamines for the practice of the present invention can have the formula: ##STR11## wherein R₁, R₂, R₃ and R₄ are independently selected from a substituted or unsubstituted aliphatic mono-radical of 1 to 12 carbon atoms substituted or unsubstituted aromatic mono-radical of 6 to 10 carbon atoms. Suitable radicals include --CH₃, --CF₃, --(CH₂)_n CF₃, --CF₂ --CHF--CF₃, ##STR12## and --C₆ H₅.

R is a tri-radical of the foregoing type. Suitable tri-radicals include ##STR13##

When a dianhydride other than the ODPA is employed, their solubility in various solvents, glass transition temperatures and thermal stability changes depending on the chemical nature of these co-monomers. For instance, when a siloxane dianhydride is incorporated in the presence of ODPA, the solubility of the polymer increases, while the glass transition temperature and thermal stability will be lowered. Therefore, depending on the requirements for applications, the incorporation of siloxane dianhydride may become unfavorable. On the other hand, when an organic dianhydride such as PMDA is added in small proportions of less than 5 mole percent, the resulting ODPA-containing polyimidesiloxanes still has the desirable solubility in, for instance, NMP. The incorporation of PMDA can increase the glass transition temperature and thermal stability of the resulting ODPA-containing polyimidesiloxanes, and, therefore, can provide more favorable products for extrusion or injection molding applications. However, one may also find that even with a small amount of PMDA or BTDA in the ODPA-containing polyimidesiloxanes, the resulting copolymers may become insoluble in solvents, such as diglyme, THF or MEK, and their applications as coating materials will be limited, for instance, in heat sensitive electronic devices or substrates.

The polyimidesiloxanes of the invention which utilize fluorine substituted substituents have improved thermal stability and chemical resistance. They also have a lower dielectric constant.

The Process For Soluble Polyimidesiloxanes

Although the chemistry for reactions of organic diamines with organic dianhydrides has become well-known, the preparation of polyimidesiloxanes in the presence of the siloxane comonomers may sometimes require special techniques. For instance, when the repeating unit m, of the siloxane monomer is larger (i.e., >20 to 40), it may be desirable to use a dual solvent system: i.e., a solvent system consisting not only of a polar solvent, but also a less polar solvent. (See, for instance, McGrath et al, Polymer Preprints, 27 (2), 1986, pp. 403). In the practice of making soluble polyimides, if a polyimide is soluble in a given solvent, in which the polyamide acid is not soluble, one can prepare the polyimide directly in a one step polymerization process, that is, by a simultaneous imidization and polycondensation process, referred to as the one-step process. This procedure can be advantageous, especially when a desirable polymer solution for coating applications has to be made out of a given solvent in which the polyamide acids are not soluble. The problem with the simultaneous imidization and polycondensation is that the depolymerization of the polyamide acid in the presence of the water which is produced during the imidization step, can be very severe. Theoretically, the depolymerization can become an irreversible process, since it produces a dicarboxylic acid and an amino compound. The carboxylic acid reacts with amino compounds at much higher temperatures as compared to the almost instantaneous reaction of the dianhydrides with the amino compounds at room temperature. The depolymerization of polyamide acids can become very severe at high temperatures. This one-step process often produces polyimidesiloxanes with such lower molecular weight as compared to those produced in a good solvent, in which the polyamide acid and the imidized polymers are both soluble, and one employs a two-step process. The two-step process employs a low temperature polycondensation step which generates very high molecular weight polyamide acid and then a very fast heating step to imidize and remove water generated from imidization.

The two-step process produces higher molecular weight materials which have higher thermal stability and mechanical strength, especially higher elongation at break. The polycondensation temperature for the two-step process should be below 60° C., preferably below room temperature. The imidization can be carried out at temperatures from 90° C. to 180° C., or the refluxing temperature of the solvents. When the boiling temperature of the desirable solvent for imidization is below 160° C., the use of dehydrating agents and/or a base catalyst is desirable. A suitable dehydrating agent is acetic anhydride. The catalyst is a tertiary amine, such as pyridine. When the acetic anhydride is employed, lower imidization temperatures can be employed to complete the imidization. In addition, an azeotropic agent with water can also be added to the reactor. The use of an azeotropic agent such as toluene can facilitate the removal of water presented in the reactor and minimize the depolymerization of the polyamide acids. When an azeotropic agent is employed, a continuous recovery of fresh azeotropic agent can be achieved by using also a Dean Stark trap under the condenser.

The degree of polycondensation is important for obtaining good thermal and mechanical properties in making polyimidesiloxanes. The reaction time for making high molecular weight polyimidesiloxanes is normally several times longer than that required for making polyimides due to the fact that the reactivity of the α,w-diamino or dianhydride siloxanes is normally lower than organic monomers In general, the high molecular weight siloxane monomers react much slower than the organic monomers in a polar solvent. Accordingly, one can also expect that the microstructure of the polyimidesiloxane depends not only on the molar ratio of the organic to siloxane monomers (or the composition of the monomers), but also on the additional sequence of these monomers during polycondensation. For instance, when a high molecular weight α,w-diamino siloxane is employed, one sometimes finds that it is advantageous to first react the organic dianhydride without the presence of the organic diamine. This procedure not only can overcome the need of using a dual solvent system, but also can result in a much more uniform and controllable polyimide block size and distribution. Compared to a polyimidesiloxane with identical chemical make-up, but prepared with a different addition sequence (i.e., add all monomer together into a solvent at once) the polyimidesiloxane with more uniform and controlled imide size and distribution have a more soluble characteristic toward siloxane-like solvent or non-polar solvent. On the other hand, polyimidesiloxanes have the identical number average molecular weight of imide-block but having a broad molecular weight distribution will be less soluble in the diglyme or THF.

Depending on the property requirements for various applications, one can therefore design polyimidesiloxanes by their composition, but also control their microstructures through monomer addition sequence for one's advantage.

The solvents that can be used for the polymerization of the present invention are the phenol solvents; N,N-dialkylated carboxylamide solvents and monoalkylated or dialkylated ether type solvents. The examples of phenol solvents are phenol, o-cresol, m-cresol, o-chlorophenol, m-chlorophenol, p-fluorophenol, 2,4,6-tribromophenol; examples of N,N-dialkylated carboxylamide solvents are N,N-dimethylformamide, N,N-dimethylacetamide, NMP; ether type solvents are tetrahydrofuran (THF), or diglyme. Other solvents such as sulfolane, dimethylsulfoxide and chlorinated benzenes such as p-dichloro benzene which are commonly mentioned in various polyimide patents can also be used.

Polyimidesiloxane can also be prepared in a melt polymerization process; especially when the glass transition temperature of the imide block is lower than say about 200° C.; or a large proportion (>25%) of the siloxane comonomers is employed. In practice, the melt polycondensation can be done in an extruder in which imidization can be achieved using a vented zone situated close to the outlet nozzle.

To achieve high molecular weight polyimidesiloxanes, the total moles of dianhydride component(s) should equal the total moles of diamine component(s). To reduce the molecular weight an excess of dianhydride, diamine components or small amounts of monofunctional compounds can be employed.

When the siloxane monomer is a diamine, for every 1 mole of siloxane diamine employed, assume that n moles of organic diamine is employed. Then n+1 moles of organic dianhydride is employed.

When the siloxane monomer is a dianhydride, for every 1 mole of siloxane dianhydride employed, assume that n moles of organic dianhydride is employed. Then n+1 moles of organic diamine must be employed.

In the foregoing cases, n has a value of greater than 0.01 but no more than 40, preferably 20.

When 0.01≦n≦0.1, the polyimidesiloxane exhibit elastomeric or rubber properties and are useful for potting, encapsulation, and sealing applications. Especially, a cross-linking elastomeric polyimidesiloxane will have great value in the above-mentioned applications. When 0.1≦n≦10, polyimidesiloxanes with thermoplastic elastomeric properties are obtained. These materials are useful for wire, cable, injection molding and protective coating applications. When 10≦n≦40, very high strength and rigid thermoplastics are produced which are useful for molding and coating applications.

The Curable Polyimidesiloxanes

The soluble polyimidesiloxanes described above have many valuable properties and uses. However, limitations are found in their applications, especially in areas where higher chemical or creep resistance are desirable or even critical. For instance, most of the polyimidesiloxanes show limited hydraulic fluid or jet fuel resistance when their siloxane content is over 30 to 40%. Even though this weakness can be largely reduced by incorporating fluorinated compound into their backbone structure, in particular, into their siloxane blocks, it is still more desirable to convert these fluorinated polyimidesiloxanes into thermosets in order to achieve higher solvent and creep resistance. In general, when a cross-linkable polyimidesiloxane carries an acrylic functionally, it can be cured by either thermal or photo-method. A photosensitive or photocurable polyimidesiloxane is especially valuable for patterning applications in microchips or integrated circuit industries. Furthermore, these novel curable polyimidesiloxanes, as well as the soluble polyimidesiloxanes, can also find applications in passivation layer, alpha particle barrier, electron beam patterning, ion implant mask or interlayer dielectric in electronics and micro-electronic industries.

The polyimidesiloxanes of the invention can be made curable by the inclusion of reactants that have functionalities that are capable of being cross-linked, or that have intermediate functionalities that can be suitably modified with cross-linkable moieties after formation of the polymer. The required functionalities can be incorporated into the polymer of the invention by use of suitable diamines and/or siloxane compounds.

The diamine compounds have the characteristic described for the soluble polymers of a diamine that provide assymetrical structure in the polyimidesiloxane chains. The diamines further have the following general formula: ##STR14## wherein Ar is aromatic, R" is a hydroxyl, hydrothiol or carboxylic radical, preferably a hydroxyl or carboxylic radical. The typical examples of these compounds are, for instance, 3,5-diaminobenzoic acid and 3,5-di-aminophenol, and the like.

The functionalized siloxane diamines or dianhydrides have the following general structure: ##STR15## wherein D is either an amino or anhydride group and the R¹ is a diradical R, or a triradical R, such as described hereinbefore. Radicals R₁, R₂, R₃ and R₄ are described hereinbefore, except that one or more of R₁, R₂, R₃ and R₄ can be a halogen, hydride (H), vinyl or a hydroxyl group, when D is an anhydride group; or vinyl or hydroxyl when D is an amino group.

Examples of the functionalized siloxane α,w-diamino compounds can be the following: ##STR16## wherein n is an integral from 2 to 6, preferably 3 and 4; and R'" is a vinyl or hydroxyl group, and x+y=1 to 100, preferably 4-40 and y is an integer of 1 to 15, preferably 1 to 5.

The examples of the functionalized dianhydride are: ##STR17## and R''" is selected from hydride (H), hydroxyl, halogen and vinyl groups, preferably the H and vinyl groups. The x and y have the same meanings as above.

The Process For Making Curable Polyimidesiloxanes

The procedures for making soluble polyimidesiloxanes are generally followed.

The comonomers are generally copolymerized in an appropriate solvent such as NMP or diglyme. The fully imidized, polyimidesiloxane which carries at least one kind of the functionalities described above, can then be further reacted or grafted with an acetylinic, ethylenic or acrylic-bearing compound to provide the final products desired for this invention. The grafting reaction is preferably conducted in a non-reactive solvent, preferably in diglyme, THF or MEK. Since there are many different functional groups that can be selected for the functionalized polyimidesiloxane, the grafting reaction desired for this invention has to be varied accordingly. For instance, when a carboxylic or hydroxyl-containing polyimidesiloxane is first prepared, the grafting of an acrylic group can be achieved by using either an epoxy-bearing acrylate such as the ##STR18##

When the functional group of the polyimidesiloxane is located in the siloxane blocks, the grafting reaction can be achieved using either an hydrosilylation reaction or a condensation reaction. For instance, when a ##STR19## group is present in a polyimidesiloxane, the grafting can be achieved via hydrosilylation: i.e., reaction of a vinyl group with a Si-H group in the presence of a catalyst, such as a Pt catalyst. Therefore grafting of a ##STR20## compound results in an acrylate-bearing polyimidesiloxane. When a --OH or epoxy group is present in the polyimidesiloxane, on the other hand, the grafting can be achieved via a condensation reaction. For instance, the reactions of an isocyanate-bearing acrylate or an acrylic acid or methylacrylic acid with the hydroxyl or epoxy group on the polyimidesiloxane can result in an acrylic- bearing polyimidesiloxane desired for the present invention.

When an acetylenic-bearing compound also bears a carboxylic, an epoxy or isocyanato functionality, it is clear that the compounds can be grafted onto a polyimidesiloxane which carries an --OH or, a carboxylic group, respectively.

When an ethylenic group is present in the siloxane block of the polyimidesiloxane, it can be used as such, and further be cured thermally via free radical cross-linking reactions or can be further changed into polyimidesiloxanes which carry either an acrylic or an acetylinic group. The grafting reaction of this kind is difficult to achieve, however, due to the lack of appropriate chemicals.

To prepare the functionalized polyimidesiloxanes with a functional group presented in the imide block, it is preferred to start with an OH or --COOH-bearing diamino compound On the other hand, this kind of siloxane monomer is usually not readily available. The incorporation of epoxy, silicone hydride or silicone hydroxyl group can be achieved via equillibration of the α,w-diamino or α,w- dianhydride siloxane with cyclic silicone epoxy, silicone hydride or silicone hydroxy compounds. In any event, it is preferred to graft the acrylic or ethylenic or acetylenic group rather than using an acrylic, ethylenic or acetylenic diamino or dianhydride compound for making the desired polyimidesilocane. This is to avoid thermally cross-linking reactions of these functionalities during imidization of the polyimidesiloxane at high temperatures (about 160° to 170° C./2 hrs in solvent). A grafting reaction of a fully imidized polyimidesiloxane with the above described functionalities can be, in general, carried out at much lower temperatures. For instance, the hydrosilylation can be carried out at temperatures as low as 25° C. in the presence of a platinum catalyst. The condensation between the --OH or carboxylic group with the epoxy group can be achieved at temperatures of no more than 120° C., within hours with the presence of a tertiary amine as a catalyst, while the reaction of an OH or carboxylic group with an isocyanate group needs even lower temperatures (RT to 80° C.), and the like.

To avoid the need for isolation of the reaction product from solvent, it is desirable to conduct the grafting reaction in the solvent which is acceptable for coating operations. The desirable solvents of these kinds are solvents with low flammability and/or toxicity, such as diglyme or MEK. The latter has been widely employed in coating industries due to its low boiling temperature.

In this specification and claims halogen shall refer to fluorine, chlorine, bromine and iodine, but preferably to fluorine and chlorine. Aromatic generally refers to hydrocarbon aromatic.

In the following Examples and throughout the specification and claims, parts are by weight and temperatures are in degrees Celsius, unless indicated otherwise.

In the following Examples, the following test procedures were used:

Solubility Tests

Into a 5 ml small vial, 0.2-0.3 mg of polymer specimens were added with 2-3 ml of solvent. The observations for solubility was conducted normally after ≧16 hours, at temperatures from 25° C. to the boiling temperature of the solvent.

Glass Transition Temperatures

The glass transition temperatures were measured by both differential scanning Calorimeter (DSC) and also by dynamic mechanical analysis (DMA) methods.

EXAMPLES Example 1

Into a 125 ml Erlenmeyer flask was loaded 1.55 g of 4,4'- oxydiphthalic anhydride (4,4'-ODPA) and 10 ml of anhydrous N-methyl pyrrolidone (NMP). The ODPA was dissolved with rigorous mixing using a magnet stirrer. Then 0.61 g of 2,4-tolyldiamine (2,4-TDA) was added. The reaction was continued at room temperature for 2 hours. The solution was cast in a Teflon mold at temperatures about 160°-165° C. for 4 hours, then at 250° C. for 30 minutes. A flexible film was obtained. The polyimide is designated as the [(TO)].

Example 2

Example 1 was repeated by reacting 1.55 g of 4,4'-ODPA with 0.54 g of p-diaminobenzene. The product was a powder-like material which is designated as [(OA_p)].

Example 3

Example 1 was repeated by reacting 1.55 g of 4,4'-ODPA with 1.00 g of 4,4'-oxydianiline. The product was a flexible film with its structure being designated as [(OO_p)].

Examples 4 to 6 and 8 to 21

Example 1 was repeated except for reactants, amounts of reactants and reaction times. The nature of the polymer product was as indicated in Table 1. The products were tested for solubility in various solvents and the results are also shown in Table 1. The glass transition temperatures for some of the products were tested and the results are shown in Table 1.

In the foregoing examples, has the formula: ##STR21## where m indicates the number of repeating units, as shown in Table 1, for example, G₁, G₇.5, G₉, G₁₁ and G₁₂.

Example 7

Into a 125 ml Erlenmeyer flask was loaded 4.93 g of 4,4'-ODPA with 30 ml of anhydrous NMP. After the 4,4'-ODPA was dissolved, 3.82 g of G9 was added. The solution was stirred with a magnetic stirrer for another hour at room temperature. Then 1.39 g of TDA was added and the reaction was continued overnight (≧16 hours). The solution was cast into a 5"×5"1/32" Teflon plate at temperatures about 160°-165° C. for 4.5 hours, then at 250° C. for 30 minutes. The product was a flexible film. The designated structure is (OT)₂.5 G₉. The product properties are shown in Table 1.

The solubility and some glass transition temperatures were measured for the products of Examples 1 to 21. The results are given in Table 1.

As seen from the results of Examples 1 to 21, the solubility of the polyimidesiloxanes of the invention in low boiling, non-polar solvents, such as THF or diglyme is a function of the proportions of siloxane and block size of the siloxane. The results of Examples 1 to 21, would form a phase diagram to show the effect of structural differences in the siloxane monomer. Thus, polyimidesiloxane consisting of 25% of siloxane with one repeating ##STR22## unit is soluble in both THF and diglyme. A polyimidesiloxane consisting of a similar 25% siloxane, but with 3 repeating ##STR23## units is only soluble in THF but not soluble in diglyme. A polyimidesiloxane consisting of a similar 25% siloxane but with 8 ##STR24## repeating units will neither solubilize in THF nor in diglyme. Therefore the solubility of a given polyimidesiloxane is dependent on both the proportion of the siloxane component in the polyimidesiloxane and also the siloxane block size.

                                  TABLE 1                                 
__________________________________________________________________________
                                                         Glass            
Exam-                                                    Transition       
ple                       Reaction                       Tempera-         
Num-                                                                      
    Components, Grams     Time        Nature of                           
                                           Solubility    ture,            
                                                         °C.       
ber ODPA                                                                  
        TDA Gm Wt. Gm                                                     
                    Wt % Gm                                               
                          Hours                                           
                               Structure                                  
                                      Product                             
                                           NMP Digl.                      
                                                  THF                     
                                                     MEK Tg.sub.1         
                                                            Tg.sub.2      
__________________________________________________________________________
1   1.55                                                                  
        0.61                                                              
            -- 0    0     2    OT     Flexible                            
                                           -   -  -  -      313           
                                      Film                                
2   1.55                                                                  
        --  -- 0    0     2    OA.sub.p                                   
                                      Powder                              
                                           -   -  -  -                    
3   1.55                                                                  
        --  -- 0    0     2    OO.sub.p                                   
                                      Flexible                            
                                           -   -  -  -                    
                                      Film                                
4   3.10                                                                  
        0.85                                                              
            G.sub.1                                                       
               0.75 16    4    (OT).sub.2 G.sub.1                         
                                      Brittle                             
                                           +   -  ±                    
                                                     -                    
                                      Film                                
5   3.10                                                                  
        0.61                                                              
            G.sub.1                                                       
               1.24 25    4    (OT).sub.1 G.sub.1                         
                                      Brittle                             
                                           +   ±                       
                                                  +  -                    
                                      Film                                
6   6.20                                                                  
         1.836                                                            
            G.sub.9                                                       
               4.2  34    4    (OT).sub.3 G.sub.9                         
                                      Flexible                            
                                           +   -  ±                    
                                                     -      230           
                                      Film                                
7   4.93                                                                  
        1.39                                                              
            G.sub.9                                                       
               3.82 38    ≧16                                      
                               (OT).sub.2.5 G.sub.9                       
                                      Flexible                            
                                           +   +  +  -   -80              
                                                            205           
                                      Film                                
8   4.65                                                                  
        1.22                                                              
            G.sub.9                                                       
               4.20 41    4    (OT).sub.2 G.sub.9                         
                                      Flexible                            
                                           +   +   +*                     
                                                     ±   196           
                                      Film                                
9   6.2 1.22                                                              
            G.sub.9                                                       
               8.40 53    4    (OT).sub.1 G.sub.9                         
                                      Flexible                            
                                           +   +   +*                     
                                                     +      165           
                                      Film                                
10  5.58                                                                  
        1.71                                                              
            G.sub.11                                                      
               4.0  35.4  ≧16                                      
                               (OT).sub.3.5 G.sub.11                      
                                      Flexible                            
                                           +   -  -  -      255           
                                      Film                                
11  6.2 1.83                                                              
            G.sub.11                                                      
               5.0  38.0  ≧16                                      
                               (OT).sub.3.0 G.sub.11                      
                                      Flexible                            
                                           +   -  -  -                    
                                      Film                                
12  6.2 1.83                                                              
            G.sub.12                                                      
               5.28 39.7  ≧16                                      
                               (OT).sub.3.0 G.sub.12                      
                                      Flexible                            
                                           +   -  -  -                    
                                      Film                                
13  5.43                                                                  
        1.53                                                              
            G.sub.12                                                      
               5.28 43    ≧16                                      
                               (OT).sub.2.5 G.sub.12                      
                                      Flexible                            
                                           +   -  -  -   -80              
                                                            235           
                                      Film                                
14  4.65                                                                  
        1.22                                                              
            G.sub.12                                                      
               5.28 47.3  ≧16                                      
                               (OT).sub.2.0 G.sub.12                      
                                      Flexible                            
                                           +   -  +  -      225           
                                      Film                                
15  3.88                                                                  
        0.92                                                              
            G.sub.12                                                      
               5.28 52.4  ≧16                                      
                               (OT).sub.1.5 G.sub.12                      
                                      Flexible                            
                                           +   +  +  -                    
                                      Film                                
16  6.2 1.22                                                              
            G.sub.12                                                      
               10.56                                                      
                    58.7  ≧16                                      
                               (OT).sub.1.0 G.sub.12                      
                                      Flexible                            
                                           +   +  +  +                    
                                      Film                                
17  7.0 2.52                                                              
            G.sub.7.5                                                     
               1.45 13.4  ≧16                                      
                               (OT).sub.10 G.sub.7.5                      
                                      Flexible                            
                                           +   -  -  -                    
                                      Film                                
18  6.2 1.83                                                              
            G.sub.7.5                                                     
               3.62 31.1  ≧16                                      
                               (OT).sub.3 G.sub.7.5                       
                                      Flexible                            
                                           +   -  +  -   -80              
                                                            205           
                                      Film                                
19  5.43                                                                  
        1.53                                                              
            G.sub.7.5                                                     
               3.62 34.3  ≧16                                      
                               (OT).sub.2.5 G.sub.7.5                     
                                      Flexible                            
                                           +   -  +  -                    
                                      Film                                
20  6.2 1.22                                                              
            G.sub.7.5                                                     
               7.25 49.4  ≧16                                      
                               (OT).sub.2 G.sub.7.5                       
                                      Flexible                            
                                           +   +  +  +      125           
                                      Film                                
21  3.41                                                                  
        0.12                                                              
            G.sub.7.5                                                     
               7.25 68    ≧16                                      
                               (OT).sub.0.1 G.sub.7.5                     
                                      Flexible                            
                                           +   +  +  +                    
                                      Film                                
__________________________________________________________________________
 + = soluble                                                              
 +* = slight insolubility                                                 
 ± = partially soluble                                                 
 - = insoluble

COMPARATIVE EXAMPLES Example 22

Example 1 was repeated by reacting 4.02 g of 1,4-(3,4-dicarboxyphenoxy)benzene dianhydride with 1.22 g of TDA. The product is designated as (HT).

Example 23

Example 6 was repeated by reacting 4.02 g of 1,4-(3,4-dicarboxyphenoxy)benzene dianhydride with 0.81 g of TDA and 2.80 g of G₉. The product is flexible films with a designated structure as (HT)₂ G₉.

Example 24

Example 1 was repeated by reacting 3.22 g BTDA with 1.22 g TDA. The product is flexible film designated as (BT).

Example 25

Example 10 was repeated by reacting 4.83 g of BTDA, 1.22 g TDA and 4.20 g of G₉. The product is flexible film designated as (BT)₂ G₉.

The solubility data for Comparative Examples 22 to 25 were determined and compared with the solubilities obtained in accord with the invention in Examples 1 and 8. These data are also compared with data obtained for the polymers disclosed in Examples 1b and 3b in U.S. Pat. No. 4,586,997. The solubility data are shown in Table 2.

The data in Table 2 show the lack of predictability that a given dianhydride will give a glyme soluble polymer. Thus, even though all (BT), (HT) and (UT) are soluble in NMP, only (UT)₂ G₉ is soluble isoluble in diglyme.

Considering the fact that (OT) is not soluble in NMP, the discovery that the polyimidesiloxane (OT)₂ G₉ is soluble, was totally unexpected.

In Table 3, the thermal properties for polyimidesiloxanes shown in Table 2 are compared.

              TABLE 2                                                     
______________________________________                                    
Comparative Solubility of Various                                         
Polyimides and Polyimide Siloxanes                                        
Example Designated Solubility (10 g/100 mil)**                            
No.     Composition                                                       
                   NMP     Diglyme THF  MEK                               
______________________________________                                    
24      (BT).sub.n +       -       -    -                                 
 1      (OT).sub.n -       -       -    -                                 
22      (HT).sub.n +       -       -    -                                 
(a)     (UT).sub.n +       -       -    -                                 
25      (BT).sub.2 G.sub.9                                                
                   +       -       -    -                                 
 8      (OT).sub.2 G.sub.9                                                
                   +       +        +*  ±                              
23      (HT).sub.2 G.sub.9                                                
                   +       -       ± -                                 
(b)     (UT).sub.2 G.sub.9                                                
                   +       +       -    -                                 
______________________________________                                    
 **(Values given in Table 1)

              TABLE 3                                                     
______________________________________                                    
Comparative Thermal Properties of Polyimidesiloxanes                      
                          Glass                                           
                          Transition                                      
            Oxygen Index  Temperature,                                    
Example                                                                   
       Designated 10 mil            °C.                            
No.    Composition                                                        
                  Film    1/32" 1/16" Tg.sub.1                            
                                            Tg.sub.2                      
______________________________________                                    
25     (BT).sub.2 G.sub.9                                                 
                  40-41   --    --    -80   205                           
 8     (OT).sub.2 G.sub.9                                                 
                  40-41   42    44    -80   196                           
23     (HT).sub.2 G.sub.9                                                 
                  36-37   --    --    -80   170                           
(b)    (UT).sub.2 G.sub.9                                                 
                  30-31   --    --    -80   145                           
______________________________________                                    
 B = Benzophenone Tetracarboxylic Dianhydride (BTDA)                      
 O = 4,4Oxydiphthalic Anhydride (4,4ODPA)                                 
 H = 1,4(3,4-dicarboxy phenoxy)benzene dianhydride                        
 U = 2,2bis[4(3,4-dicarboxy phenoxy)phenyl] propane                       
 (a) Composition of Example 1b of U.S. Pat. No. 4,586,997                 
 (b) Composition of Example 3b of U.S. Pat. No. 4,586,997

The thermal stability of the polymer of the invention disclosed in Example 7 was compared with the thermal stability of the polymer composition identified in U.S. Pat. No. 4,586,997, Example 3b. The data are shown in Table 4.

              TABLE 4                                                     
______________________________________                                    
Example No.       8         (a)                                           
______________________________________                                    
Polymer Structure (OT).sub.2.5 G.sub.9                                    
                            [(UT).sub.2 G.sub.9 ]                         
Tensile Strength (psi)                                                    
                  5200      4500                                          
% Elongation at Break                                                     
                   15        10                                           
Tensile Strength (psi)                                                    
After   350° C./0.5 hour                                           
                      5600      5200                                      
        350° C./1 hour                                             
                      2900       450                                      
% Elongation at Break                                                     
After   350° C./0.5 hour                                           
                       12         4                                       
        350° C./1 hour                                             
                       10         1                                       
Tg (°C.)    205       145                                          
______________________________________                                    
 (a) Composition identified in Example 3b of U.S. Pat. No. 4,586,997

CURABLE POLYIMIDESILOXANES Example 26

Into a 150 ml flask was loaded 3.1 grams of 4,4'-ODPA, 0.75 gram of 3,5-diamino benzoic acid, 4.20 grams of G₉ and 20 ml of NMP. The reaction was carried out at room temperature for about 6 hours. Then the solution was cast into two Teflon cavities (5×5×1/32 inches), and dried at temperatures of about 160° C. for 4 hours. The imidized polyimidesiloxane was designated as [(OA¹)₁ G₉ ]. The product contained 40.5 weight percent of G₉ siloxane. The product was tested and found soluble in NMP, diglyme and THF but not in MEK.

Example 27

The above example was repeated to provide 3.40 grams of [(OA¹)₁ G₉ ], which was dissolved in 20 ml of diglyme. Then into the solution, 0.25 gram of acrylic acid epoxy propyl ester was loaded. The solution was heated to about 90° C. in the presence of about 0.005 gram of hydroquinone as free radical inhibitor and 0.02 gram of diazo-[2,2,z]-bicyclic octane as catalyst. The reaction was conducted under a blanket of nitrogen atmosphere for about one hour. Then into the solution was added 2 drops of t-butyl perbenzoate, and the solution then was cast into a Teflon cavity at temperatures of about 120° to 140° C. for two hours. The cured polyimidesiloxane is designated as [(OA")₁ G₉ ]. The cured product was insoluble in NMP, diglyme, THF and MEK.

The solubility of all the products of Examples 26 and 27 were tested as follows: About 0.4 mg of the film for each material was placed into a 5 ml vial and then 2-3 ml of NMP, diglyme, THF or MEK was loaded. The vials were left at room temperatures for at least 24 hours with occasional stirring and shaking to promote the dissolution of the materials.

The polyimidesiloxanes of the invention are useful in a variety of applications in the micro-electronic industry. Such applications include use in the form of coatings as dielectrics and/or for passivations for semiconductors and thin film hybrids. Coatings of the polyimidesiloxanes can be used in the fabrication of semiconductor devices in the following areas: a) as a protective overcoat, b) as an interlayer dielectric for multi-level devices, c) as an alpha particle barrier, and d) as a non-implant mask. These uses are described in detail by Lee and Craig in Polymer Materials for Electronic Applications, ACS Symposium, Ser. 184, page 108.

Other uses for the polyimidesiloxanes of the invention include wire and cable coatings, in fibers and films, and molded and extruded articles.

Claims

I claim:

1. A fully imidized polyimidesiloxane soluble in diglyme which comprises the reaction product if an organic dianhydride, an aromatic diamine, and a siloxane monomer, wherein said organic dianhydride is free of polyether linkage and at least about 80 weight percent of said organic dianhydride is oxydiphthalic anhydride, said aromatic diamine being selected to provide an asymmetrical structure in the polyimidesiloxane, and said siloxane monomer being selected to have sufficient block size and being present in an amount to render the polyimidesiloxane soluble in diglyme.

2. The polyimidesiloxane of claim 1 wherein the oxydiphthalic anhydride is 4,4'-oxydiphthalic anhydride.

3. The polyimidesiloxane of claim 1 wherein the oxydiphthalic anhydride is 3,3'-oxydiphthalic anhydride.

4. The polyimidesiloxane of claim 1 wherein the oxydiphthalic anhydride is 3,4'-oxydiphthalic anhydride. PG,41

5. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,4-tolyldiamine wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

6. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,5-tolyldiamine wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

7. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,6-tolyldiamine wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

8. A polyimidesiloxane according to clam 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and a mixture of 2,4-tolyldiamine and 2,6-tolyldiamine wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

9. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and m-xylyldiamine wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

10. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,4-diamino-5-chloro toluene wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

11. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,4-diamino-6-chloro toluene wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

12. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and 2,4,6-trimethyl-2,3-diaminobenzene wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

13. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and m,m-methylene dianiline wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

14. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and m,m-sulfone dianiline wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

15. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and o,m-sulfone dianiline wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

16. A polyimidesiloxane according to claim 1 comprising the reaction product of 4,4'-oxydiphthalic anhydride, a difunctional siloxane monomer, and diaminoanthraquinone wherein the 4,4'-oxydiphthalic anhydride is the sole essential organic dianhydride monomeric component of the polyimidesiloxane, and wherein the organic dianhydride monomeric component is free of polyether linkage.

17. The polyimidesiloxane of claim 1 wherein at least a portion of the organic diamine has the formula ##STR25## wherein Ar is an aromatic radical, and R" is at least one of a hydroxyl, carboxyl, or hydrothiol.

18. The polyimidesiloxane of claim 17 wherein R" is carboxyl.

19. The polyimidesiloxane of claim 1 wherein at least a portion of the organic diamine component has the formula ##STR26## wherein Ar is an aromatic radical, and R'" is at least one of an acrylic-, an ethylenic- or an acetylenic-bearing radical.

20. The polyimidesiloxane of claim 1 wherein the siloxane monomer is a siloxane diamine.

21. The polyimidesiloxane of claim 20 wherein the siloxane diamine has the formula ##STR27## wherein R' is independently selected from substituted or unsubstituted aliphatic difunctional radicals of 1 to 12 carbon atoms, and wherein one or more of R₁, R₂, R₃ and R₄ can be vinyl, hydroxyl, radicals, and the remainder of R₁, R₂, R₃, and R₄ are independently selected from a substituted or unsubstituted aliphatic monofunctional radical of 1 to 12 carbon atoms, or substituted or unsubstituted aromatic monofunctional radicals of 6 to 10 carbon atoms, and m is a number from about 5 to about 200.

22. The polyimidesiloxane according to claim 21 wherein the remainder of R₁, R₂, R₃, and R₄ are methyl groups.

23. The polyimidesiloxane according to claim 22 wherein R' is CH₂₃.

24. The polyimidesiloxane according to claim 21 wherein at least one of R₁, R₂, R₃ and R₄ is vinyl and the remainder are methyl groups.

25. The polyimidesiloxane according to claim 30 wherein the R' is CH₂ ₃.

26. The polyimidesiloxane of claim 26 wherein at least a portion of the siloxane diamine of the formula comprises a siloxane diamine component wherein at least one of the hydroxyl or vinyl radicals is reacted with a compound having a radical selected from acrylic-, ethylenic- or acetylenic-bearing radicals.

27. The polyimidesiloxane of claim 26 comprising an acrylic-bearing radical.

28. The polyimidesiloxane of claim 1 wherein the siloxane monomer is a siloxane dianhydride.

29. The polyimidesiloxane of claim 28 wherein the siloxane dianhydride has the formula ##STR28## wherein R is substituted or unsubstituted aliphatic trifunctional radicals of 1 to 12 carbon atoms, or substituted or unsubstituted aromatic trifunctional radicals of 6 to 10 carbon atoms, and wherein one or more of R₁, R₂, R₃ and R₄ can be halogen, hydride (H), vinyl or a hydroxyl group, and the remainder of R₁, R₂, R₃, and R₄ are independently selected from a substituted or unsubstituted aliphatic monofunctional radical of 1 to 12 carbon atoms, or substituted or unsubstituted aromatic monofunctional radicals of 6 to 10 carbon atoms, and wherein m is about 5 to 50.

30. The polyimidesiloxane of claim 29 wherein the remainder of R₁, R₂, R₃, and R₄ are methyl groups.

31. The polyimidesiloxane of claim 30 wherein R is ##STR29##

32. The polyimidesiloxane according to claim 29 wherein at least one of R₁, R₂, R₃ and R₄ is vinyl and the remainder are methyl groups.

33. The polyimidesiloxane according to claim 32 wherein R is ##STR30##

34. The polyimidesiloxane of claim 29 wherein at least a portion of the siloxane dianhydride component of the formula comprises a siloxane dianhydride component wherein at least one of the hydride(H), halogen, hydroxyl or vinyl radicals is reacted with a compound having a is a radical selected from acrylic, ethylenic or acetylenic radicals.

35. The polyimidesiloxane of claim 34 comprising an acrylic-bearing radical.

36. A solution comprising the polyimidesiloxane of claim 1 dissolved in a solvent for the polyimidesiloxane.

37. The solution of claim 36 wherein the solvent is selected from diglyme, triglyme, 1-methyl-2-pyrrolidinone tetrahydrofuran, methyl ethyl ketone, phenols and chlorinated solvents.

38. An article comprising a substrate coated with a polyimide-siloxane according to claim 1.

39. An article of claim 38 wherein the substrate is a wire or cable.

40. A film prepared from the polyimidesiloxane according to claim 1.

41. A fiber prepared from the polyimidesiloxane according to claim 1.

42. A molded article prepared from a polyimidesiloxane according to claim 1.

43. An extruded article prepared from a polyimidesiloxane according to claim 1.

44. A cured composition of claim 26.

45. A cured composition of claim 34.

46. The polyimidesiloxane of claim 1 wherein the organic dianhydride is 4,4'-oxydiphthalic anhydride, the difunctional siloxane monomer is a siloxane diamine, and the organic diamine is a tolyldiamine.

47. The polyimidesiloxane of claim 1 wherein the organic dianhydride is 4,4'-oxydiphthalic anhydride, the difunctional siloxane monomer is a siloxane diamine, and the organic diamine is a tolyldiamine.

48. A fully imidized polyimidesiloxane soluble in diglyme and which is capable of forming a photosensitive polyimidesiloxane, which comprises the reaction product of an organic dianhydride, an aromatic diamine, and a siloxane monomer, wherein said organic dianhydride is free of polyether linkage and at least about 80 weight percent of said organic dianhydride is oxydiphthalic anhydride, said aromatic diamine being selected to provide an asymmetrical structure in the polyimidesiloxane, and said siloxane monomer being selected to have sufficient block size and being present in an amount to render the polyimidesiloxane soluble in diglyme, comprising at least one radical selected from hydride (H), hydroxyl, halogen, carboxyl, hydrothiol or vinyl.

49. The polyimidesiloxane of claim 48 comprising a carboxyl radical.

50. A photosensitive polyimidesiloxane of claim 48 wherein at least one of the hydride (H), hydroxyl halogen, carboxyl, hydrothiol, or vinyl radicals is reacted with at least one radical selected from an acrylic radical, an ethylenic radical or an acetylenic radical.

51. The polyimidesiloxane of claim 50 comprising an acrylic radical.

52. A cured composition of claim 50.