US3505285A - Stabilised polyamides containing a copper salt and a phosphine - Google Patents
Stabilised polyamides containing a copper salt and a phosphine Download PDFInfo
- Publication number
- US3505285A US3505285A US576831A US3505285DA US3505285A US 3505285 A US3505285 A US 3505285A US 576831 A US576831 A US 576831A US 3505285D A US3505285D A US 3505285DA US 3505285 A US3505285 A US 3505285A
- Authority
- US
- United States
- Prior art keywords
- phosphine
- polyamide
- iodide
- copper
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000004952 Polyamide Substances 0.000 title description 38
- 229920002647 polyamide Polymers 0.000 title description 38
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 title description 30
- 229910000073 phosphorus hydride Inorganic materials 0.000 title description 15
- 150000001879 copper Chemical class 0.000 title description 13
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 25
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 20
- 239000010949 copper Substances 0.000 description 19
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000003381 stabilizer Substances 0.000 description 13
- 230000000875 corresponding effect Effects 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 239000011574 phosphorus Substances 0.000 description 11
- 229910052698 phosphorus Inorganic materials 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- 150000003003 phosphines Chemical class 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- -1 naphthyl diethyl phosphine Chemical compound 0.000 description 5
- OKIIEJOIXGHUKX-UHFFFAOYSA-L cadmium iodide Chemical compound [Cd+2].[I-].[I-] OKIIEJOIXGHUKX-UHFFFAOYSA-L 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 230000003019 stabilising effect Effects 0.000 description 4
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 3
- 229940107816 ammonium iodide Drugs 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000001880 copper compounds Chemical class 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 150000003018 phosphorus compounds Chemical class 0.000 description 3
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- UNMYWSMUMWPJLR-UHFFFAOYSA-L Calcium iodide Chemical compound [Ca+2].[I-].[I-] UNMYWSMUMWPJLR-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229960002684 aminocaproic acid Drugs 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229940075417 cadmium iodide Drugs 0.000 description 2
- 229910001640 calcium iodide Inorganic materials 0.000 description 2
- 229940046413 calcium iodide Drugs 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 150000004694 iodide salts Chemical class 0.000 description 2
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 2
- 229910001641 magnesium iodide Inorganic materials 0.000 description 2
- 150000002696 manganese Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical group N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229960004839 potassium iodide Drugs 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 2
- 235000009518 sodium iodide Nutrition 0.000 description 2
- 229940083599 sodium iodide Drugs 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YJJKYKYXZZCJEE-UHFFFAOYSA-N 2,2-diphenylethylphosphane Chemical compound C=1C=CC=CC=1C(CP)C1=CC=CC=C1 YJJKYKYXZZCJEE-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- PZIJUXHDLWNNRW-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)phosphanyl]ethanol Chemical compound OCCP(CCO)CCO PZIJUXHDLWNNRW-UHFFFAOYSA-N 0.000 description 1
- QSVXMOKGHFNTEI-UHFFFAOYSA-N 2-bis[2-(dimethylamino)phenyl]phosphanyl-n,n-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1P(C=1C(=CC=CC=1)N(C)C)C1=CC=CC=C1N(C)C QSVXMOKGHFNTEI-UHFFFAOYSA-N 0.000 description 1
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 101100172879 Caenorhabditis elegans sec-5 gene Proteins 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- JNKICIJSCVMYQF-UHFFFAOYSA-N I.C(C)NCC1=CC=CC=C1 Chemical compound I.C(C)NCC1=CC=CC=C1 JNKICIJSCVMYQF-UHFFFAOYSA-N 0.000 description 1
- AQDOJAUQFWNAEP-UHFFFAOYSA-N N-methyloctadecan-1-amine hydroiodide Chemical compound I.CNCCCCCCCCCCCCCCCCCC AQDOJAUQFWNAEP-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 229910001615 alkaline earth metal halide Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- UKFWSNCTAHXBQN-UHFFFAOYSA-N ammonium iodide Chemical compound [NH4+].[I-] UKFWSNCTAHXBQN-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- JWLJBISFJGEYMT-UHFFFAOYSA-M benzyl(triethyl)azanium;iodide Chemical compound [I-].CC[N+](CC)(CC)CC1=CC=CC=C1 JWLJBISFJGEYMT-UHFFFAOYSA-M 0.000 description 1
- LRRJQNMXIDXNIM-UHFFFAOYSA-M benzyl(trimethyl)azanium;iodide Chemical compound [I-].C[N+](C)(C)CC1=CC=CC=C1 LRRJQNMXIDXNIM-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- WGYRINYTHSORGH-UHFFFAOYSA-N cyclohexylazanium;iodide Chemical compound [I-].[NH3+]C1CCCCC1 WGYRINYTHSORGH-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- HASCQPSFPAKVEK-UHFFFAOYSA-N dimethyl(phenyl)phosphine Chemical compound CP(C)C1=CC=CC=C1 HASCQPSFPAKVEK-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- USEXUESVOVNRHP-UHFFFAOYSA-M dodecyl(triethyl)azanium;iodide Chemical compound [I-].CCCCCCCCCCCC[N+](CC)(CC)CC USEXUESVOVNRHP-UHFFFAOYSA-M 0.000 description 1
- PXWSKGXEHZHFJA-UHFFFAOYSA-N dodecylazanium;iodide Chemical compound [I-].CCCCCCCCCCCC[NH3+] PXWSKGXEHZHFJA-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- VVJDJWDRCWLWDI-UHFFFAOYSA-N hexadecylazanium;iodide Chemical compound [I-].CCCCCCCCCCCCCCCC[NH3+] VVJDJWDRCWLWDI-UHFFFAOYSA-N 0.000 description 1
- 229940071870 hydroiodic acid Drugs 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- HBPSMMXRESDUSG-UHFFFAOYSA-N piperidine;hydroiodide Chemical compound I.C1CCNCC1 HBPSMMXRESDUSG-UHFFFAOYSA-N 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000010517 secondary reaction Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- DHWBYAACHDUFAT-UHFFFAOYSA-N tricyclopentylphosphane Chemical compound C1CCCC1P(C1CCCC1)C1CCCC1 DHWBYAACHDUFAT-UHFFFAOYSA-N 0.000 description 1
- CURCMGVZNYCRNY-UHFFFAOYSA-N trimethylazanium;iodide Chemical compound I.CN(C)C CURCMGVZNYCRNY-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- IWPNEBZUNGZQQQ-UHFFFAOYSA-N tripentylphosphane Chemical compound CCCCCP(CCCCC)CCCCC IWPNEBZUNGZQQQ-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
Definitions
- This invention relates to stabilised polyamides using copper compounds as stabilisers.
- Mouldings of polyamdes obtained by polymerising diamines with dicarboxylic acids or from aminocarboxylic acids or their lactarns; for example filaments, bristles or films, are deteriorated by the action of air and oxygen, particularly at elevated temperatures, to such an extent that their relative viscosity decreases whilst their strength and elasticity deteriorate. At the same time, the polyamide becomes progressively browner in colour.
- the known stabilisers have the disadvantage either that their stabilising action is too weak, as is the case, for example, with manganese salts, phosphorus compounds and phenols, or the disadvantage that they cause discolouration, particularly when they are added to the polyamide-forming starting mixture before polymerisation, as is the case for example with copper salts, or that they are sensitive to light and, over a period of time, discolour the polyamide, as is the case for example with aromatic amines and phenols.
- polyamides can be stabilised without the aforementioned disadvantages by using, as the stabiliser, a combination of (a) a salt of monovalent or bivalent copper with an inorganic or organic acid, and (b) aphosphine.
- a further object of this invention is to combine the stabilising mixture consisting of a copper salt and a phosphine with an inorganic or organic salt of hydriodic acid.
- the more difficulty volatile compounds from the triaryl-, trialkylor tri-(aryl-alkyD-phosphine series are preferably used in accordance with the invention as the phosphines.
- phosphines are triphenyl phosphine, tris-(dimethylaminophenyl)-phosphine, tritolyl phosphine, phenyldimethyl phosphine, dimethylarninophenyl-dimethyl phosphine, naphthyl diethyl phosphine, tributyl phosphine, tripentyl phosphine, trioctyl phosphine,
- Preferred copper salts are the cupric and cuprous salts of hydrohalic acids and hydrocyanic acid, and the copper salts of aliphatic carboxylic acids.
- Suitable copper salts are cuprous chloride, cuprous bromide, cuprous iodide, cuprous cyanide, cupric chloride, cupric acetate and cupric stearate.
- the copper salts are preferably added in such a quantity that the polyamide contains 0.0001 to 0.1% by weight, most preferably 0.001 to 0.02% by weight, of copper.
- the phosphorus compounds are preferably added in such a quantity that the polyamide contains 0.001 to 0.1% by weight, most preferably 0.001 to 0.05% by weight, of phosphorus.
- Ammonium iodide sodium iodide, potassium iodide, calcium iodide, magnesium iodide, zinc iodide or cadmium iodide.
- Hydriodides of primary amines such as hexadecylamine hydriodide; hexamethylene diamine dihydriodide and cyclohexylamine hydriodide.
- Hydriodides of secondary amines such as N-ethylbenzylamine hydriodide; piperidine hydriodide and N- methyloctadecylamine hydriodide.
- Hydriodides of tertiary amines such as N,N- dimethylbenzene-amine hydriodide; N,N,N-triethanolaminehydriodide; pyridine hydriodide; trioctadecylaminehydriodide and N,N-dimethyldodecylamine hydriodide.
- Iodides of quaternary ammonium compounds such as N-benzyl-N,N,N-trimethylammonium iodide; N-ethyl- N-benzyl-N,N-diethylammonium iodide; N-dodecyl-N,N, N-triethyl-ammonium iodide and N,N,N,N',N,N-hexamethyl-N,N-ethylene-bis-ammonium iodide.
- Hydriodides of aminocarboxylic acid esters and amides such as N,N-dimethyl-6-aminocaproic acidmorpholide hydriodide; N,N dimethyl 6 aminocaproic acid dodecylamide hydriodide; N-methyl-N-cyclohexyl-6- aminocaproic acid ethyl ester hydriodide and N,N-dimethyl-1l-aminoundec-anic acid anilaide hydriodide.
- Iodides of carbamylamrnonium compounds such as N- (N-dodecylcarbamylpentyl) N,N,N trimethylammonium iodide and N-(N'-3,4-dichlorophenylcarbamylpentyl) -N,N,N-trimethylammonium iodide.
- the inorganic or organic salts of hydriodic acid are preferably added in such quantity that the polyamide contains 0.001 to 5% by weight, most preferably 0.01 to 1.0% by weight, of iodine.
- the combinations according to the invention of copper salts and phosphorus compounds can be either mixtures of the components, or stable, crystallised addition compounds of phosphines and substances correspond ing to the formula CuX, in which X represents chlorine, bromine, iodine or cyanogen.
- X represents chlorine, bromine, iodine or cyanogen.
- Example of these addition compounds which can be obtained from the components, optionally at elevated temperature, are CuC1 2 triphenyl phosphine, CuBr 2 triphenyl phosphine, CuI tri-nbutylphosphine, CuI .tri-n-pentylphosphine, Cul X 2 triphenyl phosphine and CuCNXtriphenyl phosphine.
- the stabiliser combinations according to the invention may be added to the polyamide-forming starting mixture before polymerisation, after which polymerisation may be carried out either continuously or in batches, as known per se, Without there being any discolouration of the polyamide melt.
- the polyamides may also contain the usual additives such as pigments, dyes, light stabilisers, fillers such as glass fibres, lubricants, mould-release agents and crystallisation activators.
- polyamides stabilised in accordance with the invention against, in particular, damage by oxidation at elevated temperatures are eminently suitable for the production of industrial silk for fishing nets, drive belts, conveyor belts, tyre cord and mouldings exposed to thermal stressing in the presence of air or oxygen.
- the advantages set out below can be obtained by using copper compounds in combination with phosphines, optionally together with inorganic or organic salts of hydriodic acid. These advantages can be explained by the chemical resistance of the phosphines to hydrolysing or decomposing agents, and by the fact that secondary reactions involving the products of hydrolysis or decomposition are avoided.
- EXAMPLE 1 A mixture of 1.1 kg. of caprolactam, 35 g. of aminocaproic acid and 0.79 g. of CuCI 2 triphenyl phosphine (corresponding to 0.008% by weight of copper and 0.008% by weight of phosphorus in the end product), is polycondensed in the usual way in an auto clave at a temperature of 270 C. The resulting polyamide is then spun into a filament, chapped into granular form, freed from monomeric components by boiling with water and then dried. The resulting product is completely colourless and has a relative viscosity of 3.12 (measured on a 1% by Weight solution in m-cresol). In order to test the stability of the product to atmospheric oxidation, it is stored at 150 C. in a drying cabinet to which air has free access. After 144 hours, its relative viscosity is 3.46, after 500 hours it is 3.16 and after 1000 hours it is 2.96.
- EXAMPLE 2 As in Example 1, a polyamide with a relative viscosity of 3.18 is prepared from 0.30 g. of Cu(II)Cl 2I-l O (corresponding to 0.011% by weight of copper in the end product) and 0.52 g. of tripheuyl phosphine (corresponding to 0.006% by weight of phosphorus in the end product). The product is completely colourless. After it has been stored at 150 C. in a drying cabinet to which air has free access, its relative viscosity is 3.48 after 144 hours, 3.09 after 500 hours and 2.94 after 1000 hours. A polyamide prepared under identical conditions, except that only 0.30 g. of Cu(II)Cl 2H O are added, is greenish in colour.
- EXAMPLE 3 2 kg. of polycaprolactam with a relative viscosity of 3.15 are fused by means of a conventional screw extruder EXAMPLE 4 As in Example 3, a polyamide with a relative viscosity of 3.01 is prepared from 0.35 g. of Cu(II)-acetate H O (corresponding to 0.006% by weight of copper) and 0.44 g. of diphenyl ethyl phosphine (corresponding to 0.003% phosphorus). The product is completely colourless. After it has been stored at C in a drying cabinet to which air has free access, its relative viscosity is 3.24 after 144 hours, 3.05 after 500 hours and 2.92 after 1000 hours. A polyamide prepared under identical conditions, except that only 0.35 g. to Cu(-II)-acetate were added, is slightly greyish-green in colour.
- a deep blue-grey coloured polyamide is obtained from 0.50 g. of Cu(I)-I- triisopropyl phosphite (corresponding to 0.008% by weight of copper and 0.004% by weight of phosphorus in the end product).
- a deep-blue-grey coloured polyamide is obtained from 0.32 g. of Ou(II)- Cl .2H O (corresponding to 0.012% by weight of copper in the end product) and 1.24 g. of trinonylphenyl phos phite (corresponding to 0.006% by weight of phosphorus in the end product).
- Triphenyl phosphine on its own does not have any stabilising effect on polyamides. This is demonstrated by the following comparison test:
- EXAMPLE 5 1 kg. of a conventionally prepared colourless polycaprolactam with a relative viscosity of 3.12 (measured on a 1% by weight solution in m-cresol), is fused by means of a conventional screw extruder in which it is homogeneously mixed "with various stabilisers. The stabilised polycaprolactam is spun itno a filament of approx. 3 mm. diameter, chopped into granular form and dried. The granulate is then stored at 150 C. in a drying cabinet to which air has free access, and its relative viscosity measured after 144, 500 and 1000 hours.
- ammonium iodide 9 "do 1. 57 0. 056 .do 1. 26 0. 011 0. 011 do 3. 05 3. 81 3. 48 3. 12 10 N-ethyl-N-benzyl-N,N- 1.28 0.056 bib(10 1.26 0.011 0.011 do 3.06 3.82 3.55 3,38
- ammonium hydroiodide g N,N41imethyl-fi-amino-caproie 2.01 0.056 .d0 1.26 0.011 0,011 Do.
- a thermally stabilised polyamide comprising a high molecular weight polyamide and as stabilising agents admixed therewith (a) a copper salt selected from the group consisting of a chloride, bromide, iodide, cyanide, and a salt of an aliphatic carboxylic acid of monovalent and bivalent copper, and (b) a tertiary phosphine, said copper salt being present in such a quantity that the polyamide contains 0.0001 to 0.1% by weight of copper, said phosphine being present in such a quantity that the polyamide contains 0.001 to 0.1% by weight of phosphorus.
- a thermally stabilised polyamide comprising a high molecular weight polyamide and as stabilising agents admixed therewith (a) a copper salt selected from the group consisting of a chloride, bromide, iodide, cyanide, and a salt of an aliphatic carboxylic acid of monovalent and bivalent copper, (b) a phosphine, and (c) a salt of hydroiodic acid selected from the group consisting of ammonium iodide, sodium iodide, potassium iodide, calcium iodide, magnesium iodide, zinc iodide, cadmium iodide, 21 hydroiodide of a primary amine, a hydroiodide of a sec- 5 wherein said salt of hydriodic acid is potassium iodide.
- a copper salt selected from the group consisting of a chloride, bromide, iodide, cyanide, and a salt of an
- thermoly stabilised polyamide of claim 2 wherin said salt of hydriodic acid is N,N-dimethyldodecy1- amine hydroiodide.
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Description
United States Patent US. Cl. 26045.75 4 Claims ABSTRACT OF THE DISCLOSURE A thermally stabilised polyamide comprising a high' molecular weight polyamide and as a stabilising agent a combination of copper salt and a phosphine and optionally an inorganic or organic salt of hydriodic acid.
This invention relates to stabilised polyamides using copper compounds as stabilisers.
Mouldings of polyamdes obtained by polymerising diamines with dicarboxylic acids or from aminocarboxylic acids or their lactarns; for example filaments, bristles or films, are deteriorated by the action of air and oxygen, particularly at elevated temperatures, to such an extent that their relative viscosity decreases whilst their strength and elasticity deteriorate. At the same time, the polyamide becomes progressively browner in colour.
It is known that polyamides can be protected against deterioration by the action of air and oxygen at elevated temperatures by the addition of stabilisers. The following compounds, for example, have already been used as stabilisers: manganese salts of inorganic or organic acids; copper salts of inorganic or organic acids; derivatives of the oxyacids of phosphorus; aromatic amines and phenols. Combinations of these groups of compounds with one another or with compounds Whch, on their own, have no stabilising action, such as alkali metal halides, alkaline earth metal halides, iodine and arylsulphonic acids, have also been used to advantage.
The known stabilisers, however, have the disadvantage either that their stabilising action is too weak, as is the case, for example, with manganese salts, phosphorus compounds and phenols, or the disadvantage that they cause discolouration, particularly when they are added to the polyamide-forming starting mixture before polymerisation, as is the case for example with copper salts, or that they are sensitive to light and, over a period of time, discolour the polyamide, as is the case for example with aromatic amines and phenols.
It has now been found that polyamides can be stabilised without the aforementioned disadvantages by using, as the stabiliser, a combination of (a) a salt of monovalent or bivalent copper with an inorganic or organic acid, and (b) aphosphine.
A further object of this invention is to combine the stabilising mixture consisting of a copper salt and a phosphine with an inorganic or organic salt of hydriodic acid.
The more difficulty volatile compounds from the triaryl-, trialkylor tri-(aryl-alkyD-phosphine series are preferably used in accordance with the invention as the phosphines. Examples of such phosphine are triphenyl phosphine, tris-(dimethylaminophenyl)-phosphine, tritolyl phosphine, phenyldimethyl phosphine, dimethylarninophenyl-dimethyl phosphine, naphthyl diethyl phosphine, tributyl phosphine, tripentyl phosphine, trioctyl phosphine,
3,505,285 Patented Apr. 7, 1970 ICC tris-(hydroxy-ethyl)-phosphine and tricyclopentyl-phosphine.
Preferred copper salts are the cupric and cuprous salts of hydrohalic acids and hydrocyanic acid, and the copper salts of aliphatic carboxylic acids.
Examples of suitable copper salts are cuprous chloride, cuprous bromide, cuprous iodide, cuprous cyanide, cupric chloride, cupric acetate and cupric stearate.
The copper salts are preferably added in such a quantity that the polyamide contains 0.0001 to 0.1% by weight, most preferably 0.001 to 0.02% by weight, of copper. The phosphorus compounds are preferably added in such a quantity that the polyamide contains 0.001 to 0.1% by weight, most preferably 0.001 to 0.05% by weight, of phosphorus.
Example of suitable inorganic or organic salts of hydriodic acids are:
(1) Ammonium iodide, sodium iodide, potassium iodide, calcium iodide, magnesium iodide, zinc iodide or cadmium iodide.
(2) Hydriodides of primary amines, such as hexadecylamine hydriodide; hexamethylene diamine dihydriodide and cyclohexylamine hydriodide.
(3) Hydriodides of secondary amines, such as N-ethylbenzylamine hydriodide; piperidine hydriodide and N- methyloctadecylamine hydriodide.
(4) Hydriodides of tertiary amines, such as N,N- dimethylbenzene-amine hydriodide; N,N,N-triethanolaminehydriodide; pyridine hydriodide; trioctadecylaminehydriodide and N,N-dimethyldodecylamine hydriodide.
(5) Iodides of quaternary ammonium compounds, such as N-benzyl-N,N,N-trimethylammonium iodide; N-ethyl- N-benzyl-N,N-diethylammonium iodide; N-dodecyl-N,N, N-triethyl-ammonium iodide and N,N,N,N',N,N-hexamethyl-N,N-ethylene-bis-ammonium iodide.
(6) Hydriodides of aminocarboxylic acid esters and amides, such as N,N-dimethyl-6-aminocaproic acidmorpholide hydriodide; N,N dimethyl 6 aminocaproic acid dodecylamide hydriodide; N-methyl-N-cyclohexyl-6- aminocaproic acid ethyl ester hydriodide and N,N-dimethyl-1l-aminoundec-anic acid anilaide hydriodide.
(7) Iodides of carbamylamrnonium compounds, such as N- (N-dodecylcarbamylpentyl) N,N,N trimethylammonium iodide and N-(N'-3,4-dichlorophenylcarbamylpentyl) -N,N,N-trimethylammonium iodide.
The inorganic or organic salts of hydriodic acid are preferably added in such quantity that the polyamide contains 0.001 to 5% by weight, most preferably 0.01 to 1.0% by weight, of iodine.
The combinations according to the invention of copper salts and phosphorus compounds can be either mixtures of the components, or stable, crystallised addition compounds of phosphines and substances correspond ing to the formula CuX, in which X represents chlorine, bromine, iodine or cyanogen. Example of these addition compounds which can be obtained from the components, optionally at elevated temperature, are CuC1 2 triphenyl phosphine, CuBr 2 triphenyl phosphine, CuI tri-nbutylphosphine, CuI .tri-n-pentylphosphine, Cul X 2 triphenyl phosphine and CuCNXtriphenyl phosphine.
The stabiliser combinations according to the invention may be added to the polyamide-forming starting mixture before polymerisation, after which polymerisation may be carried out either continuously or in batches, as known per se, Without there being any discolouration of the polyamide melt.
It is also possible, however, to mix the stabilisers according to the invention with the polyamide melt, either during or after polymerisation, in which case known mixing units, such as extruders or kneaders, may be used.
In addition to the stabilisers according to the invention, the polyamides may also contain the usual additives such as pigments, dyes, light stabilisers, fillers such as glass fibres, lubricants, mould-release agents and crystallisation activators.
The polyamides stabilised in accordance with the invention against, in particular, damage by oxidation at elevated temperatures, are eminently suitable for the production of industrial silk for fishing nets, drive belts, conveyor belts, tyre cord and mouldings exposed to thermal stressing in the presence of air or oxygen.
Broadly speaking, the advantages set out below can be obtained by using copper compounds in combination with phosphines, optionally together with inorganic or organic salts of hydriodic acid. These advantages can be explained by the chemical resistance of the phosphines to hydrolysing or decomposing agents, and by the fact that secondary reactions involving the products of hydrolysis or decomposition are avoided.
No discoloured products are formed in cases where addition precedes polymerisation and where screw extruders are used for mixing. The use of screw extruders is not accompanied by the formation of partly crosslinked products (as is the case, for example, when aliphatic or aromatic esters of phosphoric or phosphorous acid are used, cf. comparison Example 4), or by corrosion (as in the case, for example, when halides of phosphoric or phosphorous acids are used). In addition, there is no additional chain-terminating effect where addition precedes polymerisation (as is the case, for example, with phosphoric or phosphorous acids or hydrolysable derivatives thereof).
The following examples illustrate more specifically the invention.
EXAMPLE 1 A mixture of 1.1 kg. of caprolactam, 35 g. of aminocaproic acid and 0.79 g. of CuCI 2 triphenyl phosphine (corresponding to 0.008% by weight of copper and 0.008% by weight of phosphorus in the end product), is polycondensed in the usual way in an auto clave at a temperature of 270 C. The resulting polyamide is then spun into a filament, chapped into granular form, freed from monomeric components by boiling with water and then dried. The resulting product is completely colourless and has a relative viscosity of 3.12 (measured on a 1% by Weight solution in m-cresol). In order to test the stability of the product to atmospheric oxidation, it is stored at 150 C. in a drying cabinet to which air has free access. After 144 hours, its relative viscosity is 3.46, after 500 hours it is 3.16 and after 1000 hours it is 2.96.
In the case of a comparison product of identical rela tive viscosity in which no stabiliser was present, the relative viscosity dropped under the same conditions to 2.61 after 144 hours, to 2.36 after 500 hours and to 2.21 after 1000 hours. In addition, the comparison product became much darker brown in colour considerably more quickly.
EXAMPLE 2 As in Example 1, a polyamide with a relative viscosity of 3.18 is prepared from 0.30 g. of Cu(II)Cl 2I-l O (corresponding to 0.011% by weight of copper in the end product) and 0.52 g. of tripheuyl phosphine (corresponding to 0.006% by weight of phosphorus in the end product). The product is completely colourless. After it has been stored at 150 C. in a drying cabinet to which air has free access, its relative viscosity is 3.48 after 144 hours, 3.09 after 500 hours and 2.94 after 1000 hours. A polyamide prepared under identical conditions, except that only 0.30 g. of Cu(II)Cl 2H O are added, is greenish in colour.
EXAMPLE 3 2 kg. of polycaprolactam with a relative viscosity of 3.15 are fused by means of a conventional screw extruder EXAMPLE 4 As in Example 3, a polyamide with a relative viscosity of 3.01 is prepared from 0.35 g. of Cu(II)-acetate H O (corresponding to 0.006% by weight of copper) and 0.44 g. of diphenyl ethyl phosphine (corresponding to 0.003% phosphorus). The product is completely colourless. After it has been stored at C in a drying cabinet to which air has free access, its relative viscosity is 3.24 after 144 hours, 3.05 after 500 hours and 2.92 after 1000 hours. A polyamide prepared under identical conditions, except that only 0.35 g. to Cu(-II)-acetate were added, is slightly greyish-green in colour.
Comparison tests demonstrating the technical advance of the combination of copper compounds with phosphines over combinations with other phosphines, are set out in the following:
(a) A mixture of 1.1 kg. of caprolactam, 35 g. of aminocaproic acid and 0.91 g. of Cu(I)-Cl 2 tripheuyl phosphite (corresponding to 0.008% by weight of copper and 0.009% by weight of phosphorus in the end product) is polycondensed in the usual way in an autoclave at a temperature of 270 C. The resulting polyamide is then spun into a filament, chopped into granular form, freed from monomeric components by boiling with water and then dried. The resulting product is deep blue-grey in colour.
(b) As in comparison example (a), a deep blue-grey coloured polyamide is obtained from 0.50 g. of Cu(I)-I- triisopropyl phosphite (corresponding to 0.008% by weight of copper and 0.004% by weight of phosphorus in the end product).
(c) As in comparison example (a), a deep-blue-grey coloured polyamide is obtained from 0.32 g. of Ou(II)- Cl .2H O (corresponding to 0.012% by weight of copper in the end product) and 1.24 g. of trinonylphenyl phos phite (corresponding to 0.006% by weight of phosphorus in the end product).
((1) 2 kg. of colourless polycaprolactam with a relative viscosity of 3.15 are fused by means of a conventional screw extruder in which they are homogeneously mixed with 1.44 g. of Cu(I)Cl-triphenyl phosphite (corresponding to 0.011% by weight of copper and 0.0055% by weight of phosphorus). The product is then spun into a filament, chopped into granular form and dried. It is reddish-brown in colour and has a relative viscosity of 3.38.
Triphenyl phosphine on its own does not have any stabilising effect on polyamides. This is demonstrated by the following comparison test:
2 kg. of polycaprolactam with a relative viscosity of 3.11 are fused by means of a conventional screw extruder in which they are mixed with 10 g. of triphenyl phosphine (corresponding to 0.059% by weight of phosphorus). The polyamide is then spun into a filament, chopped into granular form and dried. It is colourless and has a relative viscosity of 3.02. After it has been stored at 150 C. in a drying cabinet to which air has free access, its relative viscosity drops to 2.65 after 144 hours, to 2.48 after 500 hours and to 2.24 after 1000 hours.
EXAMPLE 5 1 kg. of a conventionally prepared colourless polycaprolactam with a relative viscosity of 3.12 (measured on a 1% by weight solution in m-cresol), is fused by means of a conventional screw extruder in which it is homogeneously mixed "with various stabilisers. The stabilised polycaprolactam is spun itno a filament of approx. 3 mm. diameter, chopped into granular form and dried. The granulate is then stored at 150 C. in a drying cabinet to which air has free access, and its relative viscosity measured after 144, 500 and 1000 hours.
ondary amine, a hydroiodide of a tertiary amine, an iodide of a quaternary ammonium compound, a hydroiodide of an amino carboxylic acid ester, 21 hydroiodide of an amino carboxylic acid amide, and an iodide of a carbamyl ammonium compound, said copper salt being present in such 5 The test results are Set out In Table a quantity that the polyamide contains 0.0001 to 0.1% by EXAMPLE 6 Weight of copper, said phosphme being present in such A mixture of 1.0 kg. of caprolactam, 35 g. of amino- 3 l g tlfiat i g il z to 9 caprorc acid and the stabllisers set out 1n Table II, 18 poly- Welg t P osp orus sa t o y acld belng condensed in the usual Way in an autoclave at a tempera 10 present in such a quantity that the polyamlde contalns ture of 270 C. The colour of the resulting polyamides 1s O-OOI t y Welght of lodlneshown in Table II. 3. The thermally stabilised polyamide of claim 2,
TABLE I Relative viscosity Percent Percent Percent Colour after- I in the Cu in P in the of the polythe polypolypoly- After 144 500 1,000 No. Iodide g amide Cu-eompound amide amide amide mixing hours hours hours 0. 38 011(1) Cl-1 triphenyl 0. 64 0. 011 0. 0055 Colour- 2. 98 4. 09 3. 84 3. 60
phosphine. less. 0.17 Cu(I)-I-2 triphenyl 1.26 0.011 0. 011 do.. 3. 12 4.17 3.89 3.66
phosphine. 0. do 1. 26 0. 011 0. 011 do 3. 08 3. 71 3. 55 3. 0.76 Cu(I)CN- triphenyl 1.20 0.11 0.011 do 3.03 4.40 4.21 3.75
phosphine. 0.38 C11(I)Br-1 triphenyl 0.54 0.0085 0.004 d0 3.06 4.04 3.70 3.35
phosphine. 6 N,N-dimethyl-dodecylamine l. 0. 056 Cu(I)-I-2 triphenyl 1. 26 0. 011 0. 011 do 3. 10 3. 92 3. 56 3. 20
hydroiodide. phosphine. 7 N,N-dimethyl-benzylamine 1. 16 0. 056 do 1. 26 0. 011 0. 011 do 3. 05 3. 86 3. 3. 16
hydro-iodide. 8 N-dodecyl-N,N,N-trimethyl- 0. 63 0. 022 do 1. 26 0. 011 0. 011 do. 3. 05 3. 64 3. 25 2. 97
ammonium iodide. 9 "do 1. 57 0. 056 .do 1. 26 0. 011 0. 011 do 3. 05 3. 81 3. 48 3. 12 10 N-ethyl-N-benzyl-N,N- 1.28 0.056 .....(10 1.26 0.011 0.011 do 3.06 3.82 3.55 3,38
dimethylammom'nm iodide. 11 N,N-dimethyl-6-amino- 2. 01 0. 056 do 1. 26 0. 011 0. 011 do. 3. 05 3. 86 3. 72 3. 25
caproic acid dodecyl amide hydro-iodide. 12 N-(N-3,4diehlorophenyl 0. 79 0 022 dO 1 26 0. 011 0. 011 do. 3. 08 3. 65 3. 29 3. 06
carbamyl-pentyl)N,N,N- trimethyl-ammonium 13 d0 1. 26 0.011 0.011 do 3.12 3.43 3.12 2.00 14 -410-.- 3. O0 2. 73 2. 36 2. 21
TABLE II Percent I Percent Cu Percent P Colour Test in the in t e in the of the No. Iodide G. polyamlde 011-compound G. polyamide polyamide polyamide 1 KI 5.0 07 38 Cu(I)C1-1tripheny1phosphine. 0.64 0. 011 0.0055 colourless. 2 KI 2. 0 0.17 Cu(I)I-2 triphenyl phosphine 1.26 0.011 0.011 Do. 3 KI..- 1.0 0.10 do 1.26 0. 011 0. 011 Do. 10.0 0.76 Cu(I)CN-2 triphenylphosp 1.10 0.011 0.011 Do. KI 5. 0 0.38 Cu(I)Br-1 triphenyl phosphine. 0. 54 0.0085 0.004 Do. ,N-dimethyLdodecylamine- 1. 50 0. 056 Cu(I)I-2 triphenyl phosphine 1. 26 0. 011 0. 011 D0.
hydroiodide. 7 N-dodecyl-N,N,N-trimethy1 1.57 0.056 d0 1.26 0.011 0011 Do,
ammonium hydroiodide. g N,N41imethyl-fi-amino-caproie 2.01 0.056 .d0 1.26 0.011 0,011 Do.
acid dodecylaminehydroiodide. 9 KI 5.0 0.38 Cu( I) 01521120 triphenyl 0. 27 0.011 0,0 5 Do,
phosphine. 0. 42 10 KI 5.0 0- 8 C11( z-2Hz0 0.27 0.011 Greenish.
What we claim is:
1. A thermally stabilised polyamide comprising a high molecular weight polyamide and as stabilising agents admixed therewith (a) a copper salt selected from the group consisting of a chloride, bromide, iodide, cyanide, and a salt of an aliphatic carboxylic acid of monovalent and bivalent copper, and (b) a tertiary phosphine, said copper salt being present in such a quantity that the polyamide contains 0.0001 to 0.1% by weight of copper, said phosphine being present in such a quantity that the polyamide contains 0.001 to 0.1% by weight of phosphorus.
2. A thermally stabilised polyamide comprising a high molecular weight polyamide and as stabilising agents admixed therewith (a) a copper salt selected from the group consisting of a chloride, bromide, iodide, cyanide, and a salt of an aliphatic carboxylic acid of monovalent and bivalent copper, (b) a phosphine, and (c) a salt of hydroiodic acid selected from the group consisting of ammonium iodide, sodium iodide, potassium iodide, calcium iodide, magnesium iodide, zinc iodide, cadmium iodide, 21 hydroiodide of a primary amine, a hydroiodide of a sec- 5 wherein said salt of hydriodic acid is potassium iodide.
4. The thermally stabilised polyamide of claim 2, wherin said salt of hydriodic acid is N,N-dimethyldodecy1- amine hydroiodide.
References Cited UNITED STATES PATENTS DONALD E. CZAJA, Primary Examiner V. P. HOKE, Assistant Examiner US. Cl. X.R.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DEF47169A DE1237309B (en) | 1965-09-11 | 1965-09-11 | Process for the production of heat-stabilized polyamides |
DEF48224A DE1245591B (en) | 1965-09-11 | 1966-01-21 | Process for the production of stabilized polyamides |
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US3505285A true US3505285A (en) | 1970-04-07 |
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US576831A Expired - Lifetime US3505285A (en) | 1965-09-11 | 1966-09-02 | Stabilised polyamides containing a copper salt and a phosphine |
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US (1) | US3505285A (en) |
AT (1) | AT259873B (en) |
BE (1) | BE686692A (en) |
CH (1) | CH472458A (en) |
DE (2) | DE1237309B (en) |
DK (1) | DK116244B (en) |
ES (1) | ES331089A1 (en) |
GB (1) | GB1084699A (en) |
NL (1) | NL6612672A (en) |
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US3666717A (en) * | 1969-04-15 | 1972-05-30 | Ici Ltd | Polyamides stabilized with a phosphine |
US4043972A (en) * | 1975-10-06 | 1977-08-23 | Phillips Fibers Corporation | Stabilizing polyamide antistatic compositions |
US4937276A (en) * | 1987-05-22 | 1990-06-26 | Bayer Aktiengesellschaft | Glass-fiber-reinforced stabilized polyamide molding compositions |
US5686513A (en) * | 1996-09-09 | 1997-11-11 | Zimmer Aktiengesellschaft | Process for the production of stabilizer concentrate for polyamide |
US6011099A (en) * | 1996-04-19 | 2000-01-04 | Basf Aktiengesellschaft | Oxidation-stabilized polyamide molding materials |
WO2017174949A1 (en) | 2016-04-08 | 2017-10-12 | Arkema France | Polyamide-based composition for pipes containing oil or gas |
WO2017174948A1 (en) | 2016-04-08 | 2017-10-12 | Arkema France | Composition comprising thermoplastic polymer and copper-based stabilizer, and production and use thereof |
WO2018220105A1 (en) | 2017-06-02 | 2018-12-06 | Arkema France | Composition containing polyamide for coolant pipes |
WO2020249899A1 (en) | 2019-06-11 | 2020-12-17 | Arkema France | Polyamide compositions having a high modulus and a low dielectric constant and use thereof |
WO2021191547A1 (en) | 2020-03-24 | 2021-09-30 | Arkema France | Moulding compositions reinforced with glass fibres having improved impact properties |
WO2021250352A1 (en) | 2020-06-10 | 2021-12-16 | Arkema France | Polyamide compositions having a high modulus and a low dielectric constant and use thereof |
WO2023275463A1 (en) | 2021-06-28 | 2023-01-05 | Arkema France | Blow molding compositions based on branched polyamides and uses thereof |
WO2023275464A1 (en) | 2021-06-28 | 2023-01-05 | Arkema France | Blow molding compositions based on branched polyamides and uses thereof |
WO2023049161A1 (en) * | 2021-09-21 | 2023-03-30 | Ascend Performance Materials Operations Llc | Stabilizing component for polyamide resin composition |
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US3666675A (en) * | 1970-01-21 | 1972-05-30 | Univ Temple | Method for producing luminescence using complex luminescent materials |
US3806487A (en) * | 1972-07-03 | 1974-04-23 | Monsanto Co | Stabilization of pigmented nylon against actinic radiation |
DE3917294A1 (en) † | 1989-05-27 | 1990-11-29 | Huels Chemische Werke Ag | HIGH POLYMERS MATERIALS LABELABLE WITH LASER LIGHT |
DE4020447A1 (en) * | 1990-06-27 | 1992-01-02 | Bayer Ag | STABILIZER COMBINATIONS AND THEIR USE FOR THE PRODUCTION OF STABILIZED, IMPACT-MODIFIED POLYAMIDES |
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US2510777A (en) * | 1946-12-30 | 1950-06-06 | Du Pont | Polyamide treated with a hypophosphorous acid compound |
US2705227A (en) * | 1954-03-15 | 1955-03-29 | Du Pont | Heat stabilization of polyamides |
GB839067A (en) * | 1957-04-11 | 1960-06-29 | Inventa Ag | Improvements relating to the production of objects from synthetic linear polyamide |
GB864701A (en) * | 1958-07-18 | 1961-04-06 | Ici Ltd | Improved polyamide resins |
US3428597A (en) * | 1965-02-02 | 1969-02-18 | Stamicarbon | Stabilization of polyamides |
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DE1152816B (en) * | 1962-01-27 | 1963-08-14 | Basf Ag | Process for making stabilized polyamides |
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1965
- 1965-09-11 DE DEF47169A patent/DE1237309B/en active Pending
-
1966
- 1966-01-21 DE DEF48224A patent/DE1245591B/en active Pending
- 1966-08-03 CH CH1119266A patent/CH472458A/en not_active IP Right Cessation
- 1966-08-18 GB GB37073/66A patent/GB1084699A/en not_active Expired
- 1966-08-22 AT AT795366A patent/AT259873B/en active
- 1966-08-29 SE SE11629/66A patent/SE301382B/xx unknown
- 1966-09-02 US US576831A patent/US3505285A/en not_active Expired - Lifetime
- 1966-09-08 NL NL6612672A patent/NL6612672A/xx unknown
- 1966-09-08 DK DK461666AA patent/DK116244B/en unknown
- 1966-09-09 BE BE686692D patent/BE686692A/xx unknown
- 1966-09-10 NO NO164675A patent/NO115681B/no unknown
- 1966-09-10 ES ES0331089A patent/ES331089A1/en not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2510777A (en) * | 1946-12-30 | 1950-06-06 | Du Pont | Polyamide treated with a hypophosphorous acid compound |
US2705227A (en) * | 1954-03-15 | 1955-03-29 | Du Pont | Heat stabilization of polyamides |
GB839067A (en) * | 1957-04-11 | 1960-06-29 | Inventa Ag | Improvements relating to the production of objects from synthetic linear polyamide |
GB864701A (en) * | 1958-07-18 | 1961-04-06 | Ici Ltd | Improved polyamide resins |
US3428597A (en) * | 1965-02-02 | 1969-02-18 | Stamicarbon | Stabilization of polyamides |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3666717A (en) * | 1969-04-15 | 1972-05-30 | Ici Ltd | Polyamides stabilized with a phosphine |
US4043972A (en) * | 1975-10-06 | 1977-08-23 | Phillips Fibers Corporation | Stabilizing polyamide antistatic compositions |
US4937276A (en) * | 1987-05-22 | 1990-06-26 | Bayer Aktiengesellschaft | Glass-fiber-reinforced stabilized polyamide molding compositions |
US6011099A (en) * | 1996-04-19 | 2000-01-04 | Basf Aktiengesellschaft | Oxidation-stabilized polyamide molding materials |
US5686513A (en) * | 1996-09-09 | 1997-11-11 | Zimmer Aktiengesellschaft | Process for the production of stabilizer concentrate for polyamide |
WO2017174949A1 (en) | 2016-04-08 | 2017-10-12 | Arkema France | Polyamide-based composition for pipes containing oil or gas |
WO2017174948A1 (en) | 2016-04-08 | 2017-10-12 | Arkema France | Composition comprising thermoplastic polymer and copper-based stabilizer, and production and use thereof |
WO2018220105A1 (en) | 2017-06-02 | 2018-12-06 | Arkema France | Composition containing polyamide for coolant pipes |
WO2020249899A1 (en) | 2019-06-11 | 2020-12-17 | Arkema France | Polyamide compositions having a high modulus and a low dielectric constant and use thereof |
FR3097226A1 (en) | 2019-06-11 | 2020-12-18 | Arkema France | POLYAMIDE COMPOSITIONS WITH HIGH MODULE AND LOW DIELECTRIC CONSTANT AND THEIR USE |
WO2021191547A1 (en) | 2020-03-24 | 2021-09-30 | Arkema France | Moulding compositions reinforced with glass fibres having improved impact properties |
FR3108615A1 (en) | 2020-03-24 | 2021-10-01 | Arkema France | MOLDING COMPOSITIONS REINFORCED WITH GLASS FIBERS HAVING IMPROVED IMPACT PROPERTIES |
WO2021250352A1 (en) | 2020-06-10 | 2021-12-16 | Arkema France | Polyamide compositions having a high modulus and a low dielectric constant and use thereof |
FR3111351A1 (en) | 2020-06-10 | 2021-12-17 | Arkema France | POLYAMIDE COMPOSITIONS WITH HIGH MODULE AND LOW DIELECTRIC CONSTANT AND THEIR USE |
WO2023275463A1 (en) | 2021-06-28 | 2023-01-05 | Arkema France | Blow molding compositions based on branched polyamides and uses thereof |
WO2023275464A1 (en) | 2021-06-28 | 2023-01-05 | Arkema France | Blow molding compositions based on branched polyamides and uses thereof |
WO2023049161A1 (en) * | 2021-09-21 | 2023-03-30 | Ascend Performance Materials Operations Llc | Stabilizing component for polyamide resin composition |
Also Published As
Publication number | Publication date |
---|---|
NL6612672A (en) | 1967-03-13 |
NO115681B (en) | 1968-11-11 |
SE301382B (en) | 1968-06-04 |
ES331089A1 (en) | 1967-09-16 |
BE686692A (en) | 1967-02-15 |
DK116244B (en) | 1969-12-22 |
AT259873B (en) | 1968-02-12 |
CH472458A (en) | 1969-05-15 |
DE1237309B (en) | 1967-03-23 |
GB1084699A (en) | 1967-09-27 |
DE1245591B (en) | 1967-07-27 |
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