US2447979A - Copper base alloy for metal evaporation - Google Patents
Copper base alloy for metal evaporation Download PDFInfo
- Publication number
- US2447979A US2447979A US543634A US54363444A US2447979A US 2447979 A US2447979 A US 2447979A US 543634 A US543634 A US 543634A US 54363444 A US54363444 A US 54363444A US 2447979 A US2447979 A US 2447979A
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- US
- United States
- Prior art keywords
- copper
- metal
- base alloy
- metal evaporation
- copper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/044—Vacuum
Definitions
- An object of the invention is to improve the evaporation of copper and its alloys.
- Figure 1 is a sectional elevation of a metal evaporation apparatus
- Figure 2 is a fragmentary cross-section of the tungsten filament coated with the metal to be evaporated.
- Figure 3 shows a wire loop of the metal.
- the metal to be evaporated is usually hung on a tungsten filament as small loops of wire. Electric current is then passed through the lament to heat it and the wire loops are melted and the fused metal clings to the filament and evaporates as the heating is continued.
- One diiiiculty which has been encountered with silver and copper has been the failure of these metals to wet the tungsten sufciently to cling to it during the vaporization process.
- the metal tends to ball up and drop olf the filament before it can be evaporated. It also sometimes tends to spatter during evaporation, probably due to the accumulation of the liquid metal in large globules.
- Platinum 5.00 Copper Balance 2 or iron may be present in percentages ranging from .001 to .5%.
- Figure 1 shows a metal vaporization apparatus comprising a bell jar I0 resting on a pump plate II with a rubber gasket I 2 between them to afford a gas seal.
- the bell jar is connected to a vacuum pump through pipe I3 and a Pirani gauge I4 may be provided to measure the degree of vacuum obtained.
- the articles to be coated with a thin film of copper such as glass plates or mirror blanks I5 are mounted on the inside wall of a cylindrical container I6 supported within the bell jar.
- the tungsten filament I'I is mounted axially within the container and connected to insulated terminals I8 and I9.
- the copper alloy to be evaporated is hung on the spiral tungsten filament as little wire loops 23 (Fig. 3) so that when the filament heats up the loops will melt and cling to the filament.
- Figure 2 is a fragmentary cross-section of the tungsten filament II coated with the fused alloy 2 I of copper preparatory to evaporation.
- An alloy loop for metal evaporation formed of an alloy composed of .001 to 1% lithium, .25 to 20% of a metal selected from the group consisting of platinum and palladium and the balance copper.
- An alloy wire for metal evaporation composed of about .05% lithium, 5% platinum and the balance copper.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
F. R.H ENsE| Erm. 2,447,979
COPPER BASE ALLOY FOR METAL EYAPORATION Aug. 24, 1948.
Filed July e. 1944 .T0 Mrz/UM PUMP P/mq/v/ 60,465
Hrm/P NEY Patented Aug. 24, 1948 COPPER BASE ALLOY FOR METAL EVAPORATION Franz R. Hensel and Earl I. Larsen, Indianapolis, Ind., assignors to P. R. Mallory & Co., Inc., Indianapolis, Ind., a corporation of Delaware Application July 6, 1944, Serial No. 543,634
2V Claims. (Cl. 75-153) This invention relates to improvements in metal evaporation.
An object of the invention is to improve the evaporation of copper and its alloys.
Other objects of the invention will be apparent from the description and claims.
Figure 1 is a sectional elevation of a metal evaporation apparatus;
Figure 2 is a fragmentary cross-section of the tungsten filament coated with the metal to be evaporated; and
Figure 3 shows a wire loop of the metal.
The vaporization process for depositing silver, copper and other metals has been known for some time and used commercially to some extent. The processing as applied to silver is described in considerable detail in the book Silver in Industry edited by Lawrence Addicks (Reinhold 1940), pages 291 to 296.
In carrying out the process the metal to be evaporated is usually hung on a tungsten filament as small loops of wire. Electric current is then passed through the lament to heat it and the wire loops are melted and the fused metal clings to the filament and evaporates as the heating is continued. One diiiiculty which has been encountered with silver and copper has been the failure of these metals to wet the tungsten sufciently to cling to it during the vaporization process. The metal tends to ball up and drop olf the filament before it can be evaporated. It also sometimes tends to spatter during evaporation, probably due to the accumulation of the liquid metal in large globules.
We have now discovered that this difficulty can be overcome in the case of copper and satisfactory wetting of the tungsten filament obtained by adding a small percentage of lithium to copper or its alloys. For example, an alloy of Per cent Lithium .05
Platinum 5.00 Copper Balance 2 or iron may be present in percentages ranging from .001 to .5%.
Referring to the drawing, Figure 1 shows a metal vaporization apparatus comprising a bell jar I0 resting on a pump plate II with a rubber gasket I 2 between them to afford a gas seal. The bell jar is connected to a vacuum pump through pipe I3 and a Pirani gauge I4 may be provided to measure the degree of vacuum obtained.
The articles to be coated with a thin film of copper such as glass plates or mirror blanks I5 are mounted on the inside wall of a cylindrical container I6 supported within the bell jar. The tungsten filament I'I is mounted axially within the container and connected to insulated terminals I8 and I9.
The copper alloy to be evaporated is hung on the spiral tungsten filament as little wire loops 23 (Fig. 3) so that when the filament heats up the loops will melt and cling to the filament.
Figure 2 is a fragmentary cross-section of the tungsten filament II coated with the fused alloy 2 I of copper preparatory to evaporation.
While speciflc embodiments of the invention have been described, it is intended to cover the invention broadly within the spirit and scope of the appended claims.
What is claimed is:
1. An alloy loop for metal evaporation formed of an alloy composed of .001 to 1% lithium, .25 to 20% of a metal selected from the group consisting of platinum and palladium and the balance copper.
2. An alloy wire for metal evaporation composed of about .05% lithium, 5% platinum and the balance copper.
FRANZ R. HENSEL. EARL I. LARSEN.
REFERENCES CITED The following references are of record in the ille of this patent:
UNITED STATES PATENTS Number Name Date 1,291,106 Payne Jan. 14, 1919 1,923,955 Smith Aug. 22, 1933 2,178,233 Klatzow Oct. 31, 1939 2,196,302 Hensel et al. Apr. 9, 1940 2,213,312 Hensel Sept. 3, 1940 2,330,062 Lempert Sept. 21, 1943 2,413,604 Colbert et al Dec. 31, 1946 2,413,606 Colbert et al Dec. 31, 1946
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US543634A US2447979A (en) | 1944-07-06 | 1944-07-06 | Copper base alloy for metal evaporation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US543634A US2447979A (en) | 1944-07-06 | 1944-07-06 | Copper base alloy for metal evaporation |
Publications (1)
Publication Number | Publication Date |
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US2447979A true US2447979A (en) | 1948-08-24 |
Family
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Application Number | Title | Priority Date | Filing Date |
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US543634A Expired - Lifetime US2447979A (en) | 1944-07-06 | 1944-07-06 | Copper base alloy for metal evaporation |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2553289A (en) * | 1947-03-12 | 1951-05-15 | Bausch & Lomb | Method for depositing thin films |
US2589175A (en) * | 1948-12-28 | 1952-03-11 | Libbey Owens Ford Glass Co | Aluminum base alloy for metal evaporation |
US3188726A (en) * | 1962-05-16 | 1965-06-15 | Laske Hans | Device for evaporating coatings from extremely thin metal elements |
US3188735A (en) * | 1960-06-27 | 1965-06-15 | Laske Hans | Method for producing very thin and bright metal wires and profiles |
US4759719A (en) * | 1986-09-22 | 1988-07-26 | Levenson Michael K | Teaching device for the demonstration of scientific principles |
US20100037826A1 (en) * | 2006-09-14 | 2010-02-18 | Hiroshi Nagata | Vacuum vapor processing apparatus |
US20140056579A1 (en) * | 2006-04-28 | 2014-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Electrode cover and evaporation device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1291106A (en) * | 1917-11-21 | 1919-01-14 | Gen Electric | Electrical resistance. |
US1923955A (en) * | 1931-11-16 | 1933-08-22 | Allied Process Corp | Alloy |
US2178233A (en) * | 1936-06-25 | 1939-10-31 | Emi Ltd | Cathode ray tube |
US2196302A (en) * | 1939-02-21 | 1940-04-09 | Mallory & Co Inc P R | Silver copper alloy |
US2213312A (en) * | 1940-04-08 | 1940-09-03 | Mallory & Co Inc P R | Electric contact |
US2330062A (en) * | 1941-09-24 | 1943-09-21 | Westinghouse Electric & Mfg Co | Silver-copper solder alloy |
US2413604A (en) * | 1944-05-27 | 1946-12-31 | Libbey Owens Ford Glass Co | Method or process of evaporating metals |
US2413606A (en) * | 1944-09-01 | 1946-12-31 | Libbey Owens Ford Glass Co | Method of coating by evaporating metals |
-
1944
- 1944-07-06 US US543634A patent/US2447979A/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1291106A (en) * | 1917-11-21 | 1919-01-14 | Gen Electric | Electrical resistance. |
US1923955A (en) * | 1931-11-16 | 1933-08-22 | Allied Process Corp | Alloy |
US2178233A (en) * | 1936-06-25 | 1939-10-31 | Emi Ltd | Cathode ray tube |
US2196302A (en) * | 1939-02-21 | 1940-04-09 | Mallory & Co Inc P R | Silver copper alloy |
US2213312A (en) * | 1940-04-08 | 1940-09-03 | Mallory & Co Inc P R | Electric contact |
US2330062A (en) * | 1941-09-24 | 1943-09-21 | Westinghouse Electric & Mfg Co | Silver-copper solder alloy |
US2413604A (en) * | 1944-05-27 | 1946-12-31 | Libbey Owens Ford Glass Co | Method or process of evaporating metals |
US2413606A (en) * | 1944-09-01 | 1946-12-31 | Libbey Owens Ford Glass Co | Method of coating by evaporating metals |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2553289A (en) * | 1947-03-12 | 1951-05-15 | Bausch & Lomb | Method for depositing thin films |
US2589175A (en) * | 1948-12-28 | 1952-03-11 | Libbey Owens Ford Glass Co | Aluminum base alloy for metal evaporation |
US3188735A (en) * | 1960-06-27 | 1965-06-15 | Laske Hans | Method for producing very thin and bright metal wires and profiles |
US3188726A (en) * | 1962-05-16 | 1965-06-15 | Laske Hans | Device for evaporating coatings from extremely thin metal elements |
US4759719A (en) * | 1986-09-22 | 1988-07-26 | Levenson Michael K | Teaching device for the demonstration of scientific principles |
US20140056579A1 (en) * | 2006-04-28 | 2014-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Electrode cover and evaporation device |
US9290842B2 (en) * | 2006-04-28 | 2016-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Electrode cover and evaporation device |
US20100037826A1 (en) * | 2006-09-14 | 2010-02-18 | Hiroshi Nagata | Vacuum vapor processing apparatus |
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