US20240120150A1 - Surface-mount capacitor - Google Patents
Surface-mount capacitor Download PDFInfo
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- US20240120150A1 US20240120150A1 US18/280,401 US202218280401A US2024120150A1 US 20240120150 A1 US20240120150 A1 US 20240120150A1 US 202218280401 A US202218280401 A US 202218280401A US 2024120150 A1 US2024120150 A1 US 2024120150A1
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- seat plate
- lead terminal
- lead
- terminals
- terminal housing
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- 239000003990 capacitor Substances 0.000 title claims abstract description 109
- 238000005476 soldering Methods 0.000 claims abstract description 58
- 230000004907 flux Effects 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 238000007789 sealing Methods 0.000 claims description 47
- 238000003780 insertion Methods 0.000 claims description 41
- 230000037431 insertion Effects 0.000 claims description 41
- 239000007769 metal material Substances 0.000 claims description 14
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- 239000000853 adhesive Substances 0.000 claims description 2
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- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
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- 229910052719 titanium Inorganic materials 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 15
- 229920001971 elastomer Polymers 0.000 description 14
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/035—Liquid electrolytes, e.g. impregnating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
Definitions
- the present invention relates to a surface-mount capacitor, which enables an aluminum electrolytic capacitor to be surface mounted on a circuit board, and a seat plate for surface mounting.
- a lead same direction type also called a discrete type aluminum electrolytic capacitor
- a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein
- processes are performed to make the capacitor a surface-mount (chip) type capacitor, by mounting a seat plate, which is made of a synthetic resin and has a pair of lead terminal insertion holes, on a sealing part side of the outer case, and bending the lead terminals, which are led out to a bottom surface side of the seat plate through the lead terminal insertion holes, in opposite directions away from each other.
- this type of chip type (surface-mount type) capacitor is soldered to a circuit board by a reflow soldering method, and in particular, in a chip type capacitor for a vehicle where high vibration resistance is required, the soldering strength is increased by providing auxiliary terminals on a bottom surface of the seat plate (for example, refer to Patent Literature 1 and Patent Literature 2).
- flux gas gasified flux
- flux gas gasified flux
- solder paste applied to a solder land part is pushed to the outside of the solder land part by the generated flux gas, becomes spherical due to heat at the time of soldering, solidifies into a solder ball, and adheres, for example, to a solder mask (also called a solder resist or the like) of the circuit board or to the seat plate of this product.
- a solder mask also called a solder resist or the like
- solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part.
- solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part.
- solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part.
- Such an undesirable phenomenon occurs, regardless of the presence or absence of auxiliary terminals.
- a first object of the present invention is, in a surface-mount capacitor formed by attaching a seat plate for surface mounting (chipping) to an aluminum electrolytic capacitor, to suppress voids and cracks, a solder ball or the like, which impair the reliability of a product, from occurring at the time of soldering.
- a second object of the present invention is, in a surface-mount capacitor formed by attaching a seat plate for surface mounting (chipping) to an aluminum electrolytic capacitor, to enable the quality of soldering to a circuit board to be visually judged.
- a first invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which the seat plate has a pair of lead terminal insertion holes through each of which one of the lead terminals is inserted, lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, and auxiliary terminals that are integrated with the lead terminals at the time of soldering are embedded along each of the lead terminal housing grooves, each of the lead terminals is inserted into one of the lead terminal insertion holes, a distal portion of each of the lead terminals is housed within one of the lead terminal housing grooves by being bent, and is soldered at a prescribed position of a circuit board together with one of the
- a second invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which the seat plate has a pair of lead terminal insertion holes through each of which the lead terminals are inserted, and lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, each of the lead terminals is inserted into one of the lead terminal insertion holes, and is soldered to a solder land part formed on a circuit board in a state where housed within one of the lead terminal housing grooves by being bent, and
- a third invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which
- the first and second inventions in a surface-mount capacitor formed by attaching a seat plate for surface mounting to an aluminum electrolytic capacitor, it is possible to suppress the occurrence of voids and cracks due to flux gas generated at the time of soldering.
- a surface-mount capacitor formed by attaching a seat plate for surface mounting to an aluminum electrolytic capacitor it is possible to visually judge the quality of soldering to a circuit board.
- FIG. 1 is a plan view showing a seat plate for surface mounting of a chip type capacitor relating to a first embodiment of the present invention.
- FIG. 2 is a right side view of the seat plate for surface mounting relating to the first embodiment.
- FIG. 3 is a front view showing, as a partial cross-section, an A-A line portion in FIG. 1 of the seat plate for surface mounting relating to the first embodiment, along with an aluminum electrolytic capacitor.
- FIG. 4 is a bottom view showing the seat plate for surface mounting relating to the first embodiment.
- FIG. 5 is a main part enlarged view showing enlarged an auxiliary terminal portion of FIG. 4 .
- FIG. 6 is a perspective view showing auxiliary terminals attached to the seat plate for surface mounting relating to the first embodiment in a state where suspended on a hoop material.
- FIG. 7 is a front view of FIG. 6 .
- FIG. 8 is a front view showing a surface-mount capacitor relating to a second embodiment of the present invention separated into a capacitor main body and a seat plate for surface mounting, and showing each as a cross-section.
- FIG. 9 is a perspective view of the seat plate for surface mounting relating to the second embodiment seen from an upper surface side.
- FIG. 10 is a perspective view of the seat plate for surface mounting relating to the second embodiment seen from a bottom surface side.
- FIG. 11 is a bottom view of the seat plate for surface mounting relating to the second embodiment, and is a view for describing the relationship of the width dimensions of lead terminals, lead terminal housing grooves, and a solder land part.
- FIG. 12 is a perspective view seen from a bottom surface side showing a different embodiment of the seat plate for surface mounting relating to the second embodiment.
- FIG. 13 is a front view showing a surface-mount capacitor relating to a third embodiment of the present invention separated into a capacitor main body and a seat plate for surface mounting, and showing each as a cross-section.
- FIG. 14 is a perspective view of the seat plate for surface mounting relating to the third embodiment seen from an upper surface side.
- FIG. 15 a is a perspective view of the seat plate for surface mounting relating to the third embodiment seen from a bottom surface side.
- FIG. 15 b is a perspective view showing a modified example of the soldering auxiliary parts of FIG. 15 a.
- FIG. 16 is a cross-section view enlarging a portion of a soldering auxiliary part from within the seat plate relating to the third embodiment.
- FIG. 17 a is a perspective view of a portion of soldering auxiliary parts relating to the third embodiment seen from a bottom surface side.
- FIG. 17 b is a perspective view showing a modified example of the soldering auxiliary parts of FIG. 17 a.
- a seat plate 10 relating to a first embodiment is a seat plate for setting an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1 as a chip type capacitor in a form that can be surface mounted to a circuit board or the like, which is not illustrated.
- a seat plate for chipping of this type is also called a pedestal.
- the capacitor main body 1 to which this seat plate 10 is applied is a lead same direction type (also called a discrete type) capacitor from which a pair of lead terminals 5 a and 5 b are led out in a same direction from a sealing part 4 of an outer case 3 with a capacitor element 2 built therein.
- a lead same direction type also called a discrete type
- the outer case 3 has a bottomed cylindrical shape made of aluminum, and an opened part of the outer case 3 is closed by a rubber sealing body 6 formed from butyl rubber, for example, as the sealing part 4 .
- a rubber sealing body 6 formed from butyl rubber, for example, as the sealing part 4 .
- lateral throttle grooves 7 are formed in the circumferential direction along the rubber sealing body 6 on the outer peripheral surfaces of the outer case 3 .
- the lead terminal 5 a is on an anode side
- the lead terminal 5 b is on a cathode side
- both are led out to the outside through the rubber sealing body 6 .
- the lead terminals 5 in the case where it is not necessary to distinguish the lead terminals 5 a and 5 b , they will be collectively called the lead terminals 5 .
- the seat plate 10 has a square shape in which two adjacent corner parts are obliquely cut off in the plan view of FIG. 1 , and the entire body is formed from a heat-resistant synthetic resin.
- FIG. 1 is a component mounting surface 10 a side on which the capacitor main body 1 of the seat plate 10 is placed
- FIG. 4 is a bottom surface 10 b side of the seat plate 10 opposite to a circuit board, which is not illustrated, at the time of soldering.
- Lead terminal housing grooves 12 a and 12 b which extend from each of the lead terminal insertion holes 11 a and 11 b to opposite side edges 13 a and 13 b of the seat plate 10 in opposite directions away from each other, are formed on the bottom surface 10 b of the seat plate 10 .
- the lead terminal housing grooves 12 a and 12 b they will be collectively called the lead terminal housing grooves 12 .
- the side edges 13 a and 13 b they will be collectively called the side edges 13 .
- the capacitor main body 1 is placed on the component mounting surface 10 a of the seat plate 10 , while inserting the lead terminals 5 a and 5 b into the lead terminal insertion holes 11 a and 11 b , and thereafter the lead terminals 5 a and 5 b are housed within the lead terminal housing grooves 12 a and 12 b , by being bent in opposite directions away from each other. Therefore, the capacitor main body 1 can be set as a chip type capacitor 1 A that can be surface mounted on a circuit board.
- the auxiliary terminals 20 are provided at a total of four locations on both sides of the lead terminal housing groove 12 a and both sides of the lead terminal housing groove 12 b , and are integrated with the lead terminals 5 by a soldering material at the time of soldering.
- the auxiliary terminals 20 are made of brass.
- each of the auxiliary terminals 20 is integrally embedded in the seat plate 10 by insert molding in a mold. Accordingly, as shown in FIG. 6 and FIG. 7 , each of the auxiliary terminals 20 is conveyed inside the mold in a state where supported by a hoop material 40 as a pair of auxiliary terminals 20 a and 20 b , for each of the lead terminal housing grooves 12 a and 12 b .
- the auxiliary terminal 20 a and the auxiliary terminal 20 b are horizontally symmetrical, in a state where supported by the hoop material 40 .
- the auxiliary terminals 20 each include a main plate part 21 that occupies a large portion of the auxiliary terminal 20 .
- the main plate part 21 is attached (embedded) on the side of the lead terminal housing groove 12 on the bottom surface 10 b of the seat plate 10 so that the surface is exposed.
- a hole 221 in which resin enters at the time of injection molding, is bored into the flange piece 22 .
- An anchor piece 23 which is bent obliquely upward so as to bite into the seat plate 10 , is connected to the side edge of the main plate part 21 on an opposite side to the one side edge.
- a hole 231 in which resin enters at the time of injection molding, is bored into the anchor piece 23 .
- a gas release groove 24 for releasing flux gas generated at the time of soldering is formed on the main plate part 21 . While it is preferable for this gas release groove 24 to be a slit, it may be gutter shaped with a groove bottom. Moreover, there may be a plurality of the gas release grooves 24 .
- the gas release groove 24 is formed from a central portion of the main plate part 21 to a side edge 113 ( 13 a , 13 b ) of the seat plate 10 . It is preferable for the area occupied by the gas release groove 24 in the main plate part 21 to be from 10% to 65% of the area of the main plate part 21 prior to the gas release groove 24 being formed.
- the gas release groove 24 may be formed toward an opposite side to this (right side in FIG. 5 ), or may be formed toward a side where there is no solder (lower side in FIG. 5 ).
- the side edge 13 side of the seat plate 10 of the main plate part 21 is branched into two by the gas release groove 24 , and from among these branch pieces 25 a and 25 b , a branch plate part 26 is provided on the branch piece 25 b separated from the lead terminal housing groove 12 .
- the branch plate part 26 is bent at a right angle from the branch piece 25 b along a side piece 13 of the seat plate 10 . Note that, the branch plate part 26 may be formed on the branch piece 25 a side.
- the main plate part 21 and the branch plate part 26 are soldering parts of the auxiliary terminal 20 to a circuit board.
- the auxiliary terminals 20 ( 20 a , 20 b ) are separated from the hoop material 40 at the portion of the two-dot chain line DL of FIG. 6 and FIG. 7 after mounting or after injection molding within a mold, and a large portion of the branch plate part 26 is attached (embedded) to the side edge 13 of the seat plate 10 so that the surface is exposed at the time of injection molding of the seat plate 10 .
- the auxiliary terminals 20 are respectively attached to both sides of the lead terminal housing grooves 12 a and 12 b on the bottom surface 10 b of the seat plate 10 .
- this chip type capacitor 1 A is attached to a circuit board, which is not illustrated, by a reflow soldering method, for example, the lead terminals 5 and the auxiliary terminals 20 are integrally soldered to a land part of the circuit board by this molten solder. Moreover, since solder creeps up along the branch plate part 26 , the lead terminals 5 and the auxiliary terminals 20 are firmly attached to the circuit board. Moreover, since flux gas generated at this time is released from the gas release grooves 24 , it is possible to suppress voids and cracks from occurring in the soldering parts.
- retaining parts 30 which suppress rattling of the capacitor main body 1 , are provided on the component mounting surface 10 a of the seat plate 10 .
- the retaining parts 30 are formed as pillars 31 erected at the four corners of the seat plate 10 so as to make contact with the outer case 3 .
- Each of the pillars 31 has a height that at least exceeds the lateral throttle grooves 7 for sealing formed on the outer case 3 .
- the pillars 31 c and 31 d on the cathode side have a height that is lower than that of the pillars 31 a and 31 b on the anode side, for polarity discrimination.
- the pillars 31 c and 31 d on the cathode side may be higher than the pillars 31 a and 31 b on the anode side.
- the retaining parts 30 may be a cylindrical wall that surrounds the outer case 3 , under a condition that the height is a height exceeding the lateral throttle grooves 7 for sealing.
- a surface-mount capacitor relating to a second embodiment includes an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1 , and a seat plate (hereinafter, also simply called a “seat plate”) 100 for surface mounting. Note that, in the second embodiment, auxiliary terminals for increasing the soldering strength are not provided on the seat plate 100 .
- the capacitor main body 1 is a lead same direction type (also called a discrete type) capacitor from which a pair of lead terminals 5 a and 5 b are led out in a same direction from a sealing part 4 of an outer case 3 with a capacitor element 2 built therein.
- a lead same direction type also called a discrete type
- the outer case 3 may have a bottomed cylindrical shape made of aluminum, and an opened part of the outer case 3 is closed by a rubber sealing body 6 as the sealing part 4 .
- the rubber sealing body 6 It is preferable for the rubber sealing body 6 to be formed from butyl rubber.
- lateral throttle grooves 7 are formed in the circumferential direction along the rubber sealing body 6 on the outer peripheral surfaces of the outer case 3 .
- the lead terminal 5 a is on an anode side
- the lead terminal 5 b is on a cathode side
- both are led out to the outside through the rubber sealing body 6 .
- the lead terminals 5 in the case where it is not necessary to distinguish the lead terminals 5 a and 5 b , they will be collectively called the lead terminals 5 .
- the lead terminals 5 are originally round bar shaped wires, the lead terminals 5 , after being led out to the outside through the rubber sealing body 6 , are processed into flat band shapes by a pressing process.
- the seat plate 100 has a square shape (deformed hexagonal shape) in which two adjacent corner parts 100 c and 100 d are obliquely cut off, and the entire body is formed from a heat-resistant synthetic resin. Having two adjacent corner parts 100 c and 100 d of the seat plate 100 obliquely cut out is also to facilitate polarity discrimination. In the second embodiment, the obliquely cut off corner parts 100 c and 100 d show the anode side.
- a circular concave part, into which the sealing part 4 of the capacitor main body 1 is fitted, is formed on an upper surface 100 a side, which is the component mounting surface of the seat plate 100 .
- retaining parts 300 which surround the sealing part 4 of the capacitor main body 1 , are provided on the upper surface 100 a side of the seat plate 100 .
- the retaining parts 300 are formed as pedestal parts 310 erected at four corners of the seat plate 100 so as to make contact with the sealing part 4 of the capacitor main body 1 .
- the pedestal parts 311 a and 311 b on the cathode side have a height that is higher than that of the pedestal parts 311 c and 311 d on the anode side, for polarity discrimination.
- the pedestal parts 311 c and 311 d on the anode side may be higher than the pedestal parts 311 a and 311 b on the cathode side.
- lead terminal housing grooves 112 a and 112 b which extend from each of the lead terminal insertion holes 111 a and 111 b to opposite side surfaces 113 a and 113 b of the seat plate 100 in opposite directions away from each other, are formed on the bottom surface 100 b of the seat plate 100 .
- disk shaped spacers 114 which maintain the seat plate 100 at a prescribed height from a circuit board, which is not illustrated, at the time of mounting on the circuit board, are formed at four corners on the bottom surface 110 b of the seat plate 100 .
- lead terminal housing grooves 112 a and 112 b In the case where it is not necessary to distinguish the lead terminal housing grooves 112 a and 112 b , they will be collectively called the lead terminal housing grooves 112 . Moreover, in the case where it is not necessary to distinguish the side edges 113 a and 113 b , they will be collectively called the opposite side edges 113 .
- the capacitor main body 1 is placed on the upper surface (component mounting surface) 100 a of the seat plate 100 , while inserting the lead terminals 5 a and 5 b into the lead terminal insertion holes 111 a and 111 b , and thereafter the lead terminals 5 a and 5 b are housed within the lead terminal housing grooves 112 a and 112 b by being bent in opposite directions away from each other. Therefore, the capacitor main body 1 can be set as a surface-mount capacitor 1 A that can be surface mounted on a circuit board.
- solder paste applied to a solder land part is pushed to the outside of the solder land part by the generated flux gas, becomes spherical due to heat at the time of soldering, solidifies into a solder ball, and adheres, for example, to a solder mask (also called a solder resist or the like) or to the seat plate.
- a solder mask also called a solder resist or the like
- solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part.
- the lead terminal housing grooves 112 include widened width parts 120 for forming prescribed gaps (clearances) on both sides of the lead terminals 5 ( 5 a , 5 b ) that are greater than the width of the lead terminals ( 5 a , 5 b ).
- a direction orthogonal to the extension direction of the lead terminal housing grooves 112 (a direction from one side surface 113 a to the other side surface 113 b , or from the other side surface 113 b to the one side surface 113 a ) is set as a width direction, and a width Wa of each of the lead terminal housing grooves 112 is greater than a width Wb of each of the lead terminals 5 . Therefore, a widened width part 120 having a width of (Wa ⁇ Wb)/2 is provided on both sides of each of the lead terminals 5 .
- width Wa of the lead terminal housing grooves 112 may be greater than the width Wb of the lead terminals 5 , if the width Wa of the lead terminal housing grooves 112 is too wide, the strength of the seat plate itself is lowered, and there is the risk, for example, of being deformed at the time of reflow soldering.
- the width Wa of the lead terminal housing grooves 112 is preferably 200% to 400% of the width Wb of the lead terminals 5 , more preferably 200% to 300%, and in particular, it is preferable for deformations, such as warping of the seat plate, to not be observed at the time of reflow soldering to the circuit board.
- Examples 1-4, Examples 1 and 2 of the present invention which have a surface-mount capacitor for a vehicle as a test product, reflow soldering was actually performed, and each item of a solder ball generation number, a presence or absence of deformation at the time of heating, a seat plate strength, and a productivity (presence or absence of seat plate deformation at the time of assembly), were investigated.
- the number of test products was 30 in each example.
- the width Wa of the lead terminal housing grooves 112 was set to 100% of the width Wb of the lead terminals 5 .
- the width Wa of the lead terminal housing grooves 112 was set to 150% of the width Wb of the lead terminals 5 .
- the width Wa of the lead terminal housing grooves 112 was set to 180% of the width Wb of the lead terminals 5 .
- the width Wa of the lead terminal housing grooves 112 was set from 200% to 300% of the width Wb of the lead terminals 5 .
- the width Wa of the lead terminal housing grooves 112 was set from 301% to 400% of the width Wb of the lead terminals 5 .
- the width Wa of the lead terminal housing grooves 112 exceeded 400% of the width Wb of the lead terminals 5 .
- the widened width parts 120 are formed from base ends of the lead terminal insertion hole 111 sides to the side edges 113 of the seat plate 100 .
- the width Wa of the lead terminal housing grooves 112 is greater than a width Wc of the solder land part 130 .
- solder paste applied to the solder land part 130 is crushed by the lead terminals 5 , and the area is wide, it remains within the widened width parts 120 . Therefore, solder balls are not generated on a solder mask or the bottom surface of the seat plate 100 .
- the width Wa of the lead terminal housing grooves 112 is greater than the width Wb of the lead terminals 5 , there is the risk that the directions will deviate when the lead terminals 5 a and 5 b are bent in opposite directions away from each other and housed within the lead terminal housing grooves 112 , and the lead terminals 5 a and 5 b will not line up in a straight line.
- the lead terminal housing grooves 112 each include a pair of direction restricting means (guide means) 115 in an intermediate portion from a base end of the lead terminal insertion hole 111 side to the side edge 113 of the seat plate 100 side, the pair of direction restricting means 115 has one of the lead terminals 5 fitted therebetween and restricts (guides) the extension direction of the lead terminal 5 .
- the direction restricting means 115 In the description of the second embodiment, the following two aspects are included for the direction restricting means 115 .
- the direction restricting means 115 relating to a first aspect are each made of an overhanging arm 115 a formed in a protruding shape from an inner edge of the lead terminal housing grooves 112 to inside the groove, such as shown in FIG. 10 and FIG. 11 .
- the direction restricting means 115 relating to a second aspect are each made of a columnar projection (boss) 115 b formed in an island shape within the lead terminal housing grooves 112 .
- any other than the overhanging arms 115 a and columnar projections 115 b can be adopted as the direction restricting means 115 , as long as the lead terminals 5 a and 5 b are arranged in a straight line, without obstructing the release of flux gas.
- a surface-mount capacitor relating to a third embodiment includes an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1 , and a seat plate (hereinafter, also simply called a “seat plate”) 100 for surface mounting.
- an aluminum electrolytic capacitor hereinafter, also called a “capacitor main body” 1
- a seat plate hereinafter, also simply called a “seat plate” 100 for surface mounting.
- the capacitor main body 1 is a lead same direction type (also called a discrete type) capacitor from which a pair of lead terminals 5 a and 5 b are led out in a same direction from a sealing part 4 of an outer case 3 with a capacitor element 2 built therein.
- a lead same direction type also called a discrete type
- the outer case 3 may have a bottomed cylindrical shape made of aluminum, and an opened part of the outer case 3 is closed by a rubber sealing body 6 as the sealing part 4 .
- the rubber sealing body 6 It is preferable for the rubber sealing body 6 to be formed from butyl rubber.
- lateral throttle grooves 7 are formed in the circumferential direction along the rubber sealing body 6 on the outer peripheral surfaces of the outer case 3 .
- the lead terminal 5 a is on a cathode side
- the lead terminal 5 b is on an anode side
- both are led out to the outside through the rubber sealing body 6 .
- the lead terminals 5 in the case where it is not necessary to distinguish the lead terminals 5 a and 5 b , they will be collectively called the lead terminals 5 .
- the lead terminals 5 are originally round bar shaped wires, the lead terminals 5 , after being led out to the outside through the rubber sealing body 6 , are processed into flat band shapes by a pressing process.
- the seat plate 100 has a square shape (deformed hexagonal shape) in which two adjacent corner parts 100 c and 100 d are obliquely cut off, and the entire body is formed from a heat-resistant synthetic resin. Having two adjacent corner parts 100 c and 100 d of the seat plate 100 obliquely cut out is also to facilitate polarity discrimination. In the present embodiment, the obliquely cut off corner parts 100 c and 100 d show the anode side.
- a circular concave part, into which the sealing part 4 of the capacitor main body 1 is fitted, is formed on an upper surface 100 a side, which is the component mounting surface of the seat plate 100 .
- retaining walls 300 which surround the sealing part 4 of the capacitor main body 1 , are provided on the upper surface 100 a side of the seat plate 100 .
- the retaining walls 300 are formed as pedestal parts 311 erected at four corners of the seat plate 100 so as to make contact with the sealing part 4 of the capacitor main body 1 .
- the pedestal parts 311 a and 311 b on the cathode side have a height that is higher than that of the pedestal parts 311 c and 311 d on the anode side, for polarity discrimination.
- the pedestal parts 311 c and 311 d on the anode side may be higher than the pedestal parts 311 a and 311 b on the cathode side.
- lead terminal housing grooves 112 a and 112 b which extend from each of the lead terminal insertion holes 111 a and 111 b to opposite side surfaces 113 a and 113 b of the seat plate 100 in opposite directions away from each other, are formed on the bottom surface 110 b of the seat plate 100 .
- disk shaped spacers 114 which maintain the seat plate 100 at a prescribed height from a circuit board, which is not illustrated, at the time of mounting on the circuit board, are formed at four corners on the bottom surface 110 b of the seat plate 100 .
- the lead terminal housing grooves 112 a and 112 b In the case where it is not necessary to distinguish the lead terminal housing grooves 112 a and 112 b , they will be collectively called the lead terminal housing grooves 112 . Moreover, in the case where it is not necessary to distinguish the opposite side surfaces 113 a and 113 b , they will be collectively called the opposite side surfaces 113 . Note that, while the seat plate 100 includes two other opposite side surfaces, in addition to the side surfaces 113 a and 113 b , in the present embodiment, no processing is applied to the two other opposite side surfaces.
- the capacitor main body 1 is placed on the upper surface (component mounting surface) 100 a of the seat plate 100 , while inserting the lead terminals 5 a and 5 b into the lead terminal insertion holes 111 a and 111 b , and thereafter the lead terminals 5 a and 5 b are housed within the lead terminal housing grooves 112 a and 112 b by being bent in opposite directions away from each other. Therefore, the capacitor main body 1 can be set as a surface-mount capacitor 1 A that can be surface mounted on a circuit board.
- mounting of the surface-mount capacitor 1 A to the circuit board is performed by reflow soldering. Namely, cream solder is applied to a solder land part formed on the circuit board, and after the lead terminals 5 a and 5 b of the surface-mount capacitor 1 A are placed thereon, the cream solder is melted and soldered by heating within a heating furnace.
- soldering auxiliary parts 400 which allow a soldered state to be visually observed from the outside, are provided adjacent to the end parts of the lead terminal housing grooves 112 .
- the soldering auxiliary parts 400 are provided at a total of four locations, which are two locations on both the left and right sides of the end part of the side surface 113 a side of one lead terminal housing groove 112 a , and two locations on both the left and right sides of the end part of the side surface 113 b side of the other lead terminal housing groove 112 b.
- soldering auxiliary parts 400 may have the same configuration, the configuration of each of the soldering auxiliary parts 400 may be individually changed in accordance with, for example, the shape of a solder land part on the circuit board side. Moreover, as shown in FIG. 15 b , the soldering auxiliary parts 400 may be formed across the entire width on the lower end edges of the side surfaces 113 of the seat plate 100 .
- the soldering auxiliary parts 400 are provided on the lower end edges of the side surfaces 113 of the seat plate 100 , it is preferable to include inclined surfaces 410 formed from the side surfaces 113 to the bottom surface 100 b of the seat plate 100 .
- the inclined surfaces 410 are formed from a middle portion of the side surface 113 of the seat plate 100 to the bottom surface 110 b , and as shown in FIG. 17 b , they may be formed from an upper edge of the side surface 113 of the seat plate 100 to the bottom surface 110 b.
- the inclined surfaces 410 may be spatially connected to the end parts of the lead terminal housing grooves 112 , they may be formed separated away from the lead terminal housing grooves 112 .
- a solderable metal material 420 is provided on the inclined surfaces 410 .
- the metal material 420 may be formed by vapor disposition, plating, or a metal plate.
- iron, brass, nickel, titanium, copper, tin, or an alloy thereof is used for the metal material 420 .
- the inclined surfaces 410 In the case where a metal plate is used as the metal material 420 , while the metal plate is fixed to each of the inclined surfaces 410 by an adhesive or embedding, by including the cases of vapor disposition and plating, it is preferable for the inclined surfaces 410 to be roughened to improve adhesion with the metal material 420 .
- an angle of each of the inclined surfaces 410 with respect to a flat plane including the bottom surface 100 b of the seat plate 100 is preferable for an angle of each of the inclined surfaces 410 with respect to a flat plane including the bottom surface 100 b of the seat plate 100 to be from 45 degrees to 80 degrees.
- the seat plate 100 includes substantially annular retaining walls 300 , into which the capacitor main body 1 is fitted, on the upper surface 100 a thereof.
- a wall thickness of a wall portion (pedestal part 311 in the present embodiment) positioned above the inclined surface 410 is set to TA
- a projection width of the inclined surface 410 in a plane view is set to TB
- TB ⁇ TA a wall thickness of a wall portion (pedestal part 311 in the present embodiment) positioned above the inclined surface 410
- the soldering auxiliary parts 400 which have a metal material 420 and allow a soldered state to be visually observed from outside, are arranged adjacent to the end parts of the lead terminal housing grooves 112 on the lower end edges of the side surfaces 113 of the seat plate 100 , a judgment can be performed for the quality of soldering by the attachment condition to the soldering auxiliary parts 400 , for example, at the time of reflow soldering. Moreover, since the soldering auxiliary parts 400 are soldered to a solder land part of the circuit board, accordingly, the soldering strength are increased.
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Abstract
In a chip type capacitor formed by attaching a seat plate to a capacitor, generation of voids or cracks due to flux gas generated at the time of soldering is suppressed. When providing auxiliary terminals for increasing the soldering strength on a seat plate for chipping, which enables a lead same direction type capacitor to be surface mounted, a gas release groove, preferably formed as a slit to release flux gas generated at the time of soldering, is formed on each of the auxiliary terminals.
Description
- The present invention relates to a surface-mount capacitor, which enables an aluminum electrolytic capacitor to be surface mounted on a circuit board, and a seat plate for surface mounting.
- In order to enable surface mounting to a circuit board, in a lead same direction type (also called a discrete type) aluminum electrolytic capacitor, in which a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein, processes are performed to make the capacitor a surface-mount (chip) type capacitor, by mounting a seat plate, which is made of a synthetic resin and has a pair of lead terminal insertion holes, on a sealing part side of the outer case, and bending the lead terminals, which are led out to a bottom surface side of the seat plate through the lead terminal insertion holes, in opposite directions away from each other.
- In a lot of cases, this type of chip type (surface-mount type) capacitor is soldered to a circuit board by a reflow soldering method, and in particular, in a chip type capacitor for a vehicle where high vibration resistance is required, the soldering strength is increased by providing auxiliary terminals on a bottom surface of the seat plate (for example, refer to
Patent Literature 1 and Patent Literature 2). - As is well known, flux gas (gasified flux) is generated at the time of soldering, and there may be cases where voids or cracks occur due to flux gas remaining in a fillet. Voids or cracks of this type impair the reliability of a solder joint.
- Moreover, there may be cases where solder paste applied to a solder land part is pushed to the outside of the solder land part by the generated flux gas, becomes spherical due to heat at the time of soldering, solidifies into a solder ball, and adheres, for example, to a solder mask (also called a solder resist or the like) of the circuit board or to the seat plate of this product.
- Moreover, as another example rather than the one resulting from flux gas, at the time of mounting to a circuit board, there may be cases where solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part. Such an undesirable phenomenon occurs, regardless of the presence or absence of auxiliary terminals.
- In addition, in a conventional chip type capacitor, since auxiliary terminals are arranged on a bottom surface of a seat plate, there is a problem in which the quality (propriety) of a solder fixing state of the auxiliary terminals is difficult to judge from the outside after soldering.
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- Patent Literature 1: Japanese Patent Laid-Open No. 2008-244033
- Patent Literature 2: Japanese Patent Laid-Open No. 2012-138414
- Accordingly, a first object of the present invention is, in a surface-mount capacitor formed by attaching a seat plate for surface mounting (chipping) to an aluminum electrolytic capacitor, to suppress voids and cracks, a solder ball or the like, which impair the reliability of a product, from occurring at the time of soldering.
- Moreover, a second object of the present invention is, in a surface-mount capacitor formed by attaching a seat plate for surface mounting (chipping) to an aluminum electrolytic capacitor, to enable the quality of soldering to a circuit board to be visually judged.
- In order to address the first object, a first invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which the seat plate has a pair of lead terminal insertion holes through each of which one of the lead terminals is inserted, lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, and auxiliary terminals that are integrated with the lead terminals at the time of soldering are embedded along each of the lead terminal housing grooves, each of the lead terminals is inserted into one of the lead terminal insertion holes, a distal portion of each of the lead terminals is housed within one of the lead terminal housing grooves by being bent, and is soldered at a prescribed position of a circuit board together with one of the auxiliary terminals, and
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- a gas release groove for releasing flux gas generated at the time of the soldering is formed on each of the auxiliary terminals.
- Moreover, in order to address the first object, a second invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which the seat plate has a pair of lead terminal insertion holes through each of which the lead terminals are inserted, and lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, each of the lead terminals is inserted into one of the lead terminal insertion holes, and is soldered to a solder land part formed on a circuit board in a state where housed within one of the lead terminal housing grooves by being bent, and
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- a direction orthogonal to an extension direction of the lead terminal housing grooves is set as a width direction, and the lead terminal housing grooves each comprise a widened width part for forming a prescribed gap on both sides of each of the lead terminals, the widened width part being wider than a width of each of the lead terminals.
- Moreover, in order to address the second object, a third invention is a surface-mount capacitor that includes a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, in which
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- the seat plate has a pair of lead terminal insertion holes through each of which the lead terminals are inserted, and lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite sides of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate,
- each of the lead terminals is inserted into one of the lead terminal insertion holes, and is soldered to a solder land part formed on a circuit board in a state where housed within one of the lead terminal housing grooves by being bent, and
- soldering auxiliary parts having a metal material and allowing a soldered state to be visually observed from outside are arranged adjacent to end parts of each of the lead terminal housing grooves on lower end edges of side surfaces of the seat plate.
- According to the first and second inventions, in a surface-mount capacitor formed by attaching a seat plate for surface mounting to an aluminum electrolytic capacitor, it is possible to suppress the occurrence of voids and cracks due to flux gas generated at the time of soldering.
- Moreover, according to the third invention, in a surface-mount capacitor formed by attaching a seat plate for surface mounting to an aluminum electrolytic capacitor, it is possible to visually judge the quality of soldering to a circuit board.
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FIG. 1 is a plan view showing a seat plate for surface mounting of a chip type capacitor relating to a first embodiment of the present invention. -
FIG. 2 is a right side view of the seat plate for surface mounting relating to the first embodiment. -
FIG. 3 is a front view showing, as a partial cross-section, an A-A line portion inFIG. 1 of the seat plate for surface mounting relating to the first embodiment, along with an aluminum electrolytic capacitor. -
FIG. 4 is a bottom view showing the seat plate for surface mounting relating to the first embodiment. -
FIG. 5 is a main part enlarged view showing enlarged an auxiliary terminal portion ofFIG. 4 . -
FIG. 6 is a perspective view showing auxiliary terminals attached to the seat plate for surface mounting relating to the first embodiment in a state where suspended on a hoop material. -
FIG. 7 is a front view ofFIG. 6 . -
FIG. 8 is a front view showing a surface-mount capacitor relating to a second embodiment of the present invention separated into a capacitor main body and a seat plate for surface mounting, and showing each as a cross-section. -
FIG. 9 is a perspective view of the seat plate for surface mounting relating to the second embodiment seen from an upper surface side. -
FIG. 10 is a perspective view of the seat plate for surface mounting relating to the second embodiment seen from a bottom surface side. -
FIG. 11 is a bottom view of the seat plate for surface mounting relating to the second embodiment, and is a view for describing the relationship of the width dimensions of lead terminals, lead terminal housing grooves, and a solder land part. -
FIG. 12 is a perspective view seen from a bottom surface side showing a different embodiment of the seat plate for surface mounting relating to the second embodiment. -
FIG. 13 is a front view showing a surface-mount capacitor relating to a third embodiment of the present invention separated into a capacitor main body and a seat plate for surface mounting, and showing each as a cross-section. -
FIG. 14 is a perspective view of the seat plate for surface mounting relating to the third embodiment seen from an upper surface side. -
FIG. 15 a is a perspective view of the seat plate for surface mounting relating to the third embodiment seen from a bottom surface side. -
FIG. 15 b is a perspective view showing a modified example of the soldering auxiliary parts ofFIG. 15 a. -
FIG. 16 FIG. 16 is a cross-section view enlarging a portion of a soldering auxiliary part from within the seat plate relating to the third embodiment. -
FIG. 17 a is a perspective view of a portion of soldering auxiliary parts relating to the third embodiment seen from a bottom surface side. -
FIG. 17 b is a perspective view showing a modified example of the soldering auxiliary parts ofFIG. 17 a. - Next, while several embodiments of the present invention will be described by referring to the figures, the present invention is not limited to these embodiments.
- First, by referring to
FIG. 1 toFIG. 3 , in particular,FIG. 3 , aseat plate 10 relating to a first embodiment is a seat plate for setting an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1 as a chip type capacitor in a form that can be surface mounted to a circuit board or the like, which is not illustrated. Note that a seat plate for chipping of this type is also called a pedestal. - The capacitor
main body 1 to which thisseat plate 10 is applied is a lead same direction type (also called a discrete type) capacitor from which a pair oflead terminals outer case 3 with acapacitor element 2 built therein. - Normally, the
outer case 3 has a bottomed cylindrical shape made of aluminum, and an opened part of theouter case 3 is closed by a rubber sealingbody 6 formed from butyl rubber, for example, as the sealing part 4. In order to improve airtightness of the sealing part 4,lateral throttle grooves 7 are formed in the circumferential direction along therubber sealing body 6 on the outer peripheral surfaces of theouter case 3. - In this example, the
lead terminal 5 a is on an anode side, thelead terminal 5 b is on a cathode side, and both are led out to the outside through therubber sealing body 6. Note that, in the case where it is not necessary to distinguish thelead terminals lead terminals 5. - The
seat plate 10 has a square shape in which two adjacent corner parts are obliquely cut off in the plan view ofFIG. 1 , and the entire body is formed from a heat-resistant synthetic resin.FIG. 1 is acomponent mounting surface 10 a side on which the capacitormain body 1 of theseat plate 10 is placed, andFIG. 4 is abottom surface 10 b side of theseat plate 10 opposite to a circuit board, which is not illustrated, at the time of soldering. - A pair of lead
terminal insertion holes lead terminals seat plate 10. Note that, in the case where it is not necessary to distinguish the leadterminal insertion holes terminal insertion holes 11. - Lead
terminal housing grooves terminal insertion holes opposite side edges seat plate 10 in opposite directions away from each other, are formed on thebottom surface 10 b of theseat plate 10. In the case where it is not necessary to distinguish the leadterminal housing grooves terminal housing grooves 12. In the case where it is not necessary to distinguish the side edges 13 a and 13 b, they will be collectively called the side edges 13. - The capacitor
main body 1 is placed on thecomponent mounting surface 10 a of theseat plate 10, while inserting thelead terminals lead terminals terminal housing grooves main body 1 can be set as achip type capacitor 1A that can be surface mounted on a circuit board. - In a lot of cases, mounting to the circuit board is performed by reflow soldering, and
auxiliary terminals 20 are used, in order to increase the soldering strength (mounting strength). In the first embodiment, theauxiliary terminals 20 are provided at a total of four locations on both sides of the leadterminal housing groove 12 a and both sides of the leadterminal housing groove 12 b, and are integrated with thelead terminals 5 by a soldering material at the time of soldering. In the present embodiment, theauxiliary terminals 20 are made of brass. - It is preferable for each of the
auxiliary terminals 20 to be integrally embedded in theseat plate 10 by insert molding in a mold. Accordingly, as shown inFIG. 6 andFIG. 7 , each of theauxiliary terminals 20 is conveyed inside the mold in a state where supported by ahoop material 40 as a pair ofauxiliary terminals terminal housing grooves auxiliary terminal 20 b are horizontally symmetrical, in a state where supported by thehoop material 40. - The
auxiliary terminals 20 each include amain plate part 21 that occupies a large portion of theauxiliary terminal 20. Themain plate part 21 is attached (embedded) on the side of the leadterminal housing groove 12 on thebottom surface 10 b of theseat plate 10 so that the surface is exposed. - A
flange piece 22 raised at a substantially right angle from themain plate part 21, so as to be exposed within the leadterminal housing groove 12, is formed on one side edge of themain plate part 21 facing the leadterminal housing groove 12. Ahole 221, in which resin enters at the time of injection molding, is bored into theflange piece 22. - An
anchor piece 23, which is bent obliquely upward so as to bite into theseat plate 10, is connected to the side edge of themain plate part 21 on an opposite side to the one side edge. Ahole 231, in which resin enters at the time of injection molding, is bored into theanchor piece 23. - A
gas release groove 24 for releasing flux gas generated at the time of soldering is formed on themain plate part 21. While it is preferable for thisgas release groove 24 to be a slit, it may be gutter shaped with a groove bottom. Moreover, there may be a plurality of thegas release grooves 24. - In the first embodiment, the
gas release groove 24 is formed from a central portion of themain plate part 21 to a side edge 113 (13 a, 13 b) of theseat plate 10. It is preferable for the area occupied by thegas release groove 24 in themain plate part 21 to be from 10% to 65% of the area of themain plate part 21 prior to thegas release groove 24 being formed. - In the first embodiment, while the area occupied by the
gas release groove 24 with respect to themain plate part 21 is to the extent of 20%, it is preferable for the proportion occupied by thegas release groove 24 with respect to themain plate part 21 to be optimized by the size of theseat plate 10 or the like. Moreover, in the present embodiment, while the end part of thegas release groove 24 is opened toward theside edge 13 of theseat plate 10, thegas release groove 24 may be formed toward an opposite side to this (right side inFIG. 5 ), or may be formed toward a side where there is no solder (lower side inFIG. 5 ). - The
side edge 13 side of theseat plate 10 of themain plate part 21 is branched into two by thegas release groove 24, and from among thesebranch pieces branch plate part 26 is provided on thebranch piece 25 b separated from the leadterminal housing groove 12. Thebranch plate part 26 is bent at a right angle from thebranch piece 25 b along aside piece 13 of theseat plate 10. Note that, thebranch plate part 26 may be formed on thebranch piece 25 a side. Themain plate part 21 and thebranch plate part 26 are soldering parts of theauxiliary terminal 20 to a circuit board. - The auxiliary terminals 20 (20 a, 20 b) are separated from the
hoop material 40 at the portion of the two-dot chain line DL ofFIG. 6 andFIG. 7 after mounting or after injection molding within a mold, and a large portion of thebranch plate part 26 is attached (embedded) to theside edge 13 of theseat plate 10 so that the surface is exposed at the time of injection molding of theseat plate 10. In this way, theauxiliary terminals 20 are respectively attached to both sides of the leadterminal housing grooves bottom surface 10 b of theseat plate 10. - When this
chip type capacitor 1A is attached to a circuit board, which is not illustrated, by a reflow soldering method, for example, thelead terminals 5 and theauxiliary terminals 20 are integrally soldered to a land part of the circuit board by this molten solder. Moreover, since solder creeps up along thebranch plate part 26, thelead terminals 5 and theauxiliary terminals 20 are firmly attached to the circuit board. Moreover, since flux gas generated at this time is released from thegas release grooves 24, it is possible to suppress voids and cracks from occurring in the soldering parts. - On the other hand, retaining
parts 30, which suppress rattling of the capacitormain body 1, are provided on thecomponent mounting surface 10 a of theseat plate 10. In the present embodiment, the retainingparts 30 are formed as pillars 31 erected at the four corners of theseat plate 10 so as to make contact with theouter case 3. Each of the pillars 31 has a height that at least exceeds thelateral throttle grooves 7 for sealing formed on theouter case 3. - Moreover, from among the four
pillars 31 a to 31 d, thepillars pillars pillars pillars FIG. 1 andFIG. 4 , having twoadjacent corner parts seat plate 10 obliquely cut out is also to facilitate polarity discrimination. - Note that, as another example of the retaining
parts 30, the retainingparts 30 may be a cylindrical wall that surrounds theouter case 3, under a condition that the height is a height exceeding thelateral throttle grooves 7 for sealing. - First, by referring to
FIG. 8 , a surface-mount capacitor relating to a second embodiment includes an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1, and a seat plate (hereinafter, also simply called a “seat plate”) 100 for surface mounting. Note that, in the second embodiment, auxiliary terminals for increasing the soldering strength are not provided on theseat plate 100. - The capacitor
main body 1 is a lead same direction type (also called a discrete type) capacitor from which a pair oflead terminals outer case 3 with acapacitor element 2 built therein. - The
outer case 3 may have a bottomed cylindrical shape made of aluminum, and an opened part of theouter case 3 is closed by arubber sealing body 6 as the sealing part 4. It is preferable for therubber sealing body 6 to be formed from butyl rubber. In order to improve airtightness of the sealing part 4,lateral throttle grooves 7 are formed in the circumferential direction along therubber sealing body 6 on the outer peripheral surfaces of theouter case 3. - In this example, the
lead terminal 5 a is on an anode side, thelead terminal 5 b is on a cathode side, and both are led out to the outside through therubber sealing body 6. Note that, in the case where it is not necessary to distinguish thelead terminals lead terminals 5. - While the
lead terminals 5 are originally round bar shaped wires, thelead terminals 5, after being led out to the outside through therubber sealing body 6, are processed into flat band shapes by a pressing process. - By also referring to
FIG. 9 , theseat plate 100 has a square shape (deformed hexagonal shape) in which twoadjacent corner parts adjacent corner parts seat plate 100 obliquely cut out is also to facilitate polarity discrimination. In the second embodiment, the obliquely cut offcorner parts - A circular concave part, into which the sealing part 4 of the capacitor
main body 1 is fitted, is formed on anupper surface 100 a side, which is the component mounting surface of theseat plate 100. Moreover, retainingparts 300, which surround the sealing part 4 of the capacitormain body 1, are provided on theupper surface 100 a side of theseat plate 100. - In the first embodiment, the retaining
parts 300 are formed as pedestal parts 310 erected at four corners of theseat plate 100 so as to make contact with the sealing part 4 of the capacitormain body 1. In this case, from among the fourpedestal parts 311 a to 311 d, thepedestal parts 311 a and 311 b on the cathode side have a height that is higher than that of thepedestal parts 311 c and 311 d on the anode side, for polarity discrimination. In contrast to this, thepedestal parts 311 c and 311 d on the anode side may be higher than thepedestal parts 311 a and 311 b on the cathode side. - A pair of lead terminal insertion holes 111 a and 111 b, through which the
lead terminals seat plate 100. Note that, in the case where it is not necessary to distinguish the lead terminal insertion holes 111 a and 111 b, they will be collectively called the lead terminal insertion holes 111. - As shown in
FIG. 10 , leadterminal housing grooves seat plate 100 in opposite directions away from each other, are formed on thebottom surface 100 b of theseat plate 100. Moreover, disk shapedspacers 114, which maintain theseat plate 100 at a prescribed height from a circuit board, which is not illustrated, at the time of mounting on the circuit board, are formed at four corners on thebottom surface 110 b of theseat plate 100. - In the case where it is not necessary to distinguish the lead
terminal housing grooves terminal housing grooves 112. Moreover, in the case where it is not necessary to distinguish the side edges 113 a and 113 b, they will be collectively called the opposite side edges 113. - The capacitor
main body 1 is placed on the upper surface (component mounting surface) 100 a of theseat plate 100, while inserting thelead terminals lead terminals terminal housing grooves main body 1 can be set as a surface-mount capacitor 1A that can be surface mounted on a circuit board. - While, in a lot of cases, mounting to the circuit board is performed by reflow soldering, at this time, flux gas (gasified flux) is generated, and there may be cases where voids or cracks occur due to flux gas remaining in a fillet.
- Moreover, there may be cases where solder paste applied to a solder land part is pushed to the outside of the solder land part by the generated flux gas, becomes spherical due to heat at the time of soldering, solidifies into a solder ball, and adheres, for example, to a solder mask (also called a solder resist or the like) or to the seat plate.
- Moreover, as another example rather than the one resulting from flux gas, at the time of mounting to a circuit board, there may be cases where solder paste applied to a solder land part is crushed by the lead terminals, the area of this crushed part expands, solder does not return to the solder land part when melted due to heat at the time of soldering, and remains as a solder ball outside the solder land part.
- In order to prevent such an undesirable phenomenon, in the second embodiment, such as shown in
FIG. 11 , the lead terminal housing grooves 112 (112 a, 112 b) include widenedwidth parts 120 for forming prescribed gaps (clearances) on both sides of the lead terminals 5 (5 a, 5 b) that are greater than the width of the lead terminals (5 a, 5 b). - Namely, a direction orthogonal to the extension direction of the lead terminal housing grooves 112 (a direction from one
side surface 113 a to theother side surface 113 b, or from theother side surface 113 b to the oneside surface 113 a) is set as a width direction, and a width Wa of each of the leadterminal housing grooves 112 is greater than a width Wb of each of thelead terminals 5. Therefore, a widenedwidth part 120 having a width of (Wa−Wb)/2 is provided on both sides of each of thelead terminals 5. - While the width Wa of the lead
terminal housing grooves 112 may be greater than the width Wb of thelead terminals 5, if the width Wa of the leadterminal housing grooves 112 is too wide, the strength of the seat plate itself is lowered, and there is the risk, for example, of being deformed at the time of reflow soldering. - Accordingly, in order to achieve both the ease of release of flux gas and the strength of the seat plate itself, the width Wa of the lead
terminal housing grooves 112 is preferably 200% to 400% of the width Wb of thelead terminals 5, more preferably 200% to 300%, and in particular, it is preferable for deformations, such as warping of the seat plate, to not be observed at the time of reflow soldering to the circuit board. - For the following examples (Comparative Examples 1-4, Examples 1 and 2 of the present invention), which have a surface-mount capacitor for a vehicle as a test product, reflow soldering was actually performed, and each item of a solder ball generation number, a presence or absence of deformation at the time of heating, a seat plate strength, and a productivity (presence or absence of seat plate deformation at the time of assembly), were investigated. The number of test products was 30 in each example.
- The width Wa of the lead
terminal housing grooves 112 was set to 100% of the width Wb of thelead terminals 5. -
- Solder ball generation number: average of 3.8 per one product
- Presence or absence of deformation at time of heating: none
- Seat plate strength: pass
- Productivity (presence or absence of deformation of seat plate at time of assembly): good productivity with no deformation
- The width Wa of the lead
terminal housing grooves 112 was set to 150% of the width Wb of thelead terminals 5. -
- Solder ball generation number: average of 2.3 per one product
- Presence or absence of deformation at time of heating: none
- Seat plate strength: pass
- Productivity (presence or absence of deformation of seat plate at time of assembly): good productivity with no deformation
- The width Wa of the lead
terminal housing grooves 112 was set to 180% of the width Wb of thelead terminals 5. -
- Solder ball generation number: average of 1.1 per one product
- Presence or absence of deformation at time of heating: none
- Seat plate strength: pass
- Productivity (presence or absence of deformation of seat plate at time of assembly): good productivity with no deformation
- The width Wa of the lead
terminal housing grooves 112 was set from 200% to 300% of the width Wb of thelead terminals 5. -
- Solder ball generation number: solder ball generation number was 0 for 30 products.
- Presence or absence of deformation at time of heating: none
- Seat plate strength: pass
- Productivity (presence or absence of deformation of seat plate at time of assembly): good productivity with no deformation
- The width Wa of the lead
terminal housing grooves 112 was set from 301% to 400% of the width Wb of thelead terminals 5. -
- Solder ball generation number: solder ball generation number was 0 for 30 products.
- Presence or absence of deformation at time of heating: no deformation to the extent of having an influence on the soldering strength.
- Seat plate strength: pass
- Productivity (presence or absence of deformation of seat plate at time of assembly): good productivity with no deformation to the extent of having an influence on the productivity.
- The width Wa of the lead
terminal housing grooves 112 exceeded 400% of the width Wb of thelead terminals 5. -
- Solder ball generation number: solder ball generation number was 0 for 30 products.
- Presence or absence of deformation at time of heating: strength of the seat plate was reduced, and deformation, while small, was observed at the time of heating.
- Seat plate strength: failed
- Productivity (presence or absence of deformation of seat plate at time of assembly): not good productivity with deformation
- These results are shown in the following Table 1.
-
TABLE 1 Solder ball Deformation Seat plate generation at time Seat plate Productivity groove width number of heating strength (not good rate) Comparative 3.8 None ⊚ Pass Good Example 1 (100%) Comparative 2.3 None ⊚ Pass Good Example 2 (150%) Comparative 1.1 None ⊚ Pass Good Example 3 (180%) Example 1 0 None ⊚ Pass Good (200% to 300%) Example 2 0 *1 None ◯ Pass *2 Good (301% to 400%) Comparative 0 Small Δ Failed Not good Example 4 (more than 401%) - Moreover, in order to allow flux gas to escape from the
bottom surface 100 b of theseat plate 100, it is preferable for the widenedwidth parts 120 to be formed from base ends of the leadterminal insertion hole 111 sides to the side edges 113 of theseat plate 100. - In
FIG. 11 , while thereference numeral 130 is a solder land part formed on the circuit board side for soldering thelead terminals 5, the width Wa of the leadterminal housing grooves 112 is greater than a width Wc of thesolder land part 130. - According to this, at the time of mounting to the circuit board, even if solder paste applied to the
solder land part 130 is crushed by thelead terminals 5, and the area is wide, it remains within the widenedwidth parts 120. Therefore, solder balls are not generated on a solder mask or the bottom surface of theseat plate 100. - As described above, if the width Wa of the lead
terminal housing grooves 112 is greater than the width Wb of thelead terminals 5, there is the risk that the directions will deviate when thelead terminals terminal housing grooves 112, and thelead terminals - Accordingly, in the second embodiment, the lead
terminal housing grooves 112 each include a pair of direction restricting means (guide means) 115 in an intermediate portion from a base end of the leadterminal insertion hole 111 side to theside edge 113 of theseat plate 100 side, the pair of direction restricting means 115 has one of thelead terminals 5 fitted therebetween and restricts (guides) the extension direction of thelead terminal 5. In the description of the second embodiment, the following two aspects are included for thedirection restricting means 115. - First, the direction restricting means 115 relating to a first aspect are each made of an overhanging
arm 115 a formed in a protruding shape from an inner edge of the leadterminal housing grooves 112 to inside the groove, such as shown inFIG. 10 andFIG. 11 . - Next, the direction restricting means 115 relating to a second aspect are each made of a columnar projection (boss) 115 b formed in an island shape within the lead
terminal housing grooves 112. - Note that, anything other than the overhanging
arms 115 a andcolumnar projections 115 b can be adopted as the direction restricting means 115, as long as thelead terminals - First, by referring to
FIG. 13 , a surface-mount capacitor relating to a third embodiment includes an aluminum electrolytic capacitor (hereinafter, also called a “capacitor main body”) 1, and a seat plate (hereinafter, also simply called a “seat plate”) 100 for surface mounting. - The capacitor
main body 1 is a lead same direction type (also called a discrete type) capacitor from which a pair oflead terminals outer case 3 with acapacitor element 2 built therein. - The
outer case 3 may have a bottomed cylindrical shape made of aluminum, and an opened part of theouter case 3 is closed by arubber sealing body 6 as the sealing part 4. It is preferable for therubber sealing body 6 to be formed from butyl rubber. In order to improve airtightness of the sealing part 4,lateral throttle grooves 7 are formed in the circumferential direction along therubber sealing body 6 on the outer peripheral surfaces of theouter case 3. - In this example, the
lead terminal 5 a is on a cathode side, thelead terminal 5 b is on an anode side, and both are led out to the outside through therubber sealing body 6. Note that, in the case where it is not necessary to distinguish thelead terminals lead terminals 5. - While the
lead terminals 5 are originally round bar shaped wires, thelead terminals 5, after being led out to the outside through therubber sealing body 6, are processed into flat band shapes by a pressing process. - By also referring to
FIG. 14 , theseat plate 100 has a square shape (deformed hexagonal shape) in which twoadjacent corner parts adjacent corner parts seat plate 100 obliquely cut out is also to facilitate polarity discrimination. In the present embodiment, the obliquely cut offcorner parts - A circular concave part, into which the sealing part 4 of the capacitor
main body 1 is fitted, is formed on anupper surface 100 a side, which is the component mounting surface of theseat plate 100. Moreover, retainingwalls 300, which surround the sealing part 4 of the capacitormain body 1, are provided on theupper surface 100 a side of theseat plate 100. - In the present embodiment, the retaining
walls 300 are formed aspedestal parts 311 erected at four corners of theseat plate 100 so as to make contact with the sealing part 4 of the capacitormain body 1. In this case, from among the fourpedestal parts 311 a to 311 d, thepedestal parts 311 a and 311 b on the cathode side have a height that is higher than that of thepedestal parts 311 c and 311 d on the anode side, for polarity discrimination. In contrast to this, thepedestal parts 311 c and 311 d on the anode side may be higher than thepedestal parts 311 a and 311 b on the cathode side. - A pair of lead terminal insertion holes 111 a and 111 b, through which the
lead terminals seat plate 100. Note that, in the case where it is not necessary to distinguish the lead terminal insertion holes 111 a and 111 b, they will be collectively called the lead terminal insertion holes 111. - As shown in
FIG. 15 a , leadterminal housing grooves seat plate 100 in opposite directions away from each other, are formed on thebottom surface 110 b of theseat plate 100. Moreover, disk shapedspacers 114, which maintain theseat plate 100 at a prescribed height from a circuit board, which is not illustrated, at the time of mounting on the circuit board, are formed at four corners on thebottom surface 110 b of theseat plate 100. - In the case where it is not necessary to distinguish the lead
terminal housing grooves terminal housing grooves 112. Moreover, in the case where it is not necessary to distinguish the opposite side surfaces 113 a and 113 b, they will be collectively called the opposite side surfaces 113. Note that, while theseat plate 100 includes two other opposite side surfaces, in addition to the side surfaces 113 a and 113 b, in the present embodiment, no processing is applied to the two other opposite side surfaces. - The capacitor
main body 1 is placed on the upper surface (component mounting surface) 100 a of theseat plate 100, while inserting thelead terminals lead terminals terminal housing grooves main body 1 can be set as a surface-mount capacitor 1A that can be surface mounted on a circuit board. - In a lot of cases, mounting of the surface-
mount capacitor 1A to the circuit board (not illustrated) is performed by reflow soldering. Namely, cream solder is applied to a solder land part formed on the circuit board, and after thelead terminals mount capacitor 1A are placed thereon, the cream solder is melted and soldered by heating within a heating furnace. - However, since the
lead terminals bottom surface 100 b side of theseat plate 100, it will be difficult to visually observe from the outside whether soldering has been performed satisfactorily. - By referring to
FIG. 15 toFIG. 17 , in the third embodiment, solderingauxiliary parts 400, which allow a soldered state to be visually observed from the outside, are provided adjacent to the end parts of the leadterminal housing grooves 112. - In the third embodiment, as shown in
FIG. 15 a , the solderingauxiliary parts 400 are provided at a total of four locations, which are two locations on both the left and right sides of the end part of theside surface 113 a side of one leadterminal housing groove 112 a, and two locations on both the left and right sides of the end part of theside surface 113 b side of the other leadterminal housing groove 112 b. - While these soldering
auxiliary parts 400 may have the same configuration, the configuration of each of the solderingauxiliary parts 400 may be individually changed in accordance with, for example, the shape of a solder land part on the circuit board side. Moreover, as shown inFIG. 15 b , the solderingauxiliary parts 400 may be formed across the entire width on the lower end edges of the side surfaces 113 of theseat plate 100. - While the soldering
auxiliary parts 400 are provided on the lower end edges of the side surfaces 113 of theseat plate 100, it is preferable to includeinclined surfaces 410 formed from the side surfaces 113 to thebottom surface 100 b of theseat plate 100. In the aspect shown inFIG. 17 a , theinclined surfaces 410 are formed from a middle portion of theside surface 113 of theseat plate 100 to thebottom surface 110 b, and as shown inFIG. 17 b , they may be formed from an upper edge of theside surface 113 of theseat plate 100 to thebottom surface 110 b. - Moreover, as shown in
FIGS. 17 a and 17 b , while it is preferable for theinclined surfaces 410 to be spatially connected to the end parts of the leadterminal housing grooves 112, they may be formed separated away from the leadterminal housing grooves 112. - A
solderable metal material 420 is provided on the inclined surfaces 410. Themetal material 420 may be formed by vapor disposition, plating, or a metal plate. As a preferred aspect, iron, brass, nickel, titanium, copper, tin, or an alloy thereof is used for themetal material 420. - In the case where a metal plate is used as the
metal material 420, while the metal plate is fixed to each of theinclined surfaces 410 by an adhesive or embedding, by including the cases of vapor disposition and plating, it is preferable for theinclined surfaces 410 to be roughened to improve adhesion with themetal material 420. - Moreover, it is preferable for an angle of each of the
inclined surfaces 410 with respect to a flat plane including thebottom surface 100 b of theseat plate 100 to be from 45 degrees to 80 degrees. By providing theinclined surfaces 410, accordingly, the strength of theseat plate 100 are reduced. Therefore, there is the risk of cracks or chips occurring in theseat plate 100, for example, at the time of mounting to the capacitormain body 1 or the like. - In order to prevent this, the following measures are taken in the third embodiment. As described above, the
seat plate 100 includes substantiallyannular retaining walls 300, into which the capacitormain body 1 is fitted, on theupper surface 100 a thereof. - By referring to
FIG. 16 , in one of the retainingwalls 300, a wall thickness of a wall portion (pedestal part 311 in the present embodiment) positioned above theinclined surface 410 is set to TA, a projection width of theinclined surface 410 in a plane view is set to TB, and TB<TA. Therefore, cracks or chips do not occur in theseat plate 100, for example, at the time of mounting to the capacitormain body 1. - According to the third embodiment, since the soldering
auxiliary parts 400, which have ametal material 420 and allow a soldered state to be visually observed from outside, are arranged adjacent to the end parts of the leadterminal housing grooves 112 on the lower end edges of the side surfaces 113 of theseat plate 100, a judgment can be performed for the quality of soldering by the attachment condition to the solderingauxiliary parts 400, for example, at the time of reflow soldering. Moreover, since the solderingauxiliary parts 400 are soldered to a solder land part of the circuit board, accordingly, the soldering strength are increased. - Heretofore, while the present invention has been described by using embodiments, the technical scope of the present invention is not limited to the description of the embodiments. Modifications or improvements added to the embodiments by a person skilled in the art are included in the technical scope of the present invention.
-
-
- 1 capacitor main body
- 1A chip type capacitor (surface-mount capacitor)
- 2 capacitor element
- 3 outer case
- 4 sealing part
- 5 (5 a, 5 b) lead terminal
- 6 rubber sealing body
- 7 lateral throttle groove
- 10 seat plate
- 10 a component mounting surface
- 10 b bottom surface
- 11 (11 a, 11 b) lead terminal insertion hole
- 12 (12 a, 12 b) lead terminal housing groove
- 13 (13 a, 13 b) side edge
- 20 (20 a, 20 b) auxiliary terminal
- 21 main plate part
- 22 flange piece
- 23 anchor piece
- 24 gas release groove
- 26 branch plate part
- 30 retaining part
- 31 (31 a-31 d) pillar
- 100 seat plate
- 100 a seat plate upper surface (component mounting surface)
- 100 b seat plate bottom surface
- 111 (111 a, 111 b) lead terminal insertion hole
- 112 (112 a, 112 b) lead terminal housing groove
- 113 (113 a, 113 b) side surface
- 114 spacer
- 115 direction restricting means
- 115 a overhanging arm
- 115 b columnar projection
- 120 widened width part
- 300 retaining part
- 311 (311 a-311 d) pedestal part
- 400 soldering auxiliary part
- 410 inclined surface
- 420 metal material
- Wa lead terminal housing groove width
- Wb lead terminal width
- Wc solder land part width
Claims (23)
1. A surface-mount capacitor comprising a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, wherein
the seat plate has a pair of lead terminal insertion holes through each of which one of the lead terminals is inserted, lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, and auxiliary terminals that are integrated with the lead terminals at the time of soldering are embedded along each of the lead terminal housing grooves,
each of the lead terminals is inserted into one of the lead terminal insertion holes, a distal portion of each of the lead terminals is housed within one of the lead terminal housing grooves by being bent, and is soldered at a prescribed position of a circuit board together with one of the auxiliary terminals, and
a gas release groove for releasing flux gas generated at the time of the soldering is formed on each of the auxiliary terminals.
2. The surface-mount capacitor according to claim 1 , wherein the auxiliary terminals each comprise a main plate part as a soldering part to the circuit board, the main plate part being attached to the bottom surface of the seat plate by leaving a surface portion at the time of resin molding of the seat plate, and a branch plate part connected to the main plate part and attached to a side edge of the seat plate.
3. The surface-mount capacitor according to claim 1 , wherein the gas release grooves are each formed from a central portion of the main plate part to a side edge of the seat plate.
4. The surface-mount capacitor according to claim 3 , wherein an area occupied by each of the gas release grooves in the main plate part is 10% to 65% of an area of the main plate part before the gas release groove has been formed.
5. The surface-mount capacitor according to claim 1 , wherein a retaining part having a height exceeding a lateral throttle groove for sealing formed on the outer case is formed on a component mounting surface side of the seat plate.
6.-12. (canceled)
13. A surface-mount capacitor comprising a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, wherein
the seat plate has a pair of lead terminal insertion holes through each of which the lead terminals are inserted, and lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate,
each of the lead terminals is inserted into one of the lead terminal insertion holes, and is soldered to a solder land part formed on a circuit board in a state where housed within one of the lead terminal housing grooves by being bent, and
a direction orthogonal to an extension direction of the lead terminal housing grooves is set as a width direction, and the lead terminal housing grooves each comprise a widened width part for forming a prescribed gap on both sides of each of the lead terminals, the widened width part being wider than a width of each of the lead terminals.
14. The surface-mount capacitor according to claim 13 , wherein the widened width parts are each formed from a base end of the lead terminal insertion hole side to a side edge of the seat plate.
15. The surface-mount capacitor according to claim 13 , wherein the widened width parts each have a width wider than a width of the solder land part of the circuit board side.
16. The surface-mount capacitor according to claim 13 , wherein the lead terminal housing grooves each comprise a pair of direction restricting means on an intermediate portion from a base end of the lead terminal insertion hole side to a side edge of the seat plate, the pair of direction restricting means each having one of the lead terminals fitted therein and restricting an extension direction of the lead terminal.
17. The surface-mount capacitor according to claim 16 , wherein the direction restricting means are each made of an overhanging arm formed in a protruding shape from an inner edge of one of the lead terminal housing grooves to inside the groove.
18. The surface-mount capacitor according to claim 16 , wherein the direction restricting means are each made of a columnar projection formed in an island shape within one of the lead terminal housing grooves.
19.-26. (canceled)
27. A surface-mount capacitor comprising a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of an outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, wherein
the seat plate has a pair of lead terminal insertion holes through each of which the lead terminals are inserted, and lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite sides of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate,
each of the lead terminals is inserted into one of the lead terminal insertion holes, and is soldered to a solder land part formed on a circuit board in a state where housed within one of the lead terminal housing grooves by being bent, and
soldering auxiliary parts having a metal material and allowing a soldered state to be visually observed from outside are arranged adjacent to end parts of each of the lead terminal housing grooves on lower end edges of side surfaces of the seat plate.
28. The surface-mount capacitor according to claim 27 , wherein the soldering auxiliary parts each have an inclined surface formed from the side surface of the seat plate to the bottom surface, and each have the metal material provided on the inclined surface.
29. The surface-mount capacitor according to claim 28 , wherein an angle of the inclined surface with respect to a flat plane including the bottom surface is from 45 degrees to 80 degrees.
30. The surface-mount capacitor according to claim 28 , wherein the inclined surface is spatially connected to an end part of one of the lead terminal housing grooves.
31. The surface-mount capacitor according to claim 27 , wherein the metal material is formed by vapor disposition, plating, or a metal plate.
32. The surface-mount capacitor according to claim 27 , wherein iron, brass, nickel, titanium, copper, tin, or an alloy thereof is used for the metal material.
33. The surface-mount capacitor according to claim 28 , wherein the inclined surface is roughened to improve adhesion with the metal material.
34. The surface-mount capacitor according to claim 31 , wherein the metal plate is used for the metal material, and the metal plate is fixed to the inclined surface by an adhesive or embedding.
35. The surface-mount capacitor according to claim 28 , wherein the seat plate has a substantially annular retaining wall on an upper surface side thereof, the capacitor main body being fitted into the retaining wall, a wall thickness of a wall portion of the retaining wall positioned above the inclined surface is set to TA, a projection width of the inclined surface in a planar view is set to TB, and TB<TA.
36.-45. (canceled)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021060482A JP2022156675A (en) | 2021-03-31 | 2021-03-31 | Chip capacitor and base plate for making them into chip |
JP2021-060482 | 2021-03-31 | ||
JP2022010732A JP2023109297A (en) | 2022-01-27 | 2022-01-27 | Surface mount type capacitor and base plate and electronic component for surface mounting |
JP2022-010732 | 2022-01-27 | ||
JP2022046447A JP2023140556A (en) | 2022-03-23 | 2022-03-23 | Surface mount capacitor, seat plate for surface mount, and electronic component |
JP2022-046447 | 2022-03-23 | ||
PCT/JP2022/015791 WO2022210826A1 (en) | 2021-03-31 | 2022-03-30 | Surface-mount capacitor, seat plate for surface mounting, and electronic component |
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US20240120150A1 true US20240120150A1 (en) | 2024-04-11 |
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US18/280,401 Pending US20240120150A1 (en) | 2021-03-31 | 2022-03-30 | Surface-mount capacitor |
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US (1) | US20240120150A1 (en) |
EP (1) | EP4318512A1 (en) |
KR (1) | KR20230164063A (en) |
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JP3601585B2 (en) * | 1999-12-17 | 2004-12-15 | エルナー株式会社 | Chip type aluminum electrolytic capacitor |
JP2002025859A (en) * | 2000-07-11 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Chip-type aluminum electrolytic capacitor |
JP2008141079A (en) * | 2006-12-05 | 2008-06-19 | Saga Sanyo Industries Co Ltd | Electrolytic capacitor |
JP2008244033A (en) | 2007-03-27 | 2008-10-09 | Nippon Chemicon Corp | Chip type capacitor |
JP5802387B2 (en) | 2010-12-24 | 2015-10-28 | サン電子工業株式会社 | Chip capacitor and method of manufacturing the same |
JP2015023096A (en) * | 2013-07-17 | 2015-02-02 | サン電子工業株式会社 | Manufacturing method of seat plate for capacitor, and capacitor |
JP2015228405A (en) * | 2014-05-30 | 2015-12-17 | サン電子工業株式会社 | Chip capacitor and method of manufacturing the same |
JP6985681B2 (en) * | 2017-11-30 | 2021-12-22 | ニチコン株式会社 | Surface-mounted capacitors and seat plates used for them |
JP7357263B2 (en) * | 2019-01-31 | 2023-10-06 | パナソニックIpマネジメント株式会社 | Electrolytic capacitor and seat plate |
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- 2022-03-30 EP EP22781037.1A patent/EP4318512A1/en active Pending
- 2022-03-30 WO PCT/JP2022/015791 patent/WO2022210826A1/en active Application Filing
- 2022-03-30 KR KR1020237033584A patent/KR20230164063A/en active Search and Examination
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