US20210036446A1 - Solderless circuit connector - Google Patents
Solderless circuit connector Download PDFInfo
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- US20210036446A1 US20210036446A1 US17/073,869 US202017073869A US2021036446A1 US 20210036446 A1 US20210036446 A1 US 20210036446A1 US 202017073869 A US202017073869 A US 202017073869A US 2021036446 A1 US2021036446 A1 US 2021036446A1
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- Prior art keywords
- connector
- edge
- alignment plate
- pcb
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
Definitions
- the present invention relates generally to electrical connectors, more particularly to surface mount connectors allowing repeated mounting and unmounting of electronic components having a plurality of densely populated, pinless terminals.
- the packaging technology has evolved from a through hole and surface mount packaging to a leadless packaging, such as ball grid array (BGA) and chip-scale packaging (CSP).
- BGA ball grid array
- CSP chip-scale packaging
- BGAs and CSPs are limited to applications where high cost is a secondary consideration
- DFN/QFN packaging has emerged as a cost-efficient packaging technology.
- An increase in integration density as well as problems arising from cooling power IC has renewed the interest in superconductor ICs capable of operating with low energy consumption and much higher speed.
- Interconnect technology is lagging behind package microminiaturization pace; therefore, connectors used to connect packages with PCBs are becoming the bulkiest, heaviest, and most expensive parts of electronic products.
- BGA and CSP packages are placed within a mounting device designed to hold packages providing high interconnection density.
- the mounting device has electrical contacts the top part of which is aligned with contacts on the IC package and the bottom part is aligned with pads on the PCB where this device must be mounted.
- a disadvantage of interconnection technology is resistance between IC package contacts and contacts of the mounting device because of contact oxidation, especially when the IC is tested at a high temperature.
- BGA packages are vulnerable to stress because of flexural stress from the circuit board resulting in potential reliability issues.
- Another disadvantage of such an electrical connection is the difficulty to align package terminals with the mounting device contacts with extremely small dimensional and physical tolerance. Still another disadvantage is the cost of package materials, which makes BGA and CSP packages undesirable due to their expensive substrate cost.
- U.S. Pat. No. 6,350,138 discloses a socket for removable mounting electronic parts that has a plurality of conductive terminals such as BGA packages. All contact members of the disclosed socket have a pair of arm-like contact parts capable of elastically opening or closing to hold or release IC's terminals. The elastic contact parts can perform a wiping action to remove the oxide layer from the package terminal and increase dimensional tolerance.
- the disclosed socket introduces parasitic resistive, capacitive, and inductive circuit components, when it is being operated at high frequencies, thus, degrading signal propagation.
- Solder reflow that is a common interconnection technology requires subjecting both the IC package and the PCB to high heat. Overheating or thermal stress can destroy or weaken ICs, resulting in higher initial and long-term failure rates. To remove and replace a defective IC, the entire PCB should be subjected to elevated temperatures, which results in additional thermal stress. To remove DFN/QFN packages, a PCB should be baked for four hours to reduce the risk of delaminating either the PCB or the IC. See, Microchip, Package Application Note for QFN and DFN Packages, AN2089 (2016). Unlike the BGA interconnection, the solder IC package and the PCB interconnection allow for decreased height of the connector and mount. However, the use of solder reflow technology requires purchase and maintenance of expensive machinery, and the use a limited number of chemical and physically compatible materials in solder reflow narrows the number of designs where solder reflow can be applied.
- U.S. Pat. No. 4,427,249 discloses a connector containing housing, cover, and multiple beryllium copper contact elements with a pin extended to the housing and a C-shaped section with a contact surface located on the free end of the section's upper limb.
- the upper limb serves as a cantilever beam that provides spring force to the contact surface; and the lower limb with the pin supports contact elements in the housing.
- the four side walls of the housing with equally elevated steps extending along the wall's outer and inside surfaces provide the IC package-receiving compartment. Walls also have horizontal cuts that extend as grooves across the step edges and are used to load contact elements.
- the disclosed connector enables the installation and the replacement of IC packages to increase contact elements' dimensional and physical tolerance, improve the connection reliability due to a wiping action, and decrease high-frequency signal distortions due to the connector's low height.
- the total connector's height includes the height of its pins, which also contributes to high frequency signal degradation.
- the connector's design complexity increases the cost and the difficulty of manufacturing its housing. The loading of contact elements into a housing of such type requires expensive and time-consuming manual work causing the connector's high cost. Beryllium copper does not demonstrate superconductor properties in cryogenic applications; therefore, the connector's contact elements are incapable of effectively removing heat.
- U.S. Pat. No. 5,738,530 discloses a connector having a plurality of electrically conductive metal traces on a flexible dielectric substrate and a plurality of protuberant electrical contacts, made of electrically conductive elastomer, that project from the trace ends to resiliently engage a contact site of the device to which the connector is coupled.
- This connector does not introduce additional signal distortions because of its low height; it is effective and reliable in operation because it does not require strict dimensional tolerance. However, it is difficult, time-consuming, and costly to manufacture.
- drawbacks of conventional systems and methods include one or more of degraded signal propagation, soldering/unsoldering components, and excess heat retention in contact elements.
- a multi-use mechanical integrated circuit connector for releasably securing electrical connectors without solder that provides at least one of a micro-strip, strip-line or waveguide with enhanced signal propagation, as well as the advantages described herein.
- An aspect of the present invention provides a multi-use device for solderless, repeatable electrical connection with an IC package or chip, the device including a top including a first side and a second side, with the first and second sides facing substantially opposite directions; an alignment plate including a first side and a second side, with the first and second sides facing substantially opposite directions; a connector including a hole, a first side, a second side, and at least one edge, with the first and second sides facing substantially opposite directions and the at least one edge being positioned between the first and second sides and extending along the hole; and a bottom including a first side and a second side, with the first and second sides facing substantially opposite directions.
- the second side of the top faces the first side of the alignment plate
- the second side of the alignment plate faces the first side of the connector
- the second side of the connector faces the first side of the bottom
- the top moves toward the bottom to secure the IC adjacent to the at least one edge of the connector.
- a device for releasably securing an electrical device including a top, an alignment plate, a connector, a bottom, and a plurality of rails that align the top and the connector. At least one post of a plurality of posts is also provided to align the alignment plate, the connector, and the bottom.
- the top is stacked on the alignment plate, the alignment plate is stacked on the connector, and the connector is stacked on the bottom. The top is moveable in a first direction along the plurality of rails.
- the connector comprises at least one layer of conductors extending from the edges of the connector.
- FIG. 1 a is an exploded perspective view illustrating a device in accordance with an embodiment of the present disclosure
- FIG. 1 b is a perspective view illustrating a device in accordance with an embodiment of the present disclosure
- FIG. 2 is an exploded perspective view illustrating the assembled device of FIG. 1 a;
- FIG. 3 is a perspective view illustrating the underside of the alignment plate of the device in accordance with an embodiment of the present disclosure
- FIG. 4 is a perspective view illustrating a bottom of the device in accordance with an embodiment of the present disclosure
- FIG. 5 is a cut-away profile view illustrating an adjuster of the device in accordance with an embodiment of the present disclosure
- FIG. 6 illustrates an underside of the connector of the device in accordance with an embodiment of the present disclosure
- FIG. 7 is a profile view illustrating an alignment plate, connector and bottom of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure
- FIG. 8 is a profile view illustrating an alignment plate and connector of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure.
- FIG. 9 is a profile view illustrating a connector of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure.
- FIG. 1 a is an exploded perspective view of a device in accordance with an embodiment of the present disclosure.
- the device includes a spring plate 120 , a top 130 , an alignment plate 140 , connector 150 , and a bottom 170 , stacked in a first direction.
- the spring plate 120 includes holes 120 a - d in respective corners thereof.
- the top 130 includes a first side 132 and a second side 134 , with the first side 132 and the second side 134 facing substantially opposite directions.
- the first side 132 includes a hemisphere 135 centrally located thereon.
- the alignment plate 140 includes a first side 142 and a second side 144 that also face in substantially opposite directions.
- the connector 150 includes a first side 152 , a second side 154 , a hole H, and at least one edge E.
- the first side 152 and the second side 154 also face in substantially opposite directions and at least one edge E is positioned between the first side 152 and the second side 154 .
- the bottom 170 includes a first side 172 and a second side 174 that face in substantially opposite directions. As shown in FIG. 1 a , the second side 134 of the top 130 faces the first side 142 of the alignment plate 140 , the second side 144 of the alignment plate 140 faces the first side 152 of the connector 150 , and the second side 154 of the connector 150 faces the first side 172 of the bottom 170 .
- the top 130 is movable toward the bottom 170 to secure the integrated circuit 500 to the connector 150 .
- the top 130 and bottom 170 are configured to apply a force (F, FIGS. 7 to 8 ) therebetween to secure the chip 500 and provide an enhanced electrical connection between the connector 150 and chip 500 , for solderless, repeatable electrical connection therebetween.
- FIG. 1 b is an exploded perspective view illustrating a device in accordance with an embodiment of the present disclosure.
- FIG. 1 b shows a top 130 having horizontal dimensions matching the horizontal dimensions of the chip 500 .
- FIG. 2 is a perspective view illustrating the assembled device of FIG. 1 a.
- the spring plate 120 is square shaped and is formed of a resilient material, e.g., a 16 ⁇ 16 mm spring plate made from 0.79 mm thick epoxy glass laminate (G10/FR4).
- a hole is provided in each corner thereof for a respective free-fit bolt, i.e., a rail of a plurality of rails 190 a - d , to pass through.
- the spring plate 120 , top 130 , alignment plate 140 , connector 150 and bottom 170 are stacked in the first direction. As shown in FIG. 2 , the spring plate 120 is stacked on the first side 132 of the top 130 , and the spring plate 120 moves in the first direction along a plurality of rails 190 , e.g., by user tightening of screws 192 a - d ( FIG. 2 ) on respective ends of the plurality of rails 190 a - d .
- the plurality of rails 190 can be provided as free-fit bolts and the like.
- the plurality of rails 190 a - d facilitate uniform movement of the top 130 towards and away from the connector 150 and the bottom 170 .
- the hemisphere 135 is provided on the first side 132 of the top 130 to direct the point of application of the force F and prevent damage to the chip 500 .
- FIG. 3 is a perspective view illustrating the underside, i.e., second side 142 , of the alignment plate 140 of the device in accordance with an embodiment of the present disclosure.
- the alignment plate 140 is preferably made from epoxy glass laminate with a square hole H for a close-fit clearance with edges of a chip 500 located in the hole H, when mounted in the device. Holes 140 a - d are provided in respective corners of the alignment plate 140 . Cut-outs 143 a - d are provided on respective sides of hole H on a bottom surface, i.e., second side 144 , of the alignment plate 140 , with the cut-outs 143 a - d forming a cross-shape.
- FIG. 4 is a perspective view illustrating the bottom 170 of the device in accordance with an embodiment of the present disclosure.
- the bottom 170 is shaped as a step pyramid with a plurality of steps uniformly provided on each side of the 170 , with the bottom 170 cut from epoxy glass laminate.
- each side of the bottom 170 contains four steps, each having a different height, i.e., a supporting step 175 , an active step 176 , an alignment step 177 , and a bumper step 178 .
- Edges of the supporting steps 175 support one or more of a plurality of fingers 156 provided on the connector. ( FIG. 6 .) Fingers 156 support respective conductors. Edges of the active steps 176 are positioned under edges of palms 155 .
- Edges of the alignment steps 177 are positioned beneath rotation axes 501 ( FIG. 7 ).
- the bumper steps 178 are preferably at least 0.5 mm wide, and edges of the bumper steps 178 are wider than respective edges of the cut-off 151 of the connector 150 . ( FIG. 6 .)
- FIG. 5 is a cut-away profile view illustrating an adjuster 904 of the device in accordance with an embodiment of the present disclosure.
- the adjuster 904 which can be provided as a screw, modifies the distance 902 by which the supporting step 175 protrudes from the active step 176 in the first direction, thereby changing a height of the supporting step 175 and changing a location where the conductor on the finger 156 will contact a corresponding pad of the chip 500 .
- FIG. 6 illustrates an underside of the connector 150 of the device in accordance with an embodiment of the present disclosure.
- the connector 150 is preferably formed as a portion of a printed circuit board (PCB), e.g., a standard 1.6 mm-thick FR4 double-sided PCB. As shown in FIG. 6 , various portions are provided for mounting connectors of various kinds of IC packages, i.e. chip 500 , that are to be connected, thereby providing a solderless, repeatable electrical connection between the chip 500 and the connector 150 .
- PCB printed circuit board
- a hole 150 a - d is provided in each respective corner, in a corresponding position as holes 140 a - d and 170 a - d in the alignment plate 140 and bottom 170 , for securing each of the alignment plate 140 , connector 150 , and the bottom 170 by passing posts 194 a - d therethrough.
- the connector 150 includes a plurality of circuit traces 160 ( FIGS. 1 a - 2 ), i.e., electrically conductive metal traces or conductors, and the density of circuit traces 160 increases as the traces 160 extend toward the hole H in which the chip is secured in the device, with the alignment plate 140 and connector 150 receiving the chip 500 , which has a plurality of contact pads positioned on peripheries thereof.
- circuit traces 160 FIGS. 1 a - 2
- the axes of the circuit traces 160 that are routed under the chip 500 and the axes of pads 502 ( FIGS. 7 to 8 ) of the chip 500 are collinear and have the same pitch, and the pads 502 are equal to or wider than traces 160 .
- the connector 150 includes distal ends of the circuit traces 160 that extend from the at least one edge (E) to electrically connect with corresponding pads 502 of the chip 500 mounted in the device.
- the underside of the connector 150 includes a cross-shaped cut-off 151 , preferably 1.25 to 1.30 mm deep, that surrounds the hole H of the alignment plate 140 .
- Respective distal ends of the circuit traces 160 are provided on respective fingers 156 that extend into the hole H. Cuts 153 separate the fingers 156 .
- Traces 111 located on wrists 157 , palms 155 , and fingers 156 serve as contacts rotatable around the rotation axes 501 at angle ⁇ for palms 155 and rotation axes 504 angle ⁇ for fingers 156 .
- FIG. 7 is a profile view illustrating the alignment plate 140 , connector 150 and bottom 170 of the device contacting a surface mounted chip 500 that is being mechanically retained by the device, in accordance with an embodiment of the present disclosure.
- a cut slot may be provided in a direction perpendicular to the first direction, with the cut slot removing a predefined amount of material removed from a side of the PCB opposite the side on which the circuit trace 160 is provided.
- Lengths L w , L p and L f depend on the position of the axis 501 and the inclination angles ⁇ of palms 155 and a of fingers 156 in the respective operating state and also depend on the selected PCB material.
- edges of some fingers 156 if formed from an inhomogeneous material as FR4, may fracture if the finger 156 has a height F H less than 0.25 mm.
- the top 130 moves downward in the first direction towards the bottom 180 , the chip 500 is secured in the alignment plate 140 , and the wrist 157 and fingers 156 are deflected upward, with the edge of the supporting step securing the distal end of the circuit trace 160 against a corresponding pad of the chip 500 .
- FIG. 8 is a profile view illustrating the alignment plate 140 and connector 150 of the device contacting a surface mounted chip 500 that is mechanically retained by the device, in accordance with another embodiment of the present disclosure.
- the PCB is reinforced by providing a circuit trace on either side thereof, rather than provide a cut slot.
- FIG. 8 does not show each of the supporting step, active step, alignment step or bumper step that support and exert an opposing force on the palms 155 and fingers 156 , as disclosed above.
- the connector 150 is formed as a portion of double layer PCB. Top conductive layer 160 and grounded bottom layer form a microstrip adjacent to the pad 502 of the chip 500 .
- FIG. 9 is a profile view illustrating the top 130 , the alignment plate 140 , the connector 150 , and the bottom 170 in accordance with an embodiment of the present disclosure working with a superconductor chip 500 .
- the second side of the top 130 is provided with 0.3 mm deep and 5 mm wide cut-off 159 used for installing a heatsink 137 , preferably a copper braid sleeve with one end pressed between the top 130 and the chip 500 , with another end thermally connected to a second stage of a cryocooler.
- the connector 150 is formed as a portion of multilayer PCB with conductive layers 158 a - d .
- Signal layer 158 c along with grounded layers 158 a and 158 c form a stripline adjacent to the pad 502 of the chip 500 .
- the cut-off 159 bifurcates upper grounded layer 158 a and an upper inner core between layers 158 a and 158 b in close proximity to all edges E, thereby providing a direct connection between the chip 500 and PCB striplines.
- FIGS. 8 and 9 demonstrate that the connector 500 can be readily transformed into a microstrip or a stripline connector providing a perfect match of the chip's and the connector's impedances to avoid signal distortion. Matching the connector's impedance to that of the chip is complicated due to mechanical limitations of existing connectors and limitations in material features of existing connectors. The impedance of the new connector can be controlled as easily as that of a PCB by varying the width and spacing of PCB traces over the distance.
- the new connector's contact can be represented as a cantilever supported by an additional load by the bottom 170 .
- a cantilever is capable of providing a higher contact normal force from the stored energy than a cantilever supported by one load if these cantilevers' edges are deflected by the same distance, e.g., similar to a diving board extended over the edge of a swimming pool.
- the new connector allows designers to establish an acceptable contact resistance between the connector's contact and chip's pads using a lower height of the connector that will improve operation characteristics at high frequencies.
- Traces 160 ( FIGS. 7 and 8 ) and 158 a - d ( FIG. 9 ) of the connector 150 which is working with superconductor chip 500 are preferably formed from copper.
- the Joule heat power that generated by electric currents flowing through junctions between resilient contacts of existing connector's conductors and chip pads, as well as the heat generated in conductors themselves, may become comparable with the chip heat generation.
- the electrical and thermal resistance of copper traces approaches zero at cryogenic temperatures, thus, copper traces do not contribute to heat generation. Instead, they can serve as a perfect heatsink for heat power generated in their junctions with chip pads.
- Grounded layers 158 a and 158 c ( FIG. 9 ) and 160 ( FIGS. 7 and 8 ) should be provided with thermo-links, e.g., copper braid sleeve, having one end soldered to the grounded layer and the other end tightly connected with the last stage of the cryocooler.
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Abstract
Description
- This application is a Continuation of PCT/US2019/028257 filed with the U.S. Patent and Trademark Office on Apr. 19, 2019, and claims the benefit of U.S. Provisional Application No. 62/660,036 filed with the U.S. Patent and Trademark Office on Apr. 19, 2018, the entire contents of each of which is incorporated herein by reference.
- The present invention relates generally to electrical connectors, more particularly to surface mount connectors allowing repeated mounting and unmounting of electronic components having a plurality of densely populated, pinless terminals.
- While the size of integrated circuit (IC) packages is decreasing, the number of circuits per package is increasing. Thus, the number of localized in extremely small spaces terminal leads necessary to communicate between the circuit elements and the outside system is increasing, which is why terminal leads are becoming finer, closer spaced, and more difficult to mount on PCBs.
- In order to overcome the difficulty of mounting IC packages with multiple dense connections, the packaging technology has evolved from a through hole and surface mount packaging to a leadless packaging, such as ball grid array (BGA) and chip-scale packaging (CSP). As the use of BGAs and CSPs is limited to applications where high cost is a secondary consideration, a dual/quad flat no leads (DFN/QFN) packaging has emerged as a cost-efficient packaging technology. An increase in integration density as well as problems arising from cooling power IC has renewed the interest in superconductor ICs capable of operating with low energy consumption and much higher speed.
- Interconnect technology is lagging behind package microminiaturization pace; therefore, connectors used to connect packages with PCBs are becoming the bulkiest, heaviest, and most expensive parts of electronic products. For example, BGA and CSP packages are placed within a mounting device designed to hold packages providing high interconnection density. The mounting device has electrical contacts the top part of which is aligned with contacts on the IC package and the bottom part is aligned with pads on the PCB where this device must be mounted. A disadvantage of interconnection technology is resistance between IC package contacts and contacts of the mounting device because of contact oxidation, especially when the IC is tested at a high temperature. BGA packages are vulnerable to stress because of flexural stress from the circuit board resulting in potential reliability issues. Surface irregularities on packages and mounting devices themselves can result in failure of certain electrical contacts. Another disadvantage of such an electrical connection is the difficulty to align package terminals with the mounting device contacts with extremely small dimensional and physical tolerance. Still another disadvantage is the cost of package materials, which makes BGA and CSP packages undesirable due to their expensive substrate cost.
- U.S. Pat. No. 6,350,138 discloses a socket for removable mounting electronic parts that has a plurality of conductive terminals such as BGA packages. All contact members of the disclosed socket have a pair of arm-like contact parts capable of elastically opening or closing to hold or release IC's terminals. The elastic contact parts can perform a wiping action to remove the oxide layer from the package terminal and increase dimensional tolerance. However, due to the size and orientation of the contact parts, the disclosed socket introduces parasitic resistive, capacitive, and inductive circuit components, when it is being operated at high frequencies, thus, degrading signal propagation.
- Solder reflow that is a common interconnection technology requires subjecting both the IC package and the PCB to high heat. Overheating or thermal stress can destroy or weaken ICs, resulting in higher initial and long-term failure rates. To remove and replace a defective IC, the entire PCB should be subjected to elevated temperatures, which results in additional thermal stress. To remove DFN/QFN packages, a PCB should be baked for four hours to reduce the risk of delaminating either the PCB or the IC. See, Microchip, Package Application Note for QFN and DFN Packages, AN2089 (2016). Unlike the BGA interconnection, the solder IC package and the PCB interconnection allow for decreased height of the connector and mount. However, the use of solder reflow technology requires purchase and maintenance of expensive machinery, and the use a limited number of chemical and physically compatible materials in solder reflow narrows the number of designs where solder reflow can be applied.
- U.S. Pat. No. 4,427,249 discloses a connector containing housing, cover, and multiple beryllium copper contact elements with a pin extended to the housing and a C-shaped section with a contact surface located on the free end of the section's upper limb. The upper limb serves as a cantilever beam that provides spring force to the contact surface; and the lower limb with the pin supports contact elements in the housing. The four side walls of the housing with equally elevated steps extending along the wall's outer and inside surfaces provide the IC package-receiving compartment. Walls also have horizontal cuts that extend as grooves across the step edges and are used to load contact elements. The disclosed connector enables the installation and the replacement of IC packages to increase contact elements' dimensional and physical tolerance, improve the connection reliability due to a wiping action, and decrease high-frequency signal distortions due to the connector's low height. However, besides the decreased contact elements' height, the total connector's height includes the height of its pins, which also contributes to high frequency signal degradation. The connector's design complexity increases the cost and the difficulty of manufacturing its housing. The loading of contact elements into a housing of such type requires expensive and time-consuming manual work causing the connector's high cost. Beryllium copper does not demonstrate superconductor properties in cryogenic applications; therefore, the connector's contact elements are incapable of effectively removing heat.
- U.S. Pat. No. 5,738,530 discloses a connector having a plurality of electrically conductive metal traces on a flexible dielectric substrate and a plurality of protuberant electrical contacts, made of electrically conductive elastomer, that project from the trace ends to resiliently engage a contact site of the device to which the connector is coupled. This connector does not introduce additional signal distortions because of its low height; it is effective and reliable in operation because it does not require strict dimensional tolerance. However, it is difficult, time-consuming, and costly to manufacture.
- Accordingly, drawbacks of conventional systems and methods include one or more of degraded signal propagation, soldering/unsoldering components, and excess heat retention in contact elements.
- To overcome shortcomings of conventional methods, components and systems, provided herein is a multi-use mechanical integrated circuit connector for releasably securing electrical connectors without solder that provides at least one of a micro-strip, strip-line or waveguide with enhanced signal propagation, as well as the advantages described herein.
- An aspect of the present invention provides a multi-use device for solderless, repeatable electrical connection with an IC package or chip, the device including a top including a first side and a second side, with the first and second sides facing substantially opposite directions; an alignment plate including a first side and a second side, with the first and second sides facing substantially opposite directions; a connector including a hole, a first side, a second side, and at least one edge, with the first and second sides facing substantially opposite directions and the at least one edge being positioned between the first and second sides and extending along the hole; and a bottom including a first side and a second side, with the first and second sides facing substantially opposite directions. The second side of the top faces the first side of the alignment plate, the second side of the alignment plate faces the first side of the connector, the second side of the connector faces the first side of the bottom, and the top moves toward the bottom to secure the IC adjacent to the at least one edge of the connector.
- Another aspect of the present disclosure provides a device for releasably securing an electrical device, the device including a top, an alignment plate, a connector, a bottom, and a plurality of rails that align the top and the connector. At least one post of a plurality of posts is also provided to align the alignment plate, the connector, and the bottom. The top is stacked on the alignment plate, the alignment plate is stacked on the connector, and the connector is stacked on the bottom. The top is moveable in a first direction along the plurality of rails.
- Still another aspect of the present disclosure is that the connector comprises at least one layer of conductors extending from the edges of the connector.
- The above and other aspects, features and advantages of certain embodiments of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
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FIG. 1a is an exploded perspective view illustrating a device in accordance with an embodiment of the present disclosure; -
FIG. 1b is a perspective view illustrating a device in accordance with an embodiment of the present disclosure; -
FIG. 2 is an exploded perspective view illustrating the assembled device ofFIG. 1 a; -
FIG. 3 is a perspective view illustrating the underside of the alignment plate of the device in accordance with an embodiment of the present disclosure; -
FIG. 4 is a perspective view illustrating a bottom of the device in accordance with an embodiment of the present disclosure; -
FIG. 5 is a cut-away profile view illustrating an adjuster of the device in accordance with an embodiment of the present disclosure; -
FIG. 6 illustrates an underside of the connector of the device in accordance with an embodiment of the present disclosure; -
FIG. 7 is a profile view illustrating an alignment plate, connector and bottom of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure; -
FIG. 8 is a profile view illustrating an alignment plate and connector of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure; and -
FIG. 9 is a profile view illustrating a connector of the device contacting a surface mounted chip being mechanically retained by the device, in accordance with another embodiment of the present disclosure. - The following detailed description of certain embodiments references the accompanying drawings. In the description, explanation about related functions or constructions known in the art are omitted for clarity.
-
FIG. 1a is an exploded perspective view of a device in accordance with an embodiment of the present disclosure. - As shown in
FIG. 1a , the device includes aspring plate 120, a top 130, analignment plate 140,connector 150, and a bottom 170, stacked in a first direction. Thespring plate 120 includesholes 120 a-d in respective corners thereof. The top 130 includes afirst side 132 and asecond side 134, with thefirst side 132 and thesecond side 134 facing substantially opposite directions. Thefirst side 132 includes ahemisphere 135 centrally located thereon. Thealignment plate 140 includes afirst side 142 and asecond side 144 that also face in substantially opposite directions. Theconnector 150 includes afirst side 152, asecond side 154, a hole H, and at least one edge E. Thefirst side 152 and thesecond side 154 also face in substantially opposite directions and at least one edge E is positioned between thefirst side 152 and thesecond side 154. The bottom 170 includes afirst side 172 and asecond side 174 that face in substantially opposite directions. As shown inFIG. 1a , thesecond side 134 of the top 130 faces thefirst side 142 of thealignment plate 140, thesecond side 144 of thealignment plate 140 faces thefirst side 152 of theconnector 150, and thesecond side 154 of theconnector 150 faces thefirst side 172 of the bottom 170. - The top 130 is movable toward the bottom 170 to secure the
integrated circuit 500 to theconnector 150. The top 130 and bottom 170 are configured to apply a force (F,FIGS. 7 to 8 ) therebetween to secure thechip 500 and provide an enhanced electrical connection between theconnector 150 andchip 500, for solderless, repeatable electrical connection therebetween. -
FIG. 1b is an exploded perspective view illustrating a device in accordance with an embodiment of the present disclosure.FIG. 1b shows a top 130 having horizontal dimensions matching the horizontal dimensions of thechip 500. -
FIG. 2 is a perspective view illustrating the assembled device ofFIG. 1 a. - As shown in
FIG. 2 , thespring plate 120 is square shaped and is formed of a resilient material, e.g., a 16×16 mm spring plate made from 0.79 mm thick epoxy glass laminate (G10/FR4). As shown inFIGS. 1a and 1b , a hole is provided in each corner thereof for a respective free-fit bolt, i.e., a rail of a plurality of rails 190 a-d, to pass through. - The
spring plate 120, top 130,alignment plate 140,connector 150 and bottom 170 are stacked in the first direction. As shown inFIG. 2 , thespring plate 120 is stacked on thefirst side 132 of the top 130, and thespring plate 120 moves in the first direction along a plurality of rails 190, e.g., by user tightening of screws 192 a-d (FIG. 2 ) on respective ends of the plurality of rails 190 a-d. The plurality of rails 190 can be provided as free-fit bolts and the like. - The plurality of rails 190 a-d facilitate uniform movement of the top 130 towards and away from the
connector 150 and the bottom 170. As shown inFIGS. 1a and 1b , thehemisphere 135 is provided on thefirst side 132 of the top 130 to direct the point of application of the force F and prevent damage to thechip 500. -
FIG. 3 is a perspective view illustrating the underside, i.e.,second side 142, of thealignment plate 140 of the device in accordance with an embodiment of the present disclosure. - The
alignment plate 140 is preferably made from epoxy glass laminate with a square hole H for a close-fit clearance with edges of achip 500 located in the hole H, when mounted in the device.Holes 140 a-d are provided in respective corners of thealignment plate 140. Cut-outs 143 a-d are provided on respective sides of hole H on a bottom surface, i.e.,second side 144, of thealignment plate 140, with the cut-outs 143 a-d forming a cross-shape. -
FIG. 4 is a perspective view illustrating thebottom 170 of the device in accordance with an embodiment of the present disclosure. - As shown in
FIG. 4 , the bottom 170 is shaped as a step pyramid with a plurality of steps uniformly provided on each side of the 170, with the bottom 170 cut from epoxy glass laminate. - As shown in
FIG. 4 , each side of the bottom 170 contains four steps, each having a different height, i.e., a supportingstep 175, anactive step 176, analignment step 177, and abumper step 178. Edges of the supportingsteps 175 support one or more of a plurality offingers 156 provided on the connector. (FIG. 6 .)Fingers 156 support respective conductors. Edges of theactive steps 176 are positioned under edges ofpalms 155. - Edges of the alignment steps 177 are positioned beneath rotation axes 501 (
FIG. 7 ). The bumper steps 178 are preferably at least 0.5 mm wide, and edges of the bumper steps 178 are wider than respective edges of the cut-off 151 of theconnector 150. (FIG. 6 .) -
FIG. 5 is a cut-away profile view illustrating anadjuster 904 of the device in accordance with an embodiment of the present disclosure. - As shown in
FIG. 5 , theadjuster 904, which can be provided as a screw, modifies thedistance 902 by which the supportingstep 175 protrudes from theactive step 176 in the first direction, thereby changing a height of the supportingstep 175 and changing a location where the conductor on thefinger 156 will contact a corresponding pad of thechip 500. -
FIG. 6 illustrates an underside of theconnector 150 of the device in accordance with an embodiment of the present disclosure. - The
connector 150 is preferably formed as a portion of a printed circuit board (PCB), e.g., a standard 1.6 mm-thick FR4 double-sided PCB. As shown inFIG. 6 , various portions are provided for mounting connectors of various kinds of IC packages, i.e.chip 500, that are to be connected, thereby providing a solderless, repeatable electrical connection between thechip 500 and theconnector 150. - As shown in
FIG. 6 , ahole 150 a-d is provided in each respective corner, in a corresponding position asholes 140 a-d and 170 a-d in thealignment plate 140 and bottom 170, for securing each of thealignment plate 140,connector 150, and the bottom 170 by passing posts 194 a-d therethrough. - The
connector 150 includes a plurality of circuit traces 160 (FIGS. 1a -2), i.e., electrically conductive metal traces or conductors, and the density of circuit traces 160 increases as thetraces 160 extend toward the hole H in which the chip is secured in the device, with thealignment plate 140 andconnector 150 receiving thechip 500, which has a plurality of contact pads positioned on peripheries thereof. - The axes of the circuit traces 160 that are routed under the
chip 500 and the axes of pads 502 (FIGS. 7 to 8 ) of thechip 500 are collinear and have the same pitch, and thepads 502 are equal to or wider than traces 160. Accordingly, theconnector 150 includes distal ends of the circuit traces 160 that extend from the at least one edge (E) to electrically connect withcorresponding pads 502 of thechip 500 mounted in the device. - The underside of the
connector 150 includes a cross-shaped cut-off 151, preferably 1.25 to 1.30 mm deep, that surrounds the hole H of thealignment plate 140. Respective distal ends of the circuit traces 160 are provided onrespective fingers 156 that extend into the hole H. Cuts 153 separate thefingers 156. Traces 111 located onwrists 157,palms 155, andfingers 156 serve as contacts rotatable around the rotation axes 501 at angle β forpalms 155 androtation axes 504 angle α forfingers 156. -
FIG. 7 is a profile view illustrating thealignment plate 140,connector 150 andbottom 170 of the device contacting a surface mountedchip 500 that is being mechanically retained by the device, in accordance with an embodiment of the present disclosure. A cut slot may be provided in a direction perpendicular to the first direction, with the cut slot removing a predefined amount of material removed from a side of the PCB opposite the side on which thecircuit trace 160 is provided. Lengths Lw, Lp and Lf depend on the position of theaxis 501 and the inclination angles β ofpalms 155 and a offingers 156 in the respective operating state and also depend on the selected PCB material. As understood by those skilled in the art, edges of somefingers 156, if formed from an inhomogeneous material as FR4, may fracture if thefinger 156 has a height FH less than 0.25 mm. - As shown in
FIG. 7 , when the force F is applied, the top 130 moves downward in the first direction towards the bottom 180, thechip 500 is secured in thealignment plate 140, and thewrist 157 andfingers 156 are deflected upward, with the edge of the supporting step securing the distal end of thecircuit trace 160 against a corresponding pad of thechip 500. -
FIG. 8 is a profile view illustrating thealignment plate 140 andconnector 150 of the device contacting a surface mountedchip 500 that is mechanically retained by the device, in accordance with another embodiment of the present disclosure. - As shown in
FIG. 8 , the PCB is reinforced by providing a circuit trace on either side thereof, rather than provide a cut slot. For clarity,FIG. 8 does not show each of the supporting step, active step, alignment step or bumper step that support and exert an opposing force on thepalms 155 andfingers 156, as disclosed above. In this embodiment, theconnector 150 is formed as a portion of double layer PCB. Topconductive layer 160 and grounded bottom layer form a microstrip adjacent to thepad 502 of thechip 500. -
FIG. 9 is a profile view illustrating the top 130, thealignment plate 140, theconnector 150, and the bottom 170 in accordance with an embodiment of the present disclosure working with asuperconductor chip 500. - As shown in
FIG. 9 , the second side of the top 130 is provided with 0.3 mm deep and 5 mm wide cut-off 159 used for installing aheatsink 137, preferably a copper braid sleeve with one end pressed between the top 130 and thechip 500, with another end thermally connected to a second stage of a cryocooler. Theconnector 150 is formed as a portion of multilayer PCB with conductive layers 158 a-d.Signal layer 158 c along with groundedlayers pad 502 of thechip 500. The cut-off 159 bifurcates upper groundedlayer 158 a and an upper inner core betweenlayers chip 500 and PCB striplines. -
FIGS. 8 and 9 demonstrate that theconnector 500 can be readily transformed into a microstrip or a stripline connector providing a perfect match of the chip's and the connector's impedances to avoid signal distortion. Matching the connector's impedance to that of the chip is complicated due to mechanical limitations of existing connectors and limitations in material features of existing connectors. The impedance of the new connector can be controlled as easily as that of a PCB by varying the width and spacing of PCB traces over the distance. - Unlike a typical spring connector's contact, which can be represented as a simple cantilever beam whose one end is supported by clamping and the other end is subjected to one concentrated load by the chip, the new connector's contact can be represented as a cantilever supported by an additional load by the bottom 170. Such a cantilever is capable of providing a higher contact normal force from the stored energy than a cantilever supported by one load if these cantilevers' edges are deflected by the same distance, e.g., similar to a diving board extended over the edge of a swimming pool. As a result, the new connector allows designers to establish an acceptable contact resistance between the connector's contact and chip's pads using a lower height of the connector that will improve operation characteristics at high frequencies.
- Traces 160 (
FIGS. 7 and 8 ) and 158 a-d (FIG. 9 ) of theconnector 150 which is working withsuperconductor chip 500 are preferably formed from copper. As superconductor chips have extremely low power consumption, the Joule heat power that generated by electric currents flowing through junctions between resilient contacts of existing connector's conductors and chip pads, as well as the heat generated in conductors themselves, may become comparable with the chip heat generation. The electrical and thermal resistance of copper traces approaches zero at cryogenic temperatures, thus, copper traces do not contribute to heat generation. Instead, they can serve as a perfect heatsink for heat power generated in their junctions with chip pads. Groundedlayers FIG. 9 ) and 160 (FIGS. 7 and 8 ) should be provided with thermo-links, e.g., copper braid sleeve, having one end soldered to the grounded layer and the other end tightly connected with the last stage of the cryocooler. - While the present disclosure has been shown and described with reference to certain aspects thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure, as defined by the appended claims and equivalents thereof
Claims (20)
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US201862660036P | 2018-04-19 | 2018-04-19 | |
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US17/073,869 US11404805B2 (en) | 2018-04-19 | 2020-10-19 | Solderless circuit connector |
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2019
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2020
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US11404805B2 (en) | 2022-08-02 |
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