US20200170100A1 - Heat dissipation assembly of m.2 expansion card and electronic device - Google Patents
Heat dissipation assembly of m.2 expansion card and electronic device Download PDFInfo
- Publication number
- US20200170100A1 US20200170100A1 US16/252,708 US201916252708A US2020170100A1 US 20200170100 A1 US20200170100 A1 US 20200170100A1 US 201916252708 A US201916252708 A US 201916252708A US 2020170100 A1 US2020170100 A1 US 2020170100A1
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- US
- United States
- Prior art keywords
- heat dissipating
- expansion card
- motherboard
- dissipating body
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Definitions
- the invention relates to a heat dissipating assembly and an electronic device, and more particularly, to a heat dissipating assembly of M.2 expansion card and an electronic device.
- M.2 connectors for connecting M.2 expansion cards on the motherboard to facilitate expansion by users. Since the M.2 expansion cards have different sizes, the existing motherboard needs to be provided with at least 2 to 3 screw holes adjacent to the M.2 connectors to fix expansion cards of different sizes on the motherboard.
- the invention provides a heat dissipating assembly of M.2 expansion card.
- An M.2 expansion card may be fixed on a motherboard through the heat dissipating assembly of the M.2 expansion card.
- the invention provides an electronic device having the heat dissipating assembly of M.2 expansion card.
- the electronic device allows the motherboard to require only a single M.2 fixing hole to fix various sizes of the M.2 expansion card and the heat dissipating assembly of the M.2 expansion card, thus reducing the difficulty of wiring on the motherboard.
- a heat dissipating assembly of M.2 expansion card of the invention is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member.
- the heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed on the motherboard through the fixed portion.
- the locking member is detachably disposed on one of the screw holes, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
- the at least one screw hole includes a plurality of screw holes
- the locking member is detachably disposed on one of the screw holes
- the plurality of screw holes are spaced apart on the heat dissipating body.
- the heat dissipating assembly of the M.2 expansion card further has at least one clamping arm, and the clamping arm is extended from at least one side of the heat dissipating body.
- the clamping arm is adapted to detachably clamp the M.2 expansion card.
- the locking member includes a stud or a screw.
- the heat dissipating body has a groove extended from the position of the fixed portion and extended along a direction away from the first end.
- the heat dissipating body further includes a sliding member slidably disposed at the groove, and the screw hole is formed on the sliding member.
- the heat dissipating body has a second end opposite to the first end.
- the heat dissipating body further includes a tongue located at the second end.
- An electronic device of the invention is adapted to configure an M.2 expansion card and includes a motherboard and a heat dissipating assembly of an M.2 expansion card.
- the motherboard includes an M.2 connector and a single M.2 fixing hole.
- the heat dissipating assembly of the M.2 expansion card is detachably disposed at a portion on the motherboard adjacent to the M.2 connector and adapted to fix the M.2 expansion card on the motherboard.
- the heat dissipating assembly of the M.2 expansion card further includes a heat dissipating body having a first end and a locking member.
- the heat dissipating body includes a fixed portion located at the first end and at least one screw hole.
- the fixed portion is detachably fixed on the M.2 fixing hole of the motherboard.
- the locking member is detachably disposed on one of the screw holes and is adapted to fix the M.2 expansion card to the heat dissipating body.
- the at least one screw hole includes a plurality of screw holes
- the locking member is detachably disposed on one of the screw holes
- the plurality of screw holes are spaced apart on the heat dissipating body.
- the heat dissipating assembly of the M.2 expansion card further has at least one clamping arm, and the clamping arm is extended from at least one side of the heat dissipating body.
- the clamping arm is adapted to detachably clamp the M.2 expansion card.
- the locking member includes a stud or a screw.
- the heat dissipating body has a groove extended from the position of the fixed portion and extend along a direction away from the first end.
- the heat dissipating body further includes a sliding member slidably disposed at the groove, and the at least one screw hole is formed on the sliding member.
- the heat dissipating body has a second end opposite to the first end.
- the heat dissipating body further includes a tongue located at the second end.
- the motherboard further includes a tongue slot located on the M.2 connector and corresponding to the tongue. When the heat dissipating assembly of the M.2 expansion card is disposed on the motherboard, the tongue is extended into the tongue slot.
- the heat dissipating assembly of M.2 expansion card of the electronic device of the invention not only may provide heat dissipation function to the M.2 expansion card, the user may also fix the M.2 expansion card on the motherboard through the heat dissipating assembly of the M.2 expansion card. In other words, the user may fix the M.2 expansion card and the heat dissipating body together through the locking member.
- the heat dissipating assembly of M.2 expansion card of the invention may be fixed on the motherboard through the M.2 fixing hole of the motherboard of the electronic device, and the heat dissipating body is fixed to the motherboard together with the M.2 expansion card.
- the motherboard of the electronic device of the invention only needs to provide a single M.2 fixing hole for each M.2 connector, and the M.2 expansion card does not need to be fixed by configuring a plurality of M.2 fixing holes adjacent to the M.2 connector as in the prior art. Therefore, the motherboard of the electronic device of the invention may save some of the space of the conventional M.2 fixing holes to make the layout of the wiring on the motherboard more flexible.
- FIG. 1 is a schematic of an electronic device located at a first position and fixed to a motherboard according to an embodiment of the invention.
- FIG. 2 is a side view of a heat dissipating assembly of an M.2 expansion card of the electronic device of FIG. 1 .
- FIG. 3 is a schematic of the electronic device of FIG. 1 disposed on a motherboard and located at a second position.
- FIG. 4 is a partially enlarged schematic of FIG. 3 from another viewing angle.
- FIG. 5 is a side view of a heat dissipating assembly of an M.2 expansion card according to another embodiment of the invention.
- FIG. 6 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still another embodiment of the invention.
- FIG. 7 is a schematic of an electronic device of still yet another embodiment of the invention.
- FIG. 8 is a partial schematic of a cross section of a heat dissipating assembly of an M.2 expansion card of the electronic device of FIG. 7 along the extending direction of the first end and the second end.
- FIG. 9 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still yet another embodiment of the invention.
- FIG. 1 is a schematic of an electronic device located at a first position and fixed to a motherboard according to an embodiment of the invention.
- FIG. 2 is a side view of a heat dissipating assembly of an M.2 expansion card of the electronic device of FIG. 1 .
- an electronic device 10 of the present embodiment includes a motherboard 100 and a heat dissipating assembly of M.2 expansion card 200 .
- the motherboard 100 includes an M.2 connector 120 and a single M.2 fixing hole 140 .
- the M.2 connector 120 of the electronic device 10 may configure an M.2 expansion card 300 .
- the heat dissipating assembly of M.2 expansion card 200 includes a heat dissipating body 220 and a locking member 240 .
- the heat dissipating body 220 has a first end 222 and a second end 224 opposite to the first end 222 .
- the heat dissipating body 220 further includes a fixed portion 222 a located at the first end 222 and at least one screw hole 227 .
- the heat dissipating assembly of M.2 expansion card 200 of the electronic device 10 applies for a plurality of M.2 expansion card 300 sizes.
- the size of the M.2 expansion card 300 may be a sized of model 2230, 2242, 2260 or 2280, and the invention is not limited thereto.
- the locking member 240 of the heat dissipating assembly of M.2 expansion card 200 includes, for example, a screw.
- the at least one screw hole 227 on the heat dissipating body 220 includes a plurality of screw holes 227 , and the number of the screw holes 227 is, for example, two. Further, a plurality of screw holes 227 are spaced apart on the heat dissipating body 220 , and the arrangement locations of the plurality of screw holes 227 are on the midline extended from the first end 222 to the second end 224 along the heat dissipating body 220 .
- the positions of the screw holes 227 correspond to various sizes of the M.2 expansion card 300 to detachably fix the M.2 expansion card 300 on the heat dissipating body 220 in conjunction with the locking member 240 .
- the stud portion of the screw may be abutted against the edge of the M.2 expansion card 300 opposite to another side of the M.2 connector 120 to ensure that the M.2 expansion card 300 is stably inserted into the M.2 connector 120 on the motherboard 100 .
- the nut of the screw slightly holds the M.2 expansion card 300 such that the M.2 expansion card 300 more stably fits the heat dissipating body 220 .
- the material of the heat dissipating assembly of M.2 expansion card 200 may be a material facilitating heat dissipation such as aluminum, carbonized alloy, or copper, but the invention is not limited thereto.
- the surface of the heat dissipating body 220 is shown as a plane, but is not limited thereto.
- the heat dissipating body 220 may also be, for example, a fin or other shapes facilitating the heat dissipation of the heat dissipating assembly of M.2 expansion card 200 .
- FIG. 3 is a schematic of the electronic device of FIG. 1 disposed on a motherboard and located at a second position.
- FIG. 4 is a partially enlarged schematic of FIG. 3 from another viewing angle. Please refer to FIG. 3 and FIG. 4 .
- the heat dissipating assembly of M.2 expansion card 200 is detachably disposed at a portion on the motherboard 100 adjacent to the M.2 connector 120 .
- the heat dissipating body 220 further includes a tongue 224 a located at the second end 224 of the heat dissipating body 220 .
- the motherboard 100 also includes a tongue slot 160 located on the M.2 connector 120 and corresponding to the tongue 224 a.
- the electronic device 10 further has a connector housing 150 .
- the connector housing 150 is disposed over the M.2 connector 120 of the motherboard 100 , and the tongue slot 160 is formed at the connector housing 150 .
- the connector housing 150 may be in other forms, and the connector housing 150 does not necessarily cover the M.2 connector 120 on the motherboard 100 .
- the connector cover 150 only needs to provide placement for the tongue slot 160 and fix the tongue slot 160 and the M.2 connector 120 on the motherboard 100 , and the invention is not limited thereto.
- the tongue 224 a located at the second end 224 of the heat dissipating body 220 of the heat dissipating assembly of M.2 expansion card 200 is extended into the tongue slot 160 of the motherboard 100 .
- the user detachably fixes the M.2 expansion card 300 to the heat dissipating body 220 through the locking member 240 of the heat dissipating assembly of M.2 expansion card 200 .
- the user only needs to insert the tongue 224 a of the heat dissipating body 220 into the tongue slot 160 of the motherboard 100 and simultaneously insert the M.2 expansion card 300 into the M.2 connector 120 of the motherboard 100 .
- the heat dissipating assembly of M.2 expansion card 200 and the M.2 expansion card 300 are stacked and held at a second position P 2 as shown in FIG. 3 .
- the locking member 240 of the heat dissipating assembly of M.2 expansion card 200 detachably fixes the M.2 expansion card 300 together with the heat dissipating body 220 and holds them at the second position P 2 .
- the user only needs to press the first end 222 of the heat dissipating body 220 of the heat dissipating assembly of M.2 expansion card 200 , and the M.2 expansion card 300 may be moved together with the heat dissipating assembly of M.2 expansion card 200 from the second position P 2 shown in FIG. 3 to the first position P 1 shown in FIG. 1 to fit the motherboard 100 .
- the heat dissipating assembly of M.2 expansion card 200 is fixed on the motherboard 100 through the fixed portion 222 a of the heat dissipating body 220 .
- the sequence of operations described is merely an example.
- the user may also first insert the M.2 expansion card 300 into the M.2 connector 120 of the motherboard 100 and then detachably fix the M.2 expansion card 300 to the heat dissipating body 220 through the locking member 240 of the heat dissipating assembly of M.2 expansion card 200 .
- the user may also have other installation sequences, and the invention is not limited thereto.
- the fixed portion 222 a of the heat dissipating body 220 may be a through-hole for a screw 20 to pass through the fixed portion 222 a of the heat dissipating body 220 to fix the heat dissipating body 220 on the motherboard 100 .
- a convex locking portion 30 is disposed on the motherboard 100 . Therefore, the screw 20 may be stably locked to the convex locking portion 30 after passing through the fixed portion 222 a of the heat dissipating body 220 .
- the fixed portion 222 a may be, for example, a structure such as a snap, a latch, or the like, and is not limited thereto.
- the tongue 224 a of the heat dissipating assembly shown in FIG. 4 and the tongue slot 160 of the motherboard 100 are only examples, and in other embodiments not shown, as long as a detachable fixing method is used, the invention is not limited thereto. More specifically, in an embodiment not shown, the heat dissipating assembly of M.2 expansion card 200 may not even have the tongue 224 a, and the motherboard 100 may not require the tongue slot 160 . In other words, the user only needs to first fix the heat dissipating assembly of M.2 expansion card 200 and the M.2 expansion card 300 together by the locking member 240 and then insert the M.2 expansion card 300 to the M.2 connector 120 on the motherboard 100 .
- the heat dissipating assembly of M.2 expansion card 200 and the M.2 expansion card 300 may still be held at the second position P 2 shown in FIG. 3 .
- the user only needs to press the first end 222 of the heat dissipating body 220 of the heat dissipating assembly of M.2 expansion card 200 , and the M.2 expansion card 300 may be moved together with the heat dissipating assembly of M.2 expansion card 200 from the second position P 2 shown in FIG. 3 to the first position P 1 shown in FIG. 1 to fit the motherboard 100 .
- the user only needs to fix the fixed portion 222 a of the heat dissipating body 220 to the M.2 fixing hole 140 on the motherboard 100 , and the M.2 expansion card 300 may be fixed on the motherboard 100 by the heat dissipating assembly of M.2 expansion card 200 .
- FIG. 5 is a side view of a heat dissipating assembly of an M.2 expansion card according to another embodiment of the invention.
- the locking member 240 of a heat dissipating assembly of M.2 expansion card 200 a may be a stud (the locking member 240 a ) in addition to, for example, a screw.
- the M.2 connector 120 itself has a partial effect of fixing the M.2 expansion card 300 . Therefore, the user may also hold the M.2 expansion card 300 without a screw (the locking member 240 ).
- the user only needs to fix the stud (the locking member 240 a ) without a nut on the screw hole 227 of the heat dissipating body 220 and lean the stud (the locking member 240 a ) against an edge of the M.2 expansion card 300 opposite to another side of the M.2 connector 120 to ensure that the M.2 expansion card 300 does not slip, and then the user may fix the M.2 expansion card 300 to the heat dissipating body 220 .
- FIG. 6 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still another embodiment of the invention.
- a heat dissipating body 220 b further has at least one clamping arm 260 .
- the clamping arm 260 is extended from at least one side of the heat dissipating body 220 b, and the clamping arm 260 may detachably clamp the M.2 expansion card 300 .
- the user when the user inserts the M.2 expansion card 300 into the M.2 connector 120 on the motherboard 100 ( FIG. 1 ), the user fixes the M.2 expansion card 300 to the heat dissipating body 220 b using the locking member 240 ( FIG. 1 ).
- the heat dissipating body 220 b is located at one side of the M.2 expansion card 300
- the clamping arm 260 is hooked on another side of the M.2 expansion card 300 .
- the clamping arm 260 of the further ensures that the M.2 expansion card 300 may be stably fixed with the heat dissipating body 220 without slipping.
- the number of the at least one clamping arm 260 is, for example, two. Of course, in other embodiments, the invention is not limited thereto.
- FIG. 7 is a schematic of an electronic device of still yet another embodiment of the invention.
- FIG. 8 is a partial schematic of a cross section of a heat dissipating assembly of an M.2 expansion card of the electronic device of FIG. 7 along an extending direction of a first end and a second end.
- a heat dissipating body 220 c of a heat dissipating assembly of M.2 expansion card 200 c has a groove 226 extended from the position of the fixed portion 222 a of the heat dissipating body 220 c to a direction away from the first end 222 of the heat dissipating body 220 c.
- the heat dissipating body 220 c further includes a sliding member 228 slidably disposed in the groove 226 . Moreover, the screw holes 227 of the heat dissipating body 220 c are formed on the sliding member 228 .
- the screw hole on the sliding member 228 may be locked by the locking member 240 .
- the user may fix various sizes of the M.2 expansion card 300 using the characteristic that the sliding member 228 may slide freely in the groove 226 .
- the user may fix various sizes of the M.2 expansion card 300 and the heat dissipating body 220 c together in conjunction with the locking member 240 by sliding the sliding member 228 to the corresponding position.
- the manufacturer does not need to provide corresponding screw hole for each type of the M.2 expansion card 300 at the time of manufacture.
- the issue that the heat dissipating assembly of M.2 expansion card 200 c may not completely match various sizes of the M.2 expansion card 300 on the market due to the manufacturer not providing the screw hole corresponding to the M.2 expansion card 300 at the heat dissipating assembly of M.2 expansion card 200 c does not occur.
- the situation in which the sizes of the heat dissipating assembly of M.2 expansion card 200 c and the M.2 expansion card 300 do not match and thus causing inconvenience to the user also does not occur.
- FIG. 9 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still yet another embodiment of the invention.
- At least one clamping arm 260 is extended from at least one side of the heat dissipating body 220 d, and the clamping arm 260 may detachably clamp the M.2 expansion card 300 .
- the heat dissipating body 220 d has a groove 226 .
- the heat dissipating body 220 d further includes a sliding member 228 slidably disposed in the groove 226 .
- the screw hole 227 of the heat dissipating body 220 d are formed on the sliding member 228 .
- the heat dissipating assembly of M.2 expansion card has the clamping arm 260 in the embodiment of FIG. 6 and the sliding member 228 in the embodiments of FIG. 7 and FIG. 8 at the same time.
- the present embodiment combines the technical features of the above two embodiments while having the advantages of the technical features of the two embodiments. As a result, the user may more stably and conveniently fix the M.2 expansion card to the motherboard.
- the locking member 240 shown in FIG. 6 to FIG. 9 is, for example, a screw.
- the locking member 240 may also be, for example, a stud (the locking member 240 a ), and the invention is not limited thereto.
- the heat dissipating assembly of M.2 expansion card of the electronic device of the invention not only may provide heat dissipation function to the M.2 expansion card
- the user may also fix the M.2 expansion card on the motherboard through the heat dissipating assembly of M.2 expansion card.
- the user may also first fix the M.2 expansion card and the heat dissipating body through the locking member and then fix the heat dissipating body and the M.2 expansion card together on the motherboard through the fixed portion located at the first end of the heat dissipating body and the M.2 fixing hole on the motherboard.
- the electronic device of the invention allows the manufacturer to simply provide a single M.2 fixing hole adjacent to each M.2 connector on the motherboard, and other M.2 fixing holes additionally provided adjacent to the M.2 connector in the prior art may be omitted. Therefore, the heat dissipating assembly of M.2 expansion card of the electronic device of the invention improves the conventional structure of fixing the M.2 expansion card on the motherboard. Therefore, the degree of freedom in the design of the wiring and configuration of devices of the motherboard by those skilled in the art is increased. Further, the electronic device of the invention is also more capable of adapting to the trend of continuous increase in data transmission volume and transmission speed in the future.
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Abstract
Description
- This application claims the priority benefit of Taiwan application serial no. 107142152, filed on Nov. 27, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- The invention relates to a heat dissipating assembly and an electronic device, and more particularly, to a heat dissipating assembly of M.2 expansion card and an electronic device.
- At present, a relatively large number of electronic devices are provided with M.2 connectors for connecting M.2 expansion cards on the motherboard to facilitate expansion by users. Since the M.2 expansion cards have different sizes, the existing motherboard needs to be provided with at least 2 to 3 screw holes adjacent to the M.2 connectors to fix expansion cards of different sizes on the motherboard.
- However, in recent years, with the evolution of technology, such as advances in cloud computing, the demand for CPUs to deliver high-speed signals has increased. In particular, more wiring configurations are needed between the PCI-E interface and the CPU. However, most of the connectors of the M.2 expansion cards are disposed between the PCI-E interface and the CPU. In particular, the motherboard needs to be provided with a plurality of screw holes for fixing the M.2 expansion cards on the motherboard in this area, such that the layout of the wiring between the PCI-E interface and the CPU is more difficult.
- The invention provides a heat dissipating assembly of M.2 expansion card. An M.2 expansion card may be fixed on a motherboard through the heat dissipating assembly of the M.2 expansion card.
- The invention provides an electronic device having the heat dissipating assembly of M.2 expansion card. The electronic device allows the motherboard to require only a single M.2 fixing hole to fix various sizes of the M.2 expansion card and the heat dissipating assembly of the M.2 expansion card, thus reducing the difficulty of wiring on the motherboard.
- A heat dissipating assembly of M.2 expansion card of the invention is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed on the motherboard through the fixed portion. The locking member is detachably disposed on one of the screw holes, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
- In an embodiment of the invention, the at least one screw hole includes a plurality of screw holes, the locking member is detachably disposed on one of the screw holes, and the plurality of screw holes are spaced apart on the heat dissipating body.
- In an embodiment of the invention, the heat dissipating assembly of the M.2 expansion card further has at least one clamping arm, and the clamping arm is extended from at least one side of the heat dissipating body. The clamping arm is adapted to detachably clamp the M.2 expansion card. When the M.2 expansion card is disposed on the heat dissipating assembly, the heat dissipating body is located at one surface of the M.2 expansion card, and the at least one clamping arm is hooked on another surface of the M.2 expansion card.
- In an embodiment of the invention, the locking member includes a stud or a screw.
- In an embodiment of the invention, the heat dissipating body has a groove extended from the position of the fixed portion and extended along a direction away from the first end. The heat dissipating body further includes a sliding member slidably disposed at the groove, and the screw hole is formed on the sliding member.
- In an embodiment of the invention, the heat dissipating body has a second end opposite to the first end. The heat dissipating body further includes a tongue located at the second end.
- An electronic device of the invention is adapted to configure an M.2 expansion card and includes a motherboard and a heat dissipating assembly of an M.2 expansion card. The motherboard includes an M.2 connector and a single M.2 fixing hole. The heat dissipating assembly of the M.2 expansion card is detachably disposed at a portion on the motherboard adjacent to the M.2 connector and adapted to fix the M.2 expansion card on the motherboard.
- The heat dissipating assembly of the M.2 expansion card further includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole. The fixed portion is detachably fixed on the M.2 fixing hole of the motherboard. The locking member is detachably disposed on one of the screw holes and is adapted to fix the M.2 expansion card to the heat dissipating body.
- In an embodiment of the invention, the at least one screw hole includes a plurality of screw holes, the locking member is detachably disposed on one of the screw holes, and the plurality of screw holes are spaced apart on the heat dissipating body.
- In an embodiment of the invention, the heat dissipating assembly of the M.2 expansion card further has at least one clamping arm, and the clamping arm is extended from at least one side of the heat dissipating body. The clamping arm is adapted to detachably clamp the M.2 expansion card. When the M.2 expansion card is disposed on the heat dissipating assembly, the heat dissipating body is located at one surface of the M.2 expansion card, and the at least one clamping arm is hooked on another surface of the M.2 expansion card.
- In an embodiment of the invention, the locking member includes a stud or a screw.
- In an embodiment of the invention, the heat dissipating body has a groove extended from the position of the fixed portion and extend along a direction away from the first end. The heat dissipating body further includes a sliding member slidably disposed at the groove, and the at least one screw hole is formed on the sliding member.
- In an embodiment of the invention, the heat dissipating body has a second end opposite to the first end. The heat dissipating body further includes a tongue located at the second end. The motherboard further includes a tongue slot located on the M.2 connector and corresponding to the tongue. When the heat dissipating assembly of the M.2 expansion card is disposed on the motherboard, the tongue is extended into the tongue slot.
- Based on the above, the heat dissipating assembly of M.2 expansion card of the electronic device of the invention not only may provide heat dissipation function to the M.2 expansion card, the user may also fix the M.2 expansion card on the motherboard through the heat dissipating assembly of the M.2 expansion card. In other words, the user may fix the M.2 expansion card and the heat dissipating body together through the locking member. The heat dissipating assembly of M.2 expansion card of the invention may be fixed on the motherboard through the M.2 fixing hole of the motherboard of the electronic device, and the heat dissipating body is fixed to the motherboard together with the M.2 expansion card. In addition, the motherboard of the electronic device of the invention only needs to provide a single M.2 fixing hole for each M.2 connector, and the M.2 expansion card does not need to be fixed by configuring a plurality of M.2 fixing holes adjacent to the M.2 connector as in the prior art. Therefore, the motherboard of the electronic device of the invention may save some of the space of the conventional M.2 fixing holes to make the layout of the wiring on the motherboard more flexible.
- In order to make the aforementioned features and advantages of the disclosure more comprehensible, embodiments accompanied with figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1 is a schematic of an electronic device located at a first position and fixed to a motherboard according to an embodiment of the invention. -
FIG. 2 is a side view of a heat dissipating assembly of an M.2 expansion card of the electronic device ofFIG. 1 . -
FIG. 3 is a schematic of the electronic device ofFIG. 1 disposed on a motherboard and located at a second position. -
FIG. 4 is a partially enlarged schematic ofFIG. 3 from another viewing angle. -
FIG. 5 is a side view of a heat dissipating assembly of an M.2 expansion card according to another embodiment of the invention. -
FIG. 6 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still another embodiment of the invention. -
FIG. 7 is a schematic of an electronic device of still yet another embodiment of the invention. -
FIG. 8 is a partial schematic of a cross section of a heat dissipating assembly of an M.2 expansion card of the electronic device ofFIG. 7 along the extending direction of the first end and the second end. -
FIG. 9 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still yet another embodiment of the invention. -
FIG. 1 is a schematic of an electronic device located at a first position and fixed to a motherboard according to an embodiment of the invention.FIG. 2 is a side view of a heat dissipating assembly of an M.2 expansion card of the electronic device ofFIG. 1 . Referring toFIG. 1 andFIG. 2 , anelectronic device 10 of the present embodiment includes amotherboard 100 and a heat dissipating assembly of M.2expansion card 200. Themotherboard 100 includes an M.2connector 120 and a single M.2fixing hole 140. In addition, the M.2connector 120 of theelectronic device 10 may configure an M.2expansion card 300. The heat dissipating assembly of M.2expansion card 200 includes aheat dissipating body 220 and a lockingmember 240. Theheat dissipating body 220 has afirst end 222 and asecond end 224 opposite to thefirst end 222. In addition, theheat dissipating body 220 further includes a fixedportion 222 a located at thefirst end 222 and at least onescrew hole 227. - It is worth mentioning that in the present embodiment, the heat dissipating assembly of M.2
expansion card 200 of theelectronic device 10 applies for a plurality of M.2expansion card 300 sizes. For example, the size of the M.2expansion card 300 may be a sized of model 2230, 2242, 2260 or 2280, and the invention is not limited thereto. - As shown in
FIG. 1 , in the present embodiment, the lockingmember 240 of the heat dissipating assembly of M.2expansion card 200 includes, for example, a screw. The at least onescrew hole 227 on theheat dissipating body 220 includes a plurality of screw holes 227, and the number of the screw holes 227 is, for example, two. Further, a plurality of screw holes 227 are spaced apart on theheat dissipating body 220, and the arrangement locations of the plurality of screw holes 227 are on the midline extended from thefirst end 222 to thesecond end 224 along theheat dissipating body 220. The positions of the screw holes 227 correspond to various sizes of the M.2expansion card 300 to detachably fix the M.2expansion card 300 on theheat dissipating body 220 in conjunction with the lockingmember 240. - Furthermore, as may be seen from
FIG. 2 , when a screw (the locking member 240) is fixed on thescrew hole 227, the stud portion of the screw (the locking member 240) may be abutted against the edge of the M.2expansion card 300 opposite to another side of the M.2connector 120 to ensure that the M.2expansion card 300 is stably inserted into the M.2connector 120 on themotherboard 100. In addition, the nut of the screw (the locking member 240) slightly holds the M.2expansion card 300 such that the M.2expansion card 300 more stably fits theheat dissipating body 220. - It should be noted that, in the present embodiment, the material of the heat dissipating assembly of M.2
expansion card 200 may be a material facilitating heat dissipation such as aluminum, carbonized alloy, or copper, but the invention is not limited thereto. In addition, as shown inFIG. 1 , in order to facilitate the expression of the plurality of screw holes 227 on theheat dissipating body 220, in the drawings of the invention, the surface of theheat dissipating body 220 is shown as a plane, but is not limited thereto. Of course, in other embodiments, theheat dissipating body 220 may also be, for example, a fin or other shapes facilitating the heat dissipation of the heat dissipating assembly of M.2expansion card 200. -
FIG. 3 is a schematic of the electronic device ofFIG. 1 disposed on a motherboard and located at a second position.FIG. 4 is a partially enlarged schematic ofFIG. 3 from another viewing angle. Please refer toFIG. 3 andFIG. 4 . In the present embodiment, the heat dissipating assembly of M.2expansion card 200 is detachably disposed at a portion on themotherboard 100 adjacent to the M.2connector 120. In addition, theheat dissipating body 220 further includes atongue 224 a located at thesecond end 224 of theheat dissipating body 220. Themotherboard 100 also includes atongue slot 160 located on the M.2connector 120 and corresponding to thetongue 224 a. - In detail, in the present embodiment, as shown in
FIG. 4 , theelectronic device 10 further has aconnector housing 150. Theconnector housing 150 is disposed over the M.2connector 120 of themotherboard 100, and thetongue slot 160 is formed at theconnector housing 150. Of course, in other embodiments, theconnector housing 150 may be in other forms, and theconnector housing 150 does not necessarily cover the M.2connector 120 on themotherboard 100. Theconnector cover 150 only needs to provide placement for thetongue slot 160 and fix thetongue slot 160 and the M.2connector 120 on themotherboard 100, and the invention is not limited thereto. In addition, when the heat dissipating assembly of M.2expansion card 200 is disposed on the motherboard, thetongue 224 a located at thesecond end 224 of theheat dissipating body 220 of the heat dissipating assembly of M.2expansion card 200 is extended into thetongue slot 160 of themotherboard 100. - Further, the user detachably fixes the M.2
expansion card 300 to theheat dissipating body 220 through the lockingmember 240 of the heat dissipating assembly of M.2expansion card 200. At this time, the user only needs to insert thetongue 224 a of theheat dissipating body 220 into thetongue slot 160 of themotherboard 100 and simultaneously insert the M.2expansion card 300 into the M.2connector 120 of themotherboard 100. The heat dissipating assembly of M.2expansion card 200 and the M.2expansion card 300 are stacked and held at a second position P2 as shown inFIG. 3 . - Next, please refer to all of
FIG. 1 toFIG. 4 . In the present embodiment, the lockingmember 240 of the heat dissipating assembly of M.2expansion card 200 detachably fixes the M.2expansion card 300 together with theheat dissipating body 220 and holds them at the second position P2. The user only needs to press thefirst end 222 of theheat dissipating body 220 of the heat dissipating assembly of M.2expansion card 200, and the M.2expansion card 300 may be moved together with the heat dissipating assembly of M.2expansion card 200 from the second position P2 shown inFIG. 3 to the first position P1 shown inFIG. 1 to fit themotherboard 100. At this time, the heat dissipating assembly of M.2expansion card 200 is fixed on themotherboard 100 through the fixedportion 222 a of theheat dissipating body 220. It is worth mentioning that in the present embodiment, the sequence of operations described is merely an example. For example, the user may also first insert the M.2expansion card 300 into the M.2connector 120 of themotherboard 100 and then detachably fix the M.2expansion card 300 to theheat dissipating body 220 through the lockingmember 240 of the heat dissipating assembly of M.2expansion card 200. Of course, in other embodiments, the user may also have other installation sequences, and the invention is not limited thereto. - It should be noted that, in the present embodiment, for example, the fixed
portion 222 a of theheat dissipating body 220 may be a through-hole for ascrew 20 to pass through the fixedportion 222 a of theheat dissipating body 220 to fix theheat dissipating body 220 on themotherboard 100. In addition, since the distance between theheat dissipating body 220 of the heat dissipating assembly of M.2expansion card 200 and themotherboard 100 has a certain height, in the present embodiment, aconvex locking portion 30 is disposed on themotherboard 100. Therefore, thescrew 20 may be stably locked to theconvex locking portion 30 after passing through the fixedportion 222 a of theheat dissipating body 220. Of course, in other embodiments, the fixedportion 222 a may be, for example, a structure such as a snap, a latch, or the like, and is not limited thereto. - In addition, in the present embodiment, the
tongue 224 a of the heat dissipating assembly shown inFIG. 4 and thetongue slot 160 of themotherboard 100 are only examples, and in other embodiments not shown, as long as a detachable fixing method is used, the invention is not limited thereto. More specifically, in an embodiment not shown, the heat dissipating assembly of M.2expansion card 200 may not even have thetongue 224 a, and themotherboard 100 may not require thetongue slot 160. In other words, the user only needs to first fix the heat dissipating assembly of M.2expansion card 200 and the M.2expansion card 300 together by the lockingmember 240 and then insert the M.2expansion card 300 to the M.2connector 120 on themotherboard 100. As a result, the heat dissipating assembly of M.2expansion card 200 and the M.2expansion card 300 may still be held at the second position P2 shown inFIG. 3 . Similarly, the user only needs to press thefirst end 222 of theheat dissipating body 220 of the heat dissipating assembly of M.2expansion card 200, and the M.2expansion card 300 may be moved together with the heat dissipating assembly of M.2expansion card 200 from the second position P2 shown inFIG. 3 to the first position P1 shown inFIG. 1 to fit themotherboard 100. Then, the user only needs to fix the fixedportion 222 a of theheat dissipating body 220 to the M.2fixing hole 140 on themotherboard 100, and the M.2expansion card 300 may be fixed on themotherboard 100 by the heat dissipating assembly of M.2expansion card 200. - It should be mentioned here that, the following embodiments adopt the reference numerals of the embodiments above and a portion of the contents thereof, wherein the same numerals are used to represent the same or similar devices and descriptions of the same technical contents are omitted. The omitted portions are as described in the embodiments above and are not repeated in the embodiments below.
-
FIG. 5 is a side view of a heat dissipating assembly of an M.2 expansion card according to another embodiment of the invention. Please refer toFIG. 5 . In the present embodiment, the lockingmember 240 of a heat dissipating assembly of M.2expansion card 200 a may be a stud (the lockingmember 240 a) in addition to, for example, a screw. Further, when the user inserts the M.2expansion card 300 on the M.2connector 120 on themotherboard 100, the M.2connector 120 itself has a partial effect of fixing the M.2expansion card 300. Therefore, the user may also hold the M.2expansion card 300 without a screw (the locking member 240). That is, the user only needs to fix the stud (the lockingmember 240 a) without a nut on thescrew hole 227 of theheat dissipating body 220 and lean the stud (the lockingmember 240 a) against an edge of the M.2expansion card 300 opposite to another side of the M.2connector 120 to ensure that the M.2expansion card 300 does not slip, and then the user may fix the M.2expansion card 300 to theheat dissipating body 220. -
FIG. 6 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still another embodiment of the invention. Referring toFIG. 6 , in the present embodiment, aheat dissipating body 220 b further has at least oneclamping arm 260. The clampingarm 260 is extended from at least one side of theheat dissipating body 220 b, and theclamping arm 260 may detachably clamp the M.2expansion card 300. - In detail, when the user inserts the M.2
expansion card 300 into the M.2connector 120 on the motherboard 100 (FIG. 1 ), the user fixes the M.2expansion card 300 to theheat dissipating body 220 b using the locking member 240 (FIG. 1 ). At this time, theheat dissipating body 220 b is located at one side of the M.2expansion card 300, and theclamping arm 260 is hooked on another side of the M.2expansion card 300. The clampingarm 260 of the further ensures that the M.2expansion card 300 may be stably fixed with theheat dissipating body 220 without slipping. In the present embodiment, as shown inFIG. 6 , the number of the at least oneclamping arm 260 is, for example, two. Of course, in other embodiments, the invention is not limited thereto. -
FIG. 7 is a schematic of an electronic device of still yet another embodiment of the invention.FIG. 8 is a partial schematic of a cross section of a heat dissipating assembly of an M.2 expansion card of the electronic device ofFIG. 7 along an extending direction of a first end and a second end. Referring toFIG. 7 andFIG. 8 simultaneously, in the present embodiment, aheat dissipating body 220 c of a heat dissipating assembly of M.2expansion card 200 c has agroove 226 extended from the position of the fixedportion 222 a of theheat dissipating body 220 c to a direction away from thefirst end 222 of theheat dissipating body 220 c. Theheat dissipating body 220 c further includes a slidingmember 228 slidably disposed in thegroove 226. Moreover, the screw holes 227 of theheat dissipating body 220 c are formed on the slidingmember 228. - In detail, in the present embodiment, the screw hole on the sliding
member 228 may be locked by the lockingmember 240. When the user needs to fix the M.2expansion card 300 and theheat dissipating body 220 c together by the lockingmember 240, the user may fix various sizes of the M.2expansion card 300 using the characteristic that the slidingmember 228 may slide freely in thegroove 226. - That is, the user may fix various sizes of the M.2
expansion card 300 and theheat dissipating body 220 c together in conjunction with the lockingmember 240 by sliding the slidingmember 228 to the corresponding position. In this way, the manufacturer does not need to provide corresponding screw hole for each type of the M.2expansion card 300 at the time of manufacture. Further, in the present embodiment, the issue that the heat dissipating assembly of M.2expansion card 200 c may not completely match various sizes of the M.2expansion card 300 on the market due to the manufacturer not providing the screw hole corresponding to the M.2expansion card 300 at the heat dissipating assembly of M.2expansion card 200 c does not occur. Further, the situation in which the sizes of the heat dissipating assembly of M.2expansion card 200 c and the M.2expansion card 300 do not match and thus causing inconvenience to the user also does not occur. -
FIG. 9 is a cross section of a heat dissipating assembly of an M.2 expansion card of an electronic device along an extending direction of a first end and a second end according to still yet another embodiment of the invention. Referring toFIG. 9 , in the present embodiment, At least oneclamping arm 260 is extended from at least one side of theheat dissipating body 220 d, and theclamping arm 260 may detachably clamp the M.2expansion card 300. Moreover, theheat dissipating body 220 d has agroove 226. Theheat dissipating body 220 d further includes a slidingmember 228 slidably disposed in thegroove 226. Moreover, thescrew hole 227 of theheat dissipating body 220 d are formed on the slidingmember 228. - In the present embodiment, as shown in
FIG. 9 , the heat dissipating assembly of M.2 expansion card has theclamping arm 260 in the embodiment ofFIG. 6 and the slidingmember 228 in the embodiments ofFIG. 7 andFIG. 8 at the same time. In short, the present embodiment combines the technical features of the above two embodiments while having the advantages of the technical features of the two embodiments. As a result, the user may more stably and conveniently fix the M.2 expansion card to the motherboard. - It should be noted that the related technical details of the present embodiment are similar to the embodiment of
FIG. 6 and the embodiments ofFIG. 7 andFIG. 8 and therefore are not repeated herein. It is worth mentioning that the lockingmember 240 shown inFIG. 6 toFIG. 9 is, for example, a screw. Of course, in an embodiment not shown, the lockingmember 240 may also be, for example, a stud (the lockingmember 240 a), and the invention is not limited thereto. - Based on the above, the heat dissipating assembly of M.2 expansion card of the electronic device of the invention not only may provide heat dissipation function to the M.2 expansion card, the user may also fix the M.2 expansion card on the motherboard through the heat dissipating assembly of M.2 expansion card. In other words, the user may also first fix the M.2 expansion card and the heat dissipating body through the locking member and then fix the heat dissipating body and the M.2 expansion card together on the motherboard through the fixed portion located at the first end of the heat dissipating body and the M.2 fixing hole on the motherboard. In addition, the electronic device of the invention allows the manufacturer to simply provide a single M.2 fixing hole adjacent to each M.2 connector on the motherboard, and other M.2 fixing holes additionally provided adjacent to the M.2 connector in the prior art may be omitted. Therefore, the heat dissipating assembly of M.2 expansion card of the electronic device of the invention improves the conventional structure of fixing the M.2 expansion card on the motherboard. Therefore, the degree of freedom in the design of the wiring and configuration of devices of the motherboard by those skilled in the art is increased. Further, the electronic device of the invention is also more capable of adapting to the trend of continuous increase in data transmission volume and transmission speed in the future.
- Although the invention has been described with reference to the above embodiments, it will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit of the invention. Accordingly, the scope of the invention is defined by the attached claims not by the above detailed descriptions.
Claims (18)
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CN112787118A (en) * | 2019-11-08 | 2021-05-11 | 泰科电子(上海)有限公司 | Backboard component and electronic device |
US11262813B2 (en) * | 2020-05-05 | 2022-03-01 | Quanta Computer Inc. | Double-sided and tool-less M.2 module design |
TWM617810U (en) * | 2021-05-25 | 2021-10-01 | 艾維克科技股份有限公司 | Securing apparatus for expansion card |
TWI761285B (en) * | 2021-09-06 | 2022-04-11 | 華碩電腦股份有限公司 | Interface card assembly and circuit board module using the same |
TWI778820B (en) * | 2021-09-30 | 2022-09-21 | 新加坡商鴻運科股份有限公司 | Removable expansion module |
US11877414B2 (en) * | 2021-10-18 | 2024-01-16 | Hewlett-Packard Development Company, L.P. | Electronic component mounting |
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CN1221030C (en) * | 2001-10-23 | 2005-09-28 | 丽台科技股份有限公司 | Integrated heat dissipation device |
CN106647956B (en) * | 2015-10-30 | 2020-05-19 | 鸿富锦精密电子(天津)有限公司 | Connecting assembly |
US9703331B1 (en) * | 2016-05-03 | 2017-07-11 | Dell Products L.P. | Board fastener for securing a data storage device in an information handling system |
TWI626797B (en) * | 2017-04-11 | 2018-06-11 | 技嘉科技股份有限公司 | Resilient structure for heat dissipator and connector module |
TWM547692U (en) | 2017-04-28 | 2017-08-21 | Kwo Ger Metal Technology Inc | Detachable M.2 interface heat dissipation module |
TWI636357B (en) * | 2017-05-24 | 2018-09-21 | 微星科技股份有限公司 | Heat sink assembly and motherboard assembly including the same |
TWI633831B (en) * | 2017-09-29 | 2018-08-21 | 威剛科技股份有限公司 | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function |
CN207802016U (en) * | 2017-11-09 | 2018-08-31 | 广东欧珀移动通信有限公司 | Mobile terminal and its camera module and holder |
US10394291B2 (en) * | 2017-11-29 | 2019-08-27 | Facebook, Inc. | Apparatus, system, and method for dissipating heat from expansion components |
TWM561980U (en) * | 2017-12-05 | 2018-06-11 | 技嘉科技股份有限公司 | Main circuit board with heat dissipation holes and electronic device thereof |
TWM565468U (en) | 2018-03-13 | 2018-08-11 | 微星科技股份有限公司 | Heat dissipation assembly |
US10488893B1 (en) * | 2018-05-23 | 2019-11-26 | Dell Products L.P. | Expansion module system |
US10359815B1 (en) * | 2018-09-21 | 2019-07-23 | Super Micro Computer, Inc. | Adaptable storage bay for solid state drives |
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US20200170101A1 (en) | 2020-05-28 |
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