TWI722671B - Heat dissipation assembly of m.2 expansion card and electronic device - Google Patents

Heat dissipation assembly of m.2 expansion card and electronic device Download PDF

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TWI722671B
TWI722671B TW108142129A TW108142129A TWI722671B TW I722671 B TWI722671 B TW I722671B TW 108142129 A TW108142129 A TW 108142129A TW 108142129 A TW108142129 A TW 108142129A TW I722671 B TWI722671 B TW I722671B
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expansion card
heat sink
sink body
motherboard
heat dissipation
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TW108142129A
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Chinese (zh)
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TW202021449A (en
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簡源利
張燕雲
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技嘉科技股份有限公司
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Abstract

A heat dissipating assembly of an M.2 expansion card is adapted to fix a M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on one of the screw holes, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.

Description

M.2擴充卡的散熱組件及電子裝置Heat dissipation component and electronic device of M.2 expansion card

本發明是有關於一種散熱組件及電子裝置，且特別是有關於一種M.2擴充卡的散熱組件及電子裝置。The present invention relates to a heat dissipation component and an electronic device, and more particularly to a heat dissipation component and an electronic device of an M.2 expansion card.

目前，相當多的電子裝置的主機板上設置有可讓M.2擴充卡連接的M.2連接器，以方便使用者擴充。因為M.2擴充卡有不同的尺寸，現有的主機板上會需要在M.2連接器附近配置至少2~3以上的螺絲孔，以將不同尺寸的擴充卡固定於主機板上。At present, the motherboards of many electronic devices are provided with M.2 connectors that allow M.2 expansion cards to be connected to facilitate user expansion. Because M.2 expansion cards have different sizes, existing motherboards need to be equipped with at least 2 to 3 screw holes near the M.2 connector to fix expansion cards of different sizes on the motherboard.

然而，近年來隨著科技的演進，例如雲端運算的進步，使得CPU傳遞高速訊號的需求增加。其中，PCI-E介面與CPU之間需要有更多的走線配置。然而，M.2擴充卡的連接器多半設置在PCI-E介面與CPU之間。特別是，主機板在此區域要設置多個讓M.2擴充卡固定於主機板上的螺絲孔，而使得PCI-E介面與CPU之間的走線佈局更加困難。However, with the evolution of technology in recent years, such as the advancement of cloud computing, the demand for CPUs to transmit high-speed signals has increased. Among them, more wiring configurations are required between the PCI-E interface and the CPU. However, the connector of the M.2 expansion card is mostly located between the PCI-E interface and the CPU. In particular, the motherboard must be provided with multiple screw holes in this area for the M.2 expansion card to be fixed on the motherboard, which makes the wiring layout between the PCI-E interface and the CPU more difficult.

本發明提供一種M.2擴充卡的散熱組件，M.2擴充卡能夠透過M.2擴充卡的散熱組件固定至主機板上。The present invention provides a heat dissipation assembly of an M.2 expansion card. The M.2 expansion card can be fixed to a main board through the heat dissipation assembly of the M.2 expansion card.

本發明提供一種電子裝置，其具有上述的M.2擴充卡的散熱組件。此電子裝置可使主機板上僅需設置單一個M.2固定孔便能固定多種尺寸的M.2擴充卡及M.2擴充卡的散熱組件，而降低主機板佈線的困難性。The present invention provides an electronic device having the heat dissipation assembly of the above-mentioned M.2 expansion card. The electronic device can fix the M.2 expansion card of various sizes and the heat dissipation components of the M.2 expansion card with only a single M.2 fixing hole on the motherboard, thereby reducing the difficulty of wiring the motherboard.

本發明的一種M.2擴充卡的散熱組件，適於將一M.2擴充卡固定於一主機板上，且包括一具有一第一端的散熱件本體以及一鎖固件。散熱件本體包括位於第一端的一固定部以及至少一螺孔，且散熱件本體適於透過固定部固定至主機板上。鎖固件可拆卸地配置在其中一個螺孔上，且鎖固件適於固定M.2擴充卡於散熱件本體，至少一螺孔為多個螺孔，這些螺孔間隔地配置在散熱件本體上，鎖固件適於由散熱件本體的下表面鎖入這些螺孔的其中一個。The heat dissipation assembly of an M.2 expansion card of the present invention is suitable for fixing an M.2 expansion card on a motherboard, and includes a heat sink body with a first end and a locking member. The heat sink body includes a fixing portion and at least one screw hole at the first end, and the heat sink body is suitable for being fixed to the motherboard through the fixing portion. The locking member is detachably disposed on one of the screw holes, and the locking member is suitable for fixing the M.2 expansion card to the heat sink body. At least one screw hole is a plurality of screw holes, and the screw holes are arranged on the heat sink body at intervals , The locking member is adapted to be locked into one of these screw holes from the lower surface of the heat sink body.

在本發明的一實施例中，上述的M.2擴充卡的散熱組件更具有至少一夾持臂，且夾持臂延伸自散熱件本體的至少一側。夾持臂適於可拆卸地夾持M.2擴充卡。當M.2擴充卡配置在散熱組件上時，散熱件本體位於M.2擴充卡的一面，至少一夾持臂勾住M.2擴充卡的另一面。In an embodiment of the present invention, the heat dissipation assembly of the aforementioned M.2 expansion card further has at least one clamping arm, and the clamping arm extends from at least one side of the heat sink body. The clamping arm is suitable for detachably clamping the M.2 expansion card. When the M.2 expansion card is configured on the heat dissipation assembly, the heat sink body is located on one side of the M.2 expansion card, and at least one clamping arm hooks the other side of the M.2 expansion card.

在本發明的一實施例中，上述的鎖固件為一螺柱或是一螺絲。In an embodiment of the present invention, the aforementioned locking member is a stud or a screw.

在本發明的一實施例中，上述的散熱件本體具有相對於第一端的一第二端。散熱件本體更包括位於第二端的一舌片。In an embodiment of the present invention, the aforementioned heat sink body has a second end opposite to the first end. The heat sink body further includes a tongue at the second end.

在本發明的一實施例中，上述的鎖固件包括一螺帽部，螺帽部位於散熱件本體與主機板之間，螺帽部抵接於M.2擴充卡，以將M.2擴充卡靠合於散熱件本體。In an embodiment of the present invention, the aforementioned locking member includes a nut portion, the nut portion is located between the heat sink body and the motherboard, and the nut portion abuts against the M.2 expansion card to expand the M.2 The card is leaned against the body of the heat sink.

本發明的一種電子裝置，適於供一M.2擴充卡配置，且包括一主機板以及一M.2擴充卡的散熱組件。主機板包括一M.2連接器及單一個M.2固定孔。M.2擴充卡的散熱組件可拆卸地配置在主機板上靠近於M.2連接器的部位，且適於將M.2擴充卡固定於主機板上。M.2擴充卡的散熱組件還包括一具有一第一端的散熱件本體以及一鎖固件。散熱件本體包括位於第一端固定部以及至少一螺孔。固定部可拆卸地固定至主機板的M.2固定孔上。鎖固件可拆卸地配置在螺孔的其中一個上，且適於固定M.2擴充卡於散熱件本體，至少一螺孔為多個螺孔，這些螺孔間隔地配置在散熱件本體上，鎖固件適於由散熱件本體的下表面鎖入這些螺孔的其中一個。An electronic device of the present invention is suitable for the configuration of an M.2 expansion card, and includes a motherboard and a heat dissipation component of the M.2 expansion card. The main board includes an M.2 connector and a single M.2 fixing hole. The heat dissipation component of the M.2 expansion card is detachably arranged on the main board near the M.2 connector, and is suitable for fixing the M.2 expansion card on the main board. The heat dissipating assembly of the M.2 expansion card further includes a heat dissipating element body with a first end and a locking member. The heat sink body includes a fixing portion at the first end and at least one screw hole. The fixing part is detachably fixed to the M.2 fixing hole of the main board. The locking member is detachably disposed on one of the screw holes and is suitable for fixing the M.2 expansion card to the heat sink body. At least one screw hole is a plurality of screw holes, and the screw holes are arranged on the heat sink body at intervals. The locking member is adapted to be locked into one of the screw holes from the lower surface of the heat sink body.

在本發明的一實施例中，上述的M.2擴充卡的散熱組件更具有至少一夾持臂，且夾持臂延伸自散熱件本體的至少一側。夾持臂適於可拆卸地夾持M.2擴充卡。當M.2擴充卡配置在散熱組件上時，散熱件本體位於M.2擴充卡的一面，至少一夾持臂勾住M.2擴充卡的另一面。In an embodiment of the present invention, the heat dissipation assembly of the aforementioned M.2 expansion card further has at least one clamping arm, and the clamping arm extends from at least one side of the heat sink body. The clamping arm is suitable for detachably clamping the M.2 expansion card. When the M.2 expansion card is configured on the heat dissipation assembly, the heat sink body is located on one side of the M.2 expansion card, and at least one clamping arm hooks the other side of the M.2 expansion card.

在本發明的一實施例中，上述的鎖固件為一螺柱或是一螺絲。In an embodiment of the present invention, the aforementioned locking member is a stud or a screw.

在本發明的一實施例中，上述的散熱件本體具有相對於第一端的一第二端。散熱件本體更包括位於第二端的一舌片。主機板更包括位於M.2連接器上且對應於舌片的一舌片插槽。當M.2擴充卡的散熱組件配置在主機板上時，舌片伸入舌片插槽。In an embodiment of the present invention, the aforementioned heat sink body has a second end opposite to the first end. The heat sink body further includes a tongue at the second end. The motherboard further includes a tongue slot on the M.2 connector and corresponding to the tongue. When the heat dissipation component of the M.2 expansion card is configured on the motherboard, the tongue extends into the tongue slot.

在本發明的一實施例中，上述的鎖固件包括一螺帽部，螺帽部位於散熱件本體與主機板之間，螺帽部抵接於M.2擴充卡，以將M.2擴充卡靠合於散熱件本體。In an embodiment of the present invention, the aforementioned locking member includes a nut portion, the nut portion is located between the heat sink body and the motherboard, and the nut portion abuts against the M.2 expansion card to expand the M.2 The card is leaned against the body of the heat sink.

基於上述，本發明的電子裝置的M.2擴充卡的散熱組件除了能夠提供M.2擴充卡散熱功能之外，使用者還可藉由此M.2擴充卡的散熱組件將M.2擴充卡固定於主機板上。也就是說，使用者能夠透過鎖固件將M.2擴充卡與M.2擴充卡的散熱組件的散熱件本體固定在一起。本發明的M.2擴充卡的散熱組件可以藉由電子裝置的主機板的M.2固定孔而固定在主機板上，而將散熱件本體與M.2擴充卡一起固定至主機板上。此外，本發明的電子裝置的主機板僅需對各M.2連接器設置單一個M.2固定孔，而不需要如習知在M.2連接器附近配置有多個M.2固定孔來固定M.2擴充卡。因此，本發明的電子裝置的主機板可讓出習知的部分M.2固定孔的空間，以使主機板上走線佈局的更具有彈性。Based on the above, in addition to providing the heat dissipation function of the M.2 expansion card, the heat dissipation assembly of the M.2 expansion card of the electronic device of the present invention can also be used to expand the M.2 by the heat dissipation assembly of the M.2 expansion card. The card is fixed on the motherboard. In other words, the user can fix the M.2 expansion card and the heat sink body of the heat dissipation assembly of the M.2 expansion card together through the lock firmware. The heat dissipation assembly of the M.2 expansion card of the present invention can be fixed on the motherboard through the M.2 fixing hole of the motherboard of the electronic device, and the heat sink body and the M.2 expansion card are fixed to the motherboard together. In addition, the motherboard of the electronic device of the present invention only needs to provide a single M.2 fixing hole for each M.2 connector, instead of having multiple M.2 fixing holes near the M.2 connector as in the prior art. To fix the M.2 expansion card. Therefore, the motherboard of the electronic device of the present invention can free up the space of the conventional part of the M.2 fixing hole, so that the wiring layout of the motherboard is more flexible.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

圖1是本發明的一實施例的一種電子裝置位於第一位置且固定於主機板的示意圖。圖2是圖1的電子裝置的M.2擴充卡的散熱組件的側視示意圖。請參閱圖1及圖2，本實施例的一種電子裝置10包括一主機板100及一M.2擴充卡的散熱組件200。主機板100包括一M.2連接器120及單一個M.2固定孔140。此外，電子裝置10的M.2連接器120可供一M.2擴充卡300配置。M.2擴充卡的散熱組件200包括一散熱件本體220及一鎖固件240。散熱件本體220具有一第一端222以及相對於第一端222的一第二端224。此外，散熱件本體220還包括位於第一端222的一固定部222a以及至少一螺孔227。FIG. 1 is a schematic diagram of an electronic device in a first position and fixed to a motherboard according to an embodiment of the present invention. 2 is a schematic side view of the heat dissipation assembly of the M.2 expansion card of the electronic device in FIG. 1. Please refer to FIG. 1 and FIG. 2, an electronic device 10 of this embodiment includes a motherboard 100 and a heat dissipation assembly 200 of an M.2 expansion card. The motherboard 100 includes an M.2 connector 120 and a single M.2 fixing hole 140. In addition, the M.2 connector 120 of the electronic device 10 can be configured with an M.2 expansion card 300. The heat dissipating assembly 200 of the M.2 expansion card includes a heat dissipating element body 220 and a locking member 240. The heat sink body 220 has a first end 222 and a second end 224 opposite to the first end 222. In addition, the heat sink body 220 further includes a fixing portion 222 a at the first end 222 and at least one screw hole 227.

值得一提的是，在本實施例中，電子裝置10的M.2擴充卡的散熱組件200支援多種M.2擴充卡300尺寸長度。舉例而言，M.2擴充卡300的尺寸可以是2230、2242、2260、2280，本發明並不以此為限。It is worth mentioning that, in this embodiment, the heat dissipation assembly 200 of the M.2 expansion card of the electronic device 10 supports a variety of M.2 expansion card 300 sizes and lengths. For example, the size of the M.2 expansion card 300 may be 2230, 2242, 2260, 2280, and the present invention is not limited thereto.

如圖1所示，在本實施例中，M.2擴充卡的散熱組件200的鎖固件240例如為螺絲。散熱件本體220上的至少一螺孔227為多個螺孔227，且螺孔227的數量例如為2個。進一步地說，多個螺孔227間隔地被配置在散熱件本體220上，而多個螺孔227的排列位置在沿著散熱件本體220的平行於散熱件本體220的第一端222與第二端224之沿伸方向的中線上。螺孔227的位置對應於M.2擴充卡300的多種尺寸長度，以配合鎖固件240將M.2擴充卡300可拆卸地固定於散熱件本體220上。As shown in FIG. 1, in this embodiment, the locking member 240 of the heat dissipation assembly 200 of the M.2 expansion card is, for example, a screw. The at least one screw hole 227 on the heat sink body 220 is a plurality of screw holes 227, and the number of the screw holes 227 is, for example, two. Furthermore, the plurality of screw holes 227 are arranged on the heat sink body 220 at intervals, and the arrangement positions of the plurality of screw holes 227 are along the first end 222 and the second end of the heat sink body 220 parallel to the heat sink body 220. The center line of the two ends 224 along the direction of extension. The position of the screw hole 227 corresponds to various lengths of the M.2 expansion card 300, and the M.2 expansion card 300 is detachably fixed to the heat sink body 220 in cooperation with the locking member 240.

此外，由圖2可見，當螺絲(鎖固件240)鎖固於螺孔227上時，鎖絲(鎖固件240)的螺柱部分可抵靠在M.2擴充卡300相對於M.2連接器120的另一側的邊緣，以確保M.2擴充卡300穩定地插設於主機板100上的M.2連接器120。另外，螺絲(鎖固件240)的螺帽會稍微扣住M.2擴充卡300以使M.2擴充卡300更穩定地靠合於散熱件本體220。In addition, it can be seen from FIG. 2 that when the screw (locking member 240) is locked on the screw hole 227, the stud part of the locking wire (locking member 240) can abut against the M.2 expansion card 300 to be connected to the M.2 The edge of the other side of the connector 120 to ensure that the M.2 expansion card 300 is stably inserted into the M.2 connector 120 on the motherboard 100. In addition, the nut of the screw (locking member 240) slightly buckles the M.2 expansion card 300 so that the M.2 expansion card 300 is more stably leaned against the heat sink body 220.

在此需說明的是，在本實施例中，M.2擴充卡的散熱組件200的材質例如可以為鋁、碳化合金、銅等有助於散熱的材質，但不以此為限。此外，如圖1所示，為了方便表達散熱件本體220上散熱件本體220上的多個螺孔227，在本發明的圖式中，將散熱件本體220的表面繪示為平面，但不以此為限。當然，在其他實施例中，散熱件本體220也可以例如為鰭片或是其他有助於M.2擴充卡的散熱組件200散熱的形狀。It should be noted here that, in this embodiment, the material of the heat dissipation assembly 200 of the M.2 expansion card can be, for example, aluminum, carbide alloy, copper and other materials that help heat dissipation, but it is not limited thereto. In addition, as shown in FIG. 1, in order to conveniently express the multiple screw holes 227 on the heat sink body 220 on the heat sink body 220, in the drawings of the present invention, the surface of the heat sink body 220 is shown as a plane, but not Limit this. Of course, in other embodiments, the heat sink body 220 may also be, for example, fins or other shapes that help the heat dissipation assembly 200 of the M.2 expansion card to dissipate heat.

圖3是圖1的電子裝置設置在主機板上且位於第二位置的示意圖。圖4是圖3的其他視角的局部放大示意圖。請參考圖3及圖4。在本實施例中，M.2擴充卡的散熱組件200可拆卸地配置在主機板100上靠近於M.2連接器120的部位。此外，散熱件本體220更包括位於散熱件本體220的第二端224的一舌片224a。主機板100也包括位於M.2連接器120上且對應於舌片224a的一舌片插槽160。FIG. 3 is a schematic diagram of the electronic device of FIG. 1 installed on a motherboard and in a second position. Fig. 4 is a partial enlarged schematic view of Fig. 3 from other viewing angles. Please refer to Figure 3 and Figure 4. In this embodiment, the heat dissipating assembly 200 of the M.2 expansion card is detachably disposed on the motherboard 100 close to the M.2 connector 120. In addition, the heat sink body 220 further includes a tongue 224 a at the second end 224 of the heat sink body 220. The motherboard 100 also includes a tongue slot 160 located on the M.2 connector 120 and corresponding to the tongue 224a.

詳細而言，在本實施例中，如圖4所示，在本實施例中，電子裝置10還具有一連接器外罩150。連接器外罩150罩設於主機板100的M.2連接器120上，而舌片插槽160形成於連接器外罩150。當然，在其他實施例中，連接器外罩150可以是其他形式，連接器外罩150也不一定要罩住主機板100上的M.2連接器120。連接器外罩150只要能夠設置舌片插槽160並將舌片插槽160與主機板100上的M.2連接器120固定即可，本發明並不以此為限制。此外，當M.2擴充卡的散熱組件200配置在主機板上時，位於M.2擴充卡的散熱組件200的散熱件本體220的第二端224的舌片224a將會伸入主機板100的舌片插槽160。In detail, in this embodiment, as shown in FIG. 4, in this embodiment, the electronic device 10 further has a connector cover 150. The connector cover 150 is disposed on the M.2 connector 120 of the motherboard 100, and the tongue slot 160 is formed on the connector cover 150. Of course, in other embodiments, the connector cover 150 may be in other forms, and the connector cover 150 does not necessarily have to cover the M.2 connector 120 on the motherboard 100. The connector housing 150 only needs to be able to provide the tongue slot 160 and fix the tongue slot 160 to the M.2 connector 120 on the motherboard 100, and the present invention is not limited thereto. In addition, when the heat sink 200 of the M.2 expansion card is disposed on the motherboard, the tongue 224a located at the second end 224 of the heat sink body 220 of the heat sink 200 of the M.2 expansion card will extend into the motherboard 100 The tongue piece slot is 160.

進一步而言，當使用者將M.2擴充卡300透過M.2擴充卡的散熱組件200的鎖固件240可拆卸地與散熱件本體220固定在一起之後。此時，使用者只要將散熱件本體220的舌片224a伸入主機板100的舌片插槽160，並同時將M.2擴充卡300也插設於主機板100的M.2連接器120。M.2擴充卡的散熱組件200及M.2擴充卡300便會疊置在一起並維持在如圖3所示的第二位置P2。Furthermore, when the user detachably fixes the M.2 expansion card 300 with the heat sink body 220 through the locking member 240 of the heat dissipation assembly 200 of the M.2 expansion card. At this time, the user only needs to extend the tongue 224a of the heat sink body 220 into the tongue slot 160 of the motherboard 100, and at the same time insert the M.2 expansion card 300 into the M.2 connector 120 of the motherboard 100. . The heat dissipation assembly 200 of the M.2 expansion card and the M.2 expansion card 300 are stacked together and maintained at the second position P2 as shown in FIG. 3.

接著，請同時參考圖1至圖4。在本實施例中，當M.2擴充卡的散熱組件200的鎖固件240將M.2擴充卡300可拆卸地與散熱件本體220固定在一起並維持在第二位置P2之後。使用者只要施壓於M.2擴充卡的散熱組件200的散熱件本體220的第一端222，M.2擴充卡300便能夠連同M.2擴充卡的散熱組件200從如圖3所示的第二位置P2一起移動如圖1所示的第一位置P1以靠合於主機板100。此時，M.2擴充卡的散熱組件200透過散熱件本體220的固定部222a固定至主機板100上。值得一提的是，在本實施例中，所敘述的操作順序僅為舉例。舉例而言，使用者也可以依個人喜好，先將M.2擴充卡300插設於主機板100的M.2連接器120，再將M.2擴充卡300透過M.2擴充卡的散熱組件200的鎖固件240可拆卸地與散熱件本體220固定在一起。當然，在其他實施例中，使用者也可以有其它安裝順序，本發明並不以此為限。Next, please refer to Figures 1 to 4 at the same time. In this embodiment, when the locking member 240 of the heat dissipating assembly 200 of the M.2 expansion card detachably fixes the M.2 expansion card 300 to the heat dissipating element body 220 and maintains it in the second position P2. The user only needs to press the first end 222 of the heat sink body 220 of the heat dissipating assembly 200 of the M.2 expansion card, and the M.2 expansion card 300 can be combined with the heat dissipating assembly 200 of the M.2 expansion card as shown in FIG. 3 The second position P2 moves together with the first position P1 shown in FIG. 1 to be close to the main board 100. At this time, the heat dissipating assembly 200 of the M.2 expansion card is fixed to the motherboard 100 through the fixing portion 222 a of the heat dissipating element body 220. It is worth mentioning that in this embodiment, the described operation sequence is only an example. For example, the user can also according to personal preference, first insert the M.2 expansion card 300 into the M.2 connector 120 of the motherboard 100, and then heat the M.2 expansion card 300 through the M.2 expansion card The locking member 240 of the assembly 200 is detachably fixed to the heat sink body 220. Of course, in other embodiments, the user may also have other installation sequences, and the present invention is not limited to this.

在此需說明的是，在本實施例中，舉例而言，散熱件本體220的固定部222a可以是一穿孔，以供螺絲20穿過散熱件本體220的固定部222a而將散熱件本體220固定至主機板100上。另外，因為M.2擴充卡的散熱組件200的散熱件本體220與主機板100的之間的平行距離有一定的高度，在本實施例中，主機板100上會設置一凸起的鎖固部30。以供螺絲20穿過散熱件本體220的固定部222a後能穩定地鎖固於凸起的鎖固部30。當然，在其他實施例中，固定部222a可以例如為卡扣、栓鎖等結構，並不以此為限制。It should be noted here that, in this embodiment, for example, the fixing portion 222a of the heat sink body 220 may be a through hole, so that the screw 20 can pass through the fixing portion 222a of the heat sink body 220 to fasten the heat sink body 220. Fixed to the motherboard 100. In addition, because the parallel distance between the heat sink body 220 of the heat sink assembly 200 of the M.2 expansion card and the motherboard 100 has a certain height, in this embodiment, a protruding lock is provided on the motherboard 100 Department 30. After the screw 20 passes through the fixing portion 222a of the heat sink body 220, it can be stably locked to the raised locking portion 30. Of course, in other embodiments, the fixing portion 222a may be a structure such as a buckle, a latch, etc., and is not limited thereto.

除此之外，在本實施例中，圖4中繪示的散熱組件的舌片224a及主機板100的舌片插槽160僅為舉例，在其他未繪示的實施例中，只要是可拆卸式的固定方式即可，並不以此為限。更一進步地說，在一未繪示的實施例中，M.2擴充卡的散熱組件200甚至可以不具有舌片224a，且主機板100也可以不需要舌片插槽160。也就是說，使用者只要先藉由鎖固件240將M.2擴充卡的散熱組件200與M.2擴充卡300固定在一起，再將M.2擴充卡300插設於主機板100上的M.2連接器120。M.2擴充卡的散熱組件200以及M.2擴充卡300便依然能夠維持在圖3所示的第二位置P2。同樣地，使用者只要施壓於M.2擴充卡的散熱組件200的散熱件本體220的第一端222，M.2擴充卡300便可連同M.2擴充卡的散熱組件200從如圖3所示的第二位置P2一起移動如圖1所示的第一位置P1以靠合於主機板100。接著，使用者僅需再將散熱件本體220的固定部222a固定至主機板100上的M.2固定孔140，便可藉由M.2擴充卡的散熱組件200將M.2擴充卡300固定於主機板100上。In addition, in this embodiment, the tongue 224a of the heat dissipation assembly and the tongue slot 160 of the motherboard 100 shown in FIG. 4 are only examples. In other embodiments not shown, as long as it is available A detachable fixing method is sufficient, and it is not limited to this. To be more advanced, in an unshown embodiment, the heat dissipation assembly 200 of the M.2 expansion card may not even have the tongue 224a, and the motherboard 100 may not need the tongue slot 160. In other words, the user only needs to fix the heat dissipation assembly 200 of the M.2 expansion card and the M.2 expansion card 300 together by the locking firmware 240, and then insert the M.2 expansion card 300 on the motherboard 100. M.2 connector 120. The heat dissipation assembly 200 of the M.2 expansion card and the M.2 expansion card 300 can still be maintained at the second position P2 shown in FIG. 3. Similarly, the user only needs to press the first end 222 of the heat sink body 220 of the heat dissipating assembly 200 of the M.2 expansion card, and the M.2 expansion card 300 can be combined with the heat dissipating assembly 200 of the M.2 expansion card as shown in the figure. The second position P2 shown in 3 moves together with the first position P1 shown in FIG. 1 to be close to the main board 100. Then, the user only needs to fix the fixing portion 222a of the heat sink body 220 to the M.2 fixing hole 140 on the motherboard 100, and the M.2 expansion card 300 can be assembled by the heat dissipation assembly 200 of the M.2 expansion card. Fixed on the motherboard 100.

在此必須說明的是，下述實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

圖5是本發明的另一實施例的M.2擴充卡的散熱組件的側視示意圖。請參考圖5。在本實施例中，M.2擴充卡的散熱組件200的鎖固件240除了例如為螺絲之外，也可以是一螺柱(鎖固件240a)。進一步而言，當使用者將M.2擴充卡300插設於主機板100上的M.2連接器120上，M.2連接器120本身便已具有固定M.2擴充卡300的部分效果。因此，使用者也可以不需再透過螺絲(鎖固件240)的螺帽將M.2擴充卡300扣住。也就是說，使用者僅需將沒有螺帽的螺柱(鎖固件240a)鎖固於散熱件本體220的螺孔227上，並利用螺柱(鎖固件240a)靠住M.2擴充卡300相對於M.2連接器120的另一側的邊緣，以確保M.2擴充卡300不滑落，使用者便能夠將M.2擴充卡300固定於散熱件本體220。5 is a schematic side view of the heat dissipation assembly of the M.2 expansion card according to another embodiment of the present invention. Please refer to Figure 5. In this embodiment, the locking member 240 of the heat dissipation assembly 200 of the M.2 expansion card may be, for example, a screw, or a stud (locking member 240a). Furthermore, when the user inserts the M.2 expansion card 300 into the M.2 connector 120 on the motherboard 100, the M.2 connector 120 itself already has a partial effect of fixing the M.2 expansion card 300 . Therefore, the user does not need to buckle the M.2 expansion card 300 through the nut of the screw (locking member 240). In other words, the user only needs to lock the stud (locking member 240a) without a nut on the screw hole 227 of the heat sink body 220, and use the stud (locking member 240a) to lean against the M.2 expansion card 300 Relative to the edge on the other side of the M.2 connector 120, to ensure that the M.2 expansion card 300 does not slip off, the user can fix the M.2 expansion card 300 to the heat sink body 220.

圖6是本發明的又一實施例的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面示意圖。請參考圖6，在本實施例中，M.2擴充卡的散熱組件200更具有至少一夾持臂260。而M.2擴充卡的散熱組件200的夾持臂260延伸自散熱件本體220的至少一側，且夾持臂260能夠可拆卸地夾持M.2擴充卡300。6 is a schematic vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device according to another embodiment of the present invention along the extending direction of the first end and the second end. Please refer to FIG. 6. In this embodiment, the heat dissipation assembly 200 of the M.2 expansion card further has at least one clamping arm 260. The clamping arm 260 of the heat dissipation assembly 200 of the M.2 expansion card extends from at least one side of the heat sink body 220, and the clamping arm 260 can detachably clamp the M.2 expansion card 300.

詳細而言，當使用者將M.2擴充卡300插設於主機板100上的M.2連接器120時，使用者以M.2擴充卡的散熱組件200的鎖固件240將M.2擴充卡300固定於散熱件本體220。此時，散熱件本體220位於M.2擴充卡300的一面，且M.2擴充卡的散熱組件200的夾持臂260會勾住M.2擴充卡300的另一面。M.2擴充卡的散熱組件200的夾持臂260更進一步地確保了M.2擴充卡300能夠穩定地與M.2擴充卡的散熱組件200固定在一起而不會滑動。在本實施例中，如圖6所示，M.2擴充卡的散熱組件200的至少一夾持臂260的數量例如為2個。當然，在其他實施例中，並不以此為限。In detail, when the user inserts the M.2 expansion card 300 into the M.2 connector 120 on the motherboard 100, the user uses the locking member 240 of the heat dissipation assembly 200 of the M.2 expansion card to attach the M.2 The expansion card 300 is fixed to the heat sink body 220. At this time, the heat sink body 220 is located on one side of the M.2 expansion card 300, and the clamping arm 260 of the heat dissipation assembly 200 of the M.2 expansion card hooks the other side of the M.2 expansion card 300. The clamping arm 260 of the heat dissipation assembly 200 of the M.2 expansion card further ensures that the M.2 expansion card 300 can be stably fixed with the heat dissipation assembly 200 of the M.2 expansion card without sliding. In this embodiment, as shown in FIG. 6, the number of at least one clamping arm 260 of the heat dissipation assembly 200 of the M.2 expansion card is, for example, two. Of course, in other embodiments, it is not limited to this.

圖7是本發明的再一實施例的一種電子裝置的示意圖。圖8是圖7的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面的局部示意圖。請同時參考圖7與圖8，在本實施例中，M.2擴充卡的散熱組件200的散熱件本體220具有從散熱件本體220的固定部222a的位置往遠離散熱件本體220的第一端222延伸的一溝槽226。散熱件本體220更包括可滑動地設置於溝槽226的一滑動件228。且散熱件本體220的螺孔227形成於滑動件228上。FIG. 7 is a schematic diagram of an electronic device according to still another embodiment of the present invention. 8 is a partial schematic view of a vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device of FIG. 7 along the extending direction of the first end and the second end. Please refer to FIGS. 7 and 8 at the same time. In this embodiment, the heat sink body 220 of the heat sink assembly 200 of the M.2 expansion card has a first position away from the heat sink body 220 from the fixing portion 222a of the heat sink body 220. A groove 226 extends from the end 222. The heat sink body 220 further includes a sliding member 228 slidably disposed in the groove 226. And the screw hole 227 of the heat sink body 220 is formed on the sliding member 228.

詳細而言，在本實施例中，滑動件228上的螺孔227能夠供鎖固件240鎖固。當使用者需要藉由鎖固件240將M.2擴充卡300與散熱件本體220固定在一起時，使用者可以利用滑動件228能夠在溝槽226內自由滑動的特性以固定多種尺寸的M.2擴充卡300。In detail, in this embodiment, the screw hole 227 on the sliding member 228 can be used for the locking member 240 to be locked. When the user needs to fix the M.2 expansion card 300 and the heat sink body 220 together by the locking member 240, the user can use the sliding member 228 to be able to slide freely in the groove 226 to fix various sizes of M. 2Expansion card 300.

也就是說，使用者只要將滑動件228滑動至相應的位置，便能配合鎖固件240將各種不同尺寸的M.2擴充卡300與散熱件本體220固定在一起。如此一來，生產者在生產時便不需要針對每種M.2擴充卡300的尺寸都設置相對應的螺孔227。此外，在本實施例中，也不會因為生產者未在M.2擴充卡的散熱組件200設置對應M.2擴充卡300尺寸的螺孔227，而發生M.2擴充卡的散熱組件200無法完全配合市面上多種尺寸的M.2擴充卡300的問題。進而出現M.2擴充卡的散熱組件200與M.2擴充卡300尺寸不合的狀況，而造成使用者的不便。In other words, as long as the user slides the sliding member 228 to the corresponding position, the M.2 expansion card 300 of various sizes and the heat sink body 220 can be fixed together with the locking member 240. In this way, the manufacturer does not need to provide corresponding screw holes 227 for each size of the M.2 expansion card 300 during production. In addition, in this embodiment, the heat dissipation assembly 200 of the M.2 expansion card does not occur because the manufacturer does not provide the screw holes 227 corresponding to the size of the M.2 expansion card 300 in the heat dissipation assembly 200 of the M.2 expansion card. Can not fully meet the problem of M.2 expansion card 300 of various sizes on the market. Furthermore, the size of the heat dissipating assembly 200 of the M.2 expansion card and the M.2 expansion card 300 do not match, which causes inconvenience for the user.

圖9是本發明的更一實施例的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面示意圖。請參考圖6至圖9，在本實施例中，M.2擴充卡的散熱組件200具有至少一夾持臂260。而M.2擴充卡的散熱組件200的夾持臂260延伸自散熱件本體220的至少一側，且夾持臂260能夠可拆卸地夾持M.2擴充卡300。除此之外，M.2擴充卡的散熱組件200的散熱件本體220具有從散熱件本體220的固定部222a的位置往遠離散熱件本體220的第一端222延伸的一溝槽226。散熱件本體220更包括可滑動地設置於溝槽226的一滑動件228。且散熱件本體220的螺孔227形成於滑動件228上。9 is a schematic vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device according to another embodiment of the present invention along the extending direction of the first end and the second end. Please refer to FIGS. 6-9. In this embodiment, the heat dissipation assembly 200 of the M.2 expansion card has at least one clamping arm 260. The clamping arm 260 of the heat dissipation assembly 200 of the M.2 expansion card extends from at least one side of the heat sink body 220, and the clamping arm 260 can detachably clamp the M.2 expansion card 300. In addition, the heat sink body 220 of the heat sink assembly 200 of the M.2 expansion card has a groove 226 extending from the fixing portion 222 a of the heat sink body 220 to the first end 222 away from the heat sink body 220. The heat sink body 220 further includes a sliding member 228 slidably disposed in the groove 226. In addition, the screw hole 227 of the heat sink body 220 is formed on the sliding member 228.

在本實施例中，如圖9所示，M.2擴充卡的散熱組件200同時具有圖6的實施例中M.2擴充卡的散熱組件200的夾持臂260及圖7、圖8的實施例中的散熱件本體220的滑動件228。簡而言之，本實施例的電子裝置10的M.2擴充卡的散熱組件200將上述兩實施例中的技術特徵組合在一起，而同時具備了兩實施例的技術特徵的優點，進一步讓使用者能夠更穩定且方便地利用本實施例的M.2擴充卡的散熱組件200將M.2擴充卡固定至主機板。In this embodiment, as shown in FIG. 9, the heat dissipating assembly 200 of the M.2 expansion card has both the clamping arm 260 of the heat dissipating assembly 200 of the M.2 expansion card in the embodiment of FIG. The sliding member 228 of the heat sink body 220 in the embodiment. In short, the heat dissipation assembly 200 of the M.2 expansion card of the electronic device 10 of this embodiment combines the technical features of the above two embodiments, and at the same time has the advantages of the technical features of the two embodiments, further allowing The user can more stably and conveniently use the heat dissipation assembly 200 of the M.2 expansion card of this embodiment to fix the M.2 expansion card to the motherboard.

要說明的是，本實施例的相關技術細節與圖6的實施例及圖7、圖8的實施例相似，因此在此不加以贅述。值得一提的是，在圖6至圖9中所繪示的鎖固件240例如為螺絲。當然，在未繪示的實施例中，鎖固件240也可以例如為螺柱(鎖固件240a)，本發明並不以此為限。It should be noted that the related technical details of this embodiment are similar to the embodiment of FIG. 6 and the embodiments of FIG. 7 and FIG. 8, and therefore will not be repeated here. It is worth mentioning that the locking member 240 shown in FIGS. 6 to 9 is, for example, a screw. Of course, in an embodiment not shown, the locking member 240 may also be a stud (locking member 240a), and the present invention is not limited thereto.

綜上所述，本發明的電子裝置的M.2擴充卡的散熱組件除了能夠提供M.2擴充卡散熱功能之外，使用者還可藉由此M.2擴充卡的散熱組件將M.2擴充卡固定於主機板上。也就是說，使用者也可以先透過鎖固件將M.2擴充卡與M.2擴充卡的散熱組件的散熱件本體固定在一起，再透過位於散熱件本體的第一端的固定部與主機板上的M.2固定孔，而將散熱件本體與M.2擴充卡一起固定至主機板上。此外，本發明的電子裝置使生產者僅需在主機板上各M.2連接器附近設置單一個M.2固定孔，而可省去習知在M.2連接器附近另外配置的其他個M.2固定孔。因此，本發明的電子裝置的M.2擴充卡的散熱組件改良了習知的將M.2擴充卡固定於主機板上的構造。使本領域人員在設計主機板的走線與配置元件時的自由度提高。進一步而言，本發明的電子裝置也更能夠適應未來數據傳輸量及傳輸速度不斷躍進的趨勢。In summary, in addition to providing the heat dissipation function of the M.2 expansion card, the heat dissipation assembly of the M.2 expansion card of the electronic device of the present invention can also be used by the user to remove the M.2 expansion card from the heat dissipation assembly. 2 The expansion card is fixed on the motherboard. In other words, the user can also fix the M.2 expansion card and the heat sink body of the heat dissipation assembly of the M.2 expansion card together through the lock, and then use the fixing part at the first end of the heat sink body to connect to the host The M.2 fixing hole on the board, and the heat sink body and the M.2 expansion card are fixed to the motherboard together. In addition, the electronic device of the present invention allows the manufacturer to only install a single M.2 fixing hole near each M.2 connector on the motherboard, and can save other conventional M.2 connectors. M.2 fixing holes. Therefore, the heat dissipation assembly of the M.2 expansion card of the electronic device of the present invention improves the conventional structure of fixing the M.2 expansion card on the motherboard. This improves the freedom of those skilled in the art in designing the wiring and configuration of the motherboard. Furthermore, the electronic device of the present invention is also more able to adapt to the trend of continuous leaps in data transmission volume and transmission speed in the future.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

P1:第一位置 P2:第二位置 10:電子裝置 20:螺絲 30:鎖固部 100:主機板 120:M.2連接器 140:M.2固定孔 150:連接器外罩 160:舌片插槽 200:M.2擴充卡的散熱組件 220:散熱件本體 222:第一端 222a:固定部 224:第二端 224a:舌片 226:溝槽 227:螺孔 228:滑動件 240、240a:鎖固件 260:夾持臂 300:M.2擴充卡P1: first position P2: second position 10: Electronic device 20: Screw 30: Locking part 100: Motherboard 120: M.2 connector 140: M.2 fixing hole 150: Connector cover 160: tongue slot 200: Heat dissipation component of M.2 expansion card 220: heat sink body 222: first end 222a: Fixed part 224: second end 224a: Tongue 226: Groove 227: screw hole 228: Slider 240, 240a: lock firmware 260: Clamping arm 300: M.2 expansion card

圖1是本發明的一實施例的一種電子裝置位於第一位置且固定於主機板的示意圖。 圖2是圖1的電子裝置的M.2擴充卡的散熱組件的側視示意圖。 圖3是圖1的電子裝置設置在主機板上且位於第二位置的示意圖。 圖4是圖3的其他視角的局部放大示意圖。 圖5是本發明的另一實施例的M.2擴充卡的散熱組件的側視示意圖。 圖6是本發明的又一實施例的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面示意圖。 圖7是本發明的再一實施例的一種電子裝置的示意圖。 圖8是圖7的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面的局部示意圖。 圖9是本發明的更一實施例的電子裝置的M.2擴充卡的散熱組件沿著第一端與第二端之延伸方向的垂直橫切剖面示意圖。FIG. 1 is a schematic diagram of an electronic device in a first position and fixed to a motherboard according to an embodiment of the present invention. 2 is a schematic side view of the heat dissipation assembly of the M.2 expansion card of the electronic device in FIG. 1. FIG. 3 is a schematic diagram of the electronic device of FIG. 1 installed on a motherboard and in a second position. Fig. 4 is a partial enlarged schematic view of Fig. 3 from other viewing angles. 5 is a schematic side view of the heat dissipation assembly of the M.2 expansion card according to another embodiment of the present invention. 6 is a schematic vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device according to another embodiment of the present invention along the extending direction of the first end and the second end. FIG. 7 is a schematic diagram of an electronic device according to still another embodiment of the present invention. 8 is a partial schematic view of a vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device of FIG. 7 along the extending direction of the first end and the second end. 9 is a schematic vertical cross-sectional view of the heat dissipation component of the M.2 expansion card of the electronic device according to another embodiment of the present invention along the extending direction of the first end and the second end.

P2:第二位置 P2: second position

10:電子裝置 10: Electronic device

30:鎖固部 30: Locking part

100:主機板 100: Motherboard

120:M.2連接器 120: M.2 connector

140:M.2固定孔 140: M.2 fixing hole

150:連接器外罩 150: Connector cover

200:M.2擴充卡的散熱組件 200: Heat dissipation component of M.2 expansion card

220:散熱件本體 220: heat sink body

222:第一端 222: first end

222a:固定部 222a: Fixed part

224:第二端 224: second end

227:螺孔 227: screw hole

240:鎖固件 240: lock firmware

300:M.2擴充卡 300: M.2 expansion card

Claims (10)

一種M.2擴充卡的散熱組件，適於將一M.2擴充卡固定於一主機板上，包括：一散熱件本體，具有一第一端以及朝向該主機板的一下表面，且包括：一固定部，位於該第一端，且該散熱件本體適於透過該固定部固定至該主機板上；以及多個螺孔；以及一鎖固件，可拆卸地配置在該些螺孔的其中一個上，適於固定該M.2擴充卡於該散熱件本體，該些螺孔間隔地配置在該散熱件本體上，該鎖固件適於由該散熱件本體的該下表面鎖入該些螺孔的其中一個。 A heat dissipation assembly for an M.2 expansion card, suitable for fixing an M.2 expansion card on a motherboard, includes: a heat sink body with a first end and a lower surface facing the motherboard, and includes: A fixing portion located at the first end, and the heat sink body is adapted to be fixed to the motherboard through the fixing portion; and a plurality of screw holes; and a locking member detachably arranged in the screw holes One upper part is adapted to fix the M.2 expansion card to the heat sink body, the screw holes are arranged on the heat sink body at intervals, and the locking member is adapted to be locked into the heat sink body by the lower surface of the heat sink body. One of the screw holes. 如申請專利範圍第1項所述的M.2擴充卡的散熱組件，更具有至少一夾持臂，延伸自該散熱件本體的至少一側，該至少一夾持臂適於可拆卸地夾持該M.2擴充卡，當該M.2擴充卡配置在該散熱組件上時，該散熱件本體位於該M.2擴充卡的一面，該至少一夾持臂勾住該M.2擴充卡的另一面。 For example, the heat dissipation assembly of the M.2 expansion card described in the first item of the scope of patent application further has at least one clamping arm extending from at least one side of the heat sink body, and the at least one clamping arm is suitable for detachably clamping Holding the M.2 expansion card, when the M.2 expansion card is configured on the heat dissipation assembly, the heat sink body is located on one side of the M.2 expansion card, and the at least one clamping arm hooks the M.2 expansion card The other side of the card. 如申請專利範圍第1項所述的M.2擴充卡的散熱組件，其中該鎖固件為一螺柱或是一螺絲。 For the heat dissipating component of the M.2 expansion card described in item 1 of the scope of patent application, the locking member is a stud or a screw. 如申請專利範圍第1項所述的M.2擴充卡的散熱組件，其中該散熱件本體具有相對於該第一端的一第二端，該散熱件本體更包括位於該第二端的一舌片。 According to the heat dissipation assembly of the M.2 expansion card described in claim 1, wherein the heat sink body has a second end opposite to the first end, and the heat sink body further includes a tongue at the second end sheet. 如申請專利範圍第1項所述的M.2擴充卡的散熱組件，其中該鎖固件包括一螺帽部，該螺帽部位於該散熱件本體與該主機板之間，該螺帽部抵接於該M.2擴充卡，以將該M.2擴充卡靠合於該散熱件本體。 For the heat dissipation assembly of the M.2 expansion card described in the first item of the scope of patent application, the locking member includes a nut portion located between the heat sink body and the motherboard, and the nut portion abuts Connected to the M.2 expansion card, so that the M.2 expansion card is leaned against the heat sink body. 一種電子裝置，適於供一M.2擴充卡配置，包括：一主機板，包括一M.2連接器及單一個M.2固定孔；以及一M.2擴充卡的散熱組件，可拆卸地配置在該主機板上靠近於該M.2連接器的部位，且適於將該M.2擴充卡固定於該主機板上，該M.2擴充卡的散熱組件包括：一散熱件本體，具有一第一端以及朝向該主機板的一下表面，且包括：一固定部，位於該第一端，且可拆卸地固定至該主機板的該M.2固定孔上；以及多個螺孔；以及一鎖固件，可拆卸地配置在該些螺孔的其中一個上，適於固定該M.2擴充卡於該散熱件本體，該些螺孔間隔地配置在該散熱件本體上，該鎖固件適於由該散熱件本體的該下表面鎖入該些螺孔的其中一個。 An electronic device suitable for the configuration of an M.2 expansion card, comprising: a motherboard, including an M.2 connector and a single M.2 fixing hole; and a heat dissipation component of the M.2 expansion card, detachable The M.2 expansion card is grounded on the motherboard close to the M.2 connector, and is suitable for fixing the M.2 expansion card on the motherboard. The heat dissipation assembly of the M.2 expansion card includes: a heat sink body , Having a first end and a lower surface facing the main board, and including: a fixing portion located at the first end and detachably fixed to the M.2 fixing hole of the main board; and a plurality of screws Hole; and a locking member, detachably disposed on one of the screw holes, suitable for fixing the M.2 expansion card to the heat sink body, the screw holes are arranged on the heat sink body at intervals, The locking member is adapted to be locked into one of the screw holes from the lower surface of the heat sink body. 如申請專利範圍第6項所述的電子裝置，其中該M.2擴充卡的散熱組件更具有至少一夾持臂，延伸自該散熱件本體的至少一側，該至少一夾持臂適於可拆卸地夾持該M.2擴充卡，當該 M.2擴充卡配置在該散熱組件上時，該散熱件本體位於該M.2擴充卡的一面，該至少一夾持臂勾住該M.2擴充卡的另一面。 According to the electronic device described in item 6 of the scope of patent application, the heat dissipation component of the M.2 expansion card further has at least one clamping arm extending from at least one side of the heat sink body, and the at least one clamping arm is suitable for Removably hold the M.2 expansion card, when the When the M.2 expansion card is arranged on the heat dissipation assembly, the heat dissipation element body is located on one side of the M.2 expansion card, and the at least one clamping arm hooks the other side of the M.2 expansion card. 如申請專利範圍第6項所述的電子裝置，其中該鎖固件為一螺柱或是一螺絲。 For the electronic device described in item 6 of the scope of patent application, the locking member is a stud or a screw. 如申請專利範圍第6項所述的電子裝置，其中該散熱件本體具有相對於該第一端的一第二端，該散熱件本體更包括位於該第二端的一舌片，該主機板更包括位於該M.2連接器上且對應於該舌片的一舌片插槽，當該M.2擴充卡的散熱組件配置在該主機板上時，該舌片伸入該舌片插槽。 According to the electronic device described in claim 6, wherein the heat sink body has a second end opposite to the first end, the heat sink body further includes a tongue at the second end, and the motherboard is more It includes a tongue slot on the M.2 connector and corresponding to the tongue. When the heat sink of the M.2 expansion card is disposed on the motherboard, the tongue extends into the tongue slot . 如申請專利範圍第6項所述的電子裝置，其中該鎖固件包括一螺帽部，該螺帽部位於該散熱件本體與該主機板之間，該螺帽部抵接於該M.2擴充卡，以將該M.2擴充卡靠合於該散熱件本體。 The electronic device described in item 6 of the scope of patent application, wherein the locking member includes a nut portion located between the heat sink body and the motherboard, and the nut portion abuts against the M.2 Expansion card, so that the M.2 expansion card is leaned against the heat sink body.
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TWM547692U (en) * 2017-04-28 2017-08-21 Kwo Ger Metal Technology Inc Detachable M.2 interface heat dissipation module
TWM565468U (en) * 2018-03-13 2018-08-11 微星科技股份有限公司 Heat dissipation assembly

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Publication number Priority date Publication date Assignee Title
TWM547692U (en) * 2017-04-28 2017-08-21 Kwo Ger Metal Technology Inc Detachable M.2 interface heat dissipation module
TWM565468U (en) * 2018-03-13 2018-08-11 微星科技股份有限公司 Heat dissipation assembly

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