US20190264066A1 - Reactivatable Tile Bonding Mat - Google Patents
Reactivatable Tile Bonding Mat Download PDFInfo
- Publication number
- US20190264066A1 US20190264066A1 US16/276,518 US201916276518A US2019264066A1 US 20190264066 A1 US20190264066 A1 US 20190264066A1 US 201916276518 A US201916276518 A US 201916276518A US 2019264066 A1 US2019264066 A1 US 2019264066A1
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- Prior art keywords
- reactivatable
- tile
- melt material
- mat
- bonding mat
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/08—Flooring or floor layers composed of a number of similar elements only of stone or stone-like material, e.g. ceramics, concrete; of glass or with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/003—PET, i.e. poylethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2505/00—Use of metals, their alloys or their compounds, as filler
- B29K2505/08—Transition metals
- B29K2505/12—Iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2471/00—Floor coverings
- B32B2471/04—Mats
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/0215—Flooring or floor layers composed of a number of similar elements specially adapted for being adhesively fixed to an underlayer; Fastening means therefor; Fixing by means of plastics materials hardening after application
- E04F15/02155—Adhesive means specially adapted therefor, e.g. adhesive foils or strips
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/04—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
Definitions
- This disclosure relates to field of tile installation, and more specifically, this disclosure relates to reactivatable tile bonding mats installable without cement-based thinset.
- Tiles are widely used for wall and floor coverings. Tiles can be made of ceramic, glass, porcelain, concrete, stone, and various composite materials.
- cement-based thinset is used to adhere the tiles to cover surfaces, such floors and walls.
- the use of the cement-based thinset for tile installation has disadvantages. First, it makes hard to remove or replace tile after the tile is glued to a surface. Second, production of the cement used in cement-based thinset is not environmentally friendly because it involves extensive emission of carbon dioxide. Thirdly, the mixing of cement thinset creates a dust-filled area with airborne silica being of concern.
- the present disclosure is directed to tile boding mats. Some embodiments of the present disclosure may allow installment of the tile without using a cement-based thinset.
- a reactivatable tile bonding mat is providing for installation without cement-based thinset.
- the reactivatable tile bonding mat may include a top surface and a bottom surface.
- the top surface and the bottom surface may include polymer hot-melt material.
- the polymer hot-melt material can be reactivated by heating.
- the polymer hot-melt material may have adhesive properties.
- the polymer hot-melt material can be able to adhere to a surface of at least one of concrete, wood, stone, tile and vinyl.
- the polymer hot-melt material may bond to the surface after being heated to a pre-determined temperature. The strength of the bonding may be sufficient to satisfy one or more construction requirements for tile installation.
- the top surface and the bottom surface can include a heat receptor and the heating may be carried out with induction heating.
- the heat receptor can be embedded in the polymer hot-melt material and include at least one of metal flake, metallic fiber, powdered steel, and a steel screen mesh.
- the heating may also be carried out with convection heating.
- the heating can be produced by a microwave heater and a heat gun.
- the polymer hot-melt material may include a polyethylene terephthalate (PET) and a filler.
- the filler may include at least one of calcium carbonate, aragonite, silica, metal flake, and glass.
- the filler can be melted into the PET in a pre-determined proportion to obtain a polymer hot-melt material with a pre-determined melting temperature.
- the polymer hot-melt material may include 20-50% by volume of the PET and 50%-80% by volume of glass material.
- the glass material can be made of a recycled windshield glass or other ground glass filler.
- the melting temperature of the polymer hot-melt material can be higher than a temperature produced by a floor heating system.
- the top surface and the bottom surface of the mat may include a hydrophobic material to cause the reactivatable tile bonding mat to be moisture resistant.
- the top surface and the bottom surface further can include a crack suppressant membrane.
- the top surface and bottom surface may be carried out in a notch pattern.
- the notch pattern may include notches 1 ⁇ 2 inches wide and 3 ⁇ 8 inches deep and a distance between two neighboring notches can be 1 ⁇ 4 inches.
- the height between the top surface and the bottom surface can be between 1 ⁇ 2 inch to 3 ⁇ 4 inch.
- a method for manufacturing a reactivatable tile bonding mat installable without cement-based thinset may include using a polymer PET polyester and a filler.
- the filler may be melted into the polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature.
- the method may further include forming, from the polymer hot-melt material, a mat having a first surface and a second surface, wherein heating of the polymer hot-melt material causes the first surface to adhere to a tile and the second surface to adhere to a surface being covered by the tile.
- FIG. 1 illustrates a system for applying a reactivatable tile bonding mat, according to embodiments of the present technology.
- FIG. 2 illustrates a reactivatable tile bonding mat according to embodiments of the present technology.
- FIG. 3 illustrates another system for applying a reactivatable tile bonding mat, according to embodiments of the present technology.
- FIG. 4A illustrates a top view of a reactivatable tile bonding mat 115 according to some embodiments of the present technology.
- FIG. 4B illustrates a side view of the reactivatable tile bonding mat of FIG. 4A .
- FIG. 5 illustrates a close up view of the top surface of a reactivatable tile bonding mat according to some embodiments of the present technology.
- FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some embodiments of the present technology.
- the technology disclosed herein is concerned with tile installation. Specifically, a reactivatable tile bonding mat that requires no cement-based thinset for installation is disclosed.
- the reactivatable tile bonding mat includes material with adhesive properties on the top surface and the bottom surface.
- the top surface and the bottom surface can include a polymer hot-melt material that is reactivatable after heating, the polymer hot-melt material having adhesive properties for adhering to concrete and other substrates activated upon heating.
- Technical effects of certain embodiments of the disclosure may provide a method for installation of tiles without use of a cement-based thinset by using a reactivatable tile bonding mat. Eliminating the need for cement-based thinset may result in reduction of the use and production of cement-based products, and thereby reducing carbon dioxide emission.
- FIG. 1 illustrates a system 100 for applying a reactivatable tile bonding mat, according to some example embodiments of the present technology.
- the system 100 may include a floor 105 , a tile 110 , and a reactivatable tile bonding mat 115 .
- the reactivatable tile bonding mat 115 can be placed between the floor 105 and the tile 110 .
- Heating 120 can be applied to the reactivatable tile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to the floor.
- FIG. 2 illustrates a system 200 for applying a reactivatable tile bonding mat, according to other example embodiments of the present technology.
- the system 100 may include a floor 105 , a tile 110 , a floor heating system 150 , and a reactivatable tile bonding mat 115 .
- the floor heating system 150 can be built into the floor.
- the floor heating system 150 may include electrically heated cables.
- the reactivatable tile bonding mat 115 can be positioned between the floor heating system 150 and the tile 110 .
- a heating 120 can be applied to the reactivatable tile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to the floor heating system 150 and, lastly, to the floor 105 .
- FIG. 3 illustrates a reactivatable tile bonding mat 115 according to embodiments of the present technology.
- the reactivatable tile bonding mat 115 may include a first surface 125 adhering to a tile and a second surface 115 adhering to a surface on which the tile is to be installed.
- the reactivatable tile bonding mat 115 represents a sheet made of a polymer hot-melt material having adhesive properties.
- the polymer hot-melt material can be adhering to the tile and the floor.
- the polymer hot-melt material can be adhesive with regards to one or more materials that the tile or the floor is made of, for example, concrete, wood, stone, tile and vinyl.
- the width and length of the reactivatable tile bonding mat 110 can be substantially the same as the width and length of the tile 110 .
- the length and width of the reactivatable tile bonding mat 110 may be, for example, 3 by 5 feet, 4 by 8 feet, or of any other size.
- the thickness of the reactivatable tile bonding mat 110 can be, for example, from 1 ⁇ 2 to 3 ⁇ 4 inches.
- the polymer hot-melt material can be made of a mixture of a polyethylene terephthalate (PET) and a filler.
- the filler may include one or more of calcium carbonate, aragonite, silica, metal flake, and glass.
- the filler can be made of recycled windshield glass.
- the filler in the polymer hot-melt material can be added for the following reasons.
- the filler may stabilize temperature at which the polymer hot-melt material can melt.
- a pre-determined proportion of the filler to the PET can be selected to obtain the polymer material with a desired melting temperature for the polymer hot-melt material.
- the descried melting temperature of the polymer hot-melt material can be higher than a temperature produced by the floor heating system to allow the reactivatable tile bonding mat to be used with floor heating systems without being melted.
- the desired melting temperature can be low enough to allow heating 120 to be applied to the reactivatable tile bonding mat to cause melting of the polymer hot-melt material.
- the polymer hot-melt material may include 20-50% by volume of the PET and 50-80% by volume of glass material.
- the filler may provide extra support structure for the tile 110 when the tile 110 is positioned on top of the reactivatable tile bonding mat 115 .
- the filler may replace, at least partially, the PET and thus reduce costs of manufacturing the polymer hot-melt material and the reactivatable tile bonding mat 115 because the filler (for example, recycled windshield glass) can be less expensive than the PET.
- Heating 120 may include inductive heating or conductive heating.
- the heating may be used to adhere the tile 110 to the surface of floor 105 by melting the polymer hot-melt material.
- the heating can be also used to remove the tile or adjust position of the tile already attached to the floor by re-melting the polymer hot-melt material of the reactivatable tile bonding mat 115 .
- the reactivatable tile bonding mat 115 may include a heat receptor.
- the heat receptor when heating is induction heating, may include on or more of metal flake, metallic fiber, powdered steel or a steel screen mesh, embedded in the polymer hot-melt material. Heating may cause molecules of the hot receptor to stir up, which, in turn, causes the polymer hot-melt material to melt and create bonding to surfaces of the tile 110 , the floor 105 and/or floor heating system (if installed on the floor), and other surfaces on which the tile can be installed.
- the reactivatable tile bonding mat 115 may include a porous, melt-bonded polyester that is non-woven and has proven dimensional stability when, for example, subjected to changes in temperature and humidity.
- the reactivatable tile bonding mat 115 may further include a hydrophobic material.
- the hydrophobic material can make the reactivatable tile bonding mat 115 moisture resistant.
- the reactivatable tile bonding mat 115 can also act as a crack suppressant membrane.
- the reactivatable tile bonding mat may include a low-melting point polymer or synthetic material impregnated with metal flake, metallic fibers, or a steel mesh.
- the tile can be placed on the reactivatable tile bonding mat 115 as described above and bonded to the tile by heating the polymer hot-melt material.
- the tile and mat can be properly positioned and an induction heater can be passed over the top of the tile to melt the mat and form a bond between the floor and the tile.
- the induction heater can include a floor buffing machine generating a high frequency alternating current. The current can inductively couple with the PET mix, thus setting up an alternating current flow through the metal impregnated mat.
- the mat would resistively heat and form a permanent bond with the tile and the floor.
- the induction heater can be also be used to re-melt the mat and loosen the tile.
- parameters of bonding of a tile to a surface using the reactivatable tile bonding mat 115 can satisfy one or more construction requirements.
- the requirements may include certain bond strength, tensile strength, crack isolation, and water proofing.
- FIG. 4A illustrates a top view of a reactivatable tile bonding mat 115 according to some embodiments of the present technology.
- FIG. 4B illustrates a side view of the reactivatable tile bonding mat 115 .
- the reactivatable tile bonding mat 115 includes a plate 405 made of a polymer hot-melt material and a metal screen 410 embedded in the plate 405 .
- the metal screen 410 can function as a heat receptor. When the mat 115 is placed between a tile and a floor, the metal screen 410 can be heated to cause the polymer hot-melt material of the plate 405 to melt. After being melted and cooled down, the plate 405 may adhere to the tile and the floor.
- FIG. 5 illustrates a close up view of a top surface of a reactivatable tile bonding mat according to some embodiments of the present technology.
- the top surface comprises a notch pattern for enhanced bonding.
- the notches can be, for example, 1 ⁇ 2 inches wide and 3 ⁇ 8 inches deep.
- a distance between two neighboring notches can be, for example, 1 ⁇ 4 inches.
- FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some example embodiments of the present technology.
- the method 600 may commence with providing a polymer PET polyester in block 605 .
- the method 600 may proceed with providing a filler.
- the filler may include calcium carbonate, aragonite, silica, metal flake, and glass.
- the method 600 may melt the filler in the polymer PET polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature.
- the method may proceed with forming, from the polymer hot-melt material, a mat of a predetermined length, width, and thickness.
- the mat can include a first surface and a second surface such that when the mat is positioned between a tile and a surface to be covered by the tile, heating of the polymer hot-melt material causes the first surface to adhere to the tile and the second surface to adhere to the surface to be covered by the tile.
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
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Abstract
Description
- The present application claims the priority benefit of U.S. Non-Provisional Patent Application Ser. No. 62/634,711, filed on Feb. 23, 2018, titled “Methods of Installing Tile Using a Reactivatable Tile Bonding Mat,” and claims the priority benefit of U.S. Provisional Application No. 62/634,724, filed on Feb. 23, 2018, titled Reactivatable Tile Bonding Mat, the subject matter of the aforementioned applications are incorporated herein by reference for all purposes. The present application is also related to U.S. Non-Provisional patent application Ser. No. ______ filed on February _, titled “Methods of Installing Tile Using a Reactivatable Tile Bonding Mat,” (Attorney Docket No. PA9043US), which is hereby incorporated by reference in its entirety.
- This disclosure relates to field of tile installation, and more specifically, this disclosure relates to reactivatable tile bonding mats installable without cement-based thinset.
- Tiles are widely used for wall and floor coverings. Tiles can be made of ceramic, glass, porcelain, concrete, stone, and various composite materials. Currently cement-based thinset is used to adhere the tiles to cover surfaces, such floors and walls. However, the use of the cement-based thinset for tile installation has disadvantages. First, it makes hard to remove or replace tile after the tile is glued to a surface. Second, production of the cement used in cement-based thinset is not environmentally friendly because it involves extensive emission of carbon dioxide. Thirdly, the mixing of cement thinset creates a dust-filled area with airborne silica being of concern.
- This summary is provided to introduce a selection of concepts in a simplified form that are further described in the Detailed Description below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
- Generally, the present disclosure is directed to tile boding mats. Some embodiments of the present disclosure may allow installment of the tile without using a cement-based thinset.
- According to one example embodiment of the present disclosure, a reactivatable tile bonding mat is providing for installation without cement-based thinset. The reactivatable tile bonding mat may include a top surface and a bottom surface. The top surface and the bottom surface may include polymer hot-melt material. The polymer hot-melt material can be reactivated by heating. The polymer hot-melt material may have adhesive properties.
- The polymer hot-melt material can be able to adhere to a surface of at least one of concrete, wood, stone, tile and vinyl. The polymer hot-melt material may bond to the surface after being heated to a pre-determined temperature. The strength of the bonding may be sufficient to satisfy one or more construction requirements for tile installation.
- The top surface and the bottom surface can include a heat receptor and the heating may be carried out with induction heating. The heat receptor can be embedded in the polymer hot-melt material and include at least one of metal flake, metallic fiber, powdered steel, and a steel screen mesh. The heating may also be carried out with convection heating. The heating can be produced by a microwave heater and a heat gun.
- The polymer hot-melt material may include a polyethylene terephthalate (PET) and a filler. The filler may include at least one of calcium carbonate, aragonite, silica, metal flake, and glass. The filler can be melted into the PET in a pre-determined proportion to obtain a polymer hot-melt material with a pre-determined melting temperature. The polymer hot-melt material may include 20-50% by volume of the PET and 50%-80% by volume of glass material. The glass material can be made of a recycled windshield glass or other ground glass filler. The melting temperature of the polymer hot-melt material can be higher than a temperature produced by a floor heating system.
- The top surface and the bottom surface of the mat may include a hydrophobic material to cause the reactivatable tile bonding mat to be moisture resistant. The top surface and the bottom surface further can include a crack suppressant membrane. In some embodiments, the top surface and bottom surface may be carried out in a notch pattern. The notch pattern may include notches ½ inches wide and ⅜ inches deep and a distance between two neighboring notches can be ¼ inches. In some embodiments, the height between the top surface and the bottom surface can be between ½ inch to ¾ inch.
- According to one example embodiment of the present disclosure, a method for manufacturing a reactivatable tile bonding mat installable without cement-based thinset is provided. The method may include using a polymer PET polyester and a filler. The filler may be melted into the polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature. The method may further include forming, from the polymer hot-melt material, a mat having a first surface and a second surface, wherein heating of the polymer hot-melt material causes the first surface to adhere to a tile and the second surface to adhere to a surface being covered by the tile.
- Other example embodiments of the disclosure and aspects will become apparent from the following description taken in conjunction with the following drawings.
- The accompanying drawings, where like reference numerals refer to identical or functionally similar elements throughout the separate views, together with the detailed description below, are incorporated in and form part of the specification, and serve to further illustrate embodiments of concepts that include the claimed disclosure and explain various principles and advantages of those embodiments.
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FIG. 1 illustrates a system for applying a reactivatable tile bonding mat, according to embodiments of the present technology. -
FIG. 2 illustrates a reactivatable tile bonding mat according to embodiments of the present technology. -
FIG. 3 illustrates another system for applying a reactivatable tile bonding mat, according to embodiments of the present technology. -
FIG. 4A illustrates a top view of a reactivatable tile bondingmat 115 according to some embodiments of the present technology. -
FIG. 4B illustrates a side view of the reactivatable tile bonding mat ofFIG. 4A . -
FIG. 5 illustrates a close up view of the top surface of a reactivatable tile bonding mat according to some embodiments of the present technology. -
FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some embodiments of the present technology. - In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosure. It will be apparent, however, to one skilled in the art, that the disclosure may be practiced without these specific details. In other instances, structures and devices are shown at block diagram form only in order to avoid obscuring the disclosure.
- The technology disclosed herein is concerned with tile installation. Specifically, a reactivatable tile bonding mat that requires no cement-based thinset for installation is disclosed. In some embodiments, the reactivatable tile bonding mat includes material with adhesive properties on the top surface and the bottom surface. The top surface and the bottom surface can include a polymer hot-melt material that is reactivatable after heating, the polymer hot-melt material having adhesive properties for adhering to concrete and other substrates activated upon heating.
- Technical effects of certain embodiments of the disclosure may provide a method for installation of tiles without use of a cement-based thinset by using a reactivatable tile bonding mat. Eliminating the need for cement-based thinset may result in reduction of the use and production of cement-based products, and thereby reducing carbon dioxide emission.
- Referring now to the drawings, various embodiments are described in which like reference numerals represent like parts and assemblies throughout the several views. It should be noted that the reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples outlined in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.
-
FIG. 1 illustrates asystem 100 for applying a reactivatable tile bonding mat, according to some example embodiments of the present technology. Thesystem 100 may include afloor 105, atile 110, and a reactivatabletile bonding mat 115. The reactivatabletile bonding mat 115 can be placed between thefloor 105 and thetile 110.Heating 120 can be applied to the reactivatabletile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to the floor. -
FIG. 2 illustrates a system 200 for applying a reactivatable tile bonding mat, according to other example embodiments of the present technology. Thesystem 100 may include afloor 105, atile 110, afloor heating system 150, and a reactivatabletile bonding mat 115. Thefloor heating system 150 can be built into the floor. Thefloor heating system 150 may include electrically heated cables. The reactivatabletile bonding mat 115 can be positioned between thefloor heating system 150 and thetile 110. Aheating 120 can be applied to the reactivatabletile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to thefloor heating system 150 and, lastly, to thefloor 105. -
FIG. 3 illustrates a reactivatabletile bonding mat 115 according to embodiments of the present technology. The reactivatabletile bonding mat 115 may include afirst surface 125 adhering to a tile and asecond surface 115 adhering to a surface on which the tile is to be installed. In some embodiments, the reactivatabletile bonding mat 115 represents a sheet made of a polymer hot-melt material having adhesive properties. The polymer hot-melt material can be adhering to the tile and the floor. The polymer hot-melt material can be adhesive with regards to one or more materials that the tile or the floor is made of, for example, concrete, wood, stone, tile and vinyl. The width and length of the reactivatabletile bonding mat 110 can be substantially the same as the width and length of thetile 110. The length and width of the reactivatabletile bonding mat 110 may be, for example, 3 by 5 feet, 4 by 8 feet, or of any other size. The thickness of the reactivatabletile bonding mat 110 can be, for example, from ½ to ¾ inches. - In an example embodiment, the polymer hot-melt material can be made of a mixture of a polyethylene terephthalate (PET) and a filler. The filler may include one or more of calcium carbonate, aragonite, silica, metal flake, and glass. In some embodiments, the filler can be made of recycled windshield glass.
- The filler in the polymer hot-melt material can be added for the following reasons. First, the filler may stabilize temperature at which the polymer hot-melt material can melt. A pre-determined proportion of the filler to the PET can be selected to obtain the polymer material with a desired melting temperature for the polymer hot-melt material. The descried melting temperature of the polymer hot-melt material can be higher than a temperature produced by the floor heating system to allow the reactivatable tile bonding mat to be used with floor heating systems without being melted. At the same time, the desired melting temperature can be low enough to allow
heating 120 to be applied to the reactivatable tile bonding mat to cause melting of the polymer hot-melt material. In some embodiments, the polymer hot-melt material may include 20-50% by volume of the PET and 50-80% by volume of glass material. - Another reason for adding the filler is that the filler may provide extra support structure for the
tile 110 when thetile 110 is positioned on top of the reactivatabletile bonding mat 115. Yet another reason for adding the filler is that the filler may replace, at least partially, the PET and thus reduce costs of manufacturing the polymer hot-melt material and the reactivatabletile bonding mat 115 because the filler (for example, recycled windshield glass) can be less expensive than the PET. -
Heating 120 may include inductive heating or conductive heating. The heating may be used to adhere thetile 110 to the surface offloor 105 by melting the polymer hot-melt material. The heating can be also used to remove the tile or adjust position of the tile already attached to the floor by re-melting the polymer hot-melt material of the reactivatabletile bonding mat 115. - In some embodiment, the reactivatable
tile bonding mat 115 may include a heat receptor. In some embodiments, when heating is induction heating, the heat receptor may include on or more of metal flake, metallic fiber, powdered steel or a steel screen mesh, embedded in the polymer hot-melt material. Heating may cause molecules of the hot receptor to stir up, which, in turn, causes the polymer hot-melt material to melt and create bonding to surfaces of thetile 110, thefloor 105 and/or floor heating system (if installed on the floor), and other surfaces on which the tile can be installed. - In some embodiments, when relying on other heating methods (for example using a microwave device, heat gun, and so forth) the reactivatable
tile bonding mat 115 may include a porous, melt-bonded polyester that is non-woven and has proven dimensional stability when, for example, subjected to changes in temperature and humidity. - In some embodiments, the reactivatable
tile bonding mat 115 may further include a hydrophobic material. The hydrophobic material can make the reactivatabletile bonding mat 115 moisture resistant. In some embodiments, the reactivatabletile bonding mat 115 can also act as a crack suppressant membrane. - In various embodiments, the reactivatable tile bonding mat may include a low-melting point polymer or synthetic material impregnated with metal flake, metallic fibers, or a steel mesh. For example, the tile can be placed on the reactivatable
tile bonding mat 115 as described above and bonded to the tile by heating the polymer hot-melt material. - In various embodiments, the tile and mat can be properly positioned and an induction heater can be passed over the top of the tile to melt the mat and form a bond between the floor and the tile. The induction heater can include a floor buffing machine generating a high frequency alternating current. The current can inductively couple with the PET mix, thus setting up an alternating current flow through the metal impregnated mat. In various embodiment, the mat would resistively heat and form a permanent bond with the tile and the floor. The induction heater can be also be used to re-melt the mat and loosen the tile.
- In some embodiments, parameters of bonding of a tile to a surface using the reactivatable
tile bonding mat 115 can satisfy one or more construction requirements. The requirements may include certain bond strength, tensile strength, crack isolation, and water proofing. -
FIG. 4A illustrates a top view of a reactivatabletile bonding mat 115 according to some embodiments of the present technology.FIG. 4B illustrates a side view of the reactivatabletile bonding mat 115. InFIG. 4A andFIG. 4B the reactivatabletile bonding mat 115 includes aplate 405 made of a polymer hot-melt material and ametal screen 410 embedded in theplate 405. Themetal screen 410 can function as a heat receptor. When themat 115 is placed between a tile and a floor, themetal screen 410 can be heated to cause the polymer hot-melt material of theplate 405 to melt. After being melted and cooled down, theplate 405 may adhere to the tile and the floor. -
FIG. 5 illustrates a close up view of a top surface of a reactivatable tile bonding mat according to some embodiments of the present technology. InFIG. 4 , the top surface comprises a notch pattern for enhanced bonding. The notches can be, for example, ½ inches wide and ⅜ inches deep. A distance between two neighboring notches can be, for example, ¼ inches. -
FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some example embodiments of the present technology. Themethod 600 may commence with providing a polymer PET polyester inblock 605. Inblock 610, themethod 600 may proceed with providing a filler. The filler may include calcium carbonate, aragonite, silica, metal flake, and glass. - In
block 615, themethod 600 may melt the filler in the polymer PET polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature. Inblock 620, the method may proceed with forming, from the polymer hot-melt material, a mat of a predetermined length, width, and thickness. The mat can include a first surface and a second surface such that when the mat is positioned between a tile and a surface to be covered by the tile, heating of the polymer hot-melt material causes the first surface to adhere to the tile and the second surface to adhere to the surface to be covered by the tile. - The present technology is described above with reference to example embodiments. Therefore, other variations upon the example embodiments are intended to be covered by the present disclosure.
Claims (20)
Priority Applications (1)
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US16/276,518 US20190264066A1 (en) | 2018-02-23 | 2019-02-14 | Reactivatable Tile Bonding Mat |
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US201862634724P | 2018-02-23 | 2018-02-23 | |
US201862634711P | 2018-02-23 | 2018-02-23 | |
US16/276,518 US20190264066A1 (en) | 2018-02-23 | 2019-02-14 | Reactivatable Tile Bonding Mat |
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US16/276,518 Abandoned US20190264066A1 (en) | 2018-02-23 | 2019-02-14 | Reactivatable Tile Bonding Mat |
US16/276,528 Active US11168232B2 (en) | 2018-02-23 | 2019-02-14 | Methods of installing tile using a reactivatable tile bonding mat |
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US16/276,528 Active US11168232B2 (en) | 2018-02-23 | 2019-02-14 | Methods of installing tile using a reactivatable tile bonding mat |
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US11168232B2 (en) | 2018-02-23 | 2021-11-09 | Ardex Group Gmbh | Methods of installing tile using a reactivatable tile bonding mat |
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IT202000002845A1 (en) * | 2020-02-13 | 2021-08-13 | Panariagroup Ind Ceramiche S P A | MATTRESS FOR THE DRY LAYING OF FLOORING MADE WITH CERAMIC PRODUCTS SUBSTANTIALLY LASTRIFORMS, RELATIVE PROCEDURE FOR DRY LAYING OF A FLOORING AND FLOORING SO OBTAINED. |
CN112459288A (en) * | 2020-11-28 | 2021-03-09 | 青岛科瑞新型环保材料集团有限公司 | Heat insulation structure integrated system and construction process thereof |
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-
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- 2019-02-14 US US16/276,518 patent/US20190264066A1/en not_active Abandoned
- 2019-02-14 US US16/276,528 patent/US11168232B2/en active Active
- 2019-02-22 EP EP19158933.2A patent/EP3530841A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11168232B2 (en) | 2018-02-23 | 2021-11-09 | Ardex Group Gmbh | Methods of installing tile using a reactivatable tile bonding mat |
Also Published As
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US11168232B2 (en) | 2021-11-09 |
EP3530841A1 (en) | 2019-08-28 |
US20190264450A1 (en) | 2019-08-29 |
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