US20180323354A1 - Light emitting device and method for manufacturing light emitting device - Google Patents
Light emitting device and method for manufacturing light emitting device Download PDFInfo
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- US20180323354A1 US20180323354A1 US15/588,688 US201715588688A US2018323354A1 US 20180323354 A1 US20180323354 A1 US 20180323354A1 US 201715588688 A US201715588688 A US 201715588688A US 2018323354 A1 US2018323354 A1 US 2018323354A1
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0054—Processes for devices with an active region comprising only group IV elements
- H01L33/0058—Processes for devices with an active region comprising only group IV elements comprising amorphous semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/18—Eye characteristics, e.g. of the iris
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Definitions
- This invention generally relates to a light emitting device and to a method of manufacturing such a light emitting device.
- FIG. 1 is a schematic diagram illustrating an iris recognition system.
- a typical iris recognition system includes three key components: a light source, a camera unit, and a data processing unit. Natural light often reflects off the iris, creating glare that can obstruct part of the view of the iris. To avoid such glare, the light source generally uses infrared light as illumination, which is invisible to the human eye.
- the camera unit uses an infrared camera to take a clear and detailed image of the iris and sends the image to the data processing unit for processing and recognition.
- IR LED based light source generally also includes a substrate for mounting the IR LED and a lens for focusing the light emitted by the IR LED.
- IR LED based light sources for iris recognition systems are currently available on the market. But they are expensive and difficult to make. Their manufacturing process requires cutting a sheet of substrate into individual substrates, mounting a LED onto each substrate, bonding a supporting structure with each substrate, and bonding a lens with the supporting structure. The supporting structures and the lenses are separately molded and cut into individual pieces before bonding with each substrate. Such manufacturing process is complicated and difficult to scale for mass production.
- a light-emitting device in one embodiment, includes a molded body having metal leads and a plane surface for mounting a light-emitting element.
- the light-emitting device also includes a lens having one central portion, one edge portion surrounding the central portion, and one base portion supporting the central portion and the edge portion.
- the central portion has a dome-shaped top surface.
- the edge portion has one inner top surface and one outer top surface, and the inner top surface of the edge portion connects with the dome-shaped top surface of the central portion to form a valley-shaped groove.
- the base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element.
- the cross-sectional line of the outer top surface may be a straight or curved line, and in either case, any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
- the light-emitting element may be a CSP (chip-scale package) chip, white chip, VCSEL (vertical-cavity surface-emitting laser) chip, or SLED (super luminescent diode) chip.
- the light-emitting element may also be a die array.
- a method of manufacturing the light-emitting device includes providing a first sheet of molded structure comprising a plurality of molded bodies having metal leads; placing a second sheet of molded structure comprising a plurality of lenses on top of the first sheet of molded structure; bonding the first sheet of molded structure with the second sheet of molded structure to create a bonded structure so that each molded body forms a sealed chamber with a corresponding lens to enclose a light-emitting element; and cutting the bonded structure to create light emitting devices.
- the sealed chambers help to protect the light-emitting elements from being contaminated by dusts created during the cutting process.
- FIG. 1 is a schematic diagram illustrating an iris recognition system.
- FIG. 2 is a three-dimensional illustration of an embodiment of a light-emitting device according to the invention.
- FIG. 3 is an exploded view of the embodiment shown in FIG. 2 .
- FIG. 4A is a cross-sectional view of the embodiment shown in FIG. 2 .
- FIGS. 4B is a cross-sectional view of an alternative embodiment of the light-emitting device shown in FIG. 4A .
- FIGS. 4C is a cross-sectional view of an alternative embodiment of the light-emitting device shown in FIG. 4A .
- FIG. 5 is a three-dimensional illustration of another embodiment of a light-emitting device according to the invention.
- FIG. 6 is an exploded view of the embodiment shown in FIG. 5 .
- FIG. 7 is a cross-sectional view of the embodiment shown in FIG. 5 .
- FIG. 8 is a two-dimensional illustration of the light focusing effect of an embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity.
- FIG. 9 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity.
- FIG. 10 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity.
- FIGS. 11A-B are perspective views illustrating a method for manufacturing the light-emitting devices according to the invention.
- FIGS. 12A-B are sectional views of the manufacturing method illustrated in FIGS. 11A-B .
- FIG. 13 is a sectional view of using a heat-pressing machine for the manufacturing method illustrated in FIG. 11A-B and 12 A-B.
- FIG. 2 is a three-dimensional illustration of an embodiment of a light-emitting device according to the invention.
- FIG. 3 is an exploded view of the embodiment shown in FIG. 2 .
- FIG. 4A is a cross-sectional view of the embodiment shown in FIG. 2 .
- the light-emitting device 200 includes a molded body 201 and a lens 202 .
- the molded body 201 has raised edges that form a concave portion.
- metal leads 203 At the bottom of the concave portion are metal leads 203 , which extend to the outer edges of the molded body 201 , and a plane surface 205 .
- a light-emitting element 204 e.g., a light-emitting diode
- the lens 202 includes a central portion 206 , an edge portion 207 surrounding the central portion 206 , and a base portion 208 supporting the central portion 206 and the edge portion 207 .
- the central portion 206 is a dome-shaped structure symmetric across its central axis 206 a . It has a dome-shaped top surface 209 .
- the edge portion 207 has an inner top surface 210 and an outer top surface 211 .
- the inner top surface 210 of the edge portion 207 connects with the dome-shaped top surface 209 of the central portion 206 to form a valley-shaped groove.
- the cross-section line 211 c of the outer top surface 211 is a straight line.
- the line 211 c forms an angle ⁇ with the central axis 206 a of the central portion 206 .
- the edge portion 207 is shaped to ensure the angle ⁇ is between 0-45°.
- the line 211 c may be a curved line, where any angle formed by any plane tangent to the outer top surface 211 of the edge portion 207 and the central axis 206 a shall also be between 0-45° to achieve the same ideal light focusing result.
- the cross-section line of the inner top surface 210 may be a straight or curved line as well.
- the bottom part of the base portion 208 is attached onto the molded body 201 to form a sealed chamber 212 to enclose the light-emitting element 204 .
- the sealed chamber 212 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas.
- the molded body 201 is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics. During the molding process, the metal leads 203 are integrated as part of the molded body 201 .
- the lens 202 is molded from silica gel, resin, or epoxy. The manufacturing process of the light-emitting device 200 is discussed below in detail.
- FIG. 4B is a cross-sectional view of an alternative embodiment of the light-emitting device shown in FIG. 4A .
- the light-emitting device 300 has a molded body 301 and a lens 302 .
- the molded body 301 has raised edges that form a concave portion.
- metal leads 303 At the bottom of the concave portion are metal leads 303 , which extend to the outer edges of the molded body 301 , and a plane surface 305 .
- a light-emitting element 304 is mounted onto the plane surface 305 and is wire bonded to the metal leads 303 for receiving electric power.
- the lens 302 includes a central portion 306 , a middle portion 313 surrounding the central portion 306 , and an edge portion 307 surrounding the middle portion 313 , and a base portion 308 supporting the central portion 306 , the middle portion 313 , and the edge portion 307 .
- the central portion 306 is a dome-shaped structure symmetric across its central axis 306 a . It has a dome-shaped top surface 309 .
- the middle portion 313 surrounds the dome-shaped central portion 306 and has an upside-down “v” shaped cross-section.
- the edge portion 307 has an inner top surface 310 and an outer top surface 311 .
- the inner top surface 310 of the edge portion 307 connects with the upside-down “v” shaped top surface of the middle portion 209 to form a valley-shaped groove.
- the cross-section line 311 c of the outer top surface 311 is a straight line.
- the line 311 c forms an angle ⁇ with the central axis 306 a of the central portion 306 .
- the edge portion 307 is shaped to ensure the angle ⁇ is between 0-45°.
- the line 311 c may be a curved line, where any angle formed by any plane tangent to the outer top surface 311 of the edge portion 307 and the central axis 306 a shall also be between 0-45° to achieve the same ideal light focusing result.
- the cross-section line of the inner top surface 310 may be a straight or curved line as well.
- the bottom part of the base portion 308 is attached onto the molded body 301 to form a sealed chamber 312 to enclose the light-emitting element 304 .
- the sealed chamber 312 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas.
- FIG. 4C is a cross-sectional view of an alternative embodiment of the light-emitting device shown in FIG. 4A .
- the light-emitting device 400 is similar to the light-emitting device 300 (shown in FIG. 4B ) except that the lens 402 has a plurality of upside-down “v” shaped middle portions 413 , each surrounding another with the inner-most one surrounding the dome-shaped central portion 409 and the outer-most one being surrounded by the edge portion 407 .
- FIG. 5 is a three-dimensional illustration of another embodiment of a light-emitting device according to the invention.
- FIG. 6 is an exploded view of the embodiment shown in FIG. 5 .
- FIG. 7 is a cross-sectional view of the embodiment shown in FIG. 5 .
- the light-emitting device 500 includes a molded body 501 and a lens 502 . Different from the embodiment shown in FIGS. 2-4 , the molded body 501 is flat and does not have raised edges.
- the molded body 501 has a plane surface 505 and metal leads 503 , which extend to the bottom of the molded body 501 .
- a light-emitting element 504 (e.g., a light-emitting diode) is mounted onto the plane surface 505 and is connected to the metal leads 503 for receiving electric power.
- the lens 502 includes a central portion 506 , an edge portion 507 surrounding the central portion 506 , and a base portion 508 supporting the central portion 506 and the edge portion 507 .
- the central portion 506 is a dome-shaped structure symmetric across its central axis 506 a . It has a dome-shaped top surface 509 .
- the edge portion 507 has an inner top surface 510 and an outer top surface 511 .
- the inner top surface 510 of the edge portion 507 connects with the dome-shaped top surface 509 of the central portion 506 to form a valley-shaped groove.
- the cross-section line 511 c of the outer top surface 511 is a straight line.
- the line 511 c forms an angle ⁇ with the central axis 506 a of the central portion 506 .
- the edge portion 507 is shaped to ensure the angle ⁇ is between 0-45°.
- the line 511 c may be a curved line, where any angle formed by any plane tangent to the outer top surface 511 of the edge portion 507 and central axis 506 a shall also be between 0-45° to achieve the same ideal light focusing result.
- the cross-section line of the inner top surface 510 may be a straight or curved line as well.
- the edge portion 507 has extended leg 5071 .
- the sealed chamber 512 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas.
- the plane surface 205 or 505 described in the above embodiments may have a sunk area for mounting the light-emitting element so that the lens may be made closer to the plane surface.
- This design can help to reduce the overall height of the light-emitting device.
- the sunk area may be created by etching if it is located on a metal lead or by molding if it is located on the molded material.
- FIG. 8 is a two-dimensional illustration of the light focusing effect of an embodiment of a light-emitting device 800 .
- the arrow lines 803 represent light emitted from the light-emitting element 801 .
- the lens 802 is symmetric across the vertical axis 800 a of the light-emitting device 800 and the center of the light-emitting element 801 is positioned on the vertical axis 800 a .
- the lens 802 focuses the light 803 emitted from the light-emitting element 801 symmetrically across the vertical axis 800 a when the light 803 travels from the sealed chamber into the lens 802 and then exits the lens 802 into the air, due to the shape of the lens 802 and the difference in refractive index between the lens and air.
- FIG. 9 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device 900 .
- the lens 902 is shifted horizontally and is no longer symmetrical across the vertical axis 900 a of the light-emitting device 900 .
- light 903 emitted from the light-emitting element 901 is focused but bended with an angle.
- the light-emitting element 901 may be shifted horizontally away from the vertical axis 900 a whereas the lens 902 remain symmetrical across the axis 900 a .
- This design is particularly useful for mobile iris recognition systems (e.g., iris system on a smartphone) where users usually look at the system from an angle.
- mobile iris recognition systems e.g., iris system on a smartphone
- no mechanical tilt of the light source is needed.
- the light-emitting device can be soldered directly on mainboard, bringing cost saving in both materials and manufacturing.
- FIG. 10 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device 1000 .
- the lens 1002 is not symmetric across the vertical axis 1000 a of the light-emitting device 1000 .
- the central portion 1004 and the edge portion 1005 are tilted together with an angle ⁇ towards a direction.
- the light-emitting element 1001 is positioned on the vertical axis 1000 a .
- the light 1003 emitted from the light-emitting element 1001 is focused but bend with an angle ⁇ . Because a lens 1002 may be easily molded from materials such as silica gel, resin, or epoxy, no mechanical tilt of the light source is needed.
- the light-emitting device can be soldered directly on mainboard, bringing cost saving in both materials and manufacturing.
- the light-emitting element 1001 may be positioned off the vertical axis 1000 a with a distance, such as the embodiment described in FIG. 9 , to further enhance the light bending effect.
- FIGS. 11A-B are perspective views illustrating a method for manufacturing the light-emitting devices according to the invention.
- a sheet of molded structure 1101 is provided.
- the sheet of molded structure 1101 includes an array of molded bodies 1103 having metal leads, such as the molded bodies 201 or 501 described above.
- the sheet of molded structure 1101 is formed as an integral structure in an industrial-scale molding process, such as the process described in Ichikawa.
- the sheet of molded structure 1101 may be molded from materials including but not limited to Epoxy Molding Compound, Silicon Molding Compound, and ceramics.
- a light-emitting element such as light-emitting diode
- a sheet of molded structure 1102 including an array of lenses 1104 is provided.
- Each lens 1104 may be formed as any lens embodiment described above.
- the sheet of molded structure 1102 is formed as an integral structure in an industrial-scale molding process.
- the sheet of molded structure 1102 may be molded from materials including but not limited to silica gel, resin, and epoxy.
- adhesives such as epoxy, resin, or silicone, are applied onto the top surface of the sheet of molded structure 1101 and/or the bottom surface of the sheet of molded structure 1102 .
- the two sheets of molded structures are bonded together by, for example, applying pressure and heat.
- small sealed chambers are formed between each individual molded body 1103 and corresponding lens 1104 .
- air may be vacuumed out of the sealed chambers or certain special gas may be injected into the sealed chambers. Alternatively, regular air may be left in the sealed chambers.
- FIG. 11B shows the bonded structure 1105 .
- the bonded structure 1105 is then cut along the x and y axis to create individual light-emitting devices. Because the light-emitting elements are sealed inside the sealed chamber after the bonding process, dusts created by the cutting process cannot get in contact with the light-emitting elements. As such, each sealed chamber provides a clean working environment for the light-emitting element, increasing the life expectancy of the device and production yield.
- FIGS. 12A-B are sectional views of the manufacturing method illustrated in FIGS. 11A-B .
- FIGS. 2-4 is used here to describe the method of manufacturing, other embodiment of lens and/or molded body may also be manufactured through this method, as long as the corresponding sheet of molded structures are provided.
- FIG. 13 is a sectional view of a heat-pressing machine used for the manufacturing method illustrated in FIG. 11A-B and 12 A-B.
- the heat-pressing machine 1300 includes a cover part 1301 and a base part 1302 .
- the cover part 1301 has a cover shell 1303 .
- the base part 1302 has a base shell 1304 .
- Sealing washers 1305 are added between the shells 1303 and 1304 so that the chamber may be sealed securely.
- a vacuum port 1306 is provided on the shell 1303 (or on shell 1304 ) so that air may be vacuumed out of the chamber.
- the cover part 1301 further includes a plurality of heating rods 1308 embedded inside the cover shell 1303 and a pressing pad 1307 .
- the base part 1302 includes a pressing pad 1309 placed on a lifting table 1310 .
- the lifting table 1310 is connected with the bottom of the base shell 1302 via a compression spring 1311 .
- the compression spring 1311 is controlled externally to move the table up or down.
- the lifting table 1310 has a plurality of heating rods 1308 .
- the pressing pad 1309 and the lifting table 1310 may be formed as a single part.
- the sheet of molded body 1101 (described in FIGS. 11A-B and 12 A-B) is placed on the pressing pad 1309 and the sheet of lenses 1102 is secured underneath the pressing pad 1307 . Then, the sheet of lenses 1102 and the sheet of molded body 1101 are accurately aligned and adhesives are applied on the surface of the sheet of molded body 1101 . Then, the cover shell 1103 and the base shell 1104 are coupled together to form a working chamber. At this moment, the two pressing pads 1307 and 1309 have not yet pressed the two molded sheets together. Rather, air is vacuumed out of the chamber, and optionally, dinitrogen, argon, or inert gas may be pumped into the chamber.
- an external command instructs the compression spring 1311 to lift the lifting table 1310 and the pressing pad 1309 up to fully engage with the pressing pad 1307 .
- the sheet of molded body 1101 and the sheet of lenses 1102 are pressed together. Meanwhile, the heating rods 1308 heat up the temperature inside the chamber so speed up the adhesives bonding of the two sheets.
- the bonded structure 1105 is formed and ready for being cut into individual light-emitting devices.
- the light-emitting element used in the present invention may be an IR LED or a LED producing any light wavelength.
- the LED may be a lateral, vertical or flip chip.
- the light-emitting element may be a CSP (chip-scale package) chip, white chip, VCSEL (vertical-cavity surface-emitting laser) chip, or SLED (super luminescent diode) chip.
- the light-emitting element may also be a die array.
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Abstract
A light-emitting device and a method of manufacturing the device are disclosed in this invention. The light-emitting device includes a molded body having metal leads and a plane surface for mounting a light-emitting element. The light-emitting device also includes a lens having one central portion, one edge portion surrounding the central portion, and one base portion supporting the central portion and the edge portion. To produce the device in mass scale, a first sheet of molded structure comprising a plurality of molded bodies having metal leads is provided, then a second sheet of molded structure comprising a plurality of lenses is placed on top of the first sheet of molded structure. The two sheets of molded structures are bonded together with adhesives and by a heat-pressing process to create a bonded structure. Finally, the bonded structure is cut to create individual light emitting devices.
Description
- This invention generally relates to a light emitting device and to a method of manufacturing such a light emitting device.
- Iris biometrics is now considered one of the trilogy of the most important biometrics: face, fingerprint, and iris. The U.S. military is utilizing iris recognition to help prevent terrorism. Several nations around the world are in the process of creating National ID programs that will include all three of these biometrics.
FIG. 1 is a schematic diagram illustrating an iris recognition system. As shown, a typical iris recognition system includes three key components: a light source, a camera unit, and a data processing unit. Natural light often reflects off the iris, creating glare that can obstruct part of the view of the iris. To avoid such glare, the light source generally uses infrared light as illumination, which is invisible to the human eye. The camera unit uses an infrared camera to take a clear and detailed image of the iris and sends the image to the data processing unit for processing and recognition. - Nowadays, iris recognition systems have been made as small standalone devices or incorporated into various consumer electronics, such as mobile phones, tablet computers, personal computers, laptop computers, or webcams. As such, the size of the system needs to be made smaller and smaller. As part of the solution, infrared light-emitting diodes (or IR LEDs) have been widely used for making the light sources. Such an IR LED based light source generally also includes a substrate for mounting the IR LED and a lens for focusing the light emitted by the IR LED.
- IR LED based light sources for iris recognition systems are currently available on the market. But they are expensive and difficult to make. Their manufacturing process requires cutting a sheet of substrate into individual substrates, mounting a LED onto each substrate, bonding a supporting structure with each substrate, and bonding a lens with the supporting structure. The supporting structures and the lenses are separately molded and cut into individual pieces before bonding with each substrate. Such manufacturing process is complicated and difficult to scale for mass production.
- U.S. Pat. No. 8,530,250 to Ichikawa et al. (“Ichikawa”) discloses a method for mass producing LED devices having resin packages. According to the disclosed method, a thermosetting resin is molded together with a lead frame to create a resin-molded body, LEDs are installed inside the concave portions of the resin-molded body and are sealed by a sealing member (e.g., epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin and urethane resin of a thermosetting resin), and the resin-molded body are cut into individual LED devices. However, such LED devices do not have light focusing lenses and therefore cannot be used as light sources for iris recognition systems. Furthermore, the disclosed device's LED is already covered by a sealing member made from epoxy resin or similar polymer material, lenses made from such materials won't be effective in focusing light emitted from the LED.
- In one embodiment of the present invention, a light-emitting device is provided. The light-emitting device includes a molded body having metal leads and a plane surface for mounting a light-emitting element. The light-emitting device also includes a lens having one central portion, one edge portion surrounding the central portion, and one base portion supporting the central portion and the edge portion. The central portion has a dome-shaped top surface. The edge portion has one inner top surface and one outer top surface, and the inner top surface of the edge portion connects with the dome-shaped top surface of the central portion to form a valley-shaped groove. The base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element. The cross-sectional line of the outer top surface may be a straight or curved line, and in either case, any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
- In one embodiment, the sealed chamber is a vacuum chamber or contains air or special gas (e.g., dinitrogen, argon, inert gas). The sealed chamber has a different optical refractive index from the surrounding materials and is necessary to obtain the desired beam angle. It also helps to protect the light-emitting elements from being contaminated by dusts created during the cutting process of mass production. The light-emitting element used in the present invention may be an IR (infrared) LED or a LED producing any light wavelength. The light-emitting element may be a lateral, vertical or flip chip. Also, the light-emitting element may be a CSP (chip-scale package) chip, white chip, VCSEL (vertical-cavity surface-emitting laser) chip, or SLED (super luminescent diode) chip. Alternatively, the light-emitting element may also be a die array.
- In addition, a method of manufacturing the light-emitting device is provided. The method includes providing a first sheet of molded structure comprising a plurality of molded bodies having metal leads; placing a second sheet of molded structure comprising a plurality of lenses on top of the first sheet of molded structure; bonding the first sheet of molded structure with the second sheet of molded structure to create a bonded structure so that each molded body forms a sealed chamber with a corresponding lens to enclose a light-emitting element; and cutting the bonded structure to create light emitting devices. As discussed above, the sealed chambers help to protect the light-emitting elements from being contaminated by dusts created during the cutting process.
- The subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features and also the advantages of the invention will be apparent from the following detailed description taken in conjunction with the accompanying drawings.
-
FIG. 1 is a schematic diagram illustrating an iris recognition system. -
FIG. 2 is a three-dimensional illustration of an embodiment of a light-emitting device according to the invention. -
FIG. 3 is an exploded view of the embodiment shown inFIG. 2 . -
FIG. 4A is a cross-sectional view of the embodiment shown inFIG. 2 . -
FIGS. 4B is a cross-sectional view of an alternative embodiment of the light-emitting device shown inFIG. 4A . -
FIGS. 4C is a cross-sectional view of an alternative embodiment of the light-emitting device shown inFIG. 4A . -
FIG. 5 is a three-dimensional illustration of another embodiment of a light-emitting device according to the invention. -
FIG. 6 is an exploded view of the embodiment shown inFIG. 5 . -
FIG. 7 is a cross-sectional view of the embodiment shown inFIG. 5 . -
FIG. 8 is a two-dimensional illustration of the light focusing effect of an embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity. -
FIG. 9 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity. -
FIG. 10 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emitting device, where only the lens and the light-emitting element are shown for simplicity. -
FIGS. 11A-B are perspective views illustrating a method for manufacturing the light-emitting devices according to the invention. -
FIGS. 12A-B are sectional views of the manufacturing method illustrated inFIGS. 11A-B . -
FIG. 13 is a sectional view of using a heat-pressing machine for the manufacturing method illustrated inFIG. 11A-B and 12A-B. -
FIG. 2 is a three-dimensional illustration of an embodiment of a light-emitting device according to the invention.FIG. 3 is an exploded view of the embodiment shown inFIG. 2 .FIG. 4A is a cross-sectional view of the embodiment shown inFIG. 2 . As shown in these figures, the light-emittingdevice 200 includes a moldedbody 201 and alens 202. The moldedbody 201 has raised edges that form a concave portion. At the bottom of the concave portion are metal leads 203, which extend to the outer edges of the moldedbody 201, and aplane surface 205. A light-emitting element 204 (e.g., a light-emitting diode) is mounted onto theplane surface 205 and is wire bonded to the metal leads 203 for receiving electric power. - The
lens 202 includes acentral portion 206, anedge portion 207 surrounding thecentral portion 206, and abase portion 208 supporting thecentral portion 206 and theedge portion 207. Thecentral portion 206 is a dome-shaped structure symmetric across itscentral axis 206 a. It has a dome-shapedtop surface 209. Theedge portion 207 has an innertop surface 210 and an outertop surface 211. The innertop surface 210 of theedge portion 207 connects with the dome-shapedtop surface 209 of thecentral portion 206 to form a valley-shaped groove. In one embodiment, thecross-section line 211 c of the outertop surface 211 is a straight line. Theline 211 c forms an angle θ with thecentral axis 206 a of thecentral portion 206. To achieve an ideal result of focusing the light emitted from the light-emittingelement 204, theedge portion 207 is shaped to ensure the angle θ is between 0-45°. In another embodiment, theline 211 c may be a curved line, where any angle formed by any plane tangent to the outertop surface 211 of theedge portion 207 and thecentral axis 206 a shall also be between 0-45° to achieve the same ideal light focusing result. Similarly, the cross-section line of the innertop surface 210 may be a straight or curved line as well. - In addition, the bottom part of the
base portion 208 is attached onto the moldedbody 201 to form a sealedchamber 212 to enclose the light-emittingelement 204. The sealedchamber 212 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas. - In one embodiment, the molded
body 201 is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics. During the molding process, the metal leads 203 are integrated as part of the moldedbody 201. Thelens 202 is molded from silica gel, resin, or epoxy. The manufacturing process of the light-emittingdevice 200 is discussed below in detail. -
FIG. 4B is a cross-sectional view of an alternative embodiment of the light-emitting device shown inFIG. 4A . Like the embodiment shown inFIG. 4A , the light-emittingdevice 300 has a moldedbody 301 and alens 302. The moldedbody 301 has raised edges that form a concave portion. At the bottom of the concave portion are metal leads 303, which extend to the outer edges of the moldedbody 301, and aplane surface 305. A light-emittingelement 304 is mounted onto theplane surface 305 and is wire bonded to the metal leads 303 for receiving electric power. - The
lens 302 includes acentral portion 306, amiddle portion 313 surrounding thecentral portion 306, and anedge portion 307 surrounding themiddle portion 313, and abase portion 308 supporting thecentral portion 306, themiddle portion 313, and theedge portion 307. Thecentral portion 306 is a dome-shaped structure symmetric across itscentral axis 306 a. It has a dome-shapedtop surface 309. Themiddle portion 313 surrounds the dome-shapedcentral portion 306 and has an upside-down “v” shaped cross-section. Theedge portion 307 has an innertop surface 310 and an outertop surface 311. The innertop surface 310 of theedge portion 307 connects with the upside-down “v” shaped top surface of themiddle portion 209 to form a valley-shaped groove. In one embodiment, thecross-section line 311 c of the outertop surface 311 is a straight line. Theline 311 c forms an angle θ with thecentral axis 306 a of thecentral portion 306. To achieve an ideal result of focusing the light emitted from the light-emittingelement 304, theedge portion 307 is shaped to ensure the angle θ is between 0-45°. In another embodiment, theline 311 c may be a curved line, where any angle formed by any plane tangent to the outertop surface 311 of theedge portion 307 and thecentral axis 306 a shall also be between 0-45° to achieve the same ideal light focusing result. Similarly, the cross-section line of the innertop surface 310 may be a straight or curved line as well. - In addition, the bottom part of the
base portion 308 is attached onto the moldedbody 301 to form a sealedchamber 312 to enclose the light-emittingelement 304. The sealedchamber 312 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas. -
FIG. 4C is a cross-sectional view of an alternative embodiment of the light-emitting device shown inFIG. 4A . The light-emittingdevice 400 is similar to the light-emitting device 300 (shown inFIG. 4B ) except that thelens 402 has a plurality of upside-down “v” shapedmiddle portions 413, each surrounding another with the inner-most one surrounding the dome-shapedcentral portion 409 and the outer-most one being surrounded by theedge portion 407. -
FIG. 5 is a three-dimensional illustration of another embodiment of a light-emitting device according to the invention.FIG. 6 is an exploded view of the embodiment shown inFIG. 5 .FIG. 7 is a cross-sectional view of the embodiment shown inFIG. 5 . As shown in these figures, the light-emittingdevice 500 includes a moldedbody 501 and alens 502. Different from the embodiment shown inFIGS. 2-4 , the moldedbody 501 is flat and does not have raised edges. The moldedbody 501 has aplane surface 505 and metal leads 503, which extend to the bottom of the moldedbody 501. A light-emitting element 504 (e.g., a light-emitting diode) is mounted onto theplane surface 505 and is connected to the metal leads 503 for receiving electric power. - The
lens 502 includes acentral portion 506, anedge portion 507 surrounding thecentral portion 506, and abase portion 508 supporting thecentral portion 506 and theedge portion 507. Thecentral portion 506 is a dome-shaped structure symmetric across itscentral axis 506 a. It has a dome-shapedtop surface 509. Theedge portion 507 has an innertop surface 510 and an outertop surface 511. The innertop surface 510 of theedge portion 507 connects with the dome-shapedtop surface 509 of thecentral portion 506 to form a valley-shaped groove. In one embodiment, thecross-section line 511 c of the outertop surface 511 is a straight line. Theline 511 c forms an angle θ with thecentral axis 506 a of thecentral portion 506. To achieve an ideal result of focusing the light emitted from the light-emittingelement 504, theedge portion 507 is shaped to ensure the angle θ is between 0-45°. In another embodiment, theline 511 c may be a curved line, where any angle formed by any plane tangent to the outertop surface 511 of theedge portion 507 andcentral axis 506 a shall also be between 0-45° to achieve the same ideal light focusing result. Similarly, the cross-section line of the innertop surface 510 may be a straight or curved line as well. - In this embodiment, the
edge portion 507 has extendedleg 5071. When thebase portion 508 is attached onto the moldedbody 501, theextended leg 5071, thecentral portion 506, and thebase portion 508 form a sealedchamber 512 to enclose the light-emittingelement 504. The sealedchamber 512 may be a vacuum chamber or contains air, dinitrogen, argon, or certain special gases such as inert gas. - Although not shown in the figures, the
plane surface -
FIG. 8 is a two-dimensional illustration of the light focusing effect of an embodiment of a light-emittingdevice 800. The arrow lines 803 represent light emitted from the light-emittingelement 801. In this embodiment, thelens 802 is symmetric across thevertical axis 800 a of the light-emittingdevice 800 and the center of the light-emittingelement 801 is positioned on thevertical axis 800 a. As shown, thelens 802 focuses the light 803 emitted from the light-emittingelement 801 symmetrically across thevertical axis 800 a when the light 803 travels from the sealed chamber into thelens 802 and then exits thelens 802 into the air, due to the shape of thelens 802 and the difference in refractive index between the lens and air. -
FIG. 9 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emittingdevice 900. As shown, thelens 902 is shifted horizontally and is no longer symmetrical across thevertical axis 900 a of the light-emittingdevice 900. As such, light 903 emitted from the light-emittingelement 901 is focused but bended with an angle. Vice versa, although not shown, the light-emittingelement 901 may be shifted horizontally away from thevertical axis 900 a whereas thelens 902 remain symmetrical across theaxis 900 a. This design is particularly useful for mobile iris recognition systems (e.g., iris system on a smartphone) where users usually look at the system from an angle. With this build-in tilt emission, no mechanical tilt of the light source is needed. As such, the light-emitting device can be soldered directly on mainboard, bringing cost saving in both materials and manufacturing. -
FIG. 10 is a two-dimensional illustration of the light focusing effect of another embodiment of a light-emittingdevice 1000. Different from the embodiments shown inFIGS. 9 and 10 , thelens 1002 is not symmetric across thevertical axis 1000 a of the light-emittingdevice 1000. In this embodiment, thecentral portion 1004 and theedge portion 1005 are tilted together with an angle β towards a direction. The light-emittingelement 1001 is positioned on thevertical axis 1000 a. As shown, the light 1003 emitted from the light-emittingelement 1001 is focused but bend with an angle α. Because alens 1002 may be easily molded from materials such as silica gel, resin, or epoxy, no mechanical tilt of the light source is needed. The light-emitting device can be soldered directly on mainboard, bringing cost saving in both materials and manufacturing. Of course, the light-emittingelement 1001 may be positioned off thevertical axis 1000 a with a distance, such as the embodiment described inFIG. 9 , to further enhance the light bending effect. -
FIGS. 11A-B are perspective views illustrating a method for manufacturing the light-emitting devices according to the invention. As shown, during the manufacturing process, a sheet of moldedstructure 1101 is provided. The sheet of moldedstructure 1101 includes an array of moldedbodies 1103 having metal leads, such as the moldedbodies structure 1101 is formed as an integral structure in an industrial-scale molding process, such as the process described in Ichikawa. The sheet of moldedstructure 1101 may be molded from materials including but not limited to Epoxy Molding Compound, Silicon Molding Compound, and ceramics. Then, a light-emitting element, such as light-emitting diode, is mounted onto each moldedbody 1103 and wire bonded to the corresponding metal leads. Then, a sheet of moldedstructure 1102 including an array oflenses 1104 is provided. Eachlens 1104 may be formed as any lens embodiment described above. Like the sheet of moldedstructure 1101, the sheet of moldedstructure 1102 is formed as an integral structure in an industrial-scale molding process. The sheet of moldedstructure 1102 may be molded from materials including but not limited to silica gel, resin, and epoxy. Then, adhesives, such as epoxy, resin, or silicone, are applied onto the top surface of the sheet of moldedstructure 1101 and/or the bottom surface of the sheet of moldedstructure 1102. The two sheets of molded structures are bonded together by, for example, applying pressure and heat. After the bonding process, small sealed chambers are formed between each individual moldedbody 1103 andcorresponding lens 1104. During the bonding process, air may be vacuumed out of the sealed chambers or certain special gas may be injected into the sealed chambers. Alternatively, regular air may be left in the sealed chambers. -
FIG. 11B shows the bondedstructure 1105. The bondedstructure 1105 is then cut along the x and y axis to create individual light-emitting devices. Because the light-emitting elements are sealed inside the sealed chamber after the bonding process, dusts created by the cutting process cannot get in contact with the light-emitting elements. As such, each sealed chamber provides a clean working environment for the light-emitting element, increasing the life expectancy of the device and production yield. -
FIGS. 12A-B are sectional views of the manufacturing method illustrated inFIGS. 11A-B . Although the embodiment illustrated inFIGS. 2-4 is used here to describe the method of manufacturing, other embodiment of lens and/or molded body may also be manufactured through this method, as long as the corresponding sheet of molded structures are provided. -
FIG. 13 is a sectional view of a heat-pressing machine used for the manufacturing method illustrated inFIG. 11A-B and 12A-B. As shown, the heat-pressingmachine 1300 includes acover part 1301 and abase part 1302. Thecover part 1301 has acover shell 1303. Thebase part 1302 has abase shell 1304. When the twoshells Sealing washers 1305 are added between theshells vacuum port 1306 is provided on the shell 1303 (or on shell 1304) so that air may be vacuumed out of the chamber. In addition, other gas (e.g., dinitrogen, argon, inert gas) may be injected into the chamber after air is vacuumed. Thecover part 1301 further includes a plurality ofheating rods 1308 embedded inside thecover shell 1303 and apressing pad 1307. Thebase part 1302 includes apressing pad 1309 placed on a lifting table 1310. The lifting table 1310 is connected with the bottom of thebase shell 1302 via acompression spring 1311. Thecompression spring 1311 is controlled externally to move the table up or down. The lifting table 1310 has a plurality ofheating rods 1308. Alternatively, thepressing pad 1309 and the lifting table 1310 may be formed as a single part. - During manufacture, the sheet of molded body 1101 (described in
FIGS. 11A-B and 12A-B) is placed on thepressing pad 1309 and the sheet oflenses 1102 is secured underneath thepressing pad 1307. Then, the sheet oflenses 1102 and the sheet of moldedbody 1101 are accurately aligned and adhesives are applied on the surface of the sheet of moldedbody 1101. Then, thecover shell 1103 and thebase shell 1104 are coupled together to form a working chamber. At this moment, the twopressing pads compression spring 1311 to lift the lifting table 1310 and thepressing pad 1309 up to fully engage with thepressing pad 1307. The sheet of moldedbody 1101 and the sheet oflenses 1102 are pressed together. Meanwhile, theheating rods 1308 heat up the temperature inside the chamber so speed up the adhesives bonding of the two sheets. Thus, the bondedstructure 1105 is formed and ready for being cut into individual light-emitting devices. - It should be noted that the light-emitting element used in the present invention may be an IR LED or a LED producing any light wavelength. The LED may be a lateral, vertical or flip chip. Also, the light-emitting element may be a CSP (chip-scale package) chip, white chip, VCSEL (vertical-cavity surface-emitting laser) chip, or SLED (super luminescent diode) chip. Alternatively, the light-emitting element may also be a die array.
- Although specific embodiments of the invention have been disclosed, those having ordinary skill in the art will understand that changes can be made to the specific embodiments without departing from the spirit and scope of the invention. The scope of the invention is not to be restricted, therefore, to the specific embodiments. Furthermore, it is intended that the appended claims cover any and all such applications, modifications, and embodiments within the scope of the present invention.
Claims (20)
1. A method of manufacturing light emitting devices, the method comprising:
providing a first sheet of molded structure comprising a plurality of molded bodies having metal leads;
placing a second sheet of molded structure comprising a plurality of lenses on top of the first sheet of molded structure;
bonding the first sheet of molded structure with the second sheet of molded structure to create a bonded structure so that each molded body forms a sealed chamber with a corresponding lens to enclose a light-emitting element; and
cutting the bonded structure to create light emitting devices.
2. The method of claim 1 , wherein the bonding step comprises:
applying adhesives between the first sheet of molded structure and the second sheet of molded structure;
removing air between the first sheet of molded structure and the second sheet of molded structure; and
applying heat and pressure to create the bonded structure with sealed chambers.
3. The method of claim 1 further comprising mounting at least one light-emitting element onto each molded body before the placing step.
4. The method of claim 1 , wherein the first sheet of molded structure is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics.
5. The method of claim 1 , wherein the second sheet of molded structure is molded from silica gel, resin, or epoxy.
6. The method of claim 1 , wherein each sealed chamber is formed by a molded body and a plurality of corresponding lenses.
7. The method of claim 1 , wherein each created light emitting device has a sealed chamber.
8. A light emitting device, comprising:
a molded body having metal leads and a plane surface for mounting a light-emitting element; and
a lens having a central portion, an edge portion surrounding the central portion, and a base portion supporting the central portion and the edge portion, wherein the central portion has a dome-shaped top surface, the edge portion has an inner top surface and an outer top surface, the inner top surface of the edge portion connects with the dome-shaped top surface of the central portion to form a valley-shaped groove, the base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element, and any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
9. The light emitting device of claim 8 , wherein the molded body has raised edges for bonding with the base portion of the lens to create the sealed chamber.
10. The light emitting device of claim 8 , wherein the edge portion of the lens has extended leg.
11. The light emitting device of claim 8 , wherein the molded body is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics.
12. The light emitting device of claim 8 , wherein the lens is molded from silica gel, resin, or epoxy.
13. The light emitting device of claim 8 , wherein the sealed chamber is a vacuum chamber or contains one of air, dinitrogen, and inert gas.
14. The light emitting device of claim 8 , wherein the light-emitting element comprises an infrared light emitting diode, a regular light-emitting diode, a die array, a chip-scale package chip, a white chip, a vertical-cavity surface-emitting laser chip, or a super luminescent diode chip.
15. The light emitting device of claim 8 , wherein the lens and the light-emitting element are both positioned symmetric across a vertical axis of the light-emitting device.
16. The light emitting device of claim 8 , wherein the lens is positioned symmetric across a vertical axis of the light-emitting device whereas the light-emitting element is positioned off the vertical axis.
17. The light emitting device of claim 8 , wherein the lens is positioned off a vertical axis of the light-emitting device whereas the light-emitting element is positioned symmetric across the vertical axis.
18. The light emitting device of claim 8 , wherein the central portion and the edge portion of the lens are formed to tilt with an angle.
19. A light emitting device, comprising:
a molded body having metal leads and a plane surface for mounting a light-emitting element; and
a lens having a central portion, one or more middle portions surrounding the central portion, an edge portion surrounding the one or more middle portions, and a base portion supporting the central portion, the one or more middle portions, and the edge portion, wherein the central portion has a dome-shaped top surface, each middle portion has a upside-down “v” shaped top surface, the edge portion has an inner top surface and an outer top surface, the inner top surface of the edge portion connects with the top surface of the outer-most middle portion to form a valley-shaped groove, the base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element, and any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
20. The light emitting device of claim 19 , wherein the sealed chamber is a vacuum chamber or contains one of air, dinitrogen, and inert gas.
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US16/185,726 US10622526B2 (en) | 2017-05-07 | 2018-11-09 | Light emitting device and method for manufacturing light emitting device |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10622511B2 (en) * | 2017-11-03 | 2020-04-14 | Innotec, Corp. | Illuminated optical device |
US20210102683A1 (en) * | 2018-08-31 | 2021-04-08 | Nichia Corporation | Lens and light emitting device |
US20210384390A1 (en) * | 2020-06-04 | 2021-12-09 | Shenzhen Raysees AI Technology Co., Ltd. | Semiconductor Light Source Device of Optical Integrated Packaging |
CN116598410A (en) * | 2023-06-29 | 2023-08-15 | 惠州市弘正光电有限公司 | LED light source, LED display screen and preparation process |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112825414A (en) * | 2019-11-20 | 2021-05-21 | 瑞识科技(深圳)有限公司 | VCSEL laser device and manufacturing method thereof |
KR20220045832A (en) | 2020-10-06 | 2022-04-13 | 삼성전자주식회사 | Led package and electronic device including the same |
KR20220073301A (en) | 2020-11-26 | 2022-06-03 | 삼성전자주식회사 | Led package and electronic device including the same |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4070105A (en) * | 1976-03-05 | 1978-01-24 | Marzouk Youssef Marzouk | Laminar fresnel reduced ophthalmic lens construction |
US4787722A (en) * | 1986-04-10 | 1988-11-29 | Fresnel Technologies, Inc. | Fresnel lens with aspiteric grooves |
US4815084A (en) * | 1987-05-20 | 1989-03-21 | Spectra Diode Laboratories, Inc. | Semiconductor laser with integrated optical elements |
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
DE19610881B4 (en) * | 1995-12-07 | 2008-01-10 | Limo Patentverwaltung Gmbh & Co. Kg | Microsystem module |
US5894195A (en) * | 1996-05-03 | 1999-04-13 | Mcdermott; Kevin | Elliptical axial lighting device |
US5924942A (en) * | 1997-10-06 | 1999-07-20 | Gentile; Robert | Game ball |
JP3061779B2 (en) * | 1998-10-12 | 2000-07-10 | 協和電機化学株式会社 | Fresnel lens for enlarged observation of display screen |
DE10019665A1 (en) * | 2000-04-19 | 2001-10-31 | Osram Opto Semiconductors Gmbh | Luminescent diode chip and method for its production |
US20020085390A1 (en) * | 2000-07-14 | 2002-07-04 | Hironobu Kiyomoto | Optical device and apparatus employing the same |
US6987613B2 (en) * | 2001-03-30 | 2006-01-17 | Lumileds Lighting U.S., Llc | Forming an optical element on the surface of a light emitting device for improved light extraction |
US6730940B1 (en) * | 2002-10-29 | 2004-05-04 | Lumileds Lighting U.S., Llc | Enhanced brightness light emitting device spot emitter |
JP4293857B2 (en) * | 2003-07-29 | 2009-07-08 | シチズン電子株式会社 | Lighting device using Fresnel lens |
TWI303110B (en) * | 2003-11-25 | 2008-11-11 | Matsushita Electric Works Ltd | Light-emitting device using light-emitting diode chip |
US7473013B2 (en) * | 2003-12-10 | 2009-01-06 | Okaya Electric Industries Co., Ltd. | Indicator lamp having a converging lens |
JP5128047B2 (en) * | 2004-10-07 | 2013-01-23 | Towa株式会社 | Optical device and optical device production method |
US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
KR100580753B1 (en) * | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | Light emitting device package |
JP5490407B2 (en) * | 2005-03-14 | 2014-05-14 | コーニンクレッカ フィリップス エヌ ヴェ | Phosphor having a polycrystalline ceramic structure, and light emitting device having the phosphor |
KR100631992B1 (en) * | 2005-07-19 | 2006-10-09 | 삼성전기주식회사 | Light emitting diode package having dual lens structure for laterally emitting light |
TWI371871B (en) * | 2006-12-29 | 2012-09-01 | Ind Tech Res Inst | A led chip with micro lens |
CN1941365A (en) * | 2005-09-29 | 2007-04-04 | 鸿富锦精密工业(深圳)有限公司 | Light-emitting diodes and light-source device |
JP4993434B2 (en) * | 2005-11-18 | 2012-08-08 | スタンレー電気株式会社 | White LED lighting device |
JP2007140179A (en) * | 2005-11-18 | 2007-06-07 | Seiko Epson Corp | Optical module and method of manufacturing same |
US20070170449A1 (en) * | 2006-01-24 | 2007-07-26 | Munisamy Anandan | Color sensor integrated light emitting diode for LED backlight |
US7816697B1 (en) * | 2006-02-24 | 2010-10-19 | Cypress Semiconductor Corporation | System and method for mounting an optical component to an integrated circuit package |
EP1995794A4 (en) * | 2006-03-10 | 2011-08-31 | Panasonic Elec Works Co Ltd | Light-emitting device |
JP2007252249A (en) * | 2006-03-22 | 2007-10-04 | Oki Electric Ind Co Ltd | Apparatus for synthesizing organic compound, light irradiation apparatus, substrate for synthesizing organic compound and method for synthesizing organic compound |
CN101150160A (en) * | 2006-09-22 | 2008-03-26 | 鸿富锦精密工业(深圳)有限公司 | LED and its making method |
KR100770424B1 (en) * | 2006-12-13 | 2007-10-26 | 삼성전기주식회사 | Light emitting diode package and manufacturing method thereof |
US8410500B2 (en) * | 2006-12-21 | 2013-04-02 | Koninklijke Philips Electronics N.V. | Light-emitting apparatus with shaped wavelength converter |
CN201025617Y (en) * | 2007-03-06 | 2008-02-20 | 亿光电子工业股份有限公司 | Lighting device |
TW200913238A (en) * | 2007-06-04 | 2009-03-16 | Sony Corp | Optical member, solid state imaging apparatus, and manufacturing method |
CN101711434B (en) * | 2007-06-25 | 2012-03-21 | 新灯源科技有限公司 | Led lighting device |
GB0717802D0 (en) * | 2007-09-12 | 2007-10-24 | Photonstar Led Ltd | Electrically isolated vertical light emitting diode structure |
DE112008002540B4 (en) * | 2007-09-28 | 2024-02-08 | Seoul Semiconductor Co., Ltd. | LED housing and backlight unit using the same |
JP4967986B2 (en) * | 2007-10-24 | 2012-07-04 | 三菱電機株式会社 | Fresnel lens sheet, transmissive screen, and projection display |
TWI362766B (en) * | 2007-12-03 | 2012-04-21 | Lite On Technology Corp | Optoelectronic semiconductor component capable of emitting light concentratively |
JP5211667B2 (en) * | 2007-12-07 | 2013-06-12 | ソニー株式会社 | Lighting device and display device |
EP2891918A1 (en) * | 2008-02-29 | 2015-07-08 | Global Bionic Optics Pty Ltd. | Single-lens extended depth-of-field imaging systems |
TWI458119B (en) * | 2008-05-05 | 2014-10-21 | Univ Nat Central | Light mixing apparatus of light emitting diode |
TWI361261B (en) * | 2008-06-30 | 2012-04-01 | E Pin Optical Industry Co Ltd | Aspherical led angular lens for wide distribution patterns and led assembly using the same |
US7728399B2 (en) * | 2008-07-22 | 2010-06-01 | National Semiconductor Corporation | Molded optical package with fiber coupling feature |
CN101737709A (en) * | 2008-11-26 | 2010-06-16 | 刘如松 | Special-shaped light distribution curve light-emitting diode |
CN101769499A (en) * | 2009-01-05 | 2010-07-07 | 富准精密工业(深圳)有限公司 | Light emitting diode unit |
CN101510581B (en) * | 2009-03-19 | 2011-06-29 | 旭丽电子(广州)有限公司 | LED and relevant backlight module |
US8351219B2 (en) * | 2009-09-03 | 2013-01-08 | Visera Technologies Company Limited | Electronic assembly for an image sensing device |
US20110062469A1 (en) * | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Molded lens incorporating a window element |
US8330342B2 (en) * | 2009-12-21 | 2012-12-11 | Malek Bhairi | Spherical light output LED lens and heat sink stem system |
JP2012018306A (en) * | 2010-07-08 | 2012-01-26 | Sony Corp | Display device |
DE102010027326B4 (en) * | 2010-07-16 | 2020-08-13 | Ledlenser GmbH & Co. KG | Pocket lamp with rotationally symmetrical lens |
US10359545B2 (en) * | 2010-10-21 | 2019-07-23 | Lockheed Martin Corporation | Fresnel lens with reduced draft facet visibility |
JP2012129235A (en) * | 2010-12-13 | 2012-07-05 | Toshiba Corp | Optical device |
JP2012142426A (en) * | 2010-12-28 | 2012-07-26 | Toshiba Corp | Led package and method for manufacturing the same |
US8742655B2 (en) * | 2011-07-22 | 2014-06-03 | Guardian Industries Corp. | LED lighting systems with phosphor subassemblies, and/or methods of making the same |
GB2495323B (en) * | 2011-10-07 | 2018-05-30 | Irisguard Inc | Improvements for iris recognition systems |
DE102011084881A1 (en) * | 2011-10-20 | 2013-04-25 | Osram Gmbh | Semiconductor lighting device with a lens with Lichtablenkungsstruktur |
CN103322503B (en) * | 2012-03-19 | 2016-09-07 | 展晶科技(深圳)有限公司 | Optical lens and the light-emitting diode lamp source device of this optical lens of use |
JP6165234B2 (en) * | 2012-04-25 | 2017-07-19 | フィリップス ライティング ホールディング ビー ヴィ | Color correction optical element |
TWI565096B (en) * | 2012-12-24 | 2017-01-01 | 鴻海精密工業股份有限公司 | Led die and method for manufacturing the led die, led automobile lamp |
KR102050472B1 (en) * | 2013-01-22 | 2020-01-09 | 삼성전자주식회사 | Lens for controlling illuminance distribution, and LED(Light Emitting Diode) Package comprising the same Lens |
KR20150119179A (en) * | 2013-02-11 | 2015-10-23 | 코닌클리케 필립스 엔.브이. | Led module with hermetic seal of wavelength conversion material |
DE102013101532B4 (en) * | 2013-02-15 | 2017-12-28 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor device |
JP2014160772A (en) * | 2013-02-20 | 2014-09-04 | Toshiba Lighting & Technology Corp | Light-emitting device and light device |
US9784430B2 (en) * | 2013-06-07 | 2017-10-10 | Philips Lighting Holding B.V. | Lens and lighting device |
JP6273124B2 (en) * | 2013-11-08 | 2018-01-31 | シチズン電子株式会社 | LED lighting device |
US9911907B2 (en) * | 2014-07-28 | 2018-03-06 | Epistar Corporation | Light-emitting apparatus |
CN108700731B (en) * | 2016-02-17 | 2021-04-13 | Lg 伊诺特有限公司 | Optical lens and lamp unit having the same |
US9760775B1 (en) * | 2016-05-26 | 2017-09-12 | Wu-Hsu Lin | Retina identifying module |
-
2017
- 2017-05-07 US US15/588,688 patent/US20180323354A1/en not_active Abandoned
-
2018
- 2018-05-05 CN CN201810422797.2A patent/CN108922951B/en active Active
- 2018-11-09 US US16/185,726 patent/US10622526B2/en active Active
Non-Patent Citations (8)
Title |
---|
Amano 5 and 7-14 US pat pub no 2008/0180639 * |
Ashida US pat pub no 2006/0078246 * |
Hayafuji Figures 10A-10C US pat pub no 2003/0205333 * |
Ito US pat pub no 2011/0309398 * |
Konishi US pat pub no 5,635,115 * |
Kwon US pat pub no 2014/0339581 * |
Shimizu Figures 9A-9C US pat pub no 2015/0371975 * |
US pat pub no 2012/0161180 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10622511B2 (en) * | 2017-11-03 | 2020-04-14 | Innotec, Corp. | Illuminated optical device |
US20210102683A1 (en) * | 2018-08-31 | 2021-04-08 | Nichia Corporation | Lens and light emitting device |
US11788708B2 (en) * | 2018-08-31 | 2023-10-17 | Nichia Corporation | Lens and light emitting device |
US20210384390A1 (en) * | 2020-06-04 | 2021-12-09 | Shenzhen Raysees AI Technology Co., Ltd. | Semiconductor Light Source Device of Optical Integrated Packaging |
CN116598410A (en) * | 2023-06-29 | 2023-08-15 | 惠州市弘正光电有限公司 | LED light source, LED display screen and preparation process |
Also Published As
Publication number | Publication date |
---|---|
CN108922951B (en) | 2022-09-20 |
CN108922951A (en) | 2018-11-30 |
US20190148607A1 (en) | 2019-05-16 |
US10622526B2 (en) | 2020-04-14 |
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