US20170263566A1 - Method for making a shielded integrated circuit (ic) package with an electrically conductive polymer layer - Google Patents
Method for making a shielded integrated circuit (ic) package with an electrically conductive polymer layer Download PDFInfo
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- US20170263566A1 US20170263566A1 US15/068,752 US201615068752A US2017263566A1 US 20170263566 A1 US20170263566 A1 US 20170263566A1 US 201615068752 A US201615068752 A US 201615068752A US 2017263566 A1 US2017263566 A1 US 2017263566A1
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- electrically conductive
- packages
- conductive polymer
- polymer layer
- adjacent
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 229920001940 conductive polymer Polymers 0.000 title claims description 64
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011343 solid material Substances 0.000 claims description 21
- 239000007779 soft material Substances 0.000 claims description 15
- 239000011231 conductive filler Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims 4
- 238000005137 deposition process Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 41
- 238000013459 approach Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Definitions
- the present invention refers to the field of integrated circuit (IC) packages, and more particularly, to electrically shielding an IC package.
- IC integrated circuit
- electromagnetic interference may be received from, or transmitted to, the environment.
- One approach for shielding an IC package from electromagnetic interference is to cover the IC package with a grounded metal enclosure typically called a can.
- a grounded metal enclosure typically called a can.
- this approach may be costly and lacks design flexibility.
- the metal can adds weight and adds significant size to the IC package footprint.
- PVD physical vapor deposition
- a method for making a plurality of integrated circuit (IC) packages includes providing a plurality of spaced apart IC dies carried by a substrate and covered by a common encapsulating material, and cutting through the common encapsulating material between adjacent IC dies to define a plurality of spaced apart IC packages carried by the substrate.
- the substrate may be exposed after cutting the encapsulating material between adjacent IC dies.
- An electrically conductive polymer layer may be positioned over the plurality of spaced apart IC packages and over the spaces between adjacent IC packages, with the electrically conductive polymer layer being a solid material carried by a film. Pressure and heat may be applied to the electrically conductive polymer layer so that the solid material transforms to a soft material so as to flow over the plurality of spaced apart IC packages and filling the spaces between adjacent IC packages.
- the electrically conductive polymer layer may be cooled from the soft material back to the solid material providing an electrically conductive layer.
- the film may then be removed from the electrically conductive layer.
- the method further includes cutting through the electrically conductive layer between adjacent IC packages and through the substrate to form the plurality of shielded IC packages.
- the electrically conductive layer may be on an upper surface and sidewalls of each IC package.
- the electrically conductive polymer layer may comprise a non-conductive polymer with conductive fillers mixed therein.
- the non-conductive polymer may be thermosetting.
- a thickness of the electrically conductive layer may be within a range of 5-15 microns, for example.
- Use of the electrically conductive polymer layer advantageously allows the thickness of the electrically conductive layer to be controlled so that a uniform thickness is provided.
- Use of the electrically conductive polymer layer also advantageously provides a shielded IC package in a relatively straightforward manner.
- FIG. 1 is flowchart for making a plurality of shielded integrated circuit (IC) packages in accordance with an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of spaced apart IC dies carried by a substrate and covered by a common encapsulating material.
- FIG. 3 is a cross-sectional view of spaced apart IC dies, the substrate and the common encapsulating material illustrated in FIG. 2 after cutting the common encapsulating material between adjacent IC dies to define spaced apart IC packages.
- FIG. 4 is a cross-sectional view of an electrically conductive polymer layer positioned over the spaced apart IC packages and over the spaces between adjacent IC dies illustrated in FIG. 3 .
- FIG. 5 is a cross-sectional view of the electrically conductive polymer layer illustrated in FIG. 4 with pressure and heat being applied to provide an electrically conductive layer over the spaced apart IC packages and filling the spaces between adjacent IC packages.
- FIG. 6 is a cross-sectional view of the shield IC packages illustrated in FIG. 5 after cutting through the electrically conductive layer between the adjacent IC packages illustrated in FIG. 5 .
- FIG. 7 is flowchart for making a plurality of shielded integrated circuit (IC) packages in accordance with another embodiment of the present invention.
- IC integrated circuit
- Each IC die 40 is secured to the substrate 30 by an adhesive layer 32 .
- Each IC die 40 may be electrically coupled to the substrate 30 through the use of wire bonds, for example. Alternatively, a flip chip may be used.
- the method further includes at Block 106 cutting through the common encapsulating material 50 between adjacent IC dies 40 to define a plurality of spaced apart IC packages 22 carried by the substrate 30 , as illustrated in FIG. 3 .
- a gap 60 is now between adjacent IC packages 22 .
- the substrate 30 is exposed after cutting the encapsulating material 50 between adjacent IC dies 40 .
- An electrically conductive polymer layer 70 is positioned over the plurality of spaced apart IC packages 22 and over the spaces 60 between spaced apart IC packages 22 at Block 108 and as illustrated in FIG. 4 .
- the electrically conductive polymer layer 70 is a solid material carried by a film 72 .
- the electrically conductive polymer layer 70 comprises a non-conductive polymer with conductive fillers mixed therein.
- the non-conductive polymer is thermosetting.
- the conductive fillers for example, may include aluminum, copper, chromium, stannum, gold, silver, nickel or any combination thereof. Nonetheless, the conductive fillers are not limited to these metal materials.
- the pressure and heat are simultaneously applied at Block 110 to the electrically conductive polymer layer 70 .
- the pressure and heat causes the electrically conductive polymer layer 70 , which is a solid material, to transform to a soft material so as to flow over the plurality of spaced apart IC packages 22 and filling the spaces 60 between adjacent IC packages.
- the soft material is a gel like material that can easily spread through small intersections and interfaces.
- the heat applied to the electrically conductive polymer layer 70 is within a range of 100-150° C., for example.
- the pressure applied to the electrically conductive polymer layer 70 is within a range of 200-400 kPa, for example.
- the electrically conductive polymer layer 70 is cooled at Block 112 from the soft material back to the solid material.
- the cooling may be to room temperature or lower, for example.
- This provides an electrically conductive layer 80 over the plurality of IC packages 22 and the spaces 60 between adjacent IC packages.
- the film 72 is then removed or separated from the electrically conductive layer 80 at Block 114 . Since the substrate 30 is exposed between adjacent IC packages, this allows the electrically conductive layer 80 to be grounded.
- the method further includes at Block 116 cutting through the electrically conductive layer 80 between adjacent IC packages 22 and through the substrate 30 to form the plurality of shielded IC packages 24 .
- the electrically conductive layer 80 is on an upper surface and sidewalls of each IC package 22 .
- a thickness of the electrically conductive layer 80 may be within a range of 5-15 microns, for example.
- Use of the electrically conductive polymer layer 70 advantageously allows the thickness of the electrically conductive layer 80 to be controlled so that a uniform thickness is provided.
- Use of the electrically conductive polymer layer 70 also advantageously provides a shielded IC package 24 in a relatively straightforward manner.
- the method comprises providing a plurality of spaced apart IC dies 40 carried by a substrate 30 and covered by a common encapsulating material 50 at Block 204 .
- An electrically conductive polymer layer 70 is positioned over the common encapsulating material 50 at Block 206 , with the electrically conductive polymer layer being a solid material carried by a film 72 . Pressure and heat are applied to the electrically conductive polymer layer 70 so that the solid material transforms to a soft material so as to flow over the common encapsulating material 50 at Block 208 .
- the electrically conductive polymer layer 70 is cooled from the soft material back to the solid material at Block 210 .
- the film 72 is separated from the electrically conductive layer 70 at Block 212 .
- the method further comprises cutting through the electrically conductive layer 70 between adjacent IC dies 40 , through the common encapsulating material 50 and through the substrate 30 to form the plurality of shielded IC packages at Block 214 .
- the method ends at Block 216 .
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- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
- The present invention refers to the field of integrated circuit (IC) packages, and more particularly, to electrically shielding an IC package.
- There exists a general need in wireless communications devices for certain integrated circuit (IC) packages to be isolated from electromagnetic interference (EMI) in order to maintain proper device performance. The electromagnetic interference may be received from, or transmitted to, the environment.
- One approach for shielding an IC package from electromagnetic interference is to cover the IC package with a grounded metal enclosure typically called a can. However, this approach may be costly and lacks design flexibility. In addition, the metal can adds weight and adds significant size to the IC package footprint.
- Another approach is to use a physical vapor deposition (PVD) process that deposits in a vacuum chamber a conductive layer on an upper surface of the IC package. Sputtering is a type of PVD that involves ejecting material from a target that is a source onto a substrate (such as an IC package) in a vacuum chamber. However, this approach is expensive and it is difficult to control a thickness of the coating layer. Consequently, there is a need for electrically shielding an IC package in a relatively straightforward manner.
- A method for making a plurality of integrated circuit (IC) packages includes providing a plurality of spaced apart IC dies carried by a substrate and covered by a common encapsulating material, and cutting through the common encapsulating material between adjacent IC dies to define a plurality of spaced apart IC packages carried by the substrate. The substrate may be exposed after cutting the encapsulating material between adjacent IC dies.
- An electrically conductive polymer layer may be positioned over the plurality of spaced apart IC packages and over the spaces between adjacent IC packages, with the electrically conductive polymer layer being a solid material carried by a film. Pressure and heat may be applied to the electrically conductive polymer layer so that the solid material transforms to a soft material so as to flow over the plurality of spaced apart IC packages and filling the spaces between adjacent IC packages.
- The electrically conductive polymer layer may be cooled from the soft material back to the solid material providing an electrically conductive layer. The film may then be removed from the electrically conductive layer. The method further includes cutting through the electrically conductive layer between adjacent IC packages and through the substrate to form the plurality of shielded IC packages. The electrically conductive layer may be on an upper surface and sidewalls of each IC package.
- The electrically conductive polymer layer may comprise a non-conductive polymer with conductive fillers mixed therein. The non-conductive polymer may be thermosetting.
- A thickness of the electrically conductive layer may be within a range of 5-15 microns, for example. Use of the electrically conductive polymer layer advantageously allows the thickness of the electrically conductive layer to be controlled so that a uniform thickness is provided. Use of the electrically conductive polymer layer also advantageously provides a shielded IC package in a relatively straightforward manner.
-
FIG. 1 is flowchart for making a plurality of shielded integrated circuit (IC) packages in accordance with an embodiment of the present invention. -
FIG. 2 is a cross-sectional view of spaced apart IC dies carried by a substrate and covered by a common encapsulating material. -
FIG. 3 is a cross-sectional view of spaced apart IC dies, the substrate and the common encapsulating material illustrated inFIG. 2 after cutting the common encapsulating material between adjacent IC dies to define spaced apart IC packages. -
FIG. 4 is a cross-sectional view of an electrically conductive polymer layer positioned over the spaced apart IC packages and over the spaces between adjacent IC dies illustrated inFIG. 3 . -
FIG. 5 is a cross-sectional view of the electrically conductive polymer layer illustrated inFIG. 4 with pressure and heat being applied to provide an electrically conductive layer over the spaced apart IC packages and filling the spaces between adjacent IC packages. -
FIG. 6 is a cross-sectional view of the shield IC packages illustrated inFIG. 5 after cutting through the electrically conductive layer between the adjacent IC packages illustrated inFIG. 5 . -
FIG. 7 is flowchart for making a plurality of shielded integrated circuit (IC) packages in accordance with another embodiment of the present invention. - The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
- A method for making a plurality of shielded integrated circuit (IC)
packages 24 will now be discussed in reference to theflowchart 100 inFIG. 1 and to the process steps inFIGS. 2-6 . Starting fromBlock 102, a plurality of spaced apart IC dies 40 carried by asubstrate 30 and covered by a common encapsulatingmaterial 50 is provided atBlock 104 and as illustrated inFIG. 2 . - Each IC die 40 is secured to the
substrate 30 by anadhesive layer 32. EachIC die 40 may be electrically coupled to thesubstrate 30 through the use of wire bonds, for example. Alternatively, a flip chip may be used. - The method further includes at
Block 106 cutting through the common encapsulatingmaterial 50 between adjacent IC dies 40 to define a plurality of spaced apartIC packages 22 carried by thesubstrate 30, as illustrated inFIG. 3 . Agap 60 is now betweenadjacent IC packages 22. Thesubstrate 30 is exposed after cutting the encapsulatingmaterial 50 between adjacent IC dies 40. - An electrically
conductive polymer layer 70 is positioned over the plurality of spaced apartIC packages 22 and over thespaces 60 between spaced apartIC packages 22 atBlock 108 and as illustrated inFIG. 4 . The electricallyconductive polymer layer 70 is a solid material carried by afilm 72. - The electrically
conductive polymer layer 70 comprises a non-conductive polymer with conductive fillers mixed therein. The non-conductive polymer is thermosetting. The conductive fillers, for example, may include aluminum, copper, chromium, stannum, gold, silver, nickel or any combination thereof. Nonetheless, the conductive fillers are not limited to these metal materials. - Pressure and heat are simultaneously applied at
Block 110 to the electricallyconductive polymer layer 70. The pressure and heat causes the electricallyconductive polymer layer 70, which is a solid material, to transform to a soft material so as to flow over the plurality of spaced apartIC packages 22 and filling thespaces 60 between adjacent IC packages. The soft material is a gel like material that can easily spread through small intersections and interfaces. - The heat applied to the electrically
conductive polymer layer 70 is within a range of 100-150° C., for example. The pressure applied to the electricallyconductive polymer layer 70 is within a range of 200-400 kPa, for example. - The electrically
conductive polymer layer 70 is cooled atBlock 112 from the soft material back to the solid material. The cooling may be to room temperature or lower, for example. This provides an electricallyconductive layer 80 over the plurality ofIC packages 22 and thespaces 60 between adjacent IC packages. Thefilm 72 is then removed or separated from the electricallyconductive layer 80 atBlock 114. Since thesubstrate 30 is exposed between adjacent IC packages, this allows the electricallyconductive layer 80 to be grounded. - The method further includes at
Block 116 cutting through the electricallyconductive layer 80 betweenadjacent IC packages 22 and through thesubstrate 30 to form the plurality of shieldedIC packages 24. As best illustrated inFIG. 6 , the electricallyconductive layer 80 is on an upper surface and sidewalls of eachIC package 22. - A thickness of the electrically
conductive layer 80 may be within a range of 5-15 microns, for example. Use of the electricallyconductive polymer layer 70 advantageously allows the thickness of the electricallyconductive layer 80 to be controlled so that a uniform thickness is provided. Use of the electricallyconductive polymer layer 70 also advantageously provides a shieldedIC package 24 in a relatively straightforward manner. - As an option, if the sides of the IC packages 22 do not need to be shielded, then the step of cutting through the
common encapsulating material 50 between adjacent IC dies 40 is not performed. Reference is now directed to theflowchart 200 illustrated inFIG. 7 . From the start (Block 202), the method comprises providing a plurality of spaced apart IC dies 40 carried by asubstrate 30 and covered by acommon encapsulating material 50 atBlock 204. - An electrically
conductive polymer layer 70 is positioned over thecommon encapsulating material 50 atBlock 206, with the electrically conductive polymer layer being a solid material carried by afilm 72. Pressure and heat are applied to the electricallyconductive polymer layer 70 so that the solid material transforms to a soft material so as to flow over thecommon encapsulating material 50 atBlock 208. - The electrically
conductive polymer layer 70 is cooled from the soft material back to the solid material atBlock 210. Thefilm 72 is separated from the electricallyconductive layer 70 atBlock 212. The method further comprises cutting through the electricallyconductive layer 70 between adjacent IC dies 40, through thecommon encapsulating material 50 and through thesubstrate 30 to form the plurality of shielded IC packages atBlock 214. The method ends atBlock 216. - Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that modifications and embodiments are intended to be included within the scope of the appended claims.
Claims (31)
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CN201710141125.XA CN107275231A (en) | 2016-03-14 | 2017-03-10 | Method for manufacturing the shielding integrated circuit package body with conductive polymer coating |
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