US20160282055A1

US20160282055A1 - Heat dissipation plate and package structure

Info

Publication number: US20160282055A1
Application number: US15/181,434
Authority: US
Inventors: Ching-Sheng Chen
Original assignee: Subtron Technology Co Ltd
Current assignee: Subtron Technology Co Ltd
Priority date: 2013-05-21
Filing date: 2016-06-14
Publication date: 2016-09-29
Also published as: EP2806455B1; EP2806455A2; TWI513069B; EP2806455A3; JP5840663B2; CN104183690B; TW201445785A; CN104183690A; US20140345841A1; JP2014228270A

Abstract

A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, a metal ring frame, and a second metal layer is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The second metal layer is disposed on the upper surface of the heat-conductive material layer. The first and second rough surface structures and the metal ring frame define a fluid chamber, and a working fluid flows in the fluid chamber. A package structure including the heat dissipation plate is also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of and claims the priority benefit of U.S. application Ser. No. 13/935,580, filed on Jul. 5, 2013, now pending. The prior U.S. application Ser. No. 13/935,580 claims the priority benefit of Taiwan application serial no. 102117918, filed on May 21, 2013. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention relates to a heat dissipation plate and a package structure, and more particularly, to a heat dissipation plate suitable for carrying at least one heat generating element and a package structure including at least one heat generating element.
2. Description of Related Art
According to a commonly used existing light emitting diode (LED) package structure, a LED chip needs to be packaged before use, and a large amount of heat will be generated while the LED chip emits light. If the heat generated by the LED chip cannot be dissipated and keeps accumulating within the LED package structure, the temperature of the LED package structure will continuously increase. Thus, due to the excessive heat, the LED chip may encounter an issue of luminance decay, and the service life of the LED chip may be shortened; what is more, permanent damages to the LED chip may be caused in some cases.
The conventional LED chips are mostly disposed on the heat dissipation plate which uses a metallic circuit to dissipate heat. However, the thermal expansion coefficient of the metallic circuit is much greater than the thermal expansion coefficient of the LED chips, i.e., these two thermal expansion coefficients are mismatched. In addition, the increasing thermal stress and warpage generated by the LED chips may lead to a reliability decrease in the LED chips and the heat dissipation plate. Therefore, how to increase the heat dissipation effect of the LED chips and improve the reliability of the LED chips and the heat dissipation plate now has become an important issue.

SUMMARY OF THE INVENTION

The invention provides a heat dissipation plate which achieves a favorable heat dissipation effect, and a package structure having a favorable heat dissipation effect.
The heat dissipation plate of the invention includes a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame. The heat-conductive material layer has an upper surface and a lower surface opposite to each other, and a material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.
In an embodiment of the invention, the heat-conductive material layer further includes at least one conductive through hole structure. The conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer.
In an embodiment of the invention, the heat dissipation plate further includes a second metal layer. The second metal layer is disposed on the upper surface of the heat-conductive material layer, and the second metal layer entirely covers or exposes a portion of the heat-conductive material layer.
In an embodiment of the invention, the heat dissipation plate further includes at least one opening. The opening penetrates through the heat-conductive material layer and the first metal layer and communicates with the fluid chamber. A thin metal pipe may be inserted into the opening for gas suction or fluid injection, such that the fluid chamber is in a low vacuum state; after that, the inserted thin metal pipe is closed.
In an embodiment of the invention, the heat dissipation plate further includes at least one opening. The opening penetrates through the metal ring frame and communicates with the fluid chamber.
In an embodiment of the invention, the heat dissipation plate further includes at least one opening. The opening penetrates through the metal substrate and communicates with the fluid chamber.
In an embodiment of the invention, a material of the first metal layer, a material of the metal substrate, and a material of the metal ring frame include copper, aluminum, or an alloy thereof.
In an embodiment of the invention, the first rough surface structure is a concave-convex surface structure, and a Rymax of the first rough surface structure ranges from several micrometers to several centimeters.
In an embodiment of the invention, the second rough surface structure is a concave-convex surface structure, and a Rymax of the second rough surface structure ranges from several micrometers to several centimeters.
In an embodiment of the invention, the working fluid includes air or liquid.
Based on the above, the material of the heat-conductive material layer of the heat dissipation plate of the invention is ceramic or silicon germanium having high thermal conductivity. The first rough surface structure of the first metal layer, the metal ring frame, and the second rough surface structure of the metal substrate define a low-vacuum-level fluid chamber. Accordingly, the heat dissipation plate of the invention can be considered as a vapor chamber, and when a heat generating element (such as a LED chip) is disposed on the heat dissipation plate, the heat generated by the heat generating element can be dissipated due to the two-phase flow characteristics of the vapor chamber. Thereby, the heat generated by the heat generating element can be removed effectively, and the efficiency and the lifetime of the heat generating element may be increased.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, several embodiments accompanied with figures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic cross-sectional view illustrating a heat dissipation plate according to an embodiment of the invention.

FIG. 2 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention.

FIG. 3 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention.

FIG. 4 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention.

FIG. 5 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention.

FIG. 6 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to an embodiment of the invention.

FIG. 7 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention.

FIG. 8 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention.

FIG. 9 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention.

FIG. 10 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a schematic cross-sectional view illustrating a heat dissipation plate according to an embodiment of the invention. In FIG. 1, a heat dissipation plate 100 a in the present embodiment includes a heat-conductive material layer 110 a, a first metal layer 120, a metal substrate 130, and a metal ring frame 140. In detail, the heat-conductive material layer 110 a has an upper surface 112 a and a lower surface 114 a opposite to each other; in particular, a material of the heat-conductive material layer 110 a includes ceramic or silicon germanium. The first metal layer 120 is disposed on the lower surface 114 a of the heat-conductive material layer 110 a and has a first rough surface structure 122. The metal substrate 130 is disposed below the first metal layer 120 and has a second rough surface structure 132. The metal ring frame 140 is disposed between the first metal layer 120 and the metal substrate 130. The first rough surface structure 122, the metal ring frame 140, and the second rough surface structure 132 define a fluid chamber C, and a working fluid F flows in the fluid chamber C.
More specifically, the first metal layer 120 described in the present embodiment is in direct contact with the lower surface 114 a of the heat-conductive material layer 110 a. In the present embodiment, a material of the first metal layer 120, a material of the metal substrate 130, and a material of the metal ring frame 140 include copper, aluminum, or an alloy thereof, wherein the materials of the first metal layer 120, the metal substrate 130, and the metal ring frame 140 can be the same or different, and the invention does not pose any limitation thereto. In addition, the fluid chamber C, for example, is a low-vacuum-level chamber, and the working fluid F, for example, is air or liquid.
In particular, the first rough surface structure 122 of the first metal layer 120 described in the present embodiment, for example, is a continuous concave-convex surface structure or a non-continuous concave-convex surface structure, and the Rymax of the first rough surface structure 122 ranges from several micrometers to several centimeters. The first rough surface structure 122 may be considered as a capillary structure. On the other hand, the second rough surface structure 132 of the metal substrate 130 described in the present embodiment, for example, is a continuous concave-convex surface structure or a non-continuous concave-convex surface structure, and the Rymax of the second rough surface structure 132 ranges from several micrometers to several centimeters. The second rough surface structure 132 may also be considered as a capillary structure. Here, the first rough surface structure 122 and the second rough surface structure 132, for example, are formed by mechanical processing (e.g., computer numerical control (CNC) milling, stamping, or sandblasting), chemical processing (e.g., electrochemical plating or etching), or physical grinding, which should not be construed as limitations to the invention.
The material of the heat-conductive material layer 110 a of the heat dissipation plate 100 a described in the present embodiment is ceramic or silicon germanium having high thermal conductivity, and the first rough surface structure 122 of the first metal layer 120, the metal ring frame 140, and the second rough surface structure 132 of the metal substrate 130 define a low-vacuum-level fluid chamber C. Accordingly, as a heat generating element (not shown) is disposed on the heat-conductive material layer 110 a, the working fluid F inside the fluid chamber C absorbs heat E generated by the heat generating element and vaporizes on a low vacuum condition. At this time, the working fluid F absorbs the heat E and rapidly expands its volume, and the gas-phase working fluid F soon fills the whole fluid chamber C. When the gas-phase working fluid F is in contact with areas with low temperature, the gas-phase working fluid F is condensed, so as to allow the heat absorbed during vaporization to be released. After condensation, the liquid-phase working fluid F returns to the evaporating region (i.e., below the heat generating element) via a capillary action of the first rough surface structure 122 and the second rough surface structure 132. Therefore, via the repeated cycles of conduction, evaporation, convection, and condensation, the heat E generated by the heat generating element can be rapidly transferred to each portion of the heat dissipation plate 100 a. In short, the heat dissipation plate 100 a described in the present embodiment can be considered a vapor chamber having a flat structure and the satisfactory two-phase flow characteristics. Thereby, an excellent two-dimensional lateral thermal conduction effect may be provided, the heat generated by the heat generating element may be rapidly diffused to avoid a formation of hot spots in local regions, and the lifetime of the heat generating element may be extended.
On the other hand, the heat-conducting material layer 110 a achieves thermal conduction effects, and the thermal expansion coefficient of the heat-conducting material layer 110 a is relatively close to the thermal expansion coefficient of the heat generating element (not shown). Therefore, as the heat generating element is disposed on the heat-conductive material layer 110 a, the difference of thermal expansion coefficients between the heat dissipation plate 100 a and the heat generating element held by the heat dissipation plate 100 a may be reduced, the corresponding stress increase between the heat generating element and the heat-conductive material layer 110 a due to the significant difference between the two thermal expansion coefficients can be avoided, the heat generating element may be prevented from falling off or being damaged, and the reliability of the heat dissipation plate 100 a may be enhanced.
Several embodiments are provided hereinafter to illustrate the structural designs of the heat dissipation plates 100 b, 100 c, 100 d, and 100 e. It should be mentioned that the reference numerals and some of the contents in the previous embodiment are used in the following embodiments, in which identical reference numerals indicate identical or similar components, and repeated description of the same technical contents is omitted. For a detailed description of the omitted parts, reference can be found in the previous embodiment, and no repeated description is contained in the following embodiments.
FIG. 2 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention. In FIG. 2, the heat dissipation plate 100 b in the present embodiment is similar to the heat dissipation plate 100 a in FIG. 1, and one of main differences is that the heat-conductive material layer 110 b in the present embodiment has at least one conductive through hole structure 116 b (FIG. 2 schematically illustrates three hole structures), and the conductive through hole structure 116 b is connected to the upper surface 112 b and the lower surface 114 b and exposes a portion of the first metal layer 120. The conductive through hole structure 116 b is electrically connected to the exposed portion of the first metal layer 120. In addition, the heat dissipation plate 100 b further includes at least one opening H1, wherein the opening H1 penetrates through the metal substrate 130 and communicates with the fluid chamber C to improve the overall heat dissipation efficiency of the heat dissipation plate 100 b by sucking gas from or injecting fluid into the fluid chamber C through the opening H1. A thin metal pipe (not shown) may be inserted into the opening H1 for gas suction or fluid injection, such that the fluid chamber C is in a low vacuum state; after that, the inserted thin metal pipe is closed.
FIG. 3 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention. In FIG. 3, the heat dissipation plate 100 c in the present embodiment is similar to the heat dissipation plate 100 a in FIG. 1, and one of main differences is that the heat dissipation plate 100 c in the present embodiment further includes a second metal layer 160 a. The second metal layer 160 a is disposed on the upper surface 112 a of the heat-conductive material layer 110 a, and the second metal layer 160 a entirely covers the heat-conductive material layer 110 a.
In addition, the heat dissipation plate 100 c further includes at least one opening H2. The opening H2 sequentially penetrates through the second metal layer 160 a, the heat-conductive material 110 a, and the first metal layer 120 and communicates with the fluid chamber C to improve the overall heat dissipation efficiency of the heat dissipation plate 100 c by sucking gas from or injecting fluid into the fluid chamber C through the opening H2.
FIG. 4 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention. In FIG. 4, the heat dissipation plate 100 d in the present embodiment is similar to the heat dissipation plate 100 a in FIG. 1, and one of main differences is that the heat dissipation plate 100 d in the present embodiment further includes a second metal layer 160 b. The second metal layer 160 b is disposed on the upper surface 112 a of the heat-conductive material layer 110 a, and the second metal layer 160 b covers the heat-conductive material layer 110 a and exposes a portion of the upper surface 112 a of the heat-conductive material layer 110 a. In addition, the heat dissipation plate 100 d further includes at least one opening H3, and the opening H3 penetrates through the metal ring frame 140 and communicates with the fluid chamber C to improve the overall heat dissipation efficiency of the heat dissipation plate 100 d by sucking gas from or injecting fluid into the fluid chamber C through the opening H3.
FIG. 5 is a schematic cross-sectional view illustrating a heat dissipation plate according to another embodiment of the invention. In FIG. 5, the heat dissipation plate 100 e in the present embodiment is similar to the heat dissipation plate 100 b in FIG. 2, and one of main differences is that the heat dissipation plate 100 e in the present embodiment further includes a second metal layer 160 b. The second metal layer 160 b is disposed on the upper surface 112 b of the heat-conductive material layer 110 b, and the second metal layer 160 b covers the heat-conductive material layer 110 b and exposes a portion of the upper surface 112 b of the heat-conductive material layer 110 b.
Furthermore, the conductive through hole structure 116 b, the second metal layers 160 a and 160 b, and the openings H1, H2, and H3 are also applicable in other embodiments not shown herein. According to the above descriptions in the previous embodiments, people having the ordinary skill in the art can use the aforementioned components to achieve the desired technical effects based on the actual requirements.
FIG. 6 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to an embodiment of the invention. In FIG. 6, the heat dissipation plate 100 a is suitable for carrying a LED chip 200 a (i.e., the heat generating element), and the LED chip 200 a is embedded in a dielectric layer 210 and electrically connected to circuits 230 on the dielectric layer 210 through a plurality of bonding wires 220. Moreover, the LED chip 200 a and the dielectric layer 210 are fixed onto the upper surface 112 a of the heat-conductive material layer 110 a by an adhesive layer 240. Here, the adhesive layer 240, for example, can be a conductive adhesive layer or a non-conductive adhesive layer, and the invention does not pose any limitation thereto.
The heat-conductive material layer 110 a in present embodiment achieves the heat dissipation effects, and the thermal expansion coefficient of the heat-conductive material layer 110 a is close to the thermal expansion coefficient of the LED chip 200 a (not shown). Therefore, as the LED chip 200 a is disposed on the heat-conductive material layer 110 a by the adhesive layer 240, the difference of thermal expansion coefficients between the heat dissipation plate 100 a and the LED chip 200 a held by the heat dissipation plate 100 a may be effectively reduced, the corresponding stress increase between the heat generating element and the heat-conductive material layer 110 a due to the significant difference between the two thermal expansion coefficients can be avoided, the LED chip 200 a may be prevented from falling off or being damaged, and the reliability of the heat dissipation plate 100 a may be enhanced. Furthermore, if the heat dissipation plate 100 a only has the function of heat dissipation, the heat generated by the LED chip 200 a may be rapidly transmitted to the external surroundings through the cycles of conduction, evaporation, convection, and condensation.
It is worth to mention that the invention does not limit the number of the LED chips 200 a, although only one LED chip 200 a is exemplified herein. However, with reference to FIG. 7, in another embodiment, the heat generating element can also be composed of a plurality of LED chips 200 b connected in series or in parallel. This still belongs to a technical means adoptable in the invention and falls within the protection scope of the invention.
FIG. 8 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention. In FIG. 8, the heat dissipation plate 100 d is suitable for carrying a LED chip 200 d (i.e., the heat generating element), wherein the LED chip 200 d is disposed on the second metal layer 160 b, and the LED chip 200 d is structurally and electrically connected to the second metal layer 160 b through a plurality of bonding wires 220. Here, the heat dissipation plate 100 d not only has the function of heat dissipation but also has the function of electrical conduction.
FIG. 9 is a schematic cross-sectional view illustrating a heat dissipation plate which holds a heat generating element according to another embodiment of the invention. In FIG. 9, the heat dissipation plate 100 d is suitable for carrying a LED chip 200 e (i.e., the heat generating element), wherein the LED chip 200 e is disposed on the second metal layer 160 b through the silver paste 250; that is, the LED chip 200 e is electrically connected to the second metal layer 160 b of the heat dissipation plate 100 d by flip chip bonding. Here, the heat dissipation plate 100 d not only has the function of heat dissipation but also has the function of electrical conduction.
It is worth to mention that the invention does not limit the number of the LED chips 200 e, although only one LED chip 200 e is exemplified herein. However, with reference to FIG. 10, in another embodiment, the heat generating element can also be composed of a plurality of LED chips 200 f. This still belongs to a technical means adoptable in the invention and falls within the protection scope of the invention. Furthermore, the heat dissipation plate 100 b, 100 c, and 100 d as mentioned above are applicable in other embodiments not shown herein. According to the above descriptions in the previous embodiments, people having the ordinary skill in the art can use the aforementioned components to achieve the desired technical effects based on the actual requirements.
In summary, the material of the heat-conductive material layer of the heat dissipation plate described in the invention is ceramic or silicon germanium having high thermal conductivity. The first rough surface structure of the first metal layer, the metal ring frame, and the second rough surface structure of the metal substrate define a low-vacuum-level fluid chamber. Therefore, the heat dissipation plate described in the invention can be considered as a vapor chamber, and when the heat generating element (e.g., a LED chip) is disposed on the heat dissipation plate, the heat generated by the heat generating element can be dissipated due to the two-phase flow characteristics of the vapor chamber. Thereby, the heat generated by the heat generating element can be removed efficiently, and the efficiency and the lifetime of the heat generating element can be increased.
Although the invention has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit of the invention. Accordingly, the scope of the invention is defined by the attached claims not by the above detailed descriptions.

Claims

What is claimed is:

1. A heat dissipation plate, suitable for carrying a heat generating element, the heat dissipation plate comprising:

a heat-conductive material layer having an upper surface and a lower surface opposite to each other, wherein a material of the heat-conductive material layer comprises ceramic or silicon germanium, and a thermal expansion coefficient of the heat-conductive material layer is close to a thermal expansion coefficient of the heat generating element;

a first metal layer disposed on the lower surface of the heat-conductive material layer and having a first rough surface structure, wherein the heat-conductive material layer is disposed between the first metal layer and the heat generating element, the first rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the first rough surface structure ranges from several micrometers to several centimeters;

a metal substrate disposed below the first metal layer and having a second rough surface structure, wherein the second rough surface structure is a concave-convex surface structure, and a maximum value of a maximum height per length of the second rough surface structure ranges from several micrometers to several centimeters;

a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber the fluid chamber is in a low vacuum state, and the working fluid is peprformed two-dimensional lateral flow via a capillary action of the first rough surface structure and the second rough surface structure; and

a second metal layer disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer, and second metal layer is disposed between the heat generating element and the heat-conductive material layer.

2. The heat dissipation plate as claimed in claim 1, wherein the heat-conductive material layer further comprises at least one conductive through hole structure, and the at least one conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer.

3. The heat dissipation plate as claimed in claim 1, further comprising:

at least one opening penetrating through the heat-conductive material layer and the first metal layer and communicating with the fluid chamber.

4. The heat dissipation plate as claimed in claim 1, further comprising:

at least one opening penetrating through the metal ring frame and communicating with the fluid chamber.

5. The heat dissipation plate as claimed in claim 1, further comprising:

at least one opening penetrating through the metal substrate and communicating with the fluid chamber.

6. The heat dissipation plate as claimed in claim 1, wherein a material of the first metal layer, a material of the metal substrate, and a material of the metal ring frame comprise copper, aluminum, or an alloy thereof.

7. The heat dissipation plate as claimed in claim 1, wherein the working fluid comprises air or liquid.

8. A package structure, comprising:

a heat generating element;