US20060175044A1 - Heat dissipating tube sintered with copper powders - Google Patents

Heat dissipating tube sintered with copper powders Download PDF

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Publication number
US20060175044A1
US20060175044A1 US11/054,139 US5413905A US2006175044A1 US 20060175044 A1 US20060175044 A1 US 20060175044A1 US 5413905 A US5413905 A US 5413905A US 2006175044 A1 US2006175044 A1 US 2006175044A1
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US
United States
Prior art keywords
metal tube
tube
heat dissipating
wall
copper powders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/054,139
Inventor
Chin-Wei Lee
Ping-Huang Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US11/054,139 priority Critical patent/US20060175044A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, CHIN-WEI, YANG, PING-HUANG
Publication of US20060175044A1 publication Critical patent/US20060175044A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat dissipating tubes, and in particular to a heat dissipating tube, wherein more copper powders can be adhered to the inner wall of the metal tube so that more heat can be transferred to the copper powders. Thereby the heat dissipating ability of the heat dissipating tube is increased.
  • heat dissipating tube is widely used in CPU for dissipating heat.
  • evaporated liquid such as water
  • vacuum state liquid will evaporate to carry heat of the metal tube from one end to another end, when the temperature is decreased, the liquid will return to the original place.
  • the surface of the metal tube is coated with copper powders so as to absorb more heat from the metal tube to further increase the heat dissipating ability of the heat dissipating tube, as shown in FIG. 1 .
  • this prior art has the following disadvantages.
  • the inner wall of the metal tube is smooth so that copper powders can not be easily sintered to the surface of the inner wall of the metal tube. Furthermore, the surface area of the copper powders adhered to the metal tube is smaller so that the heat can be transferred to the copper powders is confined. Thereby the copper powders cannot be firmly secured to the surface of the metal tube.
  • the primary object of the present invention is to provide a heat dissipating tube, wherein more copper powders can be adhered to the inner wall of the metal tube so that more heat can be transferred to the copper powders. Thereby the heat dissipating ability of the heat dissipating tube is increased.
  • the present invention provides a heat dissipating tube which comprises a metal tube; an inner wall of the metal tube having at least one non-flat portion; and a plurality of copper powders adhered on the inner wall of the metal tube.
  • a heat dissipating tube which comprises a metal tube; an inner wall of the metal tube having at least one non-flat portion; and a plurality of copper powders adhered on the inner wall of the metal tube.
  • a cross section of the non-flat portion has a shape selected from one of trapezoids, rectangular shapes, semi-round shapes, sector shapes, sawtooth shapes, triangular shapes, or other irregular shape.
  • the non-flat portion may be selected from one of at least one trench, at least one protrusion and at least one groove.
  • FIG. 1 is a schematic view showing the prior art metal tube with sintering copper powders on an inner wall thereof.
  • FIG. 2 is a cross sectional view about first embodiment of the present invention.
  • FIGS. 3A and 3B are a schematic view about the second embodiment of the present invention.
  • FIG. 4 is a schematic view about the third embodiment of the present invention.
  • a metal tube 1 is an aluminum tube or a tube made of other metals.
  • An inner wall of the metal tube 1 is formed with a plurality of trenches 2 . As shown in FIG. 2 , each trench 2 is extended along an axial direction of the metal tube 1 .
  • the trenches 2 are distributed along a periphery of the metal tube 1 .
  • a cross section of the trench 2 approximately vertical to an axial direction of the metal tube 1 has a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape. After sintering, copper powders 3 will adhere to inner surfaces of the trenches 2 and the inner wall of the metal tube 1 .
  • the copper powders 3 are not only in contact with inner bottoms of the trenches 2 , but also inner lateral walls of the trenches 2 . Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1 .
  • a metal tube 1 is an aluminum tube or a tube made of other metals.
  • An inner wall of the metal tube 1 is formed with a plurality of protrusions 4 .
  • the protrusions 4 are adhered to the inner wall of the metal tube 1 , as shown in FIG. 3A , or the protrusions 4 are integrally formed with the metal tube 1 , as shown in FIG. 3B .
  • the protrusions 4 are distributed along a periphery of the metal tube 1 .
  • a cross section of each protrusion 4 approximately vertical to an axial direction of the metal tube 1 has a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape.
  • Recesses are formed between the protrusions 4 .
  • copper powders 3 are adhered to the surfaces of recesses or the surfaces of the protrusions 4 .
  • the copper powders 3 are not only in contact with inner bottoms of the protrusions 4 , but also inner lateral walls of the protrusions 4 . Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1 .
  • a metal tube 1 is an aluminum tube or a tube made of other metals.
  • An inner wall of the metal tube 1 is formed with a plurality of grooves 2 .
  • each groove 2 is extended along an axial direction of the metal tube 1 .
  • the grooves 2 are distributed along a periphery of the metal tube 1 .
  • a cross section of the groove 2 approximately vertical to an axial direction of the metal tube 1 is a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape.
  • the grooves 2 are distributed as a honeycomb.
  • copper powders 3 will adhere to inner surfaces of the grooves 2 and the inner wall of the metal tube 1 .
  • the copper powders 3 are not only in contact with inner bottoms of the grooves 2 , but also inner lateral walls of the grooves 2 . Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1 .

Abstract

A heat dissipating tube with copper powders comprises a metal tube; an inner wall of the metal tube having at least one non-flat portion; and a plurality of copper powders adhered on the inner wall of the metal tube. There are a plurality of non-flat portions which are distributed along a periphery of a cross section of the metal tube. A cross section of the non-flat portion has a shape selected from one of trapezoids, rectangular shapes, semi-round shapes, sector shapes, sawtooth shapes, triangular shapes, or other irregular shape. The non-flat portion may be selected from one of at least one trench, at least one protrusion and at least one groove.

Description

    FIELD OF THE INVENTION
  • The present invention relates to heat dissipating tubes, and in particular to a heat dissipating tube, wherein more copper powders can be adhered to the inner wall of the metal tube so that more heat can be transferred to the copper powders. Thereby the heat dissipating ability of the heat dissipating tube is increased.
    • BACKGROUND OF THE INVENTION
  • To have a better heat dissipation ability to computer CPUs (central processing units), heat dissipating tube is widely used in CPU for dissipating heat. Currently, low boiling points, evaporated liquid (such as water) is filled within the heat dissipating tube. In vacuum state, liquid will evaporate to carry heat of the metal tube from one end to another end, when the temperature is decreased, the liquid will return to the original place. Generally, the surface of the metal tube is coated with copper powders so as to absorb more heat from the metal tube to further increase the heat dissipating ability of the heat dissipating tube, as shown in FIG. 1. However this prior art has the following disadvantages.
  • The inner wall of the metal tube is smooth so that copper powders can not be easily sintered to the surface of the inner wall of the metal tube. Furthermore, the surface area of the copper powders adhered to the metal tube is smaller so that the heat can be transferred to the copper powders is confined. Thereby the copper powders cannot be firmly secured to the surface of the metal tube.
    • SUMMARY OF THE INVENTION
  • Accordingly, the primary object of the present invention is to provide a heat dissipating tube, wherein more copper powders can be adhered to the inner wall of the metal tube so that more heat can be transferred to the copper powders. Thereby the heat dissipating ability of the heat dissipating tube is increased.
  • To achieve above objects, the present invention provides a heat dissipating tube which comprises a metal tube; an inner wall of the metal tube having at least one non-flat portion; and a plurality of copper powders adhered on the inner wall of the metal tube. There are a plurality of non-flat portions which are distributed along a periphery of a cross section of the metal tube. A cross section of the non-flat portion has a shape selected from one of trapezoids, rectangular shapes, semi-round shapes, sector shapes, sawtooth shapes, triangular shapes, or other irregular shape. The non-flat portion may be selected from one of at least one trench, at least one protrusion and at least one groove.
  • The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view showing the prior art metal tube with sintering copper powders on an inner wall thereof.
  • FIG. 2 is a cross sectional view about first embodiment of the present invention.
  • FIGS. 3A and 3B are a schematic view about the second embodiment of the present invention.
  • FIG. 4 is a schematic view about the third embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • In order that those skilled in the art can further understand the present invention, a description will be described in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
    • FIRST EMBODIMENT
  • A metal tube 1 is an aluminum tube or a tube made of other metals. An inner wall of the metal tube 1 is formed with a plurality of trenches 2. As shown in FIG. 2, each trench 2 is extended along an axial direction of the metal tube 1. The trenches 2 are distributed along a periphery of the metal tube 1. A cross section of the trench 2 approximately vertical to an axial direction of the metal tube 1 has a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape. After sintering, copper powders 3 will adhere to inner surfaces of the trenches 2 and the inner wall of the metal tube 1. The copper powders 3 are not only in contact with inner bottoms of the trenches 2, but also inner lateral walls of the trenches 2. Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1.
    • SECOND EMBODIMENT
  • As shown in FIGS. 3A and 3B, a metal tube 1 is an aluminum tube or a tube made of other metals. An inner wall of the metal tube 1 is formed with a plurality of protrusions 4. The protrusions 4 are adhered to the inner wall of the metal tube 1, as shown in FIG. 3A, or the protrusions 4 are integrally formed with the metal tube 1, as shown in FIG. 3B. The protrusions 4 are distributed along a periphery of the metal tube 1. A cross section of each protrusion 4 approximately vertical to an axial direction of the metal tube 1 has a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape. Recesses are formed between the protrusions 4. After sintering process, copper powders 3 are adhered to the surfaces of recesses or the surfaces of the protrusions 4. The copper powders 3 are not only in contact with inner bottoms of the protrusions 4, but also inner lateral walls of the protrusions 4. Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1.
    • THIRD EMBODIMENT
  • A metal tube 1 is an aluminum tube or a tube made of other metals. An inner wall of the metal tube 1 is formed with a plurality of grooves 2. As shown in FIG. 4, each groove 2 is extended along an axial direction of the metal tube 1. The grooves 2 are distributed along a periphery of the metal tube 1. A cross section of the groove 2 approximately vertical to an axial direction of the metal tube 1 is a trapezoid, a rectangular shape, a semi-round shape, a sector shape, a sawtooth shape, a triangular shape, or other irregular shape. Furthermore, the grooves 2 are distributed as a honeycomb. After sintering, copper powders 3 will adhere to inner surfaces of the grooves 2 and the inner wall of the metal tube 1. The copper powders 3 are not only in contact with inner bottoms of the grooves 2, but also inner lateral walls of the grooves 2. Thereby the area of the copper powders 3 contacting to the inner side of the metal tube 1 is greatly increased. In the sintering process, the copper powders 3 are firmly secured to the metal tube 1.
  • The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Claims (10)

1. A heat dissipating tube sintered with copper powders; the tube comprising:
a metal tube; an inner wall of the metal tube having at least one non-flat portion; and
a plurality of copper powders adhered on the inner wall of the metal tube.
2. The heat dissipating tube as claimed in claim 1, wherein there are a plurality of non-flat portions which are distributed along a periphery of a cross section of the metal tube.
3. The heat dissipating tube as claimed in claim 1, wherein a cross section of the non-flat portion has a shape selected from one of trapezoid shapes, rectangular shapes, semi-round shapes, sector shapes, sawtooth shapes, triangular shapes, or other irregular shapes.
4. The heat dissipating tube as claimed in claim 1, wherein the non-flat portion is at least one trench formed on the inner wall of the metal tube and the inner wall of the trench is adhered with the copper powders.
5. The heat dissipating tube as claimed in claim 4, wherein the at least one trench is extended along an axis of the metal tube.
6. The heat dissipating tube as claimed in claim 1, wherein the non-flat portion is at least one protrusion formed on the inner wall of the metal tube and an outer wall of the protrusion is adhered with the copper powders.
7. The heat dissipating tube as claimed in claim 6, wherein the at least one protrusion is adhered to the inner wall of the metal tube.
8. The heat dissipating tube as claimed in claim 6, wherein the protrusion is integrally formed with the metal tube.
9. The heat dissipating tube as claimed in claim 1, wherein non-flat portion is at least one groove formed on the inner wall of the metal tube and an inner wall of the groove is adhered with the copper powders.
10. The heat dissipating tube as claimed in claim 4, wherein the at least one groove is extended along an axis of the metal tube.
US11/054,139 2005-02-10 2005-02-10 Heat dissipating tube sintered with copper powders Abandoned US20060175044A1 (en)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060207750A1 (en) * 2005-03-18 2006-09-21 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070089860A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe
US20110024098A1 (en) * 2009-07-31 2011-02-03 Yeh-Chiang Technology Corp. Sintered heat pipe, manufacturing method thereof and manufacturing method for groove tube thereof
US20110127013A1 (en) * 2009-11-30 2011-06-02 Shinko Electric Industries Co., Ltd. Heat-radiating component and method of manufacturing the same
CN103591820A (en) * 2013-11-26 2014-02-19 昆山德泰新材料科技有限公司 Heat exchange tube
US20140174701A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat Pipe
US20140345841A1 (en) * 2013-05-21 2014-11-27 Subtron Technology Co., Ltd. Heat dissipation plate
US20150007965A1 (en) * 2013-07-05 2015-01-08 Toyota Motor Engineerig & Manufacturing North America, Inc. Cooling Assemblies Having Porous Three Dimensional Surfaces
US9404392B2 (en) 2012-12-21 2016-08-02 Elwha Llc Heat engine system
US10408509B2 (en) * 2013-09-13 2019-09-10 Denso Corporation Adsorber
CN113720187A (en) * 2021-09-26 2021-11-30 中山莱通金属科技有限公司 Sintered tooth groove pipe and manufacturing process thereof
US11415373B2 (en) * 2017-04-12 2022-08-16 Furukawa Electric Co., Ltd. Heat pipe

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US3696861A (en) * 1970-05-18 1972-10-10 Trane Co Heat transfer surface having a high boiling heat transfer coefficient
US3840069A (en) * 1971-04-27 1974-10-08 Bbc Brown Boveri & Cie Heat pipe with a sintered capillary structure
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US20030141045A1 (en) * 2002-01-30 2003-07-31 Samsung Electro-Mechanics Co., Ltd. Heat pipe and method of manufacturing the same
US6793009B1 (en) * 2003-06-10 2004-09-21 Thermal Corp. CTE-matched heat pipe
US6877315B2 (en) * 2000-08-15 2005-04-12 Microgen Energy Limited Heat transfer head for a Stirling engine
US20050077030A1 (en) * 2003-10-08 2005-04-14 Shwin-Chung Wong Transport line with grooved microchannels for two-phase heat dissipation on devices
US6997244B2 (en) * 2004-07-16 2006-02-14 Hsu Hul-Chun Wick structure of heat pipe

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696861A (en) * 1970-05-18 1972-10-10 Trane Co Heat transfer surface having a high boiling heat transfer coefficient
US3840069A (en) * 1971-04-27 1974-10-08 Bbc Brown Boveri & Cie Heat pipe with a sintered capillary structure
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US6877315B2 (en) * 2000-08-15 2005-04-12 Microgen Energy Limited Heat transfer head for a Stirling engine
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060207750A1 (en) * 2005-03-18 2006-09-21 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070089860A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe
US20110024098A1 (en) * 2009-07-31 2011-02-03 Yeh-Chiang Technology Corp. Sintered heat pipe, manufacturing method thereof and manufacturing method for groove tube thereof
US8453718B2 (en) * 2009-07-31 2013-06-04 Zhongshan Weiqiang Technology Co., Ltd. Sintered heat pipe, manufacturing method thereof and manufacturing method for groove tube thereof
US20110127013A1 (en) * 2009-11-30 2011-06-02 Shinko Electric Industries Co., Ltd. Heat-radiating component and method of manufacturing the same
JP2011112330A (en) * 2009-11-30 2011-06-09 Shinko Electric Ind Co Ltd Heat radiation component and method for manufacturing the same
US10358945B2 (en) 2012-12-21 2019-07-23 Elwha Llc Heat engine system
US9752832B2 (en) * 2012-12-21 2017-09-05 Elwha Llc Heat pipe
US20140174701A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat Pipe
US9404392B2 (en) 2012-12-21 2016-08-02 Elwha Llc Heat engine system
US20140345841A1 (en) * 2013-05-21 2014-11-27 Subtron Technology Co., Ltd. Heat dissipation plate
US20160282055A1 (en) * 2013-05-21 2016-09-29 Subtron Technology Co., Ltd. Heat dissipation plate and package structure
US9803938B2 (en) * 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US20150007965A1 (en) * 2013-07-05 2015-01-08 Toyota Motor Engineerig & Manufacturing North America, Inc. Cooling Assemblies Having Porous Three Dimensional Surfaces
US10408509B2 (en) * 2013-09-13 2019-09-10 Denso Corporation Adsorber
CN103591820A (en) * 2013-11-26 2014-02-19 昆山德泰新材料科技有限公司 Heat exchange tube
US11415373B2 (en) * 2017-04-12 2022-08-16 Furukawa Electric Co., Ltd. Heat pipe
US20220341681A1 (en) * 2017-04-12 2022-10-27 Furukawa Electric Co., Ltd. Heat pipe
US11828539B2 (en) * 2017-04-12 2023-11-28 Furukawa Electric Co., Ltd. Heat pipe
CN113720187A (en) * 2021-09-26 2021-11-30 中山莱通金属科技有限公司 Sintered tooth groove pipe and manufacturing process thereof

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AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, CHIN-WEI;YANG, PING-HUANG;REEL/FRAME:016267/0312

Effective date: 20050201

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION