US20150155275A1 - Enhancement Mode III-Nitride Switch - Google Patents

Enhancement Mode III-Nitride Switch Download PDF

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US20150155275A1
US20150155275A1 US14/619,485 US201514619485A US2015155275A1 US 20150155275 A1 US20150155275 A1 US 20150155275A1 US 201514619485 A US201514619485 A US 201514619485A US 2015155275 A1 US2015155275 A1 US 2015155275A1
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mode iii
schottky
switch
coupled
mode
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Tony Bahramian
Jason Zhang
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Infineon Technologies North America Corp
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International Rectifier Corp USA
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Publication of US20150155275A1 publication Critical patent/US20150155275A1/en
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Assigned to Infineon Technologies Americas Corp. reassignment Infineon Technologies Americas Corp. MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: INFINEON TECHNOLOGIES NORTH AMERICA CORP., INTERNATIONAL RECTIFIER CORPORATION
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8258—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by H01L21/8206, H01L21/8213, H01L21/822, H01L21/8252, H01L21/8254 or H01L21/8256
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/30—Modifications for providing a predetermined threshold before switching
    • H03K17/302—Modifications for providing a predetermined threshold before switching in field-effect transistor switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/74—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of diodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
    • H03K2017/6875—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors using self-conductive, depletion FETs

Definitions

  • the present invention is generally in the field of switching circuits. More particularly, the invention is in the field of high voltage switching circuits.
  • High voltage circuits such as power conversion circuits, typically require fast switches that are capable of handling high voltages without breaking down.
  • silicon devices such as high voltage silicon diodes and transistors, have been utilized to provide high voltage switches.
  • FET high voltage silicon field effect transistor
  • MOSFET metal oxide semiconductor FET
  • silicon devices such as high voltage silicon diodes and transistors
  • they i.e. the silicon devices
  • the silicon devices can store a large amount of charge when conducting current.
  • the silicon devices When the silicon devices are turned off, the stored charge must be dissipated.
  • the large amount of charge stored by the silicon devices, such as high voltage silicon diodes and transistors can undesirably limit their efficiency and operating frequency. Consequently, the efficiency and operating frequency of high voltage circuits, such as power conversion circuits, can be undesirably limited by the use of silicon devices, such as high voltage silicon diodes and transistors, as high voltage switches.
  • Enhancement mode III-nitride switch with increased efficiency and operating frequency substantially as shown in and/or described in connection with at least one of the figures, and as set forth more completely in the claims.
  • FIG. 1 illustrates a circuit diagram of a power factor correction boost circuit in accordance with one embodiment of the present invention.
  • FIG. 2 illustrates a circuit diagram of an exemplary E-mode III-nitride/Schottky switch in accordance with one embodiment of the present invention.
  • FIG. 3 illustrates a circuit diagram of a power factor correction boost circuit in accordance with another embodiment of the present invention.
  • FIG. 4 illustrates a circuit diagram of an exemplary half-bridge configuration utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
  • FIG. 5 illustrates a circuit diagram of an exemplary full-bridge configuration utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
  • FIG. 6 illustrates a circuit diagram of an exemplary buck circuit utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
  • the present invention is directed to an enhancement mode III-nitride switch with increased efficiency and operating frequency.
  • the following description contains specific information pertaining to the implementation of the present invention.
  • One skilled in the art will recognize that the present invention may be implemented in a manner different from that specifically discussed in the present application. Moreover, some of the specific details of the invention are not discussed in order not to obscure the invention.
  • FIG. 1 shows a circuit diagram of an exemplary power factor correction boost circuit coupled between an AC power source and a load in accordance with one embodiment of the present invention.
  • Power factor correction (PFC) boost circuit 100 is coupled between AC power source 102 , such as an AC line, and load 104 and includes full bridge rectifier 106 , capacitors 108 and 110 , inductor 112 , controller 114 , enhancement mode (E-mode) group III-nitride switch 116 (also referred to simply as “E-mode III-N switch” 116 in the present application), “normally off switch” 118 , and resistors 120 and 122 .
  • E-mode enhancement mode
  • E-mode III-N switch 116 also referred to simply as “E-mode III-N switch” 116 in the present application
  • resistors 120 and 122 resistors 120 and 122 .
  • E-mode III-N switch 116 includes silicon transistor 124 and depletion mode (D-mode) group III-nitride device 126 (also referred to simply as “D-mode III-nitride device” 126 in the present application) and normally off switch 118 includes Schottky diode 128 and D-mode III-nitride device 130 .
  • Load 104 can be, for example, a resistive load, an inductive load, such as a step-down transformer, or a capacitive load.
  • Load 104 can be a load corresponding to a home appliance, such as a television set, for example.
  • AC power source 102 is coupled to the inputs of full-bridge rectifier 106 at nodes 132 and 134 , a first terminal of capacitor 108 , which can be a filter capacitor, is coupled to a positive output of full bridge rectifier 106 and a first terminal of inductor 112 , which can be a boost inductor, at node 136 , and a second terminal of capacitor 108 is coupled to a negative output of full bridge rectifier 106 at node 138 . Also shown in FIG.
  • a second terminal of inductor 112 is coupled to a first terminal of E-mode III-N switch 116 and a first terminal of normally off switch 118 at node 140 and a second terminal of E-mode III-N switch 116 is coupled to the negative output of full-bride rectifier 106 at node 138 .
  • silicon transistor 124 is coupled in series with D-mode III-nitride device 126 , wherein the gate of D-mode III-nitride device 126 is coupled to the source of silicon transistor 124 and the drain of silicon transistor 124 is coupled to the source of D-mode III-nitride device 126 .
  • Silicon transistor 124 can be, for example, a low voltage silicon transistor, such as a silicon FET. In one embodiment, silicon transistor 124 can be a low voltage silicon MOSFET.
  • D-mode III-nitride device 126 can comprise a group III nitride semiconductor compound, such as aluminum nitride (AlN), indium nitride (InN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or indium aluminum gallium nitride (InAlGaN).
  • AlN aluminum nitride
  • InN gallium nitride
  • GaN gallium nitride
  • AlGaN aluminum gallium nitride
  • InGaN indium gallium nitride
  • InAlGaN indium aluminum gallium nitride
  • InAlGaN indium aluminum gallium nitride
  • D-mode III-nitride device 126 is a normally on device. However, by coupling silicon transistor 124 in series with D-mode III-nitride device 126 as discussed above, silicon transistor 124 causes D-mode III-nitride device 126 to operate in an enhancement mode (E-mode). For example, when silicon transistor 124 is turned on, D-mode III-nitride device 126 is also turned on, thereby allowing current to flow through silicon transistor 124 and D-mode III-nitride device 126 . When silicon transistor 124 is turned off, D-mode III-nitride device 126 turns off as a result of a voltage that develops across silicon transistor 124 . By including the series-coupled combination of silicon transistor 124 and D-mode III-nitride device 126 , E-mode III-N switch 116 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • E-mode III-N switch 116 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • Schottky diode 128 is coupled in series with D-mode III-nitride device 130 .
  • the anode of Schottky diode 128 is coupled to the gate of D-mode III-nitride device 130 and the cathode of Schottky diode 128 is coupled to the source of D-mode III-nitride device 130 .
  • Schottky diode 128 can be a low voltage silicon diode in an embodiment of the present invention.
  • D-mode III-nitride device 130 which is a high voltage device, can comprise similar group III nitride semiconductor compounds and provides similar advantages as D-mode III-nitride device 126 .
  • D-mode III-nitride device 130 is a normally on device. However, by coupling Schottky diode 128 in series with D-mode III-nitride device 130 as discussed above, Schottky diode 128 causes D-mode III-nitride device 130 to turn off when it (i.e. Schottky diode 128 ) is in a reverse mode (i.e. when current flows from cathode to anode).
  • D-mode III-nitride device 130 For example, in a forward mode (i.e. when current flows from anode to cathode), Schottky diode 128 is turned on and D-mode III-nitride device 130 is also turned on. The voltage drop across Schottky diode 128 in the forward mode has a negligible effect on D-mode III-nitride device 130 , which is a high voltage device. In the reverse mode, D-mode III-nitride device 130 turns off as a result of a voltage that develops across Schottky diode 128 .
  • the combination of Schottky diode 128 and D-mode III-nitride device 130 can operate as a high voltage diode, where the anode of Schottky diode 128 can be an “anode” of the high voltage diode and the drain of D-mode III-nitride device 130 can be a “cathode” of the high voltage diode.
  • normally off switch 118 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • a second terminal of normally off switch 118 is coupled to first terminals of capacitor 110 , which can be an output capacitor, resistor 120 , and load 104 , and second terminals of capacitor 110 and load 104 can be coupled to the negative output of full-bride rectifier 106 at node 138 .
  • a second terminal of resistor 120 is coupled to a first terminal of resistor 122 and a first input (i.e. a feedback input) of controller 114 at node 144 and a second terminal of resistor 122 is coupled to the negative output of full-bride rectifier 106 at node 138 .
  • Resistors 120 and 122 form a voltage divider, which provides a feedback signal to the feedback input of controller 114 at node at 144 .
  • an output of controller 114 which can be a PFC pulse width modulation (PWM) controller, is coupled to the gate of silicon transistor 124 and a second input of controller 114 is coupled to the negative output of full-bridge rectifier 106 at node 138 .
  • Controller 114 can be configured to control the on/off time of E-mode III-N switch 116 by providing a pulse width modulated signal to the gate of silicon transistor 124 to control the on/off time of silicon transistor 124 .
  • controller 114 During operation of PFC boost circuit 100 , controller 114 provides a PWM (pulse width modulated) signal to the gate of silicon transistor 124 to control the on/off time of E-mode III-N switch 116 .
  • PWM pulse width modulated
  • E-mode III-N switch 116 When E-mode III-N switch 116 is turned on, current flows in a loop including E-mode III-N switch 116 and normally off switch 118 , thereby causing charge to be stored in E-mode III-N switch 116 and normally off switch 118 .
  • E-mode III-N switch 116 When E-mode III-N switch 116 is turned off, the stored charge stored in E-mode III-N switch 116 and normally off switch 118 needs to be dissipated. This stored charge, however, is significantly less than the stored charge if, in place of switches 116 and 118 , conventional switches were used—which resulted in significantly limiting the efficiency and operating frequency of, for example, a conventional PFC boost circuit.
  • a high voltage MOSFET is typically utilized in place of E-mode III-N switch 116 and a high voltage silicon diode is typically utilized in place of normally off switch 118 .
  • the high voltage MOSFET stores significantly more charge than E-mode III-N switch 116 and the high voltage silicon diode stores significantly more charge than normally off switch 118 .
  • an embodiment of the invention's PFC boost circuit 100 can significantly reduce the amount of stored charge that needs to be dissipated compared to a conventional PFC boost circuit. By reducing the amount of stored charge that needs to be dissipated, E-mode III-N switch 116 and normally off switch 118 cause PFC boost circuit 100 to provide an increased efficiency and an increased operating frequency compared to the conventional PFC boost circuit.
  • PFC boost circuit 100 can utilized smaller size passive components, such as capacitors and inductors, which can advantageously reduce the footprint of PFC boost circuit 100 , thereby advantageously reducing manufacturing cost.
  • FIG. 2 shows a circuit diagram of an exemplary E-mode III-nitride/Schottky switch in accordance with one embodiment of the present invention.
  • E-mode III-nitride/Schottky switch 216 (also referred to simply as “E-mode III-N/Schottky switch” 216 in the present application) can be utilized in place of E-mode III-N switch 116 in FIG. 1 .
  • E-mode III-N/Schottky switch 216 includes silicon transistor 224 , D-mode III-nitride device 226 , and Schottky diode 246 .
  • silicon transistor 224 and D-mode III-nitride device 226 correspond, respectively, to silicon transistor 124 and D-mode III-nitride device 126 in E-mode III-N switch 116 in FIG. 1 .
  • silicon transistor 124 can be a low voltage silicon FET, such as a low voltage silicon MOSFET
  • D-mode III-nitride device 226 can comprise a group III nitride semiconductor compound, such as aluminum nitride (AlN), indium nitride (InN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or indium aluminum gallium nitride (InAlGaN).
  • silicon transistor 224 is coupled with D-mode III-nitride device 226 between nodes 238 and 240 and Schottky diode 246 is coupled across silicon transistor 224 .
  • the anode of Schottky diode 246 is coupled to the source of silicon transistor 224 and the gate of D-mode III-nitride device 226 and the cathode of Schottky diode 246 is coupled to the drain of silicon transistor 224 and the source of D-mode III-nitride device 226 .
  • Schottky diode 246 can be a low voltage silicon Schottky diode in an embodiment of the present invention. In one embodiment, Schottky diode 246 can be integrated with silicon transistor 224 .
  • D-mode III-nitride device 226 is a normally on device. However, by coupling silicon transistor 224 with D-mode III-nitride device 226 as discussed above, silicon transistor 224 causes D-mode III-nitride device 226 to operate in an enhancement mode (E-mode). For example, when silicon transistor 224 is turned on, D-mode III-nitride device 226 is also turned on, thereby allowing current to flow through silicon transistor 224 and D-mode III-nitride device 226 . When silicon transistor 224 is turned off, D-mode III-nitride device 226 turns off as a result of a voltage that develops across silicon transistor 224 . By including the combination of silicon transistor 224 and D-mode III-nitride device 226 . E-mode III-N/Schottky switch 216 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • E-mode III-N/Schottky switch 216 provides reduced charge storage, thereby providing increased efficiency and increased operating
  • Schottky diode 246 also provides reduced charge storage, which provides increased efficiency and operating frequency. In addition, Schottky diode 246 provides reduced reverse recovery time (i.e. a faster reverse recovery).
  • an embodiment of the invention's E-mode III-N/Schottky switch 216 provides a high speed, high voltage switch having reduced charge storage, which provides increased efficiency and operating frequency, and also provides a faster reverse recovery time.
  • E-mode III-N/Schottky switch 216 can be advantageously utilized in high voltage applications, such as power conversion applications, to advantageously provide increased efficiency, increased operating frequency, and increased reverse recovery time compared to a high voltage silicon FET, such as a high voltage silicon MOSFET.
  • FIG. 3 shows a circuit diagram of an exemplary power factor correction boost circuit coupled between an AC power source and a load in accordance with another embodiment of the present invention.
  • PFC correction boost circuit 300 is substantially similar to PFC correction boost circuit 100 in FIG. 1 , with a difference being that E-mode III-nitride/Schottky switch 316 (also referred to simply as “E-mode III-N/Schottky switch” 316 in the present application) in PFC correction boost circuit 300 is utilized in place of E-mode III-N switch 116 in PFC correction boost circuit 100 .
  • E-mode III-N/Schottky switch 316 corresponds to E-mode III-N/Schottky switch 216 in FIG. 2 .
  • an embodiment of the invention's PFC correction boost circuit 300 provides similar advantages as PFC correction boost circuit 100 , such as increased efficiency and increased operating frequency. Also, the increased reverse recovery time provided by E-mode III-N/Schottky switch 316 can increase the operating speed of PFC correction boost circuit 300 .
  • FIG. 4 shows a circuit diagram of a half-bridge configuration in accordance with one embodiment of the present invention.
  • Half-bridge configuration 400 includes E-mode III-N/Schottky switches 416 a and 416 b, which are coupled between supply voltage 403 , which is a DC supply voltage, and ground 405 .
  • Each of E-mode III-N/Schottky switches 416 a and 416 b correspond to E-mode III-N/Schottky switch 216 in FIG. 2 .
  • Half-bridge configuration 400 includes output terminal 407 , which is coupled to E-mode III-N/Schottky switches 416 a and 416 b at node 409 .
  • half-bridge configuration 400 can also include other components, such as a controller, which are known in the art but not shown in FIG. 4 .
  • an embodiment of the invention provides a half-bridge configuration that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional half-bridge configuration that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • FIG. 5 shows a circuit diagram of a full-bridge configuration in accordance with one embodiment of the present invention.
  • Full-bridge configuration 500 includes E-mode III-N/Schottky switches 516 a, 516 b, 516 c, and 516 c, which are coupled between supply voltage 503 , which is a DC supply voltage, and ground 505 .
  • Each of E-mode III-N/Schottky switches 516 a, 516 b, 516 c, and 516 c correspond to E-mode III-N/Schottky switch 216 in FIG. 2 .
  • Full-bridge configuration 500 also includes inductor 507 , which has a first terminal that is coupled to E-mode III-N/Schottky switches 516 a and 516 b at node 509 and a second terminal that is coupled to E-mode III-N/Schottky switches 516 c and 516 d at node 511 .
  • Full-bridge configuration 500 also has output terminal 513 , which is coupled to node 511 . It is noted that full-bridge configuration 500 can also include other components, such as a controller, which are known in the art but not shown in FIG. 5 .
  • an embodiment of the invention provides a full-bridge configuration that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional full-bridge configuration that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • FIG. 6 shows a circuit diagram of a buck circuit in accordance with one embodiment of the present invention.
  • Buck circuit 600 includes E-mode III-N/Schottky switches 616 a and 616 b, DC power supply 621 , input capacitor 623 , which is a filter capacitor, buck inductor 625 , and buck capacitor 627 , which is also a filter capacitor.
  • each of E-mode III-N/Schottky switches 616 a and 616 b correspond to E-mode III-N/Schottky switch 216 in FIG. 2 .
  • Buck circuit 600 has output terminals 629 and 631 .
  • Buck circuit 600 can also include a controller (not shown in FIG. 6 ) for controlling the on/off times of E-mode III-N/Schottky switches 616 a and 616 b.
  • input capacitor 623 is coupled across DC power supply 621
  • E-mode III-N/Schottky switches 616 a and 616 b are coupled across input capacitor 623
  • buck inductor 625 and buck capacitor 627 are coupled together across E-mode III-N/Schottky switch 616 b.
  • Buck circuit 600 can operate in a manner known in the art.
  • E-mode III-N/Schottky switches 616 a and 616 b an embodiment of the invention provides a buck circuit that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional buck circuit that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • an embodiment of the invention's PFC boost circuit includes an E-mode III-N switch, which includes a silicon transistor coupled to a D-mode III-nitride device, and a normally off switch, which includes a Schottky diode coupled to a D-mode III-nitride device.
  • the embodiment of the invention's PFC boost circuit provides increased efficiency and increased operating frequency compared to a conventional PFC boost circuit utilizing a high voltage silicon transistor, such as a high voltage MOSFET, and a high voltage silicon diode.
  • an embodiment of the invention's E-mode III-N/Schottky switch includes a silicon transistor coupled with a D-mode III-nitride device and a Schottky diode coupled across the silicon transistor.
  • the embodiment of the invention's E-mode III-N/Schottky switch provides increased efficient and operating frequency and reduced reverse recovery time compared to a high voltage switch comprising a high voltage silicon transistor, such as a high voltage MOSFET.
  • the invention's E-mode III-N/Schottky switch is utilized in a PFC boost circuit, a half-bridge configuration, a full-bridge configuration, and a buck circuit, respectively, thereby advantageously providing increased efficient and operating frequency and faster recovery time.

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Abstract

According to one exemplary embodiment, an efficient and high speed E-mode N/Schottky switch includes a silicon transistor coupled with a D-mode III-nitride device, where the silicon transistor causes the D-mode III-nitride device to operate in an enhancement mode. The E-mode III-N/Schottky switch further includes a Schottky diode coupled across the silicon transistor so as to improve efficiency, recovery time, and speed of the E-mode III-N/Schottky switch. An anode of the Schottky diode can be coupled to a source of the silicon transistor and a cathode of the Schottky diode can he coupled to a drain of the silicon transistor. The Schottky diode can be integrated with the silicon transistor. In one embodiment the III-nitride device is a GaN device.

Description

    BACKGROUND OF THE INVENTION
  • The present application claims the benefit of and priority to a pending provisional patent application entitled “Power Factor Correction Boost Circuit using Enhanced Mode III-Nitride Power Device,” Ser. No. 61/050,730 filed on May 6, 2008. The disclosure in that pending provisional application is hereby incorporated fully by reference into the present application.
    • FIELD OF THE INVENTION
  • The present invention is generally in the field of switching circuits. More particularly, the invention is in the field of high voltage switching circuits.
    • BACKGROUND ART
  • High voltage circuits, such as power conversion circuits, typically require fast switches that are capable of handling high voltages without breaking down. Conventionally, silicon devices, such as high voltage silicon diodes and transistors, have been utilized to provide high voltage switches. For example, a high voltage silicon field effect transistor (FET), such as a high voltage metal oxide semiconductor FET (MOSFET), has been utilized as a high voltage switch in a power factor correction boost circuit.
  • When silicon devices, such as high voltage silicon diodes and transistors, are utilized as switches in high voltage circuits, such as power conversion circuits, they (i.e. the silicon devices) can store a large amount of charge when conducting current. When the silicon devices are turned off, the stored charge must be dissipated. However, the large amount of charge stored by the silicon devices, such as high voltage silicon diodes and transistors, can undesirably limit their efficiency and operating frequency. Consequently, the efficiency and operating frequency of high voltage circuits, such as power conversion circuits, can be undesirably limited by the use of silicon devices, such as high voltage silicon diodes and transistors, as high voltage switches.
    • SUMMARY OF THE INVENTION
  • Enhancement mode III-nitride switch with increased efficiency and operating frequency, substantially as shown in and/or described in connection with at least one of the figures, and as set forth more completely in the claims.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 illustrates a circuit diagram of a power factor correction boost circuit in accordance with one embodiment of the present invention.
  • FIG. 2 illustrates a circuit diagram of an exemplary E-mode III-nitride/Schottky switch in accordance with one embodiment of the present invention.
  • FIG. 3 illustrates a circuit diagram of a power factor correction boost circuit in accordance with another embodiment of the present invention.
  • FIG. 4 illustrates a circuit diagram of an exemplary half-bridge configuration utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
  • FIG. 5 illustrates a circuit diagram of an exemplary full-bridge configuration utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
  • FIG. 6 illustrates a circuit diagram of an exemplary buck circuit utilizing exemplary E-mode III-nitride/Schottky switches in accordance with one embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The present invention is directed to an enhancement mode III-nitride switch with increased efficiency and operating frequency. The following description contains specific information pertaining to the implementation of the present invention. One skilled in the art will recognize that the present invention may be implemented in a manner different from that specifically discussed in the present application. Moreover, some of the specific details of the invention are not discussed in order not to obscure the invention.
  • The drawings in the present application and their accompanying detailed description are directed to merely exemplary embodiments of the invention. To maintain brevity, other embodiments of the present invention are not specifically described in the present application and are not specifically illustrated by the present drawings.
  • FIG. 1 shows a circuit diagram of an exemplary power factor correction boost circuit coupled between an AC power source and a load in accordance with one embodiment of the present invention. Power factor correction (PFC) boost circuit 100 is coupled between AC power source 102, such as an AC line, and load 104 and includes full bridge rectifier 106, capacitors 108 and 110, inductor 112, controller 114, enhancement mode (E-mode) group III-nitride switch 116 (also referred to simply as “E-mode III-N switch” 116 in the present application), “normally off switch” 118, and resistors 120 and 122. E-mode III-N switch 116 includes silicon transistor 124 and depletion mode (D-mode) group III-nitride device 126 (also referred to simply as “D-mode III-nitride device” 126 in the present application) and normally off switch 118 includes Schottky diode 128 and D-mode III-nitride device 130. Load 104 can be, for example, a resistive load, an inductive load, such as a step-down transformer, or a capacitive load. Load 104 can be a load corresponding to a home appliance, such as a television set, for example.
  • As shown in FIG. 1, AC power source 102 is coupled to the inputs of full-bridge rectifier 106 at nodes 132 and 134, a first terminal of capacitor 108, which can be a filter capacitor, is coupled to a positive output of full bridge rectifier 106 and a first terminal of inductor 112, which can be a boost inductor, at node 136, and a second terminal of capacitor 108 is coupled to a negative output of full bridge rectifier 106 at node 138. Also shown in FIG. 1, a second terminal of inductor 112 is coupled to a first terminal of E-mode III-N switch 116 and a first terminal of normally off switch 118 at node 140 and a second terminal of E-mode III-N switch 116 is coupled to the negative output of full-bride rectifier 106 at node 138.
  • In E-mode III-N switch 116, silicon transistor 124 is coupled in series with D-mode III-nitride device 126, wherein the gate of D-mode III-nitride device 126 is coupled to the source of silicon transistor 124 and the drain of silicon transistor 124 is coupled to the source of D-mode III-nitride device 126. Silicon transistor 124 can be, for example, a low voltage silicon transistor, such as a silicon FET. In one embodiment, silicon transistor 124 can be a low voltage silicon MOSFET. D-mode III-nitride device 126 can comprise a group III nitride semiconductor compound, such as aluminum nitride (AlN), indium nitride (InN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or indium aluminum gallium nitride (InAlGaN). The aforementioned semiconductor compounds have a relatively wide direct bandgap that permits highly energetic electronic transitions to occur. D-mode III-nitride device 126 is a high voltage device and has reduced charge storage and a high mobility conduction channel, which enables it (i.e. D-mode III-nitride device 126) to conduct high current. As a result of reduced charge storage, D-mode III-nitride device 126 provides increased efficiency and increased operating frequency.
  • D-mode III-nitride device 126 is a normally on device. However, by coupling silicon transistor 124 in series with D-mode III-nitride device 126 as discussed above, silicon transistor 124 causes D-mode III-nitride device 126 to operate in an enhancement mode (E-mode). For example, when silicon transistor 124 is turned on, D-mode III-nitride device 126 is also turned on, thereby allowing current to flow through silicon transistor 124 and D-mode III-nitride device 126. When silicon transistor 124 is turned off, D-mode III-nitride device 126 turns off as a result of a voltage that develops across silicon transistor 124. By including the series-coupled combination of silicon transistor 124 and D-mode III-nitride device 126, E-mode III-N switch 116 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • In normally off switch 118, Schottky diode 128 is coupled in series with D-mode III-nitride device 130. In particular, the anode of Schottky diode 128 is coupled to the gate of D-mode III-nitride device 130 and the cathode of Schottky diode 128 is coupled to the source of D-mode III-nitride device 130. Schottky diode 128 can be a low voltage silicon diode in an embodiment of the present invention. D-mode III-nitride device 130, which is a high voltage device, can comprise similar group III nitride semiconductor compounds and provides similar advantages as D-mode III-nitride device 126. D-mode III-nitride device 130 is a normally on device. However, by coupling Schottky diode 128 in series with D-mode III-nitride device 130 as discussed above, Schottky diode 128 causes D-mode III-nitride device 130 to turn off when it (i.e. Schottky diode 128) is in a reverse mode (i.e. when current flows from cathode to anode).
  • For example, in a forward mode (i.e. when current flows from anode to cathode), Schottky diode 128 is turned on and D-mode III-nitride device 130 is also turned on. The voltage drop across Schottky diode 128 in the forward mode has a negligible effect on D-mode III-nitride device 130, which is a high voltage device. In the reverse mode, D-mode III-nitride device 130 turns off as a result of a voltage that develops across Schottky diode 128. Thus, the combination of Schottky diode 128 and D-mode III-nitride device 130 can operate as a high voltage diode, where the anode of Schottky diode 128 can be an “anode” of the high voltage diode and the drain of D-mode III-nitride device 130 can be a “cathode” of the high voltage diode. By including the series-coupled combination of Schottky diode 128 and D-mode III-nitride device 130, normally off switch 118 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • Further shown in FIG. 1, a second terminal of normally off switch 118 is coupled to first terminals of capacitor 110, which can be an output capacitor, resistor 120, and load 104, and second terminals of capacitor 110 and load 104 can be coupled to the negative output of full-bride rectifier 106 at node 138. Also shown in FIG. 1, a second terminal of resistor 120 is coupled to a first terminal of resistor 122 and a first input (i.e. a feedback input) of controller 114 at node 144 and a second terminal of resistor 122 is coupled to the negative output of full-bride rectifier 106 at node 138. Resistors 120 and 122 form a voltage divider, which provides a feedback signal to the feedback input of controller 114 at node at 144. Further shown in FIG. 1, an output of controller 114, which can be a PFC pulse width modulation (PWM) controller, is coupled to the gate of silicon transistor 124 and a second input of controller 114 is coupled to the negative output of full-bridge rectifier 106 at node 138. Controller 114 can be configured to control the on/off time of E-mode III-N switch 116 by providing a pulse width modulated signal to the gate of silicon transistor 124 to control the on/off time of silicon transistor 124.
  • During operation of PFC boost circuit 100, controller 114 provides a PWM (pulse width modulated) signal to the gate of silicon transistor 124 to control the on/off time of E-mode III-N switch 116. When E-mode III-N switch 116 is turned on, current flows in a loop including E-mode III-N switch 116 and normally off switch 118, thereby causing charge to be stored in E-mode III-N switch 116 and normally off switch 118. When E-mode III-N switch 116 is turned off, the stored charge stored in E-mode III-N switch 116 and normally off switch 118 needs to be dissipated. This stored charge, however, is significantly less than the stored charge if, in place of switches 116 and 118, conventional switches were used—which resulted in significantly limiting the efficiency and operating frequency of, for example, a conventional PFC boost circuit.
  • In a conventional PFC boost circuit, a high voltage MOSFET is typically utilized in place of E-mode III-N switch 116 and a high voltage silicon diode is typically utilized in place of normally off switch 118. However, the high voltage MOSFET stores significantly more charge than E-mode III-N switch 116 and the high voltage silicon diode stores significantly more charge than normally off switch 118. Thus, by utilizing E-mode III-N switch 116 and normally off switch 118, an embodiment of the invention's PFC boost circuit 100 can significantly reduce the amount of stored charge that needs to be dissipated compared to a conventional PFC boost circuit. By reducing the amount of stored charge that needs to be dissipated, E-mode III-N switch 116 and normally off switch 118 cause PFC boost circuit 100 to provide an increased efficiency and an increased operating frequency compared to the conventional PFC boost circuit.
  • Also, by operating at a higher frequency, PFC boost circuit 100 can utilized smaller size passive components, such as capacitors and inductors, which can advantageously reduce the footprint of PFC boost circuit 100, thereby advantageously reducing manufacturing cost.
  • FIG. 2 shows a circuit diagram of an exemplary E-mode III-nitride/Schottky switch in accordance with one embodiment of the present invention. In one embodiment of the present invention, E-mode III-nitride/Schottky switch 216 (also referred to simply as “E-mode III-N/Schottky switch” 216 in the present application) can be utilized in place of E-mode III-N switch 116 in FIG. 1. E-mode III-N/Schottky switch 216 includes silicon transistor 224, D-mode III-nitride device 226, and Schottky diode 246. In FIG. 2, silicon transistor 224 and D-mode III-nitride device 226 correspond, respectively, to silicon transistor 124 and D-mode III-nitride device 126 in E-mode III-N switch 116 in FIG. 1. Thus, silicon transistor 124 can be a low voltage silicon FET, such as a low voltage silicon MOSFET, and D-mode III-nitride device 226 can comprise a group III nitride semiconductor compound, such as aluminum nitride (AlN), indium nitride (InN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or indium aluminum gallium nitride (InAlGaN).
  • As shown in FIG. 2, silicon transistor 224 is coupled with D-mode III-nitride device 226 between nodes 238 and 240 and Schottky diode 246 is coupled across silicon transistor 224. In particular, the anode of Schottky diode 246 is coupled to the source of silicon transistor 224 and the gate of D-mode III-nitride device 226 and the cathode of Schottky diode 246 is coupled to the drain of silicon transistor 224 and the source of D-mode III-nitride device 226. Schottky diode 246 can be a low voltage silicon Schottky diode in an embodiment of the present invention. In one embodiment, Schottky diode 246 can be integrated with silicon transistor 224.
  • D-mode III-nitride device 226 is a normally on device. However, by coupling silicon transistor 224 with D-mode III-nitride device 226 as discussed above, silicon transistor 224 causes D-mode III-nitride device 226 to operate in an enhancement mode (E-mode). For example, when silicon transistor 224 is turned on, D-mode III-nitride device 226 is also turned on, thereby allowing current to flow through silicon transistor 224 and D-mode III-nitride device 226. When silicon transistor 224 is turned off, D-mode III-nitride device 226 turns off as a result of a voltage that develops across silicon transistor 224. By including the combination of silicon transistor 224 and D-mode III-nitride device 226. E-mode III-N/Schottky switch 216 provides reduced charge storage, thereby providing increased efficiency and increased operating frequency.
  • Schottky diode 246 also provides reduced charge storage, which provides increased efficiency and operating frequency. In addition, Schottky diode 246 provides reduced reverse recovery time (i.e. a faster reverse recovery). Thus, an embodiment of the invention's E-mode III-N/Schottky switch 216 provides a high speed, high voltage switch having reduced charge storage, which provides increased efficiency and operating frequency, and also provides a faster reverse recovery time. Thus, E-mode III-N/Schottky switch 216 can be advantageously utilized in high voltage applications, such as power conversion applications, to advantageously provide increased efficiency, increased operating frequency, and increased reverse recovery time compared to a high voltage silicon FET, such as a high voltage silicon MOSFET.
  • FIG. 3 shows a circuit diagram of an exemplary power factor correction boost circuit coupled between an AC power source and a load in accordance with another embodiment of the present invention. PFC correction boost circuit 300 is substantially similar to PFC correction boost circuit 100 in FIG. 1, with a difference being that E-mode III-nitride/Schottky switch 316 (also referred to simply as “E-mode III-N/Schottky switch” 316 in the present application) in PFC correction boost circuit 300 is utilized in place of E-mode III-N switch 116 in PFC correction boost circuit 100. In FIG. 3, E-mode III-N/Schottky switch 316 corresponds to E-mode III-N/Schottky switch 216 in FIG. 2. By utilizing E-mode III-N/Schottky switch 316 between nodes 338 and 340 in place of E-mode III-N switch 116, an embodiment of the invention's PFC correction boost circuit 300 provides similar advantages as PFC correction boost circuit 100, such as increased efficiency and increased operating frequency. Also, the increased reverse recovery time provided by E-mode III-N/Schottky switch 316 can increase the operating speed of PFC correction boost circuit 300.
  • FIG. 4 shows a circuit diagram of a half-bridge configuration in accordance with one embodiment of the present invention. Half-bridge configuration 400 includes E-mode III-N/Schottky switches 416 a and 416 b, which are coupled between supply voltage 403, which is a DC supply voltage, and ground 405. Each of E-mode III-N/Schottky switches 416 a and 416 b correspond to E-mode III-N/Schottky switch 216 in FIG. 2. Half-bridge configuration 400 includes output terminal 407, which is coupled to E-mode III-N/Schottky switches 416 a and 416 b at node 409. It is noted that half-bridge configuration 400 can also include other components, such as a controller, which are known in the art but not shown in FIG. 4.
  • By utilizing E-mode III-N/Schottky switches 416 a and 416 b, an embodiment of the invention provides a half-bridge configuration that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional half-bridge configuration that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • FIG. 5 shows a circuit diagram of a full-bridge configuration in accordance with one embodiment of the present invention. Full-bridge configuration 500 includes E-mode III-N/Schottky switches 516 a, 516 b, 516 c, and 516 c, which are coupled between supply voltage 503, which is a DC supply voltage, and ground 505. Each of E-mode III-N/Schottky switches 516 a, 516 b, 516 c, and 516 c correspond to E-mode III-N/Schottky switch 216 in FIG. 2. Full-bridge configuration 500 also includes inductor 507, which has a first terminal that is coupled to E-mode III-N/Schottky switches 516 a and 516 b at node 509 and a second terminal that is coupled to E-mode III-N/Schottky switches 516 c and 516 d at node 511. Full-bridge configuration 500 also has output terminal 513, which is coupled to node 511. It is noted that full-bridge configuration 500 can also include other components, such as a controller, which are known in the art but not shown in FIG. 5.
  • By utilizing E-mode III-N/Schottky switches 516 a, 516 b, 516 c, and 516 d, an embodiment of the invention provides a full-bridge configuration that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional full-bridge configuration that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • FIG. 6 shows a circuit diagram of a buck circuit in accordance with one embodiment of the present invention. Buck circuit 600 includes E-mode III-N/Schottky switches 616 a and 616 b, DC power supply 621, input capacitor 623, which is a filter capacitor, buck inductor 625, and buck capacitor 627, which is also a filter capacitor. In buck circuit 600, each of E-mode III-N/Schottky switches 616 a and 616 b correspond to E-mode III-N/Schottky switch 216 in FIG. 2. Buck circuit 600 has output terminals 629 and 631. Buck circuit 600 can also include a controller (not shown in FIG. 6) for controlling the on/off times of E-mode III-N/Schottky switches 616 a and 616 b.
  • As shown in FIG. 6, input capacitor 623 is coupled across DC power supply 621, E-mode III-N/Schottky switches 616 a and 616 b are coupled across input capacitor 623, and buck inductor 625 and buck capacitor 627 are coupled together across E-mode III-N/Schottky switch 616 b. Buck circuit 600 can operate in a manner known in the art. By utilizing E-mode III-N/Schottky switches 616 a and 616 b, an embodiment of the invention provides a buck circuit that advantageously provides increased efficiency and operating frequency and faster recovery time compared to a conventional buck circuit that utilizes switches comprising high voltage silicon transistors, such as high voltage MOSFETs.
  • As discussed above, in FIG. 1, an embodiment of the invention's PFC boost circuit includes an E-mode III-N switch, which includes a silicon transistor coupled to a D-mode III-nitride device, and a normally off switch, which includes a Schottky diode coupled to a D-mode III-nitride device. As a result, the embodiment of the invention's PFC boost circuit provides increased efficiency and increased operating frequency compared to a conventional PFC boost circuit utilizing a high voltage silicon transistor, such as a high voltage MOSFET, and a high voltage silicon diode.
  • In FIG. 2, an embodiment of the invention's E-mode III-N/Schottky switch includes a silicon transistor coupled with a D-mode III-nitride device and a Schottky diode coupled across the silicon transistor. As a result, the embodiment of the invention's E-mode III-N/Schottky switch provides increased efficient and operating frequency and reduced reverse recovery time compared to a high voltage switch comprising a high voltage silicon transistor, such as a high voltage MOSFET.
  • In FIGS. 3, 4, 5, and 6, the invention's E-mode III-N/Schottky switch is utilized in a PFC boost circuit, a half-bridge configuration, a full-bridge configuration, and a buck circuit, respectively, thereby advantageously providing increased efficient and operating frequency and faster recovery time.
  • From the above description of the invention it is manifest that various techniques can be used for implementing the concepts of the present invention without departing from its scope. Moreover, while the invention has been described with specific reference to certain embodiments, a person of ordinary skill in the art would appreciate that changes can be made in form and detail without departing from the spirit and the scope of the invention. Thus, the described embodiments are to be considered in all respects as illustrative and not restrictive. It should also be understood that the invention is not limited to the particular embodiments described herein but is capable of many rearrangements, modifications, and substitutions without departing from the scope of the invention.

Claims (21)

1. An efficient and high speed E-mode III-N/Schottky switch comprising:
a silicon transistor coupled with a D-mode III-nitride device, said silicon transistor causing said D-mode III-nitride device to operate in an enhancement mode;
a Schottky diode coupled across said silicon transistor;
said E-mode III-N/Schottky switch thereby achieving improved speed, efficiency, and reverse recovery time.
2. The E-mode III-N/Schottky switch of claim 1, wherein two of said E-mode III-N/Schottky switches are coupled between a supply voltage and a ground to form a half-bridge configuration.
3. The E-mode III-N/Schottky switch of claim 1, wherein four of said E-mode III-N/Schottky switches are coupled between a supply voltage and a ground to form a full-bridge configuration.
4. The E-mode III-N/Schottky switch of claim 3, wherein a first and a second of said E-mode III-N/Schottky switches are coupled between said supply voltage and respective first and second terminals of an inductor and a third and a fourth of said E-mode III-N/Schottky switches are coupled between said respective first and second terminals of said inductor and said ground.
5. The E-mode III-N/Schottky switch of claim 1, wherein a first said E-mode III-N/Schottky switch is coupled with a second said E-mode III-N/Schottky switch across a DC power source to form a buck circuit.
6. The E-mode III-N/Schottky switch of claim 5, wherein a buck inductor and a buck capacitor are coupled across said first said E-mode III-N/Schottky switch.
7. The E-mode III-N/Schottky switch of claim 1, wherein said silicon transistor is a low voltage FET.
8. The E-mode III-N/Schottky switch of claim 1, wherein said D-mode III-Nitride device is a GaN device.
9. The E-mode III-N/Schottky switch of claim 1, wherein an anode of said Schottky diode is coupled to a source of said silicon transistor and a cathode of said Schottky diode is coupled to a drain of said silicon transistor.
10. The E-mode III-N/Schottky switch of claim 1, wherein said Schottky diode is integrated with said silicon transistor.
11-20. (canceled)
21. An E-mode III-N/Schottky switch comprising:
a silicon transistor coupled with a D-mode III-nitride device, said silicon transistor causing said D-mode III-nitride device to operate in an enhancement mode;
a Schottky diode coupled across said silicon transistor;
said E-mode III-N/Schottky switch configured as a power switch in a power conversion circuit.
22. The E-mode III-N/Schottky switch of claim 21, wherein two of said E-mode III-N/Schottky switches are coupled between a supply voltage and a ground to form a half-bridge configuration.
23. The E-mode III-N/Schottky switch of claim 21, wherein four of said E-mode III-N/Schottky switches are coupled between a supply voltage and a ground to form a full-bridge configuration.
24. The E-mode III-N/Schottky switch of claim 21, wherein a first said E-mode III-N/Schottky switch is coupled with a second said E-mode III-N/Schottky switch across a DC power source to form a buck circuit.
25. The E-mode III-N/Schottky switch of claim 24, wherein a buck inductor and a buck capacitor are coupled across said first said E-mode III-N/Schottky switch.
26. The E-mode III-N/Schottky switch of claim 21, wherein said D-mode III-Nitride device is a GaN device.
27. An E-mode III-N/Schottky switch comprising:
a silicon transistor coupled with a D-mode III-nitride device, said silicon transistor causing said D-mode III-nitride device to operate in an enhancement mode;
a Schottky diode coupled across said silicon transistor;
said E-mode III-N/Schottky switch configured as a power switch in a power conversion circuit;
wherein a gate of said D-mode III-nitride device is connected to a source of said silicon transistor.
28. The E-mode III-N/Schottky switch of claim 27, wherein two of said E-mode III-N/Schottky switches are coupled between a supply voltage and a ground to form a half-bridge configuration.
29. The E-mode III-N/Schottky switch of claim 27, wherein a first said E-mode III-N/Schottky switch is coupled with a second said E-mode III-N/Schottky switch across a DC power source to form a buck circuit.
30. The E-mode III-N/Schottky switch of claim 27, wherein said D-mode III-Nitride device is a GaN device.
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