US20120298515A1 - Method and device for the wet-chemical treatment of material to be treated - Google Patents
Method and device for the wet-chemical treatment of material to be treated Download PDFInfo
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- US20120298515A1 US20120298515A1 US13/519,816 US201013519816A US2012298515A1 US 20120298515 A1 US20120298515 A1 US 20120298515A1 US 201013519816 A US201013519816 A US 201013519816A US 2012298515 A1 US2012298515 A1 US 2012298515A1
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- treatment
- treatment vessel
- inert gas
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- vessel
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Definitions
- the invention relates to a method and a device for the wet-chemical treatment of material to be treated.
- the invention relates in particular to such a device and such a method in which material to be treated is transported and treated with treatment liquid in a continuous process plant.
- treatment of the material to be treated frequently takes place in a wet-chemical process line.
- the material to be treated can be transported through one treatment module or a plurality of treatment modules in which it is treated with one treatment solution or, sequentially, with different treatment solutions.
- the treatment solution can be conveyed to the material to be treated by means of a pump and can be delivered via treatment members. Atmospheric oxygen can thereby enter the treatment solution.
- the introduction of oxygen can impair the treatment solution itself and/or the process of treating the material to be treated.
- the introduction of oxygen can promote oxidation processes in an electrolyte solution.
- An example of a treatment solution that can be affected by the introduction of oxygen is a tin solution.
- the introduction of oxygen from the air into a tin bath can lead to an accumulation of Sn(IV) ions as a result of oxidation of Sn(II) ions and to an accumulation of the Cu(I)-thiourea complex to a concentration at which the solubility limit is exceeded and the complex forms a precipitate.
- certain treatment solutions can be affected by the introduction of oxygen in such a manner that particles precipitate and a corresponding slurry forms in the treatment module. This can lead to a reduction in the service life of the bath, which means increased costs for chemicals and maintenance.
- the slurry can lead to damage to the material to be treated.
- the slurry can also settle in low-flow areas of the process line, and removal of the slurry can increase the outlay in terms of maintenance.
- the introduction of oxygen can also have the effect that harmful gases can form during the reaction with the material to be treated in the treatment solution, which gases remain dissolved in the bath and lead to a decrease in reactivity.
- a treatment solution in which the introduction of oxygen into the treatment solution has an adverse effect on the treatment solution itself, on the process of treating the material to be treated or on the operation of the process line or of a treatment module is referred to hereinbelow as an oxygen- or air-sensitive treatment solution.
- the object underlying the invention is to provide an improved method and an improved device for the treatment of material to be treated for a continuous process plant.
- a method and such a device in which a negative effect on the treatment solution and/or on the process of treating the material to be treated and/or on the operation of the process line or of a treatment module, which can result from the introduction of oxygen, is lessened.
- a method and such a device in which those problems can be lessened during the continuous operation of a continuous process plant without substantially affecting the treatment speed.
- the object is achieved by a method and a device as described in the independent claims.
- the dependent claims define preferred or advantageous embodiments of the invention.
- a method for the wet-chemical treatment of material to be treated in a continuous process plant in which method the material to be treated is transported through a treatment vessel and is treated in the treatment vessel with a treatment liquid.
- an inert gas is fed into the treatment vessel.
- the material to be treated can in particular be flat material to be treated, for example a printed circuit board, a conductive film, a sheet material or the like.
- the material to be treated can have a conductive structure.
- the treatment liquid can in particular be a solution in which the introduction of oxygen into the treatment solution has an adverse effect on the treatment solution itself and/or on the process of treating the material to be treated and/or on the operation of the process line or of a treatment module.
- the feeding of inert gas leads to displacement of atmospheric oxygen in the treatment vessel.
- the oxygen concentration in the treatment vessel can be reduced and the introduction of oxygen into the treatment liquid can accordingly be reduced.
- a gas cushion which contains a small fraction of oxygen or which contains no oxygen can be produced above a bath of the treatment liquid and immediately adjacent to the bath surface. This allows the introduction of oxygen into the treatment solution to be reduced in a continuous process plant in which the material to be treated is transported into the treatment vessel and out of the treatment vessel.
- the feeding of inert gas can take place in a region or regions of the treatment vessel which are spaced from the region or regions in which waste air is discharged from the treatment vessel.
- the inert gas can be fed into the treatment vessel in at least one first region of the treatment vessel, while the inert gas is discharged, for example removed by suction or drawn off, from the treatment vessel in a second region of the treatment vessel that is spaced from the first region. This makes it possible, by means of a suitable arrangement of the first region and of the second region, for oxygen to be displaced from the treatment vessel.
- the inert gas can be drawn off from the treatment module via an edge region of the treatment vessel.
- the edge region can be arranged on a section of a jacket of the treatment vessel which delimits the treatment module in the transport direction, for example on a separating wall between the treatment vessel and an adjacent treatment module in the continuous process plant.
- the feeding of inert gas into the treatment vessel can take place at least in a region that is spaced from the two sections of the jacket of the treatment vessel that delimit the treatment vessel in the transport direction, and in particular substantially centrally between them. This allows oxygen to be displaced over the length of the treatment vessel.
- the treatment vessel can have an inlet slot, through which the material to be treated is transported into the treatment vessel, and an outlet slot, through which the material to be treated is transported out of the treatment vessel, the inert gas being discharged from the treatment vessel through the inlet slot and/or the outlet slot.
- the inert gas can in particular be removed from the treatment vessel by suction through the inlet slot and through the outlet slot. This allows waste air to be discharged from the treatment vessel through one slot and, in particular, through two slots provided in the treatment vessel for the passage of the material to be treated. Ingress of air into the treatment vessel through those slots can accordingly be prevented.
- a pressure in a vapour space of the treatment vessel can be so adjusted that it is higher than an ambient pressure outside the treatment vessel.
- the ingress of atmospheric oxygen from the surroundings into the treatment vessel for example through the inlet slot and/or the outlet slot, can be reduced.
- the inert gas can be fed into the treatment vessel continuously. As a result, oxygen can be displaced from the treatment vessel during the continuous operation of a continuous process plant.
- the inert gas can be introduced at least into the treatment liquid in order to feed the inert gas into the treatment vessel. This enables oxygen dissolved in the treatment liquid or harmful gases dissolved in the treatment liquid, which form during the treatment process, to be expelled from the treatment liquid when the inert gas is fed into the treatment vessel.
- the inert gas can be introduced into the treatment liquid at a position that is arranged below a bath level of the treatment liquid.
- the inert gas can be introduced into the treatment liquid at a position that is arranged at least 10 mm, in particular at least 100 mm, below the bath level.
- the inert gas can be introduced into the treatment liquid in such a manner that swirling of the bath, or of the treatment liquid, is achieved.
- swirling of any slurry that may still be present in residual amounts can be achieved, so that filtering of the slurry is possible more simply. Maintenance intervals can thus be lengthened and higher availability of the process line can be achieved.
- the treatment vessel can have a sump in which the treatment liquid accumulates at least to a level and from which the treatment liquid is conveyed to a treatment member, the inert gas being introduced into the treatment vessel below the level.
- the inert gas can purposively be introduced into the treatment liquid in such a manner that treatment liquid having a low oxygen content is conveyed and delivered via one or more treatment members.
- oxygen and/or harmful gases can be expelled from a large fraction of the treatment liquid in the treatment vessel.
- the inert gas can be introduced into the treatment liquid in particular in an intake region of a conveyor device which conveys the treatment liquid to a treatment member.
- the inert gas can be introduced into the treatment liquid accumulated in the sump at a position or in a region at or in which there is a large amount of liquid flowing to a conveyor device that circulates the treatment liquid and/or at or in which there is a finite flow velocity to an intake opening of the conveyor device.
- the inert gas can be introduced into the treatment liquid accumulated in the sump at a position or in a region which is arranged in the sump higher than an intake opening of the conveyor device. It is thereby possible to avoid the intake of gas bubbles, which could damage the conveyor device.
- a feed device for feeding the inert gas, in particular for introducing the inert gas into the treatment liquid can be configured such that the inert gas is introduced in the form of fine bubbles.
- the feed device can have a porous frit via which the inert gas is introduced into the treatment liquid.
- the feed device can also have a feed section provided with an arrangement of small holes via which the inert gas is introduced into the treatment liquid.
- the frit or the delivery section can be in the form of a tubular plastics part.
- a volume flow rate of the inert gas fed to the treatment vessel can be established in order to achieve a desired oxygen concentration in a vapour space of the treatment vessel.
- the volume flow rate can be controlled, for example in dependence on known dimensions and operating parameters of the treatment vessel.
- the volume flow rate can also be adjusted, for example in dependence on an output signal of a sensor which measures an oxygen concentration or another gas concentration in the vapour space of the treatment module.
- the volume flow rate of the inert gas fed to the treatment vessel can be established such that the oxygen concentration in a vapour space of the treatment vessel above the bath level is less than 10 vol. %, in particular less than 5 vol. %, in particular less than 2 vol. %.
- the volume flow rate of the inert gas fed to the treatment vessel can be so established that the oxygen concentration in a vapour space of the treatment vessel above the bath level is in the range from 0.1 to 15 vol. %, in particular in the range from 3 to 12 vol. %, in particular in the range from 4 to 8 vol. %. It has been shown that, even with such a residual concentration of oxygen, problems that can occur when the material to be treated is treated with an oxygen- or air-sensitive treatment solution can successfully be reduced.
- the amount of inert gas fed to the treatment vessel per unit time can be established such that an amount of waste air discharged from the treatment vessel per unit time is at least 80% of the sum of the inert gas supplied per unit time and an amount of vapour formed per unit time by evaporation of the treatment liquid.
- the amount of waste air discharged from the treatment vessel per unit time can be at least 90%, in particular at least 100%, of that sum.
- the amount of waste air removed from the treatment vessel per unit time can be from 80% to 120% of that sum. In that manner, vapours that form can safely be removed by suction.
- the volume flow rate of inert gas fed to the treatment vessel can be established such that a ratio between the volume flow rate, measured in m 3 /h, and a volume of treatment liquid, measured in m 3 , present in the treatment vessel is less than 20:1, in particular less than 10:1.
- Such volume flow rates of inert gas allow problems that can occur when the material to be treated is treated with an oxygen- or air-sensitive treatment solution to be prevented and the consumption of inert gas to be kept sufficiently low.
- the treatment vessel can have maintenance and service openings, each of which can be provided with at least one closing element.
- the at least one closing element can be provided with a gasket. This allows the ingress of oxygen from the surroundings of the treatment vessel via the maintenance and service openings to be prevented.
- a device for the wet-chemical treatment of material to be treated in particular of flat material to be treated, is provided.
- the device comprises a treatment vessel for treating the material to be treated with a treatment liquid, a transport device for transporting the material to be treated through the treatment vessel, and a feed device for feeding an inert gas into the treatment vessel.
- the device is configured to feed inert gas into the treatment vessel, atmospheric oxygen in the treatment vessel can be displaced.
- the device is accordingly configured to reduce the oxygen concentration in the treatment vessel and accordingly the introduction of oxygen into the treatment liquid.
- a gas cushion which contains a small fraction of oxygen or no oxygen can be produced above a bath of the treatment liquid and immediately adjacent to the bath surface. This allows the introduction of oxygen into the treatment solution in a continuous process plant to be reduced.
- the device can be configured to carry out the method according to the various exemplary embodiments described herein, it being possible for the effects described in connection with the corresponding embodiments of the method to be achieved.
- Embodiments of the device are also described in the dependent claims, it being possible in each case for effects described in connection with the corresponding embodiments of the method to be achieved.
- an article in particular a printed circuit board or a conductive foil, which has been treated by the method according to an aspect or exemplary embodiment.
- Methods and devices according to various exemplary embodiments of the invention allow the introduction of oxygen into a treatment liquid to be reduced.
- problems that can result from the introduction of oxygen into the treatment liquid can be lessened by means of methods and devices according to various exemplary embodiments.
- Exemplary embodiments of the invention can be used in plants in which material to be treated is transported, for example in plants for the chemical, in particular electrochemical, treatment of printed circuit boards, foil-like material, strip conductors or the like.
- the exemplary embodiments are not limited to that field of application, however.
- FIG. 1 is a schematic sectional view of a device for the treatment of flat material to be treated, according to one exemplary embodiment.
- FIG. 2 is a further schematic sectional view of the device of FIG. 1 .
- the exemplary embodiments are described within the context of a plant for the treatment of material to be treated in which the material to be treated is transported in a horizontal transport plane.
- directions or positions relating to the material to be treated are described in relation to the transport direction.
- the direction which is parallel, or antiparallel, to the transport direction on transport of the material to be treated is referred to as the longitudinal direction.
- FIG. 1 and FIG. 2 show schematic sectional views of a device 1 for the treatment of flat material to be treated 10 , which can be, for example, a printed circuit, such as a printed circuit board, conductive foil or the like.
- a device 1 for the treatment of flat material to be treated 10 can be, for example, a printed circuit, such as a printed circuit board, conductive foil or the like.
- the drawing plane is oriented orthogonally to the transport direction 25
- the drawing plane is oriented parallel to the transport direction 25 .
- the device 1 comprises a treatment module having a treatment vessel 2 in which the material to be treated is treated with a treatment liquid.
- the treatment liquid can in particular be an oxygen- or air-sensitive treatment solution, for example a chemical tin bath.
- the treatment module with the treatment vessel 2 can be part of a process line having further treatment modules 31 , 32 , which are arranged adjacent to the treatment module with the treatment vessel 2 and in which the material to be treated 10 is respectively treated with a different process chemical or with a rinsing liquid.
- the material to be treated 10 can be brought into contact with the treatment liquid in a conventional manner.
- the treatment vessel 2 can have a sump 3 in which the treatment liquid 9 accumulates to a level 17 .
- a further region in the treatment vessel 2 which is referred to hereinbelow as the vapour space 4 , is not filled with treatment liquid and can contain various gases.
- the vapour space 4 can be defined as the partial volume of the treatment vessel 2 that is not filled with liquid.
- evaporated treatment liquid can also be contained in the gas phase.
- the treatment vessel 2 has a housing which defines a jacket of the treatment vessel 2 but does not have to be gas-tight.
- the housing in a separating wall 35 which delimits the treatment vessel 2 from the adjacent treatment module 31 in the transport direction 25 , the housing can have an inlet slot 26 via which the material to be treated 10 is transported into the treatment vessel 2 .
- the housing in a further separating wall 36 which delimits the treatment vessel 2 at its opposite end from the adjacent treatment module 32 in the transport direction 25 , the housing can have an outlet slot 27 via which the material to be treated 10 is transported out of the treatment vessel 2 .
- a transport device which comprises transport elements, for example pairs of transport rollers 24 , is provided for conveying the material to be treated 10 through the treatment vessel 2 .
- an intake opening 6 with which treatment liquid is conveyed by a conveyor device, for example a pump 5 , from the sump 3 of the treatment vessel 2 .
- the pump 5 conveys the treatment liquid from the sump 3 to treatment members 7 , 8 , which can comprise a flow nozzle, swell nozzle, spray nozzle or the like.
- the treatment liquid is delivered from the treatment members 7 , 8 in order to treat with the treatment liquid the material to be treated 10 guided past the treatment members 7 , 8 . From the treatment members 7 , 8 , or from the material to be treated 10 , the treatment liquid can flow back into the sump 3 in order to be circulated by the pump 5 again.
- the device 1 is further configured such that an inert gas can be fed into the treatment vessel 2 .
- the inert gas that is fed can be nitrogen or carbon dioxide, for example.
- the device 1 has a feed device 11 for feeding the inert gas.
- the feed device 11 has a plurality of feed elements 12 a, 12 b, 12 c, from which the inert gas 16 can be delivered, below the level 17 , into the treatment liquid 9 accumulated in the sump 3 of the treatment vessel 2 .
- the feed elements 12 a, 12 b , 12 c of the feed device 11 are so positioned that they deliver the inert gas below the level 17 to which the treatment liquid 9 at least accumulates in the sump 3 during operation of the device 1 .
- the feed elements 12 a, 12 b, 12 c of the feed device 11 can in particular be so positioned that they deliver the inert gas into the treatment liquid 9 at least 10 mm, in particular at least 100 mm, below the level 17 .
- the feed elements 12 a, 12 b, 12 c of the feed device 11 are further so positioned that they deliver the inert gas to the treatment liquid above the intake opening through which the pump 5 conveys the treatment liquid from the sump 3 .
- At least one feed element 12 b of the feed device 11 is arranged at a distance in the longitudinal direction of the treatment vessel 2 from the two separating walls 35 , 36 which delimit the treatment vessel 2 in the transport direction 25 .
- the feed element 12 b of the feed device 11 can in particular be so arranged that it is in any case capable of delivering inert gas 16 into the treatment liquid 9 also at a middle position between the two separating walls 35 , 36 .
- the inert gas is fed into the treatment vessel 2 by the feed element 12 b at a position that is spaced from the inlet slot 26 and the outlet slot 27 in the longitudinal direction of the treatment vessel 2 .
- the feed elements 12 a, 12 c of the feed device 11 are also arranged at a distance, in the longitudinal direction of the treatment vessel 2 , from the separating walls 35 , 36 which delimit the treatment vessel 2 in the transport direction 25 and feed the inert gas 16 into the treatment vessel at a position that is remote from the inlet slot 26 and the outlet slot 27 in the longitudinal direction of the treatment vessel 2 .
- At least one feed element 12 b of the feed device 11 and advantageously all the feed elements 12 a, 12 b, 12 c of the feed device 11 , are so positioned in the treatment vessel that they deliver the inert gas 16 into the treatment liquid 9 accumulated in the sump 3 at the location where a comparatively large amount of the treatment liquid is rapidly being transported via the intake opening 6 to the pump 5 .
- the feed elements 12 a, 12 b , 12 c can be so positioned that they deliver the inert gas 16 into the treatment liquid 9 accumulated in the sump 3 at the location where the accumulated treatment liquid 9 has a finite flow velocity 18 with which the treatment liquid 9 flows to the intake opening 6 .
- a concentration of oxygen or harmful gases in the treatment liquid 9 can be reduced before the treatment liquid 9 is fed to the material to be treated 10 and is circulated.
- the swirling of the accumulated treatment liquid 9 resulting from the introduction of inert gas can prevent particles suspended in the treatment liquid from settling and can thus facilitate filtering.
- the feed elements 12 a, 12 b, 12 c of the feed device 11 can each be in the form of a porous frit.
- the feed elements 12 a, 12 b, 12 c of the feed device 11 can each have an arrangement of small holes through which the inert gas 16 is delivered into the treatment liquid 9 .
- the feed elements 12 a, 12 b, 12 c can be in the form of plastics parts, in particular in the form of tubular plastics parts.
- a controllable device or a controllable element 13 for example a controllable valve, is provided in a feed pipe for the inert gas.
- a volume flow rate of the inert gas from an inert gas reservoir 14 to the feed elements 12 a, 12 b, 12 c can be established.
- a control means 15 is coupled with the controllable device 13 in order to control or adjust the volume flow rate.
- the control means 15 can be coupled with a sensor 37 or with a plurality of sensors 37 in the treatment vessel.
- the sensor 37 or the sensors can be configured to detect the concentration of at least one gas in the vapour space 4 .
- the senor 37 can be configured to detect the concentration of oxygen in the vapour space 4 above the accumulated treatment liquid 9 and to supply a signal indicative of the concentration to the control means 15 .
- the sensor 37 can be configured to detect the concentration of inert gas in the vapour space 4 and supply a signal indicative of the concentration to the control means 15 .
- the sensor 37 or the sensors can be configured such that they measure the concentration or concentrations of the corresponding gases above the level 17 of the treatment liquid, in particular just above the level 17 of the treatment liquid.
- the control means 15 can supply a control signal to the controllable device 13 in response to the detected concentration, in order to adjust the volume flow rate of the inert gas fed into the treatment vessel 2 in dependence on the concentration.
- control means 15 can control the volume flow rate of the fed inert gas in dependence on known geometric properties of the treatment vessel 2 and on operating parameters of the device 1 , which can include, for example, the amount of treatment liquid 9 in the treatment vessel 2 .
- Adjusting the volume flow rate of inert gas fed into the treatment vessel by means of the control means 15 allows the volume flow rate, or the amount, of inert gas that is fed in to be so chosen that it is as small as possible.
- the volume flow rate of inert gas that is fed can in particular be so chosen that a desired oxygen concentration is achieved in the vapour space 4 of the treatment vessel 2 with the supply of as little inert gas as possible.
- the feeding of inert gas can be so adjusted that an oxygen concentration of zero does not necessarily have to be achieved. For example, it has been shown that satisfactory results in respect of the introduction of oxygen into the treatment liquid can be achieved if the oxygen concentration in the vapour space 4 above the bath level 17 is less than 10 vol. %, in particular less than 5 vol.
- the feeding of inert gas can be so adjusted that the oxygen concentration in the vapour space 4 above the bath level 17 is in the range from 0.1 to 15 vol. %, in particular in the range from 3 to 12 vol. %, in particular in the range from 4 to 8 vol. %.
- control means 15 can adjust the feeding of inert gas in such a manner that a ratio between the volume flow rate of the fed inert gas, measured in m 3 /h, and a volume of treatment liquid present in the treatment vessel, measured in m 3 , is less than 20:1, in particular less than 10:1.
- waste air can be removed from the treatment vessel 2 via the inlet slot 26 and the outlet slot 27 through which the material to be treated 10 is transported into the treatment vessel 2 and out of the treatment vessel 2 .
- the stream of waste air 29 through the inlet slot 26 and the stream of waste air 30 through the outlet slot 27 can substantially contain supplied inert gas 28 , which flows in the vapour space 4 to the inlet and outlet slots 26 , 27 , evaporated treatment liquid as well as amounts of harmful gases or air that has been drawn into the treatment vessel 2 .
- Air can pass into the treatment vessel 2 via areas that are not leak-tight, for example.
- maintenance and service openings of the treatment vessel 2 can be provided with gaskets.
- the treatment vessel 2 can, for example, have a maintenance opening 21 , shown diagrammatically, which can be closed by means of a cover 22 .
- the cover 22 has a gasket 23 in order to prevent the ingress of air.
- the device 1 can be configured such that the waste air 29 , 30 flows from the treatment vessel 2 into the adjacent treatment modules 31 , 32 .
- a finite flow velocity of gases through the inlet slot 26 and the outlet slot 27 can be established in the device 1 , the flow velocity being so oriented that the gases flow from the treatment vessel 2 into the adjacent treatment modules 31 , 32 .
- the waste air can be removed by suction from the treatment vessel 2 via the upstream and downstream treatment modules 31 , 32 .
- the regions of the treatment vessel 2 at which the feed elements 12 a , 12 b, 12 c feed the inert gas 16 into the treatment vessel 2 are arranged at a distance from the inlet slot 26 and the outlet slot 27 in the transport direction 25 . This assists the distribution of the inert gas 16 along the longitudinal direction of the treatment vessel 2 , and accordingly the displacement of oxygen.
- a suction power and/or the supply of inert gas into the treatment vessel 2 can be so established that air is prevented from entering into the treatment vessel 2 via the inlet and outlet slots 26 , 27 .
- the suction power can be so chosen that the amount of waste air 26 , 27 removed by suction per unit time is at least equal to the amount of inert gas supplied per unit time plus the amount of treatment liquid evaporated per unit time.
- a device has been described in which the material to be treated is transported horizontally; however, it is also possible in further exemplary embodiments for the material to be treated to be transported in a vertical plane.
- inert gas is discharged into the treatment liquid accumulated in the sump; however, it is also possible in further exemplary embodiments, alternatively or in addition, for the inert gas to be fed into the treatment vessel at a position or in a region in which no treatment liquid is accumulated.
- treatment members are provided above the liquid level of the accumulated treatment liquid; however, it is also possible in further exemplary embodiments for the material to be treated to be subjected to a dipping treatment. It is not necessarily required that separate treatment members which apply the treatment liquid to the material to be treated are provided.
- the devices and methods according to the various exemplary embodiments can be used in the treatment of articles having conductive structures, such as, for example, printed circuit boards, conductive foils, solar cells or components for solar cells and the like, without their use being limited thereto.
- the devices and methods according to the various exemplary embodiments can be used in particular in the treatment of material to be treated with oxygen- or air-sensitive treatment solution.
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- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Treating Waste Gases (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Treatment Of Fiber Materials (AREA)
- Gas Separation By Absorption (AREA)
Abstract
Description
- The invention relates to a method and a device for the wet-chemical treatment of material to be treated. The invention relates in particular to such a device and such a method in which material to be treated is transported and treated with treatment liquid in a continuous process plant.
- In the processing of flat material to be treated, such as, for example, printed circuit boards in the printed circuit board industry, treatment of the material to be treated frequently takes place in a wet-chemical process line. In a continuous process plant, the material to be treated can be transported through one treatment module or a plurality of treatment modules in which it is treated with one treatment solution or, sequentially, with different treatment solutions. The treatment solution can be conveyed to the material to be treated by means of a pump and can be delivered via treatment members. Atmospheric oxygen can thereby enter the treatment solution.
- In some treatment solutions, the introduction of oxygen can impair the treatment solution itself and/or the process of treating the material to be treated. For example, the introduction of oxygen can promote oxidation processes in an electrolyte solution. An example of a treatment solution that can be affected by the introduction of oxygen is a tin solution. In EP 545 216 A2, for example, it is described that the introduction of oxygen from the air into a tin bath can lead to an accumulation of Sn(IV) ions as a result of oxidation of Sn(II) ions and to an accumulation of the Cu(I)-thiourea complex to a concentration at which the solubility limit is exceeded and the complex forms a precipitate.
- In general, certain treatment solutions can be affected by the introduction of oxygen in such a manner that particles precipitate and a corresponding slurry forms in the treatment module. This can lead to a reduction in the service life of the bath, which means increased costs for chemicals and maintenance. The slurry can lead to damage to the material to be treated. The slurry can also settle in low-flow areas of the process line, and removal of the slurry can increase the outlay in terms of maintenance.
- The introduction of oxygen can also have the effect that harmful gases can form during the reaction with the material to be treated in the treatment solution, which gases remain dissolved in the bath and lead to a decrease in reactivity.
- A treatment solution in which the introduction of oxygen into the treatment solution has an adverse effect on the treatment solution itself, on the process of treating the material to be treated or on the operation of the process line or of a treatment module is referred to hereinbelow as an oxygen- or air-sensitive treatment solution.
- In order to lessen the effects of the introduction of oxygen into a treatment solution, it is proposed in DE 101 32 478 C1 to bring baths into contact with metallic tin, for example, and thereby regenerate them. Metal ions in a high oxidation state are thereby reduced to metal ions in a low oxidation state. A corresponding regenerator is to be provided for that purpose.
- The object underlying the invention is to provide an improved method and an improved device for the treatment of material to be treated for a continuous process plant. In particular, there is a need for such a method and such a device in which a negative effect on the treatment solution and/or on the process of treating the material to be treated and/or on the operation of the process line or of a treatment module, which can result from the introduction of oxygen, is lessened. In particular, there is a need for such a method and such a device in which those problems can be lessened during the continuous operation of a continuous process plant without substantially affecting the treatment speed.
- According to the invention, the object is achieved by a method and a device as described in the independent claims. The dependent claims define preferred or advantageous embodiments of the invention.
- According to one aspect, a method for the wet-chemical treatment of material to be treated in a continuous process plant is provided, in which method the material to be treated is transported through a treatment vessel and is treated in the treatment vessel with a treatment liquid. According to the invention, an inert gas is fed into the treatment vessel.
- The material to be treated can in particular be flat material to be treated, for example a printed circuit board, a conductive film, a sheet material or the like. The material to be treated can have a conductive structure. The treatment liquid can in particular be a solution in which the introduction of oxygen into the treatment solution has an adverse effect on the treatment solution itself and/or on the process of treating the material to be treated and/or on the operation of the process line or of a treatment module.
- The feeding of inert gas leads to displacement of atmospheric oxygen in the treatment vessel. In the method, the oxygen concentration in the treatment vessel can be reduced and the introduction of oxygen into the treatment liquid can accordingly be reduced. In particular, a gas cushion which contains a small fraction of oxygen or which contains no oxygen can be produced above a bath of the treatment liquid and immediately adjacent to the bath surface. This allows the introduction of oxygen into the treatment solution to be reduced in a continuous process plant in which the material to be treated is transported into the treatment vessel and out of the treatment vessel.
- The feeding of inert gas can take place in a region or regions of the treatment vessel which are spaced from the region or regions in which waste air is discharged from the treatment vessel. For example, the inert gas can be fed into the treatment vessel in at least one first region of the treatment vessel, while the inert gas is discharged, for example removed by suction or drawn off, from the treatment vessel in a second region of the treatment vessel that is spaced from the first region. This makes it possible, by means of a suitable arrangement of the first region and of the second region, for oxygen to be displaced from the treatment vessel.
- The inert gas can be drawn off from the treatment module via an edge region of the treatment vessel. The edge region can be arranged on a section of a jacket of the treatment vessel which delimits the treatment module in the transport direction, for example on a separating wall between the treatment vessel and an adjacent treatment module in the continuous process plant. The feeding of inert gas into the treatment vessel can take place at least in a region that is spaced from the two sections of the jacket of the treatment vessel that delimit the treatment vessel in the transport direction, and in particular substantially centrally between them. This allows oxygen to be displaced over the length of the treatment vessel.
- The treatment vessel can have an inlet slot, through which the material to be treated is transported into the treatment vessel, and an outlet slot, through which the material to be treated is transported out of the treatment vessel, the inert gas being discharged from the treatment vessel through the inlet slot and/or the outlet slot. The inert gas can in particular be removed from the treatment vessel by suction through the inlet slot and through the outlet slot. This allows waste air to be discharged from the treatment vessel through one slot and, in particular, through two slots provided in the treatment vessel for the passage of the material to be treated. Ingress of air into the treatment vessel through those slots can accordingly be prevented.
- A pressure in a vapour space of the treatment vessel can be so adjusted that it is higher than an ambient pressure outside the treatment vessel. As a result, the ingress of atmospheric oxygen from the surroundings into the treatment vessel, for example through the inlet slot and/or the outlet slot, can be reduced.
- The inert gas can be fed into the treatment vessel continuously. As a result, oxygen can be displaced from the treatment vessel during the continuous operation of a continuous process plant.
- The inert gas can be introduced at least into the treatment liquid in order to feed the inert gas into the treatment vessel. This enables oxygen dissolved in the treatment liquid or harmful gases dissolved in the treatment liquid, which form during the treatment process, to be expelled from the treatment liquid when the inert gas is fed into the treatment vessel.
- The inert gas can be introduced into the treatment liquid at a position that is arranged below a bath level of the treatment liquid. In particular, the inert gas can be introduced into the treatment liquid at a position that is arranged at least 10 mm, in particular at least 100 mm, below the bath level. As a result, foam formation can be prevented, uniform bubble distribution can be achieved, and a long contact time between inert gas bubbles and the bath of treatment liquid can be achieved.
- Furthermore, the inert gas can be introduced into the treatment liquid in such a manner that swirling of the bath, or of the treatment liquid, is achieved. As a result, swirling of any slurry that may still be present in residual amounts can be achieved, so that filtering of the slurry is possible more simply. Maintenance intervals can thus be lengthened and higher availability of the process line can be achieved.
- The treatment vessel can have a sump in which the treatment liquid accumulates at least to a level and from which the treatment liquid is conveyed to a treatment member, the inert gas being introduced into the treatment vessel below the level. As a result, the inert gas can purposively be introduced into the treatment liquid in such a manner that treatment liquid having a low oxygen content is conveyed and delivered via one or more treatment members.
- In that manner, oxygen and/or harmful gases can be expelled from a large fraction of the treatment liquid in the treatment vessel.
- The inert gas can be introduced into the treatment liquid in particular in an intake region of a conveyor device which conveys the treatment liquid to a treatment member. In particular, the inert gas can be introduced into the treatment liquid accumulated in the sump at a position or in a region at or in which there is a large amount of liquid flowing to a conveyor device that circulates the treatment liquid and/or at or in which there is a finite flow velocity to an intake opening of the conveyor device.
- The inert gas can be introduced into the treatment liquid accumulated in the sump at a position or in a region which is arranged in the sump higher than an intake opening of the conveyor device. It is thereby possible to avoid the intake of gas bubbles, which could damage the conveyor device.
- A feed device for feeding the inert gas, in particular for introducing the inert gas into the treatment liquid, can be configured such that the inert gas is introduced in the form of fine bubbles. The feed device can have a porous frit via which the inert gas is introduced into the treatment liquid. The feed device can also have a feed section provided with an arrangement of small holes via which the inert gas is introduced into the treatment liquid. The frit or the delivery section can be in the form of a tubular plastics part. When the inert gas is introduced into the treatment liquid in the form of fine bubbles, a high degree of inert gas use can be achieved. In addition, undesirable splashes can be reduced.
- A volume flow rate of the inert gas fed to the treatment vessel can be established in order to achieve a desired oxygen concentration in a vapour space of the treatment vessel. The volume flow rate can be controlled, for example in dependence on known dimensions and operating parameters of the treatment vessel. The volume flow rate can also be adjusted, for example in dependence on an output signal of a sensor which measures an oxygen concentration or another gas concentration in the vapour space of the treatment module.
- The volume flow rate of the inert gas fed to the treatment vessel can be established such that the oxygen concentration in a vapour space of the treatment vessel above the bath level is less than 10 vol. %, in particular less than 5 vol. %, in particular less than 2 vol. %.
- In the method and the device, it is not necessary to lower the oxygen concentration in the vapour space of the treatment vessel to 0 vol. %. In an exemplary embodiment, the volume flow rate of the inert gas fed to the treatment vessel can be so established that the oxygen concentration in a vapour space of the treatment vessel above the bath level is in the range from 0.1 to 15 vol. %, in particular in the range from 3 to 12 vol. %, in particular in the range from 4 to 8 vol. %. It has been shown that, even with such a residual concentration of oxygen, problems that can occur when the material to be treated is treated with an oxygen- or air-sensitive treatment solution can successfully be reduced.
- The amount of inert gas fed to the treatment vessel per unit time can be established such that an amount of waste air discharged from the treatment vessel per unit time is at least 80% of the sum of the inert gas supplied per unit time and an amount of vapour formed per unit time by evaporation of the treatment liquid. The amount of waste air discharged from the treatment vessel per unit time can be at least 90%, in particular at least 100%, of that sum. In an exemplary embodiment, the amount of waste air removed from the treatment vessel per unit time can be from 80% to 120% of that sum. In that manner, vapours that form can safely be removed by suction.
- The volume flow rate of inert gas fed to the treatment vessel can be established such that a ratio between the volume flow rate, measured in m3/h, and a volume of treatment liquid, measured in m3, present in the treatment vessel is less than 20:1, in particular less than 10:1. Such volume flow rates of inert gas allow problems that can occur when the material to be treated is treated with an oxygen- or air-sensitive treatment solution to be prevented and the consumption of inert gas to be kept sufficiently low.
- The treatment vessel can have maintenance and service openings, each of which can be provided with at least one closing element. The at least one closing element can be provided with a gasket. This allows the ingress of oxygen from the surroundings of the treatment vessel via the maintenance and service openings to be prevented.
- Nitrogen or carbon dioxide, for example, can be used as the inert gas.
- According to a further aspect, a device for the wet-chemical treatment of material to be treated, in particular of flat material to be treated, is provided. The device comprises a treatment vessel for treating the material to be treated with a treatment liquid, a transport device for transporting the material to be treated through the treatment vessel, and a feed device for feeding an inert gas into the treatment vessel.
- Because the device is configured to feed inert gas into the treatment vessel, atmospheric oxygen in the treatment vessel can be displaced. The device is accordingly configured to reduce the oxygen concentration in the treatment vessel and accordingly the introduction of oxygen into the treatment liquid. In particular, a gas cushion which contains a small fraction of oxygen or no oxygen can be produced above a bath of the treatment liquid and immediately adjacent to the bath surface. This allows the introduction of oxygen into the treatment solution in a continuous process plant to be reduced.
- The device can be configured to carry out the method according to the various exemplary embodiments described herein, it being possible for the effects described in connection with the corresponding embodiments of the method to be achieved. Embodiments of the device are also described in the dependent claims, it being possible in each case for effects described in connection with the corresponding embodiments of the method to be achieved.
- According to a further aspect of the invention there is provided an article, in particular a printed circuit board or a conductive foil, which has been treated by the method according to an aspect or exemplary embodiment.
- Methods and devices according to various exemplary embodiments of the invention allow the introduction of oxygen into a treatment liquid to be reduced. In particular, in a continuous process plant in which material to be treated is transported into a treatment vessel and, after treatment with the treatment liquid, is transported out of the treatment vessel, problems that can result from the introduction of oxygen into the treatment liquid can be lessened by means of methods and devices according to various exemplary embodiments.
- Exemplary embodiments of the invention can be used in plants in which material to be treated is transported, for example in plants for the chemical, in particular electrochemical, treatment of printed circuit boards, foil-like material, strip conductors or the like. The exemplary embodiments are not limited to that field of application, however.
- The invention is explained in greater detail hereinbelow by means of a preferred or advantageous exemplary embodiment, with reference to the accompanying drawings.
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FIG. 1 is a schematic sectional view of a device for the treatment of flat material to be treated, according to one exemplary embodiment. -
FIG. 2 is a further schematic sectional view of the device ofFIG. 1 . - The exemplary embodiments are described within the context of a plant for the treatment of material to be treated in which the material to be treated is transported in a horizontal transport plane. As is conventional, directions or positions relating to the material to be treated are described in relation to the transport direction. The direction which is parallel, or antiparallel, to the transport direction on transport of the material to be treated is referred to as the longitudinal direction.
-
FIG. 1 andFIG. 2 show schematic sectional views of adevice 1 for the treatment of flat material to be treated 10, which can be, for example, a printed circuit, such as a printed circuit board, conductive foil or the like. In the sectional view ofFIG. 1 the drawing plane is oriented orthogonally to the transport direction 25, and in the sectional view ofFIG. 2 the drawing plane is oriented parallel to the transport direction 25. - The
device 1 comprises a treatment module having atreatment vessel 2 in which the material to be treated is treated with a treatment liquid. The treatment liquid can in particular be an oxygen- or air-sensitive treatment solution, for example a chemical tin bath. The treatment module with thetreatment vessel 2 can be part of a process line havingfurther treatment modules treatment vessel 2 and in which the material to be treated 10 is respectively treated with a different process chemical or with a rinsing liquid. In thetreatment vessel 2, the material to be treated 10 can be brought into contact with the treatment liquid in a conventional manner. For example, thetreatment vessel 2 can have asump 3 in which thetreatment liquid 9 accumulates to alevel 17. A further region in thetreatment vessel 2, which is referred to hereinbelow as thevapour space 4, is not filled with treatment liquid and can contain various gases. In embodiments, thevapour space 4 can be defined as the partial volume of thetreatment vessel 2 that is not filled with liquid. In thevapour space 4, evaporated treatment liquid can also be contained in the gas phase. - The
treatment vessel 2 has a housing which defines a jacket of thetreatment vessel 2 but does not have to be gas-tight. In particular, in a separatingwall 35 which delimits thetreatment vessel 2 from theadjacent treatment module 31 in the transport direction 25, the housing can have aninlet slot 26 via which the material to be treated 10 is transported into thetreatment vessel 2. In afurther separating wall 36 which delimits thetreatment vessel 2 at its opposite end from theadjacent treatment module 32 in the transport direction 25, the housing can have anoutlet slot 27 via which the material to be treated 10 is transported out of thetreatment vessel 2. A transport device which comprises transport elements, for example pairs oftransport rollers 24, is provided for conveying the material to be treated 10 through thetreatment vessel 2. - In a lower portion of the
treatment vessel 2 there is provided anintake opening 6 with which treatment liquid is conveyed by a conveyor device, for example apump 5, from thesump 3 of thetreatment vessel 2. Thepump 5 conveys the treatment liquid from thesump 3 totreatment members treatment members treatment members treatment members sump 3 in order to be circulated by thepump 5 again. - The
device 1 is further configured such that an inert gas can be fed into thetreatment vessel 2. The inert gas that is fed can be nitrogen or carbon dioxide, for example. To that end, thedevice 1 has afeed device 11 for feeding the inert gas. Thefeed device 11 has a plurality offeed elements inert gas 16 can be delivered, below thelevel 17, into thetreatment liquid 9 accumulated in thesump 3 of thetreatment vessel 2. - In order to deliver the
inert gas 16 into thetreatment liquid 9, thefeed elements feed device 11 are so positioned that they deliver the inert gas below thelevel 17 to which thetreatment liquid 9 at least accumulates in thesump 3 during operation of thedevice 1. Thefeed elements feed device 11 can in particular be so positioned that they deliver the inert gas into thetreatment liquid 9 at least 10 mm, in particular at least 100 mm, below thelevel 17. - The
feed elements feed device 11 are further so positioned that they deliver the inert gas to the treatment liquid above the intake opening through which thepump 5 conveys the treatment liquid from thesump 3. - At least one
feed element 12 b of thefeed device 11 is arranged at a distance in the longitudinal direction of thetreatment vessel 2 from the two separatingwalls treatment vessel 2 in the transport direction 25. Thefeed element 12 b of thefeed device 11 can in particular be so arranged that it is in any case capable of deliveringinert gas 16 into thetreatment liquid 9 also at a middle position between the two separatingwalls treatment vessel 2 by thefeed element 12 b at a position that is spaced from theinlet slot 26 and theoutlet slot 27 in the longitudinal direction of thetreatment vessel 2. Thefeed elements feed device 11 are also arranged at a distance, in the longitudinal direction of thetreatment vessel 2, from the separatingwalls treatment vessel 2 in the transport direction 25 and feed theinert gas 16 into the treatment vessel at a position that is remote from theinlet slot 26 and theoutlet slot 27 in the longitudinal direction of thetreatment vessel 2. - At least one
feed element 12 b of thefeed device 11, and advantageously all thefeed elements feed device 11, are so positioned in the treatment vessel that they deliver theinert gas 16 into thetreatment liquid 9 accumulated in thesump 3 at the location where a comparatively large amount of the treatment liquid is rapidly being transported via theintake opening 6 to thepump 5. To that end, thefeed elements inert gas 16 into thetreatment liquid 9 accumulated in thesump 3 at the location where the accumulatedtreatment liquid 9 has afinite flow velocity 18 with which thetreatment liquid 9 flows to theintake opening 6. In that manner, a concentration of oxygen or harmful gases in thetreatment liquid 9 can be reduced before thetreatment liquid 9 is fed to the material to be treated 10 and is circulated. This permits a rapid reduction of atmospheric oxygen and harmful gases in the treatment liquid in thetreatment vessel 2. The swirling of the accumulatedtreatment liquid 9 resulting from the introduction of inert gas can prevent particles suspended in the treatment liquid from settling and can thus facilitate filtering. - The
feed elements feed device 11 can each be in the form of a porous frit. Alternatively, thefeed elements feed device 11 can each have an arrangement of small holes through which theinert gas 16 is delivered into thetreatment liquid 9. Thefeed elements - A controllable device or a
controllable element 13, for example a controllable valve, is provided in a feed pipe for the inert gas. By means of thecontrollable device 13, a volume flow rate of the inert gas from aninert gas reservoir 14 to thefeed elements controllable device 13 in order to control or adjust the volume flow rate. The control means 15 can be coupled with asensor 37 or with a plurality ofsensors 37 in the treatment vessel. Thesensor 37 or the sensors can be configured to detect the concentration of at least one gas in thevapour space 4. For example, thesensor 37 can be configured to detect the concentration of oxygen in thevapour space 4 above the accumulatedtreatment liquid 9 and to supply a signal indicative of the concentration to the control means 15. Alternatively or in addition, thesensor 37 can be configured to detect the concentration of inert gas in thevapour space 4 and supply a signal indicative of the concentration to the control means 15. Thesensor 37 or the sensors can be configured such that they measure the concentration or concentrations of the corresponding gases above thelevel 17 of the treatment liquid, in particular just above thelevel 17 of the treatment liquid. The control means 15 can supply a control signal to thecontrollable device 13 in response to the detected concentration, in order to adjust the volume flow rate of the inert gas fed into thetreatment vessel 2 in dependence on the concentration. In a further exemplary embodiment, the control means 15 can control the volume flow rate of the fed inert gas in dependence on known geometric properties of thetreatment vessel 2 and on operating parameters of thedevice 1, which can include, for example, the amount oftreatment liquid 9 in thetreatment vessel 2. - Adjusting the volume flow rate of inert gas fed into the treatment vessel by means of the control means 15, allows the volume flow rate, or the amount, of inert gas that is fed in to be so chosen that it is as small as possible. The volume flow rate of inert gas that is fed can in particular be so chosen that a desired oxygen concentration is achieved in the
vapour space 4 of thetreatment vessel 2 with the supply of as little inert gas as possible. The feeding of inert gas can be so adjusted that an oxygen concentration of zero does not necessarily have to be achieved. For example, it has been shown that satisfactory results in respect of the introduction of oxygen into the treatment liquid can be achieved if the oxygen concentration in thevapour space 4 above thebath level 17 is less than 10 vol. %, in particular less than 5 vol. %, in particular less than 2 vol. %. The feeding of inert gas can be so adjusted that the oxygen concentration in thevapour space 4 above thebath level 17 is in the range from 0.1 to 15 vol. %, in particular in the range from 3 to 12 vol. %, in particular in the range from 4 to 8 vol. %. - Further criteria can be used by the control means 15 in order to adjust or control the feeding of inert gas. For example, the control means 15 can adjust the feeding of inert gas in such a manner that a ratio between the volume flow rate of the fed inert gas, measured in m3/h, and a volume of treatment liquid present in the treatment vessel, measured in m3, is less than 20:1, in particular less than 10:1.
- As is shown diagrammatically in
FIG. 2 , waste air can be removed from thetreatment vessel 2 via theinlet slot 26 and theoutlet slot 27 through which the material to be treated 10 is transported into thetreatment vessel 2 and out of thetreatment vessel 2. The stream ofwaste air 29 through theinlet slot 26 and the stream ofwaste air 30 through theoutlet slot 27 can substantially contain suppliedinert gas 28, which flows in thevapour space 4 to the inlet andoutlet slots treatment vessel 2. Air can pass into thetreatment vessel 2 via areas that are not leak-tight, for example. - In order to reduce the ingress of air from the surroundings into the
treatment vessel 2, maintenance and service openings of thetreatment vessel 2 can be provided with gaskets. Thetreatment vessel 2 can, for example, have amaintenance opening 21, shown diagrammatically, which can be closed by means of acover 22. Thecover 22 has agasket 23 in order to prevent the ingress of air. - The
device 1 can be configured such that thewaste air treatment vessel 2 into theadjacent treatment modules treatment vessel 2 from thetreatment modules inlet slot 26 and theoutlet slot 27 can be established in thedevice 1, the flow velocity being so oriented that the gases flow from thetreatment vessel 2 into theadjacent treatment modules intake regions adjacent treatment modules treatment vessel 2 via the upstream anddownstream treatment modules - As already mentioned, the regions of the
treatment vessel 2 at which thefeed elements inert gas 16 into thetreatment vessel 2 are arranged at a distance from theinlet slot 26 and theoutlet slot 27 in the transport direction 25. This assists the distribution of theinert gas 16 along the longitudinal direction of thetreatment vessel 2, and accordingly the displacement of oxygen. - A suction power and/or the supply of inert gas into the
treatment vessel 2 can be so established that air is prevented from entering into thetreatment vessel 2 via the inlet andoutlet slots waste air - Modifications to the exemplary embodiment shown in the figures and described in detail can be implemented in further exemplary embodiments.
- Within the context of exemplary embodiments, a device has been described in which the material to be treated is transported horizontally; however, it is also possible in further exemplary embodiments for the material to be treated to be transported in a vertical plane.
- Within the context of exemplary embodiments, devices and methods have been described in which the inert gas is discharged into the treatment liquid accumulated in the sump; however, it is also possible in further exemplary embodiments, alternatively or in addition, for the inert gas to be fed into the treatment vessel at a position or in a region in which no treatment liquid is accumulated.
- Within the context of exemplary embodiments, devices and methods have been described in which treatment members are provided above the liquid level of the accumulated treatment liquid; however, it is also possible in further exemplary embodiments for the material to be treated to be subjected to a dipping treatment. It is not necessarily required that separate treatment members which apply the treatment liquid to the material to be treated are provided.
- The devices and methods according to the various exemplary embodiments can be used in the treatment of articles having conductive structures, such as, for example, printed circuit boards, conductive foils, solar cells or components for solar cells and the like, without their use being limited thereto. The devices and methods according to the various exemplary embodiments can be used in particular in the treatment of material to be treated with oxygen- or air-sensitive treatment solution.
Claims (17)
Applications Claiming Priority (3)
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PCT/EP2010/007970 WO2011079950A1 (en) | 2009-12-28 | 2010-12-28 | Method and device for the wet chemical treatment of material feedstock |
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EP (1) | EP2520140B1 (en) |
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WO2016022311A1 (en) * | 2014-08-08 | 2016-02-11 | Eastman Kodak Company | Roll-to-roll electroless plating system with low dissolved oxygen content |
US20160076150A1 (en) * | 2014-09-12 | 2016-03-17 | Gary P. Wainwright | Roll-to-roll electroless plating system with spreader duct |
EP3016486A1 (en) * | 2014-10-29 | 2016-05-04 | ATOTECH Deutschland GmbH | Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module |
EP3805425A1 (en) * | 2019-10-10 | 2021-04-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
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DE102013207343B3 (en) * | 2013-04-23 | 2014-08-28 | Atotech Deutschland Gmbh | Apparatus and method for wet-chemical treatment of flat material to be treated |
CN106793499B (en) * | 2015-11-23 | 2019-07-16 | 宇宙电路板设备(深圳)有限公司 | Printed circuit board wet-chemical treatment equipment and printed circuit board Wet chemical processing method |
TWI689455B (en) * | 2019-07-30 | 2020-04-01 | 群翊工業股份有限公司 | Nitrogen box capable of preventing board deviation from continuous passage |
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2010
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- 2010-12-28 US US13/519,816 patent/US20120298515A1/en not_active Abandoned
- 2010-12-28 BR BR112012015928-3A patent/BR112012015928A2/en not_active Application Discontinuation
- 2010-12-28 CN CN201080056255.XA patent/CN102687602B/en active Active
- 2010-12-28 EP EP10800710.5A patent/EP2520140B1/en not_active Not-in-force
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Cited By (12)
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WO2016022311A1 (en) * | 2014-08-08 | 2016-02-11 | Eastman Kodak Company | Roll-to-roll electroless plating system with low dissolved oxygen content |
US20160076150A1 (en) * | 2014-09-12 | 2016-03-17 | Gary P. Wainwright | Roll-to-roll electroless plating system with spreader duct |
US9719171B2 (en) * | 2014-09-12 | 2017-08-01 | Eastman Kodak Company | Roll-to-roll electroless plating system with spreader duct |
US9890459B2 (en) | 2014-09-12 | 2018-02-13 | Eastman Kodak Company | Roll-to-roll electroless plating system with spreader duct |
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WO2016066431A1 (en) * | 2014-10-29 | 2016-05-06 | Atotech Deutschland Gmbh | Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module |
CN107113973A (en) * | 2014-10-29 | 2017-08-29 | 德国艾托特克公司 | The decontamination module of horizontal techniques line and the method for decontaminating particle from this separation of decontamination module and removal |
US9930786B2 (en) | 2014-10-29 | 2018-03-27 | Atotech Deutschland Gmbh | Desmear module of a horizontal process line and a method for separation method and removal of desmear particles from such a desmear module |
TWI662871B (en) * | 2014-10-29 | 2019-06-11 | 德商德國艾托特克公司 | Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module |
EP3805425A1 (en) * | 2019-10-10 | 2021-04-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
US11408076B2 (en) | 2019-10-10 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
EP4108804A1 (en) * | 2019-10-10 | 2022-12-28 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
Also Published As
Publication number | Publication date |
---|---|
EP2520140A1 (en) | 2012-11-07 |
TW201137182A (en) | 2011-11-01 |
BR112012015928A2 (en) | 2020-09-15 |
CN102687602A (en) | 2012-09-19 |
KR20130008515A (en) | 2013-01-22 |
JP5763100B2 (en) | 2015-08-12 |
WO2011079950A1 (en) | 2011-07-07 |
TWI554656B (en) | 2016-10-21 |
DE102009060676A1 (en) | 2011-06-30 |
EP2520140B1 (en) | 2018-12-26 |
KR101503377B1 (en) | 2015-03-24 |
MY159628A (en) | 2017-01-13 |
CN102687602B (en) | 2015-07-01 |
DE102009060676B4 (en) | 2015-07-23 |
JP2013515858A (en) | 2013-05-09 |
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