US20110227120A1 - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
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- US20110227120A1 US20110227120A1 US13/152,026 US201113152026A US2011227120A1 US 20110227120 A1 US20110227120 A1 US 20110227120A1 US 201113152026 A US201113152026 A US 201113152026A US 2011227120 A1 US2011227120 A1 US 2011227120A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Definitions
- the present application relates to a light-emitting device, and in particular to a semiconductor light-emitting device.
- the light-emitting mechanism and the structure of a light-emitting diode are different from that of the conventional light sources.
- the LED has advantages of small size and high reliability, and has been widely used in different fields such as displays, laser diodes, traffic lights, data storage apparatus, communication apparatus, lighting apparatus, and medical apparatus.
- FIG. 1A is the schematic top view of a conventional nitride-based light-emitting device 1
- FIG. 1B illustrates a cross-sectional view of the conventional nitride-based light-emitting device 1 along the A-A′ line in the FIG. 1A .
- the conventional nitride-based light-emitting device 1 includes a substrate 11 , an n-type nitride-based layer 12 , a light-emitting layer 13 , a p-type nitride-based layer 14 , a p-type transparent electrode 15 , an n-type electrode 16 having the function as a bonding pad, and a p-type bonding pad 17 .
- the p-type bonding pad 17 is used for current injection. The current is injected through the p-type bonding pad 17 and moves to and spread through the p-type transparent electrode 15 . Electrons and holes recombine in the light-emitting layer 13 and then produce photons. In fact, as shown in FIG.
- the current is crowded in the area where the p-type transparent electrode 15 is close to the n-type electrode 16 to cause a poor light-emitting efficiency.
- the temperature in the current crowded area is so high that the life of conventional nitride-based light-emitting device 1 is reduced.
- the light-emitting device 2 includes a p-type electrode and an n-type electrode.
- the p-type electrode includes a p-type bonding pad 24 , two first armed electrodes 24 a extending from the p-type bonding pad 24 , and second armed electrodes 24 b interposed between two first armed electrodes 24 a .
- the armed electrode can be used to decrease the light absorption of the p-type electrode.
- the current is injected from the p-type bonding pad 24 and spread by the armed electrodes.
- the n-type electrode includes an n-type bonding pad 25 , third armed electrodes 25 a , and fourth armed electrodes 25 b .
- the current is injected from the p-type electrode, moves to the light-emitting region of the light-emitting device 2 , and then flows to and out of the n-type electrode.
- the p-type armed electrodes 24 a , 24 b and the n-type armed electrodes 25 a , 25 b are interdigitated between each other.
- the light-emitting device 3 includes an n-type electrode having a first contact 35 and an n-type fingered electrode 36 connected with the first contact 35 at a first side of the light-emitting device 3 , a p-type electrode having a second contact 37 and two fingered electrodes 38 a , 38 b connected with the second contact 37 at a second side of the light-emitting device 3 , wherein the first side and the second side are opposite to each other.
- the n-type fingered electrode 36 is extended from the first side to the second side
- the p-type fingered electrodes 38 a , 38 b are extended from the second side to the first side
- the n-type fingered electrode 36 and the p-type fingered electrodes 38 a , 38 b are interdigitated between each other.
- the light-emitting devices 2 and 3 can resolve the current crowding and low light efficiency problems of the conventional light-emitting device 1 by the interdigitated extending electrodes.
- the epitaxial structure of the light-emitting device 4 includes a spiral-shaped trench, a p-type metal electrode 41 located in the exposed surface of the trench, an n-type metal electrode 42 located on the un-trenched surface of the epitaxial structure, a p-type bonding pad 43 , and an n-type bonding pad 44 , wherein the p-type metal electrode 41 and the n-type metal electrode 42 are parallel and distributed in spiral shape, which can resolve the current crowding and low light efficiency problems of the conventional light-emitting device 1
- the designs of electrodes adopt transparent electrodes or decrease the electrode area such as armed, fingered and spiral-shaped electrodes to optimize the light extraction area.
- the width of an electrode is designed to be smaller than that of a bonding pad to avoid increasing the light absorption area of the electrode.
- the light-emitting device comprises a substrate; a light-emitting stack disposed on the substrate, comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; a trench formed through the second layer, the light-emitting layer to the first layer wherein a part of the first layer is exposed; a first conductive structure disposed on the exposed part of the first layer in the trench; and a second conductive structure disposed on the second layer; wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; the second conductive structure comprises a second electrode and a second pad with an electrical connection formed therebetween; wherein at lease one of the first pad and the second pad has an area between 1.5 ⁇ 10 4 ⁇ m 2 to 6.2 ⁇ 10 4 ⁇ m 2 .
- This application also provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; a trench formed through the second layer, the light-emitting layer to the first layer wherein a part of surface of the first layer is exposed; a first conductive structure disposed on the exposed surface of the first layer in the trench; and a second conductive structure disposed on the second layer; wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; the second conductive structure comprises a second electrode and a second pad with an electrical connection formed therebetween; wherein at lease one of the first pad and the second pad comprises two bonding regions.
- This application provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; and a first conductive structure disposed on the light-emitting stack wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; wherein the first pad comprises at least two bonding regions, or the area of the first pad is between 1.5 ⁇ 10 4 ⁇ m 2 to 6.2 ⁇ 10 4 ⁇ m 2 .
- This application provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate; and a first electrode and a first pad with an electrical connection formed therebetween; wherein the area of the first pad is between 3 ⁇ 10 4 ⁇ m 2 to 1.24 ⁇ 10 5 ⁇ m 2 and is capable of accommodate at least two wires.
- This application provides a light-emitting device comprising a conductive substrate, an adhesive layer on the conductive substrate, a reflection layer on the adhesive layer, a second semiconductor layer on the reflection layer, a light-emitting layer on the second semiconductor layer, a first semiconductor layer on the light-emitting layer, a least one trench through the first semiconductor layer, and a first conductive structure on the first semiconductor layer, wherein the first conductive structure comprises a first electrode and a first pad.
- FIGS. 1A-1B are a schematic top view and a cross-sectional view of a conventional light-emitting device 1 .
- FIG. 2 is a schematic cross-sectional view of a conventional light-emitting device 2 .
- FIG. 3 is a schematic cross-sectional view of a conventional light-emitting device 3 .
- FIG. 4 is a schematic cross-sectional view of a conventional light-emitting device 4 .
- FIGS. 5A-5C are a schematic top view and cross-sectional views of a light-emitting device in accordance with a first embodiment of the present application.
- FIGS. 6A-6B are a schematic top view and a cross-sectional view of a light-emitting device in accordance with a second embodiment of the present application.
- FIG. 7 is a schematic cross-sectional view of a light-emitting device in accordance with a third embodiment of the present application.
- FIGS. 8A-8B are a schematic top view and a cross-sectional view of a light-emitting device in accordance with a fourth embodiment of the present application.
- FIGS. 9A-9H are schematic cross-sectional views of a light-emitting device in accordance with a fifth embodiment of the present application.
- FIGS. 10A-10F are schematic top views of the light-emitting device in accordance with a fifth embodiment of the present application.
- FIG. 11 is a schematic cross-sectional view of a light source element including a light-emitting device of the present application.
- FIG. 12 is a schematic cross-sectional view of a backlight module including a light-emitting device of the present application.
- FIG. 5A the schematic top view shows a light-emitting device 10 in accordance with a first embodiment of the present application.
- FIG. 5B illustrates a cross-sectional view of the light-emitting device 10 along the B-B′ line in the FIG. 5A .
- the light-emitting device 10 such as an LED includes a substrate 100 , a buffer layer 110 , a first semiconductor layer 120 , a light-emitting layer 130 , a second semiconductor layer 140 , a first electrode 151 , a second electrode 152 , a first and second pad 161 and 162 .
- the shape of light-emitting device 10 is a rectangular cube.
- Each side of the light-emitting device 10 is about 610 ⁇ m in length.
- the area of the top surface is 3.72 ⁇ 10 5 ⁇ m 2 , and the area of the light-emitting layer 130 is accorded with the area of the top surface.
- the buffer layer 110 , first semiconductor layer 120 , light-emitting layer 130 , and second semiconductor layer 140 are formed on the substrate 100 by the method of metal organic chemical vapor deposition (MOCVD) or molecular-beam epitaxy (MBE).
- MOCVD metal organic chemical vapor deposition
- MBE molecular-beam epitaxy
- an etching step is performed.
- a trench 170 is formed in the epitaxial structure by etching the epitaxial structure. A part of the first semiconductor layer 120 is exposed through the trench 170 .
- the trench 170 is formed in a rectangular spiral shape, and the un-etched epitaxial structure is also formed in a rectangular spiral shape.
- first electrode 151 and the first pad 161 are formed on the exposed surface of the first semiconductor layer 120 .
- the shape of first electrode 151 is the same as the rectangular spiral shape of the trench 170 , and the width of the first electrode 151 is about 22 ⁇ m.
- the position of first pad 161 can be between two end points of the first electrode 151 or in a non-end portion of the first electrode 151 .
- the first pad 161 is disposed at the non-end portion of the first electrode 151 . Because the light-emitting device 10 has a larger light-emitting area, a larger operating current is necessary for a higher emitting efficiency. In order to achieve the larger amount of injected current, more pads area for current injecting are necessary.
- the area of the first pad 161 is designed to be capable of containing at least two wires for current injecting, and the light-emitting device has enough wires for current injecting to improve the light-emitting efficiency.
- the area of the first pad 161 is 1.9 ⁇ 10 4 ⁇ m 2 ′ in the embodiment.
- the second electrode 152 and the second pad 162 are formed and connected with each other on the remained epitaxial structure.
- the width of the second electrode 152 is about 20 ⁇ m, and the shape of it is a rectangular spiral.
- the second pad 162 can be situated between two end points of the second electrode 152 or on a non-end portion of the second electrode 152 . In this embodiment, the second pad 162 is situated on the non-end portion of the second electrode 152 .
- the area of the second pad 162 is designed to be capable of containing at least two wires for current injecting, thus the light-emitting device has enough amounts of wires for current injecting to improve the light-emitting efficiency.
- the area of the second pad 162 is 1.73 ⁇ 10 4 ⁇ m 2 in the embodiment.
- the shapes of the first pad 161 and the second pad 162 include rectangular shape, circular shape, or any other shapes.
- the first pad 161 and the second pad 162 including bonding regions are disposed on the first and the second electrodes respectively.
- both shapes of the first pad 161 and the second pad 162 are two overlapped circles. Bonding regions 161 A and 161 B of the first pad 161 , and bonding regions 162 A and 162 B of the second pad 162 can provide a better identification and avoid duplicate bonding of two wires on the same pad.
- the schematic cross-sectional view shows a pad 161 with Au bonding bulges 180 A and 180 B formed on the bonding regions 161 A and 161 B respectively.
- Au bulges are melted by raising temperature, and then the wires 171 A and 171 B are bonded with Au bonding bulges 180 A and 180 B respectively.
- other two wires are bonded at the bonding regions 162 A and 162 B by the same method.
- the direction of the spiral shape is clockwise or counterclockwise, and the numbers of spiral are not limited.
- the material of the substrate 100 includes but is not limited to sapphire.
- the material of the buffer layer 110 includes but is not limited to AlN, AlGaN, or GaN.
- the material of the first semiconductor layer 120 includes but is not limited to (Al x Ga 1-x ) y In 1-y N wherein 0 ⁇ x ⁇ 1 and 0 ⁇ y ⁇ 1.
- the light-emitting layer 130 includes but is not limited to a double heterostructure or a multi-quantum well including materials such as (Al p Ga 1-q ) q In 1-q N wherein 0 ⁇ p ⁇ 1 and 0 ⁇ q ⁇ 1.
- the material of the second semiconductor layer 140 includes but is not limited to (Al a Ga 1-a ) b In 1-b N wherein 0 ⁇ a ⁇ 1 and 0 ⁇ b ⁇ 1.
- the material of the first electrode 151 is selected from materials which can be formed an ohmic contact with the first semiconductor layer 120 , such as a single layer, multiple layers or alloy selected from Ti, Al, and Au, or other metal-oxide conductive material.
- the first Dad 161 includes but is not limited to a single layer, multiple layer or alloy selected from Ti, Al, and Au.
- the material of the second electrode 152 is selected from materials which can be formed an ohmic contact with the second semiconductor layer 140 , such as a single layer, multiple layers or alloy selected from Ni and Au, or other metal-oxide conductive material.
- the second pad 162 includes but is not limited to a single layer, multiple layer or alloy selected from Ni and Au.
- the areas of the first pad 161 and the second pad 162 do not need to satisfy the condition of having the area capable of accommodating at least two wires for current injecting at the same time. It can be one of the first pad 161 and the second pad 162 satisfying the condition that the area of pad is capable of containing at least two wires.
- FIG. 6A the schematic top view shows a light-emitting device 20 in accordance with a second embodiment of the present invention.
- FIG. 6B illustrates a cross-sectional view of the light-emitting device 20 along the C-C′ line in the FIG. 6A .
- the light-emitting device 20 includes a substrate 200 , an adhesive layer 210 , a current conductive layer 280 , a first semiconductor layer 220 , a light-emitting layer 230 , a second semiconductor layer 240 , a first electrode 251 , a second electrode 252 , a first and second pad 261 and 262 .
- the shape of the light-emitting device 20 is a rectangular cube, and the length of each side is about 787 ⁇ m.
- the area of the top surface is 6.19 ⁇ 10 5 ⁇ m 2 , and the area of the light-emitting layer 230 is in accord with the area of the top surface.
- the epitaxial structure of the light-emitting device 20 is formed on a growth substrate (not illustrated). After the epitaxial structure is grown, a current conductive layer 280 with a high current conductivity is fouled on the first semiconductor layer 220 , which can spread the current injected from the electrode. Next, the epitaxial structure and the substrate 200 are adhered together by the adhesive layer 210 .
- a trench 270 is formed in the epitaxial structure by etching the epitaxial structure. A part of the current conductive layer 280 is exposed through the trench 270 .
- the trench 270 is formed in a fingered shape; the finger is extended from the first side to the opposite second side of the light-emitting device 20 .
- the un-etched epitaxial structure also forms a fingered shape.
- the first electrode 251 and the first pad 261 are framed on the exposed surface of the current conductive layer 280 .
- the shape of the first electrode 251 is the same as the fingered shape of the trench 270 , and the first electrode 251 includes at least three linearly extending electrodes and a laterally extending electrode connected the three linearly extending electrodes.
- the width of the first electrode 251 is about 23 ⁇ m.
- the first pad 261 can be situated between two end points of the first electrode 251 or on a non-end portion of the first electrode 251 . In this embodiment, the first pad 261 is situated on the non-end portion of the first electrode 251 .
- the area of the first pad 261 is designed to be capable of containing at least two wires for current injecting so the light-emitting device 20 has enough wires for current injection.
- the area of the first pad 261 is 2.15 ⁇ 10 4 ⁇ m 2 in the embodiment.
- the second electrode 252 and the second pad 262 are formed and connected with each other on the remained epitaxial structure.
- the second electrode 252 includes three linearly extending electrodes extended from the second side to the opposite first side of the light-emitting device 20 , and interdigitated between the three linearly extending electrode of the first electrode 251 , and a laterally extending electrode connecting the three linearly extending electrodes.
- the width of the second electrode 252 is about 20 ⁇ m.
- the second pad 262 is disposed at the second side and connected with the second electrode 252 .
- the area of the second pad 262 is 1.27 ⁇ 10 4 ⁇ m 2 in the embodiment.
- the shape of the second pad 262 is rectangular, and the second pad 262 is situated on the non-end portion of the second electrode 152 .
- the first pad 261 is capable of containing two bonding regions 261 A and 261 B. Each of regions 261 A and 261 B electrically connects to at least a wire for bonding, such that a better identification can be achieved for the next bonding procedure to avoid different wires being bonded at the same bonding region.
- the second pad 262 has a circular shape, and only one bonding region 262 A which connects to a wire electrically.
- the area of the second pad 262 is also can be designed as an size containing at least two wires, such as the area of the second pad 262 is 1.5 ⁇ 10 4 ⁇ m 2 .
- the material of the growth substrate includes but is not limited to sapphire, SiC, GaN, GaAs, or GaP.
- the material of the substrate 200 includes but is not limited to SiC, GaN, GaP, Si, AIN, ZnO, MgO, MgAl 2 O 4 , GaAs, glass, sapphire, metal, or compound materials.
- the adhesive layer 210 includes a conductive adhesive layer or an insulating adhesive layer.
- the material of the conductive adhesive layer includes but is not limited to Ag, Au, Al, In, or Sn, or alloy of them, spontaneous conductive polymer, or polymer doped with metal like Al, Au, Pt, Zn, Ag, Ni, Ge, In, Sn, Ti, Pb, Cu, Pd, or other metals.
- the material of the insulating adhesive layer includes but is not limited to spin on glass (SOG), silicone, benzocyclobutene (BCB), epoxy, polyimide (PI), or perfluorocyclobutane (PFCB).
- the material of the substrate 200 is not limited.
- the material of the substrate 200 is Si.
- the material of Si has a higher heat transfer coefficient to transfer the heat produced by the light-emitting device to the environment.
- a reflective layer is further disposed on one side of the adhesive layer 210 .
- the material of the reflective layer includes but is not limited to metal, oxide, or the combination thereof.
- the oxide material for the reflective layer includes but is not limited to AlO x , SiO x , or SiN x .
- the material of the substrate 200 includes but is not limited to glass, sapphire, or AlN. It also can disposes an insulating layer between the current conductive layer 280 and the adhesive layer 210 , or the adhesive layer 210 and the substrate 200 , wherein the material of the substrate 200 is not limited.
- FIG. 7 a cross-sectional view shows a light-emitting device in accordance with a third embodiment of the present invention.
- FIG. 7 illustrates an insulating layer 690 disposed between the adhesive layer 210 and the current conductive layer 280 for isolation.
- the material of the insulating layer includes but is not limited to SiN x or SiO 2 .
- the material of the first semiconductor layer 220 includes but is not limited to (Al x Ga 1-m ) r In 1-r N wherein 0 ⁇ m ⁇ 1 and 0 ⁇ r ⁇ 1 or (Al c Ga 1-c ) d In 1-d P wherein 0 ⁇ c ⁇ 1 and 0 ⁇ d ⁇ 1.
- the light-emitting layer 230 includes but is not limited to a double heterostructure or a multi-quantum well including materials such as (Al e Ga 1-e ) f In 1-p N wherein 0 ⁇ k ⁇ 1 and 0 ⁇ p ⁇ 1 or (Al s Ga 1-s ) t In 1-t P wherein 0 ⁇ s ⁇ 1 and 0 ⁇ t ⁇ 1.
- the material of the second semiconductor layer 240 includes but is not limited to (Al k Ga 1-k ) p In 1-p N wherein 0 ⁇ k ⁇ 1 and 0 ⁇ p ⁇ 1 or (Al s Ga 1-s ) t In 1-t P wherein 0 ⁇ s ⁇ 1 and 0 ⁇ t ⁇ 1.
- the material of the first electrode 251 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ni, and Au, or other conductive metal oxide layer.
- the material of first pad 261 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ni, and Au.
- the material of the second electrode 252 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ti, Al, and Au, or conductive metal oxide layer.
- the second pad 262 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ti, Al, and Au.
- the shapes of the first electrode 251 and the second electrode 252 include M linearly extending electrodes respectively, wherein M ⁇ 1.
- the first electrode 251 can include M linearly extending electrodes, wherein M ⁇ 1, and the second electrode 252 includes M ⁇ 1 linearly extending electrodes.
- FIG. 8A the schematic top view shows a light-emitting device 30 in accordance with a fourth embodiment of the present invention.
- FIG. 8B illustrates a cross-sectional view of the light-emitting device 30 along the D-D′ line in the FIG. 8A .
- the structure of the light-emitting device 30 is similar to that of the light-emitting device 10 including a substrate 100 , a buffer layer 110 , a first semiconductor layer 120 , a light-emitting layer 130 , and a second semiconductor layer 140 .
- a current conductive layer 380 is disposed on the second semiconductor layer 140 .
- the light-emitting device 300 is a rectangular cube and the length of each side of the light-emitting device 30 is about 1143 ⁇ m.
- the area of the top surface is 1.3 1 ⁇ 10 6 ⁇ m 2 , and the area of the light-emitting layer 130 is in accord with the area of the top surface.
- an etching step is performed.
- a trench 370 is formed in the current conductive layer 380 and the epitaxial structure by etching part of them.
- a part of the first semiconductor layer 120 is exposed through the trench 370 .
- the shape of the trench 370 is formed in a pair of spiral, and the un-etched current conductive layer 380 and epitaxial structure are also formed in a pair of spiral shape.
- the light-emitting device 30 includes a pair of first electrodes 351 A and 351 B and a pair of second electrodes 361 A and 361 B formed in a pair of spiral shape respectively.
- the first electrodes 351 A and 351 B, and first pads 361 A and 361 B are formed on the exposed surface of the first semiconductor layer 120 .
- the shape of first electrodes 351 A and 351 B are the same as the pair of spiral shape of the trench 370 .
- the width of the first electrodes 351 A or 351 B is about 10 ⁇ m respectively.
- First pads 361 A and 361 B can be situated between two end points of first electrodes 351 A and 351 B or on a non-end portion of first electrodes 351 A and 351 B.
- first pads 361 A and 361 B are situated on the non-end portions of first electrodes 351 A and 351 B near a first side of the light-emitting device 30 and a second side opposite to the first side.
- the area of first pad 361 A and 361 B are the same as 1.9 ⁇ 10 4 ⁇ m 2 .
- the second electrodes 352 A and 352 B, and the second pad 362 are formed on the remained current conductive layer 380 .
- the width of the second electrode 352 A or 352 B is about 10 ⁇ m respectively.
- the second electrodes 352 A and 352 B are formed in a spiral shape and connected with the second pads 362 respectively.
- the second pad 362 can be disposed at a third side neighboring with the first side and the second side, and connect to second electrodes 352 A and 352 B.
- the area of the second pad 362 is designed to be capable of containing at least two wires for current injection so the light-emitting device 30 has enough current to higher brightness.
- the area of the second pad 362 is 1.9 ⁇ 10 4 ⁇ m 2 in the embodiment.
- the shape of the second pad 362 formed as two circles partially overlapped includes two bonding region 362 A and 362 B such that a better identification can be achieved for the next bonding procedure to avoid two wires being bonded on the same bonding region.
- the shape of the light-emitting device 30 includes but is not limited to a square shape or a rectangular shape.
- the material of the current conductive layers 280 and 380 includes but is not limited to indium tin oxide, cadmium tin oxide, zinc oxide, or zinc tin oxide.
- Each surface of the light-emitting device can be a rough surface by an epitaxial or an etching process, such as a rough surface around the substrate or around the epitaxial structure, a rough surface in the top light extraction surface, or a rough surface under and contact with the electrode, to improve the light extraction efficiency.
- a fifth embodiment of the present application is a vertical light-emitting device structure, wherein the first conductive structure and the second conductive structure are at the opposite sides of the substrate.
- the fifth embodiment of the present application discloses a light-emitting device 50 comprising a conductive substrate 521 , an adhesive layer 506 on the conductive substrate 521 , a reflection layer 505 on the adhesive layer 506 , a second semiconductor layer 504 on the reflection layer 505 , a light-emitting layer 503 on the second semiconductor layer 504 , a first semiconductor layer 502 on the light-emitting layer 503 , at least one trench 508 through the first semiconductor layer 502 , and a first conductive structure 512 on the first semiconductor layer 502 , wherein the first conductive structure 512 comprises a first electrode 514 and a first pad 513 , as shown in FIGS. 9H , and 10 A- 10 F.
- the method of forming a light-emitting device 50 comprises providing a growth substrate 501 , as shown in FIG. 9A , and growing a first semiconductor layer 502 , a light-emitting layer 503 , and a second semiconductor layer 504 in sequence on the growth substrate 501 by the metal-organic chemical vapor deposition (MOCVD) method, as shown in FIG. 9B .
- the growth substrate 501 mentioned above can be sapphire.
- the first semiconductor layer 502 , the light-emitting layer 503 and the second semiconductor layer 504 mentioned above comprise III-V group compound such as AlGaInN series material.
- a reflection layer 505 is formed on the second semiconductor layer 504 .
- a conductive substrate 521 is provided, and an adhesive layer 506 is formed on the conductive substrate 521 .
- the conductive substrate 521 can be Si, Ge, Cu, Mo, and ZnO.
- the reflection layer is connected with the conductive substrate by the adhesive layer.
- the growth substrate 501 is removed by laser irradiation 522 , then the structure 40 is formed as FIG. 9F shows.
- the adhesive layer 506 comprises soldering tin, low temperature metal, metal silicides, PbSn, AuGe, AuBe, AuSi, Sn, In, and PdIn.
- the reflection layer 505 comprises Ag, Al, Zn, Mg, Ru, Ti, Rh, Cr, and Pt.
- a mask layer 507 is formed on the first semiconductor layer 502 , such that a portion of the first semiconductor layer 502 is covered by the mask layer 507 . Other portion of the first semiconductor layer 502 not covered by the mask layer 507 is etched by inductively coupled plasma (ICP) etching 523 .
- ICP inductively coupled plasma
- FIG. 9H shows, at least one trench 508 is formed. After removing the mask layer 507 , a plurality of platforms 509 are formed. At least one trench 508 is formed through the first semiconductor layer 502 and a plurality of platforms 509 are formed on the first semiconductor layer 502 . Finally, a first conductive structure 512 is formed on the platforms 509 so the light-emitting device 50 is formed.
- the first conductive structure 512 comprises Ni, Au, Pt, Pd, Mg, Cu, Zn, Ag, Sc, Co, Rh, Li, Be, Ca, Ru, Re, Ti, Ta, Na, and La.
- FIGS. 10A-10F show the top views of the light-emitting device 50 .
- the first conductive structure 512 comprises a first electrode 514 and a first pad 513 where in the area of the first pad 513 is between 1.5 ⁇ 10 4 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 in the embodiment.
- the conductive substrate 521 is electrically connecting with the second semiconductor layer 504 , so it can be used for a second conductive structure of the light-emitting device 50 .
- the first semiconductor layer 502 has a thickness H, and the trench 508 has a depth h.
- TABLE.1 shows the differences between the light output power (IV) and the depth of the trench (h) in the light emitting device 50 .
- Sample no. 0 is a reference sample having a depth of the trench h of 0, which means the first semiconductor layer 502 has no trenches.
- the light output power of the Sample no. 0 is 455 mW.
- the h of the Sample no 1 is between 0 and H/3, and the light output power is 455.91 mW.
- ⁇ Iv equals to [(455.91 ⁇ 455) ⁇ 100%]/455
- ⁇ Iv value of the Sample no. 1 is 0.2%.
- the h of the Sample no. 2 is between H/3 and 2H/3, and the light output power is 461.37 mW.
- the difference of light output power between the Sample no. 0 and 2, ⁇ Iv, equals to [(461.37-455) ⁇ 100%]/455, and the ⁇ Iv value of the Sample no. 2 is 1.4%.
- the h of the Sample no. 3 is between 2H/3 and H, and the light output power is 463.65 mW. The difference of light output power between the Sample no.
- ⁇ Iv equals to [(463.65 ⁇ 455) ⁇ 100%]/455, and the ⁇ Iv value of the Sample no. 3 is 1.9%.
- the h of the Sample no. 4 is greater than H, and the light output power is 439.99.
- TABLE.1 shows that when the h is between H/3 and H, the difference of the light output power with Sample No. 0 increases. But when the h is greater than H, the difference of the light output power with Sample No. 0 decreases.
- One reason the light output power of the light-emitting device 50 increases is the area of the sidewall of the trenches 508 is enlarged when the depth h of the trenches 508 is increased, and the light output power is also increased.
- Another reason the light output power of the light-emitting device 50 increases when the depth of the trenches h is increasing is that the thickness of the first semiconductor layer 502 in the trenches is decreased so the light absorbed by the first semiconductor layer 502 is also decreased.
- ICP inductively coupled plasma
- the first semiconductor layer 502 serves to spread current, it can not be etched too much. If the area of the top surface of the first semiconductor layer 511 is 1 mm 2 , the area of the a plurality of platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 , ie. 0.5 mm 2 .
- FIGS. 10A and 10B show top views of the trenches 508 of a plurality of circles formed through the first semiconductor layer 502 , and the depth h of the trenches 508 are between H/3 and H, wherein H is the thickness of the first semiconductor layer 502 .
- the platforms 509 are the area other than the plurality of trenches 508 , and the first conductive structure 512 comprises a first electrode 514 encompassing the edge and central regions of the light-emitting device and a first pad 513 .
- the area of the platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 , and the area of the first pad 513 is between 1.5 ⁇ 10 4 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 .
- FIG. 10C shows a top view of the trenches 508 of two stripes with round corners formed through the first semiconductor layer 502 and between the first electrodes 514 , and the depth h of the trenches are between H/3 and H, wherein H is the thickness of the first semiconductor layer 502 .
- the platforms 509 are the area other than the two trenches 508 , and the first conductive structure 512 comprises two first electrodes 514 and two first pads 513 .
- the area of the platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 , and the area of the first pads 513 is between 1.5 ⁇ 10 4 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 .
- FIG. 10D shows a top view of the trench 508 of one stripe with round corners formed through the first semiconductor layer 502 and between the first electrodes 514 , and the depth h of the trenches are between H/3 and H, wherein H is the thickness of the first semiconductor layer 502 .
- the platforms 509 are the area other than the trench 508 , and the first conductive structure 512 comprises two first electrodes 514 encompassing the edge regions of the light-emitting device and two first pads 513 .
- the area of the platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 and the area of the first pads 513 is between 1.5 ⁇ 10 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 .
- FIG. 10E shows a top view of the trenches 508 of two stripes formed through the first semiconductor layer 502 and between the first electrodes 514 , and the depth h of the trenches are between H/3 and H, wherein H is the thickness of the first semiconductor layer.
- the platforms 509 are the area other than the two trenches 508 , and the first conductive structure 512 comprises two first electrodes 514 encompassing the edge and central regions of the light-emitting device and two first pads 513 .
- the area of the platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 , and the area of the first pad 513 is between 1.5 ⁇ 10 4 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 .
- 10F shows a top view of the trenches 508 of two stripes with round corners formed through the first semiconductor layer 502 and between the first electrodes 514 , and the depth h of the trenches are between H/3 and H, wherein H is the thickness of the first semiconductor layer 502 .
- the platforms 509 are the area other than the two trenches 508 , and the first conductive structure 512 comprises three first electrodes 514 and one first pad 513 .
- the area of the platforms 509 is preferred to be greater than a half of the area of the top surface of the first semiconductor layer 511 , and the area of the first pad 513 is between 1.5 ⁇ 10 4 ⁇ m 2 and 6.2 ⁇ 10 4 ⁇ m 2 .
- the schematic cross-sectional view shows a light source apparatus 90 in accordance with a sixth embodiment of the present application.
- the light source apparatus 90 includes a light-emitting device of above embodiments.
- the light source apparatus 7 is a lighting apparatus such as streetlamps, vehicle lamps, or indoor lightings. It also can be traffic lights or backlights of a module in a planar display.
- the light source apparatus 90 includes a light source 910 with the light-emitting device of above embodiments, a power supply system 920 , and a control element 930 for controlling the power supply system 920 .
- the schematic cross-sectional view shows a backlight module 95 in accordance with a seventh embodiment of the present application.
- the backlight module 95 includes the light source apparatus 90 and an optical element 1010 .
- the optical element 1010 is used to operate the light emitted from the light source apparatus 90 to satisfy the requirements of the backlight.
- the optical element 1010 includes a photonic lattice, a color filter, a wavelength conversion layer, an antireflective layer, a lens or the combination thereof.
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Abstract
Description
- This application claims the right of priority based on U.S. patent application Ser. No. 12/292,593 entitled “Light-emitting Device”, filed on Nov. 21, 2008, which claims the right of priority based on Taiwan Patent Application No. 096144680, filed on Nov. 23, 2007, entitled “Light-emitting Device”, and is incorporated herein by reference and assigned to the assignee herein.
- 1. Technical Field
- The present application relates to a light-emitting device, and in particular to a semiconductor light-emitting device.
- 2. Description of the Related Art
- The light-emitting mechanism and the structure of a light-emitting diode (LED) are different from that of the conventional light sources. The LED has advantages of small size and high reliability, and has been widely used in different fields such as displays, laser diodes, traffic lights, data storage apparatus, communication apparatus, lighting apparatus, and medical apparatus.
- Referring to
FIGS. 1A and 1B .FIG. 1A is the schematic top view of a conventional nitride-based light-emitting device 1, andFIG. 1B illustrates a cross-sectional view of the conventional nitride-based light-emitting device 1 along the A-A′ line in theFIG. 1A . The conventional nitride-based light-emitting device 1 includes asubstrate 11, an n-type nitride-basedlayer 12, a light-emitting layer 13, a p-type nitride-basedlayer 14, a p-typetransparent electrode 15, an n-type electrode 16 having the function as a bonding pad, and a p-type bonding pad 17. The p-type bonding pad 17 is used for current injection. The current is injected through the p-type bonding pad 17 and moves to and spread through the p-typetransparent electrode 15. Electrons and holes recombine in the light-emittinglayer 13 and then produce photons. In fact, as shown inFIG. 1B , the current is crowded in the area where the p-typetransparent electrode 15 is close to the n-type electrode 16 to cause a poor light-emitting efficiency. Besides, the temperature in the current crowded area is so high that the life of conventional nitride-based light-emitting device 1 is reduced. - In order to resolve above problems, a known art disclosed a light-
emitting device 2 which is illustrated by a top view as shown inFIG. 2 . Another known art also disclosed a light-emitting device 3 which is illustrated by a top view as shown inFIG. 3 . Referring toFIG. 2 , the light-emittingdevice 2 includes a p-type electrode and an n-type electrode. The p-type electrode includes a p-type bonding pad 24, two firstarmed electrodes 24 a extending from the p-type bonding pad 24, and secondarmed electrodes 24 b interposed between two firstarmed electrodes 24 a. The armed electrode can be used to decrease the light absorption of the p-type electrode. The current is injected from the p-type bonding pad 24 and spread by the armed electrodes. The n-type electrode includes an n-type bonding pad 25, thirdarmed electrodes 25 a, and fourtharmed electrodes 25 b. The current is injected from the p-type electrode, moves to the light-emitting region of the light-emittingdevice 2, and then flows to and out of the n-type electrode. The p-typearmed electrodes armed electrodes - Referring to the
FIG. 3 , the light-emitting device 3 includes an n-type electrode having afirst contact 35 and an n-type fingeredelectrode 36 connected with thefirst contact 35 at a first side of the light-emitting device 3, a p-type electrode having asecond contact 37 and two fingeredelectrodes second contact 37 at a second side of the light-emitting device 3, wherein the first side and the second side are opposite to each other. The n-type fingeredelectrode 36 is extended from the first side to the second side, the p-typefingered electrodes fingered electrode 36 and the p-typefingered electrodes devices device 1 by the interdigitated extending electrodes. - Referring to
FIG. 4 , further another known art disclosed a light-emitting device 4. The epitaxial structure of the light-emitting device 4 includes a spiral-shaped trench, a p-type metal electrode 41 located in the exposed surface of the trench, an n-type metal electrode 42 located on the un-trenched surface of the epitaxial structure, a p-type bonding pad 43, and an n-type bonding pad 44, wherein the p-type metal electrode 41 and the n-type metal electrode 42 are parallel and distributed in spiral shape, which can resolve the current crowding and low light efficiency problems of the conventional light-emitting device 1 - In above conventional light-emitting devices, the designs of electrodes adopt transparent electrodes or decrease the electrode area such as armed, fingered and spiral-shaped electrodes to optimize the light extraction area. In general, the width of an electrode is designed to be smaller than that of a bonding pad to avoid increasing the light absorption area of the electrode.
- Accordingly, this application provides a light-emitting device. The light-emitting device comprises a substrate; a light-emitting stack disposed on the substrate, comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; a trench formed through the second layer, the light-emitting layer to the first layer wherein a part of the first layer is exposed; a first conductive structure disposed on the exposed part of the first layer in the trench; and a second conductive structure disposed on the second layer; wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; the second conductive structure comprises a second electrode and a second pad with an electrical connection formed therebetween; wherein at lease one of the first pad and the second pad has an area between 1.5×104 μm2 to 6.2×104 μm2.
- This application also provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; a trench formed through the second layer, the light-emitting layer to the first layer wherein a part of surface of the first layer is exposed; a first conductive structure disposed on the exposed surface of the first layer in the trench; and a second conductive structure disposed on the second layer; wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; the second conductive structure comprises a second electrode and a second pad with an electrical connection formed therebetween; wherein at lease one of the first pad and the second pad comprises two bonding regions.
- This application provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate comprising a first layer, a second layer, and a light-emitting layer disposed therebetween; and a first conductive structure disposed on the light-emitting stack wherein the first conductive structure comprises a first electrode and a first pad with an electrical connection formed therebetween; wherein the first pad comprises at least two bonding regions, or the area of the first pad is between 1.5×104 μm2 to 6.2×104 μm2.
- This application provides a light-emitting device comprising a substrate; a light-emitting stack disposed on the substrate; and a first electrode and a first pad with an electrical connection formed therebetween; wherein the area of the first pad is between 3×104 μm2 to 1.24×105 μm2 and is capable of accommodate at least two wires.
- This application provides a light-emitting device comprising a conductive substrate, an adhesive layer on the conductive substrate, a reflection layer on the adhesive layer, a second semiconductor layer on the reflection layer, a light-emitting layer on the second semiconductor layer, a first semiconductor layer on the light-emitting layer, a least one trench through the first semiconductor layer, and a first conductive structure on the first semiconductor layer, wherein the first conductive structure comprises a first electrode and a first pad.
- The accompanying drawings are included to provide easy understanding of the application, and are incorporated herein and constitute a part of this specification. The drawings illustrate embodiments of the application and, together with the description, serve to illustrate the principles of the application.
-
FIGS. 1A-1B are a schematic top view and a cross-sectional view of a conventional light-emitting device 1. -
FIG. 2 is a schematic cross-sectional view of a conventional light-emitting device 2. -
FIG. 3 is a schematic cross-sectional view of a conventional light-emitting device 3. -
FIG. 4 is a schematic cross-sectional view of a conventional light-emitting device 4. -
FIGS. 5A-5C are a schematic top view and cross-sectional views of a light-emitting device in accordance with a first embodiment of the present application. -
FIGS. 6A-6B are a schematic top view and a cross-sectional view of a light-emitting device in accordance with a second embodiment of the present application. -
FIG. 7 is a schematic cross-sectional view of a light-emitting device in accordance with a third embodiment of the present application. -
FIGS. 8A-8B are a schematic top view and a cross-sectional view of a light-emitting device in accordance with a fourth embodiment of the present application. -
FIGS. 9A-9H are schematic cross-sectional views of a light-emitting device in accordance with a fifth embodiment of the present application. -
FIGS. 10A-10F are schematic top views of the light-emitting device in accordance with a fifth embodiment of the present application. -
FIG. 11 is a schematic cross-sectional view of a light source element including a light-emitting device of the present application. -
FIG. 12 is a schematic cross-sectional view of a backlight module including a light-emitting device of the present application. - Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- Referring to
FIG. 5A , the schematic top view shows a light-emittingdevice 10 in accordance with a first embodiment of the present application.FIG. 5B illustrates a cross-sectional view of the light-emittingdevice 10 along the B-B′ line in theFIG. 5A . The light-emittingdevice 10 such as an LED includes asubstrate 100, abuffer layer 110, afirst semiconductor layer 120, a light-emittinglayer 130, asecond semiconductor layer 140, afirst electrode 151, asecond electrode 152, a first andsecond pad device 10 is a rectangular cube. Each side of the light-emittingdevice 10 is about 610 μm in length. The area of the top surface is 3.72×105 μm2, and the area of the light-emittinglayer 130 is accorded with the area of the top surface. Thebuffer layer 110,first semiconductor layer 120, light-emittinglayer 130, andsecond semiconductor layer 140 are formed on thesubstrate 100 by the method of metal organic chemical vapor deposition (MOCVD) or molecular-beam epitaxy (MBE). - After forming the epitaxial structure, an etching step is performed. A
trench 170 is formed in the epitaxial structure by etching the epitaxial structure. A part of thefirst semiconductor layer 120 is exposed through thetrench 170. Thetrench 170 is formed in a rectangular spiral shape, and the un-etched epitaxial structure is also formed in a rectangular spiral shape. - Next, the
first electrode 151 and thefirst pad 161 are formed on the exposed surface of thefirst semiconductor layer 120. The shape offirst electrode 151 is the same as the rectangular spiral shape of thetrench 170, and the width of thefirst electrode 151 is about 22 μm. The position offirst pad 161 can be between two end points of thefirst electrode 151 or in a non-end portion of thefirst electrode 151. In this embodiment, thefirst pad 161 is disposed at the non-end portion of thefirst electrode 151. Because the light-emittingdevice 10 has a larger light-emitting area, a larger operating current is necessary for a higher emitting efficiency. In order to achieve the larger amount of injected current, more pads area for current injecting are necessary. In this embodiment, the area of thefirst pad 161 is designed to be capable of containing at least two wires for current injecting, and the light-emitting device has enough wires for current injecting to improve the light-emitting efficiency. The area of thefirst pad 161 is 1.9×104 μm2′ in the embodiment. - Further, the
second electrode 152 and thesecond pad 162 are formed and connected with each other on the remained epitaxial structure. The width of thesecond electrode 152 is about 20 μm, and the shape of it is a rectangular spiral. Thesecond pad 162 can be situated between two end points of thesecond electrode 152 or on a non-end portion of thesecond electrode 152. In this embodiment, thesecond pad 162 is situated on the non-end portion of thesecond electrode 152. Similarly, in order to achieve a larger injected current, in this embodiment, the area of thesecond pad 162 is designed to be capable of containing at least two wires for current injecting, thus the light-emitting device has enough amounts of wires for current injecting to improve the light-emitting efficiency. The area of thesecond pad 162 is 1.73×104 μm2 in the embodiment. - The shapes of the
first pad 161 and thesecond pad 162 include rectangular shape, circular shape, or any other shapes. Thefirst pad 161 and thesecond pad 162 including bonding regions are disposed on the first and the second electrodes respectively. In the embodiment, both shapes of thefirst pad 161 and thesecond pad 162 are two overlapped circles.Bonding regions first pad 161, andbonding regions second pad 162 can provide a better identification and avoid duplicate bonding of two wires on the same pad. There are wires connecting to thebonding regions FIG. 5C , the schematic cross-sectional view shows apad 161 with Au bonding bulges 180A and 180B formed on thebonding regions wires bonding regions - The direction of the spiral shape is clockwise or counterclockwise, and the numbers of spiral are not limited. The material of the
substrate 100 includes but is not limited to sapphire. The material of thebuffer layer 110 includes but is not limited to AlN, AlGaN, or GaN. The material of thefirst semiconductor layer 120 includes but is not limited to (AlxGa1-x)yIn1-yN wherein 0≦x≦1 and 0≦y≦1. The light-emittinglayer 130 includes but is not limited to a double heterostructure or a multi-quantum well including materials such as (AlpGa1-q)qIn1-qN wherein 0≦p≦1 and 0≦q≦1. The material of thesecond semiconductor layer 140 includes but is not limited to (AlaGa1-a)bIn1-bN wherein 0≦a≦1 and 0≦b≦1. - The material of the
first electrode 151 is selected from materials which can be formed an ohmic contact with thefirst semiconductor layer 120, such as a single layer, multiple layers or alloy selected from Ti, Al, and Au, or other metal-oxide conductive material. Thefirst Dad 161 includes but is not limited to a single layer, multiple layer or alloy selected from Ti, Al, and Au. The material of thesecond electrode 152 is selected from materials which can be formed an ohmic contact with thesecond semiconductor layer 140, such as a single layer, multiple layers or alloy selected from Ni and Au, or other metal-oxide conductive material. Thesecond pad 162 includes but is not limited to a single layer, multiple layer or alloy selected from Ni and Au. - The areas of the
first pad 161 and thesecond pad 162 do not need to satisfy the condition of having the area capable of accommodating at least two wires for current injecting at the same time. It can be one of thefirst pad 161 and thesecond pad 162 satisfying the condition that the area of pad is capable of containing at least two wires. - Referring to
FIG. 6A , the schematic top view shows a light-emittingdevice 20 in accordance with a second embodiment of the present invention.FIG. 6B illustrates a cross-sectional view of the light-emittingdevice 20 along the C-C′ line in theFIG. 6A . The light-emittingdevice 20 includes asubstrate 200, anadhesive layer 210, a currentconductive layer 280, afirst semiconductor layer 220, a light-emittinglayer 230, asecond semiconductor layer 240, afirst electrode 251, asecond electrode 252, a first andsecond pad device 20 is a rectangular cube, and the length of each side is about 787 μm. The area of the top surface is 6.19×105 μm2, and the area of the light-emittinglayer 230 is in accord with the area of the top surface. The epitaxial structure of the light-emittingdevice 20 is formed on a growth substrate (not illustrated). After the epitaxial structure is grown, a currentconductive layer 280 with a high current conductivity is fouled on thefirst semiconductor layer 220, which can spread the current injected from the electrode. Next, the epitaxial structure and thesubstrate 200 are adhered together by theadhesive layer 210. - After the adhering step, a
trench 270 is formed in the epitaxial structure by etching the epitaxial structure. A part of the currentconductive layer 280 is exposed through thetrench 270. Thetrench 270 is formed in a fingered shape; the finger is extended from the first side to the opposite second side of the light-emittingdevice 20. The un-etched epitaxial structure also forms a fingered shape. - Next, the
first electrode 251 and thefirst pad 261 are framed on the exposed surface of the currentconductive layer 280. The shape of thefirst electrode 251 is the same as the fingered shape of thetrench 270, and thefirst electrode 251 includes at least three linearly extending electrodes and a laterally extending electrode connected the three linearly extending electrodes. The width of thefirst electrode 251 is about 23 μm. Thefirst pad 261 can be situated between two end points of thefirst electrode 251 or on a non-end portion of thefirst electrode 251. In this embodiment, thefirst pad 261 is situated on the non-end portion of thefirst electrode 251. Similarly, in order to achieve a higher emitting efficiency, in this embodiment, the area of thefirst pad 261 is designed to be capable of containing at least two wires for current injecting so the light-emittingdevice 20 has enough wires for current injection. The area of thefirst pad 261 is 2.15×104 μm2 in the embodiment. - Further, the
second electrode 252 and thesecond pad 262 are formed and connected with each other on the remained epitaxial structure. Thesecond electrode 252 includes three linearly extending electrodes extended from the second side to the opposite first side of the light-emittingdevice 20, and interdigitated between the three linearly extending electrode of thefirst electrode 251, and a laterally extending electrode connecting the three linearly extending electrodes. The width of thesecond electrode 252 is about 20 μm. Thesecond pad 262 is disposed at the second side and connected with thesecond electrode 252. The area of thesecond pad 262 is 1.27×104 μm2 in the embodiment. - In this embodiment, the shape of the
second pad 262 is rectangular, and thesecond pad 262 is situated on the non-end portion of thesecond electrode 152. Thefirst pad 261 is capable of containing twobonding regions regions second pad 262 has a circular shape, and only onebonding region 262A which connects to a wire electrically. The area of thesecond pad 262 is also can be designed as an size containing at least two wires, such as the area of thesecond pad 262 is 1.5×104 μm2. - The material of the growth substrate includes but is not limited to sapphire, SiC, GaN, GaAs, or GaP. The material of the
substrate 200 includes but is not limited to SiC, GaN, GaP, Si, AIN, ZnO, MgO, MgAl2O4, GaAs, glass, sapphire, metal, or compound materials. Theadhesive layer 210 includes a conductive adhesive layer or an insulating adhesive layer. The material of the conductive adhesive layer includes but is not limited to Ag, Au, Al, In, or Sn, or alloy of them, spontaneous conductive polymer, or polymer doped with metal like Al, Au, Pt, Zn, Ag, Ni, Ge, In, Sn, Ti, Pb, Cu, Pd, or other metals. The material of the insulating adhesive layer includes but is not limited to spin on glass (SOG), silicone, benzocyclobutene (BCB), epoxy, polyimide (PI), or perfluorocyclobutane (PFCB). When theadhesive layer 210 is the insulating adhesive layer, the material of thesubstrate 200 is not limited. In the embodiment, the material of thesubstrate 200 is Si. The material of Si has a higher heat transfer coefficient to transfer the heat produced by the light-emitting device to the environment. A reflective layer is further disposed on one side of theadhesive layer 210. The material of the reflective layer includes but is not limited to metal, oxide, or the combination thereof. The oxide material for the reflective layer includes but is not limited to AlOx, SiOx, or SiNx. - When the
adhesive layer 210 is the conductive adhesive layer, the material of thesubstrate 200 includes but is not limited to glass, sapphire, or AlN. It also can disposes an insulating layer between the currentconductive layer 280 and theadhesive layer 210, or theadhesive layer 210 and thesubstrate 200, wherein the material of thesubstrate 200 is not limited. Referring toFIG. 7 , a cross-sectional view shows a light-emitting device in accordance with a third embodiment of the present invention.FIG. 7 illustrates an insulatinglayer 690 disposed between theadhesive layer 210 and the currentconductive layer 280 for isolation. The material of the insulating layer includes but is not limited to SiNx or SiO2. The material of thefirst semiconductor layer 220 includes but is not limited to (AlxGa1-m)rIn1-rN wherein 0≦m≦1 and 0≦r≦1 or (AlcGa1-c)dIn1-dP wherein 0≦c≦1 and 0≦d≦1. The light-emittinglayer 230 includes but is not limited to a double heterostructure or a multi-quantum well including materials such as (AleGa1-e)fIn1-pN wherein 0≦k≦1 and 0≦p≦1 or (AlsGa1-s)tIn1-tP wherein 0≦s≦1 and 0≦t≦1. The material of thesecond semiconductor layer 240 includes but is not limited to (AlkGa1-k)pIn1-pN wherein 0≦k≦1 and 0≦p≦1 or (AlsGa1-s)tIn1-tP wherein 0≦s≦1 and 0≦t≦1. - The material of the
first electrode 251 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ni, and Au, or other conductive metal oxide layer. The material offirst pad 261 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ni, and Au. The material of thesecond electrode 252 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ti, Al, and Au, or conductive metal oxide layer. Thesecond pad 262 includes but is not limited to a single metal layer, multiple metal layers or alloy of Ti, Al, and Au. The shapes of thefirst electrode 251 and thesecond electrode 252 include M linearly extending electrodes respectively, wherein M≧1. Thefirst electrode 251 can include M linearly extending electrodes, wherein M≧1, and thesecond electrode 252 includes M−1 linearly extending electrodes. - Referring to
FIG. 8A , the schematic top view shows a light-emittingdevice 30 in accordance with a fourth embodiment of the present invention.FIG. 8B illustrates a cross-sectional view of the light-emittingdevice 30 along the D-D′ line in theFIG. 8A . The structure of the light-emittingdevice 30 is similar to that of the light-emittingdevice 10 including asubstrate 100, abuffer layer 110, afirst semiconductor layer 120, a light-emittinglayer 130, and asecond semiconductor layer 140. After forming the epitaxial structure, a currentconductive layer 380 is disposed on thesecond semiconductor layer 140. In the embodiment, the light-emitting device 300 is a rectangular cube and the length of each side of the light-emittingdevice 30 is about 1143 μm. The area of the top surface is 1.3 1×106 μm2, and the area of the light-emittinglayer 130 is in accord with the area of the top surface. - After the step of forming the current
conductive layer 380, an etching step is performed. Atrench 370 is formed in the currentconductive layer 380 and the epitaxial structure by etching part of them. A part of thefirst semiconductor layer 120 is exposed through thetrench 370. The shape of thetrench 370 is formed in a pair of spiral, and the un-etched currentconductive layer 380 and epitaxial structure are also formed in a pair of spiral shape. - Referring to HG. 8A, the light-emitting
device 30 includes a pair offirst electrodes 351A and 351B and a pair ofsecond electrodes trench 370 is formed, thefirst electrodes 351A and 351B, andfirst pads first semiconductor layer 120. The shape offirst electrodes 351A and 351B are the same as the pair of spiral shape of thetrench 370. The width of thefirst electrodes 351A or 351B is about 10 μm respectively.First pads first electrodes 351A and 351B or on a non-end portion offirst electrodes 351A and 351B. In this embodiment,first pads first electrodes 351A and 351B near a first side of the light-emittingdevice 30 and a second side opposite to the first side. The area offirst pad - Further, the
second electrodes second pad 362 are formed on the remained currentconductive layer 380. The width of thesecond electrode second electrodes second pads 362 respectively. Thesecond pad 362 can be disposed at a third side neighboring with the first side and the second side, and connect tosecond electrodes second pad 362 is designed to be capable of containing at least two wires for current injection so the light-emittingdevice 30 has enough current to higher brightness. The area of thesecond pad 362 is 1.9×104 μm2 in the embodiment. - In the embodiment, the shape of the
second pad 362 formed as two circles partially overlapped includes twobonding region bonding regions device 30 receives enough current by wires to have sufficient electrons and holes to recombine and then emits light. The shape of the light-emittingdevice 30 includes but is not limited to a square shape or a rectangular shape. The material of the currentconductive layers - The above mentioned embodiments from the first embodiment to the fourth embodiment of the present application are horizontal light-emitting device structures, wherein the first conductive structure and the second conductive structure are at the same side of the substrate. A fifth embodiment of the present application is a vertical light-emitting device structure, wherein the first conductive structure and the second conductive structure are at the opposite sides of the substrate. The fifth embodiment of the present application discloses a light-emitting
device 50 comprising aconductive substrate 521, anadhesive layer 506 on theconductive substrate 521, areflection layer 505 on theadhesive layer 506, asecond semiconductor layer 504 on thereflection layer 505, a light-emittinglayer 503 on thesecond semiconductor layer 504, afirst semiconductor layer 502 on the light-emittinglayer 503, at least onetrench 508 through thefirst semiconductor layer 502, and a firstconductive structure 512 on thefirst semiconductor layer 502, wherein the firstconductive structure 512 comprises afirst electrode 514 and afirst pad 513, as shown inFIGS. 9H , and 10A-10F. The method of forming a light-emittingdevice 50 comprises providing agrowth substrate 501, as shown inFIG. 9A , and growing afirst semiconductor layer 502, a light-emittinglayer 503, and asecond semiconductor layer 504 in sequence on thegrowth substrate 501 by the metal-organic chemical vapor deposition (MOCVD) method, as shown inFIG. 9B . Thegrowth substrate 501 mentioned above can be sapphire. Thefirst semiconductor layer 502, the light-emittinglayer 503 and thesecond semiconductor layer 504 mentioned above comprise III-V group compound such as AlGaInN series material. - Referring to
FIG. 9C , areflection layer 505 is formed on thesecond semiconductor layer 504. Referring toFIG. 9D , aconductive substrate 521 is provided, and anadhesive layer 506 is formed on theconductive substrate 521. Theconductive substrate 521 can be Si, Ge, Cu, Mo, and ZnO. As indicated inFIG. 9E , the reflection layer is connected with the conductive substrate by the adhesive layer. Thegrowth substrate 501 is removed bylaser irradiation 522, then thestructure 40 is formed asFIG. 9F shows. Theadhesive layer 506 comprises soldering tin, low temperature metal, metal silicides, PbSn, AuGe, AuBe, AuSi, Sn, In, and PdIn. Thereflection layer 505 comprises Ag, Al, Zn, Mg, Ru, Ti, Rh, Cr, and Pt. - As
FIG. 9G shows, amask layer 507 is formed on thefirst semiconductor layer 502, such that a portion of thefirst semiconductor layer 502 is covered by themask layer 507. Other portion of thefirst semiconductor layer 502 not covered by themask layer 507 is etched by inductively coupled plasma (ICP)etching 523. AsFIG. 9H shows, at least onetrench 508 is formed. After removing themask layer 507, a plurality ofplatforms 509 are formed. At least onetrench 508 is formed through thefirst semiconductor layer 502 and a plurality ofplatforms 509 are formed on thefirst semiconductor layer 502. Finally, a firstconductive structure 512 is formed on theplatforms 509 so the light-emittingdevice 50 is formed. The firstconductive structure 512 comprises Ni, Au, Pt, Pd, Mg, Cu, Zn, Ag, Sc, Co, Rh, Li, Be, Ca, Ru, Re, Ti, Ta, Na, and La.FIGS. 10A-10F show the top views of the light-emittingdevice 50. The firstconductive structure 512 comprises afirst electrode 514 and afirst pad 513 where in the area of thefirst pad 513 is between 1.5×104 μm2 and 6.2×104 μm2 in the embodiment. Theconductive substrate 521 is electrically connecting with thesecond semiconductor layer 504, so it can be used for a second conductive structure of the light-emittingdevice 50. - The
first semiconductor layer 502 has a thickness H, and thetrench 508 has a depth h. TABLE.1 shows the differences between the light output power (IV) and the depth of the trench (h) in thelight emitting device 50. As TABLE.1 shows, Sample no. 0 is a reference sample having a depth of the trench h of 0, which means thefirst semiconductor layer 502 has no trenches. The light output power of the Sample no. 0 is 455 mW. The h of the Sample no 1 is between 0 and H/3, and the light output power is 455.91 mW. The difference of light output power between the Sample no. 0 and 1, ΔIv, equals to [(455.91−455)×100%]/455, and the ΔIv value of the Sample no. 1 is 0.2%. The h of the Sample no. 2 is between H/3 and 2H/3, and the light output power is 461.37 mW. The difference of light output power between the Sample no. 0 and 2, ΔIv, equals to [(461.37-455)×100%]/455, and the ΔIv value of the Sample no. 2 is 1.4%. The h of the Sample no. 3 is between 2H/3 and H, and the light output power is 463.65 mW. The difference of light output power between the Sample no. 0 and 3, ΔIv, equals to [(463.65−455)×100%]/455, and the ΔIv value of the Sample no. 3 is 1.9%. The h of the Sample no. 4 is greater than H, and the light output power is 439.99. The difference of light output power between the Sample no. 0 and 4, ΔIv, equals to [(439.99−455)Δ100%]/455, and the ΔIv value of the Sample no. 4 is −3.3%. -
TABLE 1 Sample no. h (μm) Iv (mW) ΔIv (%) 0 0 455 — 1 0 < h ≦ H/3 455.91 0.2 2 H/3 < h ≦ 2H/3 461.37 1.4 3 2H/3 < h ≦ H 463.65 1.9 4 h > H 439.99 −3.3 - TABLE.1 shows that when the h is between H/3 and H, the difference of the light output power with Sample No. 0 increases. But when the h is greater than H, the difference of the light output power with Sample No. 0 decreases. One reason the light output power of the light-emitting
device 50 increases is the area of the sidewall of thetrenches 508 is enlarged when the depth h of thetrenches 508 is increased, and the light output power is also increased. Another reason the light output power of the light-emittingdevice 50 increases when the depth of the trenches h is increasing is that the thickness of thefirst semiconductor layer 502 in the trenches is decreased so the light absorbed by thefirst semiconductor layer 502 is also decreased. In other words, the larger the depth of thetrenches 508 is, the higher the light output of the light-emittingdevice 50 has. But when the depth of thetrenches 508 is greater than H, it means that inductively coupled plasma (ICP) etching 523 etches the portion of thefirst semiconductor layer 502 from the top surface of thefirst semiconductor layer 511 to the light-emittinglayer 503. Because the light-emittinglayer 503 is etched, the light output of the light-emittingdevice 50 is decreased. - Because the
first semiconductor layer 502 serves to spread current, it can not be etched too much. If the area of the top surface of thefirst semiconductor layer 511 is 1 mm2, the area of the a plurality ofplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511, ie. 0.5 mm2.FIGS. 10A and 10B show top views of thetrenches 508 of a plurality of circles formed through thefirst semiconductor layer 502, and the depth h of thetrenches 508 are between H/3 and H, wherein H is the thickness of thefirst semiconductor layer 502. Theplatforms 509 are the area other than the plurality oftrenches 508, and the firstconductive structure 512 comprises afirst electrode 514 encompassing the edge and central regions of the light-emitting device and afirst pad 513. In the embodiment, the area of theplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511, and the area of thefirst pad 513 is between 1.5×104 μm2 and 6.2×104 μm2.FIG. 10C shows a top view of thetrenches 508 of two stripes with round corners formed through thefirst semiconductor layer 502 and between thefirst electrodes 514, and the depth h of the trenches are between H/3 and H, wherein H is the thickness of thefirst semiconductor layer 502. Theplatforms 509 are the area other than the twotrenches 508, and the firstconductive structure 512 comprises twofirst electrodes 514 and twofirst pads 513. In the embodiment, the area of theplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511, and the area of thefirst pads 513 is between 1.5×104 μm2 and 6.2×104 μm2.FIG. 10D shows a top view of thetrench 508 of one stripe with round corners formed through thefirst semiconductor layer 502 and between thefirst electrodes 514, and the depth h of the trenches are between H/3 and H, wherein H is the thickness of thefirst semiconductor layer 502. Theplatforms 509 are the area other than thetrench 508, and the firstconductive structure 512 comprises twofirst electrodes 514 encompassing the edge regions of the light-emitting device and twofirst pads 513. In the embodiment, the area of theplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511 and the area of thefirst pads 513 is between 1.5×10 μm2 and 6.2×104 μm2.FIG. 10E shows a top view of thetrenches 508 of two stripes formed through thefirst semiconductor layer 502 and between thefirst electrodes 514, and the depth h of the trenches are between H/3 and H, wherein H is the thickness of the first semiconductor layer. Theplatforms 509 are the area other than the twotrenches 508, and the firstconductive structure 512 comprises twofirst electrodes 514 encompassing the edge and central regions of the light-emitting device and twofirst pads 513. In the embodiment, the area of theplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511, and the area of thefirst pad 513 is between 1.5×104 μm2 and 6.2×104 μm2.FIG. 10F shows a top view of thetrenches 508 of two stripes with round corners formed through thefirst semiconductor layer 502 and between thefirst electrodes 514, and the depth h of the trenches are between H/3 and H, wherein H is the thickness of thefirst semiconductor layer 502. Theplatforms 509 are the area other than the twotrenches 508, and the firstconductive structure 512 comprises threefirst electrodes 514 and onefirst pad 513. In the embodiment, the area of theplatforms 509 is preferred to be greater than a half of the area of the top surface of thefirst semiconductor layer 511, and the area of thefirst pad 513 is between 1.5×104 μm2 and 6.2×104 μm2. - Referring to
FIG. 11 , the schematic cross-sectional view shows alight source apparatus 90 in accordance with a sixth embodiment of the present application. Thelight source apparatus 90 includes a light-emitting device of above embodiments. Thelight source apparatus 7 is a lighting apparatus such as streetlamps, vehicle lamps, or indoor lightings. It also can be traffic lights or backlights of a module in a planar display. Thelight source apparatus 90 includes alight source 910 with the light-emitting device of above embodiments, apower supply system 920, and acontrol element 930 for controlling thepower supply system 920. - Referring to
FIG. 12 , the schematic cross-sectional view shows abacklight module 95 in accordance with a seventh embodiment of the present application. Thebacklight module 95 includes thelight source apparatus 90 and anoptical element 1010. Theoptical element 1010 is used to operate the light emitted from thelight source apparatus 90 to satisfy the requirements of the backlight. Theoptical element 1010 includes a photonic lattice, a color filter, a wavelength conversion layer, an antireflective layer, a lens or the combination thereof. - It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present application without departing from the scope or spirit of the application. In view of this, it is intended that the present application covers modifications and variations of this application provided they fall within the scope of the following claims and their equivalents.
Claims (11)
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US12/292,593 US8188505B2 (en) | 2007-11-23 | 2008-11-21 | Light-emitting device |
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US10355174B2 (en) * | 2015-07-15 | 2019-07-16 | Osram Opto Semiconductors Gmbh | Component having improved coupling-out properties |
CN107017322A (en) * | 2015-12-22 | 2017-08-04 | 晶元光电股份有限公司 | Luminescence component |
CN109564958A (en) * | 2016-08-05 | 2019-04-02 | 首尔伟傲世有限公司 | Light-emitting component |
US20210119084A1 (en) * | 2017-02-15 | 2021-04-22 | Epistar Corporation | Optoelectronic device |
US11705539B2 (en) * | 2017-02-15 | 2023-07-18 | Epistar Corporation | Optoelectronic device with transparent insulated current blocking region and uniform current spreading |
CN110462835A (en) * | 2017-03-27 | 2019-11-15 | Lg伊诺特有限公司 | Semiconductor devices |
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