US20110220328A1 - Flexible heat pipe and manufacturing method thereof - Google Patents

Flexible heat pipe and manufacturing method thereof Download PDF

Info

Publication number
US20110220328A1
US20110220328A1 US12/720,301 US72030110A US2011220328A1 US 20110220328 A1 US20110220328 A1 US 20110220328A1 US 72030110 A US72030110 A US 72030110A US 2011220328 A1 US2011220328 A1 US 2011220328A1
Authority
US
United States
Prior art keywords
tube body
heat pipe
annular elastomer
flexible heat
encapsulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/720,301
Inventor
Yu- Po HUANG
Tung-Jung Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN JUE-CHUNG ELECTRONICS Co Ltd
Kunshan Jue Chung Electronics Co Ltd
Original Assignee
Kunshan Jue Chung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Jue Chung Electronics Co Ltd filed Critical Kunshan Jue Chung Electronics Co Ltd
Priority to US12/720,301 priority Critical patent/US20110220328A1/en
Assigned to KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. reassignment KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, YU- PO, KUO, TUNG-JUNG
Publication of US20110220328A1 publication Critical patent/US20110220328A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Definitions

  • the present invention generally relates to heat pipes, in particular to a flexible heat pipe and a manufacturing method of the flexible heat pipe.
  • a conventional heat pipe comprises a metal tube body, a wick structure and a working fluid, wherein the metal tube body includes a sealed chamber, and the wick structure is installed on an internal wall of the metal tube body, and the working fluid is filled in the sealed chamber of the metal tube body, and a gas passage is formed on an internal side of the wick structure, and the wick structure includes a liquid passage.
  • the space limitation of the surrounding environment and the heat conduction at different positions are generally taken into consideration, and thus most of the conventional heat pipes are bent into an L-shape or a U-shape.
  • the interior of the wick structure and the internal wall of the metal tube body of the bent heat pipe may be peeled of or fallen off easily, so that the heat conduction effect is reduced significantly.
  • most of the foregoing heat pipes can be bent once only in the manufacturing process, and a second bend of the heat pipe may crack the metal tube body easily.
  • the conventional heat pipe requires further improvements.
  • the present invention discloses a flexible heat pipe comprising a first tube body, a second tube body, a flexible section, a wick structure and a working fluid, wherein the second tube body is arranged apart from the first tube body, and the flexible section is interconnected to the first tube body and the second tube body, and the flexible section includes an annular elastomer and a soft encapsulating layer, and the annular elastomer is coupled to the first tube body and the second tube body, and the soft encapsulating layer is coupled to the first tube body and the second tube body and wrapped around the exterior of the annular elastomer; and the wick structure is disposed inside the first tube body, second tube body and the annular elastomer, and the working fluid is filled inside the first tube body, second tube body and the soft encapsulating layer.
  • the present invention provides a manufacturing method of a flexible heat pipe, and the manufacturing method comprises the steps of:
  • the present invention further has the following effects.
  • the invention uses the annular elastomer to support the soft encapsulating layer, so that the soft encapsulating layer will not sink or collapse easily. With each receiving section of the soft encapsulating layer sheathed onto each heat pipe tightly, a quick heat conduction effect can be achieved. Since the flexible material of the heat pipe allows the heat pipe to be adjusted and bent to any angle, the heat pipe will not be hardened easily and the integrity of its original structure will remain even after the pipe has been adjusted and bent repeatedly for many times.
  • FIG. 1 is an exploded view of a heat pipe in accordance with present invention
  • FIG. 2 is a perspective view of a heat pipe in accordance with present invention
  • FIG. 3 is a partial cross-sectional view of a heat pipe in accordance with present invention.
  • FIG. 4 is a cross-sectional view of a heat conducting module after being bent in accordance with present invention.
  • FIG. 5 is a flow chart of a manufacturing method of a heat pipe in accordance with the present invention.
  • FIG. 6 is a schematic view of a heat pipe applied to an electronic heat-generating component in accordance with the present invention
  • the present invention provides a flexible heat pipe comprising a first tube body 10 , a second tube body 20 , a flexible section 30 , a wick structure 40 and a working fluid (not shown in the figure).
  • the second tube body 20 is arranged apart from the first tube body 10 , and both of the first tube body 10 and the second tube body 20 are vertical tubes, and each tube body 10 , 20 is made of a good thermal conducting material such as copper.
  • the flexible section 30 includes an annular elastomer 31 and a soft encapsulating layer 32 , and the annular elastomer 31 can be bent in its axial direction, wherein the annular elastomer 31 of this preferred embodiment is a helical spring, but the invention is not limited to such arrangement only.
  • the soft encapsulating layer 32 is disposed and wrapped around the external surface of the annular elastomer 31 , wherein the soft encapsulating layer 32 of this preferred embodiment is a copper foil, but the invention is not limited to such arrangement only.
  • the helical spring type elastomer 31 has a free length smaller than the axial length of the soft encapsulating layer 32 , such that when the soft encapsulating layer 32 is wrapped around the exterior of the elastomer 31 , a receiving section 321 , 322 can be formed separately at both ends of the soft encapsulating layer 32 (as shown in FIG. 3 ) for coupling the first tube body 10 and the second tube body 20 , and each tube body 10 , 20 is coupled to the soft encapsulating layer 32 with a thermal contact.
  • the wick structure 40 is made of a metal mesh, a steel wire, or a fiber material, or sintered with a metal powder, wherein the wick structure 40 of this preferred embodiment includes a first wick structure 41 , 42 installed in each tube body 10 , 20 and a second wick structure 43 passed into the annular elastomer 31 and contacted with each first wick structure 41 , 42 .
  • the working fluid can be pure water filled inside each tube body 10 , 20 .
  • Each tube body 10 , 20 is vacuumed, such that a vapor-liquid phase change mechanism for conducting heat can be achieved.
  • the flexible section 30 can be bent to any angle or in any direction according to actual demands of the heat pipe, wherein the annular elastomer 31 is provided for supporting the soft encapsulating layer 32 , so that the soft encapsulating layer 32 will not sink or collapse easily.
  • the tight sheathing between each receiving section 321 , 322 of the soft encapsulating layer 32 and each heat pipe 10 , 20 a quick conduction effect can be achieved.
  • a manufacturing method of a heat pipe in accordance with the present invention comprises the steps of:
  • each tube body 10 , 20 and the annular elastomer 31 in Steps (b) and (d) are coupled by a soldering method, and the soft encapsulating layer 32 and each tube body 10 , 20 in Step (e) are coupled by the soldering method.
  • the manufacturing method of a heat pipe in accordance with the present invention further comprises a Step f) of filling a working fluid into the second tube body 20 , and vacuuming and sealing the first tube body 10 and the second tube body 20 .
  • the heat pipe of the present invention can be combined with a fin module 6 for dissipating the heat generated by an electronic heat-generating component 8 (such as a CPU chip) installed on a mainboard 7 .
  • a heat plate 9 is attached onto a heat-generating surface of the electronic heat-generating component 8 , such that the heat generated by the electronic heat-generating component 8 will be absorbed by the heat plate 9 , and then the vapor-liquid phase change occurred at the first tube body 10 will conduct the heat to the soft encapsulating layer 32 , and then conduct the heat from the soft encapsulating layer 32 to the second tube body 20 , and the heat at the second tube body 20 will be dissipated to the outside by the fin module 6 . Since the flexible section 30 can be adjusted and bent to any angle, the heat pipe will not be hardened easily and the integrity of its original structure will remain, even after the pipe has been adjusted and bent repeatedly for many times.
  • the flexible heat pipe and the method of manufacturing the flexible heat pipe definitely can achieve the expected using purposes and overcome the shortcomings of the prior art.
  • the invention complies with the patent application requirements, and is thus duly filed for patent application. While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

In a flexible heat pipe and a manufacturing method thereof, the flexible heat pipe includes a first tube body, a second tube body arranged apart from the first tube body, a flexible section, a wick structure, and a working fluid. The flexible section includes an annular elastomer and a soft encapsulating layer. The annular elastomer connects the first tube body and the second tube body. The soft encapsulating layer is set around the annular elastomer. The capillary structure is settled inside the first tube body, the second tube body, and the annular elastomer. The working fluid is filled inside the first tube body, the second tube body, and the soft encapsulating layer. Then, the flexible heat pipe can be bent to any angle or in any direction according to practical demands.

Description

    FIELD OF THE INVENTION
  • The present invention generally relates to heat pipes, in particular to a flexible heat pipe and a manufacturing method of the flexible heat pipe.
  • BACKGROUND OF THE INVENTION
  • As computer components such as a central processing unit (CPU) come with an increasingly higher computing speed, the heat generated by the components also becomes increasingly greater. Obviously, the use of a heat sink composed of a plurality of heat dissipating fins and a fan in the past no longer meets the requirement of the high-speed operation of the present CPUs. Therefore, some manufacturers developed a heat dissipating device that combines a heat pipe with heat dissipating fins to overcome the heat dissipation problem of the present CPUs. However, existing heat pipes still have a drawback of occupying much space, and thus it is a main subject for related manufacturers and developers to improve the conventional heat pipes.
  • In general, a conventional heat pipe comprises a metal tube body, a wick structure and a working fluid, wherein the metal tube body includes a sealed chamber, and the wick structure is installed on an internal wall of the metal tube body, and the working fluid is filled in the sealed chamber of the metal tube body, and a gas passage is formed on an internal side of the wick structure, and the wick structure includes a liquid passage.
  • When the foregoing heat pipe is used, the space limitation of the surrounding environment and the heat conduction at different positions are generally taken into consideration, and thus most of the conventional heat pipes are bent into an L-shape or a U-shape. However, the interior of the wick structure and the internal wall of the metal tube body of the bent heat pipe may be peeled of or fallen off easily, so that the heat conduction effect is reduced significantly. Furthermore, most of the foregoing heat pipes can be bent once only in the manufacturing process, and a second bend of the heat pipe may crack the metal tube body easily. Obviously, the conventional heat pipe requires further improvements.
  • SUMMARY OF THE INVENTION
  • Therefore, it is a primary objective of the present invention to provide a flexible heat pipe and its manufacturing method, and the flexible heat pipe can be bent to any angle or in any direction according to practical demands.
  • To achieve the foregoing objective, the present invention discloses a flexible heat pipe comprising a first tube body, a second tube body, a flexible section, a wick structure and a working fluid, wherein the second tube body is arranged apart from the first tube body, and the flexible section is interconnected to the first tube body and the second tube body, and the flexible section includes an annular elastomer and a soft encapsulating layer, and the annular elastomer is coupled to the first tube body and the second tube body, and the soft encapsulating layer is coupled to the first tube body and the second tube body and wrapped around the exterior of the annular elastomer; and the wick structure is disposed inside the first tube body, second tube body and the annular elastomer, and the working fluid is filled inside the first tube body, second tube body and the soft encapsulating layer.
  • To achieve the foregoing objective, the present invention provides a manufacturing method of a flexible heat pipe, and the manufacturing method comprises the steps of:
  • (a) providing a first tube body and a second tube body, both having a first wick structure;
  • (b) providing an annular elastomer with an end coupled to the first tube body;
  • (c) providing a second wick structure, passing the second wick structure into the annular elastomer and attaching the second wick to the first wick structure of the first tube body;
  • (d) coupling the second tube body to another end of the annular elastomer, and attaching the second wick structure to the first wick structure of the second tube body; and
  • (e) providing a soft encapsulating layer coupled to the first tube body and a second tube body and wrapped around the exterior of the annular elastomer.
  • The present invention further has the following effects. The invention uses the annular elastomer to support the soft encapsulating layer, so that the soft encapsulating layer will not sink or collapse easily. With each receiving section of the soft encapsulating layer sheathed onto each heat pipe tightly, a quick heat conduction effect can be achieved. Since the flexible material of the heat pipe allows the heat pipe to be adjusted and bent to any angle, the heat pipe will not be hardened easily and the integrity of its original structure will remain even after the pipe has been adjusted and bent repeatedly for many times.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat pipe in accordance with present invention;
  • FIG. 2 is a perspective view of a heat pipe in accordance with present invention;
  • FIG. 3 is a partial cross-sectional view of a heat pipe in accordance with present invention;
  • FIG. 4 is a cross-sectional view of a heat conducting module after being bent in accordance with present invention;
  • FIG. 5 is a flow chart of a manufacturing method of a heat pipe in accordance with the present invention; and
  • FIG. 6 is a schematic view of a heat pipe applied to an electronic heat-generating component in accordance with the present invention
  • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The technical characteristics and contents of the present invention will become apparent with the following detailed description accompanied with related drawings, and the drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.
  • With reference to FIGS. 1 to 3, the present invention provides a flexible heat pipe comprising a first tube body 10, a second tube body 20, a flexible section 30, a wick structure 40 and a working fluid (not shown in the figure).
  • The second tube body 20 is arranged apart from the first tube body 10, and both of the first tube body 10 and the second tube body 20 are vertical tubes, and each tube body 10, 20 is made of a good thermal conducting material such as copper.
  • The flexible section 30 includes an annular elastomer 31 and a soft encapsulating layer 32, and the annular elastomer 31 can be bent in its axial direction, wherein the annular elastomer 31 of this preferred embodiment is a helical spring, but the invention is not limited to such arrangement only. The soft encapsulating layer 32 is disposed and wrapped around the external surface of the annular elastomer 31, wherein the soft encapsulating layer 32 of this preferred embodiment is a copper foil, but the invention is not limited to such arrangement only. The helical spring type elastomer 31 has a free length smaller than the axial length of the soft encapsulating layer 32, such that when the soft encapsulating layer 32 is wrapped around the exterior of the elastomer 31, a receiving section 321, 322 can be formed separately at both ends of the soft encapsulating layer 32 (as shown in FIG. 3) for coupling the first tube body 10 and the second tube body 20, and each tube body 10, 20 is coupled to the soft encapsulating layer 32 with a thermal contact.
  • The wick structure 40 is made of a metal mesh, a steel wire, or a fiber material, or sintered with a metal powder, wherein the wick structure 40 of this preferred embodiment includes a first wick structure 41, 42 installed in each tube body 10, 20 and a second wick structure 43 passed into the annular elastomer 31 and contacted with each first wick structure 41, 42.
  • The working fluid can be pure water filled inside each tube body 10, 20. Each tube body 10, 20 is vacuumed, such that a vapor-liquid phase change mechanism for conducting heat can be achieved.
  • With reference to FIG. 4, the flexible section 30 can be bent to any angle or in any direction according to actual demands of the heat pipe, wherein the annular elastomer 31 is provided for supporting the soft encapsulating layer 32, so that the soft encapsulating layer 32 will not sink or collapse easily. With the tight sheathing between each receiving section 321, 322 of the soft encapsulating layer 32 and each heat pipe 10, 20, a quick conduction effect can be achieved.
  • With reference to FIG. 5, a manufacturing method of a heat pipe in accordance with the present invention comprises the steps of:
  • (a) providing a first tube body 10 and a second tube body 20, both having a first wick structure 41, 42;
  • (b) providing an annular elastomer 31 with an end coupled to the first tube body 10;
  • (c) providing a second wick structure 43, passing the second wick structure 43 into the annular elastomer 31, and attaching the second wick structure 43 to a first wick structure 41 of the first tube body 10;
  • (d) coupling the second tube body 20 to another end of the annular elastomer 31, and attaching the second wick structure 43 to a first wick structure 42 of the second tube body 20; and
  • (e) providing a soft encapsulating layer 32 coupled to the first tube body 10 and a second tube body 20 and wrapped around the exterior of the annular elastomer 31.
  • It is noteworthy to point out that each tube body 10, 20 and the annular elastomer 31 in Steps (b) and (d) are coupled by a soldering method, and the soft encapsulating layer 32 and each tube body 10, 20 in Step (e) are coupled by the soldering method.
  • In addition, the manufacturing method of a heat pipe in accordance with the present invention further comprises a Step f) of filling a working fluid into the second tube body 20, and vacuuming and sealing the first tube body 10 and the second tube body 20.
  • With reference to FIG. 6, the heat pipe of the present invention can be combined with a fin module 6 for dissipating the heat generated by an electronic heat-generating component 8 (such as a CPU chip) installed on a mainboard 7. A heat plate 9 is attached onto a heat-generating surface of the electronic heat-generating component 8, such that the heat generated by the electronic heat-generating component 8 will be absorbed by the heat plate 9, and then the vapor-liquid phase change occurred at the first tube body 10 will conduct the heat to the soft encapsulating layer 32, and then conduct the heat from the soft encapsulating layer 32 to the second tube body 20, and the heat at the second tube body 20 will be dissipated to the outside by the fin module 6. Since the flexible section 30 can be adjusted and bent to any angle, the heat pipe will not be hardened easily and the integrity of its original structure will remain, even after the pipe has been adjusted and bent repeatedly for many times.
  • In summation of the description above, the flexible heat pipe and the method of manufacturing the flexible heat pipe definitely can achieve the expected using purposes and overcome the shortcomings of the prior art. In addition, the invention complies with the patent application requirements, and is thus duly filed for patent application. While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims (10)

1. A flexible heat pipe, comprising:
a first tube body;
a second tube body, arranged apart from the first tube body;
a flexible section, interconnected to the first tube body and the second tube body, and including an annular elastomer and a soft encapsulating layer, and the annular elastomer being coupled to the first tube body and the second tube body, and the soft encapsulating layer being coupled to the first tube body and the second tube body and installed around an exterior of the annular elastomer;
a wick structure, installed inside the first tube body, the second tube body and the annular elastomer; and
a working fluid, filled inside the first tube body, the second tube body and the soft encapsulating layer.
2. The flexible heat pipe of claim 1, wherein the first tube body and the second tube body are vertical tubes.
3. The flexible heat pipe of claim 2, wherein the annular elastomer is a helical spring.
4. The flexible heat pipe of claim 3, wherein the soft encapsulating layer is a copper foil.
5. The flexible heat pipe of claim 4, wherein the helical spring has a free length smaller than an axial length of the copper foil, such that a receiving section is formed separately at both ends of the copper foil for passing and receiving the first tube body and the second tube body respectively.
6. A manufacturing method of a flexible heat pipe, comprising the steps of:
(a) providing a first tube body and a second tube body, both having a first wick structure;
(b) providing an annular elastomer with an end coupled to the first tube body;
(c) providing a second wick structure, passing the second wick structure into the annular elastomer and attaching the second wick to the first wick structure of the first tube body;
(d) coupling the second tube body to another end of the annular elastomer, and attaching the second wick structure to the first wick structure of the second tube body; and
(e) providing a soft encapsulating layer coupled to the first tube body and the second tube body and wrapped around an exterior of the annular elastomer.
7. The manufacturing method of a flexible heat pipe as recited in claim 6, wherein the first tube body and the annular elastomer in the Step (b) are coupled by a soldering method.
8. The manufacturing method of a flexible heat pipe as recited in claim 6, wherein the second tube body and the annular elastomer in the Step (d) are coupled by a soldering method.
9. The manufacturing method of a flexible heat pipe as recited in claim 6, wherein the soft encapsulating layer and each tube body in the Step (e) are coupled by a soldering method.
10. The manufacturing method of a flexible heat pipe as recited in claim 6, further comprising a step (f) of filling a working fluid into the second tube body, and vacuuming and sealing the first tube body and the second tube body.
US12/720,301 2010-03-09 2010-03-09 Flexible heat pipe and manufacturing method thereof Abandoned US20110220328A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/720,301 US20110220328A1 (en) 2010-03-09 2010-03-09 Flexible heat pipe and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/720,301 US20110220328A1 (en) 2010-03-09 2010-03-09 Flexible heat pipe and manufacturing method thereof

Publications (1)

Publication Number Publication Date
US20110220328A1 true US20110220328A1 (en) 2011-09-15

Family

ID=44558848

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/720,301 Abandoned US20110220328A1 (en) 2010-03-09 2010-03-09 Flexible heat pipe and manufacturing method thereof

Country Status (1)

Country Link
US (1) US20110220328A1 (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140060793A1 (en) * 2012-09-06 2014-03-06 Cooler Master Development Corporation Plate-type heat exchanger and support structure thereof
US20140318744A1 (en) * 2013-04-25 2014-10-30 Asia Vital Components Co., Ltd. Thermal module
US20150007965A1 (en) * 2013-07-05 2015-01-08 Toyota Motor Engineerig & Manufacturing North America, Inc. Cooling Assemblies Having Porous Three Dimensional Surfaces
CN104374221A (en) * 2014-11-05 2015-02-25 上海交通大学 Manufacturing method for heat pipe or vapor chamber based on combination of metal material and polymeric material
CN104396357A (en) * 2014-06-12 2015-03-04 华为技术有限公司 An intelligent terminal heat dissipation device and an intelligent terminal
CN105658022A (en) * 2014-11-13 2016-06-08 奇鋐科技股份有限公司 Wearable mobile device heat dissipation structure
US9466551B1 (en) * 2012-02-09 2016-10-11 Advanced Cooling Technologies, Inc. Heat transferring clamp
US20170363367A1 (en) * 2016-06-21 2017-12-21 Tai-Sol Electronics Co., Ltd. Heat dissipation device
CN107544645A (en) * 2016-06-27 2018-01-05 超众科技股份有限公司 Heat abstractor
WO2018139656A1 (en) * 2017-01-30 2018-08-02 古河電気工業株式会社 Vapor chamber
US20180238632A1 (en) * 2017-02-21 2018-08-23 Lenovo (Beijing) Co., Ltd. Heat pipe, radiator, and electronic device
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US20180372419A1 (en) * 2017-04-11 2018-12-27 Cooler Master Co., Ltd. Heat transfer device
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US10595439B2 (en) 2018-06-25 2020-03-17 Intel Corporation Movable heatsink utilizing flexible heat pipes
CN111829378A (en) * 2020-06-03 2020-10-27 广州大学 Multi-section hinge type flexible heat pipe
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US20210318074A1 (en) * 2020-04-08 2021-10-14 Lockheed Martin Corporation Heat transfer assemblies with compliant heat pipes
CN114501928A (en) * 2021-12-29 2022-05-13 联想(北京)有限公司 Heat dissipation device and electronic equipment
EP4001820A1 (en) * 2020-11-20 2022-05-25 Nokia Technologies Oy Oscillating heat pipe
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
US11469155B2 (en) * 2020-01-09 2022-10-11 Landis+Gyr Innovations, Inc. Flexible thermal coupling for a heat pipe
GB2610062A (en) * 2020-03-09 2023-02-22 Nvidia Corp Configurable heatsink
CN116379821A (en) * 2023-03-24 2023-07-04 中国原子能科学研究院 Heat pipe and manufacturing method thereof
CN116625150A (en) * 2023-07-21 2023-08-22 歌尔股份有限公司 Flexible flat heat pipe, preparation method thereof and electronic equipment
TWI814195B (en) * 2021-12-30 2023-09-01 索士亞科技股份有限公司 Anti-vibration heat dissipation module
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604503A (en) * 1968-08-02 1971-09-14 Energy Conversion Systems Inc Heat pipes
US3604504A (en) * 1970-05-13 1971-09-14 Rca Corp Flexible heat pipe
US4212347A (en) * 1978-12-20 1980-07-15 Thermacore, Inc. Unfurlable heat pipe
US4402358A (en) * 1982-10-15 1983-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe thermal switch
US4947825A (en) * 1989-09-11 1990-08-14 Rockwell International Corporation Solar concentrator - radiator assembly
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability
US20060048919A1 (en) * 2004-09-03 2006-03-09 Hul-Chun Hsu Wick structure of heat pipe
US20060086482A1 (en) * 2004-10-25 2006-04-27 Thayer John G Heat pipe with axial and lateral flexibility
US20070089864A1 (en) * 2005-10-24 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20080092973A1 (en) * 2006-10-20 2008-04-24 Tai-Sol Electronics Co., Ltd. Flexible heat pipe
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604503A (en) * 1968-08-02 1971-09-14 Energy Conversion Systems Inc Heat pipes
US3604504A (en) * 1970-05-13 1971-09-14 Rca Corp Flexible heat pipe
US4212347A (en) * 1978-12-20 1980-07-15 Thermacore, Inc. Unfurlable heat pipe
US4402358A (en) * 1982-10-15 1983-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe thermal switch
US4947825A (en) * 1989-09-11 1990-08-14 Rockwell International Corporation Solar concentrator - radiator assembly
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability
US20060048919A1 (en) * 2004-09-03 2006-03-09 Hul-Chun Hsu Wick structure of heat pipe
US20060086482A1 (en) * 2004-10-25 2006-04-27 Thayer John G Heat pipe with axial and lateral flexibility
US20070089864A1 (en) * 2005-10-24 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20080092973A1 (en) * 2006-10-20 2008-04-24 Tai-Sol Electronics Co., Ltd. Flexible heat pipe
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9466551B1 (en) * 2012-02-09 2016-10-11 Advanced Cooling Technologies, Inc. Heat transferring clamp
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
US20140060793A1 (en) * 2012-09-06 2014-03-06 Cooler Master Development Corporation Plate-type heat exchanger and support structure thereof
US20140318744A1 (en) * 2013-04-25 2014-10-30 Asia Vital Components Co., Ltd. Thermal module
US9772143B2 (en) * 2013-04-25 2017-09-26 Asia Vital Components Co., Ltd. Thermal module
US20150007965A1 (en) * 2013-07-05 2015-01-08 Toyota Motor Engineerig & Manufacturing North America, Inc. Cooling Assemblies Having Porous Three Dimensional Surfaces
US9803938B2 (en) * 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US10088879B2 (en) 2014-06-12 2018-10-02 Huawei Technologies Co., Ltd. Intelligent terminal heat dissipation apparatus and intelligent terminal
CN104396357A (en) * 2014-06-12 2015-03-04 华为技术有限公司 An intelligent terminal heat dissipation device and an intelligent terminal
WO2015188343A1 (en) * 2014-06-12 2015-12-17 华为技术有限公司 Intelligent terminal heat dissipation device and intelligent terminal
CN104374221A (en) * 2014-11-05 2015-02-25 上海交通大学 Manufacturing method for heat pipe or vapor chamber based on combination of metal material and polymeric material
CN105658022A (en) * 2014-11-13 2016-06-08 奇鋐科技股份有限公司 Wearable mobile device heat dissipation structure
US11313628B2 (en) * 2016-04-07 2022-04-26 Cooler Master Co., Ltd. Thermal conducting structure
US10935326B2 (en) * 2016-04-07 2021-03-02 Cooler Master Co., Ltd. Thermal conducting structure
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US20170363367A1 (en) * 2016-06-21 2017-12-21 Tai-Sol Electronics Co., Ltd. Heat dissipation device
CN107544645A (en) * 2016-06-27 2018-01-05 超众科技股份有限公司 Heat abstractor
JPWO2018139656A1 (en) * 2017-01-30 2019-06-27 古河電気工業株式会社 Vapor chamber
WO2018139656A1 (en) * 2017-01-30 2018-08-02 古河電気工業株式会社 Vapor chamber
US20180238632A1 (en) * 2017-02-21 2018-08-23 Lenovo (Beijing) Co., Ltd. Heat pipe, radiator, and electronic device
US20180372419A1 (en) * 2017-04-11 2018-12-27 Cooler Master Co., Ltd. Heat transfer device
US10345049B2 (en) * 2017-04-11 2019-07-09 Cooler Master Co., Ltd. Communication-type thermal conduction device
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US11320211B2 (en) * 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
US11680752B2 (en) 2018-05-29 2023-06-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11448470B2 (en) 2018-05-29 2022-09-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US10595439B2 (en) 2018-06-25 2020-03-17 Intel Corporation Movable heatsink utilizing flexible heat pipes
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11469155B2 (en) * 2020-01-09 2022-10-11 Landis+Gyr Innovations, Inc. Flexible thermal coupling for a heat pipe
GB2610062A (en) * 2020-03-09 2023-02-22 Nvidia Corp Configurable heatsink
US11703921B2 (en) 2020-03-09 2023-07-18 Nvidia Corporation Configurable heatsink
US20210318074A1 (en) * 2020-04-08 2021-10-14 Lockheed Martin Corporation Heat transfer assemblies with compliant heat pipes
US11828536B2 (en) * 2020-04-08 2023-11-28 Lockheed Martin Corporation Heat transfer assemblies with compliant heat pipes
CN111829378A (en) * 2020-06-03 2020-10-27 广州大学 Multi-section hinge type flexible heat pipe
EP4001820A1 (en) * 2020-11-20 2022-05-25 Nokia Technologies Oy Oscillating heat pipe
CN114501928A (en) * 2021-12-29 2022-05-13 联想(北京)有限公司 Heat dissipation device and electronic equipment
TWI814195B (en) * 2021-12-30 2023-09-01 索士亞科技股份有限公司 Anti-vibration heat dissipation module
CN116379821A (en) * 2023-03-24 2023-07-04 中国原子能科学研究院 Heat pipe and manufacturing method thereof
CN116625150A (en) * 2023-07-21 2023-08-22 歌尔股份有限公司 Flexible flat heat pipe, preparation method thereof and electronic equipment

Similar Documents

Publication Publication Date Title
US20110220328A1 (en) Flexible heat pipe and manufacturing method thereof
US7609520B2 (en) Heat spreader with vapor chamber defined therein
US20110297355A1 (en) Heat-conducting module and heat-dissipating device having the same
US20120227934A1 (en) Heat pipe having a composite wick structure and method for making the same
JP5323614B2 (en) Heat pipe and manufacturing method thereof
US20120305222A1 (en) Heat spreader structure and manufacturing method thereof
TWI461648B (en) Heat-dissipating device
US20110067844A1 (en) Planar heat pipe
WO2011087117A1 (en) Heat sink
JP6667544B2 (en) heatsink
US20110168358A1 (en) Lap-joined heat pipe structure and thermal module using same
US9102020B2 (en) Manufacturing method of thin heat pipe
US20040050535A1 (en) Heat sink with angled heat pipe
JP2006245356A (en) Cooling apparatus of electronic device
US7140421B2 (en) Wick structure of heat pipe
JP5157266B2 (en) Radiator and method of manufacturing radiator
US11039549B2 (en) Heat transferring module
CN102169857A (en) Flexible heat pipe structure and manufacturing method thereof
TWM261983U (en) Tubular radiator
JP2010153443A (en) Cooling device, cooling-device manufacturing method, and electronic apparatus
US20130168055A1 (en) Thermal module
JP4382892B2 (en) Flat heat pipe and manufacturing method thereof
TW201128156A (en) A flexible heat pipe and manufacturing method thereof
JP2006013217A (en) Heatsink using carbon graphite
US20060243424A1 (en) Heat pipe

Legal Events

Date Code Title Description
AS Assignment

Owner name: KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, YU- PO;KUO, TUNG-JUNG;REEL/FRAME:024096/0282

Effective date: 20100211

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION