US20110067844A1 - Planar heat pipe - Google Patents

Planar heat pipe Download PDF

Info

Publication number
US20110067844A1
US20110067844A1 US12/793,726 US79372610A US2011067844A1 US 20110067844 A1 US20110067844 A1 US 20110067844A1 US 79372610 A US79372610 A US 79372610A US 2011067844 A1 US2011067844 A1 US 2011067844A1
Authority
US
United States
Prior art keywords
metallic tube
heat pipe
planar heat
flat
intermediate structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/793,726
Inventor
George Anthony Meyer, IV
Chien-Hung Sun
Chieh-Ping Chen
David Paul Bono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celsia Technologies Taiwan Inc
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Assigned to Celsia Technologies Taiwan, Inc. reassignment Celsia Technologies Taiwan, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BONO, DAVID PAUL, CHEN, CHIEH-PING, MEYER IV, GEORGE ANTHONY, SUN, CHIEN-HUNG
Publication of US20110067844A1 publication Critical patent/US20110067844A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention generally relates to heat dissipation devices, particularly to heat pipes.
  • Integrated circuits are broadly applied in various industrial equipments, measurement instruments and computers. With the development of electronic industries, ICs work at higher and higher frequencies and then generate more and more heat. ICs tend to damage if overheating. Conventional heat dissipation devices simply employing fins are not enough to satisfy requirement of heat dissipation of modern ICs. Thus heat pipes become popular in heat dissipation devices.
  • Conventional heat pipes are tubular in shape and composed of a metallic tube, a wick structure arranged in the tube and a working fluid injected in the tube. The heat pipes can rapidly transfer a large amount of heat by phase change of the working fluid.
  • An object of the invention is to provide a planar heat pipe which can only occupy a flat space and easily evade other components for increasing the space utilization.
  • planar heat pipe of the invention includes:
  • a metallic tube composed of two flat extensions located at two ends thereof and a shrinked intermediate structure connecting between the flat extensions
  • a support element in the metallic tube for supporting the wick structure to attach the metallic tube.
  • the flat extensions can be separately attached to a heat source and a heat sink.
  • the flat extensions can be accommodated in a very flat space.
  • the intermediate structure can be provided with a turn to evade other components.
  • FIG. 1 shows the original shape of the metallic tube
  • FIG. 2 shows the metallic tube which has been shrinked
  • FIG. 3 shows the metallic tube which has been pressed into a flat shape
  • FIG. 4 shows the metallic tube which has been provided with the wick structure
  • FIG. 5 is a cross-section view of the metallic tube with the support element
  • FIG. 6 shows the metallic tube which has been sealed
  • FIG. 7 shows an application of the planar heat pipe associated with a heat source
  • FIG. 8 is a cross-section view of FIG. 7 .
  • the planar heat pipe of the invention includes a metallic tube 10 composed of two flat extensions 11 , 12 and an intermediate structure 13 , a wick structure 20 , a working fluid 30 and a support element 40 .
  • a circular metallic tube 10 is used to be an original material of a heat pipe.
  • the metallic tube 10 is made of material with great thermo-conductivity such as, but not limited to, copper.
  • the flat extensions 11 , 12 are located at two ends of the metallic tube 10 and the intermediate structure 13 is located between the two flat extensions 11 , 12 .
  • the intermediate structure 13 is made by a shrink process.
  • the shrink process can be preferably performed by the tube spinning.
  • the intermediate structure 13 is elongated with maintaining a circular cross-section.
  • the intermediate structure 13 still keeps hollow even if it has been elongated.
  • Two tapering portions 111 , 121 are formed between the intermediate structure 13 and the extensions 11 , 12 .
  • the tapering portions 111 , 121 taper from the extensions 11 , 12 to the intermediate structure 13 .
  • the intermediate structure 13 may be made with a turn to satisfy real requirements.
  • the embodiment shown in the drawings is with a turn.
  • a turn 131 is formed in the intermediate structure 13 .
  • the metallic tube 10 is pressed to become flat, i.e. the extensions 11 , 12 , tapering portions 111 , 121 , intermediate structure 13 and turn 131 are deformed into a flat shape. This flat shape can make the heat pipe accommodated in a thin space.
  • the wick structure 20 is disposed in the metallic tube 10 through an opening thereof.
  • the wick structure 20 attaches an inner side of the metallic tube 10 .
  • a gas passage is remained in the metallic tube 10 .
  • the wick structure 20 is made of porous material such as sintered powder.
  • the working fluid 30 is injected in the metallic tube 10 through its opening.
  • the working fluid is absorbed by the wick structure 20 due to the capillary force.
  • the total volume of the injected working fluid 30 is equal to the total volume of all pores of the wick structure 20 .
  • the support element 40 is disposed in the metallic tube 10 to prevent the metallic tube from caving.
  • the support element 40 pushes the wick structure 20 to attach the inner side of the metallic tube 10 .
  • the metallic tube 10 must be degassed before its opening is sealed because the gas inherently filled in the metallic tube 10 , such as air, does not involve the phase change of the working fluid 30 .
  • a heat pipe can not work normally if the gas has not been degassed.
  • Either of the flat extensions 11 , 12 serves as an evaporating section for attaching a heat source 50 .
  • the evaporating section can attach the heat source 50 planarly and tightly due to its flat shape.
  • the other one of the flat extensions 11 , 12 serves as a condensing section for attaching a fin set 60 .
  • the intermediate structure 13 is smaller than the flat extensions 11 , 12 so that it can easily pass through or evade other components.
  • the flat extensions 11 , 12 can be easily accommodated in a limited space such as a laptop computer.
  • the evaporating section may be further extended to attach more heat sources. So the manufacturing costs can be reduced.

Abstract

The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure.

Description

    BACKGROUND OF THE INVENTION
  • 1. Technical Field
  • The invention generally relates to heat dissipation devices, particularly to heat pipes.
  • 2. Related Art
  • Integrated circuits (ICs) are broadly applied in various industrial equipments, measurement instruments and computers. With the development of electronic industries, ICs work at higher and higher frequencies and then generate more and more heat. ICs tend to damage if overheating. Conventional heat dissipation devices simply employing fins are not enough to satisfy requirement of heat dissipation of modern ICs. Thus heat pipes become popular in heat dissipation devices. Conventional heat pipes are tubular in shape and composed of a metallic tube, a wick structure arranged in the tube and a working fluid injected in the tube. The heat pipes can rapidly transfer a large amount of heat by phase change of the working fluid.
  • However, modern electronic devices tend toward lighter, thinner, shorter and smaller than ever. Conventional heat pipes become hard to be applied in a limited space. On the other hand, a heat pipe connecting a heat source to a heat sink usually must make a turn to evade other components. This situation has the design of heat dissipation become difficult.
    • SUMMARY OF THE INVENTION
  • An object of the invention is to provide a planar heat pipe which can only occupy a flat space and easily evade other components for increasing the space utilization.
  • To accomplish the above object, the planar heat pipe of the invention includes:
  • a metallic tube composed of two flat extensions located at two ends thereof and a shrinked intermediate structure connecting between the flat extensions;
  • a wick structure arranged in the metallic tube;
  • a working fluid in the metallic tube; and
  • a support element in the metallic tube for supporting the wick structure to attach the metallic tube.
  • In above structure, the flat extensions can be separately attached to a heat source and a heat sink. The flat extensions can be accommodated in a very flat space. And the intermediate structure can be provided with a turn to evade other components.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows the original shape of the metallic tube;
  • FIG. 2 shows the metallic tube which has been shrinked;
  • FIG. 3 shows the metallic tube which has been pressed into a flat shape;
  • FIG. 4 shows the metallic tube which has been provided with the wick structure;
  • FIG. 5 is a cross-section view of the metallic tube with the support element;
  • FIG. 6 shows the metallic tube which has been sealed;
  • FIG. 7 shows an application of the planar heat pipe associated with a heat source; and
  • FIG. 8 is a cross-section view of FIG. 7.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The planar heat pipe of the invention includes a metallic tube 10 composed of two flat extensions 11, 12 and an intermediate structure 13, a wick structure 20, a working fluid 30 and a support element 40.
  • Please refer to FIG. 1. A circular metallic tube 10 is used to be an original material of a heat pipe. The metallic tube 10 is made of material with great thermo-conductivity such as, but not limited to, copper.
  • Please refer to FIGS. 2 and 3. The flat extensions 11, 12 are located at two ends of the metallic tube 10 and the intermediate structure 13 is located between the two flat extensions 11, 12.
  • The intermediate structure 13 is made by a shrink process. The shrink process can be preferably performed by the tube spinning. The intermediate structure 13 is elongated with maintaining a circular cross-section. The intermediate structure 13 still keeps hollow even if it has been elongated. Two tapering portions 111, 121 are formed between the intermediate structure 13 and the extensions 11, 12. The tapering portions 111, 121 taper from the extensions 11, 12 to the intermediate structure 13.
  • The intermediate structure 13 may be made with a turn to satisfy real requirements. The embodiment shown in the drawings is with a turn. As can be seen in FIG. 3, a turn 131 is formed in the intermediate structure 13. The metallic tube 10 is pressed to become flat, i.e. the extensions 11, 12, tapering portions 111, 121, intermediate structure 13 and turn 131 are deformed into a flat shape. This flat shape can make the heat pipe accommodated in a thin space.
  • Please refer to FIGS. 4-6. The wick structure 20 is disposed in the metallic tube 10 through an opening thereof. The wick structure 20 attaches an inner side of the metallic tube 10. A gas passage is remained in the metallic tube 10. The wick structure 20 is made of porous material such as sintered powder.
  • The working fluid 30 is injected in the metallic tube 10 through its opening. The working fluid is absorbed by the wick structure 20 due to the capillary force. The total volume of the injected working fluid 30 is equal to the total volume of all pores of the wick structure 20.
  • The support element 40 is disposed in the metallic tube 10 to prevent the metallic tube from caving. The support element 40 pushes the wick structure 20 to attach the inner side of the metallic tube 10.
  • The metallic tube 10 must be degassed before its opening is sealed because the gas inherently filled in the metallic tube 10, such as air, does not involve the phase change of the working fluid 30. A heat pipe can not work normally if the gas has not been degassed.
  • Please refer to FIGS. 7 and 8. Either of the flat extensions 11, 12 serves as an evaporating section for attaching a heat source 50. The evaporating section can attach the heat source 50 planarly and tightly due to its flat shape. The other one of the flat extensions 11, 12 serves as a condensing section for attaching a fin set 60. The intermediate structure 13 is smaller than the flat extensions 11, 12 so that it can easily pass through or evade other components.
  • The flat extensions 11, 12 can be easily accommodated in a limited space such as a laptop computer. On the other hand, the evaporating section may be further extended to attach more heat sources. So the manufacturing costs can be reduced.
  • Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (6)

What is claimed is:
1. A planar heat pipe comprising:
a metallic tube composed of two flat extensions located at two ends thereof and a shrinked intermediate structure connecting between the flat extensions;
a wick structure arranged in the metallic tube;
a working fluid in the metallic tube; and
a support element in the metallic tube for supporting the wick structure to attach the metallic tube.
2. The planar heat pipe of claim 1, wherein the metallic tube is made of copper.
3. The planar heat pipe of claim 1, further comprising two tapering portions formed between the intermediate structure and the extensions.
4. The planar heat pipe of claim 1, further comprising a turn formed in the intermediate structure.
5. The planar heat pipe of claim 1, wherein the intermediate structure is flat in shape.
6. The planar heat pipe of claim 1, wherein the wick structure is sintered powder.
US12/793,726 2009-09-24 2010-06-04 Planar heat pipe Abandoned US20110067844A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098217637U TWM375205U (en) 2009-09-24 2009-09-24 Flat hot pipe
TW098217637 2009-09-24

Publications (1)

Publication Number Publication Date
US20110067844A1 true US20110067844A1 (en) 2011-03-24

Family

ID=43755614

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/793,726 Abandoned US20110067844A1 (en) 2009-09-24 2010-06-04 Planar heat pipe

Country Status (2)

Country Link
US (1) US20110067844A1 (en)
TW (1) TWM375205U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US20120325438A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan Heat pipe with flexible support structure
US20120325437A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan, I Flat heat pipe with capilllary structure
US20130199757A1 (en) * 2012-02-03 2013-08-08 Celsia Technologies Taiwan, Inc. Heat-dissipating module having loop-type vapor chamber
US20150129175A1 (en) * 2012-11-13 2015-05-14 Delta Electronics, Inc. Thermosyphon heat sink
US20170343297A1 (en) * 2016-05-27 2017-11-30 Asia Vital Components Co., Ltd. Heat dissipation device
US20190254194A1 (en) * 2019-03-30 2019-08-15 Intel Corporation Torsional heat pipe
US20230012170A1 (en) * 2021-07-07 2023-01-12 Taiwan Microloops Corp. Heat conduction structure with liquid-gas split mechanism
US20230031618A1 (en) * 2021-07-27 2023-02-02 Asia Vital Components (China) Co., Ltd. Floating heat pipe assembly and clamp collar for using therewith

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6357515B1 (en) * 1998-02-23 2002-03-19 Intel Corporation Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US20030024691A1 (en) * 2001-07-31 2003-02-06 Leu-Wen Tsay High efficiency heat sink
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US20050045310A1 (en) * 2003-08-29 2005-03-03 Isao Okutsu Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
US20050098303A1 (en) * 2002-08-28 2005-05-12 Lindemuth James E. Vapor chamber with sintered grooved wick
US20050269064A1 (en) * 2004-06-02 2005-12-08 Hul-Chun Hsu Planar heat pipe structure
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US20090236085A1 (en) * 2008-03-19 2009-09-24 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6357515B1 (en) * 1998-02-23 2002-03-19 Intel Corporation Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US20030024691A1 (en) * 2001-07-31 2003-02-06 Leu-Wen Tsay High efficiency heat sink
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US20050098303A1 (en) * 2002-08-28 2005-05-12 Lindemuth James E. Vapor chamber with sintered grooved wick
US20050045310A1 (en) * 2003-08-29 2005-03-03 Isao Okutsu Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
US20050269064A1 (en) * 2004-06-02 2005-12-08 Hul-Chun Hsu Planar heat pipe structure
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US20090236085A1 (en) * 2008-03-19 2009-09-24 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US20120325438A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan Heat pipe with flexible support structure
US20120325437A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan, I Flat heat pipe with capilllary structure
US20130199757A1 (en) * 2012-02-03 2013-08-08 Celsia Technologies Taiwan, Inc. Heat-dissipating module having loop-type vapor chamber
US8792238B2 (en) * 2012-02-03 2014-07-29 Celsia Technologies Taiwan, Inc. Heat-dissipating module having loop-type vapor chamber
US11486652B2 (en) * 2012-11-13 2022-11-01 Delta Electronics, Inc. Thermosyphon heat sink
US20150129175A1 (en) * 2012-11-13 2015-05-14 Delta Electronics, Inc. Thermosyphon heat sink
US20170343297A1 (en) * 2016-05-27 2017-11-30 Asia Vital Components Co., Ltd. Heat dissipation device
US10077945B2 (en) * 2016-05-27 2018-09-18 Asia Vital Components Co., Ltd. Heat dissipation device
US20190254194A1 (en) * 2019-03-30 2019-08-15 Intel Corporation Torsional heat pipe
US10932393B2 (en) * 2019-03-30 2021-02-23 Intel Corporation Torsional heat pipe
US20230012170A1 (en) * 2021-07-07 2023-01-12 Taiwan Microloops Corp. Heat conduction structure with liquid-gas split mechanism
US20230031618A1 (en) * 2021-07-27 2023-02-02 Asia Vital Components (China) Co., Ltd. Floating heat pipe assembly and clamp collar for using therewith
US11828537B2 (en) * 2021-07-27 2023-11-28 Asia Vital Components (China) Co., Ltd. Floating heat pipe assembly and clamp collar for using therewith

Also Published As

Publication number Publication date
TWM375205U (en) 2010-03-01

Similar Documents

Publication Publication Date Title
US20110067844A1 (en) Planar heat pipe
US11313628B2 (en) Thermal conducting structure
US7870889B2 (en) Heat dissipation device with a heat pipe
US7520315B2 (en) Heat pipe with capillary wick
US7594537B2 (en) Heat pipe with capillary wick
US9170058B2 (en) Heat pipe heat dissipation structure
US8622117B2 (en) Heat pipe including a main wick structure and at least one auxiliary wick structure
US20070267178A1 (en) Heat pipe
TW202037871A (en) Flexible vapor chamber
US20070240857A1 (en) Heat pipe with capillary wick
US20140352926A1 (en) Shell structure for handheld device
US20070102147A1 (en) Heat dissipation apparatus and method for manufacturing the same
US20110297355A1 (en) Heat-conducting module and heat-dissipating device having the same
US20120199337A1 (en) Heat Sink for Dissipating a Thermal Load
US20070240856A1 (en) Heat pipe
US9179577B2 (en) Flat heat pipe and fabrication method thereof
US20090002937A1 (en) Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
US20140054014A1 (en) Heat pipe and method for making the same
US20070240851A1 (en) Heat pipe
US20110168358A1 (en) Lap-joined heat pipe structure and thermal module using same
US20170374762A1 (en) Heat pipe assembly and electronic device
US20140055954A1 (en) Heat pipe structure, and thermal module and electronic device using same
US20060164809A1 (en) Heat dissipation module
US20130248152A1 (en) Heat pipe with one wick structure supporting another wick structure in position
TWM502875U (en) Heat dissipation module

Legal Events

Date Code Title Description
AS Assignment

Owner name: CELSIA TECHNOLOGIES TAIWAN, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;AND OTHERS;REEL/FRAME:024484/0702

Effective date: 20100527

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION