US20110171055A1 - Method of manufacturing heat sink plate - Google Patents
Method of manufacturing heat sink plate Download PDFInfo
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- US20110171055A1 US20110171055A1 US12/687,083 US68708310A US2011171055A1 US 20110171055 A1 US20110171055 A1 US 20110171055A1 US 68708310 A US68708310 A US 68708310A US 2011171055 A1 US2011171055 A1 US 2011171055A1
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- holding tool
- heat conductive
- conductive sheet
- half holding
- metal powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/004—Filling molds with powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
Definitions
- the present invention relates to a method of manufacturing heat sink plate, and more particularly to a heat sink plate manufacturing method that requires only reduced tool and assembling costs while enables copper powder to uniformly distribute on and be sintered to the heat sink plate.
- the central processing unit (CPU) thereof produces the largest part of heat in the computer.
- the CPU will have reduced performance when the heat produced by it constantly increases.
- the heat accumulated in the CPU exceeds a high limit, it will result in shutdown or other serious damages of the computer.
- all important components and parts of the computer are enclosed in a computer case. Therefore, it is a very important issue to quickly remove the heat produced by the CPU and other electronic elements of the computer from the computer case.
- the heat sink plate is frequently used with processors, chips and illuminating devices for dissipating the heat produced during the operation of these items.
- the heat sink plate has high thermal conductivity, quick heat transfer and large contact area with heat-producing elements, and does not consume electric power, and is therefore very suitable for use with heat-producing elements to transfer and dissipate the heat produced by the heat-producing elements.
- the currently available heat sink plate mainly includes two copper sheets connected to each other. Between the two copper sheets, copper powder is distributed and a plurality of spacers is provided. The spacers are firmly arranged between and connected to the two copper sheets, and the copper powder is uniformly located around the spacers.
- the conventional heat sink plate involves complicated manufacturing procedures to complete it.
- FIG. 1 is a flowchart showing the steps included in a conventional heat sink plate manufacturing method. The steps include:
- step S 11 associating a central mould with a copper sheet
- step S 12 filling metal powder between the central mould and the copper sheet
- step S 13 vibrating the copper sheet and the central mould
- step S 14 sintering the central mould and the copper sheet that have the metal powder filled therebetween
- step S 15 removing the central mould from the copper sheet after the sintering
- the central mould is associated with the copper sheet that serve as an upper or a lower metal cover. Then, the metal powder is filled between the central mould and the copper sheet, and the copper sheet and the central mould are vibrated to uniformly distribute the metal powder therebetween. Thereafter, the central mould and the copper sheet along with the uniformly distributed metal powder are positioned in a sintering furnace and sintered at high temperature. After the high-temperature sintering, the metal powder forms a layer of capillary structure on an inner surface of the copper sheet. Finally, the central mould is removed from the copper sheet.
- each of the copper sheets has one central mould associated therewith. Therefore, a plurality of central moulds is needed to enable sintering a plurality of copper sheets and metal powder at the same time. As a result, high costs are required to prepare a large number of central moulds and filling the metal powder. Moreover, since it is necessary to form a plurality of recesses on the sintered copper sheet at the sintered metal powder, a plurality of extended posts must be provided on the central mould for forming such recesses.
- the central mould Before the sintering is completed, the central mould must not be removed from the copper sheet, lest the metal powder should shift to and thereby eliminate the spaces in the recesses due to any movement of the copper sheet. This also necessitates the copper sheet to be sintered along with the central mould.
- the conventional heat sink plate manufacturing method has the following disadvantages: (1) requiring high mould cost; (2) involving troublesome manufacturing procedures; and (3) increasing the overall manufacturing cost of the heat sink plate.
- a primary object of the present invention is to provide a heat sink plate manufacturing method that enables reduced tools and accordingly, reduced tool cost.
- Another object of the present invention is to provide a heat sink plate manufacturing method that has simplified procedures to save the manufacturing and assembling costs.
- a further object of the present invention is to provide a heat sink plate manufacturing method that effectively enables uniform distribution of metal powder on the heat sink plate.
- a still further object of the present invention is to provide a heat sink plate manufacturing method that is able to effectively prevent the heat conductive sheets for forming the heat sink plate from moving during the manufacturing process, and accordingly, prevents the metal powder from shifting before being sintered to the heat conductive sheets.
- a still further object of the present invention is to provide a heat sink plate manufacturing method that ensures good levelness of the manufactured heat sink plate.
- the heat sink plate manufacturing method of the present invention includes the steps of positioning a heat conductive sheet on a lower half holding tool of a powder feeder; tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool, such that spacers downward extended from the upper half holding tool are in tight contact with the heat conductive sheet; dispensing metal powder on the heat conductive sheet via a powder inlet on the upper half holding tool while vibrating the heat conducting sheet for the metal powder to uniformly distribute on the heat conductive sheet; opening the upper half holding tool and spraying an organic liquid on the metal powder for the same to set on the heat conductive sheet; and removing the heat conductive sheet from the lower half holding tool and sintering the metal powder to the heat conductive sheet.
- the metal powder can be uniformly distributed on the heat conductive sheets; and the problem of shifting metal powder in the process of manufacturing due to moved heat conductive sheets can be effectively prevented.
- FIG. 1 is a flowchart showing the steps included in a conventional method of manufacturing a heat sink plate
- FIG. 2 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a first preferred embodiment of the present invention
- FIG. 3 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a second preferred embodiment of the present invention.
- FIGS. 4 to 9 are schematic views illustrating the manufacturing of a heat sink plate using the method of the present invention.
- FIG. 2 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a first preferred embodiment of the present invention, and to FIGS. 4 , 5 , 6 and 8 that illustrate the manufacturing of a heat sink plate using the method shown in FIG. 2 .
- the method of manufacturing heat sink plate according to the first preferred embodiment of the present invention includes the steps of:
- step S 21 positioning a heat conductive sheet 2 on a lower half holding tool 11 of a powder feeder 1 (step S 21 ); tightly closing and connecting an upper half holding tool 12 of the power feeder 1 to the lower half holding tool 11 (step S 22 ); dispensing metal powder 3 on the heat conductive sheet 2 while vibrating the heat conducting sheet 2 , so that the metal powder 3 is uniformly distributed on the heat conductive sheet 2 (step S 23 ); opening the upper half holding tool 12 and spraying an organic liquid 4 on the metal powder 3 that has been uniformly distributed on the heat conductive sheet 2 (step S 24 ); and removing the heat conductive sheet 2 from the lower half holding tool 11 and sintering the metal powder 3 to the heat conductive sheet 2 (step S 25 ).
- the heat conductive sheet 2 is a copper sheet.
- the copper heat conductive sheet 2 is positioned on the lower half holding tool 11 of the powder feeder 1 , and the lower half holding tool 11 is provided on a top with a receiving space being configured to the shape of the heat conductive sheet 2 , so that the heat conductive sheet 2 is fixedly set in the receiving space of the lower half holding tool 11 .
- the upper half holding tool 12 of the powder feeder 2 is tightly closed and connected to the lower half holding tool 11 , as shown in FIGS. 5 and 6 .
- FIG. 5 and 6 As can be seen from FIG.
- the upper half holding tool 12 is provided on a lower side facing toward the lower half holding tool 11 with a plurality of spacers 121 , which are in tight contact with the heat conductive sheet 2 when the upper half holding tool 12 is closed onto the lower half holding tool 11 .
- metal powder 3 such as copper powder or aluminum powder
- the powder feeder 1 drives the lower half holding tool 11 to vibrate while feeding the metal powder 3 , so that the metal powder 3 is uniformly distributed on the heat conductive sheet 2 .
- the metal powder 3 uniformly distributed on the heat conductive sheet 2 is divided by the spacers 121 into several areas.
- the spacers 121 extended from the lower side of the upper half holding tool 12 are separated from the heat conductive sheet 2 at the same time, leaving a plurality of recesses 31 on the uniformly distribute metal powder 3 at positions corresponding to the spacers 121 , as shown in FIG. 8 .
- the organic liquid 4 such as alcohol or acetone, is sprayed onto the metal powder 3 on the heat conductive sheet 2 to set the metal powder 3 and maintain the recesses 31 in shape. Thereafter, the heat conductive sheet 2 can be separated from the lower half holding tool 11 for use in subsequent process.
- Two heat conductive sheets 2 both having the metal powder 3 set thereon in the above manner are then assembled to each other and moved to a graphite plate (not shown) to sinter the metal powder 3 to the heat conductive sheets 2 and complete the manufacture of a heat sink plate.
- the heat sink plate can be manufactured with reduced tools and simplified procedures.
- the method of the present invention can effectively overcome the problems of shifting metal powder when the heat conductive sheets are moved in the process of manufacturing.
- a plurality of supporting elements 32 can be separately positioned in the recesses 31 on the set metal powder 3 before two pieces of the heat conductive sheets 2 are assembled to each other. With the two heat conductive sheets 2 being internally supported by the supporting elements 32 , the heat conductive sheets 2 undergone sintering can have good levelness.
- FIG. 3 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a second preferred embodiment of the present invention.
- the method in the second preferred embodiment is different from that in the first preferred embodiment in some of the steps.
- the heat sink plate manufacturing method in the second preferred embodiment includes the steps of:
- step S 31 Moving a lower half holding tool 11 of a powder feeder 1 to an outer side of the powder feeder 1 via a sliding mechanism 13 thereof (step S 31 ); positioning a heat conductive sheet 2 on the outward moved lower half holding tool 11 of the powder feeder 1 (step S 32 ); tightly closing and connecting an upper half holding tool 12 of the power feeder 1 to the lower half holding tool 11 , and using the sliding mechanism 13 to move the closed lower and upper half holding tools 11 , 12 back into the powder feeder 1 (step S 33 ); dispensing metal powder 3 on the heat conductive sheet 2 while vibrating the heat conducting sheet 2 , so that the metal powder 3 is uniformly distributed on the heat conductive sheet 2 under a positive pressure (step S 34 ); moving the closed lower and upper half holding tools 11 , 12 out of the powder feeder 1 via the sliding mechanism 13 , and opening the upper half holding tool 12 and spraying an organic liquid 4 on the metal powder 3 that has been uniformly distributed on the heat conductive sheet 2 (step S 35 ); and removing the heat conductive sheet 2 from the lower half holding
- the powder feeder 1 is provided below the lower half holding tool 11 with a sliding mechanism 13 , such that the lower half holding tool 11 can be sidewardly moved out of the powder feeder 1 via the sliding mechanism 13 .
- the heat conductive sheet 2 is also a copper sheet in the second embodiment. As can be seen from FIG. 4 , the copper heat conductive sheet 2 is positioned on the lower half holding tool 11 of the powder feeder 1 , and the lower half holding tool 11 is provided on a top with a receiving space being configured to the shape of the heat conductive sheet 2 , so that the heat conductive sheet 2 is fixedly set in the receiving space of the lower half holding tool 11 .
- the upper half holding tool 12 of the powder feeder 2 is tightly closed and connected to the lower half holding tool 11 , and the closed lower and upper half holding tools 11 , 12 are moved back into the powder feeder 1 via the sliding mechanism 13 , as shown in FIGS. 5 and 6 .
- the upper half holding tool 12 is provided on a lower side facing toward the lower half holding tool 11 with a plurality of spacers 121 , which are in tight contact with the heat conductive sheet 2 when the upper half holding tool 12 is closed onto the lower half holding tool 11 .
- metal powder 3 such as copper powder or aluminum powder
- a pressure-supply device 14 is connected to a vessel of the powder feeder 1 having the metal powder 3 contained therein.
- the pressure-supply device 14 is caused to generate an amount of positive-pressure airflow for forcing the metal powder 3 forward, so that the metal powder is dispensed on the heat conductive sheet 2 under a positive pressure.
- the powder feeder 1 drives the lower half holding tool 11 to vibrate while feeding the metal powder 3 , so that the metal powder 3 is uniformly distributed on the heat conductive sheet 2 .
- the duration of vibrating the lower half holding tool 11 can be set on the powder feeder 1 .
- the metal powder 3 uniformly distributed on the heat conductive sheet 2 is divided by the spacers 121 into several areas.
- the spacers 121 extended from the lower side of the upper half holding tool 12 are separated from the heat conductive sheet 2 at the same time, leaving a plurality of recesses 31 on the uniformly distribute metal powder 3 at positions corresponding to the spacers 121 , as shown in FIG. 8 .
- the organic liquid 4 such as alcohol or acetone
- the heat conductive sheet 2 can be separated from the lower half holding tool 11 for use in subsequent process.
- Two heat conductive sheets 2 both having the metal powder 3 set thereon in the above manner are then assembled to each other and moved to a graphite plate (not shown) to sinter the metal powder 3 to the heat conductive sheets 2 and complete the manufacture of a heat sink plate.
- the heat sink plate can be manufactured with reduced tools and simplified procedures.
- the method of the present invention can uniformly distribute the metal powder 3 on the heat conductive sheet 2 and effectively overcome the problem of shifting metal powder when the heat conductive sheet is moved in the process of manufacturing.
- a plurality of supporting elements 32 can be separately positioned in the recesses 31 on the set metal powder 3 before two pieces of the heat conductive sheets 2 are assembled to each other. With the two heat conductive sheets 2 being internally supported by the supporting elements 32 , the heat conductive sheets 2 undergone the sintering can have good levelness.
- the heat sink manufacturing method according to the present invention has the following advantages: (1) requiring only reduced tools; (2) requiring reduced assembling cost; (3) enabling uniform distribution of the metal powder on the heat conductive sheets; (4) effectively preventing the metal powder from shifting in the process of manufacturing; and (5) enabling the heat conductive sheets undergone sintering to have good levelness.
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Abstract
A heat sink manufacturing method includes the steps of positioning a heat conductive sheet on a lower half holding tool of a powder feeder; tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool, such that spacers downward extended from the upper half holding tool are in tight contact with the heat conductive sheet; dispensing metal powder on the heat conductive sheet via a powder inlet on the upper half holding tool and under a positive pressure while vibrating the heat conducting sheet for the metal powder to uniformly distribute on the heat conductive sheet; opening the upper half holding tool and spraying an organic liquid on the metal powder for the same to set; and removing the heat conductive sheet from the lower half holding tool and sintering the metal powder to the heat conductive sheet.
Description
- The present invention relates to a method of manufacturing heat sink plate, and more particularly to a heat sink plate manufacturing method that requires only reduced tool and assembling costs while enables copper powder to uniformly distribute on and be sintered to the heat sink plate.
- With the progress in the scientific and technological fields, the currently available electronic devices have higher and higher operating performance and also produce more heat during the operation thereof. Therefore, the demand for heat sinks with increased heat dissipation efficiency also increases. To enable increased heat dissipation efficiency, most of the conventional heat sinks include a plurality of stacked radiating fin assemblies. Therefore, a lot of manufacturers have engaged in the research and development in radiating fins, and high-efficiency heat sinks have become the most important target in the industrial field now.
- Taking a computer as an example, the central processing unit (CPU) thereof produces the largest part of heat in the computer. The CPU will have reduced performance when the heat produced by it constantly increases. When the heat accumulated in the CPU exceeds a high limit, it will result in shutdown or other serious damages of the computer. Moreover, to solve the problem of electromagnetic wave radiation, all important components and parts of the computer are enclosed in a computer case. Therefore, it is a very important issue to quickly remove the heat produced by the CPU and other electronic elements of the computer from the computer case.
- Currently, a heat sink plate is frequently used with processors, chips and illuminating devices for dissipating the heat produced during the operation of these items. The heat sink plate has high thermal conductivity, quick heat transfer and large contact area with heat-producing elements, and does not consume electric power, and is therefore very suitable for use with heat-producing elements to transfer and dissipate the heat produced by the heat-producing elements.
- According to the currently available heat sink plate, it mainly includes two copper sheets connected to each other. Between the two copper sheets, copper powder is distributed and a plurality of spacers is provided. The spacers are firmly arranged between and connected to the two copper sheets, and the copper powder is uniformly located around the spacers. In brief, the conventional heat sink plate involves complicated manufacturing procedures to complete it.
-
FIG. 1 is a flowchart showing the steps included in a conventional heat sink plate manufacturing method. The steps include: - associating a central mould with a copper sheet (step S11);
filling metal powder between the central mould and the copper sheet (step S12);
vibrating the copper sheet and the central mould (step S13);
sintering the central mould and the copper sheet that have the metal powder filled therebetween (step S14); and
removing the central mould from the copper sheet after the sintering (step S15). - According to the above-described conventional technique for manufacturing the heat sink plate, the central mould is associated with the copper sheet that serve as an upper or a lower metal cover. Then, the metal powder is filled between the central mould and the copper sheet, and the copper sheet and the central mould are vibrated to uniformly distribute the metal powder therebetween. Thereafter, the central mould and the copper sheet along with the uniformly distributed metal powder are positioned in a sintering furnace and sintered at high temperature. After the high-temperature sintering, the metal powder forms a layer of capillary structure on an inner surface of the copper sheet. Finally, the central mould is removed from the copper sheet. In the sintering furnace, there is a plurality of copper sheets positioned in the sintering furnace at the same time for sintering, and each of the copper sheets has one central mould associated therewith. Therefore, a plurality of central moulds is needed to enable sintering a plurality of copper sheets and metal powder at the same time. As a result, high costs are required to prepare a large number of central moulds and filling the metal powder. Moreover, since it is necessary to form a plurality of recesses on the sintered copper sheet at the sintered metal powder, a plurality of extended posts must be provided on the central mould for forming such recesses. Before the sintering is completed, the central mould must not be removed from the copper sheet, lest the metal powder should shift to and thereby eliminate the spaces in the recesses due to any movement of the copper sheet. This also necessitates the copper sheet to be sintered along with the central mould.
- In brief, the conventional heat sink plate manufacturing method has the following disadvantages: (1) requiring high mould cost; (2) involving troublesome manufacturing procedures; and (3) increasing the overall manufacturing cost of the heat sink plate.
- It is therefore tried by the inventor to develop an improved heat sink plate manufacturing method to overcome the problems in the prior art.
- A primary object of the present invention is to provide a heat sink plate manufacturing method that enables reduced tools and accordingly, reduced tool cost.
- Another object of the present invention is to provide a heat sink plate manufacturing method that has simplified procedures to save the manufacturing and assembling costs.
- A further object of the present invention is to provide a heat sink plate manufacturing method that effectively enables uniform distribution of metal powder on the heat sink plate.
- A still further object of the present invention is to provide a heat sink plate manufacturing method that is able to effectively prevent the heat conductive sheets for forming the heat sink plate from moving during the manufacturing process, and accordingly, prevents the metal powder from shifting before being sintered to the heat conductive sheets.
- A still further object of the present invention is to provide a heat sink plate manufacturing method that ensures good levelness of the manufactured heat sink plate.
- To achieve the above and other objects, the heat sink plate manufacturing method of the present invention includes the steps of positioning a heat conductive sheet on a lower half holding tool of a powder feeder; tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool, such that spacers downward extended from the upper half holding tool are in tight contact with the heat conductive sheet; dispensing metal powder on the heat conductive sheet via a powder inlet on the upper half holding tool while vibrating the heat conducting sheet for the metal powder to uniformly distribute on the heat conductive sheet; opening the upper half holding tool and spraying an organic liquid on the metal powder for the same to set on the heat conductive sheet; and removing the heat conductive sheet from the lower half holding tool and sintering the metal powder to the heat conductive sheet.
- With the heat sink plate manufacturing method of the present invention, only reduced tool and assembling costs are required; the metal powder can be uniformly distributed on the heat conductive sheets; and the problem of shifting metal powder in the process of manufacturing due to moved heat conductive sheets can be effectively prevented.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
-
FIG. 1 is a flowchart showing the steps included in a conventional method of manufacturing a heat sink plate; -
FIG. 2 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a first preferred embodiment of the present invention; -
FIG. 3 is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a second preferred embodiment of the present invention; and -
FIGS. 4 to 9 are schematic views illustrating the manufacturing of a heat sink plate using the method of the present invention. - Please refer to
FIG. 2 that is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a first preferred embodiment of the present invention, and toFIGS. 4 , 5, 6 and 8 that illustrate the manufacturing of a heat sink plate using the method shown inFIG. 2 . - As shown in
FIG. 2 , the method of manufacturing heat sink plate according to the first preferred embodiment of the present invention includes the steps of: - positioning a heat
conductive sheet 2 on a lowerhalf holding tool 11 of a powder feeder 1 (step S21);
tightly closing and connecting an upperhalf holding tool 12 of thepower feeder 1 to the lower half holding tool 11 (step S22);
dispensingmetal powder 3 on the heatconductive sheet 2 while vibrating theheat conducting sheet 2, so that themetal powder 3 is uniformly distributed on the heat conductive sheet 2 (step S23);
opening the upperhalf holding tool 12 and spraying anorganic liquid 4 on themetal powder 3 that has been uniformly distributed on the heat conductive sheet 2 (step S24); and
removing the heatconductive sheet 2 from the lowerhalf holding tool 11 and sintering themetal powder 3 to the heat conductive sheet 2 (step S25). - In the illustrated first embodiment, the heat
conductive sheet 2 is a copper sheet. As can be seen fromFIG. 4 , the copper heatconductive sheet 2 is positioned on the lowerhalf holding tool 11 of thepowder feeder 1, and the lowerhalf holding tool 11 is provided on a top with a receiving space being configured to the shape of the heatconductive sheet 2, so that the heatconductive sheet 2 is fixedly set in the receiving space of the lowerhalf holding tool 11. Then, the upperhalf holding tool 12 of thepowder feeder 2 is tightly closed and connected to the lowerhalf holding tool 11, as shown inFIGS. 5 and 6 . As can be seen fromFIG. 4 , the upperhalf holding tool 12 is provided on a lower side facing toward the lowerhalf holding tool 11 with a plurality ofspacers 121, which are in tight contact with the heatconductive sheet 2 when the upperhalf holding tool 12 is closed onto the lowerhalf holding tool 11. After the upperhalf holding tool 12 has been closed and connected to the lowerhalf holding tool 11,metal powder 3, such as copper powder or aluminum powder, is fed onto the heatconductive sheet 2 via apowder inlet 122 formed on the upperhalf holding tool 12. Meanwhile, thepowder feeder 1 drives the lowerhalf holding tool 11 to vibrate while feeding themetal powder 3, so that themetal powder 3 is uniformly distributed on the heatconductive sheet 2. Themetal powder 3 uniformly distributed on the heatconductive sheet 2 is divided by thespacers 121 into several areas. When the upperhalf holding tool 12 is removed to open the lowerhalf holding tool 11, thespacers 121 extended from the lower side of the upperhalf holding tool 12 are separated from the heatconductive sheet 2 at the same time, leaving a plurality ofrecesses 31 on the uniformly distributemetal powder 3 at positions corresponding to thespacers 121, as shown inFIG. 8 . Then, theorganic liquid 4, such as alcohol or acetone, is sprayed onto themetal powder 3 on the heatconductive sheet 2 to set themetal powder 3 and maintain therecesses 31 in shape. Thereafter, the heatconductive sheet 2 can be separated from the lowerhalf holding tool 11 for use in subsequent process. Two heatconductive sheets 2 both having themetal powder 3 set thereon in the above manner are then assembled to each other and moved to a graphite plate (not shown) to sinter themetal powder 3 to the heatconductive sheets 2 and complete the manufacture of a heat sink plate. - With the heat sink manufacturing method according to the first preferred embodiment of the present invention, the heat sink plate can be manufactured with reduced tools and simplified procedures. The method of the present invention can effectively overcome the problems of shifting metal powder when the heat conductive sheets are moved in the process of manufacturing. Moreover, as shown in
FIG. 9 , a plurality of supportingelements 32 can be separately positioned in therecesses 31 on the setmetal powder 3 before two pieces of the heatconductive sheets 2 are assembled to each other. With the two heatconductive sheets 2 being internally supported by the supportingelements 32, the heatconductive sheets 2 undergone sintering can have good levelness. - Please refer to
FIG. 3 that is a flowchart showing the steps included in a method of manufacturing heat sink plate according to a second preferred embodiment of the present invention. The method in the second preferred embodiment is different from that in the first preferred embodiment in some of the steps. As shown, the heat sink plate manufacturing method in the second preferred embodiment includes the steps of: - Moving a lower
half holding tool 11 of apowder feeder 1 to an outer side of thepowder feeder 1 via a slidingmechanism 13 thereof (step S31);
positioning a heatconductive sheet 2 on the outward moved lowerhalf holding tool 11 of the powder feeder 1 (step S32);
tightly closing and connecting an upperhalf holding tool 12 of thepower feeder 1 to the lowerhalf holding tool 11, and using the slidingmechanism 13 to move the closed lower and upperhalf holding tools
dispensingmetal powder 3 on the heatconductive sheet 2 while vibrating theheat conducting sheet 2, so that themetal powder 3 is uniformly distributed on the heatconductive sheet 2 under a positive pressure (step S34);
moving the closed lower and upperhalf holding tools powder feeder 1 via the slidingmechanism 13, and opening the upperhalf holding tool 12 and spraying anorganic liquid 4 on themetal powder 3 that has been uniformly distributed on the heat conductive sheet 2 (step S35); and
removing the heatconductive sheet 2 from the lowerhalf holding tool 11 and sintering themetal powder 3 to the heat conductive sheet 2 (step S36). - As can be best seen from
FIGS. 4 to 7 , in the illustrated second embodiment, thepowder feeder 1 is provided below the lowerhalf holding tool 11 with a slidingmechanism 13, such that the lowerhalf holding tool 11 can be sidewardly moved out of thepowder feeder 1 via the slidingmechanism 13. The heatconductive sheet 2 is also a copper sheet in the second embodiment. As can be seen fromFIG. 4 , the copper heatconductive sheet 2 is positioned on the lowerhalf holding tool 11 of thepowder feeder 1, and the lowerhalf holding tool 11 is provided on a top with a receiving space being configured to the shape of the heatconductive sheet 2, so that the heatconductive sheet 2 is fixedly set in the receiving space of the lowerhalf holding tool 11. Then, the upperhalf holding tool 12 of thepowder feeder 2 is tightly closed and connected to the lowerhalf holding tool 11, and the closed lower and upperhalf holding tools powder feeder 1 via the slidingmechanism 13, as shown inFIGS. 5 and 6 . As can be seen fromFIG. 4 , the upperhalf holding tool 12 is provided on a lower side facing toward the lowerhalf holding tool 11 with a plurality ofspacers 121, which are in tight contact with the heatconductive sheet 2 when the upperhalf holding tool 12 is closed onto the lowerhalf holding tool 11. After the closed lower and upperhalf holding tools powder feeder 1 via the slidingmechanism 13,metal powder 3, such as copper powder or aluminum powder, is fed onto the heatconductive sheet 2 via apowder inlet 122 formed on the upperhalf holding tool 12. As can be seen fromFIG. 7 , in the second embodiment, a pressure-supply device 14 is connected to a vessel of thepowder feeder 1 having themetal powder 3 contained therein. To dispense themetal powder 3 over the heatconductive sheet 2, the pressure-supply device 14 is caused to generate an amount of positive-pressure airflow for forcing themetal powder 3 forward, so that the metal powder is dispensed on the heatconductive sheet 2 under a positive pressure. Meanwhile, thepowder feeder 1 drives the lowerhalf holding tool 11 to vibrate while feeding themetal powder 3, so that themetal powder 3 is uniformly distributed on the heatconductive sheet 2. The duration of vibrating the lowerhalf holding tool 11 can be set on thepowder feeder 1. Themetal powder 3 uniformly distributed on the heatconductive sheet 2 is divided by thespacers 121 into several areas. When the upperhalf holding tool 12 is removed to open the lowerhalf holding tool 11, thespacers 121 extended from the lower side of the upperhalf holding tool 12 are separated from the heatconductive sheet 2 at the same time, leaving a plurality ofrecesses 31 on the uniformly distributemetal powder 3 at positions corresponding to thespacers 121, as shown inFIG. 8 . Then, theorganic liquid 4, such as alcohol or acetone, is sprayed onto themetal powder 3 on the heatconductive sheet 2 to set themetal powder 3 and maintain therecesses 31 in shape. Thereafter, the heatconductive sheet 2 can be separated from the lowerhalf holding tool 11 for use in subsequent process. Two heatconductive sheets 2 both having themetal powder 3 set thereon in the above manner are then assembled to each other and moved to a graphite plate (not shown) to sinter themetal powder 3 to the heatconductive sheets 2 and complete the manufacture of a heat sink plate. - With the heat sink manufacturing method according to the second preferred embodiment of the present invention, the heat sink plate can be manufactured with reduced tools and simplified procedures. The method of the present invention can uniformly distribute the
metal powder 3 on the heatconductive sheet 2 and effectively overcome the problem of shifting metal powder when the heat conductive sheet is moved in the process of manufacturing. Moreover, as shown inFIG. 9 , a plurality of supportingelements 32 can be separately positioned in therecesses 31 on the setmetal powder 3 before two pieces of the heatconductive sheets 2 are assembled to each other. With the two heatconductive sheets 2 being internally supported by the supportingelements 32, the heatconductive sheets 2 undergone the sintering can have good levelness. - According to the above description, it can be found the heat sink manufacturing method according to the present invention has the following advantages: (1) requiring only reduced tools; (2) requiring reduced assembling cost; (3) enabling uniform distribution of the metal powder on the heat conductive sheets; (4) effectively preventing the metal powder from shifting in the process of manufacturing; and (5) enabling the heat conductive sheets undergone sintering to have good levelness.
Claims (10)
1. A method of manufacturing heat sink plate, comprising the steps of:
positioning a heat conductive sheet on a lower half holding tool of a powder feeder;
tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool;
dispensing metal powder on the heat conductive sheet while vibrating the heat conducting sheet, so that the metal powder is uniformly distributed on the heat conductive sheet; and
opening the upper half holding tool and removing the heat conductive sheet from the lower half holding tool, and sintering the metal powder to the heat conductive sheet.
2. The method of manufacturing heat sink plate as claimed in claim 1 , wherein the metal powder is dispensed on the heat conductive sheet under a positive pressure.
3. The method of manufacturing heat sink plate as claimed in claim 1 , wherein the upper half holding tool is provided with a powder inlet, and the metal powder is dispensed onto the heat conductive sheet via the powder inlet.
4. The method of manufacturing heat sink plate as claimed in claim 1 , further comprising a step of spraying an organic liquid on the metal powder uniformly distributed on the heat conductive sheet before the heat conductive sheet is removed from the lower half holding tool for sintering.
5. The method of manufacturing heat sink plate as claimed in claim 4 , wherein the organic liquid is a metal-powder-affinity liquid enabling the metal powder having the organic liquid sprayed thereon to set on the heat conductive sheet.
6. The method of manufacturing heat sink plate as claimed in claim 5 , wherein the organic liquid is selected from the group consisting of alcohol and acetone.
7. The method of manufacturing heat sink plate as claimed in claim 1 , wherein the upper half holding tool is provided on a lower side with a plurality of spacers, the spacers being in tight contact with the heat conductive sheet when the upper half holding tool is closed onto the lower half holding tool, such that a plurality of recesses are formed on the heat conductive sheet when the metal powder is distributed on the heat conductive sheet.
8. The method of manufacturing heat sink plate as claimed in claim 1 , wherein the metal powder is selected from the group consisting of copper powder and aluminum powder.
9. The method of manufacturing heat sink plate as claimed in claim 1 , further comprising a step of causing the powder feeder to drive the lower half holding tool to vibrate, so as to vibrate the heat conductive sheet, and a duration of vibrating the lower half holding tool being settable on the powder feeder.
10. The method of manufacturing heat sink plate as claimed in claim 1 , wherein the powder feeder includes a sliding mechanism provided below the lower half holding tool for moving the lower half holding tool into and out of the powder feeder in the process of manufacturing the heat sink plate.
Priority Applications (1)
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US12/687,083 US20110171055A1 (en) | 2010-01-13 | 2010-01-13 | Method of manufacturing heat sink plate |
Applications Claiming Priority (1)
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US12/687,083 US20110171055A1 (en) | 2010-01-13 | 2010-01-13 | Method of manufacturing heat sink plate |
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US20110171055A1 true US20110171055A1 (en) | 2011-07-14 |
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US12/687,083 Abandoned US20110171055A1 (en) | 2010-01-13 | 2010-01-13 | Method of manufacturing heat sink plate |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10443958B2 (en) * | 2016-04-25 | 2019-10-15 | Raytheon Company | Powdered metal as a sacrificial material for ultrasonic additive manufacturing |
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US3024128A (en) * | 1955-11-14 | 1962-03-06 | Dawson Armoring Company | Method of coating metal article with hard particles |
US5855637A (en) * | 1995-11-27 | 1999-01-05 | Canon Kabushiki Kaisha | Method of manufacturing image display apparatus using bonding agents |
US6139975A (en) * | 1997-06-12 | 2000-10-31 | Hitachi Powered Metals Co., Ltd. | Sheet metal member, method of manufacturing same, and heat radiation plate |
US6241935B1 (en) * | 1996-06-14 | 2001-06-05 | Materials Innovation, Inc. | Pulsed pressurized powder feed system and method for uniform particulate material delivery |
US6288766B1 (en) * | 1998-02-16 | 2001-09-11 | Sharp Kabushiki Kaisha | Manufacturing method of liquid crystal element for injecting the liquid crystal into the cell and liquid crystal injecting device |
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2010
- 2010-01-13 US US12/687,083 patent/US20110171055A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US3024128A (en) * | 1955-11-14 | 1962-03-06 | Dawson Armoring Company | Method of coating metal article with hard particles |
US5855637A (en) * | 1995-11-27 | 1999-01-05 | Canon Kabushiki Kaisha | Method of manufacturing image display apparatus using bonding agents |
US6241935B1 (en) * | 1996-06-14 | 2001-06-05 | Materials Innovation, Inc. | Pulsed pressurized powder feed system and method for uniform particulate material delivery |
US6139975A (en) * | 1997-06-12 | 2000-10-31 | Hitachi Powered Metals Co., Ltd. | Sheet metal member, method of manufacturing same, and heat radiation plate |
US6288766B1 (en) * | 1998-02-16 | 2001-09-11 | Sharp Kabushiki Kaisha | Manufacturing method of liquid crystal element for injecting the liquid crystal into the cell and liquid crystal injecting device |
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US10443958B2 (en) * | 2016-04-25 | 2019-10-15 | Raytheon Company | Powdered metal as a sacrificial material for ultrasonic additive manufacturing |
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