US20110146949A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20110146949A1 US20110146949A1 US12/781,821 US78182110A US2011146949A1 US 20110146949 A1 US20110146949 A1 US 20110146949A1 US 78182110 A US78182110 A US 78182110A US 2011146949 A1 US2011146949 A1 US 2011146949A1
- Authority
- US
- United States
- Prior art keywords
- heat
- clip
- fastening
- dissipation device
- tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to heat dissipation devices, and more particularly to a heat dissipation device which is configured for facilitating securing the heat dissipation device to a printed circuit board on which a heat generating element is mounted.
- a heat dissipation device is used to dissipate heat generated by the electronic device.
- a typical heat dissipation device includes a heat sink, a heat-absorbing plate, a heat pipe with two opposite ends thereof respectively connecting to the heat-absorbing plate and the heat sink, and a clip disposed on the heat pipe and the heat-absorbing plate.
- the heat-absorbing plate is provided for contacting the electronic device and absorbing heat therefrom.
- the heat pipe is utilized to transfer heat from the heat-absorbing plate to the heat sink.
- Securing holes are defined in two ends of the clip, for fasteners to pass therethrough in order to fix the heat dissipation device onto the electronic device.
- the clip and the heat pipe and the heat-absorbing plate are combined together by soldering or riveting for facilitating assembling the heat dissipation device on the electronic device.
- FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
- FIG. 2 is a fully exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is a partly exploded view of the heat dissipation device of FIG. 1 .
- FIGS. 1-2 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure.
- the heat dissipation device dissipates heat from a first heat-generating component 10 and a second heat-generating component 11 , such as CPUs mounted on a printed circuit board (not shown).
- the heat dissipation device comprises a first heat-absorbing plate 20 , a fin unit 30 , a first heat pipe 40 thermally connected with the first heat-absorbing plate 20 and the fin unit 30 , and a clip 50 disposed on the first heat pipe 40 and connected to the first heat-absorbing plate 20 .
- a fastening tab 22 and a positioning tab 24 are formed on the first heat-absorbing plate 20 .
- a fastening hole 52 and a positioning hole 54 are defined in the clip 50 , corresponding to the fastening tab 22 and the positioning tab 24 , respectively.
- the fastening tab 22 engages in the fastening hole 52 , and the positioning tab 24 passes through the positioning hole 54 .
- the heat dissipation device further comprises a second heat-absorbing plate 70 , and a second heat pipe 60 .
- the second heat pipe 60 is connected with the second heat-absorbing plate 70 and the fin unit 30 , and rests on the clip 50 .
- the first heat-absorbing plate 20 is made of material with good heat conductivity, and has a substantially rectangular shape.
- the first heat-generating component 10 is attached to a bottom surface of the first heat-absorbing plate 20 . Heat generated by the first heat-generating component 10 is absorbed by the first heat-absorbing plate 20 and transferred to the fin unit 30 in order to be dissipated to the ambient environment.
- the fastening tab 22 and the positioning tab 24 extend upwardly from two diagonally opposite corners of a top surface of the first heat-absorbing plate 20 .
- the fastening tab 22 and the positioning tab 24 are perpendicular to each other, that is, the fastening tab 22 and the positioning tab 24 are formed from two adjacent lateral sides of the first heat-absorbing plate 20 .
- the fastening tab 22 has a straight bottom end and a straight enlarged top end coplanar with the bottom end. The top end runs across and straddles a top extremity of the bottom end, whereby the fastening tab 22 presents as a substantially T shape to engage in the fastening hole 52 of the clip 50 .
- the positioning tab 24 has a straight plate shape, to be capable of inserting into the positioning hole 54 of the clip 50 . Understandably, the fastening tab 22 can be of other configurations in alternative embodiments, as long as the fastening tab 22 can be fixedly engaged in the fastening hole 52 .
- the positioning tab 24 can also be altered into other shapes such as a larger top end in alternative embodiments, as long as the positioning tab 24 can be conveniently passed through the positioning hole 54 .
- the second heat-absorbing plate 70 has a substantially rectangular sheet configuration with a bottom surface thereof tightly attached to the second heat-generating component 11 . Heat generated by the second heat-generating component 11 is absorbed by the second heat-absorbing plate 70 and transferred to the fin unit 30 to be dissipated to the ambient environment.
- Two fixtures 72 are engaged with two lateral sides of the second heat-absorbing plate 70 . Fasteners (not shown) pass through fixing holes (not labeled) in two ends of each of the fixtures 72 to secure the second heat-absorbing plate 70 onto the printed circuit board.
- the fin unit 30 comprises a plurality of vertical plate-shape fins 31 arranged side by side.
- a longitudinal opening is defined in each fin 31 , and the openings corporately define a receiving groove 310 receiving the first and second heat pipes 40 , 60 .
- the first heat pipe 40 comprises an evaporating section 41 connected to the first heat-absorbing plate 20 and a condensing section 42 received in the receiving groove 310 of the fin unit 30 .
- the clip 50 has a substantially strip-like configuration, and comprises a bulge portion 51 in the middle thereof, and two shoulders 53 extending from two ends of the bulge portion 51 .
- the bulge portion 51 has a U-shaped configuration to span on the evaporating section 41 of the first heat pipe 40 .
- the bulge portion 51 can have an arc-shaped configuration.
- the fastening hole 52 and the positioning hole 54 are respectively defined in the two shoulders 53 , and are aligned along a longitudinal axis (not labeled) of the clip 50 .
- Each of the fastening and positioning holes 52 , 54 can be considered to have a longitudinal axis and a transverse axis.
- the longitudinal axis is collinear with the longitudinal axis of the clip 50 , and the transverse axis is perpendicular to the longitudinal axis.
- Each of the fastening and positioning holes 52 , 54 is generally slightly elongated along the longitudinal axis.
- a middle portion of each of the fastening and positioning holes 52 , 54 has a substantially elliptical configuration with a long axis of the ellipse being aligned along the longitudinal axis.
- Each of opposite end portions of each of the fastening and positioning holes 52 , 54 is narrower than the short axis of the ellipse of the middle portion, as measured parallel to the transverse axis.
- each of the fastening and positioning holes 52 , 54 is symmetrical about its longitudinal axis, and symmetrical about its transverse axis.
- the fastening and positioning holes 52 , 54 are identical in configuration.
- the fastening hole 52 is used to engagingly receive the fastening tab 24 of the first heat-absorbing plate 20
- the positioning hole 54 is used to receive the positioning tab 24 of the first heat-absorbing plate 20 .
- transverse widths of the ends of the fastening hole 52 should be a little larger than a transverse width of the fastening tab 22 .
- Two fixing holes (not labeled) are defined in free ends of the two shoulders 53 , respectively. Fasteners can pass through the fixing holes to secure the clip 50 and the first heat-absorbing plate 20 onto the printed circuit board.
- the second heat pipe 60 comprises an evaporating section 61 connected to the second heat-absorbing plate 79 , a condensing section 62 received in the receiving groove 310 of the fin unit 30 , and a middle section 63 interconnecting the evaporating section 61 and the condensing section 62 .
- the second heat pipe 60 is arranged beside the first heat pipe 40 .
- the middle section 63 spans over the first heat-absorbing plate 20 and rests on the shoulder 53 that has the positioning hole 54 .
- the condensing section 42 of the first heat pipe 40 is received in the groove 310 of the fin unit 30 , and the evaporating section 41 of the first heat pipe 40 is connected to the first heat-absorbing plate 20 .
- the clip 50 is firstly aligned with the side of the first heat-absorbing plate 20 on which the fastening tab 22 is formed, to allow the fastening tab 22 to be inserted into the fastening hole 52 of the clip 50 .
- the clip 50 is turned on the fastening tab 22 so that the bulge portion 51 rests on the evaporating section 41 of the first heat pipe 40 and simultaneously the positioning tab 24 passes through the positioning hole 54 of the clip 50 .
- Both the fastening and positioning tabs 22 , 24 are oriented at oblique angles with respect to the longitudinal axis of the clip 50 (i.e., with respect to the longitudinal axes of the fastening and positioning holes 52 , 54 ).
- the fastening tab 22 is fixed in the fastening hole 52 due to the larger top end thereof, thereby securing that end of the clip 50 on the first heat-absorbing plate 20 .
- the middle portions of the fastening and positioning holes 52 , 54 are wider than the ends thereof, certain degrees of freedom of the clip 50 relative to each of the fastening and positioning tabs 22 , 24 are obtained.
- the condensing section 62 of the second heat pipe 60 is received in the groove 310 , and the evaporating section 61 of the second heat pipe 60 is connected to the second heat-absorbing plate 70 .
- the middle section 63 of the second heat pipe 60 rests on the shoulder 53 that has the positioning hole 54 , to further secure the clip 50 on the first heat-absorbing plate 20 .
- the condensing sections 42 , 62 of the first and second heat pipes 40 , 60 are both received in the groove 310 of the fin unit 30 in this embodiment. Understandably, in alternative embodiments, the condensing sections 42 , 62 can further or alternatively be thermally connected to different fin units. Furthermore, in alternative embodiments, the middle section 63 of the second heat pipe 60 can be altered to rest on the shoulder 53 of the clip 50 which has the fastening hole 52 .
- the clip 50 Due to one end of the clip 50 being secured on the fastening tab 22 of the first heat-absorbing plate 20 , and the other end of the clip 50 being positioned by the positioning tab 24 , it is convenient and time-saving to locate the clip 50 relative to the printed circuit board and assemble the heat dissipation device to the printed circuit board. Compared with the hypothetical situation of securing the clip 50 by soldering, certain degrees of freedom of the clip 50 relative to the first heat-absorbing plate 20 are obtained. Accordingly, the position of the clip 50 can be finely adjusted to eliminate any deviations between the clip 50 and the printed circuit board which may otherwise exist due to ordinary manufacturing tolerances. Furthermore, the clip 50 is positioned and secured without the need for any soldering tools or instruments. Moreover, there is no need for surface treating (e.g. electroplating) of the clip 50 associated with a soldering operation. For at least these reasons, the heat dissipation device with the clip 50 can have a low cost and high market competitiveness.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910311913.4 | 2009-12-21 | ||
CN2009103119134A CN102105035A (zh) | 2009-12-21 | 2009-12-21 | 散热模组 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110146949A1 true US20110146949A1 (en) | 2011-06-23 |
Family
ID=44149445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/781,821 Abandoned US20110146949A1 (en) | 2009-12-21 | 2010-05-18 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110146949A1 (zh) |
CN (1) | CN102105035A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100059202A1 (en) * | 2008-09-11 | 2010-03-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100258276A1 (en) * | 2009-04-10 | 2010-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20130014918A1 (en) * | 2011-07-13 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20190354147A1 (en) * | 2014-06-04 | 2019-11-21 | Huawei Technologies Co., Ltd. | Electronic Device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210426171U (zh) * | 2019-06-03 | 2020-04-28 | 浙江盾安热工科技有限公司 | 扁管及换热器 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070253769A1 (en) * | 2006-04-26 | 2007-11-01 | Foxconn Technology Co., Ltd. | Fastening device for mounting a thermal module to an electronic component |
US20080123298A1 (en) * | 2006-11-24 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Apparatus |
US7489510B1 (en) * | 2007-12-27 | 2009-02-10 | Foxconn Technology Co., Ltd. | Fastening device for mounting thermal module to electronic component |
US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
US20100195280A1 (en) * | 2009-02-03 | 2010-08-05 | Quanta Computer Inc. | Heat-dissipation module and electronic device using the same |
US20100258277A1 (en) * | 2009-04-10 | 2010-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100307719A1 (en) * | 2009-06-04 | 2010-12-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device and method of manufacturing the same |
US20120160456A1 (en) * | 2010-12-28 | 2012-06-28 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2624399Y (zh) * | 2003-05-07 | 2004-07-07 | 英业达股份有限公司 | 电子装置内的散热模组结构 |
CN100531535C (zh) * | 2005-08-05 | 2009-08-19 | 富准精密工业(深圳)有限公司 | 散热模组 |
-
2009
- 2009-12-21 CN CN2009103119134A patent/CN102105035A/zh active Pending
-
2010
- 2010-05-18 US US12/781,821 patent/US20110146949A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070253769A1 (en) * | 2006-04-26 | 2007-11-01 | Foxconn Technology Co., Ltd. | Fastening device for mounting a thermal module to an electronic component |
US20080123298A1 (en) * | 2006-11-24 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Apparatus |
US7489510B1 (en) * | 2007-12-27 | 2009-02-10 | Foxconn Technology Co., Ltd. | Fastening device for mounting thermal module to electronic component |
US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
US20100195280A1 (en) * | 2009-02-03 | 2010-08-05 | Quanta Computer Inc. | Heat-dissipation module and electronic device using the same |
US20100258277A1 (en) * | 2009-04-10 | 2010-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100307719A1 (en) * | 2009-06-04 | 2010-12-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device and method of manufacturing the same |
US20120160456A1 (en) * | 2010-12-28 | 2012-06-28 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100059202A1 (en) * | 2008-09-11 | 2010-03-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8225847B2 (en) * | 2008-09-11 | 2012-07-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe and elastic member |
US20100258276A1 (en) * | 2009-04-10 | 2010-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8050038B2 (en) * | 2009-04-10 | 2011-11-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20130014918A1 (en) * | 2011-07-13 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US9046306B2 (en) * | 2011-07-13 | 2015-06-02 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20190354147A1 (en) * | 2014-06-04 | 2019-11-21 | Huawei Technologies Co., Ltd. | Electronic Device |
US11144101B2 (en) * | 2014-06-04 | 2021-10-12 | Huawei Technologies Co., Ltd. | Electronic device |
US11789504B2 (en) | 2014-06-04 | 2023-10-17 | Huawei Technologies Co., Ltd. | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN102105035A (zh) | 2011-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, HONG-CHENG;CAO, LEI;GUO, JIAN;REEL/FRAME:024398/0390 Effective date: 20100513 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, HONG-CHENG;CAO, LEI;GUO, JIAN;REEL/FRAME:024398/0390 Effective date: 20100513 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |